JP2001274579A - Panel and communication system using it - Google Patents

Panel and communication system using it

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Publication number
JP2001274579A
JP2001274579A JP2000083175A JP2000083175A JP2001274579A JP 2001274579 A JP2001274579 A JP 2001274579A JP 2000083175 A JP2000083175 A JP 2000083175A JP 2000083175 A JP2000083175 A JP 2000083175A JP 2001274579 A JP2001274579 A JP 2001274579A
Authority
JP
Japan
Prior art keywords
cover
heat
electric
printed board
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000083175A
Other languages
Japanese (ja)
Inventor
Kazuhisa Yoshizawa
一寿 吉沢
Kazuhisa Ono
一寿 尾野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
NEC Network Products Ltd
Original Assignee
NEC Corp
NEC Network Products Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, NEC Network Products Ltd filed Critical NEC Corp
Priority to JP2000083175A priority Critical patent/JP2001274579A/en
Publication of JP2001274579A publication Critical patent/JP2001274579A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To solve the problem of mounting of a strong fan for heat radiation in a conventional system having a panel only causes failure such as corrosion with an electric/electronic part 13 and results in less reliability. SOLUTION: The heat generated at the electric/electronic part 13 on a printed board 11 is transferred to a heat conductive member 15 fully filled in a closed space 14, and then it is transferred to a cover 12 drawn from a thin metal plate material for heat dispersion. The surface of the cover 12 is corrugated for larger surface area, resulting in enlarged heat-radiation area for efficient heat radiation. Further, the cover 12 has a corrugated heat-radiation surface which is drawn from a thin metal plate material, so that electric/electronic part 13 is protected from corrosive causes (corrosive gas, dust, condensation and the like) in an installation environment.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はパネル及びこれを用
いた通信装置に係り、特に装置を構成する電子回路をプ
リント板に搭載したパネル及びこれを用いた通信装置に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel and a communication device using the same, and more particularly to a panel in which an electronic circuit constituting the device is mounted on a printed board and a communication device using the same.

【0002】[0002]

【従来の技術】図7は従来のパネルの一例の全体斜視
図、図8は従来のパネルの実装状態の一例の斜視図を示
す。図7に示すように、従来のパネル1は、プリント板
2に電気機能を発揮するための複数の電気・電子部品3
が搭載されている。これら複数の電気・電子部品3によ
り所定の電子回路を構成している。
2. Description of the Related Art FIG. 7 is an overall perspective view of an example of a conventional panel, and FIG. 8 is a perspective view of an example of a mounted state of the conventional panel. As shown in FIG. 7, a conventional panel 1 includes a plurality of electric / electronic components 3 for exerting an electric function on a printed board 2.
Is installed. A predetermined electronic circuit is configured by the plurality of electric / electronic components 3.

【0003】この構成のパネル1は、図8に示すよう
に、ガイドレールに沿って複数のパネルが順次SHF4
内に収容されるが、隣り合うパネル1の間の間隔が極め
て狭い高密度実装であるために、プリント板2に搭載さ
れた電気・電子部品3の熱を如何に放熱させるかが、装
置信頼度を向上させるポイントである。また、装置設置
環境における信頼度低下要因を如何に排除するかも重要
なポイントである。
[0003] As shown in FIG. 8, a panel 1 having this configuration is composed of a plurality of panels sequentially arranged along a guide rail.
Since the space between the adjacent panels 1 is very small, and the high-density mounting is performed, how to dissipate the heat of the electric / electronic components 3 mounted on the printed board 2 depends on the device reliability. It is a point to improve the degree. It is also an important point how to eliminate the reliability reduction factor in the apparatus installation environment.

【0004】しかし、従来のパネル1は、プリント板2
上に電気・電子部品3を搭載するだけであるがために、
電機・電子部品3の放熱に関しては部品の大きさでしか
放熱面積がなく、ファンを搭載することにより、放熱対
策を施している。
However, the conventional panel 1 has a printed board 2
Because it only mounts electric and electronic parts 3 on top,
Regarding the heat radiation of the electric / electronic parts 3, there is a heat radiation area only by the size of the parts, and a heat radiation measure is taken by mounting a fan.

【0005】[0005]

【発明が解決しようとする課題】しかるに、上記の従来
のパネルを搭載した装置では、放熱のために強力なファ
ンを搭載することにより、装置設置環境における悪影響
因子(腐食ガス、塵埃、結露等)もより強力に装置内に
吸気してしまい、電気・電子部品3に悪影響(腐食の発
生による障害等)を与え、信頼性の低下を招くという問
題がある。
However, in a device equipped with the above-mentioned conventional panel, a powerful fan for heat dissipation is mounted, so that adverse effects in the device installation environment (corrosion gas, dust, dew condensation, etc.). However, there is a problem that the air is more strongly sucked into the device, adversely affecting the electric / electronic component 3 (eg, failure due to the occurrence of corrosion), and lowering the reliability.

【0006】本発明は以上の点に鑑みなされたもので、
十分な放熱を行い得るパネル及びこれを用いた通信装置
を提供することを目的とする。
[0006] The present invention has been made in view of the above points,
It is an object of the present invention to provide a panel capable of sufficiently dissipating heat and a communication device using the panel.

【0007】また、本発明の他の目的は、搭載された装
置の信頼性を向上し得るパネル及びこれを用いた通信装
置を提供することにある。
Another object of the present invention is to provide a panel capable of improving the reliability of a mounted device and a communication device using the same.

【0008】[0008]

【課題を解決するための手段】上記の目的を達成するた
め、本発明のパネルは、電気・電子部品を搭載している
プリント板と、少なくとも波形の断面形状を一部に有
し、プリント板上の電気・電子部品を覆う薄板金材料製
のカバーと、プリント板とカバーの間の閉空間に隙間な
く充填された熱伝導部材とからなる構成である。
In order to achieve the above object, a panel according to the present invention has a printed board on which electric and electronic components are mounted, and a printed board having at least a part of a corrugated cross section. It is composed of a cover made of a sheet metal material for covering the above electric and electronic components, and a heat conducting member that fills a closed space between the printed board and the cover without any gap.

【0009】この発明では、プリント板とカバーの間の
閉空間に隙間なく熱伝導部材を充填し、更に、カバーの
断面形状を少なくとも一部を波形形状としたため、プリ
ント板に搭載された電気・電子部品で発生した熱を、熱
伝導部材を通して表面積が大とされているカバーに伝達
させることができる。
According to the present invention, the closed space between the printed board and the cover is filled with the heat conductive member without any gap, and at least a part of the cross section of the cover has a corrugated shape. The heat generated in the electronic component can be transmitted to the cover having a large surface area through the heat conducting member.

【0010】また、上記の目的を達成するため、本発明
の通信装置は、ダイカスト成形(又は一部プラスチック
成形品)された下部ケースと、上部ケースとを上下に付
き合わせることにより形成される筐体内の閉空間に電気
・電子部品を搭載したパネルを少なくとも収容した通信
装置であって、電気・電子部品を搭載している第1のプ
リント板と、第1のプリント板上の電気・電子部品を覆
い、かつ、表面が下部ケースの内面に密着固定された薄
板金材料製の第1のカバーと、第1のプリント板と第1
のカバーの間の閉空間に隙間なく充填された第1の熱伝
導部材とからなる第1のパネルと、電気・電子部品を搭
載している第2のプリント板と、少なくとも波形の断面
形状を一部に有し、第2のプリント板上の電気・電子部
品を覆う薄板金材料製の第2のカバーと、第2のプリン
ト板と第2のカバーの間の閉空間に隙間なく充填された
第2の熱伝導部材とからなる第2のパネルと、第1及び
第2のパネルを、第1及び第2のプリント板を離間対向
させて配置するスペーサと、第2のカバーの表面と上部
ケースの内面とを結合する柔軟性のあるシート状の第3
の熱伝導部材とを筐体内の閉空間に収容する構成とした
ものである。
In order to achieve the above object, a communication device according to the present invention provides a housing formed by vertically joining a lower case formed by die-casting (or a partially molded plastic product) and an upper case. What is claimed is: 1. A communication device including at least a panel on which electric and electronic components are mounted in a closed space in a body, comprising: a first printed board on which electric and electronic components are mounted; and an electric and electronic component on the first printed board. A first cover made of a sheet metal material, the first cover being made of a sheet metal material and having a surface tightly fixed to an inner surface of the lower case;
A first panel made of a first heat conductive member filled in a closed space between the covers without a gap, a second printed board on which electric and electronic components are mounted, and at least a corrugated cross-sectional shape. A second cover made of a sheet metal material, which is partially provided and covers the electric and electronic components on the second printed board; and a closed space between the second printed board and the second cover is filled without gaps. A second panel made of a second heat conductive member, a spacer for arranging the first and second panels with the first and second printed boards spaced apart from each other, and a surface of the second cover. A flexible sheet-like third member that connects to the inner surface of the upper case
And a heat conductive member are accommodated in a closed space in the housing.

【0011】この発明では、第1のプリント板に搭載さ
れている電気・電子部品で発生した熱を、第1の熱伝導
部材及び第1のカバーを通して、第1のカバーに密着し
ている下部ケースに伝導させることができる。また、第
2のプリント板に搭載されている電気・電子部品で発生
した熱を、第2の熱伝導部材、第2のカバー、第3の熱
伝導部材を通して、上部ケースに伝導させるが、第2の
熱伝導部材、第2のカバー、第3の熱伝導部材及び上部
ケースにより放熱面積の拡大及び熱輸送の効率化を図る
ことができる。
According to the present invention, the heat generated by the electric / electronic parts mounted on the first printed board is transferred to the lower part which is in close contact with the first cover through the first heat conducting member and the first cover. It can be conducted to the case. Further, heat generated in the electric / electronic component mounted on the second printed board is conducted to the upper case through the second heat conductive member, the second cover, and the third heat conductive member. The second heat conductive member, the second cover, the third heat conductive member, and the upper case can increase the heat radiation area and increase the efficiency of heat transport.

【0012】[0012]

【発明の実施の形態】次に、本発明の実施の形態につい
て図面と共に説明する。図1は本発明になるパネルの一
実施の形態の全体斜視図、図2は本発明になるパネルの
一実施の形態の分解斜視図、図3は本発明になるパネル
の図1のA−A線に沿う断面図を示す。各図中、同一構
成部分には同一符号を付してある。
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an overall perspective view of one embodiment of a panel according to the present invention, FIG. 2 is an exploded perspective view of one embodiment of a panel according to the present invention, and FIG. FIG. 2 shows a cross-sectional view along the line A. In each figure, the same components are denoted by the same reference numerals.

【0013】各図に示すように、本実施の形態のパネル
10は、複数の電気・電子部品13を搭載しているプリ
ント板11と、このプリント板11上の電気・電子部品
13を覆う、熱伝導の薄板金材料(例えば、アルミニウ
ム、銅等)を絞り成形し、かつ、波形の断面形状を有す
るカバー12と、プリント板11とカバー12の間の閉
空間14に隙間なく充填された熱伝導部材15とからな
る。
As shown in each of the drawings, a panel 10 of the present embodiment includes a printed board 11 on which a plurality of electric / electronic parts 13 are mounted, and covers the electric / electronic parts 13 on the printed board 11. A cover 12 having a corrugated cross-sectional shape formed by drawing a heat conductive sheet metal material (for example, aluminum, copper, or the like) and a closed space 14 between the printed board 11 and the cover 12 filled with heat without gaps. And a conductive member 15.

【0014】熱伝導部材15は、例えば、加熱硬化型の
シリコーンゴムなどからなり、プリント板11上に搭載
された電気・電子部品13から発生した熱を効率良くカ
バー12に伝達させるために設けられている。カバー1
2は、断面が波形の放熱面を有している。
The heat conducting member 15 is made of, for example, a heat-curable silicone rubber or the like, and is provided for efficiently transmitting the heat generated from the electric / electronic parts 13 mounted on the printed board 11 to the cover 12. ing. Cover 1
2 has a heat-radiating surface having a corrugated cross section.

【0015】次に、本実施の形態の実装時の動作につい
て説明する。このパネル10は、従来と同様に、図4に
示すように、ガイドレールに案内されて複数枚が順次S
HF16内に、隣り合うパネル10の間の間隔が極めて
狭い高密度に実装される。この実装状態で、プリント板
11上の電気・電子部品13より発生した熱が、閉空間
14に隙間なく充填されている熱伝導部材15に伝わ
り、その後、薄板金材料で絞り成形されたカバー12に
伝わって放熱される。
Next, a description will be given of an operation at the time of mounting the present embodiment. As shown in FIG. 4, a plurality of panels 10 are successively guided by guide rails, and
In the HF 16, the space between the adjacent panels 10 is extremely small and is mounted at a high density. In this mounting state, the heat generated from the electric / electronic components 13 on the printed board 11 is transmitted to the heat conducting member 15 filling the closed space 14 without any gap, and thereafter, the cover 12 drawn by a sheet metal material is drawn. Is dissipated and dissipated.

【0016】ここで、カバー12の表面は、波形断面形
状を有しており、表面積が大きく成形されているので、
放熱面積が拡大され、効率良く放熱される。また、カバ
ー12は、薄板金材料で絞り成形された波形の放熱面を
有しているので、電気・電子部品13を、設置環境の腐
食要因(腐食ガス、塵埃、結露等)より保護することが
できる。
Here, the surface of the cover 12 has a corrugated cross-sectional shape and is formed with a large surface area.
The heat radiation area is enlarged, and heat is efficiently radiated. Further, since the cover 12 has a corrugated heat dissipation surface drawn and formed of a sheet metal material, the cover 12 protects the electric and electronic components 13 from corrosive factors (corrosion gas, dust, dew condensation, etc.) in the installation environment. Can be.

【0017】このように、本実施の形態によれば、プリ
ント板11上に搭載された電気・電子部品13で発生し
た熱は、閉空間14に充填された熱伝導部材15を効率
良くカバー12へ伝導し、更にカバー12の波形により
大面積とされた放熱面から放熱されるため、放熱性を向
上することができる。
As described above, according to the present embodiment, the heat generated by the electric / electronic component 13 mounted on the printed board 11 efficiently transfers the heat conductive member 15 filled in the closed space 14 to the cover 12. And the heat is radiated from the heat radiating surface having a large area by the waveform of the cover 12, so that the heat radiating property can be improved.

【0018】また、本実施の形態によれば、プリント板
11上に搭載された電気・電子部品13がカバー12に
より覆われているため、電気・電子部品13を、設置環
境の腐食要因(腐食ガス、塵埃、結露等)より保護する
ことができ、このことから装置信頼性を向上できる。
Further, according to the present embodiment, since the electric / electronic component 13 mounted on the printed board 11 is covered by the cover 12, the electric / electronic component 13 is exposed to the corrosion factor (corrosion) of the installation environment. Gas, dust, dew condensation, etc.), thereby improving the reliability of the apparatus.

【0019】次に、本発明になる通信装置の一実施の形
態について説明する。図5は本発明になる通信装置の一
実施の形態の斜視図、図6は図5のA'−A'線に沿う断
面図を示す。両図中、同一構成部分には同一符号を付し
てある。両図に示すように、本実施の形態の通信装置で
ある屋外型通信基地局20は、ダイカスト成形(又は一
部プラスチック成形品)の下部ケース21aと、ダイカ
スト成形(又は一部プラスチック成形品)の上部ケース
21bとを上下に付き合わせることにより形成される筐
体22内の閉空間に収納された、電気・電子部品13
a、13bが搭載された2枚のパネルと、プリント板2
4と、熱伝導部材26などからなる。
Next, an embodiment of the communication apparatus according to the present invention will be described. FIG. 5 is a perspective view of an embodiment of the communication device according to the present invention, and FIG. 6 is a sectional view taken along line A'-A 'of FIG. In both figures, the same components are denoted by the same reference numerals. As shown in both figures, the outdoor communication base station 20 which is the communication device of the present embodiment includes a lower case 21a formed by die-casting (or a partly molded plastic part) and a die-casting molded part (or partially molded plastic part). The electric / electronic component 13 housed in a closed space in a housing 22 formed by vertically attaching the upper case 21b to the upper case 21b.
a and 13b, and two printed boards
4 and a heat conducting member 26 and the like.

【0020】下部ケース21aには、図6の断面図に示
すように、複数の電気・電子部品13aを搭載している
プリント板11aと、このプリント板11a上の電気・
電子部品13aを覆う、熱伝導の薄板金材料を絞り成形
したカバー12aと、プリント板11aとカバー12a
の間の閉空間に隙間なく充填された熱伝導部材15aと
からなる第1のパネルと、複数の電気・電子部品13b
を搭載しているプリント板11bと、このプリント板1
1b上の電気・電子部品13bを覆う、熱伝導の薄板金
材料を絞り成形し、かつ、波形の断面形状を有するカバ
ー12bと、プリント板11bとカバー12bの間の閉
空間に隙間なく充填された熱伝導部材15bとからなる
第2のパネルとが、互いにプリント板11aと11bと
を相対向させてスペーサ23で離間配置されている。
As shown in the cross-sectional view of FIG. 6, the lower case 21a has a printed board 11a on which a plurality of electric and electronic components 13a are mounted, and an electric and electronic component on the printed board 11a.
A cover 12a formed by drawing a heat conductive sheet metal material and covering the electronic component 13a, a printed board 11a and a cover 12a.
And a plurality of electric and electronic components 13b, each of which includes a heat conductive member 15a filled in a closed space without gaps therebetween.
Printed board 11b on which
A cover 12b having a corrugated cross-sectional shape and a closed space between the printed board 11b and the cover 12b are filled without gaps by drawing and forming a heat conductive sheet metal material that covers the electric / electronic component 13b on the base 1b. The second panel made of the heat conducting member 15b is spaced apart from the printed boards 11a and 11b by a spacer 23 with the printed boards 11a and 11b facing each other.

【0021】すなわち、上記の第2のパネルは前述した
本発明のパネルの一実施の形態の構造とされており、上
記の第1のパネルは、カバー12aの断面形状が波形で
はないが、それ以外は前述した本発明のパネルの構造と
同様とされている。また、第1のパネルのカバー12a
の平坦な表面は下ケース21aの内部下面に密着固定さ
れている。
That is, the second panel has the structure of the above-described embodiment of the panel of the present invention, and the first panel has a cover 12a whose cross section is not corrugated. Except for this, the structure of the panel according to the present invention is the same as that described above. Also, the cover 12a of the first panel
Is fixed to the inner lower surface of the lower case 21a.

【0022】一方、上部ケース21bの内部には、上部
ケース21bに一端が固定されたスペーサ25上にプリ
ント板24が設けられており、また、波形の断面形状の
カバー12b上に密着し、かつ、上部ケース21bの内
面に密着固定されており、カバー12bより上部ケース
21bへ熱を伝導するための、柔軟性のあるシート状の
熱伝導部材26が設けられている。熱伝導部材26は、
熱伝導部材15a及び15bとして用いられる加熱硬化
型のシリコーンゴムとは異なる、例えば市販品のグラフ
ァイトシートが用いられる。
On the other hand, inside the upper case 21b, a printed board 24 is provided on a spacer 25 having one end fixed to the upper case 21b, and is in close contact with the cover 12b having a corrugated cross section, and , A flexible sheet-like heat conducting member 26 for conducting heat from the cover 12b to the upper case 21b is provided in close contact with the inner surface of the upper case 21b. The heat conducting member 26 is
For example, a commercially available graphite sheet different from the heat-curable silicone rubber used as the heat conducting members 15a and 15b is used.

【0023】なお、カバー12bと熱伝導部材26との
固定方法は、粘着剤による固定のほか、カバー12bの
波形の形状に合わせた押え金具により挟み込んでもよ
い。また、下部ケース21aと上部ケース21bは、突
起が一定間隔で設けられ、放熱性を高める構造とされて
いる。
The method of fixing the cover 12b and the heat conducting member 26 may be, instead of fixing with an adhesive, sandwiching the cover 12b with a press fitting adapted to the corrugated shape of the cover 12b. Further, the lower case 21a and the upper case 21b have a structure in which projections are provided at regular intervals to enhance heat dissipation.

【0024】この屋外型通信基地局20では、電気・電
子部品13aで発生した熱は、熱伝導部材15aを伝播
してカバー12aから下部ケース21aに伝導される
が、カバー12aと下部ケース21aとが密着してお
り、また、下部ケース12aは突起が形成されて表面積
が大きく形成されているため、効率良く下部ケース21
aから空気中に放熱される。
In this outdoor communication base station 20, heat generated in the electric / electronic component 13a propagates through the heat conducting member 15a and is conducted from the cover 12a to the lower case 21a. And the lower case 12a is formed with projections and has a large surface area.
a is radiated into the air.

【0025】一方、電気・電子部品13bで発生した熱
は、熱伝導部材15bを伝播してカバー12bへ熱伝導
され、更に熱伝導部材26から上部ケース21bへ熱伝
導される。ここで、放熱は、放熱面積に大きく依存する
ため、カバー12bは断面形状が一部波形に形成されて
おり、また、熱伝導部材26がカバー12bの波形によ
り大きく成形された表面に密着しており、更に、上部ケ
ース12bは突起が形成されて表面積が大きく形成され
ており、放熱面積の拡大及び熱輸送の効率化を図ってい
るので、中央に位置するプリント板11bに搭載された
電気・電子部品13bの発熱は、カバー12bと熱伝導
部材26とにより十分に空気中に放熱することができ
る。
On the other hand, the heat generated in the electric / electronic component 13b propagates through the heat conducting member 15b and is conducted to the cover 12b, and further from the heat conducting member 26 to the upper case 21b. Here, since the heat radiation largely depends on the heat radiation area, the cross-sectional shape of the cover 12b is partially formed in a waveform, and the heat conductive member 26 is in close contact with the surface of the cover 12b which is largely formed by the waveform. In addition, the upper case 12b is formed with projections to form a large surface area, thereby increasing the heat radiation area and increasing the efficiency of heat transport. The heat generated by the electronic component 13b can be sufficiently radiated into the air by the cover 12b and the heat conducting member 26.

【0026】このように、この実施の形態の屋外型通信
基地局20では、複数の電気・電子部品13a及び13
bがプリント板11a及び11bに搭載されているパネ
ルが多数、筐体22内に収納されていても、中央に位置
する電気・電子部品13bの発熱についても十分な放熱
ができるので、小型化ができるばかりでなく、装置信頼
性を向上できる。
As described above, in the outdoor communication base station 20 of this embodiment, the plurality of electric / electronic components 13a and 13
Although a large number of panels b are mounted on the printed boards 11a and 11b and are housed in the housing 22, sufficient heat can be released from the heat of the electric / electronic component 13b located at the center, so that downsizing can be achieved. Not only is it possible to improve the reliability of the device.

【0027】なお、本発明は上記の実施の形態に限定さ
れるものではなく、例えば、カバー12、12a、12
bは、鋳造にて形成してもよい。その場合は、アルミニ
ウムやマグネシウムなどの金属材料を使用し、かつ、厚
さを極力薄く成形する必要がある。また、プリント板1
1の両面に波形の放熱面を有するカバー12で覆っても
よく、更に、閉空間14の密閉度を高めるために、波形
の放熱面を有するカバー12の開口部全周にパッキンを
装着してもよい。
Note that the present invention is not limited to the above-described embodiment, and for example, covers 12, 12a, 12
b may be formed by casting. In that case, it is necessary to use a metal material such as aluminum or magnesium and to form the thickness as thin as possible. In addition, printed board 1
1 may be covered with a cover 12 having a corrugated heat radiating surface on both sides. Further, in order to increase the degree of sealing of the closed space 14, a packing is attached to the entire periphery of the opening of the cover 12 having a corrugated heat radiating surface. Is also good.

【0028】[0028]

【発明の効果】以上説明したように、本発明のパネルに
よれば、プリント板とカバーの間の閉空間に隙間なく熱
伝導部材を充填し、更に、カバーの断面形状を少なくと
も一部を波形形状とすることにより、プリント板に搭載
された電気・電子部品で発生した熱を、熱伝導部材を通
して表面積が大とされているカバーに伝達させるように
したため、効率良く放熱することができる。また、本発
明のパネルによれば、電気・電子部品をカバーで覆うよ
うにしているため、電気・電子部品を設置環境の腐食要
因(腐食ガス、塵埃、結露等)から保護することができ
る。
As described above, according to the panel of the present invention, the closed space between the printed board and the cover is filled with the heat conductive member without any gap, and at least a part of the cross-sectional shape of the cover is corrugated. By adopting the shape, the heat generated in the electric / electronic parts mounted on the printed board is transmitted to the cover having a large surface area through the heat conducting member, so that the heat can be efficiently radiated. Further, according to the panel of the present invention, since the electric and electronic parts are covered with the cover, the electric and electronic parts can be protected from corrosive factors (corrosion gas, dust, dew, etc.) in the installation environment.

【0029】また、本発明の通信装置によれば、第1の
プリント板に搭載されている電気・電子部品で発生した
熱は、効率良く下部ケースに伝導させることができ、一
方、第2のプリント板に搭載されている電気・電子部品
で発生した熱は、放熱面積の拡大及び熱輸送の効率化を
図った第2の熱伝導部材、第2のカバー、第3の熱伝導
部材を通して、上部ケースに伝導させることができるた
め、いずれの熱も十分に空気中に放熱でき、放熱性を向
上できる。
Further, according to the communication device of the present invention, the heat generated by the electric and electronic components mounted on the first printed board can be efficiently conducted to the lower case, while the second The heat generated by the electric / electronic components mounted on the printed board passes through the second heat conducting member, the second cover, and the third heat conducting member, which aim to increase the heat radiation area and increase the efficiency of heat transport. Since the heat can be conducted to the upper case, any heat can be sufficiently dissipated into the air, and the heat dissipation can be improved.

【0030】また、本発明によれば、第1及び第2のプ
リント板にそれぞれ搭載されている電気・電子部品を、
第1及び第2のカバーでそれぞれ覆うことにより、電気
・電子部品を設置環境の腐食要因(腐食ガス、塵埃、結
露等)から保護するようにしたため、設置環境の腐食要
因を防止することによる通信装置の信頼性を向上するこ
とができる。
Further, according to the present invention, the electric and electronic components mounted on the first and second printed boards, respectively,
The electric and electronic components are protected from corrosion factors (corrosion gas, dust, dew condensation, etc.) in the installation environment by being covered with the first and second covers, respectively, so that communication by preventing the corrosion factors in the installation environment is performed. The reliability of the device can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明になるパネルの一実施の形態の全体斜視
図である。
FIG. 1 is an overall perspective view of an embodiment of a panel according to the present invention.

【図2】本発明になるパネルの一実施の形態の分解斜視
図である。
FIG. 2 is an exploded perspective view of one embodiment of the panel according to the present invention.

【図3】図1のA−A線に沿う断面図である。FIG. 3 is a sectional view taken along line AA of FIG. 1;

【図4】本発明になるパネルの実装状態を示す斜視図で
ある。
FIG. 4 is a perspective view showing a mounted state of the panel according to the present invention.

【図5】本発明になる通信装置の一実施の形態の斜視図
である。
FIG. 5 is a perspective view of one embodiment of a communication device according to the present invention.

【図6】図5のA'−A'線に沿う断面図である。FIG. 6 is a sectional view taken along the line A′-A ′ of FIG. 5;

【図7】従来のパネルの一例の全体斜視図である。FIG. 7 is an overall perspective view of an example of a conventional panel.

【図8】従来のパネルの実装状態を示す斜視図である。FIG. 8 is a perspective view showing a mounting state of a conventional panel.

【符号の説明】 10 パネル 11、11a、11b、24 プリント板 12、12a、12b カバー 13、13a、13b 電気・電子部品 14 閉空間 15、15a、15b、26 熱伝導部材 20 屋外型通信基地局 21a 下部ケース 21b 上部ケース 22 筐体 23、25 スペーサDESCRIPTION OF SYMBOLS 10 Panel 11, 11a, 11b, 24 Printed board 12, 12a, 12b Cover 13, 13a, 13b Electric / electronic component 14 Closed space 15, 15a, 15b, 26 Heat conductive member 20 Outdoor communication base station 21a Lower case 21b Upper case 22 Housing 23, 25 Spacer

───────────────────────────────────────────────────── フロントページの続き (72)発明者 尾野 一寿 神奈川県大和市上草柳350番地 日本電気 無線電子株式会社内 Fターム(参考) 5E322 AA01 AA03 AB06 AB11 FA05 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kazutoshi Ono 350 Kamikusayanagi, Yamato-shi, Kanagawa F-term in NEC Wireless Electronics Co., Ltd. (reference) 5E322 AA01 AA03 AB06 AB11 FA05

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 電気・電子部品を搭載しているプリント
板と、 少なくとも波形の断面形状を一部に有し、前記プリント
板上の前記電気・電子部品を覆う薄板金材料製のカバー
と、 前記プリント板と前記カバーの間の閉空間に隙間なく充
填された熱伝導部材とからなることを特徴とするパネ
ル。
1. A printed board on which electric / electronic components are mounted, a cover made of a sheet metal material having at least a part of a corrugated cross-sectional shape and covering the electric / electronic components on the printed board, A panel comprising a heat conducting member that fills a closed space between the printed board and the cover without any gap.
【請求項2】 前記カバーは、絞り成形又は鋳造成形さ
れていることを特徴とする請求項1記載のパネル。
2. The panel according to claim 1, wherein the cover is formed by drawing or casting.
【請求項3】 前記熱伝導部材は、加熱硬化型のシリコ
ーンゴムにより構成されていることを特徴とする請求項
1又は2記載のパネル。
3. The panel according to claim 1, wherein the heat conductive member is made of heat-curable silicone rubber.
【請求項4】 ダイカスト成形(又は一部プラスチック
成形品)された下部ケースと、上部ケースとを上下に付
き合わせることにより形成される筐体内の閉空間に電気
・電子部品を搭載したパネルを少なくとも収容した通信
装置であって、 電気・電子部品を搭載している第1のプリント板と、前
記第1のプリント板上の前記電気・電子部品を覆い、か
つ、表面が前記下部ケースの内面に密着固定された薄板
金材料製の第1のカバーと、前記第1のプリント板と前
記第1のカバーの間の閉空間に隙間なく充填された第1
の熱伝導部材とからなる第1のパネルと、 電気・電子部品を搭載している第2のプリント板と、少
なくとも波形の断面形状を一部に有し、前記第2のプリ
ント板上の前記電気・電子部品を覆う薄板金材料製の第
2のカバーと、前記第2のプリント板と前記第2のカバ
ーの間の閉空間に隙間なく充填された第2の熱伝導部材
とからなる第2のパネルと、 前記第1及び第2のパネルを、第1及び第2のプリント
板を離間対向させて配置するスペーサと、 前記第2のカバーの表面と前記上部ケースの内面とを結
合する柔軟性のあるシート状の第3の熱伝導部材とを前
記筐体内の閉空間に収容することを特徴とする通信装
置。
4. A panel in which electric and electronic components are mounted at least in a closed space in a housing formed by vertically joining a lower case formed by die-casting (or a partly molded plastic product) and an upper case. A communication device accommodated therein, wherein the first printed board on which electric / electronic parts are mounted, and the electric / electronic parts on the first printed board are covered, and a surface is provided on an inner surface of the lower case. A first cover made of a sheet metal material fixedly adhered to the first cover, and a first space filled in a closed space between the first printed board and the first cover without any gap.
A first panel made of a heat conductive member, a second printed board on which electric and electronic components are mounted, and a portion having at least a corrugated cross-sectional shape, and the second printed board on the second printed board. A second cover made of a sheet metal material for covering electric and electronic components, and a second heat conductive member filled in a closed space between the second printed board and the second cover without any gap. A second panel, a spacer for arranging the first and second panels with the first and second printed boards spaced apart and facing each other, and joining a surface of the second cover and an inner surface of the upper case. A communication device, wherein a flexible sheet-shaped third heat conductive member is accommodated in a closed space in the housing.
【請求項5】 前記カバーは、絞り成形又は鋳造成形さ
れていることを特徴とする請求項4記載の通信装置。
5. The communication device according to claim 4, wherein the cover is formed by drawing or casting.
【請求項6】 前記熱伝導部材は、加熱硬化型のシリコ
ーンゴムにより構成されていることを特徴とする請求項
4又は5記載の通信装置。
6. The communication device according to claim 4, wherein the heat conductive member is made of a heat-curable silicone rubber.
JP2000083175A 2000-03-24 2000-03-24 Panel and communication system using it Pending JP2001274579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000083175A JP2001274579A (en) 2000-03-24 2000-03-24 Panel and communication system using it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000083175A JP2001274579A (en) 2000-03-24 2000-03-24 Panel and communication system using it

Publications (1)

Publication Number Publication Date
JP2001274579A true JP2001274579A (en) 2001-10-05

Family

ID=18599859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000083175A Pending JP2001274579A (en) 2000-03-24 2000-03-24 Panel and communication system using it

Country Status (1)

Country Link
JP (1) JP2001274579A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011243554A (en) * 2010-02-10 2011-12-01 Kaneka Corp Electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011243554A (en) * 2010-02-10 2011-12-01 Kaneka Corp Electronic equipment

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