JP6196131B2 - Metal foil for press bonding and electronic component package - Google Patents
Metal foil for press bonding and electronic component package Download PDFInfo
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- 229910052751 metal Inorganic materials 0.000 title claims description 80
- 239000002184 metal Substances 0.000 title claims description 80
- 239000011888 foil Substances 0.000 title claims description 74
- 229920005989 resin Polymers 0.000 claims description 153
- 239000011347 resin Substances 0.000 claims description 153
- 239000002245 particle Substances 0.000 claims description 115
- 230000001186 cumulative effect Effects 0.000 claims description 28
- 239000003963 antioxidant agent Substances 0.000 claims description 3
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- 238000009825 accumulation Methods 0.000 claims description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 32
- 239000000843 powder Substances 0.000 description 22
- 239000012790 adhesive layer Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 17
- 229910052709 silver Inorganic materials 0.000 description 16
- 239000004332 silver Substances 0.000 description 16
- 239000011889 copper foil Substances 0.000 description 15
- 239000011342 resin composition Substances 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
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- 238000003825 pressing Methods 0.000 description 7
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- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
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- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- LMWMTSCFTPQVCJ-UHFFFAOYSA-N 2-methylphenol;phenol Chemical compound OC1=CC=CC=C1.CC1=CC=CC=C1O LMWMTSCFTPQVCJ-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
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- 239000004642 Polyimide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
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- 125000003118 aryl group Chemical group 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
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- 239000010951 brass Substances 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
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- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- 238000005260 corrosion Methods 0.000 description 1
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- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
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- 238000001125 extrusion Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- CPSYWNLKRDURMG-UHFFFAOYSA-L hydron;manganese(2+);phosphate Chemical compound [Mn+2].OP([O-])([O-])=O CPSYWNLKRDURMG-UHFFFAOYSA-L 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920002113 octoxynol Polymers 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007152 ring opening metathesis polymerisation reaction Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Images
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
本発明は、導電樹脂層を備えたプレス接着用金属箔、並びに、これを用いた電子部品パッケージに関する。 The present invention relates to a metal foil for press bonding provided with a conductive resin layer, and an electronic component package using the same.
半導体チップとプリント配線基板とを実装する方法として、半導体チップの電極(パッド)と基板配線電極との間に導電性フィルムを挟み込んで熱圧着し、半導体チップとプリント配線基板の電極同士を、導電性フィルム中の導電性粒子によって導通するという、フリップチップ実装技術が知られている。 As a method of mounting a semiconductor chip and a printed wiring board, a conductive film is sandwiched between the electrodes (pads) of the semiconductor chip and the board wiring electrodes, and thermocompression bonding is performed. A flip chip mounting technique is known in which electrical conduction is made by conductive particles in a conductive film.
また、導電性フィルムとしての電磁波シールドフィルムをプリント配線板に貼着したり、プリント基板上に実装された送信系回路と受信系回路との間に電磁シールドフィルムを実装して、両者のカップリングを防止したりすることも行われている。 In addition, an electromagnetic shielding film as a conductive film is attached to a printed wiring board, or an electromagnetic shielding film is mounted between a transmission system circuit and a reception system circuit mounted on a printed circuit board to couple the two. It is also done to prevent.
この種の導電性フィルムとしては、例えば特許文献1(特開2003−298285号公報)には、電磁波シールド性接着フィルムとして、カバーフィルムの片面に、導電性接着剤層及び必要に応じて金属薄膜層からなるシールド層を有し、他方の面に接着剤層と離型性補強フィルムとが順次積層されてなる補強シールドフィルムが開示されている。 As this type of conductive film, for example, in Patent Document 1 (Japanese Patent Laid-Open No. 2003-298285), as an electromagnetic wave shielding adhesive film, a conductive adhesive layer and, if necessary, a metal thin film on one side of a cover film There is disclosed a reinforced shield film having a shield layer composed of layers, in which an adhesive layer and a releasable reinforcing film are sequentially laminated on the other surface.
特許文献2(特開2004−273577号公報)には、シールド層と芳香族ポリアミド樹脂からなるベースフィルムとを有するシールドフィルムが開示されていると共に、これを用いて共振回路を形成する方法として、フレキシブルプリント配線板のカバーレイにスルーホールを数カ所開けておき、グランド回路(アース回路)が露出するように加工しておき、次いで、シールドフィルムの導電性接着剤層とカバーレイを熱プレスで貼り合せた後、グランド回路と導電性接着剤層との接合部を形成して回路のグランドと銀蒸着層との間で共振回路を形成する方法が開示されている。 Patent Document 2 (Japanese Patent Application Laid-Open No. 2004-273577) discloses a shield film having a shield layer and a base film made of an aromatic polyamide resin, and a method for forming a resonance circuit using the shield film, Several through holes are opened in the cover lay of the flexible printed wiring board and processed so that the ground circuit (earth circuit) is exposed, and then the conductive adhesive layer of the shield film and the cover lay are attached by hot press. A method of forming a resonance circuit between the ground of the circuit and the silver deposition layer by forming a joint portion between the ground circuit and the conductive adhesive layer after being combined is disclosed.
特許文献3(特開2007−189091号公報)には、離型フィルムと、導電性粒子及びバインダを含む等方導電性接着剤層とを備えた等方導電性接着シートが開示されており、その使用方法として、離型フィルム付きの接着シートを回路基板に仮止めした後、離型フィルムを剥がし、補強板を導電性接着剤層表面に重ね合わせ、プレス加工(130〜190℃、1〜4MPa)で熱圧着し、補強板と電極とを低融点金属粉を介して電気的に接続させる方法が開示されている。 Patent Document 3 (Japanese Patent Application Laid-Open No. 2007-189091) discloses an isotropic conductive adhesive sheet including a release film and an isotropic conductive adhesive layer containing conductive particles and a binder. As the usage method, after temporarily fixing the adhesive sheet with the release film to the circuit board, the release film is peeled off, the reinforcing plate is superimposed on the surface of the conductive adhesive layer, and press working (130 to 190 ° C., 1 to 4 MPa), and a method of electrically connecting the reinforcing plate and the electrode via the low melting point metal powder is disclosed.
特許文献4(特開2009−191099号公報)には、多数の導電性粒子と、これら導電性粒子を分散したバインダとを有するフィルム状に形成された導電性接着剤層と、タック性を備えたタック性樹脂層と、を有する導電性接着シートが開示されている。 Patent Document 4 (Japanese Patent Application Laid-Open No. 2009-191099) includes a conductive adhesive layer formed in a film shape having a large number of conductive particles and a binder in which these conductive particles are dispersed, and has tackiness. A conductive adhesive sheet having a tacky resin layer is disclosed.
特許文献5(特開2010−168518号公報)には、シート状に形成された熱可塑性エラストマ樹脂やアクリル系樹脂などからなる粘着性物質と、当該粘着性物質に分散されたAgコートCu粉やAgコートNi粉などの導電性粒子とを有する組成物で構成される導電性接着剤層を有しており、前記導電性粒子の平均粒子径に対して前記粘着性物質の厚みの平均値が0.8倍〜1.4倍の範囲にあり、前記導電性粒子の含有量が前記導電性接着剤層全体の15〜25質量%の範囲にある導電性粘着シートが開示されている。 Patent Document 5 (Japanese Unexamined Patent Application Publication No. 2010-168518) discloses an adhesive material made of a thermoplastic elastomer resin, an acrylic resin, or the like formed in a sheet shape, Ag coated Cu powder dispersed in the adhesive material, It has a conductive adhesive layer composed of a composition having conductive particles such as Ag-coated Ni powder, and the average value of the thickness of the adhesive substance with respect to the average particle diameter of the conductive particles is There is disclosed a conductive pressure-sensitive adhesive sheet that is in a range of 0.8 times to 1.4 times and in which the content of the conductive particles is in a range of 15 to 25% by mass of the entire conductive adhesive layer.
特許文献6(特開2011−66329号公報)には、外部グランド部材に接続するための金属層と導電性粒子を含む導電性接着層とを接触状態に備えた導電部材に、加熱および加圧により接続されるシールドフィルムであって、前記加熱によって軟化される樹脂により形成され、前記加熱および加圧により接続された後において、前記導電性接着層から突出した前記導電性粒子の平均突出長よりも薄い層厚みで形成されるとともに、前記導電性接着層に接着されるカバーフィルムと、前記カバーフィルムに順に積層された金属薄膜層および接着層と、を有することを特徴とするシールドフィルムが開示されていると共に、これを用いたグランド接続方法として、外部グランド部材に接続された金属層と導電性粒子を含む導電性接着層とを接触状態に備えた導電部材を、前記樹脂が軟化する温度で加熱しながら加圧して当該導電性接着層と前記カバーフィルムとを接着することにより、前記カバーフィルムの層厚みよりも長く突出した前記導電性粒子が前記金属薄膜層にまで達することでグランド接続することを特徴とするシールドフィルムのグランド接続方法が開示されている。 In Patent Document 6 (Japanese Patent Laid-Open No. 2011-66329), heating and pressurization are performed on a conductive member provided with a metal layer for connection to an external ground member and a conductive adhesive layer containing conductive particles in contact. A shield film connected by the above, formed from the resin softened by the heating, and after being connected by the heating and pressurization, the average protruding length of the conductive particles protruding from the conductive adhesive layer A shield film comprising: a cover film formed with a thin layer thickness; and a cover film adhered to the conductive adhesive layer; and a metal thin film layer and an adhesive layer sequentially laminated on the cover film. As a ground connection method using this, a metal layer connected to an external ground member and a conductive adhesive layer containing conductive particles are connected. The conductive member provided in a state is pressurized while being heated at a temperature at which the resin is softened to bond the conductive adhesive layer and the cover film, thereby projecting the conductive material longer than the layer thickness of the cover film. A ground connection method for a shield film is disclosed, in which the conductive particles reach the metal thin film layer to be grounded.
特許文献7(特開2011−166100号公報)には、硬化性絶縁層、導電性被膜、及び硬化性導電性接着剤層をこの順序で具備する、電磁波シールド性接着性フィルムであって、前記導電性被膜が、導電性粒子が保護物質によって被覆されてなる平均粒子径が0.001〜0.5μmの被覆導電性粒子を含む分散体から形成された被膜であり、前記硬化性導電性接着剤層が、硬化性絶縁性樹脂と、平均粒子径が1〜50μmの金属粉とを含有する、ことを特徴とする電磁波シールド性接着性フィルムが開示されている。硬化性導電性接着剤層をプリント配線基板などの被着体に重ね合わせ、加熱することにより、硬化性導電性接着剤層及び硬化性絶縁層を硬化させ、これらの硬化によって接着が確保され、被着体を電磁波から遮蔽することが可能となる。 Patent Document 7 (Japanese Patent Laid-Open No. 2011-166100) discloses an electromagnetic wave shielding adhesive film comprising a curable insulating layer, a conductive film, and a curable conductive adhesive layer in this order, The conductive coating is a coating formed from a dispersion containing coated conductive particles having an average particle diameter of 0.001 to 0.5 μm formed by coating conductive particles with a protective substance, and the curable conductive adhesive An electromagnetic wave shielding adhesive film is disclosed, wherein the agent layer contains a curable insulating resin and a metal powder having an average particle diameter of 1 to 50 μm. The curable conductive adhesive layer is superimposed on an adherend such as a printed wiring board and heated to cure the curable conductive adhesive layer and the curable insulating layer. It becomes possible to shield the adherend from electromagnetic waves.
特許文献8(特開2011−187895号公報)には、(A)金属粉と(B)バインダ樹脂とからなる導電層に、保護層が積層されてなる電磁波シールドフィルムにおいて、導電層が(a)平均厚さ50〜300nm、平均粒径3〜10μmの薄片状金属粉と、(b)平均粒径3〜10μmの針状又は樹枝状金属粉(特に銀被覆銅粉)とを含有する導電性ペーストから形成されてなるものが開示されている。 Patent Document 8 (Japanese Patent Application Laid-Open No. 2011-187895) discloses an electromagnetic wave shielding film in which a protective layer is laminated on a conductive layer made of (A) metal powder and (B) a binder resin. ) Conductivity containing flaky metal powder having an average thickness of 50 to 300 nm and an average particle diameter of 3 to 10 μm, and (b) acicular or dendritic metal powder (particularly silver-coated copper powder) having an average particle diameter of 3 to 10 μm. What is formed from an adhesive paste is disclosed.
特許文献9(特開2011−171523号公報)には、硬化性を有しない絶縁フィルム、導電性被膜、及び硬化性導電性接着剤層をこの順序で具備する、電磁波シールド性接着性フィルムであって、前記導電性被膜が、導電性粒子が保護物質によって被覆されてなる平均粒子径が0.001〜0.5μmの被覆導電性粒子を含む分散体から形成された被膜であり、前記硬化性導電性接着剤層が、硬化性絶縁性樹脂と、平均粒子径が1〜50μmの金属粉とを含有することを特徴とする電磁波シールド性接着性フィルムが開示されている。 Patent Document 9 (Japanese Patent Application Laid-Open No. 2011-171523) discloses an electromagnetic wave shielding adhesive film comprising an insulating film having no curability, a conductive coating, and a curable conductive adhesive layer in this order. The conductive film is a film formed from a dispersion containing coated conductive particles having an average particle diameter of 0.001 to 0.5 μm, in which conductive particles are coated with a protective substance, and the curability is An electromagnetic wave shielding adhesive film is disclosed, wherein the conductive adhesive layer contains a curable insulating resin and a metal powder having an average particle diameter of 1 to 50 μm.
電子部品パッケージの製法において、回路基板上に電子部品を実装し、該電子部品をモールド樹脂で封止した後、ハーフカットダイシングして電子部品間のモールド樹脂を除去して溝部を設け、前記モールド樹脂の上から、導電性ペーストを塗布して前記溝部内にも導電性ペーストを充填し、次に、当該溝部の中心部に沿ってダイシングしてパッケージ毎に分割して電子部品パッケージを作製する方法が行われている。 In the manufacturing method of the electronic component package, after mounting the electronic component on the circuit board and sealing the electronic component with a mold resin, the mold resin between the electronic components is removed by half-cut dicing to provide a groove portion, and the mold The conductive paste is applied on the resin to fill the groove with the conductive paste, and then diced along the center of the groove to divide the package into electronic packages. The way is done.
このような電子部品パッケージの作製において、導電性ペーストを塗布する工程を、導電性粒子を含有する樹脂層が積層された金属箔を加熱プレスする工程、例えば、当該樹脂層を回路基板に重ねて金属箔側から加熱及びプレスすることにより、前記樹脂層の樹脂及び導電性粒子を、前記回路基板に設けられた溝部内に充填する工程に置き換えることができれば、電子部品パッケージの作製工程をより簡略化することができる。
しかしながら、回路基板に設ける溝や孔は益々微細化する傾向にあるため、前記のように金属箔を加熱プレスすることによって、樹脂乃至導電性粒子を、細い溝や小さな孔内の隅々まで充填することができ、しかも、確実に導通をとることができるかが課題であった。
In producing such an electronic component package, the step of applying a conductive paste is a step of heat-pressing a metal foil on which a resin layer containing conductive particles is laminated, for example, the resin layer is stacked on a circuit board. If heating and pressing from the metal foil side can replace the resin and conductive particles in the resin layer with the step of filling the groove portion provided in the circuit board, the manufacturing process of the electronic component package is simplified. Can be
However, since the grooves and holes provided in the circuit board tend to become finer, the resin or conductive particles are filled to every corner of the narrow grooves or small holes by hot pressing the metal foil as described above. In addition, it was a problem whether it was possible to establish electrical conduction reliably.
そこで本発明は、上記のように加熱プレスする用途に用いるプレス接着用金属箔に関し、樹脂乃至導電性粒子を、細い溝や小さな孔内の隅々まで充填することができ、しかも、確実に導通をとることができる、新たなプレス接着用金属箔を提供せんとするものである。 Therefore, the present invention relates to a metal foil for press bonding used for heat pressing as described above, and can be filled with resin or conductive particles to every corner of a narrow groove or small hole, and reliably conductive. It is intended to provide a new metal foil for press bonding that can take the following steps.
本発明は、金属箔と、Bステージ状態の樹脂中に導電性粒子を含有してなる樹脂層(「導電樹脂層」とも称する)Aとを備えたプレス接着用金属箔であって、樹脂層A中の導電性粒子のうち円形度が高い方からカウントした個数累積50個数%における導電性粒子の円形度(「累積50%」と称する)が0.80未満であり、且つ、樹脂層A中の導電性粒子のうち円形度が高い方からカウントした頻度累積90個数%における導電性粒子の円形度(「累積90%」と称する)が0.60未満であり、且つ、樹脂層A中の導電性粒子の円形度の標準偏差が0.130以上であることを特徴とするプレス接着用金属箔を提案する。 The present invention is a press-bonding metal foil comprising a metal foil and a resin layer (also referred to as “conductive resin layer”) A containing conductive particles in a B-stage resin. The conductive particles in A have a circularity of conductive particles (referred to as “cumulative 50%”) at a cumulative number of 50% counted from the higher circularity among the conductive particles in A and less than 0.80, and the resin layer A The circularity of the conductive particles in the cumulative 90% by number counted from the higher circularity of the conductive particles in the conductive particles (referred to as “cumulative 90%”) is less than 0.60, and the resin layer A A metal foil for press bonding is proposed in which the standard deviation of the circularity of the conductive particles is 0.130 or more.
本発明が提案するプレス接着用金属箔は、例えば、電子部品が実装され、該電子部品がモールド樹脂で封止されてなる構成を備えたプリント配線基板に、前記プレス接着用金属箔の樹脂層Aを重ねて、樹脂層Aの樹脂を加熱して軟化若しくは溶融させて、該プレス接着用金属箔を基板側にプレスし、さらに加熱して、前記で軟化若しくは溶融させた樹脂を硬化させることで、前記回路基板に設けられた溝又は孔内に樹脂層Aの樹脂及び導電性粒子を充填することができ、電子部品パッケージを製造することができる。 The metal foil for press bonding proposed by the present invention is, for example, a resin layer of the metal foil for press bonding provided on a printed wiring board having a configuration in which an electronic component is mounted and the electronic component is sealed with a mold resin. A is overlapped, the resin of the resin layer A is heated and softened or melted, the metal foil for press bonding is pressed to the substrate side, and further heated to cure the softened or melted resin. Thus, the resin and conductive particles of the resin layer A can be filled in the grooves or holes provided in the circuit board, and an electronic component package can be manufactured.
本発明が提案するプレス接着用金属箔に関しては、導電性粒子の形状を所定の範囲に規定したことにより、すなわち、樹脂層A中の導電性粒子の円形度(累積50%)が0.80未満であり、且つ、樹脂層A中の導電性粒子の円形度(累積90%)が0.60未満であり、且つ、樹脂層A中の導電性粒子の円形度の標準偏差が0.130以上に規定したことにより、細い溝や小さな孔内の隅々まで、樹脂層Aの樹脂乃至導電性粒子を充填することができ、しかも、比較的少ない量の導電性粒子でも確実に導通をとることができるようになった。 Regarding the metal foil for press bonding proposed by the present invention, the circularity (cumulative 50%) of the conductive particles in the resin layer A is 0.80 by defining the shape of the conductive particles within a predetermined range. The circularity (cumulative 90%) of the conductive particles in the resin layer A is less than 0.60, and the standard deviation of the circularity of the conductive particles in the resin layer A is 0.130. By defining as described above, the resin or conductive particles of the resin layer A can be filled to every corner of the narrow groove or small hole, and the conduction is surely achieved even with a relatively small amount of the conductive particles. I was able to do it.
以下、本発明の実施形態について詳述する。但し、本発明の範囲が以下の実施形態に限定されるものではない。 Hereinafter, embodiments of the present invention will be described in detail. However, the scope of the present invention is not limited to the following embodiments.
<本プレス接着用金属箔>
本実施形態の一例に係るプレス接着用金属箔(「本プレス接着用金属箔」と称する)は、金属箔と、Bステージ状態の樹脂中に粒状の導電性粒子を含有してなる樹脂層Aと、を備えた、プレス接着用金属箔である。詳しくは後述するが、本プレス接着用金属箔は、本プレス接着用金属箔の樹脂層Aを回路基板に重ねて、加熱及びプレスすることにより、前記回路基板に設けられた溝又は孔内に樹脂層Aの樹脂及び導電性粒子を充填することができ、本プレス接着用金属箔を回路基板に接着することができる(本発明では、このような充填及び接着手段を“プレス接着”と称する)。
<Metal foil for press bonding>
A metal foil for press bonding according to an example of the present embodiment (referred to as “metal foil for press bonding”) includes a metal foil and a resin layer A containing granular conductive particles in a B-stage resin. And a metal foil for press bonding. As will be described in detail later, the metal foil for press bonding is placed in a groove or hole provided in the circuit board by superposing the resin layer A of the metal foil for press bonding on the circuit board and heating and pressing. The resin of the resin layer A and conductive particles can be filled, and the metal foil for press bonding can be bonded to a circuit board (in the present invention, such filling and bonding means is referred to as “press bonding”). ).
本プレス接着用金属箔は、前記金属箔及び樹脂層A以外の層を一層又は二層以上備えていてもよい。例えば、樹脂Aの金属箔とは反対側の面に離型シートを積層するようにしてもよい。 This press-bonding metal foil may include one or more layers other than the metal foil and the resin layer A. For example, a release sheet may be laminated on the surface of the resin A opposite to the metal foil.
(金属箔)
本プレス接着用金属箔における金属箔は、例えば電子回路や電子部品における導電層或いは電極層等として機能することができる金属箔であればよい。
このような金属箔としては、圧延法や電解法などで得られた金属箔であるのが好ましい。例えば銅箔、ニッケル箔、銅合金箔(真鍮箔、コルソン合金箔等)、ニッケル合金箔(ニッケル−リン合金箔、ニッケル−コバルト合金箔等)などを挙げることができる。但し、これらに限定されるものではない。
(Metal foil)
The metal foil in this press-bonding metal foil may be a metal foil that can function as, for example, a conductive layer or an electrode layer in an electronic circuit or an electronic component.
Such a metal foil is preferably a metal foil obtained by a rolling method or an electrolytic method. For example, copper foil, nickel foil, copper alloy foil (brass foil, corson alloy foil etc.), nickel alloy foil (nickel-phosphorus alloy foil, nickel-cobalt alloy foil etc.) etc. can be mentioned. However, it is not limited to these.
金属箔の厚さは、薄過ぎると樹脂層Aを形成するのが難しくなる一方、厚過ぎるとコスト高になるため、1μm〜50μmであるのが好ましく、中でも2μm以上或いは30μm以下、その中でも3μm以上或いは20μm以下であるのが好ましい。 If the thickness of the metal foil is too thin, it is difficult to form the resin layer A. On the other hand, if the thickness is too thick, the cost is high. Therefore, the thickness is preferably 1 μm to 50 μm, more preferably 2 μm or more or 30 μm or less, especially 3 μm. The thickness is preferably 20 μm or less.
エッチング加工等により、電子回路形成等を行うことを考慮すると、微細な導電パターン、或いは、微細な電極パターン等を良好に形成するという観点から、単一組成の金属箔を用いることが好ましい。
また、金属箔が導電層として用いられることを考慮すると、当該金属箔は、ニッケルに比して電気抵抗率が低く、且つ、非磁性体である銅又は銅合金からなる金属箔であるのが好ましい。銅箔は、エッチング等の加工が容易であり、さらに安価である点で好ましい。
In consideration of forming an electronic circuit by etching or the like, it is preferable to use a metal foil having a single composition from the viewpoint of satisfactorily forming a fine conductive pattern or a fine electrode pattern.
In consideration of the fact that the metal foil is used as the conductive layer, the metal foil has a lower electrical resistivity than nickel and is a metal foil made of copper or a copper alloy which is a non-magnetic material. preferable. Copper foil is preferable in that it is easy to process such as etching and is inexpensive.
(樹脂層A)
樹脂層Aを構成する樹脂組成物は、Bステージ状態となり得る樹脂組成物であればよい。通常、この種のベース樹脂は熱硬化性樹脂が一般的である。但し、熱硬化性樹脂に熱可塑性樹脂が混合したものを用いることもできる。
(Resin layer A)
The resin composition which comprises the resin layer A should just be a resin composition which can be in a B stage state. Usually, this type of base resin is generally a thermosetting resin. However, a mixture of a thermoplastic resin and a thermosetting resin can also be used.
ここで、Bステージ状態とは、接着性乃至粘着性を有する熱硬化性樹脂の硬化中間状態を意味する。中でも、フィルム状乃至シート状を維持することができ、且つ加熱すると樹脂が一旦は軟化若しくは溶融し、さらに加熱すると硬化する状態であるのが好ましい。 Here, the B stage state means an intermediate curing state of a thermosetting resin having adhesiveness or tackiness. Among them, it is preferable that the film or sheet can be maintained, and the resin is once softened or melted when heated and cured when heated.
樹脂組成物をBステージ状態とする方法としては、1)溶剤を適宜揮発させる方法、2)硬化反応を途中で強制的に停止させる方法、3)硬化領域の異なる2種類以上の硬化性樹脂を含有させる方法、4)その他公知の方法を採用することができる。 As a method for bringing the resin composition into a B-stage state, 1) a method for volatilizing a solvent as appropriate, 2) a method for forcibly stopping a curing reaction in the middle, and 3) two or more types of curable resins having different curing regions. 4) Other known methods can be employed.
Bステージ状態となり得る樹脂組成物の主成分を為す樹脂(「ベース樹脂」と称する)としては、特に限定するものではない。例えばエポキシ樹脂、ポリジメチルシロキサン樹脂、アクリル樹脂、その他の有機官能性ポリシロキサン樹脂、ポリイミド樹脂、フッ化炭素樹脂、ベンゾシクロブテン樹脂、フッ素化ポリアリルエーテル、ポリアミド樹脂、ポリイミドアミド樹脂、フェノールクレゾール樹脂、芳香族ポリエステル樹脂、ポリフェニレンエーテル樹脂、ビスマレイミドトリアジン樹脂、フッ素樹脂などを挙げることができ、これらのうち一種又は二種以上の混合樹脂であってもよい。なお、ベース樹脂とは、樹脂組成物を構成する樹脂成分のうち最も含有量の多い樹脂を言うものとする。
また、硬化性又は架橋性材料として、遊離基重合、原子移動、ラジカル重合、開環重合、開環メタセシス重合、アニオン重合、またはカチオン重合によって架橋可能な、エポキシ樹脂、アクリル樹脂、ポリジメチルシロキサン樹脂、またはその他の有機官能性ポリシロキサン樹脂の一つ以上を配合してもよい。
The resin that forms the main component of the resin composition that can be in the B-stage state (referred to as “base resin”) is not particularly limited. For example, epoxy resin, polydimethylsiloxane resin, acrylic resin, other organic functional polysiloxane resin, polyimide resin, fluorocarbon resin, benzocyclobutene resin, fluorinated polyallyl ether, polyamide resin, polyimide amide resin, phenol cresol resin , Aromatic polyester resins, polyphenylene ether resins, bismaleimide triazine resins, fluororesins, and the like. Among these, one or a mixture of two or more of them may be used. The base resin is a resin having the largest content among the resin components constituting the resin composition.
Also, as curable or crosslinkable materials, epoxy resins, acrylic resins, polydimethylsiloxane resins that can be crosslinked by free radical polymerization, atom transfer, radical polymerization, ring opening polymerization, ring opening metathesis polymerization, anionic polymerization, or cationic polymerization. Or one or more of other organofunctional polysiloxane resins may be blended.
中でも、樹脂層Aを構成する樹脂組成物は、100〜150℃における最低溶融粘度が10Pa・s〜1000000Pa・sの樹脂組成物であるのが好ましく、中でも100Pa・s以上の樹脂組成物であるのがより一層好ましい。 Among them, the resin composition constituting the resin layer A is preferably a resin composition having a minimum melt viscosity of 10 Pa · s to 1000000 Pa · s at 100 to 150 ° C., and more preferably a resin composition of 100 Pa · s or more. Is even more preferable.
樹脂層Aを構成する樹脂組成物の一例として、ベース樹脂としてのエポキシ樹脂、エポキシ硬化剤、有機溶媒、シランカップリング剤、界面活性剤などを含有する樹脂組成物を挙げることができる。このような樹脂組成物であれば、有機溶媒を揮発させることにより、この樹脂組成物をBステージ状態とすることができる。
この場合、例えばアクリル系樹脂とエポキシ樹脂のポリマーブレンドをベース樹脂として使用しても同様である。
但し、これらはあくまで一例である。
As an example of the resin composition constituting the resin layer A, a resin composition containing an epoxy resin as a base resin, an epoxy curing agent, an organic solvent, a silane coupling agent, a surfactant, and the like can be given. If it is such a resin composition, this resin composition can be made into a B-stage state by volatilizing an organic solvent.
In this case, for example, the same applies even when a polymer blend of an acrylic resin and an epoxy resin is used as the base resin.
However, these are only examples.
熱硬化のために添加される材料として、有機過酸化物やイソシアネート化合物、エポキシ化合物やアミン化合物等の熱硬化剤などを挙げることができる。 Examples of the material added for thermosetting include thermosetting agents such as organic peroxides, isocyanate compounds, epoxy compounds, and amine compounds.
(導電性粒子)
樹脂層Aに含まれる導電性粒子としては、例えば銀粉粒子、銅粉粒子、鉄粉粒子などの導電性粒子、或いは、任意材料からなる粒子、例えば前記導電性粒子を芯材としてこれらの表面の一部又は全部を異種導電性材料、例えば金、銀、銅、ニッケル、スズなどで被覆してなる粒子などを挙げることができる。但し、これらに限定する趣旨ではなく、導電性を有する材料であれば任意に採用可能である。
(Conductive particles)
As the conductive particles contained in the resin layer A, for example, conductive particles such as silver powder particles, copper powder particles, and iron powder particles, or particles made of an arbitrary material, for example, the conductive particles as a core material of these surfaces. The particle | grains etc. which coat | cover one part or all part with different electroconductive materials, for example, gold | metal | money, silver, copper, nickel, tin, etc. can be mentioned. However, the present invention is not limited to these, and any material having conductivity can be arbitrarily adopted.
導電性粒子の形状に関しては、基板に設けられた溝や孔へ充填した際に、比較的少ない量の導電性粒子でも、確実に導通をとることができる観点から、樹脂層A中の導電性粒子のうち、円形度が高い方からカウントした個数累積50個数%における導電性粒子の円形度(「累積50%」と称する)が0.80未満、中でも0.10以上或いは0.77以下、その中でも0.75以下であるのがさらに好ましい。
また、樹脂層A中の導電性粒子のうち、円形度が高い方からカウントした個数累積90個数%における導電性粒子の円形度(「累積90%」と称する)が0.60未満、中でも0.10以上或いは0.55以下、その中でも0.15以上或いは0.50以下であるのがさらに好ましい。
なお、上記「累積50数%」或いは「累積90%」は、樹脂層A中の導電性粒子を、円形度が最も高い値(円形度=1.0)から低い方へ導電性粒子の個数をカウントして、その個数累積が50%或いは90%に達した時の円形度を示すものである。
さらにまた、樹脂層A中の導電性粒子の円形度の標準偏差は0.130以上、中でも0.150以上或いは0.500以下、その中でも0.160以上であるのがさらに好ましい。
With respect to the shape of the conductive particles, the conductivity in the resin layer A can be ensured even when a relatively small amount of the conductive particles can be conducted when filled into the grooves and holes provided in the substrate. Among the particles, the circularity of the conductive particles at a cumulative number of 50% counted from the higher degree of circularity (referred to as “cumulative 50%”) is less than 0.80, especially 0.10 or more or 0.77 or less. Among these, it is more preferable that it is 0.75 or less.
Further, among the conductive particles in the resin layer A, the circularity of the conductive particles (referred to as “cumulative 90%”) in the cumulative number of 90 counts counted from the higher circularity is less than 0.60, especially 0. .10 or more and 0.55 or less, more preferably 0.15 or more and 0.50 or less.
In addition, the above “cumulative 50%” or “cumulative 90%” indicates that the number of conductive particles in the resin layer A from the highest circularity (circularity = 1.0) to the lower one. , And the circularity when the cumulative number reaches 50% or 90% is shown.
Furthermore, the standard deviation of the circularity of the conductive particles in the resin layer A is 0.130 or more, especially 0.150 or more, or 0.500 or less, and more preferably 0.160 or more.
当該導電性粒子の円形度を上記の範囲に調整するには、例えば導電性粒子の形状及びその含有割合を調整すればよい。例えば球状や略球状の粒子は円形度が比較的高く、他方、デンドライト状、針状、フレーク状、芋状などの粒子は円形度が比較的低いから、球状や略球状の粒子の含有比率を高めれば、当該導電性粒子の円形度を高めることができ、他方、デンドライト状、針状、フレーク状、芋状などの粒子の含有比率を高めれば、当該導電性粒子の円形度を低くすることができる(図2参照)。但し、このような方法に限定するものではない。 In order to adjust the circularity of the conductive particles to the above range, for example, the shape of the conductive particles and the content ratio thereof may be adjusted. For example, spherical and substantially spherical particles have a relatively high degree of circularity, while dendritic, needle-like, flake, and bowl-like particles have a relatively low degree of circularity. Increasing the circularity of the conductive particles can increase the circularity of the conductive particles. On the other hand, increasing the content ratio of dendritic, needle-like, flake-like, and bowl-like particles can reduce the circularity of the conductive particles. (See FIG. 2). However, it is not limited to such a method.
樹脂層Aに含まれる導電性粒子の粒径は、大き過ぎると、ペースト(塗料)中で沈降したり、薄膜化できなかったり、電磁波シールド特性が悪くなったりする可能性がある一方、小さ過ぎると、分散性が低下してペースト(塗料)が増粘して塗工性が低下する可能性がある。そのため、樹脂層Aに含まれる導電性粒子の平均円相当径は0.1μm〜30μmであるのが好ましく、中でも0.3μm以上或いは20μm以下、その中でも0.5μm以上或いは10μm以下であるのがより一層好ましい。 If the particle size of the conductive particles contained in the resin layer A is too large, the particles may settle in the paste (paint), cannot be thinned, or the electromagnetic shielding characteristics may be deteriorated, but are too small. And dispersibility may fall, paste (paint) may thicken, and coating property may fall. For this reason, the average equivalent circle diameter of the conductive particles contained in the resin layer A is preferably 0.1 μm to 30 μm, more preferably 0.3 μm or more and 20 μm or less, and particularly preferably 0.5 μm or more or 10 μm or less. Even more preferred.
樹脂層Aにおける導電性粒子の含有量は、少ない含有量の導電性粒子でも電気の導通を得ることができるから、樹脂層A全体の65wt%以下であるのが好ましく、中でも10wt%以上或いは60wt%以下であるのがより一層好ましく、その中でも20wt%以上或いは55wt%以下であるのがさらに好ましい。 The content of the conductive particles in the resin layer A is preferably 65 wt% or less of the entire resin layer A because even a small amount of conductive particles can provide electrical conduction, and more preferably 10 wt% or more or 60 wt%. % Or less, and more preferably 20 wt% or more or 55 wt% or less.
樹脂層Aは、例えば回路基板上に設けられた溝や孔内への充填性を確保するなどの観点から、レジンフロー(測定方法を実施例参照のこと)が3〜20%であるのが好ましく、中でも5%以上或いは17%以下、その中でも7%以上或いは15%以下であるのがさらに好ましい。
樹脂層Aのレジンフローを調整するには、樹脂層Aを構成する樹脂の種類を調整すると共に、導電性粒子の形状及び含有量を調整するようにすればよい。
The resin layer A has a resin flow (refer to the example of measurement method) of 3 to 20% from the viewpoint of, for example, ensuring filling into grooves and holes provided on the circuit board. Among them, it is preferably 5% or more and 17% or less, more preferably 7% or more and 15% or less.
In order to adjust the resin flow of the resin layer A, the type of resin constituting the resin layer A and the shape and content of the conductive particles may be adjusted.
樹脂層Aの厚さは、特に制限されるものではない。但し、厚過ぎても効果が高まる訳ではなく材料が無駄である一方、薄過ぎると、被着面の凹凸に追従でき難くなるばかりか、樹脂層Aで安定した導電性を確保するのが難しくなる。そのため、樹脂層Aの厚さは1μm〜500μmであるのが好ましく、中でも300μm以下、その中でも特に200μm以下であるのがより一層好ましい。但し、溝へ埋め込む場合は、溝の体積に厚みが依存するので、樹脂層Aの厚みは溝体積に応じて500μmを上限として所望の範囲で設定するのが好ましい。 The thickness of the resin layer A is not particularly limited. However, even if it is too thick, the effect is not increased and the material is wasted. On the other hand, if it is too thin, it becomes difficult to follow the unevenness of the adherend surface, and it is difficult to ensure stable conductivity with the resin layer A. Become. Therefore, the thickness of the resin layer A is preferably 1 μm to 500 μm, more preferably 300 μm or less, and particularly preferably 200 μm or less. However, since the thickness depends on the volume of the groove when embedded in the groove, the thickness of the resin layer A is preferably set in a desired range with an upper limit of 500 μm depending on the groove volume.
(金属箔表面層)
必要に応じて、樹脂層Aとは反対側の金属箔表面が酸化防止処理されてなる構成を備えていてもよい。但し、必ず必要というものではない。
金属箔、中でも銅箔は酸化し易いため、金属箔表面を酸化防止処理するのが好ましい。
(Metal foil surface layer)
As needed, you may provide the structure by which the metal foil surface on the opposite side to the resin layer A is antioxidant processed. However, it is not absolutely necessary.
Since metal foil, especially copper foil, is easily oxidized, it is preferable to subject the surface of the metal foil to an antioxidant treatment.
酸化防止処理としては、四三酸化鉄被膜(黒色)を形成させる化学処理、表面にリン酸(リン酸亜鉛系・リン酸マンガン系)被膜を形成させる化学処理、クロメート処理、無電解ニッケルメッキ、アルマイト処理などを挙げることができる。但し、これらの処理に限定するものではない。 Antioxidation treatment includes chemical treatment to form a triiron tetroxide film (black), chemical treatment to form a phosphoric acid (zinc phosphate and manganese phosphate) film on the surface, chromate treatment, electroless nickel plating, An alumite treatment etc. can be mentioned. However, it is not limited to these processes.
<本プレス接着用金属箔の作製方法>
Bステージ状態とすることができる樹脂組成物に導電性粒子、その他、必要に応じて硬化剤やカップリング剤、腐食抑制剤などを加えて混合し、導電性粒子の形状を壊さずに分散させるように混練してペースト(塗料)とし、このペースト(塗料)を金属箔上に塗布し、溶剤を揮発させるなどして樹脂組成物をBステージ化させて、フィルム成形するのが好ましい。
なお、混練に際しては、導電性粒子の粒子形状が崩れないように、機械的な衝撃を導電性粒子に与える攪拌機などの使用は避けて、例えばあわとり練太郎(商標名)やプラネタリーミキサなどを使って、機械的な衝撃を与えることなく混練するのが好ましい。
<Method for producing metal foil for press bonding>
Conductive particles, and, if necessary, a curing agent, a coupling agent, a corrosion inhibitor, and the like are added to the resin composition that can be in a B-stage state and mixed to disperse the conductive particles without breaking the shape. It is preferable that the paste (paint) is kneaded as described above, and this paste (paint) is applied onto a metal foil and the resin composition is B-staged by volatilizing the solvent to form a film.
During kneading, avoid the use of a stirrer that gives mechanical impact to the conductive particles so that the particle shape of the conductive particles does not collapse. It is preferable to use kneading without mechanical impact.
<本プレス接着用金属箔の使用方法>
本プレス接着用金属箔は、図1(A)に示すように、モールド樹脂等によって微細な溝や孔が設けられた回路基板に、本プレス接着用金属箔の樹脂層Aを重ねて、プレス熱板等を金属箔の表面に当接させて、金属箔を介して樹脂層Aを加熱して樹脂層Aの樹脂を軟化若しくは溶融させ、金属箔の表面を前記プレス熱板等で押圧することにより、言い換えれば金属箔の表面を被プレス面として被着体方向にプレス(押圧)することにより、樹脂層Aの樹脂及び導電性粒子を、回路基板に設けられた溝や孔内に充填することができる。
そして、さらに加熱して前記で軟化若しくは溶融させた樹脂を硬化させることにより、本プレス接着用金属箔を被着体に接着することができる。
このように本プレス接着用金属箔を熱プレスすることで、図1(B)に示すように、樹脂層Aの樹脂及び導電性粒子を、回路基板に設けられた溝や孔内の隅々まで充填することができ、確実に導通をとることができる。
<How to use this press-bonding metal foil>
As shown in FIG. 1A, the metal foil for press bonding is formed by stacking the resin layer A of the metal foil for press bonding on a circuit board provided with fine grooves and holes by mold resin or the like. A hot plate or the like is brought into contact with the surface of the metal foil, the resin layer A is heated through the metal foil to soften or melt the resin of the resin layer A, and the surface of the metal foil is pressed with the press hot plate or the like. In other words, by pressing (pressing) the surface of the metal foil in the direction of the adherend with the surface to be pressed as the pressed surface, the resin and conductive particles of the resin layer A are filled in the grooves and holes provided in the circuit board. can do.
Then, the metal foil for press bonding can be bonded to the adherend by further heating and curing the resin softened or melted as described above.
As shown in FIG. 1 (B), the press-bonding metal foil is hot-pressed in this manner, so that the resin and conductive particles of the resin layer A are placed in the grooves and holes provided in the circuit board. Can be filled, and conduction can be ensured.
例えば電子部品が実装され、該電子部品がモールド樹脂で封止され、さらにハーフダイシングにより切込み溝が設けられてなる構成を備えたプリント配線基板において、本プレス接着用金属箔の樹脂層Aを該モールド樹脂に重ねて、例えばプレス熱板などを当接させるなどして加熱して樹脂層Aの樹脂を軟化若しくは溶融させた後、当該金属箔の表面を被プレス面として該プレス接着用導電性フィルムを基板側にプレスし、次いでさらに加熱して、前記で軟化若しくは溶融させた樹脂を硬化させることで、樹脂層Aの樹脂はモールド樹脂部分を被覆すると共に、前記の切込み溝内に、樹脂層Aの樹脂及び導電性粒子が侵入して充填される。このようにして電子部品パッケージを製造することができる。 For example, in a printed wiring board having a configuration in which an electronic component is mounted, the electronic component is sealed with a mold resin, and a cut groove is provided by half dicing, the resin layer A of the metal foil for press bonding is For example, after the resin of the resin layer A is softened or melted by heating, for example, by pressing a press hot plate or the like over the mold resin, the surface of the metal foil is used as the pressed surface for the conductive property for press bonding. The film is pressed to the substrate side and then further heated to cure the softened or melted resin, so that the resin of the resin layer A covers the mold resin portion, and the resin is formed in the cut groove. The resin and conductive particles of layer A enter and fill. In this way, an electronic component package can be manufactured.
<語句の説明>
本明細書において「X〜Y」(X,Yは任意の数字)と表現する場合、特にことわらない限り「X以上Y以下」の意と共に、「好ましくはXより大きい」或いは「好ましくYより小さい」の意も包含する。
また、「X以上」(Xは任意の数字)と表現する場合、特にことわらない限り「好ましくはXより大きい」の意を包含し、「Y以下」(Yは任意の数字)と表現する場合、特にことわらない限り「好ましくYより小さい」の意を包含する。
<Explanation of words>
In the present specification, when expressed as “X to Y” (X and Y are arbitrary numbers), “X is preferably greater than X” or “preferably more than Y” with the meaning of “X to Y” unless otherwise specified. The meaning of “small” is also included.
In addition, when expressed as “X or more” (X is an arbitrary number), it means “preferably larger than X” unless otherwise specified, and expressed as “Y or less” (Y is an arbitrary number). In the case, unless otherwise specified, the meaning of “preferably smaller than Y” is included.
以下、本発明の実施例について説明する。但し、本発明が以下の実施例に限定されるものではない。 Examples of the present invention will be described below. However, the present invention is not limited to the following examples.
<金属箔>
金属箔として、厚み9μmの高張力銅箔(三井金属鉱業社製、製品名「HTE」)を使用した。
<Metal foil>
As the metal foil, a high-tensile copper foil having a thickness of 9 μm (product name “HTE”, manufactured by Mitsui Metal Mining Co., Ltd.) was used.
<導電性粉末>
(1)導電性粉末A:デンドライト状を呈する粒子からなる銀被覆銅粉。
(2)導電性粉末B:デンドライト状を呈する粒子からなる銀被覆銅粉と、球状を呈する粒子からなる銀被覆銅粉とを、7:3の質量割合で含有する混合紛体。
(3)導電性粉末C:デンドライト状を呈する粒子からなる銀被覆銅粉と、球状を呈する粒子からなる銀被覆銅粉とを、5:5の質量割合で含有する混合紛体。
(4)導電性粉末D:デンドライト状を呈する粒子からなる銀被覆銅粉と、球状を呈する粒子からなる銀被覆銅粉とを、3:7の質量割合で含有する混合紛体。
(5)導電性粉末E:デンドライト状を呈する粒子からなる銀被覆銅粉。
(6)導電性粉末F:球状を呈する粒子からなる銀被覆銅粉。
(7)導電性粉末G:フレーク状を呈する粒子からなる銀被覆銅粉。
なお、銀被覆銅粉とは、銅粉粒子の表面が銀で被覆されてなる粒子からなる紛体の意味である。
<Conductive powder>
(1) Conductive powder A: Silver-coated copper powder consisting of dendritic particles.
(2) Conductive powder B: a mixed powder containing silver-coated copper powder composed of dendritic particles and silver-coated copper powder composed of spherical particles in a mass ratio of 7: 3.
(3) Conductive powder C: Mixed powder containing silver-coated copper powder composed of particles exhibiting a dendritic shape and silver-coated copper powder composed of particles exhibiting a spherical shape in a mass ratio of 5: 5.
(4) Conductive powder D: Mixed powder containing silver-coated copper powder composed of dendritic particles and silver-coated copper powder composed of spherical particles in a mass ratio of 3: 7.
(5) Conductive powder E: Silver-coated copper powder comprising dendritic particles.
(6) Conductive powder F: Silver-coated copper powder composed of spherical particles.
(7) Conductive powder G: Silver-coated copper powder composed of particles having a flake shape.
The silver-coated copper powder means a powder composed of particles obtained by coating the surface of copper powder particles with silver.
<樹脂>
エポキシ樹脂X:100℃で2000cpの溶融粘度となるエポキシ樹脂組成物を使用した。
なお、樹脂の溶融粘度は、サンプルの厚みを5mmとして、粘度測定装置(Thermo ELECTRON CORPORATION社製「HAAKE Rheo Stress600」)を使用し、昇温速度:2℃/minにて、周波数(角速度)を適宜調整しながら測定した。
<Resin>
Epoxy resin X: An epoxy resin composition having a melt viscosity of 2000 cp at 100 ° C. was used.
The melt viscosity of the resin is 5 mm, and a viscosity measuring device (“HAAKE Rheo Stress 600” manufactured by Thermo ELECTRON CORPORATION) is used. The temperature (temperature rate) is 2 ° C./min. Measurements were made with appropriate adjustments.
<実施例1−10及び比較例1−3>
エポキシ樹脂Xに、表1に示す量(導電性粒子含有量)と種類の導電性粉末を加えて、撹拌機(あわとり練太郎(商標名))を用いて回転速度2000rpmで3分間混練してペーストを調製した後、厚さ9μmの銅箔及び厚み35μmのポリエチレンテレフタレート製フィルム(「PETフィルム」と称する)のそれぞれの上に、アプリケータを使用して乾燥厚みで100μmとなるように前記ペーストを塗布して塗膜を形成し、オーブン中にて150℃、3分間加熱して、銅箔上にBステージ状態の樹脂層Aを備えたプレス接着用銅箔と、PETフィルム上にBステージ状態の樹脂層Aを備えたプレス接着用PETフィルムとを作製した。
<Example 1-10 and Comparative Example 1-3>
Add the amount (conducting particle content) and the kind of conductive powder shown in Table 1 to the epoxy resin X, and knead for 3 minutes at a rotational speed of 2000 rpm using a stirrer (Awatori Kentaro (trade name)). After preparing the paste, on the copper foil having a thickness of 9 μm and the film made of polyethylene terephthalate having a thickness of 35 μm (referred to as “PET film”), the applicator is used so that the dry thickness becomes 100 μm. A paste is applied to form a coating film, heated in an oven at 150 ° C. for 3 minutes, a copper foil for press bonding provided with a resin layer A in a B-stage state on the copper foil, and B on the PET film A PET film for press bonding provided with the resin layer A in a stage state was produced.
<D50>
実施例・比較例で用いた導電性粉末を少量ビーカーに取り、3%トリトンX溶液(関東化学製)を2、3滴添加し、粉末になじませてから、0.1%SNディスパーサント41溶液(サンノプコ製)50mLを添加し、その後、超音波分散器TIPφ20(日本精機製作所製)を用いて2分間分散処理して測定用サンプルを調製した。この測定用サンプルを、レーザー回折散乱式粒度分布測定装置MT3300 (日機装製)を用いて体積累積基準D50を測定した。
<D50>
Take a small amount of the conductive powder used in the examples and comparative examples in a beaker, add a few drops of 3% Triton X solution (manufactured by Kanto Chemical Co., Inc.), and blend into the powder. 50 mL of a solution (manufactured by San Nopco) was added, and then a dispersion treatment was performed for 2 minutes using an ultrasonic disperser TIPφ20 (manufactured by Nippon Seiki Seisakusho) to prepare a measurement sample. The volume accumulation standard D50 of this measurement sample was measured using a laser diffraction / scattering particle size distribution analyzer MT3300 (manufactured by Nikkiso).
<円形度の測定>
グリセリンとメタノールを混合した溶液中に、実施例・比較例で用いた導電性粉末(銀被覆銅粉)を加えて混合して、株式会社セイシン企業製粒度・形状分析装置「PITA-1」を使用して測定し、解析ソフトにて3000個の粒子を解析し、平均円形度、累積10%円形度(表には「累積10%」と示す)、累積50%円形度(表には「累積50%」と示す)、累積90%円形度(表には「累積90%」と示す)、円形度標準偏差を算出した。
なお、累積10%円形度、累積50%円形度及び累積90%円形度は、円形度が高い方(真球1.0)から低い方へカウントした粒子の個数累積割合(%)がそれぞれ10%、50%、90%に達した時の円形度を示す値である。
<Measurement of circularity>
Add the conductive powder (silver-coated copper powder) used in the examples and comparative examples to the solution in which glycerin and methanol are mixed, and mix them into the particle size / shape analyzer “PITA-1” manufactured by Seishin Co., Ltd. 3,000 particles analyzed with analysis software, average circularity, cumulative 10% circularity (shown as “cumulative 10%” in the table), cumulative 50% circularity (in the table “ "Cumulative 50%"), cumulative 90% circularity (shown as "Cumulative 90%" in the table), and circularity standard deviation.
The cumulative 10% circularity, the cumulative 50% circularity, and the cumulative 90% circularity each have a cumulative number ratio (%) of particles counted from the higher circularity (true sphere 1.0) to the lower circularity. It is a value indicating the circularity when reaching%, 50%, and 90%.
ここで、「円形度」とは、Wadellが提案した粒子の投影像に関する形状指数で、「円形度」=「投影面積の等しい円の周長」/「粒子の周長」で表される。
「投影面積の等しい円の周長」とは、ある粒子を真上から観察した際の面積を求め、その面積に等しい円の周囲長さのことである。
Here, the “circularity” is a shape index related to the projected image of the particle proposed by Wadell, and is represented by “circularity” = “circumference of a circle having the same projected area” / “peripheral length of the particle”.
The “peripheral length of a circle having the same projected area” refers to the circumference of a circle equal to the area obtained by obtaining the area when a certain particle is observed from directly above.
<レジンフローの測定>
実施例・比較例で得たプレス接着用銅箔、すなわち、銅箔上にBステージ状態の樹脂層Aを備えたプレス接着用銅箔を10cm角にカットし、質量を測定した(質量A)。そして、カットしたプレス接着用銅箔をSUS板で挟みこみ、14kgf/cm2の圧力で180℃×10minプレスを常圧にて実施した。その後、10cm角よりはみ出したペーストを除去し、再度質量を測定した(質量B)。
質量測定後、下記の計算式にてレジンフロー(14kgf/cm2、180℃
)を算出した。
レジンフロー(%)={(質量B-質量C))/(質量A−質量C)}×100
なお、質量Cとは10cm角の銅箔質量である。
<Measurement of resin flow>
The copper foil for press bonding obtained in Examples and Comparative Examples, that is, the copper foil for press bonding provided with the resin layer A in the B stage state on the copper foil was cut into 10 cm squares, and the mass was measured (mass A). . And the cut copper foil for press bonding was pinched | interposed with the SUS board, and 180 degreeC * 10min press was implemented by the normal pressure by the pressure of 14 kgf / cm < 2 >. Thereafter, the paste protruding from the 10 cm square was removed, and the mass was measured again (mass B).
After mass measurement, the resin flow (14 kgf / cm 2 , 180 ° C.) is calculated using
) Was calculated.
Resin flow (%) = {(mass B-mass C)) / (mass A-mass C)} × 100
The mass C is the mass of a 10 cm square copper foil.
<真空プレス処理(溝充填性)>
実施例・比較例で得たプレス接着用銅箔、すなわち銅箔上にBステージ状態の樹脂層Aを備えたプレス接着用銅箔を、溝200μm、深さ1000μm、溝ピッチ5mmの格子状パターンを形成したガラエポ基板上へ、該樹脂層Aを下にして積層して積層体とし、さらにこの積層体をSUS板で挟み込み、30kg/cm2の圧力で180℃×60minプレスを真空中で実施した。
その後、溝への充填状態を目視にて判定すると共に、シート端からはみ出した溶融樹脂(ペースト)の量を計測して「はみ出し」を判定した。
<Vacuum press processing (groove filling)>
A copper foil for press bonding obtained in Examples and Comparative Examples, that is, a copper foil for press bonding provided with a resin layer A in a B-stage state on the copper foil, a lattice pattern having a groove of 200 μm, a depth of 1000 μm, and a groove pitch of 5 mm A laminated body is formed by laminating the resin layer A on the glass epoxy substrate on which the substrate is formed. Further, the laminated body is sandwiched between SUS plates, and pressed at 180 ° C. for 60 minutes in a vacuum at a pressure of 30 kg / cm 2. did.
Thereafter, the filling state of the groove was determined visually, and the amount of the molten resin (paste) that protruded from the sheet edge was measured to determine “excess”.
「溝充填性」に関しては、溝内が全て樹脂で充填された場合を「○(good)」と判定し、溝内の一部に樹脂が充填されてない部分がある場合を「×(poor)」と判定した。
「はみ出し」に関しては、シート端からはみ出した溶融樹脂(ペースト)の幅が10mm未満の場合を「○(good)」と判定し、10mm以上の場合を「×(poor)」と判定した。
Regarding “groove filling”, when the groove is completely filled with resin, it is judged as “good (good)”, and when there is a part not filled with resin in the groove, “× (poor ) ”.
Regarding “excess”, the case where the width of the molten resin (paste) protruding from the sheet edge was less than 10 mm was determined as “good”, and the case where the width was 10 mm or more was determined as “x (poor)”.
<真空プレス処理(抵抗測定)>
実施例・比較例で得たプレス接着用PETフィルム、すなわちPETフィルム上にBステージ状態の樹脂層Aを備えたプレス接着用PETフィルムを、該樹脂層Aを上にして離形フィルムに重ねて積層体とし、この積層体をSUS板で挟み込み、30kg/cm2の圧力で180℃×60minプレスを真空中で実施した。その後、離形フィルムを剥離し、樹脂層Aの抵抗を、四探針法(JISK7194準拠)にて表面抵抗を測定した。また、硬化物の厚みを測定し、比抵抗(Ω・cm)を算出した。
<Vacuum press treatment (resistance measurement)>
The PET film for press bonding obtained in the examples and comparative examples, that is, the PET film for press bonding provided with the resin layer A in the B stage state on the PET film, is laminated on the release film with the resin layer A facing up. It was set as the laminated body, this laminated body was pinched | interposed with the SUS board, and 180 degreeC * 60min press was implemented in the vacuum with the pressure of 30 kg / cm < 2 >. Thereafter, the release film was peeled off, and the resistance of the resin layer A was measured for surface resistance by a four-probe method (based on JISK7194). Further, the thickness of the cured product was measured, and the specific resistance (Ω · cm) was calculated.
<総合判定>
比抵抗が10-4Ω・cm未満で、かつ「溝充填性」及び「はみ出し」の評価がいずれも「○(good)」の場合を「○(good)」と総合的に判定し、どれか一つの項目でも満たさない場合を「×(poor)」と総合的に判定した。
<Comprehensive judgment>
When the specific resistance is less than 10 −4 Ω · cm and the evaluation of “groove filling” and “extrusion” is “good”, it is comprehensively judged as “good”. The case where even one item was not satisfied was comprehensively determined as “× (poor)”.
(考察)
実施例1−10においてはいずれの場合も、樹脂層Aの樹脂はモールド樹脂部分を被覆すると共に、ハーフダイシングにより形成された切込み溝内の隅々まで、樹脂及び導電性粉末粒子が侵入して、当該溝内は樹脂によって充填され、導通をとることができた。
このような実施例の結果と、これまで発明者が行ってきた試験結果から、樹脂層A中の導電性粒子の円形度(累積50%)が0.80未満であり、且つ、樹脂層A中の導電性粒子の円形度(累積90%)が0.60未満であり、且つ、樹脂層A中の導電性粒子の円形度の標準偏差が0.130以上に規定することにより、細い溝や小さな孔内の隅々まで、樹脂層Aの樹脂乃至導電性粒子を充填することができ、しかも、比較的少ない量の導電性粒子でも確実に導通をとることができることが分かった。
(Discussion)
In all cases in Example 1-10, the resin of the resin layer A covers the mold resin portion, and the resin and the conductive powder particles penetrate into every corner in the cut groove formed by half dicing. The inside of the groove was filled with resin, and conduction could be obtained.
From the results of these examples and the test results conducted by the inventors so far, the circularity (cumulative 50%) of the conductive particles in the resin layer A is less than 0.80, and the resin layer A When the circularity (cumulative 90%) of the conductive particles therein is less than 0.60 and the standard deviation of the circularity of the conductive particles in the resin layer A is specified to be 0.130 or more, a narrow groove It has been found that the resin or conductive particles of the resin layer A can be filled to every corner of the small hole, and that conduction can be ensured even with a relatively small amount of conductive particles.
Claims (6)
Bステージ状態の樹脂中に導電性粒子を含有してなる樹脂層Aのレジンフローが3〜20%であることを特徴とするプレス接着用金属箔。 A metal foil for press bonding provided with a metal foil and a resin layer A containing conductive particles in a resin in a B-stage state, the conductive particles in the resin layer A having a higher circularity The circularity of the conductive particles at a cumulative number of 50 counted from 50% (referred to as “cumulative 50%”) is less than 0.80, and among the conductive particles in the resin layer A, the circularity is higher The circularity of the conductive particles at the counted frequency accumulation of 90 number% (referred to as “cumulative 90%”) is less than 0.60, and the standard deviation of the circularity of the conductive particles in the resin layer A is 0.00. 130 or more ,
A resin foil for press bonding, wherein the resin flow of a resin layer A containing conductive particles in a B-stage resin is 3 to 20% .
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