CN104470237A - Drill dirt removing method for rigid-flexible combined board - Google Patents
Drill dirt removing method for rigid-flexible combined board Download PDFInfo
- Publication number
- CN104470237A CN104470237A CN201410687894.6A CN201410687894A CN104470237A CN 104470237 A CN104470237 A CN 104470237A CN 201410687894 A CN201410687894 A CN 201410687894A CN 104470237 A CN104470237 A CN 104470237A
- Authority
- CN
- China
- Prior art keywords
- except
- sol solution
- rigid
- adjusting agent
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Abstract
The invention relates to the field of production of rigid-flexible combined circuit boards, in particular to a drill dirt removing method for a rigid-flexible combined board. The concrete method includes the steps that after the circuit board is drilled, a potassium permanganate method is used for adhesive removal, then a PI regulator is used for adhesive removal, and therefore drill dirt is cleared away thoroughly. The drill dirt removing method has the advantages that resin adhesive and polyimide can be disposed of at the same time, the problem caused by copper nodules on a flexible printed circuit board layer is effectively solved, and the product yield is increased; compared with plasma method cleaning, the cleaning efficiency is improved by about 28%, and the working efficiency is improved; the PI regulator used in the method is low in price, and therefore the production cost is effectively reduced.
Description
Technical field
The present invention relates to flexible and hard combined circuit board production field, specifically a kind of method of Rigid Flex Drill dirt cleaning.
Background technology
In the production of Rigid Flex, need to clear up brill dirt residual after boring.At present, what industry was comparatively conventional is permanganimetric method Drill dirt cleaning, namely in strong alkali solution, by potassium permanganate strong oxidizing property, the chemical bond in resin system is opened, make resin molten in strong basicity liquor potassic permanganate, controlled by the length of time, both the chip that boring produces was removed completely, and made again hole wall smooth.But permanganimetric method can only work to the glue of resin one class, does not have aggressiveness to polyimides.So when producing Rigid Flex, often because occurring that soft board layer hole wall occurs copper knurl because boring dirt except not falling, the quality of product can be affected.
At present, can not remove the problem of polyimides for solving above-mentioned permanganimetric method, industry many employings plasma cleaning, namely uses CF
4and O
2deng the plasma gas cleaning of mixing.Plasma cleaning is regardless of type of substrate, can dispose resin glue and polyimides simultaneously, solves the generation of soft board layer copper knurl.But plasma cleaning adopts CF
4, O
2, H
2deng gas, costly, and cleaning needs special equipment, and disposal ability is also unsatisfactory.Therefore be badly in need of a kind of, can be effective fast, and the more cheap method except desmearing.
Summary of the invention
Goal of the invention: for the problems referred to above, the object of this invention is to provide a kind of can fast effectively and production cost cheaper bore dirty method except Rigid Flex.
Technical scheme: for solving the problem, the invention provides:
Rigid Flex is except boring a dirty method, and after permanganimetric method is except glue, carry out PI adjusting agent except glue, its concrete steps are as follows:
(1) preparation is except sol solution: PI adjusting agent solution and KOH powder are dropped in distilled water and stir, and obtains described except sol solution;
(2) heat: adopt heating tube mode, the described sol solution that removes is heated to 45 DEG C-55 DEG C;
(3) soak: by described except 1.5min in sol solution except the wiring board after glue is immersed in through potassium permanganate.
Further, above-mentioned except in sol solution, each concentration of component is respectively: PI adjusting agent 30%-50% (v/v), KOH30g/L-50g/L.
Preferably, except in sol solution, each concentration of component is respectively: PI adjusting agent 40% (v/v), KOH 40g/L.
Preferably, in above-mentioned heating steps, except sol solution is heated to 50 DEG C
Beneficial effect: compared with prior art, simultaneously advantage of the present invention can dispose resin glue and polyimides, efficiently solves the problem of the generation of soft board layer copper knurl, improves product yield; Comparatively plasma method cleaning, cleaning efficiency improves about 28%, improves operating efficiency; In method, PI adjusting agent used, cheap, effectively reduces production cost.
Embodiment
Below in conjunction with specific embodiment, illustrate the present invention further, these embodiments should be understood only be not used in for illustration of the present invention and limit the scope of the invention, after having read the present invention, the amendment of those skilled in the art to the various equivalent form of value of the present invention has all fallen within the application's claims limited range.
Embodiment 1
Rigid Flex, except boring a dirty method, first removes the glue slag of resin one class by conventional permanganimetric method, then carries out PI adjusting agent except glue, and its concrete steps are as follows:
(1) preparation is except sol solution: 4LPI adjusting agent and 400gKOH powder are dropped in 6L distilled water and stir, and makes to remove in sol solution, and the concentration of PI adjusting agent is the concentration of 40% (v/v), KOH is 40g/L; After preparing, solution is poured in rinse bath;
(2) heating: adopt heating tube mode, being heated to 50 DEG C by removing sol solution in rinse bath;
(3) soak: be immersed in except 1.5min in sol solution by the wiring board removed after glue through potassium permanganate, the brill removed further in boring is dirty, and emphasis removes the residual glue slag in internal layer soft board place.
Embodiment 2
Rigid Flex, except boring a dirty method, first removes the glue slag of resin one class by conventional permanganimetric method, then carries out PI adjusting agent except glue, and its concrete steps are as follows:
(1) preparation is except sol solution: 3L PI adjusting agent and 300g KOH powder are dropped in 7L distilled water and stir, and makes to remove in sol solution, and the concentration of PI adjusting agent is the concentration of 30% (v/v), KOH is 30g/L; After preparing, solution is poured in rinse bath;
(2) heating: adopt heating tube mode, being heated to 55 DEG C by removing sol solution in rinse bath;
(3) soak: be immersed in except 1.5min in sol solution by the wiring board removed after glue through potassium permanganate, the brill removed further in boring is dirty, and emphasis removes the residual glue slag in internal layer soft board place.
Embodiment 3
Rigid Flex, except boring a dirty method, first removes the glue slag of resin one class by conventional permanganimetric method, then carries out PI adjusting agent except glue, and its concrete steps are as follows:
(1) preparation is except sol solution: 5L PI adjusting agent and 500g KOH powder are dropped in 5L distilled water and stir, and makes to remove in sol solution, and the concentration of PI adjusting agent is the concentration of 50% (v/v), KOH is 50g/L; After preparing, solution is poured in rinse bath;
(2) heating: adopt heating tube mode, being heated to 45 DEG C by removing sol solution in rinse bath;
(3) soak: be immersed in except 1.5min in sol solution by the wiring board removed after glue through potassium permanganate, the brill removed further in boring is dirty, and emphasis removes the residual glue slag in internal layer soft board place.
Adopt this kind except boring dirty method, the brill thoroughly can removing boring is dirty, and make not form copper knurl in boring, improve the yield of product, rate of reducing the number of rejects and seconds, saves production cost.
Claims (4)
1. Rigid Flex is except boring a dirty method, comprises potassium permanganate except glue, it is characterized in that: also comprise PI adjusting agent except glue, concrete steps are as follows:
(1) preparation is except sol solution: PI adjusting agent solution and KOH powder are dropped in distilled water and stir, and obtains described except sol solution;
(2) heat: the described sol solution that removes is heated to 45 DEG C-55 DEG C;
(3) soak: by described except 1.5min in sol solution except the wiring board after glue is immersed in through potassium permanganate.
2. a kind of Rigid Flex according to claim 1 is except boring dirty method, it is characterized in that: in described step (1), except sol solution each component concentration is: PI adjusting agent 30%-50% (v/v), KOH 30g/L-50g/L.
3. a kind of Rigid Flex according to claim 1 and 2 is except boring dirty method, and described sol solution each component concentration of removing is: PI adjusting agent 40% (v/v), KOH 40g/L.
4. a kind of Rigid Flex according to claim 1 is except boring dirty method, it is characterized in that: in described step (2), solution is heated to 50 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410687894.6A CN104470237A (en) | 2014-11-25 | 2014-11-25 | Drill dirt removing method for rigid-flexible combined board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410687894.6A CN104470237A (en) | 2014-11-25 | 2014-11-25 | Drill dirt removing method for rigid-flexible combined board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104470237A true CN104470237A (en) | 2015-03-25 |
Family
ID=52915377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410687894.6A Pending CN104470237A (en) | 2014-11-25 | 2014-11-25 | Drill dirt removing method for rigid-flexible combined board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104470237A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108174533A (en) * | 2017-12-29 | 2018-06-15 | 柏承科技(昆山)股份有限公司 | Anti- holes Rigid Flex electroplating technology |
| CN109219262A (en) * | 2018-09-13 | 2019-01-15 | 镇江华印电路板有限公司 | A kind of efficient Rigid Flex is except boring dirty method |
| CN109462945A (en) * | 2018-12-21 | 2019-03-12 | 深圳市景旺电子股份有限公司 | A kind of multilayer soft board removes gluing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985040A (en) * | 1998-09-21 | 1999-11-16 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
| CN101754593A (en) * | 2008-12-02 | 2010-06-23 | 北京华兴太极信息科技有限责任公司 | Pretreatment technology of flex-rigid multiple-layer printed board hole metallization |
| CN102438405A (en) * | 2011-11-29 | 2012-05-02 | 电子科技大学 | Method for cleaning through hole smears of rigid-flexible printed circuit board |
-
2014
- 2014-11-25 CN CN201410687894.6A patent/CN104470237A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985040A (en) * | 1998-09-21 | 1999-11-16 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
| CN101754593A (en) * | 2008-12-02 | 2010-06-23 | 北京华兴太极信息科技有限责任公司 | Pretreatment technology of flex-rigid multiple-layer printed board hole metallization |
| CN102438405A (en) * | 2011-11-29 | 2012-05-02 | 电子科技大学 | Method for cleaning through hole smears of rigid-flexible printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108174533A (en) * | 2017-12-29 | 2018-06-15 | 柏承科技(昆山)股份有限公司 | Anti- holes Rigid Flex electroplating technology |
| CN109219262A (en) * | 2018-09-13 | 2019-01-15 | 镇江华印电路板有限公司 | A kind of efficient Rigid Flex is except boring dirty method |
| CN109462945A (en) * | 2018-12-21 | 2019-03-12 | 深圳市景旺电子股份有限公司 | A kind of multilayer soft board removes gluing method |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150325 |
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| WD01 | Invention patent application deemed withdrawn after publication |