CN105517364B - A kind of electroplating gold method for printed circuit board - Google Patents
A kind of electroplating gold method for printed circuit board Download PDFInfo
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- CN105517364B CN105517364B CN201410497607.5A CN201410497607A CN105517364B CN 105517364 B CN105517364 B CN 105517364B CN 201410497607 A CN201410497607 A CN 201410497607A CN 105517364 B CN105517364 B CN 105517364B
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- printed circuit
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Abstract
The embodiment of the invention discloses a kind of electroplating gold methods for printed circuit board to improve the aligning accuracy in gold-plated region and non-gold-plated region junction, improve the quality of printed circuit board for solving the problems, such as that gold-plated ooze is crossed.Present invention method includes：Wet film is printed on printed circuit board after electro-coppering, and carries out prebake conditions；Pattern transfer processing is carried out to the printed circuit board after prebake conditions, so that obtaining the gold-plated region in non-gold-plated region and wet film covering in the printed circuit board surface；Segmentation baking is carried out to the printed circuit board, so that generating oxide layer in the non-gold-plated region surface；Remove the wet film in the printed circuit board surface；Using the layers of copper under the printed circuit board as electroplating lead, to the printed circuit board electroplating；To the printed circuit board microetch, the oxide layer of the non-gold-plated region surface is removed.
Description
Technical field
The present invention relates to printed circuit board (PCB, Printed Circuit Board) manufacture technology fields, and in particular to
A kind of electroplating gold method for printed circuit board.
Background technology
Currently, PCB surface craft of gilding may include following steps：
A1, the figure and gold plated lead that gold-plated region is made on PCB；
A2, dry film is sticked in non-gold-plated region, it is then gold-plated in gold-plated region；
A3, non-gold-plated regional graphics are made；
A4, the other coating operations in surface.
In above-mentioned technique, the gold-plated region on PCB is first made, is first time graphic making, then in non-gold-plated region
It sticks dry film to be protected, and gold-plated in the gold-plated region for not sticking dry film, then removes the dry film in non-gold-plated region, make non-
The figure in gold-plated region is second of graphic making.Successively graphic making twice, will lead to gold-plated region and non-gold-plated region
There is the aligning accuracy deviation of 2-4mil in junction, if gold-plated region is with non-gold-plated region junction, there are fine and closely woven circuits
When, then it can not be in the junction electroplating lead.
Another PCB craft of gildings may include following steps：
B1, non-gold-plated region is covered with dry film, it is gold-plated in gold-plated region；
B2, figure is made on the PCB after gold-plated.
In above-mentioned technique, the poor adhesive force of dry film, non-gold-plated region overlay is not tight, cause to occur it is gold-plated ooze the problem of crossing,
Gold plating quality is poor.
Invention content
In view of the foregoing drawbacks, an embodiment of the present invention provides a kind of electroplating gold methods for printed circuit board, using depth
Spend oxidation technology, prevent it is gold-plated ooze the problem of crossing, and the aligning accuracy of gold-plated region and non-gold-plated region junction is higher, improves print
Printed circuit board quality.
An embodiment of the present invention provides a kind of electroplating gold methods for printed circuit board, including：
Wet film is printed on printed circuit board after electro-coppering, and carries out prebake conditions；
Pattern transfer processing is carried out to the printed circuit board after prebake conditions, so that in the printed circuit board surface
The gold-plated region covered to non-gold-plated region and wet film；
Segmentation baking is carried out to the printed circuit board, so that generating oxide layer in the non-gold-plated region surface；
Remove the wet film in the printed circuit board surface；
Using the layers of copper under the printed circuit board as electroplating lead, to the printed circuit board electroplating；
To the printed circuit board microetch, the oxide layer of the non-gold-plated region surface is removed.
Further, include before printing wet film on the printed circuit board after electro-coppering：After making internal layer figure
Copper electroplating layer on printed circuit board, the copper layer thickness are at least 5 μm thicker than the thickness of preset need.
Specifically, the printed circuit board to after prebake conditions carries out pattern transfer processing, so that in printing electricity
The gold-plated region that non-gold-plated region and wet film covering are obtained in the plate surface of road includes：It utilizes on the printed circuit board anti-gold-plated
Figure egative film exposure copper face obtains non-gold-plated region and development copper face obtains gold-plated region.
As can be seen from the above technical solutions, the electroplating gold method provided in an embodiment of the present invention for printed circuit board has
It has the advantage that：Prebake conditions and pattern transfer processing are carried out after the printed circuit board for being printed with electroplating gold stamps wet film, are being printed
The gold-plated region in non-gold-plated region and wet film covering has been obtained on printed circuit board surface, and then printed circuit board is segmented and is toasted,
So as to printed circuit board can deep oxidation, generate oxide layer in above-mentioned non-gold-plated region surface, and gold-plated region is due to wet
Film covering will not be aoxidized.The wet film in the printed circuit board surface is removed again, to the printed circuit board electroplating, at this point,
Non- gold-plated region surface has oxide layer protection to will be unable to plated with nickel gold, will not cause to plate between gold-plated region and non-gold-plated region
Gold oozes the problem of crossing, and can improve the Line-width precision in gold-plated region and non-gold-plated region junction, improves printed circuit board quality.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, will make below to required in the embodiment of the present invention
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is the flow diagram of the electroplating gold method provided in an embodiment of the present invention for printed circuit board.
Specific implementation mode
Below in conjunction with the attached drawing of the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained without creative efforts
Example is applied, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides a kind of electroplating gold method for printed circuit board, for improve gold-plated region with it is non-
The Line-width precision of gold-plated region junction improves gold plating quality.
It will be described in detail below to the present invention with specific embodiment：
Referring to Fig. 1, the flow that Fig. 1 is the electroplating gold method provided in an embodiment of the present invention for printed circuit board is illustrated
Figure；As shown in Figure 1, a kind of electroplating gold method for printed circuit board may include：
Wet film is printed on S101, the printed circuit board after electro-coppering, and carries out prebake conditions；
On printed circuit board inner figure making, matching board, lamination, drilling, heavy copper and plating, electricity are carried out according to normal flow
Copper layer thickness after plating is at least 5 μm thicker than the copper layer thickness of preset need, to ensure after successive depths aoxidize and after oxidation removal
Copper layer thickness will not be caused insufficient.
S102, pattern transfer processing is carried out to the printed circuit board after prebake conditions, so that in the printed circuit board table
The gold-plated region in non-gold-plated region and wet film covering is obtained on face；
It is understood that pattern transfer processing mainly exposes printed circuit board using anti-gold-plated figure egative film
Light-development.Gold-plated region is transmission region, is in the light a little without the setting of gold-plated region, then the gold-plated region after development is by wet film
Copper face is exposed in covering, non-gold-plated region.
S103, segmentation baking is carried out in the printed circuit board, so that generating oxygen in the non-gold-plated region surface
Change layer；
Deep oxidation is carried out to pattern transfer treated printed circuit board, segmentation baking specifically is carried out to printed circuit board
It is roasting.
In order to ensure there is enough moisture when deep oxidation, before segmentation is toasted, first on a printed circuit on spray
One layer of water mist so that the moisture on printed circuit board is sufficient, meets deep oxidation needs so that the copper energy of non-gold-plated region surface
It is enough that oxidation reaction fully occurs.
Wherein, segmentation baking is from left to right or from right to left to be toasted paragraph by paragraph, to ensure in pattern transfer processing
The copper face exposed in non-gold-plated region afterwards can be by deep oxidation.
It is understood that deep oxidation is oxygen in the copper and air exposed in non-gold-plated region, titanium dioxide at this time
The substances such as carbon and water react, and generate the oxide of the mixed types copper such as basic copper carbonate, copper oxide, cuprous oxide.Wherein, instead
Answer chemical equation as follows：
7Cu+4O2+CO2+2HO2=2Cu2(OH)2CO3+CuO+Cu2O
The thickness for the mixing Cu oxide that deep oxidation generates is resistant to general weak acid and washes, due to oxidation at 2-3 μm or more
Displacement reaction can not occur with nickel for object, protect non-gold-plated region will not plated with gold.
Preferably, 80 DEG C of temperature may be used, baking 30min first is segmented to printed circuit board, then temperature is increased to
120 DEG C are segmented baking 60min to printed circuit board again, and temperature is increased to 150 DEG C once again later, is segmented and toasts to printed circuit board
Temperature finally, then is increased to 200 DEG C by 60min, and baking 30min is segmented to printed circuit board.
Wet film on S104, the removal printed circuit board surface；
Preferably, the wet film in alkaline solution removal printed circuit board surface may be used, gold-plated region is because there is wet film
Protection will not be oxidized when being segmented baking.And alkaline solution will not impact the oxide in non-gold-plated region.
In printed circuit board after above-mentioned processing, the gold-plated region of printed circuit board surface inevitably can by light contamination and
There are small amounts, weak pickling may be used.
S105, using the layers of copper under the printed circuit board as electroplating lead, to the printed circuit board electroplating；
Due to non-gold-plated region Cu oxide protection and can not plated with nickel gold, only can on gold-plated region plated with nickel gold,
Will not then cause between gold-plated region and non-gold-plated region gold-plated oozes the problem of crossing.
S106, to the printed circuit board microetch, remove the oxide layer of the non-gold-plated region surface.
It is alternatively possible to get rid of the oxide layer generated after deep oxidation using stronger microetch liquid medicine, expose non-gold-plated
Layers of copper under region.
After removing removing oxide layer, outer graphics making and packaging will be carried out to printed circuit board according to normal flow.
In the embodiment of the present invention, prebake conditions are carried out after the printed circuit board for being printed with electroplating gold stamps wet film and figure turns
Shifting is handled, and the gold-plated region in non-gold-plated region and wet film covering has been obtained in printed circuit board surface, and then to printing electricity
Plate segmentation baking in road generates oxide layer in above-mentioned non-gold-plated region surface, and gold-plated region is due to will not be by by wet film covering
Oxidation.The wet film in the printed circuit board surface is removed again, to the printed circuit board electroplating, at this point, non-gold-plated region surface
Have oxide layer protection will be unable to plated with nickel gold, will not be caused between gold-plated region and non-gold-plated region it is gold-plated ooze the problem of crossing, can
To improve the Line-width precision in gold-plated region and non-gold-plated region junction.
A kind of electroplating gold method for printed circuit board provided by the present invention is described in detail above, for
Those of ordinary skill in the art, the thought of embodiment, has in specific embodiments and applications according to the present invention
Change place, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (9)
1. a kind of electroplating gold method for printed circuit board, which is characterized in that including：
Wet film is printed on printed circuit board after electro-coppering, and carries out prebake conditions；
Pattern transfer processing is carried out to the printed circuit board after prebake conditions, so that being obtained in the printed circuit board surface non-
The gold-plated region in gold-plated region and wet film covering；
Segmentation baking is carried out to the printed circuit board, so that generating oxide layer in the non-gold-plated region surface；
Remove the wet film in the printed circuit board surface；
Using the layers of copper under the printed circuit board as electroplating lead, to the printed circuit board electroplating；
To the printed circuit board microetch, the oxide layer of the non-gold-plated region surface is removed；
Include before printing wet film on the printed circuit board after electro-coppering：
The copper electroplating layer on the printed circuit board after making internal layer figure, the copper layer thickness 5 μ at least thicker than the thickness of preset need
m。
2. electroplating gold method according to claim 1, which is characterized in that the printed circuit board to after prebake conditions carries out
Pattern transfer processing, so that obtaining the gold-plated region packet of non-gold-plated region and wet film covering in the printed circuit board surface
It includes：
Non- gold-plated region is obtained using anti-gold-plated figure egative film exposure copper face and development copper face obtains on the printed circuit board
Gold-plated region.
It is described segmentation baking is carried out to the printed circuit board to include 3. electroplating gold method according to claim 1：
To the printed circuit board spray water mist, and carry out segmentation baking.
4. electroplating gold method according to claim 3, which is characterized in that it is described carry out segmentation baking include：
80 DEG C of segmentations are used to toast 30min, 120 DEG C of segmentation baking 60min, 150 DEG C of segmentation baking 60min, 200 DEG C of segmentations successively
Toast 30min.
5. electroplating gold method according to claim 1, which is characterized in that in the removal printed circuit board surface
Wet film includes：
The wet film in the printed circuit board surface is removed using alkaline solution.
6. electroplating gold method according to claim 5, which is characterized in that described to remove the printing electricity using alkaline solution
Include after wet film in the plate surface of road：
The printed circuit board surface is cleaned using weak acid solution.
7. electroplating gold method according to claim 1, which is characterized in that described to be removed to the printed circuit board microetch
Include after the oxide layer of the non-gold-plated region surface：
Outer graphics making is carried out to the printed circuit board.
8. electroplating gold method according to claim 1, which is characterized in that the oxide layer includes oxidation mixture, described
Oxidation mixture includes basic copper carbonate, copper oxide, cuprous oxide.
9. electroplating gold method according to claim 1, which is characterized in that the thickness of the oxide layer is 2-3 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410497607.5A CN105517364B (en) | 2014-09-25 | 2014-09-25 | A kind of electroplating gold method for printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410497607.5A CN105517364B (en) | 2014-09-25 | 2014-09-25 | A kind of electroplating gold method for printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN105517364A CN105517364A (en) | 2016-04-20 |
| CN105517364B true CN105517364B (en) | 2018-10-23 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112423483A (en) * | 2020-11-18 | 2021-02-26 | 深圳市艾诺信射频电路有限公司 | Processing method of printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3924431B2 (en) * | 1999-05-06 | 2007-06-06 | 太陽インキ製造株式会社 | Solder resist ink composition |
| CN101820730A (en) * | 2010-03-30 | 2010-09-01 | 梅州博敏电子有限公司 | Method for preparing printed wiring board by selectively plating gold |
-
2014
- 2014-09-25 CN CN201410497607.5A patent/CN105517364B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3924431B2 (en) * | 1999-05-06 | 2007-06-06 | 太陽インキ製造株式会社 | Solder resist ink composition |
| CN101820730A (en) * | 2010-03-30 | 2010-09-01 | 梅州博敏电子有限公司 | Method for preparing printed wiring board by selectively plating gold |
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| CN105517364A (en) | 2016-04-20 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
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Effective date of registration: 20190128 Address after: 226000 No. 168 Hope Avenue, Nantong High-tech Zone, Jiangsu Province Patentee after: NANTONG SHENNAN CIRCUIT Co.,Ltd. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENNAN CIRCUITS Co.,Ltd. |