JP2000208968A - Power supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a power supply device which can reduce the number of substrates, realize cost reduction and improve mounting operativity. SOLUTION: In this device, right and left end sides of a rear substrate 11 arranged in an inner part of a casing body 1A, whose front end is opened are inserted and supported to a support member 13 which also serves as a pair of right and left heat sinks connected to the casing body 1A and a front substrate 12 which is opposite to the rear substrate 11 at an interval is connected to a lid body connected to an opening of the casing body 1A through a connection terminal 8 for external wiring, and the rear substrate 11 and the front substrate 12 are connected by wiring and the support member 13 is inserted to a clearance between right and left end edges of the front substrate 12 and the sidewall of a lid body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a power supply device such as a switching power supply.

[0002]

2. Description of the Related Art As the power supply device, for example, a structure disclosed in Japanese Patent Publication No. 2816340 is known. The casing of the power supply device is configured in a front-rear split structure including a box-shaped casing main body having an open front surface and a lid connected to the front surface, and a substrate incorporated in the casing includes a casing. The rear board is connected and supported at the inner back of the main body, a pair of left and right side boards connected to the left and right of the rear board, and the front board is connected and supported by the lid. The provided terminal group for external wiring is connected to the circuit pattern of the front substrate by soldering.

[0003]

In the power supply device having the above-described structure, four substrates, that is, front and rear, and right and left, are used, so that the number of substrates is increased and the cost is increased.
Further, a pair of left and right side substrates are electrically and mechanically connected to the rear substrate in advance via a connector, and this composition is inserted into the casing body and connected, but the left and right ends of the rear substrate are connected. The U-shaped composition in which the side substrate extends in a cantilever shape from the front to the front is unstable in its shape and posture, and it takes time and effort to position and insert it into the casing main body. There was room for improvement in terms of workability.

The present invention has been made in view of such a point, and has as its main objects to reduce costs by reducing the number of substrates and to improve workability in assembling.

[0005]

In order to achieve the above object, the present invention has the following configuration.

That is, a power supply device according to a first aspect of the present invention includes a casing body having an opening, a lid attached to an opening side of the casing body, and a support member mounted on the casing body. It has a first substrate housed and arranged in the casing body, and a second substrate attached to the lid side.

According to a second aspect of the present invention, in the power supply device according to the first aspect, the opening is formed at a front end of the casing main body, and the first substrate is disposed inside the casing main body. And the second substrate is a front substrate opposed to the rear substrate at an interval, and an edge of the rear substrate is supported by the support member connected to the casing body. Things.

According to a third aspect of the present invention, in the power supply device according to the second aspect, the support member is a heat sink.

According to a fourth aspect of the present invention, in the power supply device according to the third aspect, the heat sink has an engagement piece bent forward, and the end of the rear substrate is provided with a heat sink. It is inserted into and supported by the engaging piece.

According to a fifth aspect of the present invention, in the power supply device according to the third or fourth aspect, the heat sink extends forward and passes through a gap between an edge of the front substrate and a peripheral wall of the lid. It is inserted into the lid.

According to a sixth aspect of the present invention, in the power supply device according to any one of the third to fifth aspects, the heat sink is provided in a pair, and the heat sinks are respectively provided on a primary side and a secondary side in a power supply circuit. Correspondingly, they are arranged separately from each other.

According to a seventh aspect of the present invention, in the power supply device according to the sixth aspect, only the primary heat sink is electrically connected to the ground of the primary line.

According to an eighth aspect of the present invention, in the power supply device according to any one of the third to seventh aspects, a shield plate formed by covering a metal foil with an insulating film is provided along a back surface of the front substrate. Along with disposing, this shield plate has a connecting piece inserted into a hole formed in the front board, and the connecting piece is exposed to the metal foil except for a tip end thereof and is connected to the ground of the front board. They are conductively connected.

According to a ninth aspect of the present invention, in the power supply device of the eighth aspect, the metal foil is conductively connected to the ground of the front substrate at a plurality of positions of the shield plate.

According to the structure of the first aspect of the present invention, the first substrate is supported on the support member and assembled to the casing body, and the first support member is mounted on the casing body, thereby providing the first substrate. The board can be incorporated into the casing body with the substrate properly positioned, and the twelfth board can be supported by a lid connected to the opening of the casing body. According to the configuration of the invention according to claim 2, after the rear substrate is supported by the support member, the casing is assembled to the casing main body from the opening, and the support member is connected to the casing main body, so that the rear substrate is correctly positioned. It can be incorporated in the main body, and the front substrate can be connected and supported on the lid as in the conventional case.

According to the third aspect of the present invention, the heat sink can be used also as a support member for supporting the rear substrate.

According to the fourth aspect of the present invention, by inserting the rear substrate into the engagement piece of the heat sink,
Can be easily assembled.

According to the fifth aspect of the present invention, since the heat sink as the support member extends forward, a heat sink having a large heat radiation area can be formed, and when the rear substrate is temporarily mounted on the lid. The forwardly extending portion of the heat sink serves as a positioning guide during assembly.

According to the configuration of the present invention, the propagation of noise between the heat sinks separated into the primary side and the secondary side is suppressed.

According to the configuration of the present invention, by lowering only the heat sink corresponding to the primary side to the ground, the potential of the heat sink on the primary side is stabilized, and the ground between the primary side and the secondary side is connected to each other. The noise can be prevented from being fed back between the two.

According to the configuration of the present invention, the shield plate exhibits its original shielding function, and the distal end of the connecting piece of the shield plate inserted into the hole of the front substrate and soldered is made of metal. Since the foil is not exposed, the solder does not drip from the tip of the connecting piece.

According to the ninth aspect of the present invention, the shield plate functions as a jumper line connecting a plurality of grounds on the front substrate.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an external perspective view of a power supply device according to the present invention, FIG. 2 is a longitudinal side view, FIG. 3 is a cross-sectional plan view, and FIG. 4 is an exploded perspective view seen from the rear.

The circuit configuration of the power supply device of the present invention is basically the same as that of the conventional example, and as shown in FIG.
The input AC voltage passes through a noise filter circuit 104, is converted into a DC voltage by an input-side rectifying / smoothing circuit 107, and is provided to a primary side of a transformer 108.
By being turned on / off by a signal from the switch circuit 114, an AC voltage is sent to the secondary side, and this AC voltage is converted into a DC voltage again by the output-side rectifying / smoothing circuit 111 and output. The detection circuit 117 is connected to the transformer 108
And outputs a detection output corresponding to the fluctuation of the output voltage to the drive circuit 113 of the switch circuit 114.
And the driving circuit 113
The power transistor 11 responds to the input of the detection output.
2 is turned on / off.

As shown in FIGS. 1 to 4, the casing 1 of the power supply device having such a circuit configuration includes a resin casing body 1A and a resin lid 1 connected to the front end thereof.
B, and can be screw-connected to a wall surface of a switchboard or the like via a flange portion 1a formed on the back of the casing body 1A, or can be fitted and connected to an arbitrary position of the support rail 2 attached to the wall surface. It is configured as follows.

The casing body 1A is formed in a box shape having an open front end, and a heat radiation slit 3 is formed at an appropriate position on the periphery thereof, and a lid 1B is provided near the front end of the left and right side walls. A locking hole 5 is formed for engaging and connecting a pair of locking claws 4 extending one by one from the left and right.

At the top and bottom of the front end of the lid 1B, a large number of wiring connection portions 6 are formed in parallel, and each wiring connection portion 6 is provided with a connection terminal 8 having a terminal screw 7;
A wiring cover 9 that covers the front surface of each of the upper and lower wiring connection portions 8 is provided so as to be swingably opened and closed. Further, heat dissipation slits 10 are formed on the left and right sides of the front surface of the lid 1B.

The power supply circuit incorporated in the case 1 having the above-described structure includes a rear substrate 11 incorporated in the inner portion of the casing body 1A, and a front substrate 12 attached to the lid 1B and facing the rear substrate. Various electronic components and elements are mounted on the front surfaces of the boards 11 and 12, and the boards 11 and 12 are connected by wiring.
The pattern surfaces 1 and 12 are arranged so as not to face each other. Note that the substrates 11 and 12 do not necessarily have to face in parallel.

As shown in FIG. 3, a pair of left and right support members 13 are connected to the inner wall of the casing body 1A by resin rivets 14, and the left and right ends of the rear substrate 11 are inserted and supported by the left and right support members 13. At the same time, the central portion of the rear substrate 11 is also connected to the positioning ridge 1b projecting inward from the inner wall of the casing body 1A by the resin rivet 14.

More specifically, as shown in FIGS. 5 to 8, the support member 13 is formed by bending an aluminum plate into an L shape to form a rear side portion 13a and a front side portion 13b. As shown in FIGS. 7 and 8, upper and lower inner corners formed on the edge of the rear substrate 11 are formed in notch recesses 16 of a pair of upper and lower engaging pieces 15 formed by bending forward from the rear side portion 13 a. 11a is inserted and supported in a state where it is positioned vertically. Further, notch recesses 18 are formed at the upper and lower edges of the opening 17 formed at the bent corner portion of the support member 13, and the projection 11b formed at the edge of the rear substrate 11 is engaged therein. I have.

Here, a heating element 20 such as a diode or a power transistor is screw-connected to the inner surface of the front side portion 13b of the supporting member 13 for supporting the rear substrate 11, and the supporting member 13 is separated from the heating element 20 by a screw. This is configured as a heat sink that absorbs heat and dissipates heat.

Note that the 3 extending from the heating element 20
The lead terminal 20 a faces the opening 17 of the support member 13, and is inserted from the side into a slit 21 formed at the edge of the substrate as the rear substrate 11 is inserted.
One circuit pattern is connected by soldering from the back.

The left and right support members 13 are the same members, except that the directions at the time of use are inverted up and down and left and right, but the right support member 13 when viewed from the front is used. Are connected to the ground (FG: frame ground) of the primary circuit on the rear substrate 11. That is, as shown in FIG. 9, a connection piece 22 made of a metal plate to which solder is easily attached is connected by caulking to the upper engagement piece 15 of the right support member 13, and as shown in FIG. 22 is connected by soldering to the primary-side ground circuit pattern of the rear substrate 11.

As described above, by disposing the pair of support members 13 as heat sinks separately on the left and right, it is possible to suppress noise from propagating between the two support members 13 and
By lowering only one support member 13 to the primary side ground to stabilize the potential, the noise characteristics are further improved.

The front substrate 12 is inserted and mounted on the connection terminals 8 arranged in parallel on the upper and lower sides of the lid 1B and connected by soldering. As shown in FIGS. Notch recess 23 formed in two places
The wiring 24 connecting the rear substrate 11 and the front substrate 12
Are inserted without displacement.

On the back of the front substrate 12, a shield plate 30 is provided. As shown in FIG. 11, the shield plate 30 is formed by coating and polymerizing a metal foil 31 such as copper or aluminum from the front and back with insulating films 32a and 32b. The connecting pieces 30a, 30b, 30c are bent and the front substrate 1 is bent.
2, slits 33a, 33b, 33 as holes formed in
In each of the two connecting pieces 30a and 30b, the metal foil 31 is exposed and soldered to the ground circuit pattern on the front substrate 12. In this case, the two connecting pieces 30a and 30b function as jumper wires for ground connection.

Here, the connecting piece 30 connected to the ground
In FIGS. 12A and 12B, as shown in FIG. 12, the front side insulating film 32a is peeled off to expose the metal foil 31, and the tip of the metal foil 31 is set shorter than the tip of the back side insulating film 32b. ing. In this way, as shown in FIG. 13, when soldering to the front substrate 12, the solder does not leak from the tips of the connecting pieces 30a and 30b to the front side of the substrate.

As shown in FIGS. 14 and 15,
In the connection pieces 30a and 30b connected to the ground,
The same function as described above can be achieved even if the insulating film 32a on the front side is partially peeled off so that the metal foil 31 is exposed only on a part of the base of the connecting pieces 30a and 30b.

Further, the surface of the shield plate connected to the ground (FG: frame ground) of the front substrate can be used also as a lightning surge path, which is an instantaneous surge, while ensuring the breakdown voltage function. It is easy to release the lightning surge to the ground, and the durability of the device can be increased.

The power supply device according to the present invention is configured as described above. Next, an assembling procedure will be described.

When assembling, first, various electronic components and elements are mounted on a substrate in which the rear substrate 11 and the front substrate 12 are integrated, and soldering is performed by a solder flow device. Split the rear substrate 11 and the front substrate 12
And split into

The front substrate 12 is soldered to the connection terminals 8 of the cover 1B to support the front substrate 12 on the cover 1B and connect the connection terminals 8 to the circuit formed on the front substrate 12. Connect to a predetermined site.

As shown in FIG. 4, the left and right support members (heat sinks) 13 into which the rear substrate 11 is inserted and supported are provided by a gap formed between the left and right edges of the front substrate 12 and the right and left side walls of the lid 1B. And the rear substrate 11 is held by the lid 1B.

Next, the casing body 1A is
And the cover 1B
After engaging the locking claw 4 with the locking hole 5 of the casing main body 1A, the right and left support members 13 and the center of the rear substrate 11 are mounted on the inner wall of the casing main body 1A with resin rivets. connect.

Although the heat sink is used as a support member for supporting the rear substrate 11 in the above embodiment, a connector or the like may be used as a support member for the rear substrate 11. Further, the shield plate 30 may be omitted.

[0047]

As is apparent from the above description, according to the present invention, the following effects can be expected.

According to the first aspect of the present invention, the first substrate is housed in the casing body via the support member, and the second substrate is supported by the lid connected to the casing body. The number of substrates is reduced as compared with the conventional example in which four substrates are used, and the cost can be reduced.

According to the second aspect of the present invention, since the rear substrate housed in the casing body is opposed to the front substrate supported by the lid via the support member, the side substrate is eliminated. The number of substrates can be reduced, and the cost can be reduced.

According to the third aspect of the present invention, a heat sink for the heating element can be used also as a support member for the rear substrate, which is effective in reducing costs by reducing the number of components.

According to the fourth aspect of the present invention, since the rear substrate can be assembled and connected to the main body case only by inserting and supporting the rear substrate in the heat sink, the assembling workability is improved.

According to the fifth aspect of the present invention, the heat dissipation performance of the heat sink can be improved by extending the support member forward, and the support member can be used as a guide when the rear substrate is temporarily assembled to the lid. This is more effective in improving the workability of assembling.

According to the sixth aspect of the invention, by forming the heat sink separated into the primary side and the secondary side, noise propagation between the heat sinks can be suppressed, and the noise characteristics can be improved.

According to the seventh aspect of the invention, in particular, the primary heat sink is connected to the ground to stabilize its potential, while the secondary heat sink is floated from the ground, thereby further improving the noise characteristics. be able to.

According to the eighth aspect of the present invention, the shield plate exhibits its original shielding function, and the tip of the connecting piece of the shield plate inserted into the hole of the front substrate and soldered is made of metal foil. Is not exposed, so that the solder does not drip from the tip of the connecting piece.

According to the ninth aspect of the present invention, the shield plate can be used as a jumper wire for connecting a plurality of grounds formed on the front substrate, so that the patterning of the ground and the power supply circuit can be facilitated, and the circuit can be designed. The degree of freedom in doing so increases.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an entire power supply device.

FIG. 2 is a vertical sectional side view.

FIG. 3 is a cross-sectional plan view.

FIG. 4 is an exploded perspective view seen from the rear.

FIG. 5 is a perspective view of the rear substrate as viewed from the front.

FIG. 6 is a perspective view of the rear substrate as viewed from behind.

FIG. 7 is a perspective view showing a disassembled state of the rear substrate and the support member.

FIG. 8 is a perspective view of a rear substrate and a support member that are inserted and connected.

FIG. 9 is a perspective view of one support member alone.

FIG. 10 is a perspective view of the front substrate as viewed from the front.

FIG. 11 is a perspective view of the front substrate and the shield plate as viewed from behind.

FIG. 12 is a perspective view of a connecting piece in the shield plate.

FIG. 13 is an enlarged cross-sectional view of a portion where the shield plate is connected to the substrate.

FIG. 14 is a perspective view showing another embodiment of the connecting piece in the shield plate.

FIG. 15 is an enlarged sectional view of a connecting portion according to another embodiment.

FIG. 16 is a diagram illustrating a circuit configuration of a power supply device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Casing 1A Casing main body 1B Lid 8 Connection terminal 11 Rear board 12 Front board 13 Supporting member (heat sink) 20 Heating element (power transistor) 30 Shield board 31 Metal foil 32a Insulating film 32b Insulating film

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Yasuhiro Tsubota O-Muron Co., Ltd. (72) Inventor Takatoshi Otono 10-Hanazono Todo-cho, Ukyo-ku, Kyoto, Kyoto Inside (72) Inventor Yasuyasu Murabayashi Within Omron Co., Ltd. (10) Hanazono Todocho, Ukyo-ku, Kyoto-shi, Kyoto Prefecture (72) Inside of Inventor Takashi Horie (10) Omron Co., Ltd. (72) Inventor Tsunetoshi Oba 10 Okayama Todocho, Ukyo-ku, Kyoto City, Kyoto Prefecture (72) Inventor Hideki Kobori 10 Omoron Co., Ltd., Hanazono Todocho, Ukyo-ku, Kyoto City, Kyoto Person Satoshi Takahashi 10F Hanazono Dodocho, Ukyo-ku, Kyoto-shi, Japan F-term in Omron Corporation (reference) 5E348 AA05 AA08 AA32

Claims (9)

[Claims] 1. A casing body having an opening, a lid attached to the opening side of the casing body, and a first housing housed and arranged in the casing body supported by a support member attached to the casing body. A power supply device, comprising: a substrate; and a second substrate attached to the lid. 2. The opening is formed at a front end of the casing main body, the first substrate is a rear substrate disposed inside the casing main body, and the second substrate is formed by the rear substrate. The power supply device according to claim 1, wherein a front substrate opposes the substrate at an interval, and an edge of the rear substrate is supported by the support member connected to the casing body. 3. The power supply device according to claim 2, wherein said support member is a heat sink. 4. The power supply device according to claim 3, wherein the heat sink has an engaging piece bent forward, and the end of the rear substrate is inserted into and supported by the engaging piece of the heat sink. 5. The power supply device according to claim 3, wherein the heat sink extends forward and is inserted into the lid through a gap between an edge of the front substrate and a peripheral wall of the lid. 6. A heat sink comprising a pair of heat sinks, each heat sink corresponding to a primary side and a secondary side of a power supply circuit, and arranged separately from each other.
The power supply device according to any one of the above. 7. The power supply device according to claim 6, wherein only the heat sink on the primary side is conductively connected to the ground of the primary side line. 8. A shield plate formed by covering a metal foil with an insulating film is provided along a back surface of the front substrate, and the shield plate is connected to a hole inserted into a hole formed in the front substrate. The power supply device according to any one of claims 3 to 7, further comprising a piece, wherein the connecting piece has a metal foil exposed except for a tip portion thereof and is conductively connected to a ground of the front substrate. 9. The power supply device according to claim 8, wherein a metal foil is conductively connected to a ground of the front substrate at a plurality of positions of the shield plate.