CN112423483A - Processing method of printed circuit board - Google Patents
Processing method of printed circuit board Download PDFInfo
- Publication number
- CN112423483A CN112423483A CN202011294596.2A CN202011294596A CN112423483A CN 112423483 A CN112423483 A CN 112423483A CN 202011294596 A CN202011294596 A CN 202011294596A CN 112423483 A CN112423483 A CN 112423483A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- area
- key area
- areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000009713 electroplating Methods 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims abstract description 8
- 230000001681 protective effect Effects 0.000 claims description 15
- 238000004381 surface treatment Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 239000012670 alkaline solution Substances 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 2
- 239000003814 drug Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The application discloses a processing method of a printed circuit board, which comprises the following steps: determining a key area of the printed circuit board, wherein the key area is an area on the surface of the printed circuit board, which needs to be subjected to welding operation; and carrying out metal electroplating operation on the key area. Because only the key area of the printed circuit board is electroplated with metal, compared with the prior art, the method can not only ensure the high performance of the printed circuit board, but also save the cost of the printed circuit board.
Description
Technical Field
The present application relates to the field of radio frequency, and more particularly, to a method for processing a printed circuit board.
Background
In the field of radio frequency, in order to improve the performance requirements of products, it is generally necessary to treat the surface of a Printed Circuit Board (PCB). For example, the surface of the printed circuit board is plated with gold, so that the printed circuit board has good conductivity and low loss rate. Although the surface treatment operation can improve the performance of the product, the cost of the printed circuit board is also increased, and therefore how to achieve the purpose of ensuring the high performance of the printed circuit board and saving the cost of the printed circuit board becomes a technical problem to be solved urgently.
Disclosure of Invention
In order to realize the purposes of ensuring the high performance of the printed circuit board and saving the cost of the printed circuit board, the application provides a processing method of the printed circuit board, which comprises the following steps:
the embodiment of the application provides a processing method of a printed circuit board, which comprises the following steps:
determining a key area of the printed circuit board, wherein the key area is an area on the surface of the printed circuit board, and welding operation is required to be carried out;
and carrying out metal electroplating operation on the key area.
Optionally, the method further comprises:
and carrying out surface treatment operation of the organic protective film on other areas, wherein the other areas are the areas of the surface of the printed circuit board except the key areas.
Optionally, the step of electroplating metal on the critical area comprises:
and controlling to electrically connect the key area with a production board through a lead so as to carry out the operation of electroplating metal on the key area by the production board.
Optionally, before the surface treatment operation of the organic protective film is performed on the other area, the method further comprises:
and etching to remove the conducting wire.
Optionally, etching away the conductive line comprises:
and etching and removing the lead by adopting an alkaline solution of ammonia water and hydrochloric acid in a set ratio.
Optionally, determining a critical area of the printed circuit board comprises:
determining application requirements for different locations on a surface of the printed circuit board;
determining an area needing to be welded from the surface of the printed circuit board according to the application requirements of different positions;
and taking the area needing welding as the key area.
Optionally, the other area is subjected to a surface treatment operation of the organic protective film, including:
and soaking the printed circuit board with organic protective film liquid medicine.
Optionally, the step of electroplating metal on the critical area comprises:
and carrying out nickel-free soft gold plating operation on the key area.
Optionally, before the step of electroplating metal on the critical region, the method further includes:
the other regions are covered with a dry film.
Optionally, before the surface treatment operation of the organic protective film is performed on the other area, the method further comprises:
removing the dry film.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
in the technical scheme provided by the embodiment of the application, as only the key area of the printed circuit board is subjected to metal electroplating operation, compared with the prior art, the high performance of the printed circuit board can be ensured, and the cost of the printed circuit board can be saved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
Fig. 1 is a schematic flow chart illustrating a method for processing a printed circuit board according to an embodiment of the present disclosure;
fig. 2 is another schematic flow chart of a method for processing a printed circuit board according to an embodiment of the present disclosure.
Detailed Description
In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments, and the illustrative embodiments and descriptions thereof of the present application are used for explaining the present application and do not constitute a limitation to the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1, the method for processing a printed circuit board according to an embodiment of the present invention includes the following steps:
In the embodiment of the application, the key area is an area on the surface of the printed circuit board where the soldering operation is required.
In practical application, the printed circuit board provides fixed support for various electronic components, realizes wiring and electrical connection among the various electronic components, and provides welding patterns for automatic welding. Since the soldering position needs good conductivity, the embodiment of the application takes the area needing soldering operation as the key area of the printed circuit board, and carries out the operation of electroplating metal on the key area.
Alternatively, as shown in fig. 2, step 101 may include the following steps:
In the embodiment of the present application, the application requirements of different positions on the surface of the printed circuit board may be different, and optionally, the application requirements may include a connection requirement, an electrical transmission requirement, and the like.
In practical application, when the application requirement is a connection requirement, the position corresponding to the application requirement may be a wire; when the application requirement is an electrical transmission requirement, the location corresponding to the application requirement may be a component that needs to be soldered to the printed circuit board.
In step 202, the area to be soldered is determined from the surface of the printed circuit board according to the application requirements of different positions.
And step 203, taking the area needing welding as a key area.
In practice, the metal is not limited to gold, silver, etc.
Optionally, in order to provide good conductivity to the printed circuit board, in the embodiment of the present application, the step of electroplating metal on the critical area may include the step of nickel-free soft gold plating on the critical area.
Alternatively, in the embodiment of the present application, the key area may be plated with metal by a production board (panel, PNL board). Specifically, the key area is electrically connected with the production board through a lead, so that the production board is used as the key area for metal electroplating operation.
In the technical scheme provided by the embodiment of the application, as only the key area of the printed circuit board is subjected to metal electroplating operation, compared with the prior art, the high performance of the printed circuit board can be ensured, and the cost of the printed circuit board can be saved.
In another embodiment of the present application, in order to prevent other areas on the surface of the printed circuit board from being oxidized when in contact with air, the following steps may be further included after step 102:
the other regions are subjected to a surface treatment operation of the organic protective film.
Wherein the other areas are areas of the surface of the printed circuit board other than the critical areas.
Optionally, in this embodiment of the present application, when performing surface treatment operation on the organic protective film on other areas, the surface treatment operation may be performed by soaking the printed circuit board with an organic protective film solution.
Alternatively, in order to comprehensively perform the surface treatment operation treatment of the organic protective film on the other areas except the critical areas, in the embodiment of the present application, after the metal plating operation is completed, the wires for achieving the electrical connection between the printed circuit board and the production board are etched away.
Illustratively, the wire can be removed by etching with an alkaline solution of ammonia and hydrochloric acid in a set ratio.
In another embodiment of the present application, to avoid the malfunction of other regions during the metal electroplating, before step 102, the following steps may be further included:
the other areas are covered with a dry film.
Accordingly, before the surface treatment operation of the organic protective film is performed on the other region, the dry film covering the other region needs to be removed.
In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, cause the processes or functions described in accordance with the embodiments of the application to occur, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another, for example, from one website site, computer, server, or data center to another website site, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device, such as a server, a data center, etc., that incorporates one or more of the available media. The usable medium may be a magnetic medium (e.g., floppy Disk, hard Disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., Solid State Disk (SSD)), among others.
The above description is only for the preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the protection scope of the present application.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A method of processing a printed circuit board, comprising:
determining a key area of the printed circuit board, wherein the key area is an area on the surface of the printed circuit board, and welding operation is required to be carried out;
and carrying out metal electroplating operation on the key area.
2. The method of claim 1, further comprising:
and carrying out surface treatment operation of the organic protective film on other areas, wherein the other areas are the areas of the surface of the printed circuit board except the key areas.
3. The method of claim 2, wherein the step of plating the critical area with metal comprises:
and controlling to electrically connect the key area with a production board through a lead so as to carry out the operation of electroplating metal on the key area by the production board.
4. The method according to claim 3, wherein before the surface treatment operation of the organic protective film on the other region, further comprising:
and etching to remove the conducting wire.
5. The method of claim 4, wherein etching away the conductive line comprises:
and etching and removing the lead by adopting an alkaline solution of ammonia water and hydrochloric acid in a set ratio.
6. The method of any of claims 1-5, wherein determining critical areas of the printed circuit board comprises:
determining application requirements for different locations on a surface of the printed circuit board;
determining an area needing to be welded from the surface of the printed circuit board according to the application requirements of different positions;
and taking the area needing welding as the key area.
7. The method according to claim 2, wherein the other area is subjected to a surface treatment operation of an organic protective film comprising:
and soaking the printed circuit board with organic protective film liquid medicine.
8. The method of claim 6, wherein the step of electroplating the critical area with metal comprises:
and carrying out nickel-free soft gold plating operation on the key area.
9. The method of claim 7, wherein the step of electroplating metal to the critical region further comprises:
the other regions are covered with a dry film.
10. The method according to claim 9, wherein before the surface treatment operation of the organic protective film on the other region, further comprising:
removing the dry film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011294596.2A CN112423483A (en) | 2020-11-18 | 2020-11-18 | Processing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011294596.2A CN112423483A (en) | 2020-11-18 | 2020-11-18 | Processing method of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112423483A true CN112423483A (en) | 2021-02-26 |
Family
ID=74774450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011294596.2A Pending CN112423483A (en) | 2020-11-18 | 2020-11-18 | Processing method of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112423483A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05255887A (en) * | 1991-09-13 | 1993-10-05 | Meco Equip Eng Bv | Selective electroplating method for strip member and apparatus therefor as well as production of masking belt used for its execution |
| CN102026491A (en) * | 2010-12-07 | 2011-04-20 | 深南电路有限公司 | Manufacturing process of whole gold-plated panel |
| CN102480844A (en) * | 2010-11-23 | 2012-05-30 | 深南电路有限公司 | Process for manufacturing diffusion coating prevention PCB (printed circuit board) gold-plated board |
| US20130105329A1 (en) * | 2010-08-02 | 2013-05-02 | Atotech Deutschland Gmbh | Method to form solder deposits and non-melting bump structures on substrates |
| CN105517364A (en) * | 2014-09-25 | 2016-04-20 | 深南电路有限公司 | Electrogilding method for printed circuit board |
-
2020
- 2020-11-18 CN CN202011294596.2A patent/CN112423483A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05255887A (en) * | 1991-09-13 | 1993-10-05 | Meco Equip Eng Bv | Selective electroplating method for strip member and apparatus therefor as well as production of masking belt used for its execution |
| US20130105329A1 (en) * | 2010-08-02 | 2013-05-02 | Atotech Deutschland Gmbh | Method to form solder deposits and non-melting bump structures on substrates |
| CN102480844A (en) * | 2010-11-23 | 2012-05-30 | 深南电路有限公司 | Process for manufacturing diffusion coating prevention PCB (printed circuit board) gold-plated board |
| CN102026491A (en) * | 2010-12-07 | 2011-04-20 | 深南电路有限公司 | Manufacturing process of whole gold-plated panel |
| CN105517364A (en) * | 2014-09-25 | 2016-04-20 | 深南电路有限公司 | Electrogilding method for printed circuit board |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210226 |
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| RJ01 | Rejection of invention patent application after publication |