DE102015203057B4 - electronic device - Google Patents

Abstract

An electronic device (100, 200, 300, 400) comprising:
a case (1, 201, 301, 401) formed of resin;
a heat-generating component (30, 34, 38) arranged in the housing (1, 201, 301, 401);
a plate-shaped heat dissipation member (2, 2a, 2b) arranged on an outer surface (13s) of the housing (1, 201, 301, 401) and having a higher thermal conductivity than the resin from which the housing (1, 201, 301, 401 ) and which dissipates heat generated by the heat-generating member (30, 34, 38) to the outside;
an aluminum electrolytic capacitor (35, 37) disposed in said case (1, 201, 301, 401); and
a heat insulating portion (6a, 6b) which is arranged between the heat dissipation element (2, 2a, 2b) and the case (1, 201, 301, 401) opposite to the aluminum electrolytic capacitor (35, 37) and which enables heat conduction from the heat dissipation element ( 2, 2a, 2b) to the aluminum electrolytic capacitor (35, 37);
wherein the heat-generating component (30, 34, 38) directly touches the heat-dissipating element (2, 2a, 2b) or the heat-generating component (30, 34, 38) touches the heat-dissipating element (2, 2a, 2b) indirectly via the housing (1, 201 , 301, 401) touched.

Description

TECHNICAL AREA

The present invention relates to power supplies and related electronic devices.

TECHNICAL BACKGROUND

Switch-mode power supplies, for example, are used as power supply units, in which transformers, coils, aluminum electrolytic capacitors and similar electronic components are provided. Since electronic components include, for example, transformers, coils, semiconductor elements, etc. are heat-generating components that generate more heat than other components, metal housings are used, among other things, to dissipate the heat generated by these components to the outside.

However, when using a metal case, an insulating distance must be secured between the case and electronic parts, resulting in a problem that the power supply is difficult to miniaturize. On the other hand, such as in JP 2000-208968 A discloses structures using a resin case for a power supply unit. By using such a resin package, insulation from electric parts can be neglected, so that miniaturization becomes possible from the viewpoint of insulation.

Further, the case can be mass-produced by resin molding, so the cost can also be reduced.

JP 2000-208968 A is an example of a prior art document.

The DE 10 2005 023 659 A1 discloses a converter device comprising a converter module, a control circuit board on which a control circuit for controlling the converter module is arranged, a heat sink which serves to radiate the heat generated by the converter module and a housing which contains the converter module and the control circuit board, characterized in that the Case is divided into a module case containing the converter module and a control board case containing the control board, that a converter module section is provided in which the converter module and the heat sink are thermally coupled with each other, the conversion module is contained in the module case in such a way that a cooling fin of the heat sink is exposed to the outside and one side of the module case is open and a control board section is provided in which the control board is accommodated in the control case and one side of the control board case is open, and that the corresponding open sides of the converter module section and the Control board section are opposed to each other and a heat insulating partition used for heat retention is interposed between the opposed sections, and then the converter module section and the control board section are coupled to each other.

SUMMARY OF THE INVENTION

However, the conventional structures mentioned above have the following problem points. Namely, if one tries to miniaturize them, heat build-up easily occurs in the device, so that cases made of resin (or plastic) having lower thermal conductivity than metal have a problem that heat is difficult to be sufficiently dissipated. Furthermore, if one tries to meet the need for capacity increases in recent years, the result is an increase in heat output, which makes heat dissipation even more difficult.

In addition, among the electronic components provided in power supplies, particularly aluminum electrolytic capacitors, the service life is shortened when the temperature rises too much. Striving for increased capacity and miniaturization therefore harbors the risk that an appropriate service life of power supplies that is equal to the state of the art can no longer be guaranteed. An object of the present invention is to provide an electronic device that enables miniaturization with good heat dissipation properties to ensure an adequate lifespan.

• ein aus Harz gebildetes Gehäuse;
• ein in dem Gehäuse angeordnetes wärmeentwickelndes Bauteil;
• ein an einer Außenfläche des Gehäuses angeordnetes plattenförmiges Wärmeabfuhrelement, welches eine höhere Wärmeleitfähigkeit als das Harz aufweist, aus dem das Gehäuse gebildet ist, und welches vom wärmeentwickelnden Bauteil erzeugte Wärme nach außen abführt;
• einen in dem Gehäuse angeordneten Aluminiumelektrolytkondensator;
• einen Wärmeisolierabschnitt, welcher zwischen dem Wärmeabfuhrelement und dem Gehäuse, gegenüber vom Aluminiumelektrolytkondensator angeordnet ist, und welcher die Wärmeleitung vom Wärmeabfuhrelement zum Aluminiumelektrolytkondensator behindert;
• wobei das wärmeentwickelnde Bauteil über das Gehäuse mittelbar das Wärmeabfuhrelement berührt,
• oder, falls ein Wärmeleitelement vorgesehen ist, das das wärmeentwickelnde Bauteil unmittelbar berührt, das wärmeentwickelnde Bauteil das Wärmeabfuhrelement mittelbar über das Wärmeleitelement berührt,
• oder, falls ein Wärmeleitelement vorgesehen ist, das das wärmeentwickelnde Bauteil unmittelbar berührt, das wärmeentwickelnde Bauteil das Wärmeabfuhrelement mittelbar über das Wärmeleitelement und das Gehäuse berührt, oder
• oder das wärmeentwickelnde Bauteil unmittelbar das Wärmeabfuhrelement berührt.

An electronic device according to a first aspect of the invention comprises:

• a case formed of resin;
• a heat-generating component arranged in the housing;
• a plate-shaped heat-dissipating member disposed on an outer surface of the case, which has higher thermal conductivity than the resin constituting the case, and which dissipates heat generated by the heat-generating member to the outside;
• an aluminum electrolytic capacitor disposed in the case;
• a heat insulating portion which is provided between the heat dissipation member and the housing, is arranged opposite to the aluminum electrolytic capacitor and which impedes heat conduction from the heat dissipation element to the aluminum electrolytic capacitor;
• wherein the heat-generating component indirectly touches the heat dissipation element via the housing,
• or, if a heat-conducting element is provided which directly touches the heat-generating component, the heat-generating component touches the heat-dissipating element indirectly via the heat-conducting element,
• or, if a heat-conducting element is provided which directly touches the heat-generating component, the heat-generating component touches the heat-dissipating element indirectly via the heat-conducting element and the housing, or
• or the heat-generating component directly touches the heat-dissipating element.

Since the case is formed of resin, it is possible to achieve miniaturization because it is not necessary to provide a certain insulating distance from electronic parts. And by arranging the heat-dissipating member on an outer surface of the case, the heat generated from the heat-generating member propagates along the surface direction of the heat-dissipating member and is dissipated to the outside of the entire heat-dissipating member, so that excellent heat dissipation properties can be obtained.

On the other hand, by providing a heat insulating portion, the heat conducted along the heat dissipation member can be prevented as much as possible from being conducted to the aluminum electrolytic capacitor, so that the life of the aluminum electrolytic capacitor can be prevented from being shortened, and a life of the electronic device equal to or larger than a conventional electronic device can be realized. Here, "insulation" does not necessarily mean that the heat conduction from the heat dissipation element is completely prevented, but can also mean that the heat conduction is at least reduced. Further, “heat-generating component” may refer to an electronic component that gives off heat to the heat-dissipating member during regular operation of the electronic device. When an aluminum electrolytic capacitor is used in the electronic device, it may be a component that generates a larger amount of heat than the aluminum electrolytic capacitor. Further, it may also be a component which, when considering the components used in the electronic device in the order of the amount of heat generated, is in the upper half, that is, below the half of the components which generates the greater amount of heat. The heat-generating component can be a transformer, a semiconductor element and/or a coil. The heat conducting element has a higher thermal conductivity than the gas in the housing, e.g. air. It is also possible for several of these elements to be arranged next to one another or one above the other in direct contact. In this case, the members arranged on the sides in contact with other members may be formed of plate-shaped members having higher slidability to the other members than when not provided, such as paper or plastic films, sheets or the like. Heat can thus be dissipated to the housing more efficiently than if no heat-conducting elements are arranged and only air is provided.

Therefore, as explained above, the heat generated from the heat-generating element can be dissipated to the outside, and the heat conduction to the aluminum electrolytic capacitor can be suppressed as much as possible. For this reason, an electronic device that can be miniaturized, has good heat radiation, and is excellent in durability can be provided.

An electronic device according to a second aspect of the invention corresponds to an electronic device according to the first aspect of the invention, wherein the heat insulating portion is provided in a recess formed in a wall of the case facing the heat dissipation member. Thus, the heat conduction from the heat conducting member to the case can be suppressed, so that the heat conduction from the heat conducting member to the aluminum electrolytic capacitor is reduced. Further, thus, the heat insulating portion can be formed by a simple structure, namely, by forming a recess in the case.

An electronic device according to a third aspect of the invention corresponds to an electronic device according to the second aspect of the invention, wherein the heat insulating portion is formed of air in the recess. Since the thermal conductivity of air is very low, it serves as a good insulator. As a result, heat conduction from the heat dissipation member to the housing can be effectively suppressed or reduced.

An electronic device according to a fourth aspect of the invention corresponds to an electronic device according to the first aspect of the invention, wherein the heat-generating component is a transformer. Thus, the heat from the transformer can be dissipated to the outside of the electronic device via the heat dissipation member. Since a transformer generates a large amount of heat, dissipating the heat generated from the transformer to the outside can efficiently prevent the temperature inside the electronic device from rising.

An electronic device according to a fifth aspect of the invention corresponds to an electronic device according to the first aspect of the invention, wherein the heat conducting member is a heat dissipation gel sheet whose heat conductivity is higher than that of the heat insulating portion. Here, the heat-dissipating gel sheet is easy to be brought into face-to-face contact with the heat-generating element, so that by using the heat-generating element, the heat generated from the heat-generating element can be conducted to the heat-conducting element efficiently.

An electronic device according to a sixth aspect of the invention corresponds to an electronic device according to the first aspect of the invention, wherein the heat conducting member is a heat sink. Thus, by conducting the heat of the heatsink to the heat dissipation member, the heat of the heat-generating element touching the heatsink can be efficiently conducted to the heat dissipation member.

An electronic device according to a seventh aspect of the invention corresponds to an electronic device according to the first aspect of the invention, wherein the heat conducting member is arranged between the heat-generating component and the housing and directly contacts the housing. Thus, the heat-generating component touches the heat-dissipating element indirectly via the heat-conducting element and the housing, so that the heat generated by the heat-generating component is conducted to the heat-dissipating element via the heat-conducting element and the housing, and can be further conducted in the surface direction of the heat-dissipating element and dissipated to the outside.

An electronic device according to an eighth aspect of the invention corresponds to an electronic device according to the first aspect of the invention, wherein the case is provided with a through hole, the heat conducting member is interposed between the heat-generating component and the heat dissipating member, and directly contacts the heat dissipating member through the through hole. Thus, the heat-generating component indirectly touches the heat-dissipating element via the heat-conducting element, so that the heat generated by the heat-generating component can be conducted to the heat-dissipating element via the heat-conducting element, and further conducted in the surface direction of the heat-dissipating element and dissipated to the outside.

EFFECT OF THE INVENTION

The present invention makes it possible to provide an electronic device that can be miniaturized with good heat dissipation properties to ensure an adequate lifespan.

BRIEF DESCRIPTION OF THE FIGURES

• 1 Perspective view of a power supply according to embodiment 1 of the invention, seen from the front.
• 2 Perspective view of the power supply 1 from the back.
• 3 Exploded view of the power supply 1 .
• 4 (a) , (b), (c), (d), (e) Front view, right side view, left side view, top view and bottom view of a body of the power supply unit 1 .
• 5 Perspective view of a power supply circuit unit of the power supply 1 .
• 6 Left side view showing the internal structure of the power supply 1 shows.
• 7 Sectional view along arrow marks AA in 6 .
• 8th Sectional view along arrow marks BB in 6 .
• 9 Exploded view showing a manufacturing process for the power supply 1 .
• 10 An exploded perspective view of a power supply according to a modification example of embodiment 1 of the invention.
• 11 Cross-sectional view of a power supply according to a modification example of embodiment 1 of the invention.
• 12 (a) and (b) perspective view of a power supply according to a modification example of embodiment 1 of the invention.
• 13 (a) Cross-sectional view of the power supply in 12 , and (b) enlarged view of section G in 13(a) .
• 14 Perspective view of the power supply in 12 .
• 15 A perspective view of a power supply according to a modification example of embodiment 1 of the invention.
• 16 (a) Cross-sectional view of the power supply in 15 , (b) enlarged view of section G in 13(a) .
• 17 Exploded view of the power supply in 15 .
• 18 A perspective view of a power supply according to a modification example of embodiment 1 of the invention.
• 19 Left side view of the internal structure of the power supply in 18 .
• 20 (a) Cross-sectional view in the direction of the arrow CC in 18 , and (b) cross-sectional view in the direction of arrow DD in 18 .
• 21 (a) is a view of a sliding sheet according to a modification example of the embodiment 1 of the invention, (b) is a view of a power supply circuit unit of a modification example of the embodiment 1 of the invention, and (c) shows the state in which the power supply circuit unit in figure (b) is connected to the in 21(a) slide sheet shown is covered.

EMBODIMENTS OF THE INVENTION

Embodiments of the invention are explained below with appropriate reference to figures.

Embodiment 1

<1. Structure of the power supply 100>

1 Fig. 14 is a front perspective view of a power supply unit 100 to which the present embodiment 1 of the invention relates. 2 FIG. 12 is a perspective view of the power supply unit 100 of FIG 1 from the back. 3 FIG. 14 is an exploded view of power supply 100. FIG 1 .

The power supply 100 according to the present embodiment 1 is a switching power supply that enables electric power supplied from the power grid to be converted into high-frequency electric power by utilizing the switching action of semiconductors to obtain a fixed direct current.

As in 1 until 3 1, the power supply 100 according to Embodiment 1 comprises a box body 1, heat-dissipating plates 2a, 2b arranged outside on both side walls of the box body 1, a power supply circuit unit 3 housed in the box body 1, a heat-dissipating gel sheet 4 arranged on a heat-generating component of the power supply circuit unit 3 (see 5 and 7 , described below), a slip sheet 5 (see 5 and 7 , described later), and heat insulating portions 6a, 6b for blocking heat conduction from the heat dissipation plate 2 to aluminum electrolytic capacitors 35, 37. Also, in FIG 1 a support rail 9 for mounting the power supply unit 100 is shown with dotted lines.

The individual structures are explained in sequence below.

(1-1. box body 1)

The box body 1 has as in 3 shown a housing body 10 and a housing front 11.

4(a) , 4(b) , 4(c) , 4(d) and 4(e) 12 are a front view, a right side view, a left side view, a plan view, and a bottom view, respectively, of the case body 10.

The housing body 10 is box-shaped with an opening 17 at the front, as shown in FIG 3 and 4(a) until 4(e) 1, and includes a right side wall 12, a left side wall 13, a top wall 14, a bottom wall 15, and a back wall 16. It should be noted that in the present description, the top, bottom, left, right, front and rear are defined starting from the power supply unit 100 in the state fastened to the mounting rail 9 . The left and right directions point to the left and right when looking at the housing front 11 from the front.

(1-1-1. case body 10)

(1-1-1-1. Right side panel 12)

As in 4(b) 1, engagement holes 12a, 12b for engaging claws 11a, 11b (described later) of the cabinet front 11 are formed in the right side wall 12. As shown in FIG. These engaging holes 12a, 12b are formed near the front edge 12f of the right side wall 12, at two locations above and below.

(1-1-1-2. Left side panel 13)

As in 4(c) 1, engaging holes 13a, 13b for engaging claws 11c, 11d (described later) of the cabinet front 11 are formed in the left side wall 13. As shown in FIG. These engaging holes 13a, 13b are formed toward the front edge 13f of the left side wall 13 at two locations up and down. In the left side wall 13 are also on the part of the outer wall or the outer wall Ren surface 13s formed a first recess 13c and a second recess 13d.

The first recess 13c is formed at the top edge and toward the front edge 13f of the left side wall 13. As shown in FIG. The first recess 13c is formed opposite to and covering three aluminum electrolytic capacitors 37 (described later). The second recess 13d is formed at the bottom edge and toward the rear wall 16 of the left side wall 13. As shown in FIG. The second recess 13d is formed so as to be partially opposed to the lateral surface 35a of an aluminum electrolytic capacitor 35 (described later), with a part of the lateral surface 35a being opposed to the first circuit board 31a.

(1-1-1-3. ceiling wall 14)

In the ceiling wall 14, as in 4(d) 1, an engaging hole 14a for engaging a claw 11e (described later) of the cabinet front 11 is formed. This engaging hole 14a is formed toward the front edge 14f of the top wall 14. As shown in FIG. In the top wall 14 are also, as in 1 , 3 and 4(d) 1, air holes 141 for releasing heat generated in the power supply circuit unit 3 to the outside are formed. The air holes 141 include slit-shaped air holes 141b and substantially hexagonal air holes 141a. If the edge of the top wall 14 pointing to the right side wall 12 is referred to as the right edge 14c, the edge of the top wall 14 pointing to the left side wall 13 as the left edge 14d and the edge of the top wall 14 pointing to the rear wall 16 as the rear edge 14e, the air holes are 141b provided at positions near the right edge 14c and near the left edge 14d twice along the right edge 14c and along the left edge 14d, respectively. In turn, the air holes 141a are provided in plurality between the air holes 141b formed along the right edge 14c and the left edge 14d so as to form a honeycomb pattern in the longitudinal direction (from the front edge 14f to the rear edge 14e).

(1-1-1-4. bottom wall 15)

In the bottom wall 15, as in 4(e) 1, an engaging hole 15a for engaging a claw 11f (described later) of the cabinet front 11 is formed. This engaging hole 15a is formed toward the front edge 15f of the bottom wall 15. As shown in FIG. In the bottom wall 15 are also, as in 1 , 3 and 4(e) 1, air holes 151 for releasing heat generated in the power supply circuit unit 3 to the outside are formed. The air holes 151 include slit-shaped air holes 151b and substantially hexagonal air holes 151a. Referring to the edge of the bottom wall 15 pointing to the right side wall 12 as the right edge 15c, the edge of the bottom wall 15 pointing to the left side wall 13 as the left edge 15d and the edge of the bottom wall 15 pointing to the rear wall 16 as the rear edge 15e, the air holes are 151b provided at positions near the right edge 15c and near the left edge 15d, twice along the right edge 15c and along the left edge 15d, respectively. In turn, the air holes 151a are provided in plurality between the air holes 151b formed along the right edge 15c and the left edge 15d so as to form a honeycomb pattern in the longitudinal direction (from the front edge 15f to the rear edge 15e).

(1-1-1-5. back wall 16)

On the rear wall 16, as in 2 shown, a mounting formation 160 for mounting on the mounting rail 9 is provided. The mounting formation 160 is formed by a left-right oriented depression at approximately the center with respect to the top-bottom direction. Described specifically, the rear wall 16 has a surface 16a toward the top edge along the top-bottom direction, a substantially central surface 16b, and a surface 16c toward the bottom edge, the surface 16b being positioned forward than a bottom edge of the surface 16a and a top edge of surface 16c. A downwardly projecting gripping portion 16d is formed on the lower edge of the surface 16b. At the same time, at the step between the surface 16a and the surface 16b, there is a depression 16e which deepens towards the top.

On the other hand, on the surface 16c in the vicinity of the top edge of the central portion with respect to the left-right direction, a gripping portion 16f directed upward is provided. On a surface at the end of the gripping portion 16f, a slope 16g is formed, which is inclined such that locations on its surface are the more forward the higher they are located. Further, the gripping portion 16f has elasticity that allows it to bend in the front-rear direction.

By inserting the upper edge 9a of the mounting rail 9 (see 1 ) into the depression 16e and inserting the lower edge 9b (see 1 ) overcoming the incline 16g of the gripping section 16f, the upper edge 9a is locked by the gripping section 16d, while the lower edge 9b snaps into the gripping section 16f. In this way, the power pack 100 is carried by the mounting rail 9 . Incidentally, the support rail 9 is formed left and right in length so that the left-right direction is in 1 an example of the longitudinal direction of the support rail 9 represents.

(1-1-2. Housing front 11)

The housing front 11 is, as in 3 shown, formed in the form of a cover for closing the opening 17 of the housing body 10 and attached to the housing body 10. The housing front 11 has, as in 1 until 3 shown, a front wall 110, a right wall 112, a left wall 113, a top wall 114 and a bottom wall 115. In the state with the housing front 11 attached to the housing body 10, the end surfaces of the right wall 112, the left wall 113, the top wall 114 and the bottom wall 115 of the housing front 11 adjoin the respective end surfaces of the right side wall 12, the left side wall 13, the Top wall 14 and the bottom wall 15 of the housing body 10.

From the edge 11k opposite the left side wall 13 at the rear end of the housing front 11, projections 11g, 11h projecting in the rearward direction are formed. These claws 11c, 11d have slopes 111c, 111d on the outside and are formed such that their width decreases rearward in the right-left direction.

Next are as in 1 and 2 shown, from the right side wall 12 opposite edge 11j at the rear end of the housing front 11 in the rearwardly protruding projections (not shown) are formed at the ends of claws 11a, 11b for engaging in the engagement holes 12a, 12b of the right side wall 12 are provided (please refer 2 ). The projections on which the claws 11a, 11b are provided are similar in shape to those in FIG 3 projections 11g, 11h shown.

From the edge 11m opposite to the ceiling wall 14 at the rear end of the housing front 11, a rearwardly projecting plate-shaped projection 11i is formed, on the outer surface of which a claw 11e for engaging with the engaging hole 14a of the ceiling wall 14 is provided. This claw 11e has a slope 111e on the outside and is formed such that its thickness decreases rearward in the top-bottom direction.

Next is as in 2 shown, from the edge 11n opposite the bottom wall 15 at the rear end of the housing front 11 a rearwardly projecting plate-shaped projection (not shown) is formed, on which a claw 11f is provided for engaging in the engagement hole 15a of the bottom wall 15 (see 2 ). The projection on which the claw 11f is provided is similar in shape to that in FIG 3 projection 11i shown.

Also is as in 3 shown, near the upper end of the inside of the housing front 11, a first wiring terminal 39a of the power supply circuit unit 3 is arranged. Through holes 11o for tightening or loosening screws 390 of the first wiring terminal 39a are provided in the front wall 110 of the front case 11 . Furthermore, through holes 11p for inserting wirings are provided in the top wall 114 .

Similarly, near the lower end of the inside of the front case 11, a second wiring terminal 39b of the power supply circuit unit 3 is arranged. Through holes 11q for tightening or loosening screws 390 of the second wiring terminal 39b are provided in the front wall 110 of the front case 11 . Furthermore, in the lower wall 115 (see 2 ) through holes 11r (see 3 ) intended for the insertion of wiring.

(1-2. Heat dissipation plates 2a, 2b)

In the present embodiment, the heat dissipation plates 2a, 2b are plate-shaped members made of aluminum. The heat-dissipating plates 2a, 2b are each attached with adhesive to the outer surface 12s of the right side wall 12 (see Fig 4(b) and the one described later 7 ) and to the outer surface 13s of the left side wall 13 (see 4(c) and the one described later 7 ) of the housing body 10 is glued, with the heat dissipation plate on the right-hand side wall 12 being designated 2a and the heat dissipation plate on the left-hand side wall 13 being designated 2b.

The heat dissipation plate 2a is formed in substantially the same external shape as the right side wall 12 to cover the entire right side wall 12 of the case body 10 . The heat dissipation plate 2b is formed in substantially the same external shape as the left sidewall 13 to cover the entire left sidewall 13 of the case body 10 as well as the first recess 13c and the second recess 13d.

Further, recesses 21, 22 are formed in the heat dissipation plate 2a so as not to block the engaging holes 12a, 12b formed in the right side wall 12. Also in the heat dissipation plate 2b, in order not to block the engaging holes 13a, 13b formed in the left side wall 13, the recesses 21, 22 are formed.

As the adhesive for mounting the heat dissipation plates 2a, 2b to the right side wall 12 and the left side wall 13, double-sided tape and the like can be used. are specified, preferably with a thermal conductivity which is higher than that of the housing body 10 after the adhesive has hardened.

(1-3. Power supply circuit unit 3)

5 12 is a perspective view of the power supply circuit unit 3 of the power supply 100 according to the present embodiment 1. 6 13 is a side view showing the internal structure of the power supply device 100 according to Embodiment 1. FIG. In 6 internal structures are shown with dotted lines. 7 13 is a sectional view taken along arrow marks AA in FIG 6 . 8th Fig. 14 is a sectional view taken along arrow marks BB in Fig 6 .

The power supply circuit unit 3 is, as in 5 and 6 shown, accommodated in the box body 1 and comprises a first circuit board 31a and a second circuit board 31b.

(1-3-1. First circuit board 31a)

The first circuit board 31a is arranged along a line parallel to the right side wall 12 of the housing body 10 in such a way that it covers the entire inside of the right side wall 12 . The first circuit board 31a is like that explained below 7 shown, slidably inserted and held in groove-shaped brackets 14m, 15m formed on the respective inner sides of the top wall 14 and the bottom wall 15 near the right side wall 12. It is noted that in the present description the term "parallel" is not to be understood in the strict sense.

On the first board 31a, a switching element 32, a heat sink 33a, a transformer 34, an aluminum electrolytic capacitor 35, a rectifying diode 30, a heat sink 33b, a diode bridge 36, aluminum electrolytic capacitors 37, a coil 38, etc. are arranged as main components. These components are arranged on the surface toward the left side wall 13 of the first circuit board 31a.

The switching element 32, which is, for example, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), is arranged on the first circuit board 31a toward the rear wall 16. The heat sink 33a has a plate shape to dissipate the heat given off by the switching element 32 . The main surfaces 33as of the plate shape of the heat sink 33a are arranged perpendicular to the first circuit board 31a and at the same time perpendicular to the bottom wall 15 and top wall 14 of the housing body 10 . In the present description, the term "perpendicular" is not to be understood in the strict sense.

The transformer 34 and the aluminum electrolytic capacitor 35 are disposed on the opening 17 side (front side) of the heat sink 33a on the first circuit board 31a. The transformer 34 is arranged toward the top wall 14 , while the aluminum electrolytic capacitor 35 is arranged on the bottom wall 15 side of the transformer 34 . The aluminum electrolytic capacitor 35 is cylindrical and has a lateral surface 35a, an end face 35b and an end face 35c. On the end face 35b, as in 7 shown, a terminal is provided which is electrically connected to the first circuit board 31a. In the present embodiment, the end faces 35b and 35c are aligned parallel to the top wall 14 and the bottom wall 15 . Furthermore, it can be said that the aluminum electrolytic capacitor 35 is arranged so that a part of its lateral surface 35a faces the first circuit board 31a.

The heatsink 33b is provided to dissipate heat from the rectifier diode 30 . The heat sink 33b has the shape of a plate-like member bent into an L-shape and is disposed on the opening 17 side of the transformer 34 . Furthermore, the main surfaces 33bs of the plate shape of the heat sink 33b are arranged to run perpendicularly to the bottom wall 15 and top wall 14 of the housing body 10 .

The diode bridge 36 is arranged below the heat sink 33b. The diode bridge 36 is in the form of a plate whose main surfaces 36a (see 6 ) are arranged to run perpendicularly to the bottom wall 15 and top wall 14 of the housing body 10 .

The aluminum electrolytic capacitors 37 are arranged in threes in a row in the top-bottom direction (the perpendicular to the top wall 14 and bottom wall 15). Each aluminum electrolytic capacitor 37 has, as shown in FIG 8th shown, a lateral surface 37a, an end face 37b and an end face 37c. The end face 37b is provided with a connection, not shown in detail, and is electrically connected to the first circuit board 31a. In the present embodiment, the end face 37b and the end face 37c of the aluminum electrolytic capacitors 37 are arranged in parallel with the right side wall 12 and the left side wall 13 . Furthermore, the end wall 37c which is not provided with a port as in FIG 6 and 8th shown opposite the left side wall 13 arranged.

The coil 38 is arranged on the side of the aluminum electrolytic capacitors 37 facing the bottom wall 15 .

(1-3-2. Second circuit board 31b)

The second circuit board 31b is further to the housing front 11 (not in 5 , but in 6 shown) arranged toward than the three aluminum electrolytic capacitors 37 and the coil 38 and arranged to be as shown in FIG 3 shown the opening 17 of the housing body 10 blocked substantially. In addition, the second circuit board 31b is aligned at the front on the first circuit board 31a perpendicularly to the first circuit board 31a and at the same time perpendicularly in relation to the bottom wall 15 and top wall 14 of the housing body 10 .

On the second circuit board 31b, the first wiring terminal 39a and the second wiring terminal 39b are mainly provided. The first wiring terminal 39a and the second wiring terminal 39b are provided on the surface of the second circuit board 31b facing the front wall 110 so that when the housing body 10 and the housing front 11 are assembled, they are arranged inside the housing front 11 . The first wiring terminal 39a and the second wiring terminal 39b are divided so that a plurality of lead wires can be connected to each.

At the first wiring terminal 39a, respective screws 390 for fastening lead wires are inserted in each division from the front wall 110, while wire inlets 391 for inserting lead wires to be fastened with the screws 390 are provided toward the top wall 114. The second wiring terminal 39b is similar in construction to the first wiring terminal 39a except that the wire inlets 391 are provided toward the bottom wall 115. As shown in FIG.

(1-4. Heat dissipation gel sheet 4)

The heat-dissipating gel sheet 4 of Embodiment 1 has insulating property, thermal conductivity, elasticity, and stickiness.

In the power supply 100 according to Embodiment 1, the heat-dissipating gel sheet 4 as shown in FIG 5 until 7 shown, firmly bonded to a surface 34a of the high heat-generating transformer 34 (see arrow symbol Y1 in 5 ). This surface 34a is the side facing the left side wall 13 . The heat dissipation gel sheet 4 is as in 5 shown, cuboid and has, as in 7 1, has a primary surface 4a and a secondary surface 4b which are inversely oriented to each other. The primary surface 4a of the heat-dissipating gel sheet 4 directly contacts the surface 34a of the transformer 34. Furthermore, the heat-dissipating gel sheet 4 directly contacts a sliding sheet 5 described later with the secondary surface 4b.

(1-5. Sliding sheet 5)

(1-5-1. Structure and arrangement of sliding sheet 5)

This in 5 until 7 The sliding sheet 5 shown is made of resin (or plastic) or the like. educated. The sliding sheet 5 is interposed between the heat-dissipating gel sheet 4 and the inner surface 13i of the left side wall 13 in close contact with the heat-dissipating gel sheet 4 and the left side wall 13 (see arrow symbol Y2 in 7 and 5 ).

The slide sheet 5 is used to insert the power supply circuit unit 3 into the case body 10 in a state where the heat-dissipating gel sheet 4 having tackiness is placed thereon. For this purpose, sliding sheet 5 is made of resin or the like. which preferably has high slidability on the inner surfaces of the case body 10, particularly the inner surface 13i of the left side wall 13, which is preferably at least higher than the slidability of the secondary surface 4b of the heat-dissipating gel sheet 4 on the inner surface 13i.

Due to the above structure, heat generated in the transformer 34 is transmitted to the heat dissipation plate 2b via the heat dissipation gel sheet 4, the sliding sheet, and the box body 1 (specifically, the left side wall 13). The heat transmitted to the heat dissipation plate 2b spreads in the surface direction in the heat dissipation plate 2b and is discharged to the outside of the power supply 100 .

(1-5-2. Manufacturing Method of Power Supply 100 Using Slide Sheet 5)

9 14 is an exploded view for explaining a manufacturing method of the power supply 100 of the present embodiment 1.

First, the heat-dissipating gel sheet 4 is placed on the surface 34a of the transformer 34 of the power supply circuit unit 3 (arrow symbol Y1 in 5 ). Then, the sliding sheet 5 is placed on the heat-dissipating gel sheet 4 (arrow symbol Y2 in 5 ). Since the heat-dissipating gel sheet 4 has stickiness, pressing the sliding sheet 5 to the heat-dissipating gel sheet 4 at this point causes the sliding sheet 5 to stick to the heat-dissipating gel sheet 4 and be in a state where it is difficult to detach.

Next, the power supply circuit unit 3 with the sliding sheet 5 and the heat-dissipating gel sheet 4 placed thereon is slid into the case body 10 (see arrow symbol E).

Next, by engaging the claws 11a, 11b, 11c, 11d, 11e, 11f of the housing front 11 into the respective engaging holes 12a, 12b, 13a, 13b, 14a, 15a, the housing body 10 and the housing front 11 are coupled to each other to form the housing 1 to build. To explain this in detail using the claw 11c as an example, when the housing front 11 is attached to the housing body 10 from the direction of the arrow symbol E, the bevel 111c hits the front edge 13f, so that the projection 11g bends inwards as they slide against each other Claw 11c penetrates to the inside of the case body 10 and the claw 11c engages in the engaging hole 13a. The same applies to the other claws.

Then, the heat dissipation plates 2a, 2b are bonded to the outer surface 12s of the right side wall 12 and the outer surface 13s of the left side wall 13 of the case body 10 one by one. The power supply 100 according to the present embodiment can be manufactured in the above manner.

If one tries to insert the power supply circuit unit 3 into the case body 10 without disposing the slide sheet 5 with the heat dissipation gel sheet 4 alone disposed thereon, it is difficult to slide it because the heat dissipation gel sheet 4 sticks to the inner surfaces of the case body 10 due to its stickiness mentioned above.

However, by arranging the sliding sheet 5 on the secondary surface 4b side of the heat dissipation gel sheet 4, the power supply circuit unit 3 can be inserted into the case body in a state where the heat dissipation gel sheet 4 is arranged on the transformer 34 of the power supply circuit unit 3.

(1-6. Heat insulating sections 6a, 6b)

In the power supply 100 of the present embodiment, heat insulating portions 6a, 6b are provided opposite to the aluminum electrolytic capacitor 35 and the aluminum electrolytic capacitors 37, respectively. The thermally insulating portion on the aluminum electrolytic capacitors 37 side is referred to as a thermally insulating portion 6a, and the thermally insulating portion on the aluminum electrolytic capacitor 35 side is referred to as a thermally insulating portion 6b.

As mentioned above, the heat generated from the heat-generating components such as the transformer 34 is conducted to the heat-dissipation plates 2a, 2b, and the heat-insulating portions 6a, 6b are arranged so that the heat does not flow from the heat-dissipation plate 2b to the aluminum electrolytic capacitors 35, 37 is conducted.

through the in 4(c) As shown in the first recess 13c, a gap is formed between the first side wall 13 and the heat dissipation plate 2b, and the heat insulating portion 6a is formed by the air present in this gap. As in 6 As shown, the first recess 13c is formed so as to cover the end faces 37c of the three aluminum electrolytic capacitors 37 stacked in a row in the vertical direction when viewed from a direction perpendicular to the heat dissipation plate 2b. That is, the first recess 13c is formed so as to cover the area where the aluminum electrolytic capacitors 37 are arranged.

By forming such a first recess 13c, in the area of the heat-dissipation plate 2b which is opposite to the aluminum electrolytic capacitors 37, a heat-insulating portion 6a is formed between the heat-dissipation plate 2b and the left side wall 13.

Furthermore, as in 4(c) shown by the second recess 13d, a gap is formed between the left side wall 13 and the heat dissipation plate 2b, and a heat insulating portion 6a is formed by the air present in this gap. As in 6 1, the second recess 13d is formed so as to cover the peripheral surface 35a of the aluminum electrolytic capacitor 35 when viewed from a direction perpendicular to the heat dissipation plate 2b. That is, the second recess 13d is formed so as to cover the area where the aluminum electrolytic capacitor 35 is arranged.

By forming such a second recess 13d, in the area of the heat-dissipation plate 2b which is opposite to the aluminum electrolytic capacitor 35, a heat-insulating portion 6b is formed between the heat-dissipation plate 2b and the left side wall 13.

Thus, heat insulating portions 6a, 6b are provided in the areas of the heat dissipation plate 2b opposed to the aluminum electrolytic capacitors 35, 37, so that heat conduction from the heat dissipation plate 2b to the aluminum electrolytic capacitors 35, 37 can be blocked.

Thus, heat from the transformer 34, which is a heat-generating component, can be dissipated to the outside of the power supply 100 via the heat-dissipation plate 2b with high efficiency, and heat conduction from the heat-dissipation plate 2b to the heat-susceptible aluminum electrolytic capacitors 35, 37 can be blocked.

<3 Key Features>

As described above, the power supply 100 (an example of an electronic device) of the present embodiment includes the box case 1 (an example of a case), the transformer 34 (an example of a heat-generating component), the heat-dissipation plate 2b, the aluminum electrolytic capacitors 35, 37, and the heat insulating portions 6a, 6b. The box body 1 is formed of resin. The transformer 34 is arranged in the box body 1 . The heat dissipation plate 2b is arranged on the outer surface 13s (example of an outer surface) of the box body 1, is in direct contact with the transformer 34 via the heat dissipation gel sheet 4 (example of a thermally conductive member) which is in direct contact with the transformer 34 is arranged has a higher thermal conductivity than the resin constituting the box body 1, and dissipates the heat generated from the transformer 34 to the outside. The aluminum electrolytic capacitors 35, 37 are arranged in the case 1 box. The heat insulating portions 6a, 6b are disposed between the heat-dissipation plate 2b and the box body 1 opposite to the aluminum electrolytic capacitors 35, 37, and obstruct heat conduction from the heat-dissipation plate 2b to the aluminum electrolytic capacitors 35, 37.

More specifically, in the present embodiment, the heat-dissipating plate 2b is indirectly in contact with the transformer 34 via the heat-dissipating gel sheet 4, the sliding sheet 5, and the box body 1.

Since the box body 1 can thus be formed of resin or plastic, it is possible to downsize the structure since it is not necessary to secure an insulating distance to the electronic parts such as the transformer 34. Further, by arranging the heat-dissipation plate 2b along the outer surface 13s of the left side wall of the case body 10, the heat generated from the transformer 34 can spread in the surface direction of the heat-dissipation plate 2b and be released from the entire heat-dissipation plate 2b, so that good heat dissipation is achieved can be. On the other hand, by providing the heat insulating portions 6a, 6b, the heat conducted along the heat dissipation plate 2b can be prevented as much as possible from being conducted to the aluminum electrolytic capacitors 35, 37, so that the life of the aluminum electrolytic capacitors can be prevented from shortening 35, 37 is shortened, and a service life of the power supply 100 approximately equal to or longer than that of conventional power supplies can be realized. Therefore, as described above, the heat generated from the transformer 34 can be released to the outside, and the heat conduction to the aluminum electrolytic capacitors 35, 37 can be suppressed as much as possible.

Therefore, miniaturization can be achieved, and a power supply which has good heat radiation and for which an adequate service life is secured can be provided.

<4. Other Embodiments>

In the following explanations of other embodiments, the same structures as in the above embodiment are denoted by the same reference numerals.

(A)

It is also possible that in the above-described embodiment, latticed ribs 13cb, 13db are formed in the first recess 13c and the second recess 13d in which the heat insulating portions 6a, 6b are formed.

10 Fig. 13 is a diagram showing an embodiment in which such latticed ribs 13cb, 13db are formed in the first recess 13c and the second recess 13d. In the 10 The first recess 13c and second recess 13d shown can also be regarded as a plurality of recesses divided by the ribs 13cb, 13db.

Forming the recesses 13c, 13d in the box body 1 makes the box body 1 thinner, but by forming the recesses 13c, 13d while leaving the ribs 13cb, 13db, a certain strength can be secured.

(b)

Further, in the above-described embodiment, the heat insulating effect is achieved by air provided in the first recess 13c and the second recess 13d, but heat insulating portions may be formed in which an insulating material partially including air, such as glass wool , airgel or the like, is placed in the recesses 13c, 13d.

(c)

Further, in the embodiment described above, as in 7 and 8th As shown, the inner surface 13i of the left side wall 13 is flat, but is not limited to this. For example, when the box body 1 is formed of polycarbonate, a thickness of about 0.5mm may be necessary to ensure the strength, but if the necessary thickness is not secured due to the formation of the first recess 13c and the second recess 13d can, then can as in 11 shown the box body 1 also protrude inward. That means that in 11 the left side wall 13 where the second recess 13d is formed is projected inward to ensure the thickness of the left side wall 13 of the box body 1. This protruding part is denoted by reference numeral 13de.

Thus, the thickness necessary for the strength of the box body 1 can be secured. It should be noted that the portion of the left side wall 13 on which the first recess 13c is formed may also protrude inward as on the second recess 13d.

(D)

In the embodiment described above, the transformer 34, which is an example of a heat-generating component, is in contact with the heat-dissipation plate 2b indirectly via the heat-dissipation gel sheet 4, the sliding sheet 5 and the box case 1, and the heat from the transformer 34 becomes this heat-dissipation plate 2b directed. However, it is not limited to this arrangement, and it is sufficient that the heat-generating member is in contact with the heat-dissipating plate, whether directly or indirectly, and heat is conducted from the heat-generating member to the heat-dissipating plate. It should be noted that the heat-generating component can also be regarded as an electronic component which gives off its heat to the heat-dissipating plate 2b in the regular operation of the power supply.

Various structures of direct or indirect contact of a heat-generating member with the heat-dissipating plate 2b will be explained below as modification examples of the embodiments.

(D1)

In the above-described embodiments, the heat-dissipating gel sheet 4 placed in direct contact with the transformer 34 is in indirect contact with the heat-dissipating plate 2b via the sliding sheet 5 and the box body 1, but it is also possible that no sliding sheet 5 is provided. This structure corresponds to an example that a heat-generating component indirectly touches a heat-dissipating plate via a heat-conducting member and a case.

12(a) Fig. 14 is a perspective view of a power supply unit 200 thus constructed, and 12(b) 12 is a perspective view showing the case body 210. FIG 12(a) is represented by dotted lines and the internal structure is shown. Furthermore 13(a) a frontal sectional view of the in 12(a) power supply 200 shown, with a sectional plane which is parallel to the front wall 110 and passes through the transformer 34 and the aluminum electrolytic capacitor 35. 13(b) is an enlargement of section G in 13(a) . 14 Figure 12 is an exploded view of power supply 200.

At the power supply 200 touches as in 13(b) As shown, the primary surface 4a of the heat-dissipating gel sheet 4 directly contacts the surface 34a of the transformer 34, while the secondary surface 4b of the heat-dissipating gel sheet 4 directly contacts the inner surface 13i of the left side wall 13. In the power supply 200, the heat generated by the transformer 34 is transmitted through the heat-dissipating gel sheet 4 and the left side wall 13 to the heat-dissipating plate 2b, where it spreads in the surface direction, and then is discharged to the outside.

Now, since the heat-dissipating gel sheet 4 has stickiness, the power supply circuit unit 3 in a state where the same is stuck would be difficult as shown in FIG 9 explained to be slidably inserted since the heat-dissipating gel sheet 4 sticks to the inner surface 13i of the left side wall 13. For this reason, in the power supply unit 200, the case body 210 of the box case 201 thereof is formed by uniting two components 210a and 210b. One component 210b includes the right side wall 12, and the other component 210a includes the left side wall 13. In other words, it can also be said that the 12(a) The case body 210 shown in FIG 4 ) in two.

The housing body 210 is divided along a plane parallel to the left side wall 13 and the right side wall 12, as shown in FIG 14 shown runs between the air holes 141b toward the left side wall 13 and the multiple hexagonal air holes 141a. A merging section S where the cut surfaces are merged with each other is in 12(a) and 13(a) shown. It is noted that as in 12 1 shows the power supply 200 in the state with the heat dissipation plates 2a, 2b mounted on the box body 201, except for the joining portion S in its external appearance, as in FIG 1 shown power supply 100 is the same.

By uniting the first component 210a and the second component 210b with adhesive or the like after the power supply circuit unit 3 is in the state as in FIG 14 As shown, the heat-dissipating gel sheet 4 placed on the transformer 34 is accommodated in the second component 210b, it is possible to accommodate the power supply circuit unit 3 in the state with the heat-dissipating gel sheet 4 pasted in the case body 210.

The above-mentioned joining of the first component 210a and second component 210b can also be done with screws and the like without being limited to adhesive. take place, as well as interlocking structures can be selected.

Furthermore, in the power supply 200 described above, although the case body 210 has been divided into two components (the first component 210a and the second component 210b), a box-shaped case body 10 can also be used to accommodate the power supply circuit unit 3 in the case body 210. However, in this case, due to the stickiness of the heat-dissipating gel sheet 4, it becomes more difficult to insert the power supply circuit unit 3 into the case body 10, which takes some time and effort in manufacturing. If a box-shaped case body 10 is used in such a manner, it is preferable that a low-tack heat-dissipating gel sheet 4 is used.

(D2)

In the embodiment described above, the heat-dissipation gel sheet 4 placed in direct contact with the transformer 34 is in direct contact with the heat-dissipation plate 2b via the sliding sheet 5 and the box body 1, but it may be in direct contact with the heat-dissipation plate 2b. Such an arrangement corresponds to an example of the heat-generating component being in direct contact with the heat-dissipating plate via a heat-conducting element.

15 is a perspective view of a power supply 300 constructed in this way. The power supply 300 of FIG 15 differs from the power supply 100 in that no slide sheet 5 is provided and that an opening 13e is formed in the left side wall 313 of the box body 301. 16(a) is a frontal sectional view of the in 15 shown power supply 300 with a sectional plane which is parallel to the front wall 110 and through the transformer 34 and the aluminum electrolytic capacitor 35 runs. 16(b) shows an enlargement of section F in 16(a) . 17 Figure 3 is an exploded view of power supply 300.

On the box housing 301 of the power supply unit 300, as in 15 until 17 shown, formed in the left side wall 313 of the housing body 310 opposite the transformer 34 opening 13e which breaks through the outside and inside of the left side wall 13. As in 16(b) 1, in the power supply 300, the primary surface 4a of the heat-dissipating gel sheet 4 directly contacts the surface 34a of the transformer 34, while the heat-dissipating gel sheet 4 is in direct contact with the heat-dissipating plate 2b at its secondary surface 4b through the opening 13e. Due to this structure, heat generated from the transformer 34 propagates through the heat-dissipation gel sheet 4 to the heat-dissipation plate 2b to propagate in the heat-dissipation plate 2b in the surface direction thereof and be discharged to the outside.

When assembling the power supply 300, first, in a state with no heat-dissipating gel sheet 4, the power supply circuit unit 3 is inserted into the case body 310. Thereafter, through the opening 13e, the heat-dissipating gel sheet 4 is placed on the transformer 34 (see arrow symbol T in 17 ). Thereafter, the housing front 11 is placed on the housing body 310, and the heat dissipation plates 2a, 2b are stuck to the right side wall 12 and left side wall 313 with double-sided adhesive tape.

(D3)

In the above (D2), a structure was explained in which the heat-dissipating gel sheet 4, which is an example of a heat-conducting member, is placed in close contact with the transformer 34, which is an example of a heat-generating component, and the heat-dissipating gel sheet 4 is in direct contact with the heat-dissipating plate 2b. However, the heat-generating member is not limited to the transformer 34, and the heat-conducting member is not limited to the heat-dissipating gel sheet 4.

For example, a configuration is also possible in which the heat sink 33b (an example of a heat conducting member) for heat dissipation from the rectifying diode 30 (an example of a heat generating device) directly contacts the heat dissipation plate 2b. This structure speaks of an example in which a heat-generating component indirectly touches a heat-dissipating plate via a heat-conducting element.

18 is a perspective view of a power supply unit 400 constructed in this way. 19 12 is a left side view showing the internal structure of the power supply unit 400. FIG 18 shows. 20(a) 12 is a sectional view taken along arrow marks CC in FIG 19 , and 20(b) a sectional view taken along arrow marks DD in 19 .

The power supply 400 off 18 differs compared to the in 12(a) shown power supply 200 in the point that in the left side wall 413 an opening 13f is formed for directly touching the heat dissipation plate 2b through the heat sink 33b. As in 19 , 20(a) and 20(b) As shown in FIG 20(a) , (b) shown, a first portion 33ba arranged along a direction perpendicular to the first board 31a, and a second portion 33bc extending from the distal end (the end near the left side wall 413) of the first portion 33ba along a direction parallel to the first board 31a is formed. This second portion 33bc directly touches the heat dissipation plate 2b.

Because the heat sink 33b has to be inserted into the opening 13f in this power supply unit 400, the housing body 410 of the box housing 401 is the same as in FIG 12-14 Network device 200 shown constructed by combining a first component 410a and a second component 210b. The first component 410a is off compared to the first component 210a 12-14 identical in construction except for the opening 13f.

In this way, if the heatsink 33b directly comes into contact with the heat dissipation plate 2b, either the heatsink 33b and the rectifier diode 30 must be insulated, or the rectifier diode 30 itself must be insulated.

Note that in the power supply 400, although the heat sink 33b directly touches the heat dissipation plate 2b, a heat dissipation gel sheet 4 may be disposed between the heat sink 33b and the heat dissipation plate 2b in each direct contact.

In addition, without the opening 13f being formed in the left side wall 413, the heat sink 33b can indirectly contact the heat dissipation plate 2b via a heat dissipation gel sheet 4 and the left side wall 413.

Further, the heat sink 33b can also directly touch the left side wall 413 without an intermediary heat-dissipation gel sheet 4 .

Incidentally, the heat sink 33a, like the heat sink 33b, can also serve as an example of a heat conducting member and touch the heat dissipation plate 2b indirectly via the box body or directly.

As described above, when the electronic component itself is insulated, an opening may be formed in the box body to allow the electronic component to directly contact the heat dissipation plate 2b. Such a structure corresponds to an example that a heat-generating component is in close contact with a heat-dissipating plate.

(E)

The slide sheet 5 has been referred to as being formed of resin in the embodiment described above, but may be of glass, paper or other materials. It's not limited to resin. Preferably, it is strong and of such strength that it will not tear when brought into contact with the interior surface of the housing.

(F)

In the above embodiments, such as in 6 and 9 shown, a slide sheet 5 having such a size that it covers at least the heat-dissipating gel sheet 4 is used, however, it is also possible to use a slide sheet covering not only the heat-dissipating gel sheet 4 but also other parts of the power supply circuit unit 3. 21(a) Fig. 7 is a perspective view of such a slide sheet 700. 21(b) 12 is a schematic perspective view of the power supply circuit unit 3. 21(c) FIG. 12 schematically shows the state in which the power supply circuit unit 3 is covered by the slide sheet 700. FIG.

This in 21(a) The slide sheet 700 shown includes a front wall portion 701, a right side wall portion 702, a left side wall portion 703 and a rear wall portion 704. The right side wall portion 702 is formed so that it covers the entire side on the right side wall 12 of the power supply circuit unit 3. The front wall portion 701, the left side wall portion 703 and the rear wall portion 704 cover part of the front wall 110, the left side wall 13 and the rear wall 16 of the power supply circuit unit 3. Further, on the rear wall portion 704 of the slide sheet 700, as in FIG 21(a) shown, insertion claws 704a trained det which face the front wall portion 701 and which can be inserted into insertion holes 33a1' formed in a heat sink 33a'. By inserting the insertion claws 704a into the insertion holes 33a1', the power supply circuit unit 3 is easily held in a state covered by the sliding sheet 700. Thus, the power supply circuit unit 3 covered with the sliding sheet 700 is slid into the in 8th shown housing body 10 is inserted. It should be noted that the shape is not limited to the in 21(a) is limited, and the entire side of the left side wall 13 of the power supply circuit unit 3 can also be covered, for example.

(G)

In the above-described embodiments and (D3) above, each of the transformer 34 and the rectifying diode 30 has been exemplified as a heat-generating component, but it is not limited to these, but the coil 38 or the like can also be used, for example. can be.

(H)

In the above-described embodiments, the heat dissipation plates 2a, 2b are formed of aluminum. However, this can also be another metal, although there is no restriction to metal.

In short, it suffices to use a heat dissipation plate having a higher thermal conductivity than the resin constituting the box case 1, 201, 301, 401 (particularly, the case body 10, 210, 310, 410).

(i)

In the above-described embodiments, the heat dissipation plates 2a, 2b are mounted on the right side wall 12 and the left side wall 13 by adhesion, but may be mounted by engagement or clamping.

(J)

In the above embodiment, a heat dissipation plate 2a is also provided on the right side wall 2a, but it may be omitted.

(k)

The above embodiments have been explained with respect to a network device as an example of electronic equipment, but are not limited to a network device. Rather, the structures described above can be applied to an electronic device having a heat-generating element.

COMMERCIAL APPLICABILITY

The electronic device of the present invention has an effect of enabling miniaturization with good heat dissipation properties to ensure an adequate lifespan, so that it is suitable as a power supply, particularly a switching power supply, or the like.

REFERENCE LIST

1

Box case (example of a case)

2, 2a, 2b

Heat dissipation plate (example of a heat dissipation element)

3

power supply circuit unit

4

Heat Dissipation Gel Sheet (Example of Heat Conductor)

4a

primary surface

4b

secondary surface

5

Sliding sheet (example of sheet-shaped element)

6, 6a, 6b

thermal insulation section

9

mounting rail

9a

top edge

9b

bottom edge

10

housing body

11

housing front

11a, 11b, 11c, 11d, 11e, 11f

claw

11g, 11i

head Start

11y

Opposite edge of right side wall

11k

Opposite edge of left side wall

11m

Edge of ceiling wall opposite

11n

Edge of bottom wall opposite

11o, 11p, 11q, 11r

through hole

12

right side wall

12a, 12b

engagement hole

12f

leading edge

12s

outer surface

13

left side wall

13a, 13b

engagement hole

13c

first deepening

13approx

deepening

13cb

rib

13d

second deepening

13da

deepening

13db

rib

13e

opening

13f

opening

13f

leading edge

13s

outer surface (example of an outer surface)

13i

inner surface

14

ceiling wall

14a

engagement hole

14c

right edge

14d

left edge

14e

back edge

14f

front edge

14m

bracket

15

bottom wall

15a

engagement hole

15c

right edge

15d

left edge

15e

back edge

15f

front edge

15m

bracket

16

back panel

16a

surface towards the top edge

16b

approximately central area

16c

surface towards the lower edge

16d

gripping section

16e

lowering

16f

gripping section

16g

oblique

17

opening

21, 22

recess

30

rectifier diode

31a

first board

31b

second board

32

switching element

33a, 33b

heatsink (example of a heatsink)

33ba

first section

33bc

second part

33as, 33bs

main surface

34

Transformer (example of a heat-generating component)

34a

surface

35

aluminum electrolytic capacitor

35a

lateral surface

35b, 35c

face

36

diode bridge

36a

main surface

37

aluminum electrolytic capacitor

37a

lateral surface

37b, 37c

face

38

Kitchen sink

39a

first wiring connection

39b

second wiring connector

100

power supply

110

front wall

111c, 111e

oblique

112

right wall

113

left wall

114

top wall

115

lower wall

141, 141a, 141b

air hole

151, 151a, 151b

air hole

160

assembly formation

200

power supply

201

box body

210

housing body

210a

first component

210b

second component

300

power supply

301

box body

310

housing body

313

left side wall

390

screw

391

wire entry

400

power supply

401

box body

410

housing body

410a

first component

413

left side wall

Claims (10)

An electronic device (100, 200, 300, 400) comprising: a case (1, 201, 301, 401) formed of resin; a heat-generating component (30, 34, 38) arranged in the housing (1, 201, 301, 401); a plate-shaped heat dissipation member (2, 2a, 2b) arranged on an outer surface (13s) of the housing (1, 201, 301, 401) and having a higher thermal conductivity than the resin from which the housing (1, 201, 301, 401 ) and which dissipates heat generated by the heat-generating member (30, 34, 38) to the outside; an aluminum electrolytic capacitor (35, 37) disposed in said case (1, 201, 301, 401); and a heat insulating portion (6a, 6b) which is arranged between the heat dissipation element (2, 2a, 2b) and the case (1, 201, 301, 401) opposite to the aluminum electrolytic capacitor (35, 37) and which enables heat conduction from the heat dissipation element ( 2, 2a, 2b) to the aluminum electrolytic capacitor (35, 37); wherein the heat-generating component (30, 34, 38) directly touches the heat-dissipating element (2, 2a, 2b) or the heat-generating component (30, 34, 38) touches the heat-dissipating element (2, 2a, 2b) indirectly via the housing (1, 201 , 301, 401) touched. An electronic device (100, 200, 300, 400) comprising: a case (1, 201, 301, 401) formed of resin; a heat-generating component (30, 34, 38) arranged in the housing (1, 201, 301, 401); a plate-shaped heat dissipation member (2, 2a, 2b) arranged on an outer surface (13s) of the housing (1, 201, 301, 401) and having a higher thermal conductivity than the resin from which the housing (1, 201, 301, 401 ) and which dissipates heat generated by the heat-generating member (30, 34, 38) to the outside; an aluminum electrolytic capacitor (35, 37) disposed in said case (1, 201, 301, 401); a heat insulating portion (6a, 6b) which is arranged between the heat dissipation element (2, 2a, 2b) and the case (1, 201, 301, 401) opposite to the aluminum electrolytic capacitor (35, 37) and which enables heat conduction from the heat dissipation element ( 2, 2a, 2b) to the aluminum electrolytic capacitor (35, 37); and a heat-conducting element (4, 33a, 33b) which directly touches the heat-generating component (30, 34, 38), wherein the heat-generating component (30, 34, 38) touches the heat dissipation element (2, 2a, 2b) indirectly via the heat-conducting element (4, 33a, 33b). Electronic device (100, 200, 300, 400) according to claim 1 or 2 , wherein the heat-generating component (30, 34, 38) touches the heat dissipation element (2, 2a, 2b) indirectly via the heat-conducting element (4, 33a, 33b) and the housing (1, 201, 301, 401). Electronic device (100, 200, 300, 400) according to any one of Claims 1 until 3 wherein the heat insulating portion (6a, 6b) is provided in a recess (13c, 13d) provided in a wall of the housing (1, 201, 301, 401) facing the heat dissipation member (2, 2a, 2b). Electronic device (100, 200, 300, 400) according to claim 4 wherein the heat insulating portion (6a, 6b) is formed of air in the recess (13c, 13d). Electronic device (100, 200, 300, 400) according to any one of Claims 1 until 4 , wherein the heat-generating component (30, 34, 38) is a transformer (34). Electronic device (100, 200, 300, 400) according to any one of Claims 1 until 6 wherein the heat conducting member (4, 33a, 33b) is a heat dissipation gel sheet (4) having higher thermal conductivity than the heat insulating portion (6a, 6b). Electronic device (100, 200, 300, 400) according to any one of Claims 1 until 7 , wherein the heat-conducting element (4, 33a, 33b) is a heat sink (33a, 33b). Electronic device (100, 200, 300, 400) according to any one of claims 2 until 8th , Wherein the heat-conducting element (4, 33a, 33b) between the heat-generating component (30, 34, 38) and the housing (1, 201, 301, 401) is arranged, and touches the housing directly. Electronic device (100, 200, 300, 400) according to any one of claims 2 until 9 , wherein the housing (1, 201, 301, 401) is provided with a through hole (13e), the heat conducting element (4, 33a, 33b) between the heat-generating component (30, 34, 38) and the heat dissipation element (2, 2a, 2b) and directly touches the heat dissipation element (2, 2a, 2b) through the through hole (13e).

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