CN105002363A - Method for recycling gold from circular board - Google Patents
Method for recycling gold from circular board Download PDFInfo
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- CN105002363A CN105002363A CN201510482433.XA CN201510482433A CN105002363A CN 105002363 A CN105002363 A CN 105002363A CN 201510482433 A CN201510482433 A CN 201510482433A CN 105002363 A CN105002363 A CN 105002363A
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- wiring board
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- gold
- pickling solution
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The invention discloses a method for recycling gold from a circuit board. The method comprises the following steps that 1, the paint on the surface of the circuit board is removed, and metal in the circuit board is exposed on the surface of the substrate of the circuit board; 2, the circuit board without paint is cleaned up; 3, acid etching is conducted on the cleaned up circuit board through an acid etching solution comprising sulfuric acid and an oxidizing agent, after acid etching, copper in the circuit board is leached in a copper sulfate mode, gold floats in the acid etching solution in a gold foil mode; 4, gold existing in the gold foil is obtained through separation. By the adoption of the technical scheme, the sulfuric acid and the oxidizing agent are used for corroding gold carriers such as copper, nickel and other metal, the purpose of separating gold from the circuit board is achieved. By the adoption of the method, the good gold extracting effect can be achieved without smashing the circuit board, nitrogen oxide pollution is avoided, the gold recovery rate is high, and the cost is low.
Description
Technical field
The present invention relates to industrial waste electronics materials and equipment resources technical field, in particular to a kind of method of gold recovering from wiring board.
Background technology
In recent years, along with the continuous renewal of electronic product is regenerated, increasing electronic product is eliminated.If these electronic products be eliminated effectively are not disposed, wiring board wherein will cause huge detrimentally affect to environment, and the various valuable metals simultaneously in wiring board also can be wasted.
At present, in recovery train plate there is following problem in the method for various valuable metal:
Physical separation: utilize the metal of the method for broken, physical separation respectively in recovery train plate and nonmetal.There is the low problem of metal recovery rate in the method.Metal recovery rate is understood generally lower than 80% according to the investigation of relevant manufacturers.
Wet-leaching: wiring board is broken into the particle being less than 1mm, utilizes the metal in chloroazotic acid or Cyanide Leaching wiring board.Chloroazotic acid leaching can produce a large amount of nitrogen oxides pollution environment, the more difficult recycling of the copper simultaneously leached, nickel; In Cyanide Leaching method, because prussiate is severe toxicity, waste water is difficult to process, and operational condition is severe, is slowly eliminated at present.If the patent No. is 200610026857.6 patent discloses and a kind ofly extract the method for metal from wiring board, the method wiring board needs to pulverize, later stage filtration difficulty; The oxidation/catalyst component used is complicated, causes later stage wastewater treatment difficulty, and needs to use oxynitride and likely produce exhaust emission air.
In prior art, in recovery train plate, to there is metal recovery rate low for the method for various valuable metal, and environmental pollution is severe, and cost recovery high-technology problem, for these technical problems, the present invention proposes following technical proposal.
According to a kind of typical embodiment of the present invention, provide a kind of method of gold recovering from wiring board.The method comprises the following steps: S1, carries out surperficial depainting to wiring board, makes the exposed metal/bare metal in wiring board in the substrate surface of wiring board; S2, cleans up the wiring board after depainting; S3, adopt pickling solution to carry out acid-soluble erosion to the wiring board cleaned up, wherein, pickling solution comprises sulfuric acid and oxygenant, and after acid-soluble erosion, the copper in wiring board leaches with copper sulfate form, and gold floats in pickling solution with the form of goldleaf; And S4, be separated the gold obtaining existing with the form of goldleaf.
Apply technical scheme of the present invention, circuit after depainting is out exposed, after being soaked in the mixed solution of sulfuric acid and oxygenant, the copper of sulfuric acid and oxygenant meeting corrosion PCB surface and nickel, copper, nickel are dissoluted rear gold and lose to be connected with board substrate and come off from PCB surface, form goldleaf, thus reach the object be separated that is golden and wiring board.Adopt the method, wiring board without fragmentation, just can reach and well put forward golden effect, and the method can not produce nitrogen oxides pollution, and gold recovery is high, and cost is low.
Preferably, oxygenant is hydrogen peroxide, and this avoid and use complicated oxygenant and catalyzer, waste water generation is little, while taking into full account wiring board metal recovery, also solve useless water problem; And use hydrogen peroxide as oxygenant, it decomposes generation water and oxygen, can not pollute air.
According to a kind of typical embodiment of the present invention, step S3 specifically comprises: 150g wiring board is put into pickling solution and carries out acid-soluble erosion, pickling solution by 200ml mass percentage be 10% ~ 40% sulfuric acid and 35ml mass percentage be 10% ~ 30% hydrogen peroxide form, the temperature of acid-soluble erosion is 30 DEG C ~ 80 DEG C, and the time of acid-soluble erosion is 0.5 ~ 6 hour.Under this solution and reaction conditions, the dissolving metals such as copper nickel are abundant, and consuming time short.
Preferably, step S3 specifically comprises: 150g wiring board is put into pickling solution and carries out acid-soluble erosion, pickling solution by 200ml mass percentage be 30% sulfuric acid and 35ml mass percentage be 30% hydrogen peroxide form, the temperature of acid-soluble erosion is 50 DEG C, and the time of acid-soluble erosion is 2 hours.The metals such as the copper nickel that now wiring board is exposed all dissolve, and goldleaf all peels off from wiring board.
According to a kind of typical embodiment of the present invention, in step S1, alkaline paint-removing liquid is adopted to carry out surperficial depainting to wiring board; after carrying out surperficial depainting; the exposed metal/bare metal that in wiring board, protected paint covers out, makes sulfuric acid and copper nickel contact surface larger, more easily carries out acid-soluble erosion.
Preferably, it is 5 ~ 20% sodium hydroxide that alkaline paint-removing liquid comprises mass percentage, and volumn concentration is the ethanol of 1 ~ 5%, and this alkaline paint-removing liquid has good paint removing effect.Preferred further, it is 10% sodium hydroxide that alkaline paint-removing liquid comprises mass percentage, and volumn concentration is the ethanol of 3%.
According to a kind of typical embodiment of the present invention, step S4 specifically comprises: after being taken out from pickling solution by wiring board, and filtration obtains the gold existed with the form of goldleaf, and the mode such as to fish for can certainly be adopted to carry out the separation of goldleaf.
According to a kind of typical embodiment of the present invention, comprise further: the copper sulfate produced in recycling step S3.Solution after acid etching is sulfuric acid, copper sulfate, single nickel salt mixing solutions.The good cupric sulphate crystal of purity can be obtained by evaporation concentration, crystallization; Surplus solution can obtain by electrodeposition the blister copper that purity is about 85%; After electrodeposition, liquid can obtain single nickel salt crystallization by being cooled to-5 DEG C.
Technical scheme of the present invention, is applicable to single printed-wiring board (PWB) or double-side printed-wiring board.
Beneficial effect of the present invention is further illustrated below in conjunction with embodiment.
Summary of the invention
The present invention aims to provide a kind of method of gold recovering from wiring board, with decreasing pollution, improves gold recovery, reduces costs.
To achieve these goals, according to an aspect of the present invention, a kind of method of gold recovering from wiring board is provided.The method comprises the following steps: S1, carries out surperficial depainting to wiring board, makes the exposed metal/bare metal in wiring board in the substrate surface of wiring board; S2, cleans up the wiring board after depainting; S3, adopt pickling solution to carry out acid-soluble erosion to the wiring board cleaned up, wherein, pickling solution comprises sulfuric acid and oxygenant, and after acid-soluble erosion, the copper in wiring board leaches with the form of copper sulfate, and gold floats in pickling solution with the form of goldleaf; And S4, be separated the gold obtaining existing with the form of goldleaf.
Further, oxygenant is hydrogen peroxide.
Further, step S3 specifically comprises: 150g wiring board is put into pickling solution and carries out acid-soluble erosion, pickling solution by 200ml mass percentage be 10% ~ 40% sulfuric acid and 35ml mass percentage be 10% ~ 30% hydrogen peroxide form, the temperature of acid-soluble erosion is 30 DEG C ~ 80 DEG C, and the time of acid-soluble erosion is 0.5 ~ 6 hour.
Further, step S3 specifically comprises: 150g wiring board is put into pickling solution and carries out acid-soluble erosion, pickling solution by 200ml mass percentage be 30% sulfuric acid and 35ml mass percentage be 30% hydrogen peroxide form, the temperature of acid-soluble erosion is 50 DEG C, and the time of acid-soluble erosion is 2 hours.
Further, in step S1, alkaline paint-removing liquid is adopted to carry out surperficial depainting to wiring board.
Further, it is 5 ~ 20% sodium hydroxide that alkaline paint-removing liquid comprises mass percentage, and volumn concentration is the ethanol of 1 ~ 5%.
Further, it is 10% sodium hydroxide that alkaline paint-removing liquid comprises mass percentage, and volumn concentration is the ethanol of 3%.
Further, step S4 specifically comprises: after being taken out from pickling solution by wiring board, filters the gold obtaining existing with the form of goldleaf.
Further, the method comprises: the copper sulfate produced in recycling step S3.
Further, wiring board is single printed-wiring board (PWB) or double-side printed-wiring board.
Apply technical scheme of the present invention, utilize the metal such as carrier copper, nickel of sulfuric acid and oxygenant corrosion gold, reach the object be separated that is golden and wiring board.Adopt the method, wiring board without fragmentation, just can reach and well put forward golden effect, and the method can not produce nitrogen oxides pollution, and gold recovery is high, and cost is low.
Accompanying drawing explanation
The Figure of description forming a application's part is used to provide a further understanding of the present invention, and schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 shows the process flow sheet schematic diagram of gold recovering from wiring board according to the embodiment of the present invention 1.
Embodiment
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below with reference to the accompanying drawings and describe the present invention in detail in conjunction with the embodiments.
Embodiment 1
Utilize technical scheme of the present invention to single printed-wiring board (PWB)/double-side printed-wiring board gold recovering, as shown in Figure 1, concrete steps are as follows for its process flow sheet schematic diagram:
S1, utilizes alkaline paint-removing liquid to carry out surperficial depainting to wiring board, makes its exposed metal/bare metal in board substrate surface;
S2, be separated alkaline paint-removing liquid and depainting rear board, depainting rear board cleans up;
S3, depainting rear board carries out acid-soluble erosion, mainly adds suitable sulfuric acid and oxygenant, heats a little, the add-on of adjustment sulfuric acid and wiring board, leaches the copper in wiring board with copper sulfate form, and gold floats in solution with the form of goldleaf;
Filter after the copper-bath that S4, step S3 obtain removes board substrate and obtain strip goldleaf.
Wherein, in the present embodiment, alkaline paint-removing liquid is the aqueous mixture of sodium hydroxide and ethanol, and wherein, sodium hydroxide mass percentage is 10%, and ethanol contend percentage composition is 3%.In step S3, concrete technical parameter is: wiring board weight is 150g, pickling solution by 200ml mass percentage be 30% sulfuric acid and 35ml mass percentage be 30% hydrogen peroxide form, the temperature of acid-soluble erosion is 50 DEG C, and the time of acid-soluble erosion is 2 hours.
It should be noted that, the copper-bath obtained after acid etching is actual in being sulfuric acid, copper sulfate, single nickel salt mixing solutions, because it is mainly called copper-bath containing copper sulfate.The good cupric sulphate crystal of purity can be obtained by evaporation concentration, crystallization; Surplus solution can obtain by electrodeposition the blister copper that purity is about 85%; After electrodeposition, liquid can obtain single nickel salt crystallization by being cooled to-5 DEG C.
In the present embodiment, the rate of recovery of gold is 99%.
Embodiment 2
Step is identical with embodiment 1, different technical parameter following (technical parameter do not shown separately is with embodiment 1):
In the present embodiment, alkaline paint-removing liquid is the aqueous mixture of sodium hydroxide and ethanol, and wherein, sodium hydroxide mass percentage is 5%, and ethanol contend percentage composition is 3%.In step S3, concrete technical parameter is: wiring board weight is 150g, pickling solution by 200ml mass percentage be 20% sulfuric acid and 35ml mass percentage be 10% hydrogen peroxide form, the temperature of acid-soluble erosion is 30 DEG C, and the time of acid-soluble erosion is 6 hours.
In the present embodiment, the rate of recovery of gold is 90%.
Embodiment 3
Step is identical with embodiment 1, different technical parameter following (technical parameter do not shown separately is with embodiment 1):
In the present embodiment, alkaline paint-removing liquid is the aqueous mixture of sodium hydroxide and ethanol, and wherein, sodium hydroxide mass percentage is 20%, and ethanol contend percentage composition is 5%.In step S3, concrete technical parameter is: wiring board weight is 150g, pickling solution by 200ml mass percentage be 40% sulfuric acid and 35ml mass percentage be 30% hydrogen peroxide form, the temperature of acid-soluble erosion is 80 DEG C, and the time of acid-soluble erosion is 0.5 hour.
In the present embodiment, the rate of recovery of gold is 91%.
Embodiment 4
Step is identical with embodiment 1, different technical parameter following (technical parameter do not shown separately is with embodiment 1):
In the present embodiment, alkaline paint-removing liquid is the aqueous mixture of sodium hydroxide and ethanol, and wherein, sodium hydroxide mass percentage is 10%, and ethanol contend percentage composition is 1%.In step S3, concrete technical parameter is: wiring board weight is 150g, pickling solution by 200ml mass percentage be 10% sulfuric acid and 35ml mass percentage be 10% hydrogen peroxide form, the temperature of acid-soluble erosion is 60 DEG C, and the time of acid-soluble erosion is 4 hours.
In the present embodiment, the rate of recovery of gold is 72%.In the present embodiment, sulfuric acid concentration is relatively low low, and in reaction process, sulfuric acid amount is not enough to copper, the nickel in complete acid etching wiring board, has more gold to peel off from wiring board, causes gold recovery lower than other embodiments.
Embodiment 5
Step is identical with embodiment 1, different technical parameter following (technical parameter do not shown separately is with embodiment 1):
In the present embodiment, alkaline paint-removing liquid is the aqueous mixture of sodium hydroxide and ethanol, and wherein, sodium hydroxide mass percentage is 5%, and ethanol contend percentage composition is 3%.In step S3, concrete technical parameter is: wiring board weight is 150g, pickling solution by 200ml mass percentage be 20% sulfuric acid and 35ml mass percentage be 30% hydrogen peroxide form, the temperature of acid-soluble erosion is 50 DEG C, and the time of acid-soluble erosion is 2 hours.
In the present embodiment, the rate of recovery of gold is 93%.
As can be seen from the above description, the above embodiments of the present invention achieve following technique effect:
1. wiring board without fragmentation, just can reach and well put forward golden effect, and the method can not produce nitrogen oxides pollution, and gold recovery is high, and cost is low.
2. oxygenant is hydrogen peroxide, and avoid and use complicated oxygenant and catalyzer, waste water generation is little, while taking into full account wiring board metal recovery, also solve useless water problem; And use hydrogen peroxide as oxygenant, it decomposes generation water and oxygen, can not pollute air.
3. the dissolving metal such as copper nickel is abundant, and consuming time short.
4. copper is with the form high efficiente callback of copper sulfate.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the method for gold recovering from wiring board, is characterized in that, comprise the following steps:
S1, carries out surperficial depainting to described wiring board, makes the exposed metal/bare metal in described wiring board in the substrate surface of described wiring board;
S2, cleans up the described wiring board after depainting;
S3, adopts pickling solution to carry out acid-soluble erosion to the described wiring board cleaned up, wherein, described pickling solution comprises sulfuric acid and oxygenant, after acid-soluble erosion, the copper in described wiring board leaches with the form of copper sulfate, and gold floats in described pickling solution with the form of goldleaf; And
S4, is separated the gold obtaining existing with the form of goldleaf.
2. method according to claim 1, is characterized in that, described oxygenant is hydrogen peroxide.
3. method according to claim 2, it is characterized in that, described step S3 specifically comprises: 150g wiring board is put into described pickling solution and carries out acid-soluble erosion, described pickling solution by 200ml mass percentage be 10% ~ 40% sulfuric acid and 35ml mass percentage be 10% ~ 30% hydrogen peroxide form, the temperature of described acid-soluble erosion is 30 DEG C ~ 80 DEG C, and the time of described acid-soluble erosion is 0.5 ~ 6 hour.
4. method according to claim 3, it is characterized in that, described step S3 specifically comprises: 150g wiring board is put into described pickling solution and carries out acid-soluble erosion, described pickling solution by 200ml mass percentage be 30% sulfuric acid and 35ml mass percentage be 30% hydrogen peroxide form, the temperature of described acid-soluble erosion is 50 DEG C, and the time of described acid-soluble erosion is 2 hours.
5. method according to claim 1, is characterized in that, in described step S1, adopts alkaline paint-removing liquid to carry out surperficial depainting to described wiring board.
6. method according to claim 5, is characterized in that, it is 5 ~ 20% sodium hydroxide that described alkaline paint-removing liquid comprises mass percentage, and volumn concentration is the ethanol of 1 ~ 5%.
7. method according to claim 6, is characterized in that, it is 10% sodium hydroxide that described alkaline paint-removing liquid comprises mass percentage, and volumn concentration is the ethanol of 3%.
8. method according to claim 1, is characterized in that, described step S4 specifically comprises: after being taken out from described pickling solution by described wiring board, filters the gold obtaining existing with the form of goldleaf.
9. method according to claim 1, is characterized in that, comprises further: reclaim the copper sulfate produced in described step S3.
10. method according to claim 1, is characterized in that, described wiring board is single printed-wiring board (PWB) or double-side printed-wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510482433.XA CN105002363A (en) | 2015-08-07 | 2015-08-07 | Method for recycling gold from circular board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510482433.XA CN105002363A (en) | 2015-08-07 | 2015-08-07 | Method for recycling gold from circular board |
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| CN105002363A true CN105002363A (en) | 2015-10-28 |
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| CN201510482433.XA Pending CN105002363A (en) | 2015-08-07 | 2015-08-07 | Method for recycling gold from circular board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105483386A (en) * | 2015-12-09 | 2016-04-13 | 清华大学 | Method for leaching copper from single-layer waste circuit board |
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