CN105517364A - Electrogilding method for printed circuit board - Google Patents
Electrogilding method for printed circuit board Download PDFInfo
- Publication number
- CN105517364A CN105517364A CN201410497607.5A CN201410497607A CN105517364A CN 105517364 A CN105517364 A CN 105517364A CN 201410497607 A CN201410497607 A CN 201410497607A CN 105517364 A CN105517364 A CN 105517364A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- gold
- pcb
- plated region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electrogilding method for a printed circuit board, and aims at solving the problem in electrogilding cementation, improving the aligning precision of a connecting position between a gilding area and a non-gilding area, and improving the quality of the printed circuit board. The method comprises that a wet film is printed on the printed circuit board after electrocoppering and pre-baked; pattern transfer is carried out on the pre-baked printed circuit board, so that a non-gilding area and a gilding area covered by the wet film are obtained at the surface of the printed circuit board; the printed circuit board is baked in segment, so that an oxide layer is formed at the surface of the non-gilding area; the wet film at the surface of the printed circuit board is removed; a copper layer under the printed circuit board serves as an electrogilding lead to electrogild the printed circuit board; and micro-etching is carried out on the printed circuit board to remove the oxide layer at the surface of the non-gilding area.
Description
Technical field
The present invention relates to printed circuit board (PCB) (PCB, PrintedCircuitBoard) manufacture technology field, be specifically related to a kind of electrogilding method for printed circuit board (PCB).
Background technology
At present, PCB surface gold-plating technique can comprise the following steps:
A1, the figure that PCB makes gold-plated region and gold plated lead;
A2, stick dry film in non-gold-plated region, then gold-plated in gold-plated region;
A3, make non-gold-plated regional graphics;
A4, other coating operation of surface.
In above-mentioned technique, first making the gold-plated region on PCB, is first time graphic making; then dry film protection is sticked in non-gold-plated region, and gold-plated in the gold-plated region of not sticking dry film, then remove the dry film in non-gold-plated region; making the figure in non-gold-plated region, is second time graphic making.The successively graphic making of twice, by the problem causing gold-plated region and non-gold-plated joint area place to there is the aligning accuracy deviation of 2-4mil, if when there is fine and closely woven circuit in gold-plated region and non-gold-plated joint area place, then cannot at this junction electroplating lead.
Another PCB craft of gilding can comprise the following steps:
B1, with dry film cover non-gold-plated region, gold-plated in gold-plated region;
B2, PCB after gold-plated make figure.
In above-mentioned technique, the poor adhesive force of dry film, non-gold-plated region overlay is tight, causes occurring gold-platedly oozing the problem of crossing, and gold plating quality is poor.
Summary of the invention
For above-mentioned defect, embodiments provide a kind of electrogilding method for printed circuit board (PCB), adopt advanced oxidation processes, prevent from gold-platedly oozing the problem of crossing, and the aligning accuracy at gold-plated region and non-gold-plated joint area place is higher, improve printed circuit board (PCB) quality.
Embodiments provide a kind of electrogilding method for printed circuit board (PCB), comprising:
Printed circuit board (PCB) after electro-coppering prints wet film, and carries out prebake conditions;
Graphic transitions process is carried out to the printed circuit board (PCB) after prebake conditions, to make the gold-plated region obtaining non-gold-plated region and wet film covering in described printed circuit board surface;
Segmentation baking is carried out to described printed circuit board (PCB), to make to generate oxide layer in described non-gold-plated region surface;
Remove the wet film in described printed circuit board surface;
Using the layers of copper under described printed circuit board (PCB) as electroplating lead, to described printed circuit board electroplating;
To described printed circuit board (PCB) microetch, remove the oxide layer of described non-gold-plated region surface.
Further, comprise before described printed circuit board (PCB) after electro-coppering prints wet film: copper electroplating layer on the printed circuit board (PCB) after making internal layer figure, at least thick than the thickness of the preset need 5um of described copper layer thickness.
Particularly, describedly carry out Graphic transitions process to the printed circuit board (PCB) after prebake conditions, the gold-plated region covered to make to obtain non-gold-plated region and wet film in described printed circuit board surface comprises: utilize anti-gold-plated figure egative film exposure copper face to obtain non-gold-plated region on the printed circuit board and development copper face obtains gold-plated region.
As can be seen from the above technical solutions, the electrogilding method for printed circuit board (PCB) that the embodiment of the present invention provides has the following advantages: after the printed circuit board (PCB) being printed with electrogilding stamps wet film, carry out prebake conditions and Graphic transitions process, printed circuit board surface obtains the gold-plated region of non-gold-plated region and wet film covering, and then printed circuit board (PCB) segmentation is toasted, so that printed circuit board (PCB) can deep oxidation, generate oxide layer in above-mentioned non-gold-plated region surface, and gold-plated region can not be oxidized owing to being covered by wet film.Remove the wet film in this printed circuit board surface again; to this printed circuit board electroplating; now; non-gold-plated region surface have protect oxide layer cannot plated with nickel gold; can not cause between gold-plated region and non-gold-plated region and gold-platedly ooze the problem of crossing; the Line-width precision at gold-plated region and non-gold-plated joint area place can be improved, improve printed circuit board (PCB) quality.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme of the embodiment of the present invention, be briefly described to the accompanying drawing used required in the embodiment of the present invention below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The schematic flow sheet of the electrogilding method for printed circuit board (PCB) that Fig. 1 provides for the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing of the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiments providing a kind of electrogilding method for printed circuit board (PCB), for improving the Line-width precision at gold-plated region and non-gold-plated joint area place, improving gold plating quality.
With specific embodiment, the present invention will be described in detail below:
Refer to Fig. 1, the schematic flow sheet of the electrogilding method for printed circuit board (PCB) that Fig. 1 provides for the embodiment of the present invention; As shown in Figure 1, a kind of electrogilding method for printed circuit board (PCB) can comprise:
S101, printed circuit board (PCB) after electro-coppering print wet film, and carries out prebake conditions;
Printed circuit board (PCB) carries out inner figure making, matching board, lamination, boring, heavy copper and plating according to normal flow, copper layer thickness after plating 5um at least thicker in the copper layer thickness of preset need, to guarantee copper layer thickness can not be caused not enough after successive depths is oxidized rear and oxidation removal.
S102, Graphic transitions process is carried out to the printed circuit board (PCB) after prebake conditions, to make to obtain in described printed circuit board surface the gold-plated region that non-gold-plated region and wet film cover;
Be understandable that, Graphic transitions process mainly adopts anti-gold-plated figure egative film to printed circuit board to explosure-development.Gold-plated region is transmission region, and do not have gold-plated region to arrange and be in the light a little, the gold-plated region so after development is covered by wet film, and copper face is exposed in non-gold-plated region.
S103, carry out segmentation baking at described printed circuit board (PCB), to make to generate oxide layer in described non-gold-plated region surface;
Deep oxidation is carried out to the printed circuit board (PCB) after Graphic transitions process, specifically segmentation baking is carried out to printed circuit board (PCB).
Enough moisture is had in order to ensure during deep oxidation, before segmentation baking, spray last layer water smoke first on a printed circuit, make the moisture on printed circuit board (PCB) sufficient, meet deep oxidation needs, make the copper of non-gold-plated region surface fully oxidation reaction can occur.
Wherein, segmentation baking from left to right or is from right to left toasted piecemeal, to guarantee that the copper face exposed in the non-gold-plated region after Graphic transitions process can by deep oxidation.
Be understandable that, the materials such as oxygen, carbon dioxide and water in the copper now exposed in the gold-plated region of deep oxidation right and wrong and air react, and generate the oxide of the mixed type copper such as basic copper carbonate, cupric oxide, cuprous oxide.Wherein, reactive chemistry equation is as follows:
7Cu+4O
2+CO
2+2HO
2＝2Cu
2(OH)
2CO
3+CuO+Cu
2O
The thickness of mixed copper oxide that deep oxidation generates, at more than 2-3um, can resist general weak acid to wash, due to oxide cannot with nickel generation displacement reaction, protect non-gold-plated region can not plated with gold.
Preferably, the temperature of 80 DEG C can be adopted first to printed circuit board (PCB) segmentation baking 30min, again temperature is elevated to 120 DEG C again to printed circuit board (PCB) segmentation baking 60min, temperature is elevated to 150 DEG C once again afterwards, to printed circuit board (PCB) segmentation baking 60min, finally, then temperature is elevated to 200 DEG C, to printed circuit board (PCB) segmentation baking 30min.
S104, the wet film removed in described printed circuit board surface;
Preferably, can adopt the wet film in alkaline solution removal printed circuit board surface, gold-plated region, can not be oxidized when segmentation is toasted because there is wet film to protect.And alkaline solution can not impact the oxide in non-gold-plated region.
At printed circuit board (PCB) after above-mentioned process, by light contamination and can there is small amounts in the gold-plated region of printed circuit board surface, can adopt weak pickling unavoidably.
S105, using the layers of copper under described printed circuit board (PCB) as electroplating lead, to described printed circuit board electroplating;
Cannot plated with nickel gold due to the protection of non-gold-plated region Cu oxide, only can on gold-plated region plated with nickel gold, then can not to cause between gold-plated region and non-gold-plated region gold-plated oozes the problem of crossing.
S106, to described printed circuit board (PCB) microetch, remove the oxide layer of described non-gold-plated region surface.
Alternatively, the oxide layer generated after stronger microetch liquid medicine can be adopted to get rid of deep oxidation, exposes the layers of copper under non-gold-plated region.
After removal oxide layer, outer graphics making and packaging will be carried out according to normal flow to printed circuit board (PCB).
In the embodiment of the present invention, prebake conditions and Graphic transitions process is carried out after the printed circuit board (PCB) being printed with electrogilding stamps wet film, printed circuit board surface obtains the gold-plated region of non-gold-plated region and wet film covering, and then this printed circuit board (PCB) segmentation is toasted, generate oxide layer in above-mentioned non-gold-plated region surface, and gold-plated region can not be oxidized owing to being covered by wet film.Remove the wet film in this printed circuit board surface again; to this printed circuit board electroplating; now; non-gold-plated region surface have protect oxide layer cannot plated with nickel gold; can not cause between gold-plated region and non-gold-plated region and gold-platedly ooze the problem of crossing, the Line-width precision at gold-plated region and non-gold-plated joint area place can be improved.
Above a kind of electrogilding method for printed circuit board (PCB) provided by the present invention is described in detail, for one of ordinary skill in the art, according to the thought of the embodiment of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1., for an electrogilding method for printed circuit board (PCB), it is characterized in that, comprising:
Printed circuit board (PCB) after electro-coppering prints wet film, and carries out prebake conditions;
Graphic transitions process is carried out to the printed circuit board (PCB) after prebake conditions, to make the gold-plated region obtaining non-gold-plated region and wet film covering in described printed circuit board surface;
Segmentation baking is carried out to described printed circuit board (PCB), to make to generate oxide layer in described non-gold-plated region surface;
Remove the wet film in described printed circuit board surface;
Using the layers of copper under described printed circuit board (PCB) as electroplating lead, to described printed circuit board electroplating;
To described printed circuit board (PCB) microetch, remove the oxide layer of described non-gold-plated region surface.
2. electrogilding method according to claim 1, is characterized in that, comprises before described printed circuit board (PCB) after electro-coppering prints wet film:
Copper electroplating layer on printed circuit board (PCB) after making internal layer figure, at least thick than the thickness of the preset need 5um of described copper layer thickness.
3. electrogilding method according to claim 1 and 2, is characterized in that, describedly carries out Graphic transitions process to the printed circuit board (PCB) after prebake conditions, and the gold-plated region covered to make to obtain non-gold-plated region and wet film in described printed circuit board surface comprises:
Utilize anti-gold-plated figure egative film exposure copper face to obtain non-gold-plated region on the printed circuit board and obtain gold-plated region with development copper face.
4. electrogilding method according to claim 1 and 2, described to described printed circuit board (PCB) carry out segmentation baking comprise:
To described printed circuit board (PCB) spray water mist, and carry out segmentation baking.
5. electrogilding method according to claim 4, is characterized in that, described in carry out segmentation baking comprise:
Adopt 80 DEG C of segmentation baking 30min, 120 DEG C of segmentation baking 60min, 150 DEG C of segmentation baking 60min, 200 DEG C of segmentation baking 30min successively.
6. electrogilding method according to claim 1 and 2, is characterized in that, the wet film in the described printed circuit board surface of described removal comprises:
Alkaline solution is utilized to remove wet film in described printed circuit board surface.
7. electrogilding method according to claim 6, is characterized in that, comprises after the described wet film utilizing alkaline solution to remove in described printed circuit board surface:
Weak acid solution is adopted to clean described printed circuit board surface.
8. electrogilding method according to claim 1 and 2, is characterized in that, described described printed circuit board (PCB) microetch is removed to the oxide layer of described non-gold-plated region surface after comprise:
Outer graphics making is carried out to described printed circuit board (PCB).
9. electrogilding method according to claim 1, is characterized in that, described oxide layer comprises oxidation mixture, and described oxidation mixture comprises basic copper carbonate, cupric oxide, cuprous oxide.
10. electrogilding method according to claim 1, is characterized in that, the thickness of described oxide layer is 2-3um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410497607.5A CN105517364B (en) | 2014-09-25 | 2014-09-25 | A kind of electroplating gold method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410497607.5A CN105517364B (en) | 2014-09-25 | 2014-09-25 | A kind of electroplating gold method for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105517364A true CN105517364A (en) | 2016-04-20 |
| CN105517364B CN105517364B (en) | 2018-10-23 |
Family
ID=55724886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410497607.5A Active CN105517364B (en) | 2014-09-25 | 2014-09-25 | A kind of electroplating gold method for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105517364B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112423483A (en) * | 2020-11-18 | 2021-02-26 | 深圳市艾诺信射频电路有限公司 | Processing method of printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3924431B2 (en) * | 1999-05-06 | 2007-06-06 | 太陽インキ製造株式会社 | Solder resist ink composition |
| CN101820730A (en) * | 2010-03-30 | 2010-09-01 | 梅州博敏电子有限公司 | Method for preparing printed wiring board by selectively plating gold |
-
2014
- 2014-09-25 CN CN201410497607.5A patent/CN105517364B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3924431B2 (en) * | 1999-05-06 | 2007-06-06 | 太陽インキ製造株式会社 | Solder resist ink composition |
| CN101820730A (en) * | 2010-03-30 | 2010-09-01 | 梅州博敏电子有限公司 | Method for preparing printed wiring board by selectively plating gold |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112423483A (en) * | 2020-11-18 | 2021-02-26 | 深圳市艾诺信射频电路有限公司 | Processing method of printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105517364B (en) | 2018-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100557540B1 (en) | BGA package board and method for manufacturing the same | |
| CN104047041B (en) | Preparation method for printed circuit board | |
| CN103945660B (en) | Production technology for multilayer circuit board | |
| CN103582304A (en) | Transparent printed circuit board and manufacturing method thereof | |
| CN104427776B (en) | The manufacture method of negative and positive copper thickness printed wiring board | |
| CN101951728A (en) | Production method for replacing flexible circuit board with rigid circuit board | |
| CN101146407A (en) | Graph transfer shaping technology for carrier board circuit of printed circuit board | |
| CN106231816A (en) | A kind of manufacture method of golden fingerboard without lead wire | |
| TWI538590B (en) | Printed circuit board and method for manufacturing same | |
| CN103429008A (en) | Manufacture method of printed circuit board with via on pad | |
| CN104105361A (en) | Method for selective plating of conductive hole of circuit board | |
| JP2005322868A (en) | Method for electrolytic gold plating of printed circuit board | |
| CN101778542A (en) | Manufacturing method of PCB plate with copper pillar | |
| JP2006073984A (en) | Resistor built-in printed circuit board and its manufacturing method | |
| CN103796433A (en) | Manufacturing method of circuit board mixed surface process | |
| CN111511120B (en) | Raided Pad manufacturing method | |
| CN107567196A (en) | The hard golden plate preparation method of top layer NiPdAu bottom | |
| CN105376958B (en) | The surface treatment method of wiring board | |
| CN106852033A (en) | High precision part very high current printed circuit board processing method | |
| CN101511150B (en) | Gold plating technique for secondary line of PCB board | |
| CN103338592B (en) | A kind of buried resistor and processing technology thereof | |
| CN104320926A (en) | Surface processing method of circuit board | |
| CN110049625A (en) | It is a kind of with gold-plated and immersion process PCB plate production method | |
| CN110366322A (en) | A kind of processing method that copper base processes figure | |
| CN105517364A (en) | Electrogilding method for printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190128 Address after: 226000 No. 168 Hope Avenue, Nantong High-tech Zone, Jiangsu Province Patentee after: NANTONG SHENNAN CIRCUIT Co.,Ltd. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
|
| TR01 | Transfer of patent right |