CN104902696B - A kind of method that copper post is made based on structure of sunkening cord on a printed circuit board - Google Patents
A kind of method that copper post is made based on structure of sunkening cord on a printed circuit board Download PDFInfo
- Publication number
- CN104902696B CN104902696B CN201510353137.XA CN201510353137A CN104902696B CN 104902696 B CN104902696 B CN 104902696B CN 201510353137 A CN201510353137 A CN 201510353137A CN 104902696 B CN104902696 B CN 104902696B
- Authority
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- China
- Prior art keywords
- copper
- circuit board
- copper post
- copper foil
- printed circuit
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 313
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 174
- 239000010949 copper Substances 0.000 title claims abstract description 174
- 238000000034 method Methods 0.000 title claims abstract description 102
- 239000011889 copper foil Substances 0.000 claims abstract description 110
- 239000010410 layer Substances 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 30
- 239000011241 protective layer Substances 0.000 claims abstract description 19
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 17
- 238000013461 design Methods 0.000 claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 238000010276 construction Methods 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 52
- 239000011347 resin Substances 0.000 claims description 50
- -1 Corvic Polymers 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 16
- 239000003814 drug Substances 0.000 claims description 15
- 238000005516 engineering process Methods 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 241000784732 Lycaena phlaeas Species 0.000 claims description 12
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 11
- 239000011135 tin Substances 0.000 claims description 11
- 229910052718 tin Inorganic materials 0.000 claims description 11
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000004643 cyanate ester Substances 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229920001568 phenolic resin Polymers 0.000 claims description 7
- 239000005011 phenolic resin Substances 0.000 claims description 7
- 238000005234 chemical deposition Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000011133 lead Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 3
- YJFHTKQOASXZIF-UHFFFAOYSA-N cyanic acid;pyrrole-2,5-dione Chemical compound OC#N.O=C1NC(=O)C=C1 YJFHTKQOASXZIF-UHFFFAOYSA-N 0.000 claims description 3
- 239000010408 film Substances 0.000 claims description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 229920001290 polyvinyl ester Polymers 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 2
- 229910001074 Lay pewter Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000002322 conducting polymer Substances 0.000 claims description 2
- 229920001940 conductive polymer Polymers 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims description 2
- KFZAUHNPPZCSCR-UHFFFAOYSA-N iron zinc Chemical compound [Fe].[Zn] KFZAUHNPPZCSCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 150000001412 amines Chemical class 0.000 claims 2
- 150000002148 esters Chemical class 0.000 claims 2
- 239000012466 permeate Substances 0.000 claims 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 1
- 239000010426 asphalt Substances 0.000 claims 1
- 238000003032 molecular docking Methods 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract description 2
- 230000003628 erosive effect Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 108010074506 Transfer Factor Proteins 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
A kind of method for making copper post on a printed circuit board based on structure of sunkening cord, comprises the following steps：1) copper post will be formed and is attached to support plate surface with copper foil；2) copper wire figure is made by graphic plating method in the one side for forming copper post copper foil；3) structure of sunkening cord is formed in copper wire graphic design pressure dielectric layer material；4) making of sandwich construction is completed using lamination and copper wire graphic making technique；5) supporting plate is removed；6) copper post is made by graphic plating with the one side of copper foil in formation copper post；7) the circuit board one side for not forming copper post sticks protective layer；8) copper foil of etching removal printed circuit board copper post side obtains copper post；9) protective layer is removed；10) circuit board surface makes solder mask, copper post surface makes antioxidation coating, that is, obtains the printed circuit board with chip interconnection docking Copper column structure.
Description
Technical field
The present invention relates to the manufacturing technology of printed circuit board or semiconductor integrated circuit package substrate, more particularly to a kind of base
In the method that structure of sunkening cord makes copper post on a printed circuit board.
Background technology
With flourishing for electronic industry, electronic product comes into functionalization, intelligentized development, to meet
Electronic product high integration, miniaturization, the development need of miniaturization, printed circuit board or semiconductor integrated circuit package substrate,
On the premise of the good electricity of electronic product, hot property is met, also develop towards light, thin, short, small designer trends.It is meanwhile right
Also become increasingly complex in the design requirement of electronic system, and develop towards different directions.However, have for electronic product of new generation
There are two kinds of primary demands, with progressively diminishing for design size, interconnection density of all products on design level is continuously increased.
That is, it is necessary to design more input/output signal circuits in more and more limited surface area.It is meanwhile because first
Device is operated under high speed signal, and performance must be improved.
Based on above demand, flip chip flip interconnection techniques are developed.Because the connection of flip chip flips has
Chip and circuit board access path are short, and impedance is low, and the loss of signal is small, the advantages such as electric signal parasitics is low, therefore, in many height
Hold in product design, flip chip chip packages mode progressively instead of the relatively long wire of connection
Bonding encapsulates connected mode, becomes generally.
Traditional flip chip chip packages connection is by the way of tin ball, and chip node and circuit plate node are led to
The mode for crossing high temperature Reflow Soldering welds together.But as product circuit designs being continuously increased for density, chip and circuit board
Spacing (pitch) between tie point is also less and less.On the one hand, due to docking solder joint design density it is increasing when, applying
During electric current increase therewith with fuel factor, because of the influence of tin ball electron transfer factor, product reliability potential problems also with
Increase；On the other hand, particularly as node spacing (b μm of p pitch)<At 130 μm, traditional uses tin ball, passes through high temperature
The connected mode of reflow oven is because being also easy to produce short circuit, the problems such as cost of manufacture, has not been suitable for big volume production.Based on such back of the body
Scape, arisen at the historic moment using design of the Copper column structure as connected mode, and actual product is progressively applied to by the receiving of more companies
Design.
Copper post can be produced on chip, can also be made on a printed circuit board.
When making copper post on chip, because the wafer area where chip is relatively small (diameter about 200mm), and use
Advanced electroplating device and liquid medicine, the ability of plating are stronger；Therefore, present design is more by core of the copper post design in wafer side
On piece, but its cost of manufacture is higher.Recently, existing dealer explores and makes copper post on a printed circuit board, to substitute chip
The Copper column structure of side.
Prior art makes copper post on a printed circuit board using subtractive process, but because subtractive process uses etching solution pair
Copper foil is etched, during obtaining copper post, it may appear that " lateral erosion " phenomenon, i.e.,：Etching solution not only attacks downwards copper foil, and
And also to side attack copper, the copper post resulted in is " cone ", this not only bad for the copper post of smaller spacing making, and
And there is obvious influence to the integrality of signal.Therefore need a kind of new method to make copper post, make the copper post to be formed for " circle
Cylinder ", the spacing between copper post can so reduced, improve wiring density.
The content of the invention
It is an object of the invention to provide a kind of method for making copper post on a printed circuit board based on structure of sunkening cord, circuit
Figure is structure of sunkening cord with dielectric layer, and adhesion is good, and can realize the making of small spacing Copper column structure, and the exterior quality of product is good
It is good.
To reach above-mentioned purpose, the technical scheme is that：
A kind of method for making copper post on a printed circuit board based on structure of sunkening cord, comprises the following steps：
1) copper post will be formed and is attached to support plate surface with copper foil, wherein, the one side towards supporting plate is to form copper post copper
First face of paper tinsel；One side back to supporting plate is to form the second face of copper post copper foil；
2) copper wire figure is made in copper foil surface by the method for graphic plating in the second face for forming copper post copper foil
Shape；
3) dielectric layer material is pressed in the copper wire graphic design of copper foil surface, forms structure of sunkening cord；
4) system of sandwich construction is completed using traditional laminating technology of printed circuit board and the manufacture craft of copper wire figure
Make；
5) supporting plate is removed；
6) copper post is made in copper foil surface by the method for graphic plating in the first face for forming copper post copper foil；
7) protective layer for preventing that liquid medicine from permeating is sticked in the side surface of printed circuit board one that need not form copper post；
8) copper foil of printed circuit board copper post side is removed, obtains copper post by quick-etch process, etching；
9) protective layer for preventing that liquid medicine from permeating is removed；
10) antioxidation coating is made in printed circuit plate surface making solder mask, on copper post surface, that is, obtained mutual with chip
The even printed circuit board of docking Copper column structure.
Further, the formation copper post copper thickness described in step 1) is 0.1 μm~100 μm.
Also, the formation copper post described in step 1) is more than 5 μ with copper foil using 1~3 μm of extra thin copper foil of thickness or using thickness
M common copper foil reaches extra thin copper foil thickness by the way that process for copper is thinned.
Preferably, in step 1), the method that formation copper post is attached to support plate surface with copper foil is：Using carrier-free copper foil
Common copper foil and supporting plate fringe region between bonded with stickum.
Correspondingly, in step 5), the method for supporting plate removal is glued using the fringe region to common copper foil and supporting plate
Knot point is cut, so as to which supporting plate be removed.
Preferably, in step 1), the method that formation copper post is attached to support plate surface with copper foil is：Using containing carrier copper
The extra thin copper foil of paper tinsel, bonded between carrier copper foil and supporting plate whole plate region with stickum.
Correspondingly, in step 5), it is by the method that supporting plate removes：From carrier copper foil and the ultra-thin copper containing carrier copper foil
Separated between paper tinsel, because carrier copper foil is bonded with supporting plate whole plate region with stickum, so that supporting plate and carrier copper foil
It is removed together.
Also, a kind of method for making copper post on a printed circuit board based on structure of sunkening cord of the present invention, comprises the following steps：
1) copper post will be formed and is attached to support plate surface with copper foil, wherein, the one side towards supporting plate is to form copper post copper
First face of paper tinsel；One side back to supporting plate is to form the second face of copper post copper foil；
2) copper wire figure is made in copper foil surface by the method for graphic plating in the second face for forming copper post copper foil
Shape；
3) dielectric layer material is pressed in the copper wire graphic design of copper foil surface, forms structure of sunkening cord；
4) system of sandwich construction is completed using traditional laminating technology of printed circuit board and the manufacture craft of copper wire figure
Make；
5) protective layer for preventing that liquid medicine from permeating is sticked in the side surface of printed circuit board one that need not form copper post；
6) supporting plate is removed；
7) by etch process, first the copper foil of pre-formed copper post side is etched totally, exposes structure of sunkening cord；
8) protective layer for preventing that liquid medicine from permeating is removed, and one layer of conductive layer is deposited in circuit board surface；
9) dry film is sticked in the circuit board both sides after conductive layer is deposited；
10) position for corresponding to copper post in dry film side by exposure, developing process opens a window, and forms copper post by electroplating technology
Structure；
11) dry film is peeled off；
12) by quick-etch process, the conductive layer for being deposited on circuit board surface is removed, exposes structure of sunkening cord；
13) solder mask is made, in copper post surface making antioxidation coating in printed circuit plate surface；So far, obtain being based on burying
Cable architecture carries the printed circuit board of Copper column structure.
Further, the formation copper post copper thickness described in step 1) is 0.1 μm~100 μm.
Also, the formation copper post described in step 1) is more than 5 μ with copper foil using 1~3 μm of extra thin copper foil of thickness or using thickness
M common copper foil reaches extra thin copper foil thickness by the way that process for copper is thinned.
Preferably, in step 1), the method that formation copper post is attached to support plate surface with copper foil is：Using carrier-free copper foil
Common copper foil and supporting plate fringe region between bonded with stickum.
Correspondingly, in step 6), the method for supporting plate removal is glued using the fringe region to common copper foil and supporting plate
Knot point is cut, so as to which supporting plate be removed.
Preferably, in step 1), the method that formation copper post is attached to support plate surface with copper foil is：Using containing carrier copper
The extra thin copper foil of paper tinsel, bonded between carrier copper foil and supporting plate whole plate region with stickum.
Correspondingly, in step 6), it is by the method that supporting plate removes：From carrier copper foil and the ultra-thin copper containing carrier copper foil
Separated between paper tinsel, because carrier copper foil is bonded with supporting plate whole plate region with stickum, so that supporting plate and carrier copper foil
It is removed together.
Also, stickum of the present invention is prepreg or resin, resin includes phenolic resin, polyvinyl chloride tree
Fat, polyester resin, epoxy resin, polyurethane, polyvinylesters, poly- fluororesin, poly- fluorocarbon resin, polybismaleimide tree
Fat, poly- Malaysian amine cyanate resin, polyimide resin, poly-cyanate ester resin or epoxy radicals polyphenylene oxide.
Preferably, described dielectric layer material is pure resin material or the resin material containing glass fabric.
Preferably, described pure resin material includes epoxy resin, polyimides, poly maleimide cyanate resin, poly-
Phenylate or polytetrafluoroethylene (PTFE)；Resin material containing glass fabric includes FR-4 or FR-5.
Further, described conductive layer is metal conducting layer, radio frequency layer or by metal, the nonmetallic conduction formed
Glue.
Preferably, described conductive layer is formed by the technique of chemical deposition or sputtering.
Preferably, the material of described metal conduction layer is in gold, silver, copper, tin, lead, aluminium, iron, nickel, cobalt, zinc, chromium, titanium
One kind, or in leypewter, Kufil, ormolu, corronil, iron-nickel alloy, iron cobalt nickel alloy, iron-zinc alloy
It is a kind of.
Preferably, the material of described radio frequency layer is one kind in carbon, conducting polymer polymeric membrane.
Preferably, metal ingredient is in described conducting resinl：Gold, silver, copper, tin, lead, aluminium, iron, nickel, cobalt, zinc, chromium or titanium；
Non-metallic components are：Epoxy resin, phenolic resin, polybismaleimide cyanate resin, poly-cyanate ester resin, epoxy radicals polyphenyl
Ether, polyimides, polytetrafluoroethylene (PTFE) or polybutylene terephthalate resin.
Preferably, the described protective layer for preventing liquid medicine infiltration is dry film, wet film, polyimides, epoxy resin, phenolic aldehyde tree
Fat, polybismaleimide cyanate resin, poly-cyanate ester resin, epoxy radicals polyphenylene oxide, polyimides, polytetrafluoroethylene (PTFE), poly- pair
One kind in terephtha-late resin.
Preferably, described antioxidation coating uses organic anti-welding diaphragm, chemical deposition or electronickelling gold, NiPdAu, changes
Learn that tin, chemical tin be silver-colored, chemical SAC, electrotinning, electrotinning silver, plating SAC or chemistry silver.
The advantage of the invention is that：
1. prior art be line pattern in dielectric layer (resin+glass fibre) above, the knot of line pattern and dielectric layer
Close and only have one side；And the present invention is structure of sunkening cord, i.e., graphic plating is carried out on copper foil, after growing line pattern, by circuit
Figure is pressed among dielectric layer, and there is a resin in three faces of line pattern, and adhesion is good.
Referring to Figure 23, prior art be line pattern A in dielectric layer B (resin+glass fibre) above, line pattern A with
Dielectric layer B combination only has one side.
Referring to Figure 24, the present invention is structure of sunkening cord, after graphic plating formation line pattern A is carried out on copper foil, by circuit
Figure A is pressed among dielectric layer B, and there is resin in line pattern A three faces.
2. prior art makes circuit and uses subtractive process, circuit and copper post are progress DES etchings after panel plating, due to having
Lateral erosion effect, the circuit of formation and the spacing of copper post are bigger, and line style is bad, easily form trapezoidal (as shown in figure 21), this is right
There is negative impact in the integrality of impedance control and signal, especially made above in fine rule road, there is obviously office
Limit.
And the present invention uses semi-additive process manufacture craft, the Copper column structure of minor node spacing can be processed, and Copper column structure/
(as shown in figure 22) uniform in size.
As can be seen that prior art uses the copper post (Figure 21) that subtractive process makes, due to lateral erosion from Figure 21,22 and table 1
Presence, cause circuit bottom copper etch it is unnet, minimum spacing can only be fabricated into 120 μm.
And the present invention makes copper post (Figure 22) using half additive process, only need to etch away 1-3 μm due to dodging to lose in step
Copper, therefore there is no lateral erosion effect, therefore minimum spacing can be fabricated into 60 μm.
Table 1
3rd, prior art makes Copper column structure on a printed circuit board, usually after solder mask completion, passes through surface
Chemical copper is deposited as conductive layer, electroplates copper post；This method has certain damage to welding resistance layer surface, causes rough surface dark
It is light.Because：The main component of solder mask is the composition containing acidity, and contains alkaline degreasing liquid medicine in chemical copper wiring,
Therefore solder mask can be attacked by alkaline medicinal liquid, ultimately result in rough surface.
And the Copper column structure of the present invention is made before solder mask is completed, so will not cause to damage to solder mask, welding resistance
Layer keeps smooth, and the exterior quality of product is good.
Brief description of the drawings
Fig. 1~11 are the Making programme figures of the inventive method embodiment one.
Figure 12~19 are the Making programme figures of the inventive method embodiment two.
Figure 20 is to obtain the structural representation of printed circuit board using the inventive method.
Figure 21 is a subtractive to the schematic cross-section that legal system makees copper post.
Figure 22 is the schematic cross-section that the present invention makes copper post using half addition method.
Figure 23 is the structural representation that line pattern is combined with dielectric layer in the prior art.
Figure 24 is the structural representation that line pattern of the present invention is combined with dielectric layer.
Embodiment
With reference to embodiment and accompanying drawing, the present invention will be further described.
Embodiment one
Referring to Fig. 1~Figure 11 and Figure 20, the method that on a printed circuit board makes copper post of the present invention based on structure of sunkening cord,
Comprise the following steps：
1) extra thin copper foil 101 of 3 μm of a thickness is attached to the surface of supporting plate 100, wherein, towards the one of supporting plate 100
Face is the first face 1011；One side back to supporting plate 100 is the second face 1012, as shown in Figure 1；
2) on the second face 1012 of extra thin copper foil 101 by the method for graphic plating, required by making actual product
First layer copper wire figure 102, as shown in Figure 2；
3) the first dielectric layer material 103 is laminated (containing glass on the surface first layer copper wire figure 102 of extra thin copper foil 101
The resin material FR-4 of glass fiber cloth), structure of sunkening cord is formed, as shown in Figure 3；
4) sandwich construction is completed using traditional laminating technology of printed circuit board and the manufacture craft of copper wire figure to make,
As shown in Figure 4；Wherein, 104 be second layer extra thin copper foil, and 105 be the second layer copper wire figures of the method making of pattern transfer,
106 second layer dielectric layer material to be laminated, the 107 third layer copper wire figure to make, 108 be first layer blind hole, and 109 are
Second layer blind hole, as shown in Figure 4；
5) supporting plate 100 is removed, as shown in Figure 5；
6) dry film is sticked in the circuit board both sides after supporting plate 100 is removed, and makes the dry film 110 of copper post side, opposite side
Dry film 111, as shown in Figure 6；
7) copper post position is corresponded in the side of dry film 110 by exposure, developing process to open a window, and by electroplating technology in copper foil table
Copper column structure 112 is electroplated in face, as shown in Figure 7；
8) dry film 110,111 is peeled off, as shown in Figure 8；
9) protective layer 113 of anti-liquid medicine infiltration is sticked in the side that copper post is not formed in circuit board, as shown in Figure 9；
10) by quick-etch process, the thin bottom copper foil 101 in the first dielectric layer material 103 is etched totally, exposes and buries
Cable architecture -- first layer copper wire figure 102, complete Copper column structure 112 is formed, as shown in Figure 10；
11) protective layer 113 is peeled off, as shown in figure 11；
12) by aftertreatment technology, solder mask 119, and the copper post to revealing and circuit are coated in circuit board surface
Part carries out protection processing, copper post sealer OSP120, circuit pack protective layer OSP121；So far, obtained being based on burying
Cable architecture carries the printed circuit board of Copper column structure, as shown in figure 20.
Embodiment two
Referring to Fig. 1~Fig. 4, Figure 12~Figure 20, the present invention makes copper post on a printed circuit board based on structure of sunkening cord
Method, its manufacture craft comprise the following steps：
1) extra thin copper foil 101 of 3 μm of a thickness is attached to the surface of supporting plate 100, wherein, towards the one of supporting plate 100
Face is the first face 1011；One side back to supporting plate 100 is the second face 1012, as shown in Figure 1；
2) on the second face 1012 of extra thin copper foil 101 by the method for graphic plating, required by making actual product
First layer copper wire figure 102, as shown in Figure 2；
3) (the resinous wood containing glass fabric of the first dielectric layer material 103 is laminated on first layer copper wire figure 102
Expect FR-4) and second layer copper foil 104, structure of sunkening cord is formed, as shown in Figure 3；
4) sandwich construction is completed using traditional laminating technology of printed circuit board and the manufacture craft of copper wire figure to make,
As shown in Figure 4；Wherein, 105 second layer copper wire figure made for the method for pattern transfer, 106 are situated between for the second layer of lamination
Electric layer material, the 107 third layer copper wire figure to make, 108 be first layer blind hole, and 109 be second layer blind hole, such as Fig. 4 institutes
Show；
5) protective layer 114 for preventing that liquid medicine from permeating is sticked in the side of third layer copper wire figure 107, as shown in figure 12；
6) supporting plate 100 is removed, as shown in figure 13；
7) by etch process, extra thin copper foil 101 is removed, exposes structure of sunkening cord --- first layer copper wire figure 102,
As shown in figure 14；
8) protective layer 114, and the method in circuit board surface by chemical deposition are peeled off, makes one layer of chemical copper conducting
Layer, the conductting layer of structure of sunkening cord side is 115, and the conductting layer of opposite side is 116, as shown in figure 15；
9) dry film is sticked in the circuit board both sides after chemical copper is deposited, and the dry film for making copper post side is 117, opposite side
Dry film is 118, as shown in figure 16；
10) correspond to copper post position in the side of dry film 117 by exposure, developing process to open a window, and pass through electroplating technology, electro-coppering
Rod structure 112, as shown in figure 17；
11) dry film 117,118 is peeled off, as shown in figure 18；
12) by quick-etch process, the chemical layers of copper for being deposited on circuit board surface is removed, exposes structure of sunkening cord -- the
One layer of copper wire figure 102, complete Copper column structure 112 is formed, as shown in figure 19；
13) by aftertreatment technology, solder mask 119, and the Copper column structure 112 to revealing are coated in circuit board surface
Protection processing is carried out with circuit pack, the sealer OSP of Copper column structure 112 is 120, and circuit pack protective layer OSP is 121；
So far, the printed circuit board of Copper column structure has been obtained carrying based on structure of sunkening cord, as shown in figure 20.
Because current consumer product is just developing towards the direction of " light, thin, short, small ", therefore, it is possible to production room away from smaller
The copper post of improvement lifting and performance of to(for) product have obvious help.The inventive method uses half additive process method, real
The making of small spacing Copper column structure is showed.
Presently preferred embodiments of the present invention is the foregoing is only, is not used for limiting the practical range of the present invention；That is Fan Yiben
The equivalents that the right of invention is done, it is that scope of the invention as claimed is covered.
Claims (29)
1. a kind of method for making copper post on a printed circuit board based on structure of sunkening cord, comprises the following steps：
1) copper post will be formed and is attached to support plate surface with copper foil, wherein, the one side towards supporting plate is to form copper post copper foil
First face；One side back to supporting plate is to form the second face of copper post copper foil；
2) copper wire figure is made in copper foil surface by the method for graphic plating in the second face for forming copper post copper foil；
3) dielectric layer material is pressed in the copper wire graphic design of copper foil surface, forms structure of sunkening cord；
4) making of sandwich construction is completed using traditional laminating technology of printed circuit board and the manufacture craft of copper wire figure；
5) supporting plate is removed；
6) copper post is made in copper foil surface by the method for graphic plating in the first face for forming copper post copper foil；
7) protective layer for preventing that liquid medicine from permeating is sticked in the side surface of printed circuit board one that need not form copper post；
8) copper foil of printed circuit board copper post side is removed, obtains copper post by quick-etch process, etching；
9) protective layer for preventing that liquid medicine from permeating is removed；
10) antioxidation coating is made in printed circuit plate surface making solder mask, on copper post surface, that is, obtained with chip interconnection pair
Connect the printed circuit board with Copper column structure.
2. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 1, it is characterized in that, step
1) the formation copper post copper thickness described in is 0.1 μm~100 μm.
3. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 1, it is characterized in that, step
1) the formation copper post copper foil described in is passed through using 1~3 μm of extra thin copper foil of thickness or using common copper foil of the thickness more than 5 μm
Thinned process for copper reaches extra thin copper foil thickness.
4. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 1, it is characterized in that, step
3) dielectric layer material described in is pure resin material or the resin material containing glass fabric.
5. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 4, it is characterized in that, step
It is rapid 3) described in pure resin material include epoxy resin, polyimides, poly maleimide cyanate resin, polyphenylene oxide or polytetrafluoro
Ethene；Resin material containing glass fabric includes FR-4 or FR-5.
6. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 1, it is characterized in that, step
1) in, the method that formation copper post is attached to support plate surface with copper foil is：Using the common copper foil and supporting plate of carrier-free copper foil
Fringe region between bonded with stickum.
7. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 6, it is characterized in that, step
5) method for removing supporting plate, is cut using the fringe region adhesive segment to common copper foil and supporting plate, so that will
Supporting plate removes.
8. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 1, it is characterized in that, step
1) in, the method that formation copper post is attached to support plate surface with copper foil is：Using the extra thin copper foil containing carrier copper foil, carrier copper
Bonded between paper tinsel and supporting plate whole plate region with stickum.
9. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 8, it is characterized in that, step
5) it is by the method that supporting plate removes：Separated between carrier copper foil and the extra thin copper foil containing carrier copper foil, due to carrier copper
Paper tinsel is bonded with supporting plate whole plate region with stickum, so that supporting plate is removed together with carrier copper foil.
10. the method that copper post is made based on structure of sunkening cord on a printed circuit board as described in claim 6 or 8, it is characterized in that,
Described stickum is prepreg or resin, and resin includes phenolic resin, Corvic, polyester resin, asphalt mixtures modified by epoxy resin
Fat, polyurethane, polyvinylesters, poly- fluororesin, poly- fluorocarbon resin, bismaleimide resinses, poly- Malaysian amine triazine
Resin, polyimide resin, poly-cyanate ester resin or epoxy radicals polyphenylene oxide.
11. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 1, it is characterized in that, step
It is rapid 7) described in prevent liquid medicine permeate protective layer be dry film, wet film, polyimides, epoxy resin, phenolic resin, poly bis Malaysia
Acid imide cyanate resin, poly-cyanate ester resin, epoxy radicals polyphenylene oxide, polyimides, polytetrafluoroethylene (PTFE), poly terephthalic acid fourth two
One kind in ester resin.
12. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 1, it is characterized in that, step
It is rapid 10) described in antioxidation coating use organic anti-welding diaphragm, chemical deposition or electronickelling gold, NiPdAu, chemical tin, chemistry
Xi Yin, chemical SAC, electrotinning, electrotinning silver, plating SAC or chemistry silver.
13. a kind of method for making copper post on a printed circuit board based on structure of sunkening cord, comprises the following steps：
1) copper post will be formed and is attached to support plate surface with copper foil, wherein, the one side towards supporting plate is to form copper post copper foil
First face；One side back to supporting plate is to form the second face of copper post copper foil；
2) copper wire figure is made in copper foil surface by the method for graphic plating in the second face for forming copper post copper foil；
3) dielectric layer material is pressed in the copper wire graphic design of copper foil surface, forms structure of sunkening cord；
4) making of sandwich construction is completed using traditional laminating technology of printed circuit board and the manufacture craft of copper wire figure；
5) protective layer for preventing that liquid medicine from permeating is sticked in the side surface of printed circuit board one that need not form copper post；
6) supporting plate is removed；
7) by etch process, first the copper foil of pre-formed copper post side is etched totally, exposes structure of sunkening cord；
8) protective layer for preventing that liquid medicine from permeating is removed, and one layer of conductive layer is deposited in circuit board surface；
9) dry film is sticked in the circuit board both sides after conductive layer is deposited；
10) position for corresponding to copper post in dry film side by exposure, developing process opens a window, and forms copper post knot by electroplating technology
Structure；
11) dry film is peeled off；
12) by quick-etch process, the conductive layer for being deposited on circuit board surface is removed, exposes structure of sunkening cord；
13) solder mask is made, in copper post surface making antioxidation coating in printed circuit plate surface；So far, obtain based on knot of sunkening cord
Structure carries the printed circuit board of Copper column structure.
14. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 13, it is characterized in that, step
It is rapid 1) described in formation copper post copper thickness be 0.1 μm~100 μm.
15. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 13, it is characterized in that, step
It is rapid 1) described in formation copper post copper foil lead to using 1~3 μm of extra thin copper foil of thickness or using thickness more than 5 μm of common copper foil
Cross thinned process for copper and reach extra thin copper foil thickness.
16. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 13, it is characterized in that, step
It is rapid 3) described in dielectric layer material be pure resin material or the resin material containing glass fabric.
17. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 16, it is characterized in that, step
It is rapid 3) described in pure resin material include epoxy resin, polyimides, poly maleimide cyanate resin, polyphenylene oxide or polytetrafluoro
Ethene；Resin material containing glass fabric includes FR-4 or FR-5.
18. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 13, it is characterized in that, step
It is rapid 1) in, by formed copper post with copper foil be attached to support plate surface method be：Common copper foil and support using carrier-free copper foil
Bonded between the fringe region of plate with stickum.
19. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 18, it is characterized in that, step
The rapid method for 5) removing supporting plate, is cut using the fringe region adhesive segment to common copper foil and supporting plate, so as to
Supporting plate is removed.
20. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 13, it is characterized in that, step
It is rapid 1) in, by formed copper post with copper foil be attached to support plate surface method be：Using the extra thin copper foil containing carrier copper foil, carrier
Bonded between copper foil and supporting plate whole plate region with stickum.
21. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 20, it is characterized in that, step
It is rapid 5) to be by the method that supporting plate removes：Separated between carrier copper foil and the extra thin copper foil containing carrier copper foil, due to carrier
Copper foil is bonded with supporting plate whole plate region with stickum, so that supporting plate is removed together with carrier copper foil.
22. the method that copper post is made based on structure of sunkening cord on a printed circuit board as described in claim 18 or 20, its feature
It is that described stickum is prepreg or resin, resin includes phenolic resin, Corvic, polyester resin, epoxy
Resin, polyurethane, polyvinylesters, poly- fluororesin, poly- fluorocarbon resin, bismaleimide resinses, poly- Malaysian amine three
Piperazine resin, polyimide resin, poly-cyanate ester resin or epoxy radicals polyphenylene oxide.
23. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 13, it is characterized in that, step
It is rapid 8) described in conductive layer be metal conducting layer, radio frequency layer or by metal, the nonmetallic conducting resinl formed.
24. the method that copper post is made based on structure of sunkening cord on a printed circuit board as described in claim 13 or 23, its feature
It is that the conductive layer described in step 8) is formed by the technique of chemical deposition or sputtering.
25. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 23, it is characterized in that, institute
The material for the metal conducting layer stated is gold, silver, one kind in copper, tin, lead, aluminium, iron, nickel, cobalt, zinc, chromium, titanium, or leypewter,
One kind in Kufil, ormolu, corronil, iron-nickel alloy, iron cobalt nickel alloy, iron-zinc alloy.
26. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 23, it is characterized in that, institute
The material for the radio frequency layer stated is one kind in carbon, conducting polymer polymeric membrane.
27. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 23, it is characterized in that, institute
Metal ingredient is in the conducting resinl stated：Gold, silver, copper, tin, lead, aluminium, iron, nickel, cobalt, zinc, chromium or titanium；Non-metallic components are：Epoxy
Resin, phenolic resin, polybismaleimide cyanate resin, poly-cyanate ester resin, epoxy radicals polyphenylene oxide, polyimides, poly- four
PVF or polybutylene terephthalate resin.
28. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 13, it is characterized in that, step
It is rapid 5) described in prevent liquid medicine permeate protective layer be dry film, wet film, polyimides, epoxy resin, phenolic resin, poly bis Malaysia
Acid imide cyanate resin, poly-cyanate ester resin, epoxy radicals polyphenylene oxide, polyimides, polytetrafluoroethylene (PTFE), poly terephthalic acid fourth two
One kind in ester resin.
29. the method that copper post is made based on structure of sunkening cord on a printed circuit board as claimed in claim 13, it is characterized in that, step
It is rapid 13) described in antioxidation coating use organic anti-welding diaphragm, chemical deposition or electronickelling gold, NiPdAu, chemical tin, chemistry
Xi Yin, chemical SAC, electrotinning, electrotinning silver, plating SAC or chemistry silver.
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| CN107567208A (en) * | 2017-09-07 | 2018-01-09 | 维沃移动通信有限公司 | A kind of printed circuit board (PCB) preparation method and printed circuit board (PCB) |
| CN108712824A (en) * | 2018-06-04 | 2018-10-26 | 南通海舟电子科技有限公司 | The two-sided anti-oxidation PCB circuit board production technology of high-performance |
| CN110719694B (en) * | 2019-09-17 | 2021-07-02 | 沪士电子股份有限公司 | Chemical nickel gold surface treatment method for polyphenylene ether-containing printed circuit board |
| CN111885812A (en) * | 2020-07-14 | 2020-11-03 | 珠海方正科技高密电子有限公司 | Circuit board and circuit board manufacturing method |
| CN114615799A (en) * | 2020-12-07 | 2022-06-10 | 华为技术有限公司 | Circuit board, circuit board manufacturing method and electronic equipment |
| CN114121794A (en) * | 2021-11-26 | 2022-03-01 | 长电集成电路(绍兴)有限公司 | Wiring layer structure and preparation method thereof |
| CN115579329A (en) * | 2022-10-24 | 2023-01-06 | 深圳市驭鹰者电子有限公司 | Coreless flip substrate structure and manufacturing method |
| CN116581032A (en) * | 2023-05-30 | 2023-08-11 | 江苏普诺威电子股份有限公司 | Packaging loading plate with hollow structure and manufacturing process thereof |
| CN116507045B (en) * | 2023-06-26 | 2023-09-12 | 四川英创力电子科技股份有限公司 | Printed circuit board copper column processing method and printed circuit board |
| CN118338548B (en) * | 2024-04-22 | 2024-10-25 | 江苏博敏电子有限公司 | Circuit board ultra-small space golden finger manufacturing process based on buried line structure |
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| KR101015704B1 (en) * | 2008-12-01 | 2011-02-22 | 삼성전기주식회사 | Chip embedded printed circuit board and manufacturing method thereof |
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| CN102573329A (en) * | 2010-12-08 | 2012-07-11 | 北大方正集团有限公司 | Method for fabricating conductive column of circuit board, system and circuit board |
| JP5228130B1 (en) * | 2012-08-08 | 2013-07-03 | Ｊｘ日鉱日石金属株式会社 | Copper foil with carrier |
| CN103945657A (en) * | 2014-04-17 | 2014-07-23 | 上海美维科技有限公司 | Method for manufacturing copper pillars on printed circuit board |
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