AU2003211755A1 - Photosensitive resin compositions - Google Patents

Photosensitive resin compositions

Info

Publication number
AU2003211755A1
AU2003211755A1 AU2003211755A AU2003211755A AU2003211755A1 AU 2003211755 A1 AU2003211755 A1 AU 2003211755A1 AU 2003211755 A AU2003211755 A AU 2003211755A AU 2003211755 A AU2003211755 A AU 2003211755A AU 2003211755 A1 AU2003211755 A1 AU 2003211755A1
Authority
AU
Australia
Prior art keywords
photosensitive resin
resin compositions
compositions
photosensitive
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003211755A
Inventor
Takao Hirayama
Masayoshi Joumen
Hideyuki Katagi
Hidekazu Kondou
Yasuyuki Kurisaki
Kuniaki Satou
Toshizumi Yoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of AU2003211755A1 publication Critical patent/AU2003211755A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
AU2003211755A 2002-03-06 2003-03-06 Photosensitive resin compositions Abandoned AU2003211755A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002-60361 2002-03-06
JP2002060361 2002-03-06
JP2002-116542 2002-04-18
JP2002116542 2002-04-18
PCT/JP2003/002663 WO2003075095A1 (en) 2002-03-06 2003-03-06 Photosensitive resin compositions

Publications (1)

Publication Number Publication Date
AU2003211755A1 true AU2003211755A1 (en) 2003-09-16

Family

ID=27790984

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003211755A Abandoned AU2003211755A1 (en) 2002-03-06 2003-03-06 Photosensitive resin compositions

Country Status (4)

Country Link
JP (1) JP3928620B2 (en)
AU (1) AU2003211755A1 (en)
TW (1) TW200303895A (en)
WO (1) WO2003075095A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006267441A (en) * 2005-03-23 2006-10-05 Kyocera Chemical Corp Photosensitive thermosetting resin composition and flexible printed wiring board
JP2007248846A (en) * 2006-03-16 2007-09-27 Fujifilm Corp Photosensitive composition, film, and laminate, and permanent pattern forming method, permanent pattern, and printed circuit board
KR101175079B1 (en) * 2007-12-18 2012-08-21 아사히 가세이 이-매터리얼즈 가부시키가이샤 Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate
JP2010113241A (en) 2008-11-07 2010-05-20 Taiyo Ink Mfg Ltd Photosetting resin composition, dry film and cured product of the same, and printed wiring board using them
JP5620656B2 (en) * 2009-08-19 2014-11-05 太陽ホールディングス株式会社 Photocurable resin composition
JP5495297B2 (en) * 2009-09-01 2014-05-21 太陽ホールディングス株式会社 Alkali-developable photocurable resin composition, dry film and cured product thereof, and printed wiring board using them
JP5982798B2 (en) * 2011-12-01 2016-08-31 三菱レイヨン株式会社 Method for producing polyester (meth) acrylate
JP5540165B1 (en) * 2013-06-28 2014-07-02 太陽インキ製造株式会社 Photocurable resin composition, cured product thereof and printed wiring board
JP5632978B1 (en) * 2013-06-28 2014-11-26 太陽インキ製造株式会社 Photocurable composition and cured product thereof
JP2013225151A (en) * 2013-07-09 2013-10-31 Taiyo Holdings Co Ltd Photosensitive resin composition, dry film and cured material of the same, and printed wiring board using the same
JP7363036B2 (en) * 2019-01-25 2023-10-18 東亞合成株式会社 (Meth)acrylate manufacturing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0912654A (en) * 1995-06-26 1997-01-14 Nippon Kayaku Co Ltd Energy-ray-curable resin composition and its cured item
US6583198B2 (en) * 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
JPH11288087A (en) * 1998-04-03 1999-10-19 Hitachi Chem Co Ltd Photosensitive resin composition
JP2002023363A (en) * 2000-07-13 2002-01-23 Dainippon Ink & Chem Inc Resin composition for photolithography

Also Published As

Publication number Publication date
JP3928620B2 (en) 2007-06-13
TW200303895A (en) 2003-09-16
JPWO2003075095A1 (en) 2005-06-30
WO2003075095A1 (en) 2003-09-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase