CN103934536B - A kind of method that discarded printed circuit boards welding component is disassembled - Google Patents
A kind of method that discarded printed circuit boards welding component is disassembled Download PDFInfo
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- CN103934536B CN103934536B CN201410198162.0A CN201410198162A CN103934536B CN 103934536 B CN103934536 B CN 103934536B CN 201410198162 A CN201410198162 A CN 201410198162A CN 103934536 B CN103934536 B CN 103934536B
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- printed circuit
- acid solution
- solution
- circuit boards
- circuit board
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The present invention relates to a kind of method that discarded printed circuit boards welding component is disassembled, first discarded printed circuit boards is cleaned up, remove surface impurity, drying processes, then discarded printed circuit boards is placed in the acid solution that configured in advance is good, and adding hydrogen peroxide oxidant to this acid solution, agitating solution is so as to complete reaction；When the sealing-off rate reduction of acid solution, oxytropism solution continues to add hydrogen peroxide oxidant, after the scolding tin of circuit board surface to be printed is completely dissolved, the electronic devices and components taking out circuit board and container bottom are rinsed well, change acid solution and metal in spent acid is reclaimed。It is short that the inventive method dissolves the sealing-off time, environmental protection, and safety is high, pollutes few；Side-product after disassembling carries out resource reutilization, and waste acid liquor can be used as electroplate liquid；Efficiently solving the energy consumption that printed circuit board (PCB) routine disassembling method brings high, temperature is high, and treating capacity is low, pollutes big, dangerous strong, the shortcomings such as component damage degree is big。
Description
Technical field
The present invention relates to a kind of method that discarded printed circuit boards welding component is disassembled, belong to metal environmental protection and reclaim, utilize technical field。
Background technology
Printed circuit board (PCB) is as the supporter of electronic devices and components electrical connection in electric equipment products, the value of its recycling is in that the recycling to wherein rare, noble metal, but if components and parts therein can be removed safely when disassembling and the manufacture in other products can be continuing with, this extends life cycle undoubtedly and also saves the cost of recycling。
Along with the quickening of various electric equipment products update speed, and the arrival of use time limit, increasing electric equipment products are eliminated, if these discarded printed circuit board (PCB)s are abandoned, cause waste and the carrying capacity of environment of metals resources。But on these discarded printed circuit board (PCB)s, components and parts major part can utilize (low side) by secondary, and this saves the cost manufactured from raw material undoubtedly。From the angle of salvage material relative to extracting these metals from raw ore, energy consumption abandoned printed circuit board carrying out recycling required is less, the secondary amount of waste produced in removal process is also few, good environmental benefit and economic benefit can be obtained, reach save resource, garbage decrement and reduce the multipurposes such as environmental pollution。
At present, discarded printed circuit boards main flow disassembling technology is after tin melting furnace is melted, it to be carried out components and parts disassemble, and also has employing line cutting, thermal conductive silicon wet goods investigative technique。But this disassembling method temperature is high, efficiency is low, polluting big, dangerous strong, components and parts serviceability rate is low。How quick, safe disassemble discarded printed circuit boards, be the encountered common issue of whole electron wastes industry。
Summary of the invention
The invention discloses a kind of method that discarded printed circuit boards welding component is disassembled, on printed circuit board (PCB), components and parts are mainly perforation, attachment etc. with the connected mode of substrate。The study find that the employing molten weldering of acidic leach, be possible not only to reach to disassemble purpose, and the acid solution of molten postwelding can as the utilization of resources, effectively overcome that the disassembling method temperature that prior art exists is high, efficiency is low, pollute big, dangerous strong, the drawbacks such as components and parts serviceability rate is low。The inventive method has quickly, environmental protection, and safety is high, and polluting less and strip liquid can as advantages such as electroplate liquid uses。
The technical scheme is that and be achieved in that:
A kind of method that discarded printed circuit boards welding component is disassembled; it is by discarded printed circuit boards being immersed in the acid solution containing a kind of oxidant; the plumber's solder on waste and old printed circuit board is made to dissolve thus promoting welding component to come off, it is achieved components and parts and substrate are separated and recovered from the environmental protection recycling method of electronic devices and components；It is characterized in: first discarded printed circuit boards is cleaned up, remove surface impurity, drying processes, then discarded printed circuit boards is placed in the acid solution that configured in advance is good, and add hydrogen peroxide oxidant to this acid solution, agitating solution is so as to complete reaction, and the temperature range reacted is 20 DEG C～50 DEG C；When the sealing-off rate reduction of acid solution, oxytropism solution continues to add hydrogen peroxide oxidant, after the scolding tin of circuit board surface to be printed is completely dissolved, the electronic devices and components taking out circuit board and container bottom are rinsed well, when solution not re-dissolved solder, change acid solution and metal in spent acid carried out electrolytic recovery or is used as electroplate liquid。
Described acid solution is HBF4, and acid concentration is 25%～50%。
Described hydrogen peroxide oxidant concentration in an acidic solution is 10%～20%。
The present invention adopts HBF4, and acid concentration is relatively low, and the oxidant of use-hydrogen peroxide end product is water, and acid solution composition impact is less, environment is not polluted and makes consumption few。
Reaction in the present invention is heated without external heat source, reduces energy consumption。
The time span that solder consumption is dissolved in described reaction is 10～60 minutes。
Acid solution in the present invention mainly dissolves plumber's solder and other metals insoluble, copper can be cemented out by the dissolving of a small amount of copper by interpolation plumber's solder, it is then filtered off copper or in solution, directly adds copper screening agent, so the ultimate constituent after acid reagent use is simple, and easily recycle brazing metal and acid solution, solution-treated is simple, and resource degree is high, pollute few, thus reducing the cost processed in disposal process。
The present invention is dissolved sealing-off required time short, molten weldering is fast, environmental protection, and safety is high, pollute less and also restored acid solution can use as electroplate liquid, side-product after disassembling carries out resource reutilization, efficiently solves the energy consumption height that printed circuit board (PCB) routine disassembling method brings, and temperature is high, treating capacity is low, pollute big, dangerous strong, the shortcomings such as component damage degree is big。
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described in detail, but embodiment is not limited to the present invention, the analog structure of every employing present invention, method and similar change thereof, all should list protection scope of the present invention in。
[embodiment 1]
First waste and old printed circuit board is cleaned and remove surface impurity, it is placed in the acid solution HBF4 that the good concentration of configured in advance is 25% after drying, and addition concentration is the hydrogen peroxide oxidant of 10% in this acid solution, then solution is stirred so as to complete reaction, after the scolding tin of circuit board surface to be printed is completely dissolved, the electronic devices and components taking out circuit board and container bottom are rinsed well, in solution, hydrogen peroxide oxidant is added when the sealing-off rate reduction of solution, until solution not re-dissolved solder, now change acid solution and metal in spent acid carried out electrolytic recovery or is used as electroplate liquid。
[embodiment 2]
First waste and old printed circuit board is cleaned and remove surface impurity, it is placed in the acid solution HBF4 that the good concentration of configured in advance is 35%, and addition concentration is the hydrogen peroxide oxidant of 15% in this acid solution, then solution is stirred so as to complete reaction, after the scolding tin of circuit board surface to be printed is completely dissolved, the electronic devices and components taking out circuit board and container bottom are rinsed well, in solution, hydrogen peroxide oxidant is added when the sealing-off rate reduction of solution, until solution not re-dissolved solder, now change acid solution and metal in spent acid carried out electrolytic recovery or is used as electroplate liquid。
[embodiment 3]
First waste and old printed circuit board is cleaned and remove surface impurity, it is placed in the acid solution HBF4 that the good concentration of configured in advance is 50%, and addition concentration is the hydrogen peroxide oxidant of 20% in this acid solution, then solution is stirred so as to complete reaction, after the scolding tin of circuit board surface to be printed is completely dissolved, the electronic devices and components taking out circuit board and container bottom are rinsed well, in solution, hydrogen peroxide oxidant is added when the sealing-off rate reduction of solution, until solution not re-dissolved solder, now change acid solution and metal in spent acid carried out electrolytic recovery or is used as electroplate liquid。
Claims (2)
1. the method that discarded printed circuit boards welding component is disassembled; it is by discarded printed circuit boards being immersed in a kind of acid solution containing oxidant; the plumber's solder on waste and old printed circuit board is made to dissolve so that welding component comes off, it is achieved components and parts and substrate are separated and recovered from the environmental protection recycling method of electronic devices and components；It is characterized in that: first discarded printed circuit boards is removed surface impurity, be subsequently placed in the acid solution that configured in advance is good, and add hydrogen peroxide oxidant to this acid solution, agitating solution is so as to complete reaction, and reaction temperature is 20 DEG C～50 DEG C；Continuing to add hydrogen peroxide oxidant when the sealing-off rate reduction of acid solution in solution, after the scolding tin of circuit board surface to be printed is completely dissolved, the electronic devices and components taking out circuit board and container bottom are rinsed well, and jack components and parts external force is removed gently；When solution not re-dissolved solder, change acid solution and metal in spent acid carried out electrolytic recovery or directly uses as electroplate liquid；Described acid solution is HBF4, acid concentration is 25%～50%。
2. a kind of method that discarded printed circuit boards welding component is disassembled according to claim 1, it is characterised in that: described hydrogen peroxide oxidant concentration in an acidic solution is 10%～20%。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410198162.0A CN103934536B (en) | 2014-05-12 | 2014-05-12 | A kind of method that discarded printed circuit boards welding component is disassembled |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410198162.0A CN103934536B (en) | 2014-05-12 | 2014-05-12 | A kind of method that discarded printed circuit boards welding component is disassembled |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103934536A CN103934536A (en) | 2014-07-23 |
| CN103934536B true CN103934536B (en) | 2016-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410198162.0A Active CN103934536B (en) | 2014-05-12 | 2014-05-12 | A kind of method that discarded printed circuit boards welding component is disassembled |
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| CN (1) | CN103934536B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625286A (en) * | 2015-01-23 | 2015-05-20 | 上海第二工业大学 | Waste printed circuit board wet-type disassembling method |
| CN105312705A (en) * | 2015-12-09 | 2016-02-10 | 清华大学 | Method for digesting soldering tin from waste circuit board |
| CN105396865A (en) * | 2015-12-09 | 2016-03-16 | 上海大学 | Method for removing components of waste circuit board by virtue of ultrasonically-assisted acidic compound solvent |
| CN106455337A (en) * | 2016-11-30 | 2017-02-22 | 福建工程学院 | Method for removing tin-lead solder from waste circuit board |
| CN107385236B (en) * | 2017-07-31 | 2019-09-03 | 邦兴国际顾问有限公司 | A method of processing having electronic component wiring board and stanniferous waste material |
| CN110883396A (en) * | 2019-11-15 | 2020-03-17 | 西安居正知识产权运营管理有限公司 | Printed circuit board desoldering separation method |
| CN111729880A (en) * | 2020-07-22 | 2020-10-02 | 清远市进田企业有限公司 | High-efficient cleaning equipment of abandonment circuit board |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB976167A (en) * | 1962-04-06 | 1964-11-25 | Standard Telephones Cables Ltd | Method of producing a printed circuit board |
| US4175011A (en) * | 1978-07-17 | 1979-11-20 | Allied Chemical Corporation | Sulfate-free method of etching copper pattern on printed circuit boards |
| US4306933A (en) * | 1980-02-11 | 1981-12-22 | Chemline Industries | Tin/tin-lead stripping solutions |
| CH679158A5 (en) * | 1989-07-20 | 1991-12-31 | Recytec S A C O Orfigest S A | |
| JPH1046368A (en) * | 1996-07-31 | 1998-02-17 | Ebara Densan:Kk | Solder removing solution |
| KR20130099948A (en) * | 2010-08-20 | 2013-09-06 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | Sustainable process for reclaiming precious metals and base metals from e-waste |
| CN102240663A (en) * | 2011-04-13 | 2011-11-16 | 深圳市格林美高新技术股份有限公司 | Method for separating and recycling rare noble metals and waste plastics in waste circuit board |
| CN102191383B (en) * | 2011-04-22 | 2012-10-10 | 深圳市格林美高新技术股份有限公司 | Treatment method for waste printed circuit board |
| CN102169091B (en) * | 2011-05-23 | 2012-06-06 | 同济大学 | Method for analyzing and measuring typical metal in circuit board of discarded electrical equipment |
| CN102643988B (en) * | 2012-04-13 | 2013-07-10 | 西南科技大学 | Method for leaching metallic copper from waste printed circuit board by using ionic liquid |
| CN103071662B (en) * | 2012-12-14 | 2015-02-18 | 清华大学 | Environmentally friendly method for rapidly disassembling waste circuit board through applying [BMIm]BF4 |
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| CN103934536A (en) | 2014-07-23 |
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