CN105624681B - The method of electronic component and a kind of etching agent in a kind of wet separation waste printed circuit board - Google Patents
The method of electronic component and a kind of etching agent in a kind of wet separation waste printed circuit board Download PDFInfo
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- CN105624681B CN105624681B CN201610139425.XA CN201610139425A CN105624681B CN 105624681 B CN105624681 B CN 105624681B CN 201610139425 A CN201610139425 A CN 201610139425A CN 105624681 B CN105624681 B CN 105624681B
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- circuit board
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- printed circuit
- highly basic
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/40—Alkaline compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/06—Obtaining tin from scrap, especially tin scrap
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention discloses a kind of methods of electronic component in wet separation waste printed circuit board, include the following steps：Highly basic and complexing agent are dissolved in the water to obtain solution I, a concentration of 150~300g/L of highly basic, a concentration of 20~40g/L of complexing agent；It will be put into above-mentioned solution I after waste printed circuit board cleaning, drying, oxidant is added into solution I with 0.5~2.5% flow per minute that solution I volume is added under the conditions of 30 DEG C~70 DEG C and is stirred to react 20~40min, filtering, i.e., detach electronic component with circuit board.This method separating rate is fast, damages small, suitable commercial Application to electronic component.Include aqueous solution and the oxidant dissolved with highly basic and complexing agent the invention also discloses a kind of etching agent, oxidant the etching agent using when be persistently added in the aqueous solution of highly basic and complexing agent.The etching agent ingredient is simple, corrosivity is small, is easy to extraction recycling valuable metal.
Description
Technical field
The invention belongs to electronics member devices in scrap concrete technical field more particularly to a kind of wet separation waste printed circuit board
The method of part and a kind of etching agent.
Background technology
With the fast development of electronics and information industry, the update speed of electronic product is gradually accelerated, electronic waste
Processing has become the whole world one of problem urgently to be resolved hurrily.Circuit board is one of most important component part of electronic device, currently, state
The interior renewable resources about printed circuit board are handled, and mostly concentrate on the material recovery research of printed circuit board and its element, right
It is less that the element separated carries out function reuse consideration.Wiring board over-assemble has the electronics such as a large amount of resistance, capacitance, IC chip
Device, when using material recovery as target, because different wiring board materials form different, to be obtained after crushing, detaching material groups
Divide and material purity is often inconsistent, especially component part in part contains poisonous and harmful substance and precious metal, is mingled in powder
It is difficult to be kept completely separate in end, limits reusing for material.When electronic product is scrapped, still there is a large amount of electricity on circuit board
Sub- component does not reach life service life, can be continuing with, in order to which the part component in useless circuit board can be weighed
It is multiple to utilize, it needs nondestructively to remove the component in useless circuit board, key divests at component and circuit board binding site
Scolding tin.
Currently, China's electron wastes object recycle distribution centre --- Guangdong Gui Yu mostly uses greatly heat gun pair
Need the element removed to heat, after melts soldering tin, apply certain external force manual removal component using tool, wherein 90% with
On element can be continuing with, but inefficiency, and will produce volatile poisonous and harmful substance when scolding tin fast melt.
Currently, tin soldering liquid on the market is mainly used for the production link of circuit board, i.e. printed circuit board has been etched in image
Cheng Hou, will be originally used for the tin-lead of protection image or the coating of tin removes, such as patent CN101760743A (publication date
2010.6.30 it proposes) and in patent CN101407914A (publication date 2009.4.15) and is shelled in printed wire board manufacturing process
Except the tin stripping liquid of process of tin, key component includes nitric acid, ferric nitrate, corrosion inhibiter etc., the tin stripping liquid corrosivity of the acid system
It is relatively strong, if for detaching electronic component, it is larger to component's feet damage, cause the component removed direct
It reuses.Patent CN1422982A (publication date 2003.6.11) proposes a kind of acid tin-lead stripper, main component include nitric acid,
Hydrochloric acid, activator, stabilizer etc., not only corrosivity is strong for the system, and complicated component, after moving back tin in liquid extract tin difficulty compared with
Greatly.
In addition, also having a kind of tin stripping liquid to be used to various types Electroplating Tin Set conductive rollers at present moves back tin, such as patent
CN103255418A (publication date 2012.02.17) proposes a kind of pickling etching agent, key component include sodium sulphate, sodium chloride,
Malic acid etc.；Patent CN1619013 proposes a kind of alkaline etching agent, and key component includes sodium hydroxide, lead acetate, plumbous acid
Sodium, sodium nitrate etc., it includes sodium hydroxide, m-nitro first that patent CN04060269, which proposes a kind of alkaline etching agent main component,
Acid etc., these three etching agent oxidisability are very weak, if for detaching electronic component, it is very slow to move back tin speed.
It is presently used for the rare report of tin stripping liquid of scolding tin on removing waste printed circuit board.Using the tin stripping liquid of nitric acid system come
The electronic component of separation waste printed circuit board easily causes component damage, and complicated component, it is difficult to which after moving back tin there is extraction in liquid
Valence metal；It is weak using the more mild etching agent oxidisability of some other condition, it is slower to move back tin speed.
Invention content
The technical problem to be solved by the present invention is to overcome the shortcomings of to mention in background above technology and defect, provide one
Kind separating rate is fast, damages electronic component the method and one kind of electronic component in small wet separation waste printed circuit board
Ingredient is simple, moves back that tin speed is fast, corrosivity is small, is easily recycled the etching agent of valuable metal.
In order to solve the above technical problems, technical solution proposed by the present invention is：
The method of electronic component, includes the following steps in a kind of wet separation waste printed circuit board：
(1) highly basic and complexing agent are dissolved in the water to obtain solution I；
(2) by waste printed circuit board cleaning, it is dry after be put into step (1) acquired solution I, under the conditions of 30 DEG C~70 DEG C with
Oxidant is added into solution I and is stirred to react 20~40min for 0.5~2.5% flow per minute that solution I volume is added,
Supersonic oscillations solution is used simultaneously, is filtered after the completion of reaction, i.e., by the electronic component and circuit on the waste printed circuit board
Plate detaches.
During moving back tin, tin is mainly with Sn2+Form exist in solution.Due to Sn2+It is easy the oxidation being added into
Oxygen etc. in agent or air is oxidized to Sn4+, and Sn4+Facile hydrolysis generates β-stannic acid precipitation, eventually leads to β-stannic acid and is attached to weldering
On tin, the dissolving of scolding tin is influenced.The present invention uses the side for being continuously added into oxidant with certain flow into solution I in processing
Metallic tin is oxidized to Sn by formula2+, the oxidisability avoided when being added at one time oxidant into solution I due to system is too strong,
Sn2+It is oxidized to Sn4+And then the case where influencing scolding tin dissolving；Supersonic oscillations solution, ultrasound are used while mechanical agitation
The high-frequency oscillation signal that wave producer generates, is converted into the mechanical oscillating wave of high frequency and travels in solution, make solvent ceaselessly
In flow regime, to improve the solution rate of scolding tin；In addition, complexing agent is added in the present invention in solution I, Sn can be made2+Hair
Raw complexing, promotes the dissolving of scolding tin；Furthermore the present invention uses the etching agent of alkaline system, compared to traditional using acid body
Tin method is moved back by system, and method corrosivity smaller of the invention is less to the damage of electronic component pin.Side using the present invention
Method detaches electronic component in waste printed circuit board, and scolding tin dissolution rate is not less than 83%, and component separation rate is not less than 80%, damage
Rate is no more than 10%.
The method of electronic component in above-mentioned wet separation waste printed circuit board, it is preferred that in the step (2), oxidation
Agent is tert-butyl hydroperoxide or hydrogen peroxide.Using hydrogen peroxide or tert-butyl hydroperoxide as oxidant, by scolding tin oxygen
Turn to Sn2+, excessive hydrogen peroxide or tert-butyl hydroperoxide are decomposed into H in strong basicity system2O and O2, O2Formed bubble from
It opens and moves back tin system, avoid oxidant further by Sn2+It is oxidized to Sn4+And influence scolding tin dissolving.
The method of electronic component in above-mentioned wet separation waste printed circuit board, it is preferred that in the step (2), Xiang Rong
The flow that oxidant is added in liquid I is the 1~2% of addition solution I volume per minute.Oxidant (tertiary butyl is added with the flow
Hydrogen peroxide or hydrogen peroxide), not only can guarantee it is good move back tin effect, but also can avoid tert-butyl hydroperoxide or hydrogen peroxide adds
Enter excessive velocities, cause its decomposition rate in strong alkali solution too fast, generate a large amount of bubbles, tin effect is moved back in influence.
The method of electronic component in above-mentioned wet separation waste printed circuit board, it is preferred that in the step (1), highly basic
For one or both of sodium hydroxide or potassium hydroxide, a concentration of 150~300g/L of highly basic in the solution I.Using hydrogen
As highly basic, price is relatively cheap for sodium oxide molybdena and/or potassium hydroxide.
The method of electronic component in above-mentioned wet separation waste printed circuit board, it is preferred that in the step (1), complexing
Agent is one or more, a concentration of 20~40g/L of the solution I complexing agent in EDTA, sodium citrate or potassium citrate.
Using EDTA, sodium citrate or potassium citrate as complexing agent, can effectively with Sn2+Complexing promotes scolding tin dissolving.
The method of electronic component in above-mentioned wet separation waste printed circuit board, it is preferred that in the solution I, highly basic
A concentration of 200~250g/L, a concentration of 30~40g/L of complexing agent.Highly basic and complexing agent can get good in this concentration range
Good separating effect.
The inventive concept total as one, another aspect of the present invention provide a kind of etching agent, including dissolved with highly basic and network
The aqueous solution of mixture, the etching agent further include oxidant, and the oxidant is continued when the etching agent is used with certain flow
It is added in the aqueous solution of the highly basic and complexing agent.Oxidant is continuously added into the water of highly basic and complexing agent with certain flow
It in solution, rather than disposably adds, is can avoid because of oxidant excess, by Sn in advance2+It is oxidized to Sn4+And influence scolding tin
Dissolving.
Above-mentioned etching agent, it is preferred that the oxidant is tert-butyl hydroperoxide or hydrogen peroxide, and the oxidant adds
Be added to flow in the aqueous solution of highly basic and complexing agent be it is per minute be added the highly basic and complexing agent aqueous solution volume 0.5~
2.5%.Using tert-butyl hydroperoxide or hydrogen peroxide as oxidant, while ensureing good oxidation effect, excessive oxidation
Agent can decompose in strong basicity system generates oxygen, is detached from moves back tin system in the form of bubbles；Oxidant is added with the flow can be with
Tin effect is preferably moved back in acquisition.
Above-mentioned etching agent, it is preferred that the highly basic be one or both of sodium hydroxide or potassium hydroxide, highly basic
A concentration of 150~300g/L.
Above-mentioned etching agent, it is preferred that the complexing agent is one kind or more in EDTA, sodium citrate or potassium citrate
Kind, a concentration of 20~40g/L of complexing agent.
Compared with the prior art, the advantages of the present invention are as follows：
It (1), will be in waste and old circuit board on electronic component in a manner of oxidant routinely is added by certain flow
Metallic tin be oxidized to Sn2+, so that scolding tin is dissolved, on the one hand avoid excessive oxidant by Sn2+Further aoxidize Sn4+And shadow
Ring scolding tin solution rate；On the other hand, oxidant (tert-butyl hydroperoxide or hydrogen peroxide) is avoided in strong alkali solution
Decomposition rate is too fast, generates a large amount of bubbles, and tin effect is moved back in influence.
(2) tert-butyl hydroperoxide or hydrogen peroxide is used to add as oxidant, tert-butyl hydroperoxide or hydrogen peroxide
It can be Sn by solder oxidation to enter after system2+, and excessive tert-butyl hydroperoxide or hydrogen peroxide then divide in strong basicity system
Solution is H2O and O2, oxygen formation bubble, which leaves, moves back tin system, makes to move back the suitable oxidant concentration of tin system maintenance.
(3) by the way that the addition complexing agents such as EDTA or citrate in tin system are moved back, when moving back tin, the complexing agent can be with Sn2+
Complex compound is formed, promotes scolding tin dissolving, and then improve and move back tin effect.
(4) high-frequency oscillation signal generated using supersonic oscillations solution, supersonic generator while mechanical agitation,
It is converted into the mechanical oscillating wave of high frequency and travels in solution, solvent is made ceaselessly to be in flow regime, to efficiently dissolve
Scolding tin.
(5) etching agent ingredient of the present invention is simple, is easy to from moving back tin treated extraction recycling valuable metal in solution, and
The etching agent is smaller to electronic component damage, and the electronic component after separation can re-use.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described.
Fig. 1 is the photo of waste printed circuit board before moving back tin separation in the embodiment of the present invention 1.
Fig. 2 is the photo of the waste printed circuit board after moving back tin separation in the embodiment of the present invention 1.
Specific implementation mode
To facilitate the understanding of the present invention, present invention work more comprehensively, is meticulously described below in conjunction with preferred embodiment,
But the protection scope of the present invention is not limited to the following specific embodiments.
Unless otherwise defined, all technical terms used hereinafter and the normally understood meaning of those skilled in the art
It is identical.Technical term used herein is intended merely to the purpose of description specific embodiment, is not intended to the limitation present invention
Protection domain.
Unless otherwise specified, various raw material, reagent, the instrument and equipment etc. used in the present invention can pass through city
Field is commercially available or can be prepared by existing method.
Embodiment 1
The method of electronic component and the embodiment of etching agent in a kind of wet separation waste printed circuit board of the present invention, including with
Lower step：
1) reagent is configured：Sodium hydroxide and sodium citrate is soluble in water, and it is 200g/L, lemon to be configured to naoh concentration
Lemon acid na concn is the solution I of 20g/L, and the volume of the solution I is 500ml.
2) tin separation is moved back：The discarded desktop computer circuit boards of 6cm × 6cm with electronic component are cleaned, are dried
After be put into 500ml solution Is, be placed in the solution I of waste printed circuit board to above-mentioned with the flow of 2.5mL/min under the conditions of 30 DEG C
Tert-butyl hydroperoxide is added and is sufficiently stirred, while using ultrasonic oscillation solution, processing is filtered after 30 minutes, by electronics member
Device is detached with circuit board, counts the dissolution rate of scolding tin, the separation rate of component and spoilage.Its scolding tin dissolution rate is
83.7%, component separation rate is 80%, spoilage 0%.The photo for moving back the preceding waste printed circuit board of tin separation is as shown in Figure 1；Through
The photo of waste printed circuit board after tin detaches is moved back as shown in Fig. 2, as shown in Figure 2, the separating effect of electronic component is bright after processing
It is aobvious.
Embodiment 2
The method of electronic component and the embodiment of etching agent in a kind of wet separation waste printed circuit board of the present invention, including with
Lower step：
1) reagent is configured：Sodium hydroxide and sodium citrate is soluble in water, and it is 250g/L, lemon to be configured to naoh concentration
Lemon acid potassium concn is the solution I of 30g/L, and the volume of the solution I is 500ml.
2) tin separation is moved back：The discarded desktop computer circuit boards of 6cm × 6cm with electronic component are cleaned, are dried
After be put into 500ml solution Is, be placed in the solution I of waste printed circuit board to above-mentioned with the flow of 4mL/min under the conditions of 50 DEG C plus
Enter hydrogen peroxide and be sufficiently stirred, while using ultrasonic oscillation solution, processing is filtered after 30 minutes, by electronic component and electricity
Road plate separation, counts the dissolution rate of scolding tin, the separation rate of component and spoilage.Its scolding tin dissolution rate is 93.5%, component
Separation rate is 90%, spoilage 10%.
Embodiment 3
The method of electronic component and the embodiment of etching agent in a kind of wet separation waste printed circuit board of the present invention, including with
Lower step：
1) reagent is configured：Sodium hydroxide and sodium citrate is soluble in water, and it is 250g/L, lemon to be configured to naoh concentration
Lemon acid na concn is the solution I of 40g/L, and the volume of the solution I is 500ml.
2) tin separation is moved back：The discarded desktop computer circuit boards of 6cm × 6cm with electronic component are cleaned, are dried
After be put into 500ml solution Is, be placed in the solution I of waste printed circuit board to above-mentioned with the flow of 6mL/min under the conditions of 70 DEG C plus
Enter tert-butyl hydroperoxide and be sufficiently stirred, while using ultrasonic oscillation solution, processing is filtered after 30 minutes, by electronics member device
Part is detached with circuit board, counts the dissolution rate of scolding tin, the separation rate of component and spoilage.Its scolding tin dissolution rate is 100%, member
Device isolation rate is 100%, spoilage 10%.
Embodiment 4
The method of electronic component and the embodiment of etching agent in a kind of wet separation waste printed circuit board of the present invention, including with
Lower step：
1) reagent is configured：Sodium hydroxide and EDTA is soluble in water, and it is 150g/L to be configured to naoh concentration, and EDTA is dense
Degree is the solution I of 25g/L, and the volume of the solution I is 500ml.
2) tin separation is moved back：The discarded desktop computer circuit boards of 6cm × 6cm with electronic component are cleaned, are dried
After be put into 500ml solution Is, be placed in the solution I of waste printed circuit board to above-mentioned with the flow of 2.5mL/min under the conditions of 40 DEG C
Be added hydrogen peroxide simultaneously be sufficiently stirred, while use ultrasonic oscillation solution, processing 30 minutes after filter, by electronic component with
Circuit board detaches, and counts the dissolution rate of scolding tin, the separation rate of component and spoilage.Its scolding tin dissolution rate is 86.9%, first device
Part separation rate is 80%, spoilage 0%.
Embodiment 5
The method of electronic component and the embodiment of etching agent in a kind of wet separation waste printed circuit board of the present invention, including with
Lower step：
1) reagent is configured：Sodium hydroxide and EDTA is soluble in water, and it is 225g/L to be configured to concentration of potassium hydroxide, and EDTA is dense
Degree is the solution I of 35g/L, and the volume of the solution I is 500ml.
2) tin separation is moved back：The discarded desktop computer circuit boards of 6cm × 6cm with electronic component are cleaned, are dried
After be put into 500ml solution Is, be placed in the solution I of waste printed circuit board to above-mentioned with the flow of 5mL/min under the conditions of 60 DEG C plus
Enter tert-butyl hydroperoxide and be sufficiently stirred, while using ultrasonic oscillation solution, processing is filtered after 30 minutes, by electronics member device
Part is detached with circuit board, counts the dissolution rate of scolding tin, the separation rate of component and spoilage.Its scolding tin dissolution rate is 95.3%,
Component separation rate is 90%, spoilage 10%.
Embodiment 6
The method of electronic component and the embodiment of etching agent in a kind of wet separation waste printed circuit board of the present invention, including with
Lower step：
1) reagent is configured：Potassium hydroxide and potassium citrate is soluble in water, and it is 300g/L, lemon to be configured to concentration of potassium hydroxide
Lemon acid potassium concn is the solution I of 38g/L, and the volume of the solution I is 500ml.
2) tin separation is moved back：The discarded desktop computer circuit boards of 6cm × 6cm with electronic component are cleaned, are dried
After be put into 500ml solution Is, be placed in the solution I of waste printed circuit board to above-mentioned with the flow of 10mL/min under the conditions of 65 DEG C
Tert-butyl hydroperoxide is added and is sufficiently stirred, while using ultrasonic oscillation solution, processing is filtered after 30 minutes, by electronics member
Device is detached with circuit board, counts the dissolution rate of scolding tin, the separation rate of component and spoilage.Its scolding tin dissolution rate is
98.5%, component separation rate is 100%, spoilage 10%.
Embodiment 7
The method of electronic component and the embodiment of etching agent in a kind of wet separation waste printed circuit board of the present invention, including with
Lower step：
1) reagent is configured：Sodium hydroxide and sodium citrate is soluble in water, and it is 225g/L to be configured to naoh concentration,
The volume of the solution I of a concentration of 35g/L of EDTA, the solution I is 500ml.
2) tin separation is moved back：The discarded desktop computer circuit boards of 6cm × 6cm with electronic component are cleaned, are dried
After be put into 500ml solution Is, be placed in the solution I of waste printed circuit board to above-mentioned with the flow of 7.5mL/min under the conditions of 50 DEG C
Tert-butyl hydroperoxide is added and is sufficiently stirred, while using ultrasonic oscillation solution, processing is filtered after 30 minutes, by electronics member
Device is detached with circuit board, counts the dissolution rate of scolding tin, the separation rate of component and spoilage.Its scolding tin dissolution rate is
94.9%, component separation rate is 90%, spoilage 10%.
Embodiment 8
The method of electronic component and the embodiment of etching agent in a kind of wet separation waste printed circuit board of the present invention, including with
Lower step：
1) reagent is configured：Sodium hydroxide and potassium citrate is soluble in water, and it is 300g/L, lemon to be configured to naoh concentration
Lemon acid potassium concn is the solution I of 40g/L, and the volume of the solution I is 500ml.
2) tin separation is moved back：The discarded desktop computer circuit boards of 6cm × 6cm with electronic component are cleaned, are dried
After be put into 500ml solution Is, with the flow of 12.5mL/min to the above-mentioned solution I for being placed with waste printed circuit board under the conditions of 30 DEG C
Middle addition hydrogen peroxide is simultaneously sufficiently stirred, while using ultrasonic oscillation solution, and processing is filtered after 30 minutes, by electronic component
It is detached with circuit board, counts the dissolution rate of scolding tin, the separation rate of component and spoilage.Its scolding tin dissolution rate is 85.7%, member
Device isolation rate is 80%, spoilage 0%.
Claims (9)
1. the method for electronic component, includes the following steps in a kind of wet separation waste printed circuit board：
(1) highly basic and complexing agent are dissolved in the water to obtain solution I；
(2) it will be put into step (1) acquired solution I after waste printed circuit board cleaning, drying, with every point under the conditions of 30 DEG C~70 DEG C
Oxidant is added into solution I and is stirred to react 20~40min for 0.5~2.5% flow that solution I volume is added in clock, simultaneously
It using supersonic oscillations solution, is filtered after the completion of reaction, i.e., by the electronic component and circuit board point on the waste printed circuit board
From the oxidant is tert-butyl hydroperoxide or hydrogen peroxide.
2. the method for electronic component in wet separation waste printed circuit board according to claim 1, it is characterised in that：It is described
In step (2), the flow that oxidant is added into solution I is the 1~2% of addition solution I volume per minute.
3. the method for electronic component in wet separation waste printed circuit board according to claim 1, it is characterised in that：It is described
In step (1), highly basic is one or both of sodium hydroxide or potassium hydroxide, a concentration of the 150 of highly basic in the solution I~
300g/L。
4. the method for electronic component in wet separation waste printed circuit board according to claim 1, it is characterised in that：It is described
It is one or more in complexing agent EDTA, sodium citrate or potassium citrate in step (1), the solution I complexing agent it is dense
Degree is 20~40g/L.
5. the method for electronic component, feature exist in the wet separation waste printed circuit board according to claim 1 or 3 or 4
In：In the solution I, a concentration of 200~250g/L of highly basic, a concentration of 30~40g/L of complexing agent.
6. a kind of etching agent includes the aqueous solution dissolved with highly basic and complexing agent, it is characterised in that：The etching agent further includes oxidation
Agent, the oxidant the etching agent using when be persistently added in the aqueous solution of the highly basic and complexing agent, the oxidant
For tert-butyl hydroperoxide or hydrogen peroxide.
7. etching agent according to claim 6, it is characterised in that：The oxidant is added to the water-soluble of highly basic and complexing agent
Flow in liquid is the 0.5~2.5% of the addition per minute highly basic and complexing agent aqueous solution volume.
8. etching agent according to claim 6, it is characterised in that：The highly basic is one in sodium hydroxide or potassium hydroxide
Kind or two kinds, a concentration of 150~300g/L of highly basic.
9. etching agent according to claim 6, it is characterised in that：The complexing agent is EDTA, sodium citrate or citric acid
It is one or more in potassium, a concentration of 20~40g/L of complexing agent.
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| CN106216792B (en) * | 2016-08-22 | 2018-12-21 | 中南大学 | A method of all kinds of components of clean separation and tin is recycled from discarded circuit board |
| CN109536965B (en) * | 2018-12-06 | 2021-03-26 | 江苏矽研半导体科技有限公司 | Tin stripping agent for removing poor tin coating of semiconductor packaging part and preparation method thereof |
| CN114346350A (en) * | 2022-01-13 | 2022-04-15 | 常州大学 | Method and device for stripping soldering tin of waste circuit board components |
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| CN104060269A (en) * | 2014-05-29 | 2014-09-24 | 深圳振华富电子有限公司 | Tin-stripping agent, preparation method of tin-stripping agent and tin-stripping method |
| CN105112674A (en) * | 2015-09-18 | 2015-12-02 | 中南大学 | All-wet recovery process for waste circuit boards |
| CN105312705A (en) * | 2015-12-09 | 2016-02-10 | 清华大学 | Method for digesting soldering tin from waste circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104060269A (en) * | 2014-05-29 | 2014-09-24 | 深圳振华富电子有限公司 | Tin-stripping agent, preparation method of tin-stripping agent and tin-stripping method |
| CN105112674A (en) * | 2015-09-18 | 2015-12-02 | 中南大学 | All-wet recovery process for waste circuit boards |
| CN105312705A (en) * | 2015-12-09 | 2016-02-10 | 清华大学 | Method for digesting soldering tin from waste circuit board |
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| CN105624681A (en) | 2016-06-01 |
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Effective date of registration: 20210824 Address after: 411300 Shaoshan high tech Industrial Development Zone, Xiangtan City, Hunan Province (at the junction of Hongqi Road and Lianhua Road) Patentee after: HUNAN JIANGYE ELECTRICAL AND MECHANICAL TECHNOLOGY Co.,Ltd. Address before: 410000 Zuojialuo Mountain, Yuelu District, Changsha City, Hunan Province Patentee before: CENTRAL SOUTH University |