CN107385236B - A method of processing having electronic component wiring board and stanniferous waste material - Google Patents
A method of processing having electronic component wiring board and stanniferous waste material Download PDFInfo
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- CN107385236B CN107385236B CN201710638824.5A CN201710638824A CN107385236B CN 107385236 B CN107385236 B CN 107385236B CN 201710638824 A CN201710638824 A CN 201710638824A CN 107385236 B CN107385236 B CN 107385236B
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- tin
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- wiring board
- processing
- waste material
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/06—Obtaining tin from scrap, especially tin scrap
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/04—Obtaining tin by wet processes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention belongs to substance separation technology fields, disclose a kind of method of processing having electronic component wiring board and stanniferous waste material, immersion or backwashing manner of the method using chemical agent, the tin on surface is removed, on the one hand make that electronic component tin connects partly because the removal of tin, and electronic component is made to loosen or directly fall；On the other hand the tin on wiring board and component is completely removed, is kept completely separate tin, carried out tin below and recycle completely.Having electronic component wiring board and stanniferous waste material effectively can be carried out 100% separation by the present invention, the generation of noxious material dioxin is excluded completely, design automation production line flow process, carry out the processing of high-volume batchization and operation, it reduces the spending of manpower while improving treating capacity, the recycling that electronic component or ground can be improved reduces other following process and purity problem.
Description
Technical field
The invention belongs to substance separation technology field more particularly to a kind of processing having electronic component wiring boards and stanniferous useless
The method of material.
Background technique
It is with physics at present for the isolation technics of processing having electronic component wiring board and stanniferous waste material in industry market
Tin is dissolved under liquid metal situation when reaching 180~240 DEG C Celsius using the molten point temperature of tin, allows tin stream by heating method
It takes out out or by electronic component, reaches separating effect.
In the way of being taken out in a manner of physical heating and separating electronic component, since it is desired that higher temperature, can make portion
Divide electronic component to damage because of high temperature, also results in the situation that PCB bottom plate or ground are burnt, and cause stench, and
Therefore the material of electronic component or PCB containing plastics can also lead to the problem of noxious material " dioxin " and pollute.
Operationally, because of heating operation and the technique of separation, a large amount of manpowers are needed, therefore treating capacity is by very big
It restricts, in quantization production, there is very big problem；The molten mode for moving back tin of heating, because of the tensioned problem in liquid tin face, the liquid of tin
Body can not be kept completely separate, and be easy to remain on PCB bottom plate or electronic component, and the tin isolated is only about on 60%~70% left side
The right side reduces tin and efficiently separates recycling possibility, and the problem for causing following process very big improves the cost of operation or purifying.
Existing processing mode is dissolved tin with hot tin stove heating in industry at present, using manually extracting electronic component
Separation, because of 180~240 DEG C of the solution temperature of tin, under this state metallic tin become liquid, allow electronic component loosen and
It is separated, but this mode must use and largely manually carry out pulling out electronic component work, not be available producing line design
And largely operate to carry out disadvantage, and stench and noxious material is caused to occur in heating process, artificial palpus for a long time is close useless
It is operated on gas occurring source, therefore worker can largely suck the noxious material of generation, improve sick probability.Furthermore each worker must lean on
Manual operations influences output because of factors such as the habits, gimmick and efficiency of operator so that processing procedure control on, need to pay compared with
Big cost is not suitable for effective production keyholed back plate and the design of processing procedure volume production.
In conclusion problem of the existing technology is:
1) it is handled with heating method, dioxin can be generated because of high temperature；
2) heating method is handled, and be easy to cause the damage of electronic component；
3) metallic tin can not be completely removed and be recycled；
4) biggish space and manpower are needed；
5) operator must direct contact stain occurring source.
6) it in the prior art, is handled using wet chemical, there are still:
Metallic tin dissolution takes a long time, and if it is the thicker situation of scolding tin or tin layers, needs the longer time；
In order to accelerate dissolution time, it be easy to cause the excessive corrosion or destruction of other substances；
The white tin state of oxidation is formed after tin dissolution, and is easy to form protective film in undissolved tin surfaces, and causing can not
Continue to dissolve；
Having electronic component wiring board and stanniferous waste material etc., thickness, state and the content of tin have very big difference possibility,
Cause treatment conditions difference big, so that process operations are difficult to design and overcome.
Summary of the invention
In order to solve the problems existing in the prior art, the present invention provides a kind of processing having electronic component wiring boards and stanniferous
The method of waste material.The prior art uses hot tin furnace mode, without using wet chemical treatment mode of the present invention to handle having electronic
Component wiring board.
The invention is realized in this way a method of processing having electronic component wiring board and stanniferous waste material, the place
The method for managing having electronic component wiring board and stanniferous waste material handles electronics member device wiring board using wet chemical, specific to wrap
It includes:
A, level-one moves back tin liquid medicine immersion process, comprising:
1) it hangs in processing solution tank, tin metal starts reaction dissolution；
2) electronic component melting because of tin metal, and start to loosen or fall into hanging basket；
3) set reaction time reach after, will hanging basket hang out；
B, second level moves back tin liquid medicine immersion process, comprising:
A) hanging basket second level is hung in move back in molten tin bath；
B) because tin thickness is different, move back tin using second level, will thicker or also stripping completely tin stripping completely；
C) after the completion of stripping, hanging basket is hung out；
D) it hangs out into back segment and washes processing procedure；
C, clear water spray washing process is divided into spray washing and washing by soaking, specifically includes:
One) spray washing in the way of shower directly by high concentration liquid medicine remain wash out, and using water circulation shower and
Water reuse mode reduces water consumption；
Two) washing by soaking after high concentration heated medical elutes, is soaked in clear water after spray woods washing, by hole and keeps away
Exempt from the waste that spray washing can not be cleaned thoroughly to wash out, and use two clear water soaking and water washings, washing water imports water reclaiming system；
Three) automatic blow-dry is carried out after the completion of washing to drip program；
Four) after the completion of manufacturing process for cleaning, it is temporary to carry out classification；
D, process above and below wiring board material, comprising:
D-1 the loading and unloading of suspension type overhead traveling crane) are utilized, collocation automatically controls, and automatically controls processing procedure reaction time and condition；
D-2 it) is designed using inside and outside double hanging baskets, fast and easy replaces materials and parts；Interior basket gap is small, and component is avoided to hang in medicine
In sink；Outer hoop frame is big, and convenient interior basket is put into and takes out；
D-3 material process on), comprising:
(1) electronic component is poured into hanging in basket；
(2) basket is put into hanging outline border in hanging, into processing procedure；
(3) continue to pour into electronic component into basket in hanging, prepare lower batch of charging；
D-4) blanking procedure, comprising:
(1) after the completion of reaction procedure, interior basket will be hung and taken out；
(2) after interior basket takes out, outer basket continues lower batch of feeding work；
(3) materials and parts are classified and are poured out in basket in hanging；
(4) interior basket carries out down batch charging preparation.
Further, it is described processing having electronic component wiring board and stanniferous waste material method using chemical agent immersion or
Backwashing manner removes the tin on surface, on the one hand making that electronic component tin connects partly because the removal of tin, and makes electronics
Component is loosened or is directly fallen；On the other hand the tin on wiring board and component is completely removed, is kept completely separate tin, carried out
Tin recycles completely below.
Further, the method for the processing having electronic component wiring board and stanniferous waste material includes:
Electronic component is put into hanging basket, and is hung in chemical medicinal liquid drill traverse bubble；
Soaking process generates chemical heating and reacts, and 30 DEG C~90 DEG C of temperature range；
Soaking time 10 minutes~60 minutes, different soaking times are used according to stanniferous amount or stanniferous thickness；
Water flowing is reinforced with ultrasonic wave in reaction.
Further, the method for the processing having electronic component wiring board and stanniferous waste material further include:
Hanging basket is hung out into cleaning after the reaction was completed；Hang basket in, carry out electronic component loosen or separate, manual sort
Electronic component type；Hollow plate enters broken processing procedure after separation.
Further, tupe is except hanging immersion way, or uses backwashing manner.
Further, the chemical agent that uses or for containing nitric acid, hydrochloric acid, sulfuric acid medicament.
Further, in reaction in addition to ultrasonic wave, or circulating water flow is used, stirring, roll mode reinforces water flowing.
Another object of the present invention is to provide the system of a kind of processing having electronic component wiring board and stanniferous waste material.
Another object of the present invention, which is to provide, a kind of utilizes above-mentioned processing having electronic component wiring board and stanniferous waste material
Method pcb board leftover bits and pieces.
Another object of the present invention, which is to provide, a kind of utilizes above-mentioned processing having electronic component wiring board and stanniferous waste material
Method having electronic component wiring board DIP plate.
Another object of the present invention, which is to provide, a kind of utilizes above-mentioned processing having electronic component wiring board and stanniferous waste material
Method SMT plate.
Advantages of the present invention and good effect are as follows: having electronic component wiring board and stanniferous useless should be handled with wet chemical
Having electronic component wiring board and stanniferous waste material effectively can be carried out 100% separation by the isolation technics of material, exclude Toxic
The generation of matter dioxin, design automation production line flow process carry out the processing of high-volume batchization and operation, reduce opening for manpower
It props up while improving treating capacity, electronic component recycling can be improved, reduce other following process and purity problem.
Bring benefit (compared with the hot tin furnace processing of tradition) of the present invention has: reducing cost of labor 75%；Quantization production, phase
About 300% yield is higher by than tradition with production space；It is not necessary to high-temperature process, avoids dioxin, personnel is reduced and sucks risk；
Sillim, which belongs in chemical process, to take out, and avoids stanniferous in broken rear copper powder；General broken rear copper powder about stanniferous 7%~20%, changes
Length of schooling journey is reduced to 0.1% or less；
The present invention handles the recovery process of electronics member device wiring board using wet chemical；
Operation of the present invention mode can make the every batch of materials and parts reaction time that can reach certain effect, average response in 60 minutes
Time is 30 minutes, depending on the state of material.
Tradition, which moves back tin furnace, can handle about 0.8 ton or so of electronic component wiring board for 8 hours for each person every day；
For the present invention to design batch quantity 150kg at present, 4 slot reactive tank scales can about handle 9 tons or so in 8 hours, manually about
3 people.
Effect of the invention is compared with prior art, as in the table below:
Detailed description of the invention
Fig. 1 is the method flow diagram of processing having electronic component wiring board provided in an embodiment of the present invention and stanniferous waste material.
Fig. 2 is the method process flow of processing having electronic component wiring board provided in an embodiment of the present invention and stanniferous waste material
Figure.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
Problem of the existing technology is: metallic tin dissolution takes a long time, thicker if it is scolding tin or tin layers
Situation needs the longer time；In order to accelerate dissolution time, it be easy to cause the excessive corrosion or destruction of other substances；Tin dissolution
The white tin state of oxidation is formed afterwards, and is easy to form protective film in undissolved tin surfaces, causes not continuing to dissolve；Having electronic
Component wiring board and stanniferous waste material etc., thickness, state and the content of tin have very big difference possibility, cause treatment conditions poor
It is different big, so that process operations are difficult to design and overcome.
Wet chemical processing methods are mainly used for the recycling of electronic component wiring board using specifically by the present invention
It is to separate electronic component and wiring board after dissolving tin using the use of chemical agent, and effectively control electronics is first
Integrality after device isolation, and can be a large amount of and rapidly process.
With reference to the accompanying drawing and specific embodiment is further described application principle of the invention.
The method of processing having electronic component wiring board provided in an embodiment of the present invention and stanniferous waste material,
Reach quick and quantization tupe using chemical treatments, is applied to recovery processing electricity using chemical agent
Sub- component wiring board and stanniferous waste material replace traditional processing procedure for moving back the heating cooperation of tin furnace and manually stripping electronic component；Benefit
The tin on surface is removed, on the one hand makes electronic component by immersion or backwashing manner with chemical agent, the part connected with tin because
For the removal of tin, and electronic component is made to loosen or directly fall, achievees the purpose that separation；On the other hand by wiring board and first device
Tin on part completely removes, and is kept completely separate tin, with the complete recuperability of tin behind benefit.
It is provided in an embodiment of the present invention processing having electronic component wiring board and stanniferous waste material method with wet chemistry at
Process is managed, the manpower expenditure for pulling out electronic component process is reduced, reduces a possibility that personnel suck exhaust gas and risk, exclude
Two dislike because generation may, integrate the movement and production control of process flow, increase the speed of processing, improve electronic component warp
Integrality after process flow, and tin is completely disengaged on electronic component and wiring board, it is sharp again with the subsequent recycling of benefit, processing
With.
According to an embodiment of the invention, using wet chemical processing electronic element and device and wiring board and be isolated, it can
Effective and quick processing mode is provided, is dissolved tin using chemical agent, component can be made to loosen or fall off after tin dissolution.
One, application principle of the invention is described in detail combined with specific embodiments below.
As shown in Figure 1, the method for processing having electronic component wiring board provided in an embodiment of the present invention and stanniferous waste material, packet
It includes:
S101: electronic component is put into hanging basket, and is hung in chemical medicinal liquid drill traverse bubble.
S102: soaking process generates chemical heating and reacts, between 30~90 DEG C of temperature range.
S103: soaking time range 10~60 minutes, different according to stanniferous amount or stanniferous thickness.
S104: water flowing is reinforced with ultrasonic wave in reaction.
S105: hanging basket is hung out into cleaning after the reaction was completed；It hangs in basket, electronic component is loosened or separated；Artificial point
Electron-like component type；Hollow plate enters broken processing procedure after separation.
As shown in Fig. 2, the method for processing having electronic component wiring board provided in an embodiment of the present invention and stanniferous waste material, is adopted
Electronics member device wiring board is handled with wet chemical, process flow specifically includes:
A, level-one moves back tin liquid medicine immersion process, comprising:
1) it hangs in processing solution tank, tin metal starts reaction dissolution；
2) electronic component melting because of tin metal, and start to loosen or fall into hanging basket；
3) set reaction time reach after, will hanging basket hang out；
B, second level moves back tin liquid medicine immersion process, comprising:
A) hanging basket second level is hung in move back in molten tin bath；
B) because tin thickness is different, move back tin using second level, will thicker or also stripping completely tin stripping completely；
C) after the completion of stripping, hanging basket is hung out；
D) it hangs out into back segment and washes processing procedure；
C, clear water spray washing process is divided into spray washing and washing by soaking, specifically includes:
One) spray washing in the way of shower directly by high concentration liquid medicine remain wash out, and using water circulation shower and
Water reuse mode reduces water consumption；
Two) washing by soaking after high concentration heated medical elutes, is soaked in clear water after spray woods washing, by hole and keeps away
Exempt from shower and wash the possibility that can not thoroughly clean, and use two clear water soaking and water washings, washing water imports water reclaiming system；
Three) automatic blow-dry is carried out after the completion of washing to drip program；
Four) after the completion of manufacturing process for cleaning, it is temporary to carry out classification；
D, process above and below wiring board material, comprising:
D-1 the loading and unloading of suspension type overhead traveling crane) are utilized, collocation automatically controls, and automatically controls processing procedure reaction time and condition；
D-2 it) is designed using inside and outside double hanging baskets, fast and easy replaces materials and parts；Interior basket gap is small, and component is avoided to hang in medicine
In sink；Outer hoop frame is big, and convenient interior basket is put into and takes out；
D-3 material process on), comprising:
(1) electronic component is poured into hanging in basket；
(2) basket is put into hanging outline border in hanging, into processing procedure；
(3) continue to pour into electronic component into basket in hanging, prepare lower batch of charging；
D-4) blanking procedure, comprising:
(1) after the completion of reaction procedure, interior basket will be hung and taken out；
(2) after interior basket takes out, outer basket continues lower batch of feeding work；
(3) materials and parts are classified and are poured out in basket in hanging；
(4) interior basket carries out down batch charging preparation.
Two, it is opposed with the present invention below with reference to moving back tin furnace in the prior art and manually pull out electronic component example (case of comparative examples)
Than further describing.
Detailed process:
1. a piece of electronic component wiring board is placed on heating furnace；
2. waiting about 3~5 minutes, drip to tin dissolution on wiring board；
3. manually taking pliers that electronic component is knocked out or extracted；
4. the electronic component classification extracted；
5. the empty wiring board after pulling out is collected；
As a result: an artificial once-through operation handles a piece of electronic component wiring board time about at 3~10 minutes or so；One
Piece electronic component wiring board weight is approximately 300g~1kg etc., need to regard electronic component number and weight.
The defect of case of comparative examples are as follows: electronic component is easily damaged because of baking sheet time and temperature relationship；Baking sheet process is artificial
Sucking noxious material must be easy in carrying out in operating area；Roasted wiring board can generate stink and two evils because of baking sheet temperature
Cause；Tin, which does not need to be completely dissolved, can extract electronic component, therefore after operation, most tin also remains on electronic component
On upper or wiring board；Tin dissolution to be oozed completely, can be unable to reach because of strain problem；Many lesser parts can because
The Fundamentals of Welding of tin, welding fabrication again in conjunction with liquid tin and after cooling, causes to be difficult to separated situation instead；It is taken after baking sheet
Metallic tin out, because other metals or electronic component can be dissolved, the average purity of tin is about 60~70% or so.
Effect of the invention are as follows: the embodiment of the present invention is used on the processing procedure of mass production, in the way of hanging basket into
Row operation, and design automation producing line process can largely reduce manpower expenditure, and by operator with react differentiation
It opens, and can rationally and effectively be disposed available manpower distribution, stable processing quantum of output and efficient system pipe according to process
Reason excludes two and dislikes because that may occur.
Three, the method for processing having electronic component wiring board provided in an embodiment of the present invention and stanniferous waste material is also possible to use
Different modes application.Include:
1) backwashing manner also can be used except hanging immersion way in tupe；
2) chemical agent used may be for containing medicaments such as nitric acid, hydrochloric acid, sulfuric acid, the present invention selects the spy containing nitric acid to use
Medicament；
3) in reaction in addition to ultrasonic wave, circulating water flow, stirring may be used, roll mode reinforces water flowing；
4) present invention can using the process range that covers in addition to electronic component wiring board, there are also scolding tin and it is tin plating etc. other
Different wastes and leftover bits and pieces, such as handware, electric power connector.
The system of processing having electronic component wiring board provided in an embodiment of the present invention and stanniferous waste material, including 1# wiring board
Working procedure systems above and below material, the 2# clear water spray washing working procedure systems being connected with working procedure systems above and below 1# wiring board material；With
The 3# that 2# clear water spray washing process is connected moves back tin liquid medicine and impregnates working procedure systems；Tin liquid medicine, which is moved back, with 3# impregnates working procedure systems phase
The 4# of connection moves back tin liquid medicine and impregnates working procedure systems.
Four, below with reference to medicament part Experiment, the invention will be further described.
One, medicament part Experiment (following test obtains the most effective fruit of medicament containing nitric acid).
1. using nitric acid treatment mode
(1) 10g metallic tin is taken, is put into 1L concentrated nitric acid, is impregnated 8 hours, white tin compound, metal are generated outside metallic tin
Weighing is 6g or so after tin residual quantity cleaning, drying.
(2) 10g metallic tin is taken, is put into 1L dust technology, is impregnated 8 hours, white tin compound, metal are generated outside metallic tin
Weighing is 7g or so after tin residual quantity cleaning, drying.
(3) 1kg electronic component wiring board is taken, is put into 10L concentrated nitric acid, is impregnated 8 hours, white tin chemical combination is generated outside tin
Object, electronic component partial exfoliation, other non-purpose metals almost dissolve, and cause component breakage excessive.
(4) 1kg electronic component wiring board is taken, is put into 10L dust technology, is impregnated 8 hours, white tin chemical combination is generated outside tin
Object, electronic component can not fall off, other non-purpose dissolving metals of part can not generate separating effect.
2. using HCl treatment mode
(1) 10g metallic tin is taken, is put into 1L concentrated hydrochloric acid, is impregnated 8 hours, becomes black gray expandable, metallic tin residual outside metallic tin
Weighing is 7g or so after measuring cleaning, drying.
(2) 10g metallic tin is taken, is put into 1L dilute hydrochloric acid, is impregnated 8 hours, becomes black gray expandable, metallic tin residual outside metallic tin
Weighing is 9g or so after measuring cleaning, drying.
(3) 1kg electronic component wiring board is taken, is put into 10L concentrated hydrochloric acid, is impregnated 8 hours, becomes black gray expandable outside tin, electricity
Sub- component can not fall off, other non-purpose dissolving metals of part can not generate separating effect, and cause component breakage
Greatly.
(4) 1kg electronic component wiring board is taken, is put into 10L dilute hydrochloric acid, is impregnated 8 hours, becomes black gray expandable outside tin, electricity
Sub- component can not fall off, other non-purpose dissolving metals of part can not generate separating effect.
3. using sulfuric acid treatment mode
(1) 10g metallic tin is taken, is put into the 1L concentrated sulfuric acid, is impregnated 8 hours, becomes black gray expandable, metallic tin residual outside metallic tin
Weighing is 9g or so after measuring cleaning, drying, it is virtually impossible to be dissolved.
(2) 10g metallic tin is taken, is put into 1L dilute sulfuric acid, is impregnated 8 hours, becomes black gray expandable, metallic tin residual outside metallic tin
Weighing is 8g or so after measuring cleaning, drying.
(3) 1kg electronic component wiring board is taken, is put into 10L dilute sulfuric acid, is impregnated 8 hours, becomes black gray expandable outside tin, electricity
Sub- component can not fall off, other non-purpose dissolving metals of part can not generate separating effect.
Below with reference to operation temperature experiment, the invention will be further described.
Five, operation temperature experiment (following test show that the higher solute effect of temperature is higher, but risk is higher).
1. using nitric acid treatment mode, temperature control is 60 DEG C；
(1) 10g metallic tin is taken, is put into 1L concentrated nitric acid, is impregnated 8 hours, white tin compound, metal are generated outside metallic tin
Weighing is 4g or so after tin residual quantity cleaning, drying, but smoke yields are very big in the process.
(2) 10g metallic tin is taken, is put into 1L dust technology, is impregnated 8 hours, white tin compound, metal are generated outside metallic tin
Weighing is 6g or so after tin residual quantity cleaning, drying, but smoke yields are big in the process.
(3) 1kg electronic component wiring board is taken, is put into 10L concentrated nitric acid, is impregnated 8 hours, white tin chemical combination is generated outside tin
Object, electronic component are completely fallen off, other non-purpose metals almost dissolve, and cause component almost damaged, and flue gas produces in the process
Raw amount greatly, is reacted very violent.
(4) 1kg electronic component wiring board is taken, is put into 10L dust technology, is impregnated 8 hours, white tin chemical combination is generated outside tin
Object, electronic component can not fall off, other non-purpose dissolving metals of part can not generate and be kept completely separate effect, component is almost
Breakage, smoke yields are very big in the process, and reaction is violent.
2. using HCl treatment mode, temperature control is 60 DEG C；
(1) 10g metallic tin is taken, is put into 1L concentrated hydrochloric acid, is impregnated 8 hours, becomes black gray expandable, metallic tin residual outside metallic tin
Weighing is 6g or so after measuring cleaning, drying.
(2) 10g metallic tin is taken, is put into 1L dilute hydrochloric acid, is impregnated 24 hours, becomes grey black, metallic tin residual outside metallic tin
Weighing is 7g or so after measuring cleaning, drying.
(3) 1kg electronic component wiring board is taken, is put into 10L concentrated hydrochloric acid, is impregnated 8 hours, becomes black gray expandable outside tin, electricity
Sub- component partial exfoliation, other non-purpose metals almost dissolve, and cause component breakage excessive.
(4) 1kg electronic component wiring board is taken, is put into 10L dilute hydrochloric acid, is impregnated 8 hours, becomes black gray expandable outside tin, electricity
Sub- component can not fall off, other non-purpose dissolving metals of part can not generate separating effect.
3. using sulfuric acid treatment mode, temperature control is 60 DEG C；
(1) 10g metallic tin is taken, is put into the 1L concentrated sulfuric acid, is impregnated 8 hours, becomes black gray expandable, metallic tin residual outside metallic tin
Weighing is 9g or so after measuring cleaning, drying, it is virtually impossible to be dissolved.
(2) 10g metallic tin is taken, is put into 1L dilute sulfuric acid, is impregnated 8 hours, becomes black gray expandable, metallic tin residual outside metallic tin
Weighing is 7g or so after measuring cleaning, drying.
(3) 1kg electronic component wiring board is taken, is put into 10L dilute sulfuric acid, is impregnated 8 hours, becomes black gray expandable outside tin, electricity
Sub- component can not fall off, other non-purpose dissolving metals of part can not generate separating effect.
Below with reference to mode of operation experiment, the invention will be further described.
Six, mode of operation experiment (following experiment show that medicament flowing can increase effect).
1. using nitric acid treatment mode, persistently it is stirred to react；
(1) 10g metallic tin is taken, is put into 1L concentrated nitric acid, is impregnated 8 hours, white tin compound, metal are generated outside metallic tin
Weighing is 4g or so after tin residual quantity cleaning, drying.
(2) 10g metallic tin is taken, is put into 1L dust technology, is impregnated 8 hours, white tin compound, metal are generated outside metallic tin
Weighing is 6g or so after tin residual quantity cleaning, drying.
(3) 1kg electronic component wiring board is taken, is put into 10L concentrated nitric acid, is impregnated 8 hours, white tin chemical combination is generated outside tin
Object, electronic component are completely fallen off, other non-purpose metals almost dissolve, and cause component almost damaged, and flue gas produces in the process
Raw amount greatly, is reacted very violent.
(4) 1kg electronic component wiring board is taken, is put into 10L dust technology, is impregnated 8 hours, white tin chemical combination is generated outside tin
Object, electronic component can not fall off, other non-purpose dissolving metals of part can not generate and be kept completely separate effect, component is almost
Breakage, smoke yields are very big in the process, and reaction is violent.
2. using HCl treatment mode, persistently it is stirred to react；
(1) 10g metallic tin is taken, is put into 1L concentrated hydrochloric acid, is impregnated 8 hours, becomes black gray expandable, metallic tin residual outside metallic tin
Weighing is 5g or so after measuring cleaning, drying.
(2) 10g metallic tin is taken, is put into 1L dilute hydrochloric acid, is impregnated 24 hours, becomes grey black, metallic tin residual outside metallic tin
Weighing is 7g or so after measuring cleaning, drying.
(3) 1kg electronic component wiring board is taken, is put into 10L concentrated hydrochloric acid, is impregnated 8 hours, becomes black gray expandable outside tin, electricity
Sub- component partial exfoliation, other non-purpose metal part dissolutions, causes component breakage excessive.
(4) 1kg electronic component wiring board is taken, is put into 10L dilute hydrochloric acid, is impregnated 8 hours, becomes black gray expandable outside tin, electricity
Sub- component can not fall off, other non-purpose dissolving metals of part can not generate separating effect.
3. using sulfuric acid treatment mode, persistently it is stirred to react；
(1) 10g metallic tin is taken, is put into the 1L concentrated sulfuric acid, is impregnated 8 hours, becomes black gray expandable, metallic tin residual outside metallic tin
Weighing is 9g or so after measuring cleaning, drying, it is virtually impossible to be dissolved.
(2) 10g metallic tin is taken, is put into 1L dilute sulfuric acid, is impregnated 8 hours, becomes black gray expandable, metallic tin residual outside metallic tin
Weighing is 8g or so after measuring cleaning, drying.
(3) 1kg electronic component wiring board is taken, is put into 10L dilute sulfuric acid, is impregnated 8 hours, becomes black gray expandable outside tin, electricity
Sub- component can not fall off, other non-purpose dissolving metals of part can not generate separating effect.
Batch quantity 150kg should be designed at present with wet chemical processing electronics member device wiring board, 4 slot reactive tank scales, 8 is small
Shi Yueke handles 9 tons or so, manually about 3 people；Mode of operation can make the every batch of materials and parts reaction time that can reach one in 60 minutes
Determine effect, average reaction time is 30 minutes, depending on the state of material.And tradition is moved back tin furnace 8 hours for each person every day and can be handled
About 0.8 ton or so of electronic component wiring board.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (8)
1. a kind of method of processing having electronic component wiring board and stanniferous waste material, which is characterized in that the processing having electronic
In the method for component wiring board and stanniferous waste material, immersion or backwashing manner using chemical agent are removed the tin on surface, one
Aspect make that electronic component tin connects partly because the removal of tin, and electronic component is made to loosen or directly fall；It is another
Aspect completely removes the tin on wiring board and component, is kept completely separate tin, carries out tin below and recycles completely；
The processing having electronic component wiring board and the method for stanniferous waste material include:
Electronic component wiring board is put into hanging basket, and is hung in chemical medicinal liquid drill traverse bubble；
Soaking process generates chemical heating and reacts, and 30 DEG C~90 DEG C of temperature range；
Soaking time 10 minutes~60 minutes, different soaking times are used according to stanniferous amount or stanniferous thickness；
Water flowing is reinforced with ultrasonic wave in reaction；
The method of the processing having electronic component wiring board and stanniferous waste material handles electronics member device route using wet chemical
Plate specifically includes:
A, level-one moves back tin liquid medicine immersion process, comprising:
1) it hangs in processing solution tank, tin metal starts reaction dissolution；
2) electronic component melting because of tin metal, and start to loosen or fall into hanging basket；
3) set reaction time reach after, will hanging basket hang out；
B, second level moves back tin liquid medicine immersion process, comprising:
A) hanging basket second level is hung in move back in molten tin bath；
B) because tin thickness is different, move back tin using second level, will thicker or also stripping completely tin stripping completely；
C) after the completion of stripping, hanging basket is hung out；
D) it hangs out into back segment and washes processing procedure；
C, clear water spray washing process is divided into spray washing and washing by soaking, specifically includes:
One) high concentration liquid medicine is directly remained in the way of shower and is washed out by spray washing；
Two) washing by soaking carries out after spray woods washing, after high concentration heated medical is eluted, is soaked in clear water, by hole and
The waste that spray washing can not be cleaned thoroughly washes out, and uses two clear water soaking and water washings, and washing water imports water reclaiming system；
Three) automatic blow-dry is carried out after the completion of washing to drip program；
Four) after the completion of manufacturing process for cleaning, it is temporary to carry out classification；
D, process above and below wiring board material, comprising:
D-1 the loading and unloading of suspension type overhead traveling crane) are utilized, collocation automatically controls, and automatically controls processing procedure reaction time and condition；
D-2 inside and outside double hanging basket designs) are carried out；
D-3 material process on), comprising:
(1) having electronic component wiring board is poured into hanging in basket；
(2) basket is put into hanging outline border in hanging, into processing procedure；
(3) continue to pour into having electronic component wiring board into basket in hanging, prepare lower batch of charging；
D-4) blanking procedure, comprising:
After the completion of reaction procedure, interior basket will be hung and taken out；
After interior basket takes out, outer basket continues lower batch of feeding work；
Materials and parts are classified and are poured out in basket in hanging；
Interior basket carries out down batch charging and prepares.
2. the method for processing having electronic component wiring board and stanniferous waste material as described in claim 1, which is characterized in that described
The method for handling having electronic component wiring board and stanniferous waste material further include:
Hanging basket is hung out into cleaning after the reaction was completed；Hang basket in, carry out electronic component loosen or separate, manual sort's electronics
Component type；Hollow plate enters broken processing procedure after separation.
3. the method for processing having electronic component wiring board and stanniferous waste material as described in claim 1, which is characterized in that use
Chemical agent or containing nitric acid, hydrochloric acid, sulfuric acid medicament.
4. the method for processing having electronic component wiring board and stanniferous waste material as described in claim 1, which is characterized in that reaction
In in addition to ultrasonic wave, or use circulating water flow, stirring, roll mode reinforce water flowing.
5. a kind of processing having electronic member of method of processing having electronic component wiring board and stanniferous waste material as described in claim 1
The system of device wiring board and stanniferous waste material.
6. under a kind of pcb board of the method using processing having electronic component wiring board and stanniferous waste material described in claim 1
Heel.
7. a kind of having electronic member of the method using processing having electronic component wiring board and stanniferous waste material described in claim 1
Device wiring board DIP plate.
8. a kind of SMT plate of the method using processing having electronic component wiring board and stanniferous waste material described in claim 1.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710638824.5A CN107385236B (en) | 2017-07-31 | 2017-07-31 | A method of processing having electronic component wiring board and stanniferous waste material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710638824.5A CN107385236B (en) | 2017-07-31 | 2017-07-31 | A method of processing having electronic component wiring board and stanniferous waste material |
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| CN107385236A CN107385236A (en) | 2017-11-24 |
| CN107385236B true CN107385236B (en) | 2019-09-03 |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111515227A (en) * | 2020-04-30 | 2020-08-11 | 清华苏州环境创新研究院 | Tin stripping waste liquid and waste circuit board cooperative treatment equipment and method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103934536A (en) * | 2014-05-12 | 2014-07-23 | 上海第二工业大学 | Method for disassembling welded components of waste printed circuit board |
| CN105107797A (en) * | 2015-06-29 | 2015-12-02 | 中国人民解放军装甲兵工程学院 | Component surface pollutant composite cleaning device and method |
-
2017
- 2017-07-31 CN CN201710638824.5A patent/CN107385236B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103934536A (en) * | 2014-05-12 | 2014-07-23 | 上海第二工业大学 | Method for disassembling welded components of waste printed circuit board |
| CN105107797A (en) * | 2015-06-29 | 2015-12-02 | 中国人民解放军装甲兵工程学院 | Component surface pollutant composite cleaning device and method |
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