CN105934099B - The alignment method and its positioning mechanism of the two-sided bonding methods of FOP, the two-sided bondings of FOP - Google Patents
The alignment method and its positioning mechanism of the two-sided bonding methods of FOP, the two-sided bondings of FOP Download PDFInfo
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- CN105934099B CN105934099B CN201610352300.5A CN201610352300A CN105934099B CN 105934099 B CN105934099 B CN 105934099B CN 201610352300 A CN201610352300 A CN 201610352300A CN 105934099 B CN105934099 B CN 105934099B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Microelectronics & Electronic Packaging (AREA)
- Apparatus For Radiation Diagnosis (AREA)
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Abstract
The present invention relates to the alignment methods and its positioning mechanism of a kind of two-sided bonding methods of FOP, the two-sided bondings of FOP.The alignment method of the two-sided bondings of above-mentioned FOP is used to determine the first end bonding of FPC in the position in the first side of the film, including step：By the x-ray bombardment film, X-ray penetrates the film and the second end of FPC successively；The X-ray that will transmit through the film and the second end of FPC is converted to the first image；The first image is acquired by CCD components, to obtain the first image data；Bend FPC；By the first end of x-ray bombardment FPC, X-ray penetrates the first end of FPC, the second end of the film and FPC successively；It will transmit through the first end of FPC, the X-ray of the second end of the film and FPC is converted to the second image；The second image is acquired by CCD components, to obtain the second image data；The alignment method of the two-sided bondings of above-mentioned FOP solves the problems, such as that the precision of the two-sided bondings of FOP is relatively low.
Description
Technical field
The present invention relates to the technical fields of FPC bondings, more particularly to pair of the two-sided bonding methods of FOP, the two-sided bondings of FOP
Position method and its positioning mechanism.
Background technology
The step of general FOP (FPC On Pet, the flexible PCB being located on the film) two-sided bonding is first will be luxuriant and rich with fragrance
One end bonding in the faces A and FPC (Flexible Printed Circuit board, flexible PCB) of woods, secondly by the film
The faces A overturn to the faces B of the film, the other end of FPC is passed through into CCD (Charge-coupled Device, Charged Couple again
Element) component aligned, and it finally overturns the other end of FPC and carries out bonding with the faces B of the film.
The step of above-mentioned FOP two-sided bondings, the positioning for first passing through CCD components overturns FPC again, with the other side with the film
Carry out bonding, due to during overturning FPC there are rotational variations, so the bonding in the faces B of the other end of FPC and the film
There are deviations for position, to keep the precision of the two-sided bondings of FOP relatively low.
Invention content
Based on this, it is necessary to for the relatively low problem of precision of the two-sided bondings of FOP, provide a kind of two-sided bonding method of FOP,
The alignment method and its positioning mechanism of the two-sided bondings of FOP.
A kind of alignment method of the two-sided bondings of FOP, for determining the first end bonding of FPC in the first side of the film
Position, including step：
By the film described in x-ray bombardment, the X-ray penetrates the second end of the film and the FPC successively；
The X-ray that will transmit through the second end of the film and the FPC is converted to the first image；
Described first image is acquired by CCD components, to obtain the first image data；
Bend the FPC；
By the first end of FPC described in the x-ray bombardment, the X-ray penetrates the first end of the FPC, institute successively
State the second end of the film and the FPC；
It will transmit through the first end of the FPC, the X-ray of the second end of the film and the FPC is converted to second
Image；
Second image is acquired by the CCD components, to obtain the second image data；And
Described first image data and second image data are compared, with the first end bonding of the determination FPC in institute
State the position in the first side of the film
A kind of method of the two-sided bondings of FOP, for by the first end bonding of FPC in the first side of the film, and by institute
The second end bonding of FPC is stated in the second side of the film, including step：
By the second end bonding of the FPC in the second side of the film；
Overturn the FPC and the film；
Determine the first end bonding of the FPC in described by the alignment method of the two-sided bondings of FOP described in claim 1
Position in the first side of the film；
Adjust the position of the second end of the film and the FPC；And
By the first end bonding of the FPC in the first side of the film.
A kind of positioning mechanism of the two-sided bondings of FOP, for determining the first end bonding of FPC in the first side of the film
Position, including：
X-ray emitter, for generating the X-ray for irradiating the film and the FPC；
Image intensifier, the X-ray for will transmit through the film and the FPC are converted into image；
Foldable component, for bending the FPC；
Between CCD components, with the X-ray emitter can relative motion, described image booster is set to the CCD
On component, the CCD components are for acquiring described image；And
Controller, the foldable component for comparing the CCD components acquisition bend the described image before and after the FPC
Data, with the first end bonding of the determination FPC in the position in the first side of the film.
The foldable component includes suction disc and rotary electric machine in one of the embodiments,；The suction disc is for adsorbing institute
The first end of FPC is stated, the suction disc is set on the power output end of the rotary electric machine, and the rotary electric machine drives the suction
Plate rotates, and the first end of FPC is bent relative to the second end of FPC, and the first end of FPC is made to be located at film top.
The positioning mechanism of the device of the two-sided bondings of FOP further includes microscope carrier and driving motor in one of the embodiments,；Institute
Microscope carrier is stated for placing the FPC and the film；The microscope carrier is connect with the power output end of the driving motor, the drive
Dynamic motor is communicated to connect with the controller, and the controller controls the driving motor and drives the microscope carrier movement.
The positioning mechanism of the device of the two-sided bondings of FOP further includes the first slide assemblies and in one of the embodiments,
Two slide assemblies, between first slide assemblies and second slide assemblies can relative motion, and it is described first sliding
Component and second slide assemblies are located at the both sides of the microscope carrier, and the X-ray emitter is set to described first and slides
On dynamic component, the CCD components are set on second slide assemblies, make the CCD components and the X-ray emitter it
Between being capable of relative motion.
The light-emitting surface of the X-ray emitter and the incidence surface of described image booster are flat in one of the embodiments,
Row enables the X-ray through FPC preferably to enter image intensifier, can reduce the distortion that X-ray is converted into image.
The light-emitting surface of described image booster is abutted with the incidence surface of the CCD components in one of the embodiments, is made
CCD components can preferably acquire image.
The alignment method and its positioning mechanism of the two-sided bonding methods of above-mentioned FOP, the two-sided bondings of FOP, when by the second of FPC
It holds bonding after the second side of the film, overturns FPC and the film；Before bending FPC, the x-ray bombardment film, X-ray is worn successively
The second end of the saturating film and FPC；Bend FPC after, the first end of x-ray bombardment FPC, X-ray penetrate successively FPC first end,
The second end of the film and FPC；Since the golden finger on FPC is set to the side of FPC, however golden finger of the X-ray on FPC
Penetrability is less than the penetrability in other regions on FPC, and the penetrability of golden finger of the X-ray on the film is less than its on the film
The penetrability in his region, and the number for the FPC of the X-ray before and after bending FPC penetrated is also different, so before being bent by FPC
The power of X-ray afterwards is different；The X-ray that will transmit through FPC is converted to image, due to passing through the strong of the X-ray after FPC and the film
Weak difference, so image can be converted into through the X-ray of FPC and the film；It will be corresponded to by the image acquired before and after CCD components
Image data be compared, to determine the position of the golden finger on FPC and the film, so as to by the gold of the first end of FPC
Finger accurately bonding in the position in the corresponding first side of golden finger of the film, solve the precision of the two-sided bondings of FOP compared with
Low problem.
Description of the drawings
Fig. 1 is the schematic diagram of the positioning mechanism of the two-sided bondings of FOP of an embodiment；
Fig. 1 a are partial enlarged view at the A of the positioning mechanism of the two-sided bondings of FOP shown in Fig. 1；
Fig. 2 is the flow chart of the method for the two-sided bondings of FOP of an embodiment；
Fig. 3 is the flow chart of the alignment method of the two-sided bondings of FOP of an embodiment.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to the two-sided bonding methods of FOP, FOP two-sided bondings
Alignment method and its positioning mechanism are described more fully.The two-sided bonding methods of FOP, the two-sided bondings of FOP are given in attached drawing
Alignment method and its positioning mechanism preferred embodiment.But the alignment method of the two-sided bonding methods of FOP, the two-sided bondings of FOP
And its positioning mechanism can be realized in many different forms, however it is not limited to embodiment described herein.On the contrary, providing
The purpose of these embodiments is to make the disclosure of alignment method and its positioning mechanism to the two-sided bonding methods of FOP, the two-sided bondings of FOP
Content is more thorough and comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Herein the two-sided bonding methods of FOP, the two-sided bondings of FOP alignment method and its
The term used in the description of positioning mechanism, which is only for the purpose of describing specific embodiments, is not intended to limit this
Invention.Term " and or " used herein includes any and all combinations of one or more relevant Listed Items.
As shown in Figure 1, the positioning mechanism 10 of the two-sided bondings of the FOP of an embodiment is for determining FPC20 bondings in the film 30
On position.As shown in Figure 1a, specifically, 22 nation of first end for the determination FPC20 that the positioning mechanism 10 of the two-sided bondings of FOP is used for
Position in the first side 32 of the film 30.The golden finger of FPC20 is set in the second side of FPC20.The film 30
Golden finger is set in the second side 34 of the film 30.The two-sided bondings of FOP, i.e., by the second end 24 in the second side of FPC20
Golden finger bonding on the golden finger of the second side 34 on the film 30, and by the first end 22 in the second side of FPC20
Golden finger bonding in the first side 32 on the film 30.The golden finger bonding of first end 22 in the second side of FPC20
It is corresponding with the golden finger of the film 30 in the position in the first side 32 on the film 30, so that the circuit of 30 both sides of the film carries out
Electrical connection.
As shown in Figure 1, positioning mechanism 10 include X-ray emitter 300, image intensifier 400, foldable component (in figure not
Show), CCD components 500 and controller (not shown).X-ray emitter 300 is for generating irradiation 30 He of the film
The X-ray of FPC20.Image intensifier 400 is used to will transmit through the film 30 and the X-ray of the second end 24 of FPC20 is converted into figure
Picture.Foldable component is for bending FPC20.It being capable of relative motion between CCD components 500 and X-ray emitter 300.Image enhancement
Device 400 is set on CCD components 500.CCD components 500 are for acquiring image.As shown in Figure 1a, controller is for comparing CCD groups
Image data before and after the foldable component bending FPC of part acquisition, to determine 22 bonding of first end of FPC20 in the first of the film 30
Position on side 32.In the present embodiment, image intensifier 400 is fixedly installed on CCD components 500.CCD components 500 will
For the data transmission of the image collected to the controller of positioning mechanism 10, it is curved that controller compares the foldable component that CCD components acquire
Roll over the image data before and after FPC20 and out position makes corrections data, make the 22 accurate bonding of first end of FPC20 in the of the film 30
Position on one side 32.Foldable component is set in extraneous rack (not shown).
Foldable component includes suction disc and rotary electric machine in one of the embodiments,.Suction disc is for adsorbing the first of FPC20
End 22, suction disc is set on the power output end of rotary electric machine, and rotary electric machine drives suction disc rotation, makes the first end 22 of FPC20
It is connected on the film 30.In the present embodiment, rotary electric machine is fixedly installed in extraneous rack, and suction disc is set to rotary electric machine
Output shaft on, rotary electric machine drives suction disc rotation, the first end 22 of FPC20 to bend, make relative to the second end 24 of FPC20
The first end 22 of FPC20 is located at 30 top 1mm of the film.
As shown in Figure 1, the positioning mechanism 10 of the device of the two-sided bondings of FOP further includes microscope carrier in one of the embodiments,
800 and driving motor (not shown), microscope carrier 800 is for placing FPC20 and the film 30.The power of microscope carrier and driving motor is defeated
Outlet connects, and driving motor is communicated to connect with controller, and controller controls driving motor driving microscope carrier movement.In the present embodiment
In, controller and driving motor with the PLC of the device of the two-sided bondings of FOP (Programmable Logic Controller,
Programmable logic controller (PLC)) (not shown) communication connection.Microscope carrier 800 is set on the power output end of driving motor, control
Position correction data are delivered to PLC by device processed, and PLC is moved according to position correction data control driving motor driving microscope carrier.Such as figure
Shown in 1a, since the first end 22 of FPC20 is adsorbed on suction disc, so when driving motor driving microscope carrier movement, the first of FPC20
22 remains stationaries are held, microscope carrier drives the second end 24 of FPC20 and the film 30 to move, with the second end 24 and the film 30 to FPC20
Position be adjusted.
As shown in Figure 1, the positioning mechanism 10 of the device of the two-sided bondings of FOP further includes first in one of the embodiments,
Slide assemblies 600 and the second slide assemblies 700, being capable of opposite fortune between the first slide assemblies 600 and the second slide assemblies 700
It is dynamic, and the first slide assemblies 600 and the second slide assemblies 700 are located at the both sides of microscope carrier, X-ray emitter 300 is set to
On first slide assemblies 600, CCD components 500 are set on the second slide assemblies 700, make CCD components 500 and X-ray emitter
It being capable of relative motion between 300.First slide assemblies 600 and the second slide assemblies 700 are relatively arranged in vertical plane, and first
Slide assemblies 600 are located at the top of microscope carrier 800, and the second slide assemblies 700 are located at the lower section of microscope carrier 800.X-ray emitter 300
It is set to the lower section of the first slide assemblies 600, the first slide assemblies 600 drive 300 elevating movement of X-ray emitter.CCD components
500 are set to the top of the second slide assemblies 700, and the second slide assemblies 700 drive 500 elevating movement of CCD components.Specifically at this
In embodiment, the first slide assemblies 600 and the both ends that the second slide assemblies 700 are Z axis module, and 600 He of the first slide assemblies
Between second slide assemblies 700 can relative motion, with adjust microscope carrier 800 respectively with X-ray emitter 300 and image intensifier
The distance between 400, so that CCD components 500 is collected the image data of various sizes of FPC20 and the film 30.
As shown in Figure 1, the light-emitting surface Yu image intensifier 400 of X-ray emitter 300 in one of the embodiments,
Incidence surface is parallel, so that the X-ray through FPC20 is preferably entered image intensifier 400, can reduce X-ray and be converted into
The distortion of image.The light-emitting surface of image intensifier 400 and the incidence surface of CCD components 500 support in one of the embodiments,
It connects, CCD components 500 is allow preferably to acquire image.
A kind of method of the two-sided bondings of FOP is used for 22 bonding of first end of FPC20 in the first side 32 of the film 30,
And by 24 bonding of the second end of FPC20 in the second side 34 of the film 30.As shown in Fig. 2, the method for the two-sided bondings of FOP includes
Step：
S102, by 24 bonding of second end of FPC20 in the second side 34 of 30 (not shown) of the film.
By bonding component (not shown) by the golden finger bonding of the second end 24 in the second side 34 of FPC20 in
Golden finger in the second side 34 of the film 30.
S104 overturns FPC20 and the film 30.
The film 30 is sucked by overturning the suction disc in component (not shown), the driving of drive motor (not shown) is inhaled
FPC20 and the film 30 are overturn 180 ° by plate action.
S106 determines 22 bonding of first end of FPC20 in the first side of the film 30 by the alignment method of the two-sided bondings of FOP
Position on face 32.
As shown in figure 3, a kind of alignment method of the two-sided bondings of FOP is used to determine 22 bonding of first end of FPC20 in the film
Position in 30 first side 32.The alignment method of the two-sided bondings of FOP includes step：
S202, by the x-ray bombardment film 30, X-ray penetrates the film 30 and the second end 24 of FPC20 successively.
S204, the X-ray that will transmit through the film 30 and the second end 24 of FPC20 are converted to the first image.
X-ray is the transition due to the electronics in atom between two energy levels that energy differs greatly and the particle generated
Stream.X-ray is the electromagnetic wave between ultraviolet light and gamma-rays.The wavelength of X-ray is about between 0.01~100 angstrom.X is penetrated
Line, also known as roentgen-ray have very high penetrability.As x-ray bombardment FPC20, X-ray penetrates 30 He of the film successively
The second end 24 of FPC20.It is less than penetrating for other regions on FPC20 due to the penetrability of golden finger of the X-ray on FPC20
Property, and the penetrability of golden finger of the X-ray on the film 30 is less than the penetrability in other regions on the film 30, so passing through
The power of X-ray after FPC20 and the film 30 is different.X-ray can be generated by X-ray emitter 300.
S206 acquires the first image, to obtain the first image data by CCD components.
Since the power of the X-ray after the second end 24 by FPC20 is different, so after through the second end 24 of FPC20
X-ray can be converted into image.It can be 400 turns by image intensifier through the X-ray after the second end 24 of FPC20
Change, since the power of the X-ray after the second end 24 by FPC20 is different, so being penetrated through the X of the second end 24 after FPC20
Line can be converted into the image of light and shade different zones by image intensifier 400.
S208 bends FPC20.
Rotary electric machine is fixedly installed in extraneous rack, and suction disc is set on the output shaft of rotary electric machine, can be passed through
Rotary electric machine drives suction disc rotation, the first end 22 of FPC20 to be bent relative to the second end 24 of FPC20, makes the first end of FPC20
22 are located at 30 top 1mm of the film.
S212, by the first end 22 of x-ray bombardment FPC20, X-ray penetrates the first end 22 of FPC20, the film 30 successively
With the second end 24 of FPC20.
S214 will transmit through the first end 22 of FPC20, the X-ray of the second end 24 of the film 30 and FPC20 is converted to the second figure
Picture.
S216 acquires the second image, to obtain the second image data by CCD components 500.And
S218 compares the first image data and the second image data, to determine 22 bonding of first end of FPC20 in the film 30
First side 32 on position.Controller compares the first image data and the second image data and obtains out position correction data.
Referring again to Fig. 2, S107, the position of the film 30 and FPC20 second ends 24 is adjusted.
Position correction data are delivered to PLC by controller, and PLC drives microscope carrier according to position correction data control driving motor
Movement.Since the first end 22 of FPC20 is adsorbed on suction disc, so when driving motor driving microscope carrier movement, the first end of FPC20
22 remains stationaries, microscope carrier drive the second end 24 of FPC20 and the film 30 to move, with the second end 24 and the film 30 to FPC20
Position is adjusted.After the adjustment of position, controller controls suction disc and unclamps the first end 22 of FPC20, and controls driving motor driving
FPC20 is accurately moved in (not shown) of presenting a theatrical performance as the last item on a programme and carries out precompressed by microscope carrier, another in the second side of FPC20 to make
The golden finger of one end can accurately bonding in the gold in the second side 34 with the film 30 in the first side 32 on the film 30
The opposite position of finger.
Referring again to Fig. 2, S108, by 22 bonding of first end of FPC20 in the first side 32 of the film 30.
Pre- pressure head in the first end 22 of the FPC20 on presenting a theatrical performance as the last item on a programme and the first side 32 of the film 30 to carrying out precompressed, thus will
The golden finger bonding of the other end in the second side of FPC20 is in the second side with the film 30 in the first side 32 on the film 30
The opposite position of golden finger on face 34.
The two-sided bonding methods of FOP of the present embodiment, the alignment method and its positioning mechanism 10 of the two-sided bondings of FOP, as general
24 bonding of second end of FPC20 overturns FPC20 and the film 30 after the second side 34 of the film 30.Before bending FPC20, X is penetrated
Line irradiates the film 30, and X-ray penetrates the film 30 and the second end 24 of FPC20 successively.After bending FPC30, x-ray bombardment FPC20
First end 22, X-ray penetrates the first end 22 of FPC20, the second end 24 of the film 30 and FPC20 successively.Due on FPC20
Golden finger is set to the side of FPC20, however the penetrability of golden finger of the X-ray on FPC20 is less than other regions on FPC20
Penetrability, the penetrability of golden finger of the X-ray on the film 30 is less than the penetrability in other regions on the film 30, and bends
The number for the FPC30 of X-ray before and after FPC20 penetrated is also different, so passing through the power of the front and back X-ray of FPC20 bendings
It is different.The X-ray that will transmit through FPC20 is converted to image, due to different by the power of the X-ray after FPC20 and the film, so
It can be converted into image through the X-ray of FPC20 and the film.To be acquired by CCD components 500 the corresponding image data of image into
Row compares, to determine the position of the golden finger on FPC20 and the film, so as to which the golden finger of the first end 22 of FPC20 is accurate
For true ground bonding in the position in the corresponding first side of golden finger 32 of the film 30, the precision for solving the two-sided bondings of FOP is relatively low
The problem of.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. a kind of alignment method of the two-sided bondings of FOP, for determining the first end bonding of FPC in the position in the first side of the film
It sets, which is characterized in that including step：
By the film described in x-ray bombardment, the X-ray penetrates the second end of the film and the FPC successively；
The X-ray that will transmit through the second end of the film and the FPC is converted to the first image；
Described first image is acquired by CCD components, to obtain the first image data；
Bend the FPC；
By the first end of FPC described in the x-ray bombardment, the X-ray penetrates the first end of the FPC, the phenanthrene successively
The second end of woods and the FPC；
It will transmit through the first end of the FPC, the X-ray of the second end of the film and the FPC is converted to the second image；
Second image is acquired by the CCD components, to obtain the second image data；And
Described first image data and second image data are compared, with the first end bonding of the determination FPC in the phenanthrene
Position in the first side of woods.
2. a kind of method of the two-sided bondings of FOP is used for the first end bonding of FPC in the first side of the film, and will be described
The second end bonding of FPC is in the second side of the film, which is characterized in that including step：
By the second end bonding of the FPC in the second side of the film；
Overturn the FPC and the film；
Determine the first end bonding of the FPC in the film by the alignment method of the two-sided bondings of FOP described in claim 1
First side on position；
Adjust the position of the second end of the film and the FPC；And
By the first end bonding of the FPC in the first side of the film.
3. a kind of positioning mechanism of the two-sided bondings of FOP, for determining the first end bonding of FPC in the position in the first side of the film
It sets, which is characterized in that including：
X-ray emitter, for generating the X-ray for irradiating the film and the FPC；
Image intensifier, the X-ray for will transmit through the film and the FPC are converted into image；
Foldable component, for bending the FPC；
Between CCD components, with the X-ray emitter can relative motion, described image booster is set to the CCD components
On, the CCD components are for acquiring described image；And
Controller, the foldable component for comparing the CCD components acquisition bend the number of the described image before and after the FPC
According to the first end bonding of the determination FPC in the position in the first side of the film.
4. the positioning mechanism of the two-sided bondings of FOP according to claim 3, which is characterized in that the foldable component includes inhaling
Plate and rotary electric machine；The suction disc is used to adsorb the first end of the FPC, and the suction disc is set to the power of the rotary electric machine
On output end, the rotary electric machine drives the suction disc rotation, and the first end of the FPC is made to be connected on the film.
5. the positioning mechanism of the two-sided bondings of FOP according to claim 3, which is characterized in that further include microscope carrier and driving electricity
Machine；The microscope carrier is for placing the FPC and the film；The microscope carrier is connect with the power output end of the driving motor,
The driving motor is communicated to connect with the controller, and the controller controls the driving motor and drives the microscope carrier movement.
6. the positioning mechanism of the two-sided bondings of FOP according to claim 5, which is characterized in that further include the first slide assemblies
With the second slide assemblies, between first slide assemblies and second slide assemblies can relative motion, and described first
Slide assemblies and second slide assemblies are located at the both sides of the microscope carrier, and the X-ray emitter is set to described
On one slide assemblies, the CCD components are set on second slide assemblies, and the CCD components is made to occur with the X-ray
It being capable of relative motion between device.
7. the positioning mechanism of the two-sided bondings of FOP according to claim 3, which is characterized in that the X-ray emitter goes out
Smooth surface is parallel with the incidence surface of described image booster.
8. the positioning mechanism of the two-sided bondings of FOP according to claim 3, which is characterized in that described image booster goes out
Smooth surface is abutted with the incidence surface of the CCD components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352300.5A CN105934099B (en) | 2016-05-24 | 2016-05-24 | The alignment method and its positioning mechanism of the two-sided bonding methods of FOP, the two-sided bondings of FOP |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352300.5A CN105934099B (en) | 2016-05-24 | 2016-05-24 | The alignment method and its positioning mechanism of the two-sided bonding methods of FOP, the two-sided bondings of FOP |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105934099A CN105934099A (en) | 2016-09-07 |
| CN105934099B true CN105934099B (en) | 2018-11-06 |
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