JP2005286086A - Electronic apparatus and method for mounting same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus, such as a communication apparatus usable outside a small-scale base station for a portable phone system, wherein ambient temperature surrounding electronic devices is maintained to an operation-assured level, and to provide a method for mounting the electronic apparatus. <P>SOLUTION: The electric component 10 comprises an I/F box 7 attached approximately vertically to a fixing member 18 such as a pole; a plurality of units 3 detachably attached approximately vertically to the front face of the I/F box 7 with the units 3 separated from each other; a fan 9 arranged above the units 3; and a cover 11 covering the I/F box 7, the units 3, and the fan 9. Inside a close case 2 for each of the units 3, a plurality of panels 1 are installed, and a heating element 20 and a temperature sensor 21 are installed for each of the panels 1. The fan 9 and the heating elements 20 are controlled according to the temperature sensed by the temperature sensors 21 so that the temperature of electronic devices or the like installed on the panels 1 is maintained to the operation-assured level. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic apparatus and a mounting method thereof, and particularly includes a plurality of functions configured by an electronic device that generates heat, and is used outdoors and dissipates or heats according to the outside air temperature to maintain the electronic device operation guarantee temperature. The present invention relates to an electronic device such as a communication device that needs to be performed and a mounting method thereof.

  Almost all electronic devices use one or more active electronic devices such as a semiconductor integrated circuit to realize a predetermined function, and thus generate heat during operation. In particular, in a communication device used for a small base station such as a mobile phone system, a large number of high-frequency or high-speed electronic devices that realize various functions are mounted with high density in the housing, Large amount. In addition, when a malfunction occurs in such a communication device, the user is greatly inconvenienced and confused. Since the reliability of such an electronic device decreases as the temperature rises, it is essential to keep the operating temperature below a predetermined value. For this purpose, various cooling means are provided in the housing of the electronic device and inside the housing so that the electronic device operates with high reliability.

  The above-described communication device for a mobile phone system is generally installed outdoors. For this reason, in consideration of environmental resistance, the casing of such an electronic device is mounted in a sealed or near-sealed casing, and thus cooling to dissipate heat generated by the internal electronic device is indispensable. . In addition, such an electronic device needs to have a configuration in which an operation check is periodically performed and a maintenance service can be easily performed.

  Conventional examples of electronic devices for the above-described applications and their mounting methods are disclosed in several documents. An integrated electronic device used outdoors that is attached to a fixing member such as a pole with a band or the like is disclosed (for example, see Patent Document 1).

JP 2002-9455 A (page 2-3, FIG. 1)

  In recent high-capacity communication equipment, where the number of users is rapidly increasing, when a large number of boards are mounted at high density and the outside air temperature is high, the operating temperature of parts such as electronic devices mounted on the board is set to a predetermined value. It is difficult to maintain the guaranteed temperature by natural cooling alone. On the other hand, when used in a cool or cold area where the outside air temperature is low, it is difficult to maintain a substantially uniform operation guarantee temperature on all the boards mounted inside and prevent the occurrence of condensation, etc. There was a problem.

  The present invention has been made in view of the above-described problems and requirements of the prior art, and an electronic apparatus capable of maintaining an operation guarantee temperature of an internal electronic device even when the outside air temperature is high or low, and a mounting method thereof The main purpose is to provide

  In order to solve the above-described problems, the electronic device and the mounting method thereof according to the present invention employ the following characteristic configuration.

(1) A plurality of units that are detachably attached to the front surface of an interface (I / F) box that is attached substantially vertically to a fixing member and that are attached substantially vertically; In an electronic device comprising a cover that covers the whole of the unit and the fan,
Each unit includes a temperature sensor and a heating element for detecting the temperature of the unit, and controls the fan and the heating element according to the temperature detected by the temperature sensor to control the temperature of the electronic device or the like in the unit. Electronic equipment that maintains the operating temperature within the guaranteed temperature.

  (2) A predetermined gap is provided between the plurality of units and between the outer unit of the plurality of units and the cover, and the unit is forced by forming an air flow path through the gap by the fan. The electronic device according to (1), which is air-cooled.

  (3) At least one opening is formed at a position corresponding to the fan of the cover to make an exhaust port for air heated by the unit and to prevent raindrops and the like from entering from the opening by exhausting by the fan. The electronic device according to (1) or (2).

  (4) Each unit is provided with a plurality of panels on which the electronic device or the like is mounted for each function of the unit, and the temperature sensor and the heating element are provided substantially corresponding to the panel. (1) The electronic device of (2) or (3).

  (5) The above-mentioned (1), (2), (3) or (4), wherein an opening is formed in the front surface of at least one part of the plurality of units, and the panel can be inserted / removed through the opening. Electronic equipment.

  (6) The electronic device according to any one of (1) to (5), wherein the unit and the I / F box are electrically interconnected via a connector and mechanically coupled by a fastening member.

(7) An electronic device that constitutes a communication device or the like, and that maintains the temperature of the electronic device or the like of the electronic device that includes a plurality of units each mounted with an electronic device or the like in a sealed housing In the implementation method,
Attaching the plurality of units to a substantially vertically attached I / F box spaced apart from each other and substantially vertically, covering the plurality of units and the I / F box with a cover, and within the cover; An air flow is generated between the units and the gap between the units and the cover from the bottom surface of the plurality of units by the upper fan of the plurality of units, and the temperature of the electronic device or the like inside the unit is detected. And an electronic device mounting method for controlling an air flow of the fan according to the detected temperature and controlling a heat generation amount of the heating element in the unit.

  According to the electronic apparatus and the mounting method of the present invention, the following remarkable effects in practical use can be obtained. In other words, it is possible to forcibly air-cool multiple internal units using a fan and control the air flow of this fan according to the temperature detected by the temperature sensor to maintain the temperature of the electronic device etc. within the guaranteed operating temperature range. Therefore, a highly reliable electronic device can be obtained. Further, it is possible to prevent raindrops from entering from the opening by the air flow discharged from the fan. Further, since a heating element is provided according to the panel mounted inside, and the amount of heat generation is controlled according to the temperature detected by the temperature sensor, it can be used even in a cold district. Further, since the cover can be removed and the unit can be detached from the I / F box, excellent maintenance workability can be obtained.

  Hereinafter, the configuration and operation of a preferred embodiment of a communication device and its mounting method according to the present invention will be described in detail with reference to the accompanying drawings.

  1 to 5 show a pole-mounted communication device which is a first embodiment of an electronic device according to the present invention. FIG. 1 is a perspective view of the communication device and a pole to which the communication device is attached. FIG. 2 is a perspective view showing a state where a cover is removed from the communication device of FIG. FIG. 3 is an exploded perspective view of a plurality of units constituting the electronic apparatus from the state of FIG. 4A and 4B are cross-sectional views for explaining forced air cooling of the electronic device, in which FIG. 4A is a cross-sectional view of the entire hyperopic device, and FIG. 4B is an enlarged partial cross-sectional view of a portion indicated by a circle A in FIG. . 5A and 5B show a connection structure of each unit constituting the electronic device. FIG. 5A is an overall cross-sectional view, and FIG. 5B is a partial cross-sectional view showing details of a portion indicated by a circle B in FIG.

  First, as best shown in FIG. 1, an electronic device (or communication device) 10 according to the present invention is mounted on a fixing member 18 (hereinafter referred to as a pole) having a sufficient height and planted at a suitable outdoor location. For example, it is attached by a metal band (or belt) 19. The electronic device 10 of this specific embodiment has a substantially rectangular parallelepiped shape as a whole, and is covered with a cover 11 that is removable to protect the internal electronic circuit. An elongated rectangular opening (or an exhaust port 12) is formed above the cover 11, for example.

  Next, as best shown in FIGS. 2 and 3, the electronic device 10 is detachably attached to the interface (I / F) box 7 attached to the pole 18 with the band 19 and the I / F box 7. The unit 3 is composed of a plurality (three in this specific example).

  Next, as best shown in FIG. 4, the electronic device 10 includes a control unit, a radio unit, an amplification unit (AMP), a baseband unit, and the like, which are main functions constituting the communication device, with a minimum functional configuration. An electronic circuit is formed on a plurality of substrates (or printed boards). Each panel 1 on which a plurality of electronic devices are mounted is mounted on a wall surface of a sealed casing 2 formed by die casting or the like via a heat conducting member 12 to obtain a unit 3 in which each function is divided.

  As shown in FIG. 5, connectors 5 and 6 for electrical and mechanical connection to the outside of the unit 3 (that is, the I / F box 7) are attached to one surface of each unit 3. Of course, the waterproof packing 4 and the waterproof connector are used for the housing 2 and the connectors 5 of the unit 3 when the electronic device 10 is used outdoors. Furthermore, connectors 6 for electrical and mechanical connection and coupling with connectors 5 attached to one surface of each unit 3 are attached to one surface of the I / F box 7. The I / F box 7 is formed in a sealed structure by a die-cast or sheet metal housing 2.

  The assembly of the I / F box 7 and each unit 3 is performed by fitting each connector 6 on the I / F box 7 with the connector 5 of each unit 3, and the hook portion 23 and the insertion hole 22 of each fastening member 8. Fix and hold with. As shown in FIG. 5, the fastening is performed by a reaction force 27 of the packing 4 pressed against each unit 3. However, this fastening method is merely an example, and of course, the unit 3 may be fastened to the I / F box 7 by other methods such as fastening by screwing.

  At this time, it should be noted that the adjacent units 3 are attached with a gap for forming an air flow path. A fan (waterproof fan) 9 is attached to the upper surface of each unit 3. Thereafter, the cover 11 is attached so as to cover the entire I / F box 7, the plurality of units 3, and the waterproof fan 9. Also in this case, the units 3 and the covers 11 located at both ends are attached with spaces 24 and 25 serving as air flow paths. Further, the cover 10 is formed with a plurality of exhaust ports 12 for discharging the air 28 discharged from the waterproof fan 9 to the outside.

  Further, inside each unit 3, a heating sensor 20 is provided on the wall surface of the sealed casing 2 near the lower part of the panel 1 for electric / electronic parts, and a temperature sensor 21 is provided near the upper part of the panel 1 for electronic devices. ing. Commercially available products may be used for the waterproof fan 9, the connectors 5 and 6, the fastening member 8, and the like. The waterproof packing 4 is formed by using an O-ring, rubber packing, or the like. The electronic device 10 according to the above-described embodiment is attached to a pole 18 such as a telephone pole as shown in FIG. 1 with a band 19 or the like, but can also be installed on a wall surface, ceiling, or the like using a mounting bracket or the like.

  Next, the operation of the electronic apparatus 10 according to the first embodiment of the present invention shown in FIGS. 1 to 5 is divided into “when radiating” when used in a high temperature state and “when cold” when used in a cold region. This will be described in detail below.

(Operation during heat dissipation)
As shown in FIG. 4, when power is turned on, heat is generated from the electronic devices (electrical / electronic components) on the board mounted on each panel 1 inside each unit 3, and the wall of each sealed casing 2 is generated. Heat conduction. Between the sealed housing 2 and the electronic device, the heat conduction member 12 is used to release heat to the radiation fins 13 integrated with each sealed housing 2 (see arrow 28 in FIG. 4).

  In the mounting structure of the electronic device 10 of the present invention, the connectors 6 on the I / F box 7 side and the connectors 5 on the unit 3 side are fitted to each other and fastened and held by the fastening member 8. A waterproof fan 9 is provided at the top of each unit 3 and covered with a cover 11. Since spaces for air flow paths 24 and 25 are provided between the units 3 and between the units 3 located at both ends and the cover 11, when the waterproof fan 9 is operated, the gaps between the units 3 and the units The gap between the cover 3 and the cover 11 is used as air flow paths 24 and 25, and the waterproof fan 9 sucks external cold air from below the units 3. Then, heat is released from the electronic device inside each unit 3 to the sealed casing 2. Thereby, the radiation fin 13 integrated with each sealed casing 2 heated by the electronic device or the like is radiated by the sucked cold air, that is, forced air cooling.

  As described above, the temperature sensor 21 is installed above each panel 1. Before the operation or operation of the electronic device 10, the correlation between the ambient temperature of the electronic device and the temperature near the temperature sensor 21 is confirmed. Monitoring is performed (using the confirmed temperature correlation) so that the ambient temperature of the electronic device is always an appropriate temperature (that is, within the operation guaranteed temperature range of the electronic device), and the rotational speed of the waterproof fan 9 is controlled. The cover 11 serves as a sunshade (direct sunlight shield) and effectively prevents, for example, midsummer sunlight.

(Operation in cold weather)
Next, in order that the electronic device does not fall below the operation guarantee temperature, the heating element 20 is installed on the wall surface of each hermetic casing 2 on the lower side of the panel 1 to be kept warm. The temperature sensor 21 installed above the panel 1 is monitored so that the ambient temperature of the electronic device is always at an appropriate temperature (that is, within the operation guaranteed temperature range of the electronic device) to control the amount of heat generated by the heating element 20.

  Next, a second embodiment of the electronic apparatus and the mounting method thereof according to the present invention will be described with reference to FIGS. For convenience of explanation, the same reference numerals are used for the components corresponding to the components of the first embodiment described above. FIG. 6 is an exploded perspective view of an electronic apparatus according to the second embodiment of the present invention. FIG. 7 is a partial cross-sectional view showing an internal configuration of a unit constituting the electronic apparatus shown in FIG. 8A and 8B show a detailed configuration of a unit constituting the electronic device shown in FIG. 6, in which FIG. 8A is a cross-sectional view and FIG. 8B is a side view.

  The electronic device 10 ′ of the second embodiment includes a plurality of (four in this specific example) units 3 detachably attached to an I / F box 7 attached to a pole 18 as a fixing member by a band 19. The waterproof fan 9 disposed on the upper part of the unit 3 and the I / F box 7, the plurality of units 3 and the cover 11 covering the waterproof fan 9 are configured.

  Inside at least one unit of the plurality of units 3 is provided with an opening 14 in which the casing 2 is sealed, and the panel 1 constituting the unit 3 is mounted from the opening 14 so that the panel 1 can be inserted and removed. . The heat generated by the electronic device of each panel 1 or the electronic circuit formed thereby is radiated by forced air cooling, thereby preventing the heat from adversely affecting the electronic device and preventing the electronic device from being adversely affected by the cold.

  That is, the electronic apparatus 10 'according to the second embodiment of the present invention has the same basic configuration as that of the first embodiment shown in FIGS. However, the sealed housing 2 of at least one unit 3 of the plurality of units 3 is provided with an opening 14 having a sealed structure, and the plurality of panels 1 in the unit 3 are shown in FIG. It is possible to insert / remove from the unit 3.

  As shown in the partial cross-sectional view of FIG. 7, between the panels 1, there are rails 15 for aligning them in parallel at a predetermined interval. Further, shelves 16 each having a partition plate for securing an air flow path are incorporated at both ends of each panel 1. In order to cool the heat generated from the electronic devices on the substrate mounted on each panel 1, the radiating fins 13 integrated with the sealed casing 2 are installed so as to penetrate the inside and outside of the sealed casing 2. (See FIG. 7). As shown in FIG. 6, a fan 17 for convection of the warmed air inside the sealed casing 2 is provided.

  Further, when the place where the electronic device 10 ′ is used is cold, the heating element 20 is arranged on the surface of the partition plate on the side of the heat radiation fin 13 so as not to fall below the operation guarantee temperature of the electronic device. . Thereby, the temperature sensor 21 for monitoring the ambient temperature of the electronic device or the substrate using the electronic device is provided.

(Heat dissipation operation)
Next, the operation will be described only for the sealed casing 2 of at least one unit 3 among the plurality of units 3 constituting the electronic apparatus 10 ′ of the second embodiment of the present invention shown in FIGS. 6 to 8. As shown in FIG. 7, when power is turned on, heat is generated from the electronic devices on the board mounted on each panel 1 mounted on each shelf 1 provided with a rail 16 for inserting and removing each panel 1 inside the unit 3. Occur.

  There is a certain interval between adjacent panels 1, and the fan 17 sucks air by using this gap as an air flow path. Therefore, the heat of the electronic device is radiated by the sucked air. The absorbed air is discharged from the fan 17 and passes through the air flow path formed by the partition plates at both ends of each component panel 1. At that time, since the radiation fins 13 installed so as to penetrate the inside and outside of the hermetic casing 2 integrated with the hermetic casing 2 also pass, the radiation fins 13 serve to release the heat of the air. The cooled air is sent again to the bottom of each panel 1 and is sucked again from the fan 17.

  The radiating fins 13 have heat in order to release the heat of the air, but in the same way as the electronic device 10 of the first embodiment, the waterproof fan uses the gap between the units 3 and the gap between the cover 11 and the unit 3 as an air flow path. 9 sucks cold air and is dissipated by the cold air. In addition, by using the temperature sensor 21 installed near the upper part of the panel 1 on which the electronic device that requires the guaranteed operating temperature is mounted, the ambient temperature of the electronic device and the temperature sensor 21 are operated before the operation of the electronic device 10 ′. The temperature correlation in the vicinity of is confirmed. Monitoring is performed so that the ambient temperature of the electronic device is always at an appropriate temperature (within the guaranteed operating temperature range of the electronic device), and the rotational speed of the waterproof fan 9 and the fan 17 is controlled.

(Operation in cold weather)
When it is cold, the heating element 20 is disposed on the surface of the partition plate on the side of the heat radiation fin 13 for securing the air flow path provided in the shelf 16 so as not to fall below the operation guarantee temperature of the electronic device. A temperature sensor 21 for monitoring the ambient temperature of the electronic device is arranged around the upper part of the panel 1 on which the electronic device that requires the highest guaranteed operating temperature is mounted. The temperature correlation between the ambient temperature of the electronic device and the temperature sensor 21 is confirmed in advance. Then, when the ambient temperature of the electronic device of the panel 1 on which the electronic device that requires the operation guarantee temperature is mounted is lower than the operation guarantee temperature of the electronic device, the heating element 20 is caused to generate heat. Then, the amount of heat generated by the heating element 20 is controlled so as not to fall below the guaranteed operating temperature by circulating the warmed air.

  The configuration and operation of the preferred embodiment of the electronic device and the mounting method thereof according to the present invention have been described in detail above. However, it should be noted that such examples are merely illustrative of the invention and do not limit the invention in any way. Those skilled in the art will readily understand that various modifications and changes can be made according to a specific application without departing from the gist of the present invention.

1 is a perspective view of a first embodiment of an electronic device according to the present invention attached to a fixing member. FIG. 2 is a perspective view of the inside of the electronic device with the cover of the electronic device shown in FIG. 1 disassembled. It is the perspective view which decomposed | disassembled the several unit inside the electronic device shown in FIG. It is a front view of the electronic device shown in FIG. 1, (A) is a whole fragmentary sectional view, (B) is an enlarged view in the circle A of (A). The side view of the electronic device shown in FIG. 1 is shown, (A) is a general view, (B) is an enlarged detail view in a circle B of (A). It is a disassembled perspective view of 2nd Example of the electronic device by this invention attached to the fixing member. It is the fragmentary sectional view seen from the front of the electronic device shown in FIG. 6A and 6B show units constituting the electronic device shown in FIG. 6, in which FIG. 6A is a cross-sectional view and FIG.

Explanation of symbols

1 panel
2 Sealed housing 3 Unit 5, 6 Connector 7 I / F box 9, 17 Fan 10 Electronic device 11 Cover 12 Opening 13 Radiation fin 14 Opening 18 Fixing member (pole)
19 Mounting band 20 Heating element 21 Temperature sensor

Claims (7)

A plurality of units that are detachably attached to the front surface of an interface (I / F) box that is attached substantially vertically to a fixing member and that are attached substantially vertically, a fan that is disposed above the unit, the I / F box, and the unit And an electronic device comprising a cover that covers the entire fan,
Each unit includes a temperature sensor and a heating element for detecting the temperature of the unit, and controls the fan and the heating element according to the temperature detected by the temperature sensor to control the temperature of the electronic device or the like in the unit. Is maintained within the guaranteed operating temperature.   A predetermined gap is provided between the plurality of units and between the outer unit of the plurality of units and the cover, and the unit is forcibly air-cooled by forming an air flow path through the gap by the fan. 2. The electronic device according to claim 1, wherein:   Forming at least one opening at a position corresponding to the fan of the cover to provide an air exhaust port for warmed air by the unit and preventing intrusion of raindrops and the like from the opening by exhausting by the fan. The electronic apparatus according to claim 1, wherein the electronic apparatus is characterized in that   Each unit is provided with a plurality of panels on which the electronic devices and the like are mounted for each function of the unit, and the temperature sensor and the heating element are provided substantially corresponding to the panels. The electronic device according to claim 1, 2 or 3.   5. The electronic device according to claim 1, wherein an opening is formed in a front surface of at least a part of the plurality of units, and the panel can be inserted / removed through the opening. .   6. The electronic apparatus according to claim 1, wherein the unit and the I / F box are electrically connected to each other via a connector and mechanically coupled by a fastening member. In a mounting method of an electronic device that configures a communication device or the like, and maintains the temperature of the electronic device or the like of an electronic device that includes a plurality of units each mounted with an electronic device or the like in a sealed housing ,
Attaching the plurality of units to a substantially vertically attached I / F box spaced apart from each other and substantially vertically, covering the plurality of units and the I / F box with a cover, and within the cover; The fan at the top of the plurality of units generates an air flow from the bottom surface of the plurality of units to the gap between the units and between the unit and the cover, and detects the temperature of the electronic device or the like inside the unit. And a method of mounting an electronic device, comprising: controlling an air flow of the fan according to the detected temperature and controlling a heat generation amount of a heating element in the unit.

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