CN105472908B - A kind of printed circuit board process for pressing - Google Patents
A kind of printed circuit board process for pressing Download PDFInfo
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- CN105472908B CN105472908B CN201410446671.0A CN201410446671A CN105472908B CN 105472908 B CN105472908 B CN 105472908B CN 201410446671 A CN201410446671 A CN 201410446671A CN 105472908 B CN105472908 B CN 105472908B
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Abstract
A kind of printed circuit board process for pressing provided in an embodiment of the present invention, including being covered the second face of copper foil surface with corrosion stability film；Microetch processing is carried out to the first face, so that copper thickness reduces, then removes corrosion stability film；The printing resin on the copper foil circuit in microetch treated the first face；Under preset time and preset temperature, segmentation precuring is carried out to the copper foil after printing resin；First prepreg and the first face are bonded, first facing towards the first prepreg；First time laminating operation will be executed after first substrate and the bonding of the first prepreg, solved in the prior art since etching is formed by peak in lamination, the problem of being easily broken when fiberglass machinery being caused to squeeze.
Description
Technical field
The present invention relates to PCB (Printed circuit board) printed circuit board manufacturing field more particularly to a kind of prints
Press fit of circuit boards technique processed.
Background technique
As design of electronic products becomes increasingly complex, therefore required copper foil is thicker, and route is more dense, and carrying electric current is increasingly
Greatly, proof voltage requires also higher and higher, therefore in multi-layer PCB board manufacturing process, to consider current-carrying, the bigger institute of copper thickness
The electric current that can be carried is bigger, for example, 2OZ (ounce ounces) is needed compared with 1OZ thickness to the PCB core board group after plating and etching
Part is laminated, general to be filled using conventional PP (Prepreg, that is, resin sheet, prepreg) process for pressing and print resin
Technique is used in combination with PP process for pressing,
But conventional PP process for pressing is suitable only for the product that copper thickness is less than 15OZ, with the increase of copper thickness,
Line pattern is done using double-sided etching process, after being etched due to first time, line pattern etch depth is big, can online shoulder at
Peak, thus in lamination, the glue of PP can flow into etched recesses bottom in line pattern, make the glass in PP that can touch line
Shoulders cause peak mechanical presses glass cracked, reduce product lamination rear stability and yields.
Summary of the invention
The embodiment of the present invention provides a kind of printed circuit board process for pressing, is able to solve and exists since etching is formed by peak
When lamination, the problem of being easily broken when fiberglass machinery being caused to squeeze.
A kind of printed circuit board process for pressing, comprising:
After completing copper foil surface cleaning treatment, inner figure is transferred to the of the copper foil surface by single side etching
On on one side；
The second face of the copper foil surface is covered with corrosion stability film；
Microetch processing is carried out to first face, so that copper thickness reduces, then removes corrosion stability film；
The printing resin on the copper foil circuit in microetch treated first face；
Under preset time and preset temperature, segmentation precuring is carried out to the copper foil after printing resin；
First prepreg and first face are bonded, described first facing towards first prepreg；
First time laminating operation will be executed after first substrate and first prepreg bonding；
Inner figure transfer is carried out to second face and is covered the first substrate with the corrosion stability film；
The operation of microetch processing, printing resin, bonding, segmentation precuring and lamination is carried out to second face.
Wherein, described that microetch processing, printing resin, bonding, segmentation precuring and lamination are carried out to second face
Operation specifically include:
Microetch processing is carried out to second face, so that copper thickness reduces, then removes corrosion stability film；
The printing resin on the copper foil circuit in microetch treated second face；
Under preset time and preset temperature, segmentation precuring is carried out to the copper foil after printing resin；
Second prepreg and second face are bonded；
Second of laminating operation will be executed after the second substrate and second prepreg bonding.
Further, it is described will first prepreg and first face bonding before further include:
First false core plate is put into the centre of first prepreg, the described first false core plate and adjacent described first
The relative distance of prepreg is equal；
Further, it is described will the second prepreg and second face bonding before further include:
Second false core plate is put into the centre of second prepreg, the described second false core plate and adjacent described second
The relative distance of cured sheets is equal.
Wherein, described that progress microetch processing in first face is specifically included:
Microetch processing is carried out to first face, until the numerical value of the copper thickness reduction in first face is in 20-
Between 30um；
Further, described that progress microetch processing in second face is specifically included:
Microetch processing is carried out to second face, until the numerical value of the copper thickness reduction in second face is in 20-
Between 30um.
Wherein, the segmentation precuring includes first stage, second stage, phase III and fourth stage, described default
Time and preset temperature specifically include:
The numberical range of the preset time is in the first stage 25-35min to fourth stage；
The preset temperature is 75-85 DEG C in the first stage；
The preset temperature is 95-105 DEG C in second stage；
The preset temperature is 105-115 DEG C in the phase III；
The preset temperature is 145-155 DEG C in fourth stage.
Wherein, the etch depth of single side etching is carried out between 0.4-0.6mm to the copper foil surface.
Wherein, the printing resin on the copper foil circuit in microetch treated the first face specifically includes:
Plug socket resin of the print thickness value between 5-15um on the copper foil circuit.
Wherein, the quantity of first prepreg and the quantity of second prepreg, the first false core plate
The thickness of the medium that the depth and needs that the thickness of thickness and the second false core plate etches as needed are filled determines.
Wherein, the corrosion stability film is photoresist dry film.
Wherein, the microetch processing is to the two-sided etching process of copper foil surface progress.
A kind of printed circuit board process for pressing provided in an embodiment of the present invention, including with corrosion stability film by the copper foil surface
The second face covering；Microetch processing is carried out to first face, so that copper thickness reduces, then removes corrosion stability film；?
Printing resin on the copper foil circuit in microetch treated first face；Under preset time and preset temperature, to print
Copper foil after brush resin carries out segmentation precuring；First prepreg and first face are bonded, described first faces outwardly；It will
First time laminating operation is executed after first substrate and first prepreg bonding, is solved in the prior art by etching institute
The peak of formation is in lamination, the problem of being easily broken when fiberglass machinery being caused to squeeze.
Detailed description of the invention
Fig. 1 is a kind of one embodiment schematic diagram of printed circuit board process for pressing in the present embodiment；
Fig. 2 is a kind of another embodiment schematic diagram of printed circuit board process for pressing in the present embodiment；
Fig. 3 is a kind of another embodiment schematic diagram of printed circuit board process for pressing in the present embodiment；
Fig. 4 is to cover non-etched surface diagrammatic cross-section with dry film in the present embodiment；
Fig. 5 is that diagrammatic cross-section after dry film is gone in the first face of microetch-in the present embodiment；
Fig. 6 is printing resin and precuring diagrammatic cross-section in the present embodiment；
Fig. 7 is to place false core plate diagrammatic cross-section in the present embodiment among prepreg；
Fig. 8 is laminating operation diagrammatic cross-section in the present embodiment；
Fig. 9 is the present embodiment microetch and printing treatment diagrammatic cross-section；
Figure 10 is the second face of the present embodiment microetch diagrammatic cross-section；
Figure 11 is diagrammatic cross-section after the present embodiment external layer lamination.
In attached drawing, component representated by each label is as follows:
1, inner figure, 2, corrosion stability film, 3, peak, 4, resin, 5, prepreg, 6, false core plate.
Specific embodiment
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art are not having
Every other embodiment obtained under the premise of creative work is made, shall fall within the protection scope of the present invention.
Description and claims of this specification and term " first ", " second ", " third " " in above-mentioned attached drawing
Four " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so that the embodiments described herein can be in addition to illustrating herein or describing
Sequence other than appearance is implemented.In addition, term " includes " and " having " and their any deformation, it is intended that covering is non-exclusive
Include, for example, the process, method, system, product or equipment for containing a series of steps or units are not necessarily limited to clearly arrange
Those of out step or unit, but may include be not clearly listed or it is solid for these process, methods, product or equipment
The other step or units having.
The embodiment of the invention provides a kind of printed circuit board process for pressing, for being formed by peak in layer due to etching
When pressure, the problem of being easily broken when fiberglass machinery being caused to squeeze.In the embodiment of the present invention, corrosion stability film can be dry with photoresist
Film is also possible to other similar films, as long as the film that can play barrier etching reaction is ok, does not make in the embodiment of the present invention
It limits, in addition, the resin of printing can be epoxy resin, phenolic resin, unsaturated polyester resin, epoxy-modified vinylite
Deng being ok as long as resin that is corrosion-resistant, high-strength and playing buffer function can be played, be not construed as limiting herein, below
It is described in detail.
Fig. 1, Fig. 4 are please referred to Figure 11, a kind of printed circuit board process for pressing one embodiment packet in the embodiment of the present invention
It includes:
101, after completing copper foil surface cleaning treatment, inner figure is transferred to the of copper foil surface by single side etching
On on one side；
102, the second face of copper foil surface is covered with corrosion stability film；
The second face is covered with corrosion stability film, so that the second face is not by shadow when carrying out microetch processing to the first face
It rings.
103, microetch processing is carried out to the first face, then removes corrosion stability film；
Microetch processing is carried out to the first face, so that copper thickness reduces, becomes round and smooth to reach line shoulder, is draped over one's shoulders to reduce
Then the formation at peak removes corrosion stability film to achieve the purpose that prevent the injury of the excessively multipair glass of peak；
Wherein, when carrying out microetch processing to the first face, etch depth is controlled between 0.4-0.6mm, is avoided due to list
Lateral erosion depth is excessive, impacts to microetch processing is carried out in the second face.
104, the printing resin on the copper foil circuit in microetch treated the first face；
On the copper foil circuit in the first face after plug socket resin of the print thickness value between 5-15um, consent tree can use
Rouge covers in the peak on line shoulder, so that certain buffer function is played to the extruding of glass in lamination, thus in certain journey
Prevent glass from rupturing on degree.
105, under preset time and preset temperature, segmentation precuring is carried out to the copper foil after printing resin；
Under the conditions of certain temperature and time, segmentation precuring is carried out to plug socket resin, can be squeezed out in plug socket resin
Remaining diluent, volatilizer, bubble or air can prevent the feelings due to breaking of rod when bubble or air remain and cause to drill
Condition occurs, and avoids generating a large amount of bad.
106, the first prepreg and the first face are bonded；
First prepreg and the first face are bonded, wherein first faces outwardly；
107, first time laminating operation will be executed after first substrate and the bonding of the first prepreg；
108, inner figure transfer is carried out to the second face and is covered first substrate with corrosion stability film；
109, the operation of microetch processing, printing resin, bonding, segmentation precuring and lamination is carried out to the second face；
After completing to the processing in the first face, identical processing is done to the second face, is finally completed two-sided etching.
A kind of printed circuit board process for pressing provided in an embodiment of the present invention, including with corrosion stability film by the of copper foil surface
The covering of two faces；Microetch processing is carried out to the first face, so that copper thickness reduces, then removes corrosion stability film；At microetch
Printing resin on the copper foil circuit in the first face after reason；Under preset time and preset temperature, to the copper after printing resin
Foil carries out segmentation precuring；First prepreg and the first face are bonded, first faces outwardly；By first substrate and the first semi-solid preparation
First time laminating operation is executed after piece bonding, solves in the prior art since etching is formed by peak in lamination, causes
The problem of fiberglass machinery is easily broken when squeezing.
Referring to figure 2., Fig. 4 to Figure 11, a kind of another embodiment of printed circuit board process for pressing in the embodiment of the present invention
Include:
201, after completing copper foil surface cleaning treatment, inner figure is transferred to the of copper foil surface by single side etching
On on one side；
202, the second face of copper foil surface is covered with corrosion stability film；
The second face is covered with corrosion stability film, so that the second face is not by shadow when carrying out microetch processing to the first face
It rings.
203, microetch processing is carried out to the first face, then removes corrosion stability film；
To the first face carry out microetch processing, until the first face copper thickness reduction numerical value between 20-30um with
Reduce copper thickness, become round and smooth to reach line shoulder, to reduce the formation of peak, prevents the excessively multipair glass of peak to reach
Injury purpose, then remove corrosion stability film；
Wherein, when carrying out microetch processing to the first face, etch depth is controlled between 0.4-0.6mm, is avoided due to list
Lateral erosion depth is excessive, impacts to microetch processing is carried out in the second face.
204, the printing resin on the copper foil circuit in microetch treated the first face；
On the copper foil circuit in the first face after plug socket resin of the print thickness value between 5-15um, consent tree can use
Rouge covers in the peak on line shoulder, so that certain buffer function is played to the extruding of glass in lamination, thus in certain journey
Prevent glass from rupturing on degree.
205, under preset time and preset temperature, segmentation precuring is carried out to the copper foil after printing resin；
Wherein, completing the segmentation precuring mainly includes first stage, second stage, phase III and fourth stage, in advance
If time and preset temperature specifically include:
The numberical range of preset time is in the first stage 25-35min to fourth stage；
Preset temperature is 75-85 DEG C in the first stage；
Preset temperature is 95-105 DEG C in second stage；
Preset temperature is 105-115 DEG C in the phase III；
Preset temperature is 145-155 DEG C in fourth stage.
Under the conditions of certain temperature and time, segmentation precuring is carried out to plug socket resin, can be squeezed out in plug socket resin
Remaining diluent, volatilizer, bubble or air can prevent from keeping away due to breaking of rod when bubble or air remain and cause to drill
It is a large amount of bad to exempt from generation, greatly improves yields.
206, the first prepreg and the first face are bonded；
First prepreg and the first face are bonded, wherein first faces outwardly；
207, the first false core plate is put into the centre of the first prepreg；
Wherein, the first false core plate is equal with the adjacent relative distance of the first prepreg；
After the centre of the first semi-solid preparation is put into false core plate, it can prevent prepreg from remaining excessive glue and due to balance
Inner figure it is uneven, and lead to the problem in uneven thickness of printed circuit board, while also avoiding outer graphics production
When occur notch and open circuit the problem of；
It should be noted that the configuration quantity of vacation core plate and thickness are not construed as limiting herein, particular condition in use root
It is determined according to the thickness of actual depth and the medium of required filling.
208, first time laminating operation will be executed after first substrate and the bonding of the first prepreg；
209, inner figure transfer is carried out to the second face and is covered first substrate with corrosion stability film；
210, the operation of microetch processing, printing resin, bonding, segmentation precuring and lamination is carried out to the second face；
Wherein, to the second face carry out microetch processing, until the first face copper thickness reduction numerical value 20-30um it
Between so that copper thickness reduce, become round and smooth to reach line shoulder, to reduce the formation of peak, prevent peak excessive to reach
To the purpose of the injury of glass, then remove corrosion stability film；
The printing resin on the copper foil circuit in microetch treated the second face；
Under preset time and preset temperature, segmentation precuring is carried out to the copper foil after printing resin；
Second prepreg and the second face are bonded；
Second of laminating operation will be executed after the second substrate and the bonding of the second prepreg.
It should be noted that the second false core plate is equally put into the centre of the second prepreg when handling the second face, the
Two false core plates are equal with the adjacent relative distance of the second cured sheets；
After completing to the processing in the first face, identical processing is done to the second face, is finally completed two-sided etching.
A kind of printed circuit board process for pressing provided in an embodiment of the present invention, including with corrosion stability film by the of copper foil surface
The covering of two faces；Microetch processing is carried out to the first face, so that copper thickness reduces, then removes corrosion stability film；At microetch
Printing resin on the copper foil circuit in the first face after reason is solved and is being laminated in the prior art since etching is formed by peak
When, the problem of being easily broken when fiberglass machinery being caused to squeeze under preset time and preset temperature, after printing resin
Copper foil carries out segmentation precuring, can prevent due to breaking of rod when bubble or air remain and cause to drill；By the first prepreg
Before the bonding of the first face, the second false core plate is put into the groove of the second prepreg, prevent prepreg remain excessive glue and
Due to balancing the uneven of inner figure, and lead to the problem in uneven thickness of printed circuit board.
For ease of understanding, below with a specific application scenarios to being described in detail in the embodiment of the present invention, the present invention
A kind of printed circuit board process for pressing, another embodiment include: in embodiment
Referring to figure 3., Fig. 4 to Figure 11, a kind of printed circuit board process for pressing one embodiment packet in the embodiment of the present invention
It includes:
301, after completing copper foil surface cleaning treatment, inner figure is transferred to the of copper foil surface by single side etching
On on one side；
302, the second face of copper foil surface is covered with photoresist dry film；
The second face is covered with photoresist dry film, so that when carrying out microetch processing to the first face, the second face
It is unaffected.
303, microetch processing is carried out to the first face, then removes photoresist dry film；
To the first face carry out microetch processing, until the first face copper thickness reduction numerical value in 25um, to reach line
Shoulder becomes round and smooth, to reduce the formation of peak, to achieve the purpose that prevent the injury of the excessively multipair glass of peak, then removes light
Cause resist dry film film；
When carrying out microetch processing to the first face, etch depth control is 0.5mm, is avoided due to unilateral etch depth mistake
Greatly, it is impacted in the second face progress microetch processing.
304, the plug socket resin resin that print thickness value is 10um on the copper foil circuit in microetch treated the first face；
After the plug socket resin that print thickness value is 10um on the copper foil circuit in the first face, plug socket resin covering can use
The firmly peak on line shoulder, so that certain buffer function is played to the extruding of glass in lamination, to prevent to a certain extent
Only glass ruptures.
305, under preset time and preset temperature, segmentation precuring is carried out to the copper foil after printing resin；
Wherein, preset time and preset temperature specifically include:
The preset time is in the first stage 30min to fourth stage；
Preset temperature is 80 DEG C in the first stage；
Preset temperature is 100 DEG C in second stage；
Preset temperature is 110 DEG C in the phase III；
Preset temperature is 150 DEG C in fourth stage.
Under the conditions of certain temperature and time, segmentation precuring is carried out to plug socket resin, can be squeezed out in plug socket resin
Remaining diluent, volatilizer, bubble or air can prevent from keeping away due to breaking of rod when bubble or air remain and cause to drill
It is a large amount of bad to exempt from generation, greatly improves yields.
306,2 prepregs and the first face are bonded；
2 prepregs and the first face are bonded, wherein first facing towards this 2 prepregs；
307, a false core plate is put into the centre of 2 prepregs；
Wherein, false core plate or so respectively has 1 prepreg, after the centre of 2 semi-solid preparations is put into false core plate, can prevent
Prepreg remains excessive glue and due to balancing the uneven of inner figure, and leads to the in uneven thickness of printed circuit board
Problem, while also avoiding occurring the problem of notch and open circuit when outer graphics production.
308, first time laminating operation will be executed after first substrate and the bonding of the first prepreg；
309, inner figure transfer is carried out to the second face and is covered first substrate with corrosion stability film；
310, the operation of microetch processing, printing resin, bonding, segmentation precuring and lamination is carried out to the second face；
Wherein, to the second face carry out microetch processing, until the second face copper thickness reduction numerical value in 25um, to reach
Become round and smooth to line shoulder, to reduce the formation of peak, to achieve the purpose that prevent the injury of the excessively multipair glass of peak, then goes
Fall corrosion stability film；
The printing resin on the copper foil circuit in microetch treated the second face；
Under preset time and preset temperature, segmentation precuring is carried out to the copper foil after printing resin；
2 prepregs and the second face are bonded；
Second of laminating operation will be executed after the second substrate and 2 prepreg bondings.
It should be noted that one false core plate is equally put into the centre of 2 prepregs when handling the second face,
In, false core plate or so respectively has 1 prepreg；
After completing to the processing in the first face, identical processing is done to the second face, is finally completed two-sided etching.
A kind of printed circuit board process for pressing provided in an embodiment of the present invention, including with corrosion stability film by the of copper foil surface
The covering of two faces；Microetch processing is carried out to the first face, so that copper thickness reduces, then removes corrosion stability film；At microetch
Printing resin on the copper foil circuit in the first face after reason is solved and is being laminated in the prior art since etching is formed by peak
When, the problem of being easily broken when fiberglass machinery being caused to squeeze under preset time and preset temperature, after printing resin
Copper foil carries out segmentation precuring, can prevent due to breaking of rod when bubble or air remain and cause to drill；By the first prepreg
Before the bonding of the first face, a false core plate is put into the groove of the second prepreg, prevent prepreg remain excessive glue and
Due to balancing the uneven of inner figure, and lead to the problem in uneven thickness of printed circuit board.
One kind provided by the present invention is described in detail above, specific case used herein is to of the invention
Principle and embodiment is expounded, method and its core of the invention that the above embodiments are only used to help understand
Thought；At the same time, for those skilled in the art, according to the thought of the present invention, in specific embodiment and application range
Upper there will be changes, and to sum up, the contents of this specification are not to be construed as limiting the invention.
Claims (6)
1. a kind of printed circuit board process for pressing characterized by comprising
After completing copper foil surface cleaning treatment, the first face that inner figure is transferred to the copper foil surface is etched by single side
On；
The second face of the copper foil surface is covered with corrosion stability film, the corrosion stability film is photoresist dry film；
Microetch processing is carried out to first face, so that copper thickness reduces, then removes corrosion stability film；
The printing resin on the copper foil circuit in microetch treated first face；
Under preset time and preset temperature, segmentation precuring is carried out to the copper foil after printing resin；
First prepreg and first face are bonded, described first facing towards first prepreg；
First time laminating operation will be executed after first substrate and first prepreg bonding；
Inner figure transfer is carried out to second face and is covered the first substrate with the corrosion stability film；
The operation of microetch processing, printing resin, bonding, segmentation precuring and lamination is carried out to second face；
It is described that progress microetch processing in first face is specifically included:
To first face carry out microetch processing, until first face copper thickness reduction numerical value 20-30um it
Between；
Further, described that progress microetch processing in second face is specifically included:
To second face carry out microetch processing, until second face copper thickness reduction numerical value 20-30um it
Between；
The quantity of first prepreg and the quantity of the second prepreg, the thickness of the first false core plate and the second false core plate
The thickness of the medium that the depth and needs that thickness etches as needed are filled determines.
2. technique according to claim 1, which is characterized in that described to carry out microetch processing, printing to second face
Resin, bonding, segmentation precuring and the operation of lamination specifically include:
Microetch processing is carried out to second face, so that copper thickness reduces, then removes corrosion stability film；
The printing resin on the copper foil circuit in microetch treated second face；
Under preset time and preset temperature, segmentation precuring is carried out to the copper foil after printing resin；
Second prepreg and second face are bonded；
Second of laminating operation will be executed after the second substrate and second prepreg bonding.
3. technique according to claim 2, which is characterized in that the segmentation precuring include the first stage, second stage,
Phase III and fourth stage, the preset time and preset temperature specifically include:
The numberical range of the preset time is 25-35min in the first stage to the fourth stage；
The preset temperature is 75-85 DEG C in the first stage；
The preset temperature is 95-105 DEG C in second stage；
The preset temperature is 105-115 DEG C in the phase III；
The preset temperature is 145-155 DEG C in fourth stage.
4. technique according to claim 2 or 3, which is characterized in that carry out the etching of single side etching to the copper foil surface
Depth is between 0.4-0.6mm.
5. technique according to claim 2 or 3, which is characterized in that the copper foil in microetch treated the first face
Printing resin specifically includes on route:
Plug socket resin of the print thickness value between 5-15um on the copper foil circuit.
6. a kind of printed circuit board, which is characterized in that the printed circuit board is using any technique of claim 1 to 5
It is made.
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| CN110572948B (en) * | 2019-09-26 | 2024-06-18 | 深圳明阳电路科技股份有限公司 | Laser engraving circuit board and manufacturing method thereof |
| CN115250586B (en) * | 2022-09-21 | 2022-12-06 | 四川英创力电子科技股份有限公司 | Copper-embedded printed circuit board processing method and copper-embedded printed circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861049A (en) * | 2009-04-08 | 2010-10-13 | 昆山市华升电路板有限公司 | Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof |
| CN102291946A (en) * | 2011-07-27 | 2011-12-21 | 深南电路有限公司 | Method for manufacturing thick copper circuit board |
| CN102404942A (en) * | 2010-09-08 | 2012-04-04 | 田先平 | Method of manufacturing thick copper foil PCB (Printed Circuit Board) |
| CN102448252A (en) * | 2010-10-13 | 2012-05-09 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of circuit board |
| CN104684257A (en) * | 2013-11-29 | 2015-06-03 | 深南电路有限公司 | Processing method of thick copper circuit board |
-
2014
- 2014-09-03 CN CN201410446671.0A patent/CN105472908B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861049A (en) * | 2009-04-08 | 2010-10-13 | 昆山市华升电路板有限公司 | Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof |
| CN102404942A (en) * | 2010-09-08 | 2012-04-04 | 田先平 | Method of manufacturing thick copper foil PCB (Printed Circuit Board) |
| CN102448252A (en) * | 2010-10-13 | 2012-05-09 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of circuit board |
| CN102291946A (en) * | 2011-07-27 | 2011-12-21 | 深南电路有限公司 | Method for manufacturing thick copper circuit board |
| CN104684257A (en) * | 2013-11-29 | 2015-06-03 | 深南电路有限公司 | Processing method of thick copper circuit board |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |