CN1987727A - Heat radiation module - Google Patents
Heat radiation module Download PDFInfo
- Publication number
- CN1987727A CN1987727A CN 200510120917 CN200510120917A CN1987727A CN 1987727 A CN1987727 A CN 1987727A CN 200510120917 CN200510120917 CN 200510120917 CN 200510120917 A CN200510120917 A CN 200510120917A CN 1987727 A CN1987727 A CN 1987727A
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- heat
- cooling base
- radiating module
- sliding shoe
- heat pipe
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The heat elimination module is in use for eliminating heat from heat source inside a shell body, and discharging quantity of heat to outside the shell body. Using a heat conduction device, the invention sticks the heat elimination module on the heat source in order to carry out heat exchange. Quantity of heat is conducted to a slider. Being setup on one side of the shell body, the slider forms contact of heat conduction with the heat conduction device. Being able to be slid relative to the shell body, the slider is exposed out of the shell body partially in order to discharge quantity of heat out of the shell body directly. The heat elimination module can transfer quantity of heat to outside notebook computer. Thus, it is not necessary to install fan to carry out air-cooling for notebook computer. Therefore, the invention simplifies flow of designing notebook computer.
Description
Technical field
The present invention is relevant with the heat radiation of notebook, particularly exposes to the notebook outside about a kind of sliding shoe that utilizes, directly and external world's radiating module of carrying out heat interchange.
Background technology
As shown in Figure 1, it has disclosed the used radiating module of current known notebook, it drains into the external world in order to the used heat that central processor 2 (CPU) among this notebook 1 is produced, so that this central processing unit 2 is kept working temperature, avoiding temperature too high and cause crashing, even this central processing unit 2 is burnt.
Wherein this radiating module includes: one first cooling base 3, one second cooling base 4, a heat pipe 5 (heat pipe) and a fan 6.This first cooling base 3 supports and is affixed on this central processing unit 2, carries out heat interchange by contact, dispels the heat for this central processing unit 2.This second cooling base 4 is arranged at one of this notebook 1 side, and its top has a plurality of radiating fins, and this fan 6 is arranged on this second cooling base 4, in order to promote air-flow with the cooling heat dissipation fin.The number of this heat pipe 5 can be more than one or one, two ends of this heat pipe 5 are embedded in respectively within this first cooling base 3 and this second cooling base 4, utilize these heat pipe 5 internal flows two phase change to carry out heat interchange, so that heat is transmitted low-temperature region by high-temperature area.By above-mentioned combination, the used heat that is produced during these central processing unit 2 runnings, can absorb via this first cooling base 3, then be passed to this second cooling base 4 by this heat pipe 5,6 in this fan drives gas flow, cooling draught is cooled off the radiating fin of this second cooling base 4, and the hot-air that will absorb used heat is again discharged outside this notebook 1.
Yet, though the used heat that this heat pipe 5 can promptly be produced this central processing unit 2 is passed to this second cooling base 4 by this first cooling base 3, but heat is still in this notebook 1 inside, and must drive cooling draught by this fan 6 could discharge heat.And the restricted in flow of cooling draught very easily is subjected to the influence of runner geometric shape in the assembly layout of this notebook 1 inside in flow process, and makes radiating effect not good.Therefore the assembly layout in notebook 1 inside must design at the gas flow effect, to avoid flow resistance too high or generation fluid boundary layer and heat conduction boundary layer, reduces the thermal convection effect.Because the arrangement of components of notebook inside is subject to the consideration of cooling draught circulation, can't freely change, and is difficult to the further downsizing of notebook.In addition, the use of fan also produces problems such as extra electrical source consumption and noise, makes that the design process of notebook is more complicated.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of radiating module, by directly with heat transferred to the notebook outside, do not need to be provided with again fan and carry out air cooling, simplify the design cycle of notebook.
For reaching above-mentioned purpose, a kind of radiating module that the present invention disclosed includes the housing of an electronic installation, and this enclosure interior has a thermal source; One heat-transfer device is arranged on this thermal source, so that this thermal source is carried out heat conduction; One sliding shoe, be arranged at one of this housing side, and form heat with this heat-transfer device and pass and to contact, the heat that this thermal source produced conducts to this sliding shoe via this heat-transfer device, this sliding shoe can expose to outside this housing with respect to this housing slip and part, the heat that this thermal source produced conducts to this sliding shoe via this heat-transfer device, and the heat that this thermal source produced conducts to this outside by this sliding shoe.
In addition, this heat-transfer device more includes one first cooling base, one second cooling base and one first heat pipe, is configured according to the position of this thermal source, to mate the relative position of this thermal source and this sliding shoe.Wherein, this first cooling base is arranged on this thermal source, this second cooling base is arranged at the inboard of one of this housing side, this first heat pipe in order to connect this first cooling base and this second cooling base so that can carry out heat interchange between this first cooling base and this second cooling base.This sliding shoe then forms the heat biography with this second cooling base and contacts, to dispel the heat.Certainly, for promoting the heat-conduction coefficient of this sliding shoe,, one second heat pipe also can be set be embedded among this sliding shoe, with so that heat is distributed in this sliding shoe fast and equably to promote radiating effect.
Adopt technique scheme, the present invention has such effect, this sliding shoe exposes to this notebook outside, directly the used heat that this central processing unit produced is overflow and be dissipated in the external air, thereby this notebook inside does not need to install additional fan so that this heat-transfer device is carried out air cooling again, can save the power consumption that this fan produces, can not need in this notebook design process yielding in the cooling draught flow effect, but design processes simplified and the elasticity when increasing assembly layout.
Description of drawings
Fig. 1 is the schematic perspective view of known techniques;
Fig. 2 is the diagrammatic cross-section of the present invention's first preferred embodiment;
Fig. 3 is the schematic perspective view of the present invention's second preferred embodiment;
Fig. 4 is another enforcement aspect of Fig. 3;
Fig. 5 is the partial sectional view of Fig. 4;
Fig. 6 is the exploded view of the local member of second preferred embodiment, and it is this sliding shoe and this second heat pipe;
Fig. 7 is the exploded view of the present invention's the 3rd preferred embodiment partial component, and it is this sliding shoe and these second heat pipes;
Fig. 8 is the diagrammatic cross-section of the present invention's the 4th preferred embodiment.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in further detail.
As shown in Figure 2, a kind of radiating module that it is provided by the present invention's first preferred embodiment, it includes the housing 10 of an electronic installation, and this electronic installation can be a notebook or desktop PC main frame; One thermal source 11 is positioned at this housing 10 inside, and this thermal source 11 can be a central processing unit, the contour electric power chip of graphic chips, also can be a high rotating speed hard disk; One heat-transfer device 12, it is a metal blocks, is arranged on this thermal source 11, in order to conduct the heat that this thermal source 11 is produced; One sliding shoe 13, be arranged at one of this housing 10 side, form heat with this heat-transfer device 12 and pass contact relation, this sliding shoe 13 can slide with respect to this housing 10, and part exposes to outside this housing 10, see through this heat-transfer device 12 with the heat that this thermal source 11 is produced and conduct to this sliding shoe 13, again by the directly externally heat radiation of this sliding shoe 13.Utilize this sliding shoe 13 directly and outside air carry out heat interchange, making these housing 10 inside not need to be provided with in addition fan drives inside and outside the cooling draught circulation again, the power consumption and the noise that produce by fan can be reduced, and the flow process of this electronic installation intraware topological design can be simplified.
As Fig. 3 and shown in Figure 4, a kind of radiating module that is disclosed by the present invention's second preferred embodiment, it is arranged at housing 100 inside of a notebook, use thermal source 110 to dispel the heat for this notebook inside, the heat that operation was produced is discharged this housing 100 outsides, this thermal source 110 can be central processor among this notebook, graphic chips or the contour electric power chip of logic chip group, also can be a high rotating speed hard disk.As shown in Figure 5, this radiating module includes a heat-transfer device 120 and a sliding shoe 130, and wherein this heat-transfer device 120 includes:
One first cooling base 121, it is a metal blocks, and one of this first cooling base 121 side forms one first thermal conductive surface 1211, and its inner formation one first plugs hole 1212.This first thermal conductive surface 1211 fits in this thermal source 110 surfaces, by heat conduction the heat that this thermal source 110 is produced is taken away, and can't operate to avoid this thermal source 110 to cause this notebook to crash because temperature is too high, even cause assembly to burn.
One second cooling base 122, it is a metal blocks, and this second cooling base 122 is arranged at the edge of these housing 100 inside, and one of this second cooling base 122 side forms one second thermal conductive surface 1221, and its inner formation 2 second plugs hole 1222.
2 first heat pipes 123, being inserted in this with its two end respectively respectively first plugs hole 1212 and should respectively second plug hole 1222, make two ends of this 2 first heat pipe 123 be embedded in this first cooling base 121 and this second cooling base 122 respectively, to connect this first cooling base 121 and this second cooling base 122, carry out heat interchange by this 2 first heat pipe 123 with two-phase flow, this first cooling base 121 by the heat that this thermal source 110 is absorbed, is passed to this second cooling base 122.Because this thermal source 110 is arranged at the optional position of these housing 100 inside, and make the required heat biography path prolongation of heat radiation and become more tortuous, present embodiment is by this first cooling base 121, this 2 first heat pipe 123 and this second cooling base 122, the heat that can prolong this heat-transfer device 120 passes the path, to cooperate the position at these thermal source 110 places.
As shown in Figure 6, this sliding shoe 130 is a long cuboid, and the one side has a cover plate 131, and one of this sliding shoe 130 side forms one the 3rd thermal conductive surface 132.
This housing 100 has a slotted eye 101 corresponding to one of this second cooling base 122 side, the cross section of this sliding shoe 123 of the outline of this slotted eye 101.This sliding shoe 130 is inserted in this slotted eye 101, be arranged at one of this housing 100 side with removable relation, and the cover plate 131 of this sliding shoe 130 is positioned at outside this housing 100, form limit effect, to avoid these sliding shoe 130 shift motions long and fall into this housing 100 inside, can when entering these housing 100 inside, these sliding shoe 130 complete slippages seal this slotted eye 101 simultaneously.This sliding shoe 130 is positioned at the part of these housing 100 inside, supports being affixed on second thermal conductive surface 1221 of this second cooling base 122 with the 3rd thermal conductive surface 132, passes contact by constituting heat, so that heat is conducted on this sliding shoe 130 by this second cooling base 123.
Form the state of sliding contact between this sliding shoe 130 and this second cooling base 122, this sliding shoe 130 can slide via relative this housing 100, and the some that makes this sliding shoe 130 exposes to outside this housing 100, the part that is positioned at these housing 100 inside then continues with the 3rd thermal conductive surface 132 these second thermal conductive surfaces 1221 of contact, makes that the maintaining heat biography contacts between this second cooling base 122 and this sliding shoe 130.
This sliding shoe 130 directly is exposed to outside this housing 100, directly carry out heat interchange with thermal convection, the heat that thermal source 110 is produced, be passed to this sliding shoe 130 via this first cooling base 120, this first heat pipe 123 and this second cooling base 122, by the directly externally heat radiation of this sliding shoe 130.
For improving the heat-conduction coefficient of this sliding shoe 130, to promote radiating effect, present embodiment is more buried one second heat pipe 140 underground in this sliding shoe 130.Wherein, be concaved with a groove 133 on the 3rd thermal conductive surface 132, this groove 133 presents the U font, extends to another side by one of this sliding shoe 130 side.This second heat pipe 140 is bent into the U type, is placed within this groove 133, so that this second heat pipe 140 is embedded among this sliding shoe 130, the heat that forms two-phase flow passes the path.By this second heat pipe 140 apace with spread heat in this sliding shoe 130, can effectively promote the heat-conduction coefficient of this sliding shoe 130, to promote radiating effect.
As shown in Figure 7, the radiating module that it is disclosed by the present invention's the 3rd preferred embodiment, it is roughly identical with second preferred embodiment, and its difference is that this sliding shoe 150 and the form of this second heat pipe 160 are different from this second preferred embodiment, wherein:
This sliding shoe 150 has a cover plate 151, and the one side forms on one the 3rd thermal conductive surface, 152, the three thermal conductive surfaces 152 and is concaved with two grooves 153, and wherein this two groove 153 is a linear pattern, extends to opposite side by one of this sliding shoe 150 side.
In present embodiment, the number of this second heat pipe 160 is two, should each second heat pipe 160 be straight tube-like, is placed in respectively among this two groove 153, in order to improve the overall thermal transmissibility factor of this sliding shoe 150.
As shown in Figure 8, be the radiating module that the present invention's the 4th preferred embodiment is provided, it includes: the housing 200 of an electronic installation; One thermal source 210 is provided with as for these housing 200 inside; One heat-transfer device 230 is in order to conduct the heat that this thermal source 210 is produced; And a sliding shoe 240, form heat with this heat-transfer device 230 and pass and contact, dispel the heat heat is conducted to these housing 200 outsides; Wherein:
This heat-transfer device 230 includes one first heat pipe 231 and a cooling base 232, and this cooling base 232 is a metal blocks, is arranged at the edge of these housing 200 inside; One of this first heat pipe 231 end supports and is affixed on this thermal source 210, and its other end is embedded in this cooling base 232, in order to connect this thermal source 210 and this cooling base 232.
This sliding shoe 240 is arranged at one of this housing 200 side, the one side is embedded with one second heat pipe 250, in order to promote heat-conduction coefficient, this sliding shoe 240 forms the heat biography with this cooling base 232 and contacts, and this sliding shoe 240 can slide relatively with respect to this housing 200, its some is exposed to outside this housing 200, in order to directly externally dispelling the heat, boundary outside the heat that this thermal source 210 is produced overflows and looses.
The design of current known notebook commonly used must add fan and suck cold air by the external world, after flowing through each heat abstractor and carrying out heat interchange, discharges the outside of this notebook at the air-flow that improves temperature with used heat.For making cooling draught have preferable advection heat to pass performance, the arrangement of components of the housing of notebook inside must be considered the problem of cooling draught circulation, to avoid flow resistance too high, or air-flow velocity crosses the low bigger thermal convection boundary layer of thickness that forms, and makes that the assembly layout of notebook inside is limited.
And the present invention directly is passed to the external world by this sliding shoe with heat, does not need to suck cold air via fan this heat-transfer device is carried out air cooling, can reduce that the required power consumption of fan being set, and removes the noise because of fan running produced.Therefore notebook can not be subjected to the restriction of cooling draught again at design and manufacture view, has bigger elasticity on the layout of each electronic package, does not need be subject to the cooling draught circulation path.In addition, the further compactification of the layout of this each electronic package is to dwindle the volume of notebook.
Claims (16)
1. radiating module, it includes thermal source, that a housing, is arranged at this enclosure interior and is arranged at heat-transfer device on this thermal source, it is characterized in that: described radiating module also includes a sliding shoe that can partly expose to respect to this housing slip outside this housing, it is arranged at one of this housing side, and forms heat with above-mentioned heat-transfer device and pass and to contact.
2. according to the described radiating module of claim 1, it is characterized in that: described heat-transfer device is a metal blocks.
3. according to the described radiating module of claim 1, it is characterized in that: described heat-transfer device includes a cooling base and a heat pipe, one of this heat pipe end is arranged on the above-mentioned thermal source, the other end of this heat pipe is connected in this cooling base, and this cooling base forms the heat biography with above-mentioned sliding shoe and contacts.
4. according to the described radiating module of claim 1, it is characterized in that: described heat-transfer device includes one first cooling base, one first heat pipe and one second cooling base, this first cooling base is arranged on the above-mentioned thermal source, this second cooling base forms the heat biography with above-mentioned sliding shoe and contacts, and this first heat pipe connects between this first cooling base and this second cooling base.
5. according to the described radiating module of claim 1, it is characterized in that: described sliding shoe inside is embedded with a heat pipe.
6. a radiating module includes a housing; One is arranged at the thermal source in this housing; One first cooling base, it is arranged on this thermal source; One second cooling base, it is arranged within this housing; One first heat pipe, it connects this first cooling base and this second cooling base; It is characterized in that: described radiating module also includes a sliding shoe that can partly expose to respect to this housing slip outside this housing, and it forms the heat biography with above-mentioned second cooling base and contacts.
7. according to the described radiating module of claim 6, it is characterized in that: form one first within described first cooling base and plug the hole, one of described first heat pipe end is inserted in this and first plugs among the hole.
8. according to the described radiating module of claim 6, it is characterized in that: form one second within described second cooling base and plug the hole, one of described first heat pipe end is inserted in this and second plugs among the hole.
9. according to the described radiating module of claim 6, it is characterized in that: one of described first cooling base side forms one first thermal conductive surface, and this first thermal conductive surface fits in the surface of this thermal source.
10. according to the described radiating module of claim 6, it is characterized in that: one of described second cooling base side forms one second thermal conductive surface, and one of described sliding shoe side forms one the 3rd thermal conductive surface, and this second thermal conductive surface and the 3rd thermal conductive surface are sliding contact.
11. according to the described radiating module of claim 6, it is characterized in that: described radiating module includes one second heat pipe, and it is embedded within the described sliding shoe.
12. according to the described radiating module of claim 11, it is characterized in that: be concaved with a groove on the described sliding shoe, described second heat pipe is placed in this groove.
13. according to the described radiating module of claim 12, it is characterized in that: described groove presents U type trend, and described second heat pipe also presents the U type, is placed among this groove.
14. according to the described radiating module of claim 12, it is characterized in that: described groove is a linear pattern, and one of described sliding shoe side extends to opposite side, and described second heat pipe is a straight tube-like, is placed among this groove.
15. according to the described radiating module of claim 6, it is characterized in that: one of described housing side has a slotted eye, the cross section of the described sliding shoe of the outline of this slotted eye, and this sliding shoe is inserted in this slotted eye.
16. according to the described radiating module of claim 6, it is characterized in that: described sliding shoe is a long rectangle, and the one side has a cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510120917 CN1987727A (en) | 2005-12-22 | 2005-12-22 | Heat radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510120917 CN1987727A (en) | 2005-12-22 | 2005-12-22 | Heat radiation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1987727A true CN1987727A (en) | 2007-06-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510120917 Pending CN1987727A (en) | 2005-12-22 | 2005-12-22 | Heat radiation module |
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| Country | Link |
|---|---|
| CN (1) | CN1987727A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101668403B (en) * | 2008-09-05 | 2011-09-28 | 英业达股份有限公司 | Electronic device and radiator thereof |
| CN104918457A (en) * | 2014-03-14 | 2015-09-16 | 欧姆龙株式会社 | Electronic equipment |
| WO2019112573A1 (en) * | 2017-12-06 | 2019-06-13 | Hewlett-Packard Development Company, L.P. | Electronic devices with movable air flow devices |
| CN110296628A (en) * | 2018-03-22 | 2019-10-01 | 广达电脑股份有限公司 | Heat exchange structure and the heat transfer system with heat exchange structure |
| WO2021129692A1 (en) * | 2019-12-27 | 2021-07-01 | Intel Corporation | Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices |
-
2005
- 2005-12-22 CN CN 200510120917 patent/CN1987727A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101668403B (en) * | 2008-09-05 | 2011-09-28 | 英业达股份有限公司 | Electronic device and radiator thereof |
| CN104918457A (en) * | 2014-03-14 | 2015-09-16 | 欧姆龙株式会社 | Electronic equipment |
| WO2019112573A1 (en) * | 2017-12-06 | 2019-06-13 | Hewlett-Packard Development Company, L.P. | Electronic devices with movable air flow devices |
| US11249524B2 (en) | 2017-12-06 | 2022-02-15 | Hewlett-Packard Development Company, L.P. | Electronic devices with movable air flow devices |
| CN110296628A (en) * | 2018-03-22 | 2019-10-01 | 广达电脑股份有限公司 | Heat exchange structure and the heat transfer system with heat exchange structure |
| CN110296628B (en) * | 2018-03-22 | 2021-04-06 | 广达电脑股份有限公司 | Heat exchange structure and heat transfer system with same |
| WO2021129692A1 (en) * | 2019-12-27 | 2021-07-01 | Intel Corporation | Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices |
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