WO2016088381A1 - Film de protection contre les ondes électromagnétiques - Google Patents

Film de protection contre les ondes électromagnétiques Download PDF

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Publication number
WO2016088381A1
WO2016088381A1 PCT/JP2015/006013 JP2015006013W WO2016088381A1 WO 2016088381 A1 WO2016088381 A1 WO 2016088381A1 JP 2015006013 W JP2015006013 W JP 2015006013W WO 2016088381 A1 WO2016088381 A1 WO 2016088381A1
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WO
WIPO (PCT)
Prior art keywords
layer
electromagnetic wave
shielding film
wave shielding
protective layer
Prior art date
Application number
PCT/JP2015/006013
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English (en)
Japanese (ja)
Inventor
岩井　靖
善治 柳
茂樹 竹下
Original Assignee
タツタ電線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to KR1020177004356A priority Critical patent/KR101956091B1/ko
Priority to JP2016562314A priority patent/JP6511473B2/ja
Priority to CN201580063071.9A priority patent/CN107079611A/zh
Publication of WO2016088381A1 publication Critical patent/WO2016088381A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer

Definitions

  • the present disclosure relates to an electromagnetic wave shielding film, a manufacturing method thereof, and a shield printed wiring board.
  • the conductive adhesive layer is overlapped with the opening provided in the insulating layer covering the ground circuit of the printed wiring board, heated and pressed, and the opening is filled with the conductive adhesive.
  • the shield layer and the ground circuit of the printed wiring board are connected via the conductive adhesive, and the printed wiring board is shielded.
  • This disclosure is intended to realize an electromagnetic wave shielding film having good shielding characteristics, a method for manufacturing the same, and a shield printed wiring board even when conductive particles are not used in the adhesive layer.
  • An aspect of the electromagnetic wave shielding film of the present disclosure includes a conductive shield layer having unevenness and an adhesive layer that covers the unevenness, and the maximum peak height of the unevenness is larger than the thickness of the adhesive layer.
  • the maximum peak height of the unevenness may be 20 ⁇ m or less.
  • the maximum peak height of the unevenness may be 4 ⁇ m or more.
  • One aspect of the electromagnetic wave shielding film may include a protective layer on the surface of the shielding layer opposite to the adhesive layer.
  • the protective layer may have a maximum peak height value on the surface on the shield layer side that is not less than the thickness of the adhesive layer and not more than 20 ⁇ m.
  • the protective layer may contain particles having a particle size of 1 ⁇ m or more and 20 ⁇ m or less.
  • the adhesive layer may be insulative.
  • One aspect of the method for producing an electromagnetic wave shielding film includes a step of preparing a protective layer, a step of forming a conductive shield layer having irregularities on the protective layer, and a thickness higher than the maximum peak height of the shield layer. And a step of forming an adhesive layer covering the unevenness.
  • the step of preparing the protective layer can be a step of forming a protective layer having irregularities having a maximum peak height of 4 ⁇ m or more and 20 ⁇ m or less on the surface.
  • the step of preparing a protective layer is a step of applying and curing a protective layer composition containing a resin composition and particles on a supporting substrate, and particles 1 ⁇ m or more and 20 ⁇ m or less may be used.
  • the step of preparing the protective layer may include a step of forming a resin layer on the support substrate and a step of forming irregularities on the resin layer.
  • the step of forming the unevenness may include a step of embossing the resin layer.
  • the step of forming the unevenness may include a step of blasting the resin layer.
  • the step of preparing the protective layer may include a step of forming a resin layer on a support substrate having irregularities on the surface.
  • the step of forming the adhesive layer may be a step of applying an adhesive composition on the shield layer.
  • a shield printed wiring board of the present disclosure includes the electromagnetic wave shielding film of the present disclosure, a base layer provided with a signal circuit and a ground circuit, and an insulating layer provided with an opening exposing at least a part of the ground circuit.
  • the electromagnetic wave shielding film and the printed wiring board are bonded with the adhesive layer and the insulating layer facing each other, and the convex portion of the shielding layer penetrates the adhesive layer and is exposed from the opening. It is in contact with the ground circuit.
  • the electromagnetic wave shielding film of the present disclosure it is possible to provide an electromagnetic wave shielding film with good shielding characteristics even when conductive particles are not used in the adhesive layer.
  • the electromagnetic wave shielding film 100 As shown in FIG. 1, the electromagnetic wave shielding film 100 according to one embodiment is provided in contact with a conductive shield layer 110 having projections and depressions 110 a and depressions 110 b and a first surface of the shield layer 110. And an adhesive layer 120. The convex portion 110 a of the shield layer 110 is covered with the adhesive layer 120. At least a part of the convex portion 110a of the shield layer 110 penetrates the adhesive layer 120 when the electromagnetic wave shielding film 100 is pressed and attached to the printed wiring board.
  • the maximum peak height of the unevenness of the shield layer may be larger than the thickness (t) of the adhesive layer 120.
  • the value of the maximum peak height (Rp) may be larger than the thickness (t) of the adhesive layer 120, but is preferably 4 ⁇ m or more.
  • the convex portion 110a can easily penetrate the adhesive layer 120 when the shield film is pressed and attached to the printed wiring board. Thereby, the resistance value between the electromagnetic wave shielding film 100 and the ground circuit can be reduced, and good shielding characteristics can be obtained. Further, it is possible to provide an adhesive layer 120 having a sufficient thickness for good adhesion to the printed wiring board.
  • Rp is not particularly limited, but is preferably 20 ⁇ m or less. By setting Rp to 20 ⁇ m or less, the thickness of the electromagnetic wave shielding film 100 can be reduced. Moreover, it becomes easy to ensure the flatness of the surface of the adhesive layer 120, and when the electromagnetic wave shielding film 100 is pressed and attached to the printed wiring board, the adhesive force between the electromagnetic wave shielding film 100 and the printed wiring board is good. Become.
  • the value of the maximum peak height (Rp) in the present invention is a value measured according to JIS B0651: 2001 shown in the examples.
  • the thickness of the adhesive layer 120 is preferably as thin as possible as long as the projection 110a of the shield layer 110 can be covered, but is preferably 3 ⁇ m or more, more preferably 4 ⁇ m or more, and preferably 10 ⁇ m or less, more preferably 7 ⁇ m or less.
  • the thickness of the adhesive layer 120 is 3 ⁇ m or more, even if the Rp value of the unevenness of the shield layer 110 is large, before the electromagnetic wave shielding film 100 is attached to the printed wiring board, the convex portion of the shield layer 110 110a may not protrude from the adhesive layer 120. For this reason, it can suppress that air mixes between the adhesive bond layer 120 and a printed wiring board, and favorable adhesive force is obtained.
  • the thickness is 10 ⁇ m or less, the electromagnetic wave shielding film 100 can be thinned, and the convex portion 110a of the shield layer 110 can be reliably connected to the ground circuit of the printed wiring board.
  • a protective layer 130 can be provided on the second surface of the shield layer 110 opposite to the adhesive layer 120 as necessary.
  • the protective layer 130 can be formed of an insulating resin material or the like.
  • the convex portion 110 a can be easily formed on the first surface of the shield layer 110 by providing irregularities on the surface of the protective layer 130 on the shield layer 110 side.
  • the Rp on the surface of the protective layer 130 may be equal to or greater than the thickness of the adhesive layer, preferably 4 ⁇ m to 20 ⁇ m. By setting it as such a structure, Rp of the 1st surface of the shield layer 110 can be easily 4 micrometers or more and 20 micrometers or less.
  • the shield layer 110 can be a metal film or a conductive film made of conductive particles.
  • the metal film can be formed of, for example, nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, or an alloy containing any one or more of these.
  • a method for forming the metal film for example, a rolling method, an electrolytic plating method, an electroless plating method, a sputtering method, an electron beam evaporation method, a vacuum evaporation method, a CVD method, a metal organic method, or the like can be used.
  • the conductive particles can be, for example, carbon, silver, copper, nickel, solder, or silver-coated copper particles obtained by performing silver plating on copper powder.
  • particles obtained by performing metal plating on insulating particles such as resin balls or glass beads can be used. These conductive particles can be used alone or in combination of two or more.
  • the shape of the conductive particles may be spherical, needle-like, fibrous, flaky, or dendritic, and is preferably flaky from the viewpoint of layering.
  • the particle diameter of the conductive particles is not particularly limited, but can be 0.1 ⁇ m or more and 10 ⁇ m or less from the viewpoint of thinning the shield layer 110.
  • the thickness of the shield layer 110 may be appropriately selected according to the required electromagnetic shielding characteristics and repeated bending / sliding resistance, but may be about 0.1 ⁇ m or more and 10 ⁇ m or less.
  • the adhesive layer 120 may be insulative or conductive. From the viewpoint of filling into a small-diameter opening, it is preferable to make the adhesive layer 120 insulative. By making the adhesive layer 120 a layer that does not contain conductive fillers such as metal particles, there is also an advantage that the thickness of the adhesive layer 120 can be made thinner.
  • the adhesive layer 120 is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin.
  • Thermoplastic resin compositions such as resin compositions or acrylic resin compositions, or phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions, etc.
  • a thermosetting resin composition or the like can be used. These may be used alone or in combination of two or more.
  • a curing accelerator In the adhesive layer 120, a curing accelerator, tackifier, antioxidant, pigment, dye, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, filler, flame retardant, and At least one of a viscosity modifier and the like may be included.
  • the thickness of the adhesive layer 120 is not particularly limited and may be appropriately set as necessary, but may be 3 ⁇ m or more, preferably 4 ⁇ m or more, 10 ⁇ m or less, preferably 7 ⁇ m or less.
  • the thickness of the adhesive layer 120 is not particularly limited and may be appropriately set as necessary, but may be 3 ⁇ m or more, preferably 4 ⁇ m or more, 10 ⁇ m or less, preferably 7 ⁇ m or less.
  • the electromagnetic wave shielding film of this embodiment may have a protective layer 130.
  • the protective layer 130 only needs to satisfy predetermined mechanical strength, chemical resistance, heat resistance, and the like that can protect the shield layer 110.
  • the protective layer 130 is not particularly limited as long as it has sufficient insulating properties and can protect the adhesive layer 120 and the shield layer 110.
  • the protective layer 130 is a thermoplastic resin composition, a thermosetting resin composition, or an active energy ray curable. A composition or the like can be used.
  • the thermoplastic resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, Alternatively, an acrylic resin composition or the like can be used.
  • a thermosetting resin composition A phenol-type resin composition, an epoxy-type resin composition, a urethane-type resin composition, a melamine-type resin composition, or an alkyd-type resin composition etc. can be used.
  • an active energy ray curable composition For example, the polymeric compound etc. which have at least 2 (meth) acryloyloxy group in a molecule
  • the protective layer 130 may be formed of a single material or may be formed of two or more kinds of materials.
  • a curing accelerator for the protective layer 130, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, and a viscosity adjuster as necessary. At least one of an agent, an anti-blocking agent and the like may be included.
  • the protective layer 130 may be a laminate of two or more layers having different materials, physical properties such as hardness or elastic modulus. For example, if a laminate of an outer layer having a low hardness and an inner layer having a high hardness is used, the outer layer has a cushioning effect, so that the pressure applied to the shield layer 110 is reduced in the process of heating and pressing the electromagnetic wave shielding film 100 to the printed wiring board. it can. For this reason, it can suppress that the shield layer 110 is destroyed by the level
  • the thickness of the protective layer 130 is not particularly limited and can be appropriately set as necessary. However, the thickness is 1 ⁇ m or more, preferably 4 ⁇ m or more, and 20 ⁇ m or less, preferably 10 ⁇ m or less, more preferably 5 ⁇ m or less. Can do. By setting the thickness of the protective layer 130 to 1 ⁇ m or more, the adhesive layer 120 and the shield layer 110 can be sufficiently protected. By setting the thickness of the protective layer 130 to 20 ⁇ m or less, the flexibility of the electromagnetic wave shielding film 100 can be ensured, and it becomes easy to apply the electromagnetic wave shielding film 100 to a member that requires flexibility.
  • Rp on the surface of the protective layer 130 on the shield layer 110 side is preferably not less than the thickness of the adhesive layer, preferably not less than 4 ⁇ m and not more than 20 ⁇ m.
  • the protective layer 130 can be a layer containing particles. Unevenness can be easily formed on the surface of the protective layer 130 by adding particles.
  • the particles added to the protective layer 130 are not particularly limited, and known particles can be used.
  • inorganic particles such as silica or alumina, or resin particles can be used.
  • the average particle diameter of the particles added to the protective layer 130 can be determined according to the size of the irregularities formed on the surface, but is 1 ⁇ m or more, preferably 4 ⁇ m or more, and 20 ⁇ m or less, preferably 15 ⁇ m or less, more preferably Can be 10 ⁇ m or less.
  • the average particle diameter of the particles can be 1 ⁇ m or more, unevenness on the surface of the protective layer 130 can be increased, and the shield layer 110 can easily penetrate the adhesive layer 120 in the heating and pressing step.
  • By setting the average particle size of the particles to 20 ⁇ m or less there is an advantage that the thickness of the protective layer 130 can be reduced.
  • the amount of the fine particles added to the protective layer 130 can be determined according to the thickness of the protective layer 130, the size of the irregularities formed on the surface, etc., but the resin composition forming the protective layer 130 and the fine particles
  • the total content can be 1% by mass or more, preferably 5% by mass or more, and 30% by mass or less, preferably 20% by mass or less.
  • the shape of the fine particles added to the protective layer 130 is not particularly limited, and may be any of a spherical shape, a needle shape, a fiber shape, a flake shape, and a dendritic shape, but the shield layer 110 having irregularities on the surface of the protective layer 130. From the viewpoint of easily forming the film, it is preferably spherical.
  • blasting As a method of providing irregularities on the surface of the protective layer 130, blasting, plasma irradiation, electron beam irradiation, chemical treatment, embossing, or the like can be used.
  • a protective layer composition is formed by applying a protective layer composition on a support substrate 140.
  • the protective layer composition can be prepared by adding appropriate amounts of particles 133, a solvent, and other compounding agents to the resin composition 132.
  • the particles 133 are not particularly limited, and known fine particles can be used. Examples of such particles include inorganic particles such as silica or alumina, or resin fine particles.
  • the average particle diameter of the particles 133 can be 1 ⁇ m or more, preferably 4 ⁇ m or more, and 20 ⁇ m or less, preferably 15 ⁇ m or less, more preferably 10 ⁇ m or less.
  • the blending amount of the particles 133 can be 1% by mass or more, preferably 5% by mass or more, and 30% by mass or less, preferably 20% by mass or less with respect to the total of the resin composition 132 and the particles 133.
  • the solvent can be, for example, toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, dimethylformamide, and the like.
  • a crosslinking agent, a polymerization catalyst, a curing accelerator, a colorant, and the like can be added. Other compounding agents may be added if necessary, and may not be added.
  • the protective layer composition prepared above is applied to one side of the support substrate 140.
  • the method for applying the protective layer composition to one side of the support substrate 140 is not particularly limited, and known techniques such as lip coating, comma coating, gravure coating, and slot die coating can be employed.
  • the support substrate 140 can be formed into a film, for example.
  • the support substrate 140 is not particularly limited, and can be formed of, for example, a polyolefin-based material, a polyester-based material, a polyimide-based material, a polyphenylene sulfide-based material, or the like.
  • a release agent layer may be provided between the support substrate 140 and the protective layer composition.
  • the solvent is removed by heating and drying, whereby the protective layer 130 having an uneven shape on the surface is formed.
  • the support substrate 140 can be peeled from the protective layer 130.
  • the support substrate 140 can be peeled after the electromagnetic wave shielding film 100 is attached to the printed wiring board. In this way, the electromagnetic shielding film 100 can be protected by the support substrate 140.
  • an uneven shape may be formed on the surface of the protective layer after forming a protective layer having a flat surface using a support base having a flat surface.
  • the concavo-convex shape can be formed by blasting, dry etching by plasma irradiation or electron beam irradiation, wet etching by chemical treatment, embossing, or the like.
  • an uneven shape by spraying dry ice or the like on the surface of the support substrate.
  • an uneven shape can be imparted by pressing a mold having an uneven shape onto the surface of the support substrate.
  • a protective layer having a concavo-convex shape on the surface may be formed by applying and drying the composition for the protective layer on the surface of the support substrate having the concavo-convex shape on the surface.
  • a shield layer 110 having a convex portion 110a on the surface is formed.
  • the shield layer 110 having the convex portions 110a on the surface can be easily formed by forming a metal film having a thickness of about 0.1 ⁇ m to 10 ⁇ m on the surface of the protective layer 130 having an uneven shape.
  • the metal film can be formed by an electrolytic plating method, an electroless plating method, a sputtering method, an electron beam evaporation method, a vacuum evaporation method, a CVD method, a metal organic method, or the like.
  • the shield layer may be formed by coating a conductive paste containing conductive particles on the surface of the protective layer having irregularities. In this case, the coating layer can be baked as necessary.
  • the shield layer having irregularities can be formed by roughening the surface of the metal film.
  • corrugation can also be formed by processing a copper foil into an uneven
  • the composition for an adhesive layer includes a resin composition and a solvent.
  • the resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin.
  • Compositions, or thermoplastic resin compositions such as acrylic resin compositions, or phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions, etc. It can be set as a thermosetting resin composition or the like.
  • the solvent can be, for example, toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, dimethylformamide, and the like.
  • the composition for the adhesive layer is cured accelerator, tackifier, antioxidant, pigment, dye, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, filler, flame retardant, and At least one of a viscosity modifier and the like may be included. What is necessary is just to set the ratio of the resin composition in the composition for adhesive bond layers suitably according to the thickness etc. of the adhesive bond layer 120.
  • an adhesive layer composition is applied on the shield layer 110.
  • the method for applying the adhesive layer composition on the shield layer 110 is not particularly limited, and lip coating, comma coating, gravure coating, slot die coating, or the like can be used.
  • the solvent is removed by heating and drying to form the adhesive layer 120.
  • the manufacturing method of the electromagnetic wave shielding film is not limited to the above method. For example, after preparing a first support base and a second support base, applying a protective layer composition on the surface of the first support base in the same manner as described above to form a protective layer, Further, a shield layer is formed. Further, the adhesive layer 120 is formed on the surface of the second support substrate by applying the adhesive layer composition in the same manner as described above. Subsequently, an electromagnetic wave shielding film can also be produced by bonding the shield layer formed on the first support substrate and the adhesive layer formed on the second support substrate while facing each other.
  • the electromagnetic wave shielding film 100 of the present embodiment can make the adhesive layer 120 insulative.
  • the adhesive layer 120 may be conductive, and in this case, a conductive filler can be added to the adhesive layer composition.
  • a conductive filler can be added to the adhesive layer composition.
  • the shield layer 110 is directly connected to the ground circuit, the shielding characteristics are improved as compared with the conventional electromagnetic wave shielding film.
  • the amount of the conductive filler can be reduced as compared with the conventional conductive adhesive layer, and the cost can be reduced. Furthermore, even if the diameter of the opening formed in the insulating layer covering the ground circuit is small, the connection between the ground circuit and the shield layer is good.
  • the electromagnetic wave shielding film 100 of this embodiment can be used for the following shield printed wiring boards.
  • the shield printed wiring board 300 includes a printed wiring board 200 and an electromagnetic wave shielding film 100.
  • the printed wiring board 200 covers the base layer 210, the printed circuit 220 including the signal circuit 220A and the ground circuit 220B formed on the base layer 210, and the base layer 210 so as to expose at least part of the ground circuit 220B. And an insulating layer 230.
  • the base layer 210 and the insulating layer 230 may be any material, but may be a resin film, for example. In this case, it can be formed of a resin such as polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyether imide, or polyphenylene sulfide.
  • the printed circuit 220 may be a copper wiring pattern formed on the base layer 210, for example.
  • the electromagnetic wave shielding film 100 is bonded to the printed wiring board 200 with the adhesive layer 120 on the insulating layer 230 side.
  • a part of the projection 110 a of the shield layer 110 penetrates the adhesive layer 120 and is in contact with the ground circuit 220 ⁇ / b> B exposed from the insulating layer 230.
  • the shield layer 110 and the ground circuit 220 ⁇ / b> B can be electrically connected to exhibit excellent shielding characteristics.
  • the adhesive layer 120 does not include a conductive filler, there is no conductive filler between the ground circuit 220B and the shield layer 110, and thus there is no need to consider resistance due to the conductive filler.
  • the resistance value between the ground circuit 220B and the shield layer 110 is not significantly reduced, and thus excellent shield characteristics are exhibited. Furthermore, when the adhesive layer 120 does not contain a conductive filler, the adhesive layer 120 can be made thinner, and the thickness of the shield printed wiring board 300 can be made thinner than before.
  • the electromagnetic wave shielding film 100 is placed on the printed wiring board 200 and pressed while being heated by a press. A part of the adhesive layer 120 softened by heating flows into the opening of the insulating layer 230 by pressurization. Further, at least a part of the convex portion 110 a of the shield layer 110 penetrates the adhesive layer 120 by pressurization. Thereby, the shield layer 110 and the ground circuit 220B are connected. Since there is a sufficient amount of adhesive layer 120 between the shield layer 110 and the printed wiring board 200 in the concave portion of the shield layer 110, the electromagnetic wave shielding film 100 and the printed wiring board 200 have sufficient strength. Glued with.
  • a PET film having a thickness of 60 ⁇ m and a surface subjected to a release treatment was used as a supporting substrate.
  • a protective layer is formed by applying a composition for a protective layer (solid content 30% by mass) containing silica particles having a predetermined particle size, bisphenol A type epoxy resin and methyl ethyl ketone on a support substrate and drying by heating. did.
  • a shield layer was formed by depositing silver having a thickness of 0.5 ⁇ m on the surface of the protective layer.
  • an adhesive made of an epoxy resin was applied to the surface of the shield layer to form an adhesive layer having a predetermined thickness.
  • ⁇ Method for measuring thickness of adhesive layer The value obtained by subtracting the thickness of the laminate of the protective layer and the shield layer before forming the adhesive layer from the thickness of the electromagnetic wave shielding film after forming the adhesive layer was taken as the thickness of the adhesive layer. Each thickness was measured according to JIS C 2151 using a micrometer (MDH-25 manufactured by Mitutoyo Corporation).
  • the maximum peak height (Rp) of the shield layer surface was measured according to JIS B0651: 2001 using a confocal microscope manufactured by Lasertec.
  • An electromagnetic wave shielding film was temporarily attached to the surface of the printed wiring board (120 ° C., 0.5 MPa, 5 seconds), and then heated and pressurized (170 ° C., 3 MPa, 30 minutes) to form a shield printed wiring board.
  • the printed wiring board one having two copper foil patterns extending in parallel at an interval and an insulating layer made of polyimide having a thickness of 25 ⁇ m covering the copper foil pattern was used.
  • the insulating layer was provided with an opening for exposing each copper foil pattern. The diameter of the opening was 1 mm.
  • the connectivity between the copper foil pattern and the electromagnetic wave shielding film was evaluated by measuring the electrical resistance value between the two copper foil patterns with a resistance meter. When the electrical resistance is less than 0.4 ⁇ , the connectivity is considered good.
  • Example 1 Particles added to the protective layer composition were silica having a particle diameter of 4 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-5SDC), and the silica content was 15% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the obtained protective layer was 6 ⁇ m.
  • the maximum peak height on the shield layer surface was 4.5 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.1 ⁇ .
  • Example 2 The particles added to the protective layer composition were silica having a particle size of 9 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-12D), and the silica content was 5% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the obtained protective layer was 7 ⁇ m.
  • the maximum peak height on the shield layer surface was 5.2 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.2 ⁇ .
  • Example 3 The procedure was the same as Example 2 except that the thickness of the adhesive layer was 5 ⁇ m. The resistance value was 0.2 ⁇ .
  • Example 4 The particles added to the protective layer composition were silica having a particle size of 9 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-12D), and the silica content was 15% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the obtained protective layer was 11 ⁇ m.
  • the maximum peak height on the shield layer surface was 9.1 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.1 ⁇ .
  • Example 5 The same operation as in Example 4 was conducted except that the thickness of the adhesive layer was changed to 5 ⁇ m. The resistance value was 0.1 ⁇ .
  • Example 6 The same operation as in Example 4 was conducted except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 0.1 ⁇ .
  • Example 7 The particles added to the protective layer composition were silica having a particle diameter of 14 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-940), and the silica content was 5% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the protective layer obtained was 16 ⁇ m.
  • the maximum peak height on the shield layer surface was 8.7 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.2 ⁇ .
  • Example 7 Example 7 was repeated except that the thickness of the adhesive layer was 5 ⁇ m. The resistance value was 0.2 ⁇ .
  • Example 9 The procedure was the same as Example 7 except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 0.1 ⁇ .
  • Example 10 Particles added to the protective layer composition were silica having a particle size of 14 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-940), and the content of silica was 15% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the obtained protective layer was 20 ⁇ m.
  • the maximum peak height on the shield layer surface was 16.3 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.1 ⁇ .
  • Example 11 Example 10 was repeated except that the thickness of the adhesive layer was 5 ⁇ m. The resistance value was 0.1 ⁇ .
  • Example 12 The procedure was the same as Example 10 except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 0.1 ⁇ .
  • the particles added to the protective layer composition were silica having a particle size of 14 ⁇ m (FB-940, manufactured by Denki Kagaku Kogyo Co., Ltd.), and the silica content was 25% by mass with respect to the total of the resin composition and silica. did.
  • the thickness of the obtained protective layer was 20 ⁇ m.
  • the maximum peak height on the shield layer surface was 14.6 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.2 ⁇ .
  • Example 14 Example 13 was repeated except that the thickness of the adhesive layer was 5 ⁇ m. The resistance value was 0.2 ⁇ .
  • Example 15 Example 13 was repeated except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 0.2 ⁇ .
  • Particles added to the protective layer composition were silica having a particle size of 4 ⁇ m (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-5SDC), and the silica content was 5% by mass with respect to the total of the resin composition and silica. .
  • the thickness of the obtained protective layer was 5 ⁇ m.
  • the maximum peak height on the shield layer surface was 2.2 ⁇ m.
  • the thickness of the adhesive layer was 3 ⁇ m.
  • the resistance value was 0.6 ⁇ .
  • Comparative Example 2 Comparative Example 1 was performed except that the thickness of the adhesive layer was changed to 5 ⁇ m. The resistance value was 1.4 ⁇ .
  • Comparative Example 3 Comparative Example 1 was performed except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 1.8 ⁇ .
  • Example 4 The procedure was the same as Example 1 except that the thickness of the adhesive layer was 5 ⁇ m. The resistance value was 0.5 ⁇ .
  • Example 5 The procedure was the same as Example 1 except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 1.3 ⁇ .
  • Example 6 The procedure was the same as Example 2 except that the thickness of the adhesive layer was 8 ⁇ m. The resistance value was 0.5 ⁇ .
  • Table 1 summarizes each example and comparative example.
  • the present invention is not limited to the above-described embodiment, and can be applied with appropriate modifications within a range that does not change the gist of the present invention.
  • the electromagnetic shielding film of the present disclosure is useful as an electromagnetic shielding film used for a printed wiring board and the like because the high-frequency transmission efficiency is unlikely to decrease.
  • Electromagnetic wave shield film 110 Shield layer 110a Protrusion part 120 Adhesive layer 130 Protective layer 132 Resin composition 133 Particle 140 Support base material 200 Printed wiring board 210 Base layer 220 Printed circuit 220A Signal circuit 220B Ground circuit 230 Insulating layer 300 Shield printed wiring Board

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un film de protection contre les ondes électromagnétiques pourvu d'une couche de protection électroconductrice 110 ayant des saillies et des renfoncements, et une couche adhésive 120 pour le revêtement des saillies et des renfoncements. La hauteur maximale de pic des saillies et des renfoncements est supérieure à l'épaisseur de la couche adhésive 120.
PCT/JP2015/006013 2014-12-05 2015-12-03 Film de protection contre les ondes électromagnétiques WO2016088381A1 (fr)

Priority Applications (3)

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KR1020177004356A KR101956091B1 (ko) 2014-12-05 2015-12-03 전자파 차폐 필름
JP2016562314A JP6511473B2 (ja) 2014-12-05 2015-12-03 電磁波シールドフィルム
CN201580063071.9A CN107079611A (zh) 2014-12-05 2015-12-03 电磁波屏蔽膜

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JP2019121731A (ja) * 2018-01-10 2019-07-22 タツタ電線株式会社 電磁波シールドフィルム
CN110691501A (zh) * 2018-07-06 2020-01-14 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
JP2020516052A (ja) * 2018-03-14 2020-05-28 グアンジョウ ファン バン エレクトロニクス カンパニー，リミテッドＧｕａｎｇｚｈｏｕ Ｆａｎｇ Ｂａｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． 電磁シールドフィルム、回路基板及び電磁シールドフィルムの製造方法
JP2020202183A (ja) * 2020-08-11 2020-12-17 旭化成株式会社 分散体及びプリント配線基板製造用基板
CN112534974A (zh) * 2018-10-29 2021-03-19 拓自达电线株式会社 电磁波屏蔽膜、屏蔽印制线路板的制造方法及屏蔽印制线路板
CN112586103A (zh) * 2018-10-29 2021-03-30 拓自达电线株式会社 电磁波屏蔽膜、屏蔽印制线路板的制造方法及屏蔽印制线路板
WO2022181570A1 (fr) * 2021-02-24 2022-09-01 タツタ電線株式会社 Film de protection contre les ondes électromagnétiques

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JP2019046871A (ja) * 2017-08-30 2019-03-22 タツタ電線株式会社 電磁波シールドフィルム、シールドプリント配線板、及び、シールドプリント配線板の製造方法
JP2019121731A (ja) * 2018-01-10 2019-07-22 タツタ電線株式会社 電磁波シールドフィルム
JP2020516052A (ja) * 2018-03-14 2020-05-28 グアンジョウ ファン バン エレクトロニクス カンパニー，リミテッドＧｕａｎｇｚｈｏｕ Ｆａｎｇ Ｂａｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． 電磁シールドフィルム、回路基板及び電磁シールドフィルムの製造方法
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CN110691501A (zh) * 2018-07-06 2020-01-14 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN112586103A (zh) * 2018-10-29 2021-03-30 拓自达电线株式会社 电磁波屏蔽膜、屏蔽印制线路板的制造方法及屏蔽印制线路板
CN112534974A (zh) * 2018-10-29 2021-03-19 拓自达电线株式会社 电磁波屏蔽膜、屏蔽印制线路板的制造方法及屏蔽印制线路板
JP7005709B2 (ja) 2020-08-11 2022-01-24 旭化成株式会社 分散体及びプリント配線基板製造用基板
JP2020202183A (ja) * 2020-08-11 2020-12-17 旭化成株式会社 分散体及びプリント配線基板製造用基板
WO2022181570A1 (fr) * 2021-02-24 2022-09-01 タツタ電線株式会社 Film de protection contre les ondes électromagnétiques
KR20220123474A (ko) 2021-02-24 2022-09-06 타츠타 전선 주식회사 전자파 차폐 필름
CN115486215A (zh) * 2021-02-24 2022-12-16 拓自达电线株式会社 电磁波屏蔽膜
JP7206441B1 (ja) * 2021-02-24 2023-01-17 タツタ電線株式会社 電磁波シールドフィルム
CN115486215B (zh) * 2021-02-24 2023-08-11 拓自达电线株式会社 电磁波屏蔽膜

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JP6511473B2 (ja) 2019-05-15
CN107079611A (zh) 2017-08-18

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