CN103981366A - Method for recovery of metal from circuit board - Google Patents
Method for recovery of metal from circuit board Download PDFInfo
- Publication number
- CN103981366A CN103981366A CN201310049769.8A CN201310049769A CN103981366A CN 103981366 A CN103981366 A CN 103981366A CN 201310049769 A CN201310049769 A CN 201310049769A CN 103981366 A CN103981366 A CN 103981366A
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- CN
- China
- Prior art keywords
- metal
- wiring board
- recovery train
- solution
- train plate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention relates to a method for recovery of a metal from circuit board. The method is as follows: first, the circuit board is provided, a copper foil is formed on the circuit board, and a gold foil is formed on the copper foil; then, the circuit board is placed in an acidic solution to dissolve the copper foil, the gold foil is fallen off from the circuit board, and a solution containing copper ions is obtained; the solution containing copper ions is filtered to obtain the gold foil. The technical scheme provided by the invention simplifies the step for obtaining the gold foil from the circuit board gold steps, and can reduce the pollution and damage to the environment and organisms.
Description
Technical field
The invention relates to a kind of method that reclaims metal, and relate to especially the method for the metal on a kind of recovery train plate.
Background technology
In current semiconductor industry, for example, for the harmful cause waste in printed circuit board (PCB) and photoelectricity communication (containing the printed-wiring board (PWB) of Jin Yutong), in order to reach best processing efficiency, generally all use chloroazotic acid or potassium cyanate solution to divest gold from substrate.But above-mentioned method has high risk and toxicity, and the waste liquid remaining also has high risk and toxicity, thereby has a strong impact on environmental quality and biology is damaged.In addition,, in aforesaid method, after substrate divests gold, in order to reclaim gold, must carry out again chemical reaction the gold ion being dissolved in chloroazotic acid or potassium cyanate solution is reduced into gold, thereby cause the increase of process complexity and improved production cost.
Summary of the invention
The invention provides the method for the metal on a kind of recovery train plate, the Jin Yutong on its recyclable wiring board.
The method of the metal on recovery train plate of the present invention is that wiring board is first provided, and wherein Copper Foil is formed on wiring board, and goldleaf is formed on Copper Foil.Then, wiring board is placed in to acidic solution to dissolve Copper Foil, goldleaf is come off from wiring board, and obtain copper ions solution.Afterwards, filter copper ions solution, to obtain goldleaf.
According to the method for the metal on the recovery train plate described in the embodiment of the present invention, above-mentioned acidic solution is for example the mixing solutions of hydrochloric acid, sulfuric acid, nitric acid, hydrochloric acid and sulfuric acid or the mixing solutions of sulfuric acid and nitric acid.
According to the method for the metal on the recovery train plate described in the embodiment of the present invention, the concentration of above-mentioned hydrochloric acid is for example less than or equal to 20%.
According to the method for the metal on the recovery train plate described in the embodiment of the present invention, in above-mentioned acidic solution, for example contain catalyzer.
According to the method for the metal on the recovery train plate described in the embodiment of the present invention, above-mentioned catalyzer is for example hydrogen peroxide.
According to the method for the metal on the recovery train plate described in the embodiment of the present invention, above-mentioned after wiring board is placed in to acidic solution and before filtering copper ions solution, more comprise acidic solution is carried out to heat treated.
According to the method for the metal on the recovery train plate described in the embodiment of the present invention, above-mentioned after filtering copper ions solution, more comprise copper ions solution is reduced to processing, to obtain copper and acid waste liquid.
According to the method for the metal on the recovery train plate described in the embodiment of the present invention, above-mentioned reduce process after, more comprise acid waste liquid imported to liquid waste treatment system.
Based on above-mentioned, the present invention is dissolved the Copper Foil between goldleaf and wiring board by acidic solution, relend the goldleaf that is obtained coming off from wiring board by the mode of filtering, simplified the step that obtains goldleaf on wiring board, and can reduce environment and biological pollution and injury.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
Brief description of the drawings
Fig. 1 is the schema of the method for the metal on the recovery train plate illustrating according to embodiments of the invention.
[nomenclature]
100,102,104,106,108: step
Embodiment
For further set forth the present invention for the technique means reaching predetermined goal of the invention and take with and effect, below in conjunction with accompanying drawing and preferred embodiment, embodiment, flow process, feature and the effect thereof of method to the metal on the recovery train plate proposing according to the present invention, be described in detail as follows.
Fig. 1 is the schema of the method for the metal on the recovery train plate illustrating according to embodiments of the invention.Please refer to Fig. 1, first, in step 100, provide the wiring board with Copper Foil and goldleaf.In the present embodiment, wiring board is for example printed-wiring board (PWB), but the present invention is not limited to this.In detail, in the present embodiment, Copper Foil is formed on wiring board, using the line layer as printed-wiring board (PWB), and on Copper Foil, is formed with goldleaf.
Then, in step 102, wiring board is placed in to acidic solution, to dissolve Copper Foil.After in the Copper Foil between goldleaf and wiring board is dissolved in acidic solution, goldleaf can come off from wiring board, and can obtain copper ions solution simultaneously.Therefore, above-mentioned acidic solution must be to dissolve Copper Foil completely, but can not dissolve goldleaf or only micro-the goldleaf that dissolves.Above-mentioned acidic solution is for example the mixing solutions of hydrochloric acid, sulfuric acid, nitric acid, hydrochloric acid and sulfuric acid or the mixing solutions of sulfuric acid and nitric acid.For instance, in the time that acidic solution is hydrochloric acid, can dissolves Copper Foil completely but not dissolve goldleaf in order to ensure hydrochloric acid, being preferably working concentration is to be less than or equal to 20% hydrochloric acid, the hydrochloric acid that for example working concentration is 18%.In addition, in acidic solution, can also contain catalyzer, to promote the dissolving of Copper Foil.Catalyzer is for example hydrogen peroxide.In another embodiment, after wiring board is placed in to acidic solution, can also carry out heat treated to acidic solution, to promote further Copper Foil to be dissolved in acidic solution.
Afterwards, in step 104, the copper ions solution obtaining in step 102 is filtered, to obtain the goldleaf coming off from wiring board.
With in existing known techniques, utilize chloroazotic acid or potassium cyanate solution to dissolve goldleaf recycling chemical reaction gold ion is reduced into compared with golden technology, the present embodiment only dissolves the Copper Foil between goldleaf and wiring board filter simply, can on wiring board, reclaim goldleaf, thereby simplified significantly fabrication steps and reduced cost.In addition, in the present embodiment, owing to not using and thering is high risk and highly toxic chloroazotic acid or potassium cyanate solution, therefore significantly reduced environment and biological harm, and reduced work and pacified unexpected Probability.
After reclaiming goldleaf, depending on actual demand, also can in above-mentioned copper ions solution, reclaim copper further.In step 106, copper ions solution is reduced to processing, to obtain copper and acid waste liquid.For instance, in one embodiment, can carry out replacement Treatment to copper ions solution, to obtain so-called blister copper.In addition, after obtaining blister copper, can also carry out further electrolysis treatment, to obtain so-called smart copper.Or, in another embodiment, can be also directly to carry out electrolysis treatment to obtain smart copper.
From the above, the method for the metal on recovery train plate of the present invention, except reclaiming on wiring board simply goldleaf, can also further reclaim copper on wiring board, and does not need to carry out complicated processing step.
In addition,, in step 108, for acid waste liquid remaining in step 106, because it does not contain high risk and highly toxic solution, therefore acid waste liquid directly can be imported to general liquid waste treatment system, to be for recycling and reuse.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the method for above-mentioned announcement and technology contents to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solution of the present invention, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (8)
1. a method for the metal on recovery train plate, is characterized in that comprising:
Wiring board is provided, and wherein Copper Foil is formed on described wiring board, and goldleaf is formed on described Copper Foil;
Described wiring board is placed in to acidic solution to dissolve described Copper Foil, described goldleaf is come off from described wiring board, and obtain copper ions solution; And
Filter described copper ions solution, to obtain described goldleaf.
2. the method for the metal on recovery train plate as claimed in claim 1, is characterized in that wherein said acidic solution comprises the mixing solutions of hydrochloric acid, sulfuric acid, nitric acid, hydrochloric acid and sulfuric acid or the mixing solutions of sulfuric acid and nitric acid.
3. the method for the metal on recovery train plate as claimed in claim 2, is characterized in that the concentration of wherein said hydrochloric acid is less than or equal to 20%.
4. the method for the metal on the recovery train plate as described in claim 1 or 2 or 3, is characterized in that containing catalyzer in wherein said acidic solution.
5. the method for the metal on recovery train plate as claimed in claim 4, is characterized in that wherein said catalyzer comprises hydrogen peroxide.
6. the method for the metal on the recovery train plate as described in claim 1 or 2 or 3, it is characterized in that wherein, after described wiring board is placed in to described acidic solution and before filtering described copper ions solution, more comprises described acidic solution being carried out to heat treated.
7. the method for the metal on recovery train plate as claimed in claim 1, is characterized in that wherein after filtering described copper ions solution, more comprises described copper ions solution is reduced to processing, to obtain copper and acid waste liquid.
8. the method for the metal on recovery train plate as claimed in claim 7, is characterized in that wherein, after reducing and processing, more comprising described acid waste liquid being imported to liquid waste treatment system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310049769.8A CN103981366A (en) | 2013-02-07 | 2013-02-07 | Method for recovery of metal from circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310049769.8A CN103981366A (en) | 2013-02-07 | 2013-02-07 | Method for recovery of metal from circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103981366A true CN103981366A (en) | 2014-08-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310049769.8A Pending CN103981366A (en) | 2013-02-07 | 2013-02-07 | Method for recovery of metal from circuit board |
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| Country | Link |
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| CN (1) | CN103981366A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104527159A (en) * | 2014-12-11 | 2015-04-22 | 广东生益科技股份有限公司 | Thermosetting resin composition for degradable heat-conducting aluminum based copper clad laminate, heat-conducting aluminum based copper clad laminate, preparation method and recovery method thereof |
| CN105002363A (en) * | 2015-08-07 | 2015-10-28 | 珠海格力电器股份有限公司 | Method for recycling gold from circular board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101024864A (en) * | 2007-02-14 | 2007-08-29 | 苏州天地环境科技有限公司 | Method for recovering gold and copper from gold-plated printed circuit board waste material |
| CN101092663A (en) * | 2007-04-13 | 2007-12-26 | 浙江理工大学 | Method for recovering gold from waste of gold plating procedure |
| CN101100706A (en) * | 2007-07-13 | 2008-01-09 | 东华大学 | Method for immersing gold from printing wiring board |
| CN101812591A (en) * | 2009-02-20 | 2010-08-25 | 国立云林科技大学 | Method for recovering gold, copper, copper sulfate and copper chloride waste liquid of waste circuit board |
| TW201036718A (en) * | 2009-04-02 | 2010-10-16 | Atomic Energy Council | Method for recovering gold, silver, copper and iron from valuable metal-containing plasma-caused slag |
-
2013
- 2013-02-07 CN CN201310049769.8A patent/CN103981366A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101024864A (en) * | 2007-02-14 | 2007-08-29 | 苏州天地环境科技有限公司 | Method for recovering gold and copper from gold-plated printed circuit board waste material |
| CN101092663A (en) * | 2007-04-13 | 2007-12-26 | 浙江理工大学 | Method for recovering gold from waste of gold plating procedure |
| CN101100706A (en) * | 2007-07-13 | 2008-01-09 | 东华大学 | Method for immersing gold from printing wiring board |
| CN101812591A (en) * | 2009-02-20 | 2010-08-25 | 国立云林科技大学 | Method for recovering gold, copper, copper sulfate and copper chloride waste liquid of waste circuit board |
| TW201036718A (en) * | 2009-04-02 | 2010-10-16 | Atomic Energy Council | Method for recovering gold, silver, copper and iron from valuable metal-containing plasma-caused slag |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104527159A (en) * | 2014-12-11 | 2015-04-22 | 广东生益科技股份有限公司 | Thermosetting resin composition for degradable heat-conducting aluminum based copper clad laminate, heat-conducting aluminum based copper clad laminate, preparation method and recovery method thereof |
| CN105002363A (en) * | 2015-08-07 | 2015-10-28 | 珠海格力电器股份有限公司 | Method for recycling gold from circular board |
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Application publication date: 20140813 |