CN100590212C - Treatment method and system for etching liquid - Google Patents
Treatment method and system for etching liquid Download PDFInfo
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- CN100590212C CN100590212C CN200710000980A CN200710000980A CN100590212C CN 100590212 C CN100590212 C CN 100590212C CN 200710000980 A CN200710000980 A CN 200710000980A CN 200710000980 A CN200710000980 A CN 200710000980A CN 100590212 C CN100590212 C CN 100590212C
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- etching solution
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- solution treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The invention relates to a processing method for etching solution, in particular to a processing method for recovering gold and iodine from the gold etching solution with iodine, which comprises the following steps: first, reduction reaction is performed for the potassium iodide etching solution with gold ions, so as to precipitate the metal gold; then, oxidation reaction of iodide ions is carriedout in the potassium iodide etching solution thus treated in order to separate iodine molecules. The device and method to extract noble metals from a mixed ionic dilute solution has an advantage of reclaiming the metal gold and iodine molecular components from the etching solution effectively and continuously.
Description
Technical field
A kind of treatment process that relates to etching solution relates in particular to and reclaim gold and the treatment process that reclaims iodine from the golden etching solution that contains potassiumiodide.
Background technology
All utilize etching method (etching) to carry out the etching manufacturing process in semi-conductor and the opto-electronics manufacturing process, contain potassiumiodide (KI, potassium iodide) solution is common golden etching solution (goldetchant), when the potassiumiodide concentration in the golden etching solution or etch capabilities do not meet the manufacturing process demand, this etching solution can go out of use because of activating once again to use, and is the depleted etching solution.Therefore contain the gold ion (gold ion) that concentration differs in the depleted etching solution, metal (gold) is the high precious metal of economic worth (precious metal), has the recovery value of height.Therefore the depleted etching solution is transferred to usually and is reclaimed manufacturer and carry out gold and recycle.
After the discarded golden etching solution that contains potassiumiodide carried out the gold recovery, rest solution was waste water (waste water), owing to contain a large amount of potassiumiodide compositions in the waste water, and very big to the hazardness of organism in water, so just can discharge after need removing toxicity.Present wastewater treatment is other set handling field, utilizes chemical point-score to remove iodine or neutralizes toxic program; Treat to be discharged after the waste water allow compliance with emission standards.Above-mentioned current methods is expensive and inefficient, can't contain the golden etching solution of potassiumiodide with the routine processes of consistentization.
Summary of the invention
Treatment process based on aforementioned known etching solution is expensive and inefficient, the golden etching solution that can't contain potassiumiodide with the routine processes of consistentization, so this case proposes a kind of invention of efficient recovery liquid etching composition, can in a system, reclaim metal and iodine molecule, make final waste water reduce toxicity.
After the objective of the invention is to carry out gold recycling, and carry out the iodine molecule recycling with what a successive system continued at the discarded golden etching solution that contains potassiumiodide.
Etching solution treatment process of the present invention is: at first the potassiumiodide etching solution that contains gold ion is carried out reduction reaction, thereby separate out metal; Make this treated potassiumiodide etching solution carry out the iodide ion oxidizing reaction again, thereby separate out iodine molecule, this method can effectively reclaim metal and the iodine molecule composition in the etching solution.
Description of drawings
The schema of Fig. 1 etching solution treatment process
Another schema of Fig. 2 etching solution treatment process
The auriferous potassiumiodide etching solution of Fig. 3 treatment system schema
The main element description of symbols:
100 gold ion reduction reactions can be separated out metal
Under 110 alkaline conditions, the gold ion reduction reaction can be separated out metal
200 iodide ion oxidizing reactions can be separated out iodine molecule
Under 210 acidic conditionss, the iodide ion oxidizing reaction can be separated out iodine molecule
300 first reactive tanks
302 second reactive tanks
304 first channels
Embodiment
What the present invention will disclose is a kind of etching solution treatment process.Please refer to Fig. 1 and Fig. 3: a preferred embodiment of the present invention is that pending potassiumiodide etching solution is placed first reactive tank 300.As step 1 100, reductive agent (for example: S-WAT, ferrous sulfate or diamine etc.) is added pending potassiumiodide etching solution, then the gold ion in the potassiumiodide etching solution can be reduced into metal; The potassiumiodide etching solution of being handled by first reactive tank 300 is transported to second reactive tank 304 by first channel 302, as step 2 200, (the pH value is less than 5 under acidic conditions, especially between pH=1 between the pH=4, more particularly between pH=2 between the pH=3), (for example: sulfuric acid and oxygenant add iodide ion oxidizing reaction reagent; Oxygenant can be ammonium persulphate, sodium chlorate) in second reactive tank 302, then the iodide ion in the potassiumiodide etching solution can be oxidized to iodine molecule and separate out.
With reference to Fig. 2 and Fig. 3, another preferred embodiment of the present invention is, pending potassiumiodide etching solution is placed first reactive tank 300, sodium hydroxide is added pending potassiumiodide etching solution, as step 1 110, (the pH value is greater than 8 under alkaline environment, better be between the pH=14 between pH=9, be more preferably between pH=10 between the pH=13, preferably between pH=11 between the pH=12), add hydrogen peroxide again to pending potassiumiodide etching solution, then the gold ion in the potassiumiodide etching solution can be reduced into metal; Potassiumiodide etching solution by 300 processing of first reactive tank is transported to second reactive tank 302 by first channel 304, as step 2 210, (the pH value is less than 5 under acidic conditions, especially between pH=1 between the pH=4, more particularly between pH=2 between the pH=3), (for example: sulfuric acid and oxygenant add iodide ion oxidizing reaction reagent; Oxygenant can be ammonium persulphate, sodium chlorate) in second reactive tank 302, then the iodide ion in the potassiumiodide etching solution can be oxidized to iodine molecule and separate out.
Comprehensive the above, the present invention is effectively by reclaiming metal and iodine molecule in the etching solution, this method can be exempted the aforementioned problem that is present in the known technology, and have following advantage: one, successive reclaims metal and the iodine molecule in the potassiumiodide waste liquid, meets the atom economy benefit, creates economic benefit; Two, reduce the toxicity of etching solution, make environmental injury is reduced to minimum.
More than, the present invention clearly demonstrates by embodiment and relevant drawings thereof.Yet, the person of ordinary skill in the field should be appreciated that, each embodiment of the present invention only is exemplary but not for restricted at this, that is, do not breaking away within connotation of the present invention and the scope, above-mentioned described variation example and correction example are the present invention and contain.Therefore, the present invention is defined by claim.
Claims (9)
1. the treatment process of an etching solution, wherein this etching solution contains potassiumiodide and gold ion at least, it is characterized in that: (1) adds hydrogen peroxide under alkaline environment makes the gold ion compound in the etching solution carry out reduction reaction, thereby separates out metal; (2) then under sour environment, add oxygenant in this etching solution, make the iodide ion in this etching solution carry out oxidizing reaction, separate out iodine molecule, thereby reclaim iodine molecule.
2. etching solution treatment process according to claim 1 is characterized in that this alkaline environment formation method is for adding sodium hydroxide.
3. etching solution treatment process according to claim 2, the pH value that it is characterized in that this alkaline environment is between between the pH=9 to pH=13.
4. etching solution treatment process according to claim 2 is characterized in that this alkaline environment is that the pH value is between between the pH=10 to pH=12.
5. etching solution treatment process according to claim 1 is characterized in that this sour environment formation method is for adding sulfuric acid.
6. etching solution treatment process according to claim 1 is characterized in that this oxygenant is ammonium persulphate or sodium chlorate.
7. etching solution treatment process according to claim 1 is characterized in that this sour environment is that the pH value is less than pH=5.
8. etching solution treatment process according to claim 1, it is characterized in that this sour environment be the pH value between pH=1 between the pH=4.
9. etching solution treatment process according to claim 1, it is characterized in that this sour environment be the pH value between pH=2 between the pH=3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710000980A CN100590212C (en) | 2007-01-17 | 2007-01-17 | Treatment method and system for etching liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710000980A CN100590212C (en) | 2007-01-17 | 2007-01-17 | Treatment method and system for etching liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101225473A CN101225473A (en) | 2008-07-23 |
| CN100590212C true CN100590212C (en) | 2010-02-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710000980A Expired - Fee Related CN100590212C (en) | 2007-01-17 | 2007-01-17 | Treatment method and system for etching liquid |
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| CN (1) | CN100590212C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105965030A (en) * | 2016-06-20 | 2016-09-28 | 昆山鸿福泰环保科技有限公司 | Technique for recovering gold from gold iodide liquid waste |
| CN111549349A (en) * | 2020-03-31 | 2020-08-18 | 湖南凯通电子有限公司 | Alkaline etching solution treatment method |
| CN114351144B (en) * | 2021-12-07 | 2023-06-02 | 湖北兴福电子材料股份有限公司 | Gold etching solution |
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2007
- 2007-01-17 CN CN200710000980A patent/CN100590212C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN101225473A (en) | 2008-07-23 |
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