GB976167A - Method of producing a printed circuit board - Google Patents

Method of producing a printed circuit board

Info

Publication number
GB976167A
GB976167A GB1335662A GB1335662A GB976167A GB 976167 A GB976167 A GB 976167A GB 1335662 A GB1335662 A GB 1335662A GB 1335662 A GB1335662 A GB 1335662A GB 976167 A GB976167 A GB 976167A
Authority
GB
United Kingdom
Prior art keywords
solder
board
coating
resist
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1335662A
Inventor
John Duckles Underwood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB1335662A priority Critical patent/GB976167A/en
Publication of GB976167A publication Critical patent/GB976167A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

976,167. Etching. STANDARD TELEPHONES & CABLES Ltd. April 5, 1963 [April 6, 1962], No. 13356/62. Heading B6J. [Also in Division H1] In a method of producing a printed circuit, a coating of solder is applied to a conductive coating previously attached to a board, after which portions of the solder coating and the conductive coating are removed to leave a pattern of conductive material coated with solder, preferably a 60:40 alloy of Sn:Pb. Preferably the board carries a coating of high purity copper which is cleaned, coated with flux, and tinned in a roller solder-coating machine at 220-270‹ C., any ridge of solder at the trailing edge of the board being removed mechanically. The solder surface is then washed, rubbed with moist lime, rinsed, dried, and degreased. The board is immersed, first in photo-resist, then in metal etch resist, being dried and heated after each immersion; the coated surface is then exposed to a carbon arc lamp through a transparency representing the desired circuit pattern, and is developed in trichlorethylene vapour. Alternatively, two coatings of photo-resist may be applied to the board, exposure being to a mercury vapour lamp; the board is developed in cold trichlorethylene, then dyed in a dye bath developer. Other methods may be used to apply an etch-resist e.g. silk screening. The unwanted solder is then removed by an etchant comprising:- Fluoboric acid (40 part w/v.) 250 ml. Hydrogen peroxide (100 vol.) 50 ml. Distilled water to one litre. Alternatively, the solder may be etched in ferric chloride solution in the presence of dilute sulphuric acid, or ferric nitrate; to monitor the progress of etching the copper coating is used as one electrode, another electrode being gold, the potential between the electrodes being measured; a sharp fall in potential indicates that the solder has been etched away, and a second, smaller, drop,. when the solder-copper alloy layer is penetrated, denotes the termination of the etch, and may be used to indicate, e.g. by flashing a light, or to remove the board. The unwanted copper is removed by a second etching step in, e.g., an agitated solution of ammonium persulphate (250g. with distilled water to 11.) at 60‹ C., or at 45‹ C. in a spray of ammonium persulphate, or in an etchant comprising 100g. chromic acid in 50 ml. H 2 SO 4 of s.g. 1.84. The resist is removed and moist lime is rubbed over the board surface, which is then degreased, washed and dried.
GB1335662A 1962-04-06 1962-04-06 Method of producing a printed circuit board Expired GB976167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1335662A GB976167A (en) 1962-04-06 1962-04-06 Method of producing a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1335662A GB976167A (en) 1962-04-06 1962-04-06 Method of producing a printed circuit board

Publications (1)

Publication Number Publication Date
GB976167A true GB976167A (en) 1964-11-25

Family

ID=10021473

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1335662A Expired GB976167A (en) 1962-04-06 1962-04-06 Method of producing a printed circuit board

Country Status (1)

Country Link
GB (1) GB976167A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3517382A1 (en) * 1984-06-18 1985-12-19 Kapsch Ag, Wien AGENTS FOR CHEMICAL SURFACE TREATMENT OF METALS
CN103934536A (en) * 2014-05-12 2014-07-23 上海第二工业大学 Method for disassembling welded components of waste printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3517382A1 (en) * 1984-06-18 1985-12-19 Kapsch Ag, Wien AGENTS FOR CHEMICAL SURFACE TREATMENT OF METALS
FR2566001A1 (en) * 1984-06-18 1985-12-20 Kapsch Ag AGENT FOR THE CHEMICAL SURFACE TREATMENT OF METALS
CN103934536A (en) * 2014-05-12 2014-07-23 上海第二工业大学 Method for disassembling welded components of waste printed circuit board

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