SG100761A1 - Photosensitive thermosetting resin composition - Google Patents
Photosensitive thermosetting resin compositionInfo
- Publication number
- SG100761A1 SG100761A1 SG200106024A SG200106024A SG100761A1 SG 100761 A1 SG100761 A1 SG 100761A1 SG 200106024 A SG200106024 A SG 200106024A SG 200106024 A SG200106024 A SG 200106024A SG 100761 A1 SG100761 A1 SG 100761A1
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- thermosetting resin
- photosensitive thermosetting
- photosensitive
- composition
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200106024A SG100761A1 (en) | 2001-09-28 | 2001-09-28 | Photosensitive thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200106024A SG100761A1 (en) | 2001-09-28 | 2001-09-28 | Photosensitive thermosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
SG100761A1 true SG100761A1 (en) | 2003-12-26 |
Family
ID=32847158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200106024A SG100761A1 (en) | 2001-09-28 | 2001-09-28 | Photosensitive thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG100761A1 (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63312375A (en) * | 1987-06-16 | 1988-12-20 | Nippon Kayaku Co Ltd | Resin composition and solder resist resin composition therefrom |
EP0323563A2 (en) * | 1987-11-30 | 1989-07-12 | Taiyo Ink Manufacturing Co. Ltd. | Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof |
JPH09185167A (en) * | 1995-12-28 | 1997-07-15 | Taiyo Ink Mfg Ltd | Photosetting and thermosetting soldering resist ink composition |
JPH09255741A (en) * | 1996-03-22 | 1997-09-30 | Tamura Kaken Kk | Photosensitive resin composition, and cured coating thereof film and circuit board |
US5753722A (en) * | 1995-12-13 | 1998-05-19 | Taiyo Ink Manufacturing Co., Ltd. | Photocurable and thermosetting matte liquid resist composition |
WO2000000869A1 (en) * | 1998-06-26 | 2000-01-06 | Ciba Specialty Chemicals Holding Inc. | Photopolymerizable thermosetting resin compositions |
JP2000267275A (en) * | 1999-03-15 | 2000-09-29 | Tamura Kaken Co Ltd | Photosensitive resin composition and printed circuit board |
WO2000068740A1 (en) * | 1999-05-06 | 2000-11-16 | Taiyo Ink Manufacturing Co., Ltd. | Solder resist ink composition |
-
2001
- 2001-09-28 SG SG200106024A patent/SG100761A1/en unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63312375A (en) * | 1987-06-16 | 1988-12-20 | Nippon Kayaku Co Ltd | Resin composition and solder resist resin composition therefrom |
EP0323563A2 (en) * | 1987-11-30 | 1989-07-12 | Taiyo Ink Manufacturing Co. Ltd. | Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof |
US5753722A (en) * | 1995-12-13 | 1998-05-19 | Taiyo Ink Manufacturing Co., Ltd. | Photocurable and thermosetting matte liquid resist composition |
JPH09185167A (en) * | 1995-12-28 | 1997-07-15 | Taiyo Ink Mfg Ltd | Photosetting and thermosetting soldering resist ink composition |
JPH09255741A (en) * | 1996-03-22 | 1997-09-30 | Tamura Kaken Kk | Photosensitive resin composition, and cured coating thereof film and circuit board |
WO2000000869A1 (en) * | 1998-06-26 | 2000-01-06 | Ciba Specialty Chemicals Holding Inc. | Photopolymerizable thermosetting resin compositions |
JP2000267275A (en) * | 1999-03-15 | 2000-09-29 | Tamura Kaken Co Ltd | Photosensitive resin composition and printed circuit board |
WO2000068740A1 (en) * | 1999-05-06 | 2000-11-16 | Taiyo Ink Manufacturing Co., Ltd. | Solder resist ink composition |
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