SG100761A1 - Photosensitive thermosetting resin composition - Google Patents

Photosensitive thermosetting resin composition

Info

Publication number
SG100761A1
SG100761A1 SG200106024A SG200106024A SG100761A1 SG 100761 A1 SG100761 A1 SG 100761A1 SG 200106024 A SG200106024 A SG 200106024A SG 200106024 A SG200106024 A SG 200106024A SG 100761 A1 SG100761 A1 SG 100761A1
Authority
SG
Singapore
Prior art keywords
resin composition
thermosetting resin
photosensitive thermosetting
photosensitive
composition
Prior art date
Application number
SG200106024A
Inventor
Tzou Ming-Jen
Original Assignee
Nanya Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanya Plastics Corp filed Critical Nanya Plastics Corp
Priority to SG200106024A priority Critical patent/SG100761A1/en
Publication of SG100761A1 publication Critical patent/SG100761A1/en

Links

SG200106024A 2001-09-28 2001-09-28 Photosensitive thermosetting resin composition SG100761A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200106024A SG100761A1 (en) 2001-09-28 2001-09-28 Photosensitive thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200106024A SG100761A1 (en) 2001-09-28 2001-09-28 Photosensitive thermosetting resin composition

Publications (1)

Publication Number Publication Date
SG100761A1 true SG100761A1 (en) 2003-12-26

Family

ID=32847158

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200106024A SG100761A1 (en) 2001-09-28 2001-09-28 Photosensitive thermosetting resin composition

Country Status (1)

Country Link
SG (1) SG100761A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63312375A (en) * 1987-06-16 1988-12-20 Nippon Kayaku Co Ltd Resin composition and solder resist resin composition therefrom
EP0323563A2 (en) * 1987-11-30 1989-07-12 Taiyo Ink Manufacturing Co. Ltd. Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof
JPH09185167A (en) * 1995-12-28 1997-07-15 Taiyo Ink Mfg Ltd Photosetting and thermosetting soldering resist ink composition
JPH09255741A (en) * 1996-03-22 1997-09-30 Tamura Kaken Kk Photosensitive resin composition, and cured coating thereof film and circuit board
US5753722A (en) * 1995-12-13 1998-05-19 Taiyo Ink Manufacturing Co., Ltd. Photocurable and thermosetting matte liquid resist composition
WO2000000869A1 (en) * 1998-06-26 2000-01-06 Ciba Specialty Chemicals Holding Inc. Photopolymerizable thermosetting resin compositions
JP2000267275A (en) * 1999-03-15 2000-09-29 Tamura Kaken Co Ltd Photosensitive resin composition and printed circuit board
WO2000068740A1 (en) * 1999-05-06 2000-11-16 Taiyo Ink Manufacturing Co., Ltd. Solder resist ink composition

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63312375A (en) * 1987-06-16 1988-12-20 Nippon Kayaku Co Ltd Resin composition and solder resist resin composition therefrom
EP0323563A2 (en) * 1987-11-30 1989-07-12 Taiyo Ink Manufacturing Co. Ltd. Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof
US5753722A (en) * 1995-12-13 1998-05-19 Taiyo Ink Manufacturing Co., Ltd. Photocurable and thermosetting matte liquid resist composition
JPH09185167A (en) * 1995-12-28 1997-07-15 Taiyo Ink Mfg Ltd Photosetting and thermosetting soldering resist ink composition
JPH09255741A (en) * 1996-03-22 1997-09-30 Tamura Kaken Kk Photosensitive resin composition, and cured coating thereof film and circuit board
WO2000000869A1 (en) * 1998-06-26 2000-01-06 Ciba Specialty Chemicals Holding Inc. Photopolymerizable thermosetting resin compositions
JP2000267275A (en) * 1999-03-15 2000-09-29 Tamura Kaken Co Ltd Photosensitive resin composition and printed circuit board
WO2000068740A1 (en) * 1999-05-06 2000-11-16 Taiyo Ink Manufacturing Co., Ltd. Solder resist ink composition

Similar Documents

Publication Publication Date Title
EP1431822A4 (en) Positive photosensitive polyimide resin composition
EP1329769A4 (en) Positive photosensitive polyimide resin composition
GB2357293B (en) Photosensitive resin composition
HK1055802A1 (en) Photosensitive resin composition
EP1609024A4 (en) Novel photosensitive resin compositions
EP1602009A4 (en) Novel photosensitive resin compositions
TWI341438B (en) Novel photosensitive resin compositions
DE60222293D1 (en) HARDENABLE RESIN COMPOSITION
EP1087260A4 (en) Photosensitive resin composition
GB0122195D0 (en) Epoxy resin composition
SG104317A1 (en) Radiation-sensitive resin composition
EP1680711A4 (en) Novel photosensitive resin compositions
EP1434091A4 (en) Chemical-amplification-type positive radiation-sensitive resin composition
SG93928A1 (en) Electroconductive resin composition
AU2001233775A1 (en) Thermosetting resin composition
AU2003211755A1 (en) Photosensitive resin compositions
SG102656A1 (en) Positive photosensitive resin composition
GB0118296D0 (en) Resin application
GB2395485B (en) Resin composition
SG107144A1 (en) Epoxy resin composition
AU2003284604A1 (en) Thermosetting resin composition
AU2002350087A8 (en) Photopolymerizable epoxy composition
SG100761A1 (en) Photosensitive thermosetting resin composition
GB0316285D0 (en) Resin compositions
AU2002238903A1 (en) Photosensitive resin composition