GB9721706D0 - Printed circuit boards - Google Patents

Printed circuit boards

Info

Publication number
GB9721706D0
GB9721706D0 GBGB9721706.1A GB9721706A GB9721706D0 GB 9721706 D0 GB9721706 D0 GB 9721706D0 GB 9721706 A GB9721706 A GB 9721706A GB 9721706 D0 GB9721706 D0 GB 9721706D0
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
boards
printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GBGB9721706.1A
Other versions
GB2330289A8 (en
GB2330289A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ericsson OMC Ltd
Original Assignee
Ericsson OMC Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson OMC Ltd filed Critical Ericsson OMC Ltd
Priority to GB9721706A priority Critical patent/GB2330289A/en
Publication of GB9721706D0 publication Critical patent/GB9721706D0/en
Priority to PCT/GB1998/003077 priority patent/WO1999020088A1/en
Priority to AU94502/98A priority patent/AU9450298A/en
Priority to DE69803216T priority patent/DE69803216T2/en
Priority to CNB988100444A priority patent/CN1173610C/en
Priority to US09/529,312 priority patent/US6262392B1/en
Priority to EP98947662A priority patent/EP1025747B1/en
Publication of GB2330289A publication Critical patent/GB2330289A/en
Publication of GB2330289A8 publication Critical patent/GB2330289A8/en
Priority to HK01102659A priority patent/HK1032176A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization
GB9721706A 1997-10-13 1997-10-13 Heated printed circuit board Pending GB2330289A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB9721706A GB2330289A (en) 1997-10-13 1997-10-13 Heated printed circuit board
EP98947662A EP1025747B1 (en) 1997-10-13 1998-10-13 Printed circuit boards
PCT/GB1998/003077 WO1999020088A1 (en) 1997-10-13 1998-10-13 Printed circuit boards
AU94502/98A AU9450298A (en) 1997-10-13 1998-10-13 Printed circuit boards
DE69803216T DE69803216T2 (en) 1997-10-13 1998-10-13 PRINTED CIRCUITS
CNB988100444A CN1173610C (en) 1997-10-13 1998-10-13 Printed circuit boards
US09/529,312 US6262392B1 (en) 1997-10-13 1998-10-13 Printed circuit boards
HK01102659A HK1032176A1 (en) 1997-10-13 2001-04-12 Printed circuit boards.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9721706A GB2330289A (en) 1997-10-13 1997-10-13 Heated printed circuit board

Publications (3)

Publication Number Publication Date
GB9721706D0 true GB9721706D0 (en) 1997-12-10
GB2330289A GB2330289A (en) 1999-04-14
GB2330289A8 GB2330289A8 (en) 2000-06-16

Family

ID=10820491

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9721706A Pending GB2330289A (en) 1997-10-13 1997-10-13 Heated printed circuit board

Country Status (8)

Country Link
US (1) US6262392B1 (en)
EP (1) EP1025747B1 (en)
CN (1) CN1173610C (en)
AU (1) AU9450298A (en)
DE (1) DE69803216T2 (en)
GB (1) GB2330289A (en)
HK (1) HK1032176A1 (en)
WO (1) WO1999020088A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4344101B2 (en) * 2001-02-14 2009-10-14 Ｏｋｉセミコンダクタ株式会社 Wiring structure
US6423940B1 (en) * 2001-03-02 2002-07-23 Agilent Technologies, Inc. Temperature stabilization scheme for a circuit board
US6867391B2 (en) * 2002-10-24 2005-03-15 The Boeing Company Control system for electrostatic discharge mitigation
KR20040063589A (en) * 2003-01-08 2004-07-14 (주)정우이엔지 Printed circuit board using pattern heater and apparatus for controlling temperature of printed circuit board using the same
DE202005001163U1 (en) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Circuit board for circuitry subject to temperature fluctuations, has heating wire arranged on or in circuit board and connected to power supply
DE102006030268B4 (en) * 2006-06-30 2008-12-18 Advanced Micro Devices Inc., Sunnyvale Method for forming a semiconductor structure, in particular a FET
US7839157B2 (en) 2007-01-18 2010-11-23 Dfr Solutions, Llc Surface mount testing system
FR2938102A1 (en) * 2008-10-31 2010-05-07 Hager Security MODULE OF A MONITORING AND / OR ALARM SYSTEM WITH TEMPERATURE MEASUREMENT AND AMBIENT TEMPERATURE MEASUREMENT METHOD
US8445818B2 (en) * 2009-05-05 2013-05-21 Sierra Wireless, Inc. PCB quick heater
JP2013243263A (en) * 2012-05-21 2013-12-05 Internatl Business Mach Corp <Ibm> Combination of power supply and heat dissipation (cooling) in three-dimensional laminate package
US8981259B2 (en) 2012-07-24 2015-03-17 Mildef Crete Inc. Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
EP2693851A1 (en) * 2012-07-30 2014-02-05 Mildef Crete Inc. Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
KR102038427B1 (en) * 2012-09-28 2019-10-31 삼성전자 주식회사 A Method For Voltage Control based on Temperature and Electronic Device supporting the same
FR3034947B1 (en) 2015-04-13 2017-04-21 Commissariat Energie Atomique PRIMED CIRCUIT HEATING AND COOLING DEVICE FOR REGENERATING ELECTRONIC COMPONENTS SUBJECT TO RADIATION
US10372182B2 (en) 2017-01-13 2019-08-06 International Business Machines Corporation Reducing thermal cycling fatigue
US11224098B2 (en) * 2018-11-01 2022-01-11 General Electric Company Systems and methods for passive heating of temperature-sensitive electronic components
US11382178B2 (en) * 2019-06-27 2022-07-05 General Electric Company System and method for heating an electrical bus in an electrical cabinet for cold startup and condensation/frost control

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3289046A (en) * 1964-05-19 1966-11-29 Gen Electric Component chip mounted on substrate with heater pads therebetween
US3395265A (en) * 1965-07-26 1968-07-30 Teledyne Inc Temperature controlled microcircuit
US3440407A (en) * 1966-12-29 1969-04-22 Rca Corp Temperature controlled circuit boards
US3816702A (en) * 1972-06-26 1974-06-11 R Green Electronic isothermal device
DE2354719A1 (en) 1973-11-02 1975-05-15 Licentia Gmbh Temperature stabilisation device for components - is produced on nonconducting support by thick film or thin film method
DE2362567A1 (en) 1973-12-17 1975-06-19 Crl Electronic Bauelemente Temperature stabilised electronic cct. - consists of active and passive components with compensating temperature coefficients
JPS5635383A (en) * 1979-08-29 1981-04-08 Kyoto Ceramic Semiconductor integrated circuit support with heating mechanism
US4481403A (en) * 1983-03-04 1984-11-06 Honeywell Inc. Temperature control of solid state circuit chips
US5103071A (en) 1988-11-29 1992-04-07 Amp Incorporated Surface mount technology breakaway self regulating temperature heater
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
FR2646966B1 (en) * 1989-05-10 1996-02-02 Elf Aquitaine METHOD OF QUICK AND UNIFORM HEATING OF A MULTI-LAYER ASSEMBLY COMPRISING AT LEAST ONE THIN LAYER BASED ON A MACROMOLECULAR MATERIAL WITH INTERCALLED ION CONDUCTION BETWEEN TWO STRUCTURES WITH HIGH ELECTRON CONDUCTION
FR2668876B1 (en) * 1990-11-07 1992-12-24 Alcatel Espace ELECTRONIC TEMPERATURE CONTROL CIRCUIT.
GB9225260D0 (en) * 1992-12-03 1993-01-27 Int Computers Ltd Cooling electronic circuit assemblies
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
JP3224930B2 (en) * 1993-12-28 2001-11-05 株式会社東芝 Reproduction method of semiconductor device
GB9508631D0 (en) * 1995-04-28 1995-06-14 Smiths Industries Ltd Electrical circuits
US5574627A (en) * 1995-07-24 1996-11-12 At&T Global Information Solutions Company Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices
DE19613236A1 (en) 1996-04-02 1997-10-09 Coherent Adlas Gmbh & Co Kg Attached component module and method for attaching a component
US5896259A (en) * 1997-08-05 1999-04-20 Raytheon Company Preheating device for electronic circuits

Also Published As

Publication number Publication date
DE69803216D1 (en) 2002-02-21
CN1275306A (en) 2000-11-29
HK1032176A1 (en) 2001-07-06
GB2330289A8 (en) 2000-06-16
GB2330289A (en) 1999-04-14
CN1173610C (en) 2004-10-27
AU9450298A (en) 1999-05-03
EP1025747B1 (en) 2002-01-16
EP1025747A1 (en) 2000-08-09
WO1999020088A1 (en) 1999-04-22
DE69803216T2 (en) 2002-06-27
US6262392B1 (en) 2001-07-17

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)