TWI846693B - Electromagnetic wave shielding film with transfer film, method for producing electromagnetic wave shielding film with transfer film, and method for producing shielded printed wiring board - Google Patents
Electromagnetic wave shielding film with transfer film, method for producing electromagnetic wave shielding film with transfer film, and method for producing shielded printed wiring board Download PDFInfo
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Abstract
本發明提供一種附轉印膜之電磁波屏蔽膜，其於製造屏蔽印刷配線板時，可使電磁波屏蔽膜的接著劑層與印刷配線板表面之間不易產生間隙。 附轉印膜之電磁波屏蔽膜係由轉印膜及積層於上述轉印膜的電磁波屏蔽膜構成，其特徵在於：上述電磁波屏蔽膜包含：與上述轉印膜接觸的保護層、積層於上述保護層的屏蔽層、及積層於上述屏蔽層的接著劑層；上述轉印膜之楊氏模數為2.0GPa以上。The present invention provides an electromagnetic wave shielding film with a transfer film, which can prevent a gap from being easily generated between the adhesive layer of the electromagnetic wave shielding film and the surface of the printed wiring board when manufacturing a shielded printed wiring board. The electromagnetic wave shielding film with a transfer film is composed of a transfer film and an electromagnetic wave shielding film laminated on the transfer film, and is characterized in that: the electromagnetic wave shielding film includes: a protective layer in contact with the transfer film, a shielding layer laminated on the protective layer, and an adhesive layer laminated on the shielding layer; the Young's modulus of the transfer film is greater than 2.0 GPa.
Description
發明領域 Invention Field
本發明是有關於附轉印膜之電磁波屏蔽膜、附轉印膜之電磁波屏蔽膜之製造方法及屏蔽印刷配線板之製造方法。 The present invention relates to an electromagnetic wave shielding film with a transfer film, a method for manufacturing an electromagnetic wave shielding film with a transfer film, and a method for manufacturing a shielded printed wiring board.
背景技術 Background technology
在急速發展小型化、高機能化的行動電話、視訊攝影機、筆記型電腦等電子儀器中，為了將電路裝入複雜的機構中，大多會使用撓性印刷配線板。再者，活用其優異之可撓性，還會利用在像是印刷頭之類的可動部與控制部之連接。於該等電子儀器中，必須要有電磁波屏蔽措施，於裝置內所使用之撓性印刷配線板中，亦開始使用已施加電磁波屏蔽措施的撓性印刷配線板(以下亦記載為「屏蔽印刷配線板」)。 In electronic devices such as mobile phones, video cameras, and laptop computers, which are rapidly developing in miniaturization and high functionality, flexible printed wiring boards are often used to install circuits in complex mechanisms. Furthermore, taking advantage of its excellent flexibility, it is also used to connect movable parts such as print heads with control parts. In such electronic devices, electromagnetic wave shielding measures must be taken, and flexible printed wiring boards used in the devices have also begun to use flexible printed wiring boards that have been given electromagnetic wave shielding measures (hereinafter also referred to as "shielded printed wiring boards")
舉例言之，專利文獻1中揭示有一種屏蔽印刷配線板之製造方法，其係於含印刷電路的基體膜上被覆電磁波屏蔽膜。 For example, Patent Document 1 discloses a method for manufacturing a shielded printed wiring board, which comprises coating an electromagnetic wave shielding film on a base film containing a printed circuit.
於專利文獻1中記載的屏蔽印刷配線板之製造方法中揭示：在被覆電磁波屏蔽膜時，於覆蓋膜(保護層)之單面 設置屏蔽層及導電性接著劑層(接著劑層)，且於另一面貼合可剝離之具黏著性的黏著性膜(轉印膜)而形成補強屏蔽膜(附轉印膜之電磁波屏蔽膜)，並以導電性接著劑層抵接於基體膜上之方式來載置補強屏蔽膜，進行加熱、加壓使其等接著後，剝離前述黏著性膜。 The manufacturing method of the shielded printed wiring board described in Patent Document 1 discloses that: when coating with an electromagnetic wave shielding film, a shielding layer and a conductive adhesive layer (adhesive layer) are provided on one side of the covering film (protective layer), and a peelable adhesive film (transfer film) with adhesiveness is attached to the other side to form a reinforced shielding film (electromagnetic wave shielding film with transfer film), and the reinforced shielding film is placed in a manner that the conductive adhesive layer is in contact with the base film, and after heating and pressurizing to make them adhere, the aforementioned adhesive film is peeled off.
先前技術文獻 Prior art literature
專利文獻 Patent Literature
專利文獻1：日本特開2000-269632號公報 Patent document 1: Japanese Patent Publication No. 2000-269632
發明概要 Summary of invention
如上述，電磁波屏蔽膜會透過電磁波屏蔽膜的接著劑層黏貼於印刷配線板。 As mentioned above, the electromagnetic wave shielding film is adhered to the printed wiring board through the adhesive layer of the electromagnetic wave shielding film.
與接著劑層相接的印刷配線板之表面通常並非平坦而是有高低差。 The surface of the printed wiring board that is in contact with the adhesive layer is usually not flat but has height differences.
接著劑層具有可塑性，因此可一定程度填埋印刷配線板表面的高低差，但卻無法完全埋住而有產生間隙之情形。 The adhesive layer has plasticity, so it can fill the height difference of the printed wiring board surface to a certain extent, but it cannot be completely filled and gaps may occur.
此種間隙會成為各種問題的原因。 This gap can be the cause of various problems.
作為此種問題之一例，以下說明透過電磁波屏蔽膜來連接印刷配線板的接地電路與外部接地之情形。 As an example of this problem, the following describes the case where the ground circuit of a printed wiring board is connected to an external ground through an electromagnetic wave shielding film.
印刷配線板之基本結構具有：基底膜、形成於基底膜上且含接地電路的印刷電路、及覆蓋印刷電路的覆蓋層。 The basic structure of a printed wiring board includes: a base film, a printed circuit formed on the base film and including a ground circuit, and a cover layer covering the printed circuit.
為了使接地電路與外部接地電連接，在位於接地電路上的覆蓋層上有時會形成露出接地電路的孔。該露出接地 電路的孔會成為印刷配線板表面的高低差。 In order to connect the ground circuit to the external ground, a hole exposing the ground circuit is sometimes formed in the cover layer located above the ground circuit. The hole exposing the ground circuit will become a height difference on the surface of the printed wiring board.
如上述，電磁波屏蔽膜會透過電磁波屏蔽膜的接著劑層黏貼於印刷配線板。另，在此情形下，為了使接地電路與外部接地電連接，電磁波屏蔽膜的接著劑層會使用具導電性之接著劑層。 As mentioned above, the electromagnetic wave shielding film is adhered to the printed wiring board through the adhesive layer of the electromagnetic wave shielding film. In addition, in this case, in order to connect the ground circuit to the external ground, the adhesive layer of the electromagnetic wave shielding film uses a conductive adhesive layer.
當電磁波屏蔽膜黏貼於印刷配線板時，電磁波屏蔽膜的接著劑層會變形或流動而填埋露出接地電路的孔(亦即印刷配線板表面的高低差)。 When the electromagnetic wave shielding film is attached to the printed wiring board, the adhesive layer of the electromagnetic wave shielding film will deform or flow to fill the hole where the ground circuit is exposed (that is, the height difference on the surface of the printed wiring board).
不過，若露出接地電路的孔徑小，則電磁波屏蔽膜的接著劑層無法充分填埋露出接地電路的孔，會有接地電路與電磁波屏蔽膜的接著劑層無法充分接觸之情形。在此種情形下，會產生連接電阻上升的問題。 However, if the hole diameter of the exposed ground circuit is small, the adhesive layer of the electromagnetic wave shielding film cannot fully fill the hole of the exposed ground circuit, and there may be a situation where the ground circuit and the adhesive layer of the electromagnetic wave shielding film cannot fully contact each other. In this case, the problem of increased connection resistance will occur.
本發明是有鑑於上述問題而成，本發明之目的在提供一種附轉印膜之電磁波屏蔽膜，其於製造屏蔽印刷配線板時，可使電磁波屏蔽膜的接著劑層與印刷配線板表面之間不易產生間隙。 The present invention is made in view of the above problems. The purpose of the present invention is to provide an electromagnetic wave shielding film with a transfer film, which can prevent the gap between the adhesive layer of the electromagnetic wave shielding film and the surface of the printed wiring board from being easily generated when manufacturing a shielded printed wiring board.
即，本發明附轉印膜之電磁波屏蔽膜係由轉印膜及積層於上述轉印膜的電磁波屏蔽膜構成，其特徵在於：上述電磁波屏蔽膜包含：與上述轉印膜接觸的保護層、積層於上述保護層的屏蔽層、及積層於上述屏蔽層的接著劑層；上述轉印膜之楊氏模數為2.0GPa以上。 That is, the electromagnetic wave shielding film with transfer film of the present invention is composed of a transfer film and an electromagnetic wave shielding film laminated on the transfer film, and is characterized in that: the electromagnetic wave shielding film includes: a protective layer in contact with the transfer film, a shielding layer laminated on the protective layer, and an adhesive layer laminated on the shielding layer; the Young's modulus of the transfer film is greater than 2.0 GPa.
使用本發明附轉印膜之電磁波屏蔽膜來製造屏蔽印刷配線板時，會將附轉印膜之電磁波屏蔽膜的接 著劑層抵接並壓接於印刷配線板之表面。 When the electromagnetic wave shielding film with transfer film of the present invention is used to manufacture a shielded printed wiring board, the adhesive layer of the electromagnetic wave shielding film with transfer film is abutted and pressed against the surface of the printed wiring board.
此時，若轉印膜之楊氏模數為2.0GPa以上，則轉印膜夠硬，因此壓接壓力不易分散。 At this time, if the Young's modulus of the transfer film is above 2.0 GPa, the transfer film is hard enough, so the pressing pressure is not easy to disperse.
故，即便是在印刷配線板表面有高低差時，亦可牢牢地壓住電磁波屏蔽膜的接著劑層，接著劑層可充分地填埋高低差。 Therefore, even when there is a height difference on the surface of the printed wiring board, the adhesive layer of the electromagnetic wave shielding film can be firmly pressed, and the adhesive layer can fully fill the height difference.
於本發明附轉印膜之電磁波屏蔽膜中，上述接著劑層可具有導電性。 In the electromagnetic wave shielding film with transfer film of the present invention, the above-mentioned adhesive layer may have conductivity.
通常於印刷配線板的印刷電路也會設置接地電路。當本發明附轉印膜之電磁波屏蔽膜的接著劑層具有導電性時，藉由以使電磁波屏蔽膜的接著劑層與接地電路接觸之方式將電磁波屏蔽膜配置於印刷配線板，而使該等電連接。再者，藉由使電磁波屏蔽膜的接著劑層與外部接地電連接，可使接地電路與外部接地電連接。 Usually, a ground circuit is also provided in the printed circuit of a printed wiring board. When the adhesive layer of the electromagnetic wave shielding film with transfer film of the present invention has conductivity, the electromagnetic wave shielding film is arranged on the printed wiring board in such a way that the adhesive layer of the electromagnetic wave shielding film is in contact with the ground circuit, thereby making the electrical connection. Furthermore, by making the adhesive layer of the electromagnetic wave shielding film electrically connected to the external ground, the ground circuit can be electrically connected to the external ground.
另，使電磁波屏蔽膜的接著劑層與接地電路接觸時，會在位於接地電路上的覆蓋層形成露出接地電路的孔(亦即印刷配線板表面的高低差)。 In addition, when the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit, a hole exposing the ground circuit will be formed in the cover layer located on the ground circuit (i.e., a height difference on the surface of the printed wiring board).
若使用本發明附轉印膜之電磁波屏蔽膜，則可使電磁波屏蔽膜的接著劑層與接地電路充分地接觸，因此，可防止電磁波屏蔽膜的接著劑層與接地電路間之連接電阻上升。 If the electromagnetic wave shielding film with transfer film of the present invention is used, the adhesive layer of the electromagnetic wave shielding film can be fully in contact with the ground circuit, thereby preventing the connection resistance between the adhesive layer of the electromagnetic wave shielding film and the ground circuit from increasing.
於本發明附轉印膜之電磁波屏蔽膜中，上述屏蔽層可由金屬層構成。 In the electromagnetic wave shielding film with transfer film of the present invention, the shielding layer can be composed of a metal layer.
又，於本發明附轉印膜之電磁波屏蔽膜中，上述屏蔽 層可由導電性樹脂構成。 Furthermore, in the electromagnetic wave shielding film with transfer film of the present invention, the shielding layer can be composed of a conductive resin.
依此，於本發明附轉印膜之電磁波屏蔽膜中，只要能屏蔽電磁波，則屏蔽層之材料並無特殊限制。 Accordingly, in the electromagnetic wave shielding film with transfer film of the present invention, as long as it can shield electromagnetic waves, there is no special restriction on the material of the shielding layer.
另一本發明附轉印膜之電磁波屏蔽膜係由轉印膜及積層於上述轉印膜的電磁波屏蔽膜構成，其特徵在於：上述電磁波屏蔽膜包含：與上述轉印膜接觸的保護層、及積層於上述保護層且具導電性的接著劑層；上述轉印膜之楊氏模數為2.0GPa以上。 Another electromagnetic wave shielding film with transfer film of the present invention is composed of a transfer film and an electromagnetic wave shielding film laminated on the transfer film, and is characterized in that: the electromagnetic wave shielding film includes: a protective layer in contact with the transfer film, and a conductive adhesive layer laminated on the protective layer; the Young's modulus of the transfer film is above 2.0 GPa.
於本發明附轉印膜之電磁波屏蔽膜中，轉印膜之楊氏模數為2.0GPa以上。即，轉印膜夠硬。故，在將電磁波屏蔽膜壓接於印刷配線板時，壓力不易分散。 In the electromagnetic wave shielding film with transfer film of the present invention, the Young's modulus of the transfer film is above 2.0 GPa. That is, the transfer film is hard enough. Therefore, when the electromagnetic wave shielding film is pressed onto the printed wiring board, the pressure is not easily dispersed.
故，即便是在印刷配線板表面有高低差時，亦可牢牢地壓住電磁波屏蔽膜的接著劑層，接著劑層可充分地填埋高低差。 Therefore, even when there is a height difference on the surface of the printed wiring board, the adhesive layer of the electromagnetic wave shielding film can be firmly pressed, and the adhesive layer can fully fill the height difference.
另，於本發明附轉印膜之電磁波屏蔽膜中，具導電性之接著劑層具有電磁波屏蔽機能以及與印刷配線板之接著機能兩者。 In addition, in the electromagnetic wave shielding film with transfer film of the present invention, the conductive adhesive layer has both electromagnetic wave shielding function and bonding function with the printed wiring board.
又，使電磁波屏蔽膜的接著劑層與接地電路接觸時，會在位於接地電路上的覆蓋層形成露出接地電路的孔(亦即印刷配線板表面的高低差)。 Furthermore, when the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit, a hole exposing the ground circuit will be formed in the cover layer located on the ground circuit (i.e., a height difference on the surface of the printed wiring board).
若使用本發明附轉印膜之電磁波屏蔽膜，則可使電磁波屏蔽膜的接著劑層與接地電路充分地接觸，因此，可防止電磁波屏蔽膜的接著劑層與接地電路間之連接電阻上升。 If the electromagnetic wave shielding film with transfer film of the present invention is used, the adhesive layer of the electromagnetic wave shielding film can be fully in contact with the ground circuit, thereby preventing the connection resistance between the adhesive layer of the electromagnetic wave shielding film and the ground circuit from increasing.
本發明附轉印膜之電磁波屏蔽膜之製造方法特徵在於包含以下步驟：轉印膜準備步驟，準備楊氏模數為2.0GPa以上的轉印膜；及電磁波屏蔽膜形成步驟，於上述轉印膜上依序積層保護層、屏蔽層及接著劑層而形成電磁波屏蔽膜。 The manufacturing method of the electromagnetic wave shielding film with transfer film of the present invention is characterized in that it includes the following steps: a transfer film preparation step, preparing a transfer film with a Young's modulus of 2.0 GPa or more; and an electromagnetic wave shielding film formation step, sequentially laminating a protective layer, a shielding layer and an adhesive layer on the transfer film to form an electromagnetic wave shielding film.
又，另一本發明附轉印膜之電磁波屏蔽膜之製造方法特徵在於包含以下步驟：轉印膜準備步驟，準備楊氏模數為2.0GPa以上的轉印膜；及電磁波屏蔽膜形成步驟，於上述轉印膜上依序積層保護層、由導電性樹脂構成且具電磁波屏蔽機能的接著劑層而形成電磁波屏蔽膜。 In addition, another method for manufacturing an electromagnetic wave shielding film with a transfer film of the present invention is characterized in that it includes the following steps: a transfer film preparation step, preparing a transfer film with a Young's modulus of 2.0 GPa or more; and an electromagnetic wave shielding film formation step, sequentially laminating a protective layer and an adhesive layer composed of a conductive resin and having an electromagnetic wave shielding function on the above transfer film to form an electromagnetic wave shielding film.
利用此種方法，可製造上述本發明附轉印膜之電磁波屏蔽膜。 This method can be used to manufacture the electromagnetic wave shielding film with transfer film of the present invention.
本發明之屏蔽印刷配線板之製造方法特徵在於包含以下步驟：印刷配線板準備步驟，準備印刷配線板，該印刷配線板包含：基底膜、形成於上述基底膜上且含接地電路的印刷電路、及覆蓋上述印刷電路的覆蓋層；附轉印膜之電磁波屏蔽膜準備步驟，準備上述本發明附轉印膜之電磁波屏蔽膜；壓接步驟，將上述附轉印膜之電磁波屏蔽膜的接著劑層配置成與上述印刷配線板的上述覆蓋層接觸，並將上述附轉印膜之電磁波屏蔽膜壓接於上述印刷配線板；及剝離步驟，自上述附轉印膜之電磁波屏蔽膜剝離轉印膜； 又，與上述接著劑層接觸的上述覆蓋層之表面有高低差。 The manufacturing method of the shielded printed wiring board of the present invention is characterized in that it includes the following steps: a printed wiring board preparation step, preparing a printed wiring board, the printed wiring board including: a base film, a printed circuit formed on the above-mentioned base film and containing a ground circuit, and a covering layer covering the above-mentioned printed circuit; an electromagnetic wave shielding film preparation step with a transfer film, preparing the above-mentioned electromagnetic wave shielding film with a transfer film of the present invention a shielding film; a pressing step of arranging the adhesive layer of the electromagnetic wave shielding film with transfer film to contact the covering layer of the printed wiring board, and pressing the electromagnetic wave shielding film with transfer film to the printed wiring board; and a peeling step of peeling the transfer film from the electromagnetic wave shielding film with transfer film; In addition, the surface of the covering layer in contact with the adhesive layer has a height difference.
如上述，本發明附轉印膜之電磁波屏蔽膜中的轉印膜之楊氏模數為2.0GPa以上且夠硬。 As mentioned above, the Young's modulus of the transfer film in the electromagnetic wave shielding film with transfer film of the present invention is above 2.0 GPa and is hard enough.
故，即便是在印刷配線板的覆蓋層表面有高低差時，亦可牢牢地壓住電磁波屏蔽膜的接著劑層，接著劑層可充分地填埋高低差。 Therefore, even when there is a height difference on the surface of the cover layer of the printed wiring board, the adhesive layer of the electromagnetic wave shielding film can be firmly pressed, and the adhesive layer can fully fill the height difference.
於本發明之屏蔽印刷配線板之製造方法中，上述高低差宜為露出上述接地電路的孔，且上述接著劑層宜具有導電性。 In the manufacturing method of the shielded printed wiring board of the present invention, the height difference is preferably a hole that exposes the grounding circuit, and the adhesive layer is preferably conductive.
如上述，本發明之屏蔽印刷配線板之製造方法中接著劑層可充分地填埋高低差。 As described above, in the manufacturing method of the shielded printed wiring board of the present invention, the adhesive layer can fully fill the height difference.
尤其是當高低差為露出接地電路的孔且接著劑層具有導電性時，可使接著劑層充分地與接地電路接觸。 Especially when the height difference is a hole that exposes the ground circuit and the adhesive layer is conductive, the adhesive layer can be fully in contact with the ground circuit.
故，可抑制連接電阻上升。 Therefore, the increase in connection resistance can be suppressed.
10、110、210:附轉印膜之電磁波屏蔽膜 10, 110, 210: Electromagnetic wave shielding film with transfer film
20、120、220:轉印膜 20, 120, 220: transfer film
30、130、230:電磁波屏蔽膜 30, 130, 230: electromagnetic wave shielding film
31、131、231:保護層 31, 131, 231: Protective layer
32、232:屏蔽層 32, 232: Shielding layer
33、133、233:接著劑層 33, 133, 233: Next is the agent layer
50、250:印刷配線板 50, 250: Printed wiring board
51、251:基底膜 51, 251: basement membrane
52、252:印刷電路 52, 252: Printed circuit
52a:接地電路 52a: Ground circuit
53、253:覆蓋層 53, 253: Covering layer
54、254:孔 54, 254: hole
60:屏蔽印刷配線板 60: Shielded printed wiring board
270:電阻計 270: Resistor
圖1為截面圖，其示意顯示本發明第1實施形態之附轉印膜之電磁波屏蔽膜之一例。 FIG1 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding film with a transfer film in the first embodiment of the present invention.
圖2為步驟圖，其示意顯示本發明第1實施形態之屏蔽印刷配線板之製造方法中印刷配線板準備步驟之一例。 FIG2 is a step diagram, which schematically shows an example of a printed wiring board preparation step in the manufacturing method of the shielded printed wiring board of the first embodiment of the present invention.
圖3為步驟圖，其示意顯示本發明第1實施形態之屏蔽印刷配線板之製造方法中附轉印膜之電磁波屏蔽膜準備步驟之一例。 FIG3 is a step diagram, which schematically shows an example of the preparation step of the electromagnetic wave shielding film with transfer film in the manufacturing method of the shielded printed wiring board of the first embodiment of the present invention.
圖4為步驟圖，其示意顯示本發明第1實施形態之屏蔽 印刷配線板之製造方法中壓接步驟之一例。 FIG4 is a step diagram, which schematically shows an example of a crimping step in the manufacturing method of the shielded printed wiring board of the first embodiment of the present invention.
圖5為步驟圖，其示意顯示本發明第1實施形態之屏蔽印刷配線板之製造方法中剝離步驟之一例。 FIG5 is a step diagram, which schematically shows an example of a stripping step in the manufacturing method of the shielded printed wiring board of the first embodiment of the present invention.
圖6為截面圖，其示意顯示本發明第2實施形態之附轉印膜之電磁波屏蔽膜之一例。 FIG6 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding film with a transfer film in the second embodiment of the present invention.
圖7(a)及圖7(b)為步驟圖，其示意顯示實施例1之評價用基板之製作方法。 Figure 7(a) and Figure 7(b) are step diagrams, which schematically show the method for making the evaluation substrate of Example 1.
圖8為示意圖，其示意顯示連接電阻試驗中實施例1-1之評價用基板之連接電阻測定方法。 FIG8 is a schematic diagram showing a method for measuring the connection resistance of the evaluation substrate of Example 1-1 in the connection resistance test.
用以實施發明之形態 The form used to implement the invention
以下，具體說明本發明附轉印膜之電磁波屏蔽膜。然而，本發明並不限於以下實施形態，在未變更本發明要旨的範圍內，可適當地變更而應用。 The electromagnetic wave shielding film with transfer film of the present invention is described in detail below. However, the present invention is not limited to the following implementation forms, and can be appropriately modified and applied within the scope of not changing the gist of the present invention.
(第1實施形態) (First implementation form)
利用圖式，詳述本發明第1實施形態之附轉印膜之電磁波屏蔽膜。 The electromagnetic wave shielding film with transfer film of the first embodiment of the present invention is described in detail using drawings.
圖1為截面圖，其示意顯示本發明第1實施形態之附轉印膜之電磁波屏蔽膜之一例。 FIG1 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding film with a transfer film according to the first embodiment of the present invention.
如圖1所示，附轉印膜之電磁波屏蔽膜10由轉印膜20及積層於轉印膜20的電磁波屏蔽膜30構成。 As shown in FIG. 1 , the electromagnetic wave shielding film 10 with a transfer film is composed of a transfer film 20 and an electromagnetic wave shielding film 30 laminated on the transfer film 20 .
又，電磁波屏蔽膜30包含：與轉印膜20接觸的保護層31、積層於保護層31的屏蔽層32、及積層於屏蔽層32的接著劑層33。 Furthermore, the electromagnetic wave shielding film 30 includes: a protective layer 31 in contact with the transfer film 20, a shielding layer 32 laminated on the protective layer 31, and an adhesive layer 33 laminated on the shielding layer 32.
又，轉印膜20之楊氏模數為2.0GPa以上。 In addition, the Young's modulus of the transfer film 20 is greater than 2.0 GPa.
另，轉印膜20之楊氏模數之下限宜為2.5GPa，且以2.7GPa更佳。 In addition, the lower limit of the Young's modulus of the transfer film 20 is preferably 2.5 GPa, and more preferably 2.7 GPa.
又，轉印膜20之楊氏模數之上限宜為5.0GPa，且以4.5GPa更佳。 In addition, the upper limit of the Young's modulus of the transfer film 20 is preferably 5.0 GPa, and more preferably 4.5 GPa.
若轉印膜之楊氏模數大於5.0GPa，在將附轉印膜之電磁波屏蔽膜黏貼於印刷配線板時，高低差附隨性容易降低。 If the Young's modulus of the transfer film is greater than 5.0 GPa, the height difference conformity is likely to decrease when the electromagnetic wave shielding film with the transfer film is attached to the printed wiring board.
附轉印膜之電磁波屏蔽膜10係黏貼於印刷配線板用來製造屏蔽印刷配線板。 The electromagnetic wave shielding film 10 with transfer film is pasted on the printed wiring board to manufacture the shielded printed wiring board.
使用附轉印膜之電磁波屏蔽膜10來製造屏蔽印刷配線板時，會將附轉印膜之電磁波屏蔽膜10的接著劑層33抵接並壓接於印刷配線板之表面。 When the electromagnetic wave shielding film 10 with transfer film is used to manufacture a shielded printed wiring board, the adhesive layer 33 of the electromagnetic wave shielding film 10 with transfer film is abutted and pressed against the surface of the printed wiring board.
此時，若轉印膜20之楊氏模數為2.0GPa以上，則由於轉印膜20夠硬，因此壓接壓力不易分散。 At this time, if the Young's modulus of the transfer film 20 is above 2.0 GPa, the transfer film 20 is hard enough, so the pressing pressure is not easy to disperse.
故，即便是在印刷配線板表面有高低差時，亦可牢牢地壓住電磁波屏蔽膜30的接著劑層33，接著劑層33可充分地填埋高低差。 Therefore, even when there is a height difference on the surface of the printed wiring board, the adhesive layer 33 of the electromagnetic wave shielding film 30 can be firmly pressed, and the adhesive layer 33 can fully fill the height difference.
其次，說明形成附轉印膜之電磁波屏蔽膜10的各層之構造。 Next, the structure of each layer forming the electromagnetic wave shielding film 10 with transfer film will be described.
(轉印膜) (Transfer film)
轉印膜之材料只要是轉印膜之楊氏模數可成為2.0GPa以上，則無特殊限制，例如可列舉：聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚氟乙烯、聚二氟亞乙烯、硬質聚氯乙烯、聚二氯亞乙烯、耐綸、聚醯亞胺、聚苯乙 烯、聚乙烯醇、乙烯-乙烯醇共聚物、聚碳酸酯、聚丙烯腈、聚丁烯、軟質聚氯乙烯、聚二氟亞乙烯、聚乙烯、聚丙烯、聚胺甲酸乙酯、乙烯醋酸乙烯酯共聚物、聚醋酸乙烯酯等塑膠片等、玻璃紙、道林紙、牛皮紙、塗料紙等紙類、各種不織布、合成紙、金屬層或組合有該等的複合膜等。 The material of the transfer film is not particularly limited as long as the Young's modulus of the transfer film can be above 2.0 GPa. Examples thereof include: polyethylene terephthalate, polyethylene naphthalate, polyvinyl fluoride, polyvinylidene fluoride, rigid polyvinyl chloride, polyvinylidene chloride, nylon, polyimide, polystyrene, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polycarbonate, polyacrylonitrile, polybutylene, soft polyvinyl chloride, polyvinylidene fluoride, polyethylene, polypropylene, polyurethane, ethylene-vinyl acetate copolymer, polyvinyl acetate and other plastic sheets, cellophane, woodfree paper, kraft paper, coated paper and other papers, various non-woven fabrics, synthetic paper, metal layers or composite films in combination with the above.
又，轉印膜亦可為熱硬化性樹脂或熱塑性樹脂，惟以熱塑性樹脂為佳。若為熱塑性樹脂，則附轉印膜之電磁波屏蔽膜容易附隨於印刷配線板的高低差。 In addition, the transfer film can also be a thermosetting resin or a thermoplastic resin, but thermoplastic resin is preferred. If it is a thermoplastic resin, the electromagnetic wave shielding film with the transfer film can easily adhere to the height difference of the printed wiring board.
轉印膜亦可為單面或雙面經脫模處理的膜，脫模處理方法可舉如：將脫模劑塗佈於膜之單面或雙面，或是以物理方式進行消光處理的方法。 The transfer film can also be a film with a release treatment on one or both sides. The release treatment method can be, for example, applying a release agent to one or both sides of the film, or performing a matte treatment in a physical manner.
又，當轉印膜由塑膠片構成時，為了調整楊氏模數，亦可含有氧化鈦或二氧化矽等無機粒子，或是具有核殼結構之有機物粒子等。 Furthermore, when the transfer film is made of a plastic sheet, in order to adjust the Young's modulus, it may also contain inorganic particles such as titanium oxide or silicon dioxide, or organic particles with a core-shell structure.
轉印膜之厚度宜為10~150μm，且以20~100μm更佳，尤其宜為40~60μm。 The thickness of the transfer film should be 10~150μm, preferably 20~100μm, and especially 40~60μm.
若轉印膜之厚度小於10μm，則於製造屏蔽印刷配線板時，轉印膜會破裂而不易自電磁波屏蔽膜剝離。 If the thickness of the transfer film is less than 10μm, the transfer film will break during the manufacture of the shielded printed wiring board and will not be easily separated from the electromagnetic wave shielding film.
若轉印膜之厚度大於150μm，則不易進行處理。 If the thickness of the transfer film is greater than 150μm, it will be difficult to process.
於轉印膜與保護層間亦可設有轉印膜用黏著劑層。在此情形下，轉印膜會形成由轉印膜用黏著劑層貼合的狀態。轉印膜必須在使用電磁波屏蔽膜時能輕易地自電磁波屏蔽膜剝離，轉印膜用黏著劑層宜作成在剝離轉印膜時殘留於轉印膜側。 An adhesive layer for the transfer film may also be provided between the transfer film and the protective layer. In this case, the transfer film will be in a state of being adhered by the adhesive layer for the transfer film. The transfer film must be easily peeled off from the electromagnetic wave shielding film when the electromagnetic wave shielding film is used, and the adhesive layer for the transfer film should preferably be made to remain on the side of the transfer film when the transfer film is peeled off.
(保護層) (Protective layer)
保護層只要是具有絕緣性且可保護接著劑層及屏蔽層，則無特殊限制，例如宜由熱塑性樹脂組成物、熱硬化性樹脂組成物、活性能量線硬化性組成物等構成。 There are no special restrictions on the protective layer as long as it has insulating properties and can protect the adhesive layer and the shielding layer. For example, it is preferably composed of a thermoplastic resin composition, a thermosetting resin composition, an active energy ray-hardening composition, etc.
上述熱塑性樹脂組成物並無特殊限制，可舉例如：苯乙烯系樹脂組成物、醋酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、丙烯酸系樹脂組成物等。 The above-mentioned thermoplastic resin composition is not particularly limited, and examples thereof include: styrene resin composition, vinyl acetate resin composition, polyester resin composition, polyethylene resin composition, polypropylene resin composition, imide resin composition, acrylic resin composition, etc.
上述熱硬化性樹脂組成物並無特殊限制，可舉例如：選自於由環氧系樹脂組成物、胺甲酸乙酯系樹脂組成物、胺甲酸乙酯脲系樹脂組成物、苯乙烯系樹脂組成物、酚系樹脂組成物、三聚氰胺系樹脂組成物、丙烯酸系樹脂組成物及醇酸系樹脂組成物所構成群組中之至少1種樹脂組成物。 The thermosetting resin composition is not particularly limited, and may be, for example, at least one resin composition selected from the group consisting of epoxy resin compositions, urethane resin compositions, urethane-urea resin compositions, styrene resin compositions, phenolic resin compositions, melamine resin compositions, acrylic resin compositions, and alkyd resin compositions.
上述活性能量線硬化性組成物並無特殊限制，可舉例如：分子中具有至少2個(甲基)丙烯醯氧基的聚合性化合物等。 The above-mentioned active energy ray-curable composition is not particularly limited, and examples thereof include: a polymerizable compound having at least two (meth)acryloyloxy groups in the molecule, etc.
保護層可由單獨1種材料構成，亦可由2種以上材料構成。 The protective layer can be composed of a single material or two or more materials.
於保護層中，視需要亦可含有硬化促進劑、賦黏劑、抗氧化劑、顏料、染料、塑化劑、紫外線吸收劑、消泡劑、調平劑、填充劑、阻燃劑、黏度調節劑、抗結塊劑等。 The protective layer may also contain curing accelerators, adhesives, antioxidants, pigments, dyes, plasticizers, UV absorbers, defoamers, levelers, fillers, flame retardants, viscosity regulators, anti-caking agents, etc. as needed.
保護層之厚度並無特殊限制，可視需要適當 地設定，宜為1~15μm，且以3~10μm更佳。 There is no special restriction on the thickness of the protective layer, which can be appropriately set as needed. It is preferably 1~15μm, and preferably 3~10μm.
若保護層之厚度小於1μm，會因為過薄而不易充分保護接著劑層及屏蔽層。 If the thickness of the protective layer is less than 1μm, it will be too thin to fully protect the adhesive layer and the shielding layer.
若保護層之厚度大於15μm，會因為過厚以致電磁波屏蔽膜不易彎折，且保護層本身容易破損。故，不易應用在要求耐彎折性的構件中。 If the thickness of the protective layer is greater than 15μm, the electromagnetic wave shielding film will not be easily bent due to being too thick, and the protective layer itself will be easily damaged. Therefore, it is not easy to be used in components that require bending resistance.
於保護層與屏蔽層間亦可形成有錨固塗佈層。 An anchored coating layer may also be formed between the protective layer and the shielding layer.
錨固塗佈層之材料可舉例如：胺甲酸乙酯樹脂、丙烯酸樹脂、以胺甲酸乙酯樹脂為殼且以丙烯酸樹脂為核的核-殼型複合樹脂、環氧樹脂、醯亞胺樹脂、醯胺樹脂、三聚氰胺樹脂、酚樹脂、脲甲醛樹脂、使苯酚等封端劑與聚異氰酸酯反應而得的封端異氰酸酯、聚乙烯醇、聚乙烯氫吡咯銅等。 Materials for anchor coating layers include, for example, urethane resin, acrylic resin, core-shell composite resin with urethane resin as shell and acrylic resin as core, epoxy resin, imide resin, amide resin, melamine resin, phenol resin, urea formaldehyde resin, blocked isocyanate obtained by reacting blocking agents such as phenol with polyisocyanate, polyvinyl alcohol, polyvinyl hydropyrrole copper, etc.
(屏蔽層) (Shielding layer)
圖1之附轉印膜之電磁波屏蔽膜10中，屏蔽層32可由金屬層構成，亦可由導電性樹脂構成。 In the electromagnetic wave shielding film 10 with transfer film in FIG1 , the shielding layer 32 can be composed of a metal layer or a conductive resin.
就附轉印膜之電磁波屏蔽膜10而言，只要能屏蔽電磁波，則屏蔽層之材料並無特殊限制。 As for the electromagnetic wave shielding film 10 with transfer film, as long as it can shield electromagnetic waves, there is no special restriction on the material of the shielding layer.
當屏蔽層由金屬層構成時，金屬層可包含由金、銀、銅、鋁、鎳、錫、鈀、鉻、鈦、鋅等材料構成的層體，理想的是包含銅層。 When the shielding layer is composed of a metal layer, the metal layer may include a layer composed of materials such as gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, zinc, etc., and ideally includes a copper layer.
從導電性及經濟性觀點來看，銅對於屏蔽層而言屬於適當之材料。 From the perspective of conductivity and economy, copper is a suitable material for the shielding layer.
另，屏蔽層亦可包含由上述金屬之合金構成的層體。 In addition, the shielding layer may also include a layer composed of an alloy of the above-mentioned metals.
又，屏蔽層亦可使用金屬箔，亦可為利用濺鍍、無電鍍敷或電鍍等方法形成的金屬膜。 In addition, the shielding layer may also be made of metal foil, or a metal film formed by sputtering, electroless plating, or electroplating.
當屏蔽層由導電性樹脂構成時，屏蔽層可由導電性粒子與樹脂構成。 When the shielding layer is composed of a conductive resin, the shielding layer may be composed of conductive particles and the resin.
導電性粒子並無特殊限制，可為金屬微粒子、碳奈米管、碳纖維、金屬纖維等。 There is no particular limitation on the conductive particles, and they can be metal microparticles, carbon nanotubes, carbon fibers, metal fibers, etc.
當導電性粒子為金屬微粒子時，金屬微粒子並無特殊限制，可為銀粉、銅粉、鎳粉、焊粉、鋁粉、對銅粉施以鍍銀的銀包銅粉、以金屬被覆高分子微粒子或玻璃珠等的微粒子等。 When the conductive particles are metal particles, there are no special restrictions on the metal particles, and they can be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder with silver plating, metal-coated polymer particles or glass beads, etc.
於該等之中，從經濟性觀點來看，宜為可便宜取得的銅粉或銀包銅粉。 Among these, from the economic point of view, copper powder or silver-clad copper powder, which can be obtained cheaply, is preferred.
導電性粒子之平均粒徑並無特殊限制，宜為0.5~15.0μm。若導電性粒子之平均粒徑為0.5μm以上，則導電性樹脂之導電性會變得良好。若導電性粒子之平均粒徑為15.0μm以下，則可使導電性樹脂薄化。 The average particle size of the conductive particles is not particularly limited, and is preferably 0.5 to 15.0 μm. If the average particle size of the conductive particles is greater than 0.5 μm, the conductivity of the conductive resin will be improved. If the average particle size of the conductive particles is less than 15.0 μm, the conductive resin can be thinned.
導電性粒子之形狀並無特殊限制，可自球狀、扁平狀、鱗片狀、枝晶狀、棒狀、纖維狀等適當選擇。 The shape of the conductive particles is not particularly limited and can be appropriately selected from spherical, flat, scaly, dendrite, rod, fiber, etc.
導電性粒子之摻合量並無特殊限制，宜為15~80質量%，且以15~60質量%更佳。 There is no particular limit on the amount of conductive particles mixed, but it is preferably 15-80% by mass, and more preferably 15-60% by mass.
樹脂並無特殊限制，可舉例如：苯乙烯系樹脂組成物、醋酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、 聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、醯胺系樹脂組成物、丙烯酸系樹脂組成物等熱塑性樹脂組成物；及酚系樹脂組成物、環氧系樹脂組成物、胺甲酸乙酯系樹脂組成物、三聚氰胺系樹脂組成物、醇酸系樹脂組成物等熱硬化性樹脂組成物等。 The resin is not particularly limited, and examples thereof include thermoplastic resin compositions such as styrene resin compositions, vinyl acetate resin compositions, polyester resin compositions, polyethylene resin compositions, polypropylene resin compositions, imide resin compositions, amide resin compositions, and acrylic resin compositions; and thermosetting resin compositions such as phenol resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, and alkyd resin compositions.
(接著劑層) (followed by the agent layer)
接著劑層可由熱硬化性樹脂構成，亦可由熱塑性樹脂構成。 The next layer can be made of either a thermosetting resin or a thermoplastic resin.
熱硬化性樹脂例如可列舉：酚系樹脂、環氧系樹脂、胺甲酸乙酯系樹脂、三聚氰胺系樹脂、聚醯胺系樹脂及醇酸系樹脂等。 Examples of thermosetting resins include phenolic resins, epoxy resins, urethane resins, melamine resins, polyamide resins, and alkyd resins.
又，熱塑性樹脂例如可列舉：苯乙烯系樹脂、醋酸乙烯酯系樹脂、聚酯系樹脂、聚乙烯系樹脂、聚丙烯系樹脂、醯亞胺系樹脂及丙烯酸系樹脂。 In addition, examples of thermoplastic resins include styrene resins, vinyl acetate resins, polyester resins, polyethylene resins, polypropylene resins, imide resins, and acrylic resins.
又，環氧系樹脂更宜為醯胺改質環氧樹脂。 Furthermore, the epoxy resin is more preferably an amide-modified epoxy resin.
該等樹脂適合作為構成接著劑層的樹脂。 Such resins are suitable as resins constituting the follower layer.
接著劑層之厚度並無特殊限制，宜為1~50μm，且以3~30μm更佳。 There is no special restriction on the thickness of the adhesive layer, which is preferably 1~50μm, and preferably 3~30μm.
若接著劑層之厚度小於1μm，則構成接著劑層的樹脂量少，因此不易獲得充分之接著性能。並且，會變得容易破損。 If the thickness of the adhesive layer is less than 1μm, the amount of resin constituting the adhesive layer is small, so it is difficult to obtain sufficient bonding performance. In addition, it will become easy to be damaged.
若接著劑層之厚度大於50μm，則全體會變厚，容易失去柔軟性。 If the thickness of the adhesive layer is greater than 50μm, the entire layer will become thicker and will easily lose its softness.
接著劑層亦可具有導電性。 The subsequent agent layer may also be conductive.
通常於印刷配線板的印刷電路也會設置接地電路。當本發明附轉印膜之電磁波屏蔽膜的接著劑層具有導電性時，藉由以使電磁波屏蔽膜的接著劑層與接地電路接觸之方式將電磁波屏蔽膜配置於印刷配線板，而使該等電連接。再者，藉由使電磁波屏蔽膜的接著劑層與外部接地電連接，可使接地電路與外部接地電連接。 Usually, a ground circuit is also provided in the printed circuit of a printed wiring board. When the adhesive layer of the electromagnetic wave shielding film with transfer film of the present invention has conductivity, the electromagnetic wave shielding film is arranged on the printed wiring board in such a way that the adhesive layer of the electromagnetic wave shielding film is in contact with the ground circuit, thereby making the electrical connection. Furthermore, by making the adhesive layer of the electromagnetic wave shielding film electrically connected to the external ground, the ground circuit can be electrically connected to the external ground.
另，使電磁波屏蔽膜的接著劑層與接地電路接觸時，會在位於接地電路上的覆蓋層形成露出接地電路的孔(亦即印刷配線板表面的高低差)。 In addition, when the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit, a hole exposing the ground circuit will be formed in the cover layer located on the ground circuit (i.e., a height difference on the surface of the printed wiring board).
若使用本發明附轉印膜之電磁波屏蔽膜，則可使電磁波屏蔽膜的接著劑層與接地電路充分地接觸，因此，可防止電磁波屏蔽膜的接著劑層與接地電路間之連接電阻上升。 If the electromagnetic wave shielding film with transfer film of the present invention is used, the adhesive layer of the electromagnetic wave shielding film can be fully in contact with the ground circuit, thereby preventing the connection resistance between the adhesive layer of the electromagnetic wave shielding film and the ground circuit from increasing.
當接著劑層具有導電性時，接著劑層可由導電性粒子與樹脂構成。 When the adhesive layer is conductive, the adhesive layer may be composed of conductive particles and resin.
導電性粒子並無特殊限制，可為金屬微粒子、碳奈米管、碳纖維、金屬纖維等。 There is no particular limitation on the conductive particles, and they can be metal microparticles, carbon nanotubes, carbon fibers, metal fibers, etc.
當導電性粒子為金屬微粒子時，金屬微粒子並無特殊限制，可為銀粉、銅粉、鎳粉、焊粉、鋁粉、對銅粉施以鍍銀的銀包銅粉、以金屬被覆高分子微粒子或玻璃珠等的微粒子等。 When the conductive particles are metal particles, there are no special restrictions on the metal particles, and they can be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder with silver plating, metal-coated polymer particles or glass beads, etc.
於該等之中，從經濟性觀點來看，宜為可便宜取得的銅粉或銀包銅粉。 Among these, from the economic point of view, copper powder or silver-clad copper powder, which can be obtained cheaply, is preferred.
導電性粒子之平均粒徑並無特殊限制，宜為 0.5~15.0μm。若導電性粒子之平均粒徑為0.5μm以上，則導電性接著劑層之導電性會變得良好。若導電性粒子之平均粒徑為15.0μm以下，則可使導電性接著劑層薄化。 The average particle size of the conductive particles is not particularly limited, and is preferably 0.5 to 15.0 μm. If the average particle size of the conductive particles is 0.5 μm or more, the conductivity of the conductive adhesive layer will be good. If the average particle size of the conductive particles is 15.0 μm or less, the conductive adhesive layer can be thinned.
導電性粒子之形狀並無特殊限制，可自球狀、扁平狀、鱗片狀、枝晶狀、棒狀、纖維狀等適當選擇。 The shape of the conductive particles is not particularly limited and can be appropriately selected from spherical, flat, scaly, dendrite, rod, fiber, etc.
導電性粒子之摻合量並無特殊限制，宜為15~80質量%，且以15~60質量%更佳。 There is no particular limit on the amount of conductive particles mixed, but it is preferably 15-80% by mass, and more preferably 15-60% by mass.
樹脂並無特殊限制，可舉例如：苯乙烯系樹脂組成物、醋酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、醯胺系樹脂組成物、丙烯酸系樹脂組成物等熱塑性樹脂組成物；及酚系樹脂組成物、環氧系樹脂組成物、胺甲酸乙酯系樹脂組成物、三聚氰胺系樹脂組成物、醇酸系樹脂組成物等熱硬化性樹脂組成物等。 The resin is not particularly limited, and examples thereof include thermoplastic resin compositions such as styrene resin compositions, vinyl acetate resin compositions, polyester resin compositions, polyethylene resin compositions, polypropylene resin compositions, imide resin compositions, amide resin compositions, and acrylic resin compositions; and thermosetting resin compositions such as phenol resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, and alkyd resin compositions.
又，當接著劑層具有導電性時，宜具有各向異性導電性。 Furthermore, when the adhesive layer has conductivity, it is preferred that it has anisotropic conductivity.
若接著劑層具有各向異性導電性，則相較於具有各向同性導電性時，會更加提升利用印刷配線板之印刷電路傳輸的高頻信號傳輸特性。 If the adhesive layer has anisotropic conductivity, it will further improve the high-frequency signal transmission characteristics of the printed circuit using the printed wiring board compared to when it has isotropic conductivity.
其次，說明本發明第1實施形態之附轉印膜之電磁波屏蔽膜之製造方法。 Next, the method for manufacturing the electromagnetic wave shielding film with transfer film of the first embodiment of the present invention is described.
本發明附轉印膜之電磁波屏蔽膜之製造方法包含：(1)轉印膜準備步驟；及(2)電磁波屏蔽膜形成步驟。 The method for manufacturing an electromagnetic wave shielding film with a transfer film of the present invention comprises: (1) a transfer film preparation step; and (2) an electromagnetic wave shielding film formation step.
(1)轉印膜準備步驟 (1) Transfer membrane preparation steps
於本步驟中，準備楊氏模數為2.0GPa以上的轉印膜。 In this step, a transfer film with a Young's modulus of 2.0 GPa or more is prepared.
轉印膜之材料等既已說明，故而省略此處的說明。 The materials of the transfer film have already been explained, so the explanation here is omitted.
(2)電磁波屏蔽膜形成步驟 (2) Electromagnetic wave shielding film formation step
其次，於轉印膜上依序積層保護層、屏蔽層及接著劑層而形成電磁波屏蔽膜。 Secondly, a protective layer, a shielding layer and an adhesive layer are sequentially laminated on the transfer film to form an electromagnetic wave shielding film.
將該等積層的方法可使用與以往製造電磁波屏蔽膜之方法相同的方法。 The method of laminating the above-mentioned layers can be the same as the method of manufacturing electromagnetic wave shielding films in the past.
舉例言之，可於轉印膜上形成保護層及屏蔽層，且於另外的剝離膜上形成接著劑層，藉由將該等貼合，製作出附轉印膜之電磁波屏蔽膜。 For example, a protective layer and a shielding layer can be formed on a transfer film, and an adhesive layer can be formed on another release film, and by bonding them together, an electromagnetic wave shielding film with a transfer film can be produced.
另，保護層、屏蔽層及接著劑層之材料等既已說明，故而省略此處的說明。 In addition, the materials of the protective layer, shielding layer, and adhesive layer have already been explained, so the explanation here is omitted.
利用以上步驟，可製造本發明第1實施形態之附轉印膜之電磁波屏蔽膜。 By using the above steps, the electromagnetic wave shielding film with transfer film of the first embodiment of the present invention can be manufactured.
其次，說明使用本發明第1實施形態之附轉印膜之電磁波屏蔽膜的屏蔽印刷配線板之製造方法。 Next, a method for manufacturing a shielded printed wiring board using an electromagnetic wave shielding film with a transfer film according to the first embodiment of the present invention is described.
本發明第1實施形態之屏蔽印刷配線板之製造方法包含：(1)印刷配線板準備步驟；(2)附轉印膜之電磁波屏蔽膜準備步驟；(3)壓接步驟；及(4)剝離步驟。 The manufacturing method of the shielded printed wiring board of the first embodiment of the present invention comprises: (1) a printed wiring board preparation step; (2) a preparation step of an electromagnetic wave shielding film with a transfer film; (3) a crimping step; and (4) a peeling step.
以下，利用圖式，詳述該等各步驟。 Below, each of these steps is described in detail using diagrams.
圖2為步驟圖，其示意顯示本發明第1實施形態之屏蔽印刷配線板之製造方法中印刷配線板準備步驟之一例。 FIG2 is a step diagram, which schematically shows an example of a printed wiring board preparation step in the manufacturing method of the shielded printed wiring board of the first embodiment of the present invention.
圖3為步驟圖，其示意顯示本發明第1實施形態之屏蔽印刷配線板之製造方法中附轉印膜之電磁波屏蔽膜準備步 驟之一例。 FIG3 is a step diagram, which schematically shows an example of the preparation step of the electromagnetic wave shielding film with transfer film in the manufacturing method of the shielded printed wiring board of the first embodiment of the present invention.
圖4為步驟圖，其示意顯示本發明第1實施形態之屏蔽印刷配線板之製造方法中壓接步驟之一例。 FIG4 is a step diagram, which schematically shows an example of a crimping step in the manufacturing method of the shielded printed wiring board of the first embodiment of the present invention.
圖5為步驟圖，其示意顯示本發明第1實施形態之屏蔽印刷配線板之製造方法中剝離步驟之一例。 FIG5 is a step diagram, which schematically shows an example of a stripping step in the manufacturing method of the shielded printed wiring board of the first embodiment of the present invention.
(1)印刷配線板準備步驟 (1) Printed wiring board preparation steps
首先，如圖2所示，準備印刷配線板50，該印刷配線板50包含：基底膜51、形成於基底膜51上且含接地電路52a的印刷電路52、及覆蓋印刷電路52的覆蓋層53。 First, as shown in FIG. 2 , a printed wiring board 50 is prepared, which includes: a base film 51, a printed circuit 52 formed on the base film 51 and including a ground circuit 52a, and a cover layer 53 covering the printed circuit 52.
於印刷配線板50中，在覆蓋層53上形成有露出接地電路52a的孔54，孔54會形成高低差。 In the printed wiring board 50, a hole 54 is formed on the cover layer 53 to expose the ground circuit 52a, and the hole 54 forms a height difference.
基底膜51、印刷電路52及覆蓋層53可與習知印刷配線板中所使用者相同。 The base film 51, printed circuit 52 and cover layer 53 may be the same as those used in conventional printed wiring boards.
(2)附轉印膜之電磁波屏蔽膜準備步驟 (2) Preparation steps for electromagnetic wave shielding film with transfer film
其次，如圖3所示，準備上述本發明第1實施形態之附轉印膜之電磁波屏蔽膜10。 Next, as shown in FIG3 , prepare the electromagnetic wave shielding film 10 with transfer film of the first embodiment of the present invention.
附轉印膜之電磁波屏蔽膜10由轉印膜20及積層於轉印膜20的電磁波屏蔽膜30構成。 The electromagnetic wave shielding film 10 with transfer film is composed of a transfer film 20 and an electromagnetic wave shielding film 30 laminated on the transfer film 20.
又，電磁波屏蔽膜30包含：與轉印膜20接觸的保護層31、積層於保護層31的屏蔽層32、及積層於屏蔽層32的接著劑層33。 Furthermore, the electromagnetic wave shielding film 30 includes: a protective layer 31 in contact with the transfer film 20, a shielding layer 32 laminated on the protective layer 31, and an adhesive layer 33 laminated on the shielding layer 32.
又，接著劑層33具有導電性。 Furthermore, the adhesive layer 33 has electrical conductivity.
(3)壓接步驟 (3) Pressing step
其次，如圖4所示，將附轉印膜之電磁波屏蔽膜10的 接著劑層33配置成與印刷配線板50的覆蓋層53接觸，並將附轉印膜之電磁波屏蔽膜10壓接於印刷配線板50。 Next, as shown in FIG. 4 , the adhesive layer 33 of the electromagnetic wave shielding film 10 with a transfer film is arranged to contact the covering layer 53 of the printed wiring board 50, and the electromagnetic wave shielding film 10 with a transfer film is pressed onto the printed wiring board 50.
此時，由於接著劑層33具有可撓性，因此會填埋孔54。 At this time, since the adhesive layer 33 is flexible, it will fill the hole 54.
轉印膜20之楊氏模數為2.0GPa以上，因此，在將電磁波屏蔽膜30壓接於印刷配線板50時，壓力不易分散。 The Young's modulus of the transfer film 20 is greater than 2.0 GPa, so when the electromagnetic wave shielding film 30 is pressed onto the printed wiring board 50, the pressure is not easily dispersed.
如此一來，便可牢牢地壓住電磁波屏蔽膜30的接著劑層33，接著劑層33可充分地填埋孔54。 In this way, the adhesive layer 33 of the electromagnetic wave shielding film 30 can be firmly pressed, and the adhesive layer 33 can fully fill the hole 54.
於是，接著劑層33與接地電路52a可充分地接觸。 Therefore, the agent layer 33 and the ground circuit 52a can be fully in contact.
又，接著劑層33具有導電性，因此，接地電路52a與接著劑層33可形成電連接。 In addition, the adhesive layer 33 is conductive, so the ground circuit 52a and the adhesive layer 33 can form an electrical connection.
如上述，接著劑層33與接地電路52a充分地接觸，因此，可形成低連接電阻狀態。 As described above, the adhesive layer 33 is in sufficient contact with the ground circuit 52a, thereby forming a low connection resistance state.
又，於製造屏蔽印刷配線板後，藉由使電磁波屏蔽膜的接著劑層與外部接地電連接，可使接地電路與外部接地電連接。 Furthermore, after manufacturing the shielded printed wiring board, the ground circuit can be electrically connected to the external ground by electrically connecting the adhesive layer of the electromagnetic wave shielding film to the external ground.
本步驟中壓接時的條件並無特殊限制，例如宜為壓力：1.0~5.0MPa、溫度：140~190℃、時間：15~90分鐘之條件。 There is no special restriction on the conditions for the compression in this step. For example, the conditions are preferably pressure: 1.0~5.0MPa, temperature: 140~190℃, and time: 15~90 minutes.
(4)剝離步驟 (4) Stripping step
其次，如圖5所示，自附轉印膜之電磁波屏蔽膜10剝離轉印膜20。 Next, as shown in FIG. 5 , the transfer film 20 is peeled off from the electromagnetic wave shielding film 10 with the transfer film attached.
剝離方法並無特殊限制，可採用習知方法。 There is no special restriction on the stripping method, and known methods can be used.
經由以上步驟，可製造屏蔽印刷配線板60。 Through the above steps, the shielded printed wiring board 60 can be manufactured.
上述本發明第1實施形態之屏蔽印刷配線板之製造方法係於覆蓋層53上形成孔54作為高低差，然而，本發明之屏蔽印刷配線板之製造方法亦可於覆蓋層上形成單純的高低差。又，在此情形下，附轉印膜之電磁波屏蔽膜的接著劑層亦可不具導電性。 The manufacturing method of the shielded printed wiring board of the first embodiment of the present invention is to form a hole 54 on the cover layer 53 as a height difference. However, the manufacturing method of the shielded printed wiring board of the present invention can also form a simple height difference on the cover layer. In this case, the adhesive layer of the electromagnetic wave shielding film with transfer film may also be non-conductive.
(第2實施形態) (Second implementation form)
其次，利用圖式，詳述本發明第2實施形態之附轉印膜之電磁波屏蔽膜。 Next, the electromagnetic wave shielding film with transfer film of the second embodiment of the present invention is described in detail using drawings.
圖6為截面圖，其示意顯示本發明第2實施形態之附轉印膜之電磁波屏蔽膜之一例。 FIG6 is a cross-sectional view schematically showing an example of an electromagnetic wave shielding film with a transfer film in the second embodiment of the present invention.
如圖6所示，附轉印膜之電磁波屏蔽膜110由轉印膜120及積層於轉印膜120的電磁波屏蔽膜130構成。 As shown in FIG. 6 , the electromagnetic wave shielding film 110 with a transfer film is composed of a transfer film 120 and an electromagnetic wave shielding film 130 laminated on the transfer film 120 .
又，電磁波屏蔽膜130包含：與轉印膜120接觸的保護層131、及積層於保護層131且具導電性的接著劑層133。 Furthermore, the electromagnetic wave shielding film 130 includes: a protective layer 131 in contact with the transfer film 120, and a conductive adhesive layer 133 laminated on the protective layer 131.
又，轉印膜120之楊氏模數為2.0GPa以上。 In addition, the Young's modulus of the transfer film 120 is greater than 2.0 GPa.
另，轉印膜120之楊氏模數之下限宜為2.5GPa，且以2.7GPa更佳。 In addition, the lower limit of the Young's modulus of the transfer film 120 is preferably 2.5 GPa, and more preferably 2.7 GPa.
又，轉印膜120之楊氏模數之上限宜為5.0GPa，且以4.5GPa更佳。 In addition, the upper limit of the Young's modulus of the transfer film 120 is preferably 5.0 GPa, and more preferably 4.5 GPa.
若轉印膜之楊氏模數大於5.0GPa，在將附轉印膜之電磁波屏蔽膜黏貼於印刷配線板時，高低差附隨性容易降低。 If the Young's modulus of the transfer film is greater than 5.0 GPa, the height difference conformity is likely to decrease when the electromagnetic wave shielding film with the transfer film is attached to the printed wiring board.
附轉印膜之電磁波屏蔽膜110可黏貼於印刷配線板用以製造屏蔽印刷配線板。 The electromagnetic wave shielding film 110 with transfer film can be pasted on a printed wiring board to manufacture a shielded printed wiring board.
使用附轉印膜之電磁波屏蔽膜110來製造屏蔽印刷配 線板時，會將附轉印膜之電磁波屏蔽膜110的接著劑層133抵接並壓接於印刷配線板之表面。 When the electromagnetic wave shielding film 110 with a transfer film is used to manufacture a shielded printed wiring board, the adhesive layer 133 of the electromagnetic wave shielding film 110 with a transfer film is abutted and pressed against the surface of the printed wiring board.
此時，若轉印膜120之楊氏模數為2.0GPa以上，則由於轉印膜120夠硬，因此壓接壓力不易分散。 At this time, if the Young's modulus of the transfer film 120 is greater than 2.0 GPa, the transfer film 120 is hard enough, so the pressing pressure is not easy to disperse.
故，即便是在印刷配線板表面有高低差時，亦可牢牢地壓住電磁波屏蔽膜130的接著劑層133，接著劑層133可充分地填埋高低差。 Therefore, even when there is a height difference on the surface of the printed wiring board, the adhesive layer 133 of the electromagnetic wave shielding film 130 can be firmly pressed, and the adhesive layer 133 can fully fill the height difference.
另，於附轉印膜之電磁波屏蔽膜110中，接著劑層133具有導電性，亦具有電磁波屏蔽機能。 In addition, in the electromagnetic wave shielding film 110 with transfer film, the adhesive layer 133 has conductivity and also has electromagnetic wave shielding function.
即，於附轉印膜之電磁波屏蔽膜110中，接著劑層133具有電磁波屏蔽機能以及與印刷配線板之接著機能兩者。 That is, in the electromagnetic wave shielding film 110 with transfer film, the adhesive layer 133 has both the electromagnetic wave shielding function and the bonding function with the printed wiring board.
通常於印刷配線板的印刷電路也會設置接地電路。由於附轉印膜之電磁波屏蔽膜的接著劑層具有導電性，因此，藉由以使電磁波屏蔽膜的接著劑層與接地電路接觸之方式將電磁波屏蔽膜配置於印刷配線板，而使該等電連接。再者，藉由使電磁波屏蔽膜的接著劑層與外部接地電連接，可使接地電路與外部接地電連接。 A ground circuit is usually also provided in the printed circuit of a printed wiring board. Since the adhesive layer of the electromagnetic wave shielding film with a transfer film has conductivity, the electromagnetic wave shielding film is arranged on the printed wiring board in such a way that the adhesive layer of the electromagnetic wave shielding film is in contact with the ground circuit, thereby connecting the electrical connections. Furthermore, by connecting the adhesive layer of the electromagnetic wave shielding film to an external ground, the ground circuit can be connected to an external ground.
另，使電磁波屏蔽膜的接著劑層與接地電路接觸時，會在位於接地電路上的覆蓋層形成露出接地電路的孔(亦即印刷配線板表面的高低差)。 In addition, when the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit, a hole exposing the ground circuit will be formed in the cover layer located on the ground circuit (i.e., a height difference on the surface of the printed wiring board).
若使用本發明附轉印膜之電磁波屏蔽膜，則可使電磁波屏蔽膜的接著劑層與接地電路充分地接觸，因此，可防止電磁波屏蔽膜的接著劑層與接地電路間之連接電阻上升。 If the electromagnetic wave shielding film with transfer film of the present invention is used, the adhesive layer of the electromagnetic wave shielding film can be fully in contact with the ground circuit, thereby preventing the connection resistance between the adhesive layer of the electromagnetic wave shielding film and the ground circuit from increasing.
接著劑層133可由導電性粒子與樹脂構成。 Next, the agent layer 133 may be composed of conductive particles and resin.
導電性粒子並無特殊限制，可為金屬微粒子、碳奈米管、碳纖維、金屬纖維等。 There is no particular limitation on the conductive particles, and they can be metal microparticles, carbon nanotubes, carbon fibers, metal fibers, etc.
當導電性粒子為金屬微粒子時，金屬微粒子並無特殊限制，可為銀粉、銅粉、鎳粉、焊粉、鋁粉、對銅粉施以鍍銀的銀包銅粉、以金屬被覆高分子微粒子或玻璃珠等的微粒子等。 When the conductive particles are metal particles, there are no special restrictions on the metal particles, and they can be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder with silver plating, metal-coated polymer particles or glass beads, etc.
於該等之中，從經濟性觀點來看，宜為可便宜取得的銅粉或銀包銅粉。 Among these, from the economic point of view, copper powder or silver-clad copper powder, which can be obtained cheaply, is preferred.
導電性粒子之平均粒徑並無特殊限制，宜為0.5~15.0μm。若導電性粒子之平均粒徑為0.5μm以上，則導電性接著劑層之導電性會變得良好。若導電性粒子之平均粒徑為15.0μm以下，則可使導電性接著劑層薄化。 The average particle size of the conductive particles is not particularly limited, and is preferably 0.5 to 15.0 μm. If the average particle size of the conductive particles is greater than 0.5 μm, the conductivity of the conductive adhesive layer will be good. If the average particle size of the conductive particles is less than 15.0 μm, the conductive adhesive layer can be thinned.
導電性粒子之形狀並無特殊限制，可自球狀、扁平狀、鱗片狀、枝晶狀、棒狀、纖維狀等適當選擇。 The shape of the conductive particles is not particularly limited and can be appropriately selected from spherical, flat, scaly, dendrite, rod, fiber, etc.
導電性粒子之摻合量並無特殊限制，宜為15~80質量%，且以15~60質量%更佳。 There is no particular limit on the amount of conductive particles mixed, but it is preferably 15-80% by mass, and more preferably 15-60% by mass.
樹脂並無特殊限制，可舉例如：苯乙烯系樹脂組成物、醋酸乙烯酯系樹脂組成物、聚酯系樹脂組成物、聚乙烯系樹脂組成物、聚丙烯系樹脂組成物、醯亞胺系樹脂組成物、醯胺系樹脂組成物、丙烯酸系樹脂組成物等熱塑性樹脂組成物；及酚系樹脂組成物、環氧系樹脂組成物、胺甲酸乙酯系樹脂組成物、三聚氰胺系樹脂組成物、醇酸系樹脂組成物等熱硬化性樹脂組成物等。 The resin is not particularly limited, and examples thereof include thermoplastic resin compositions such as styrene resin compositions, vinyl acetate resin compositions, polyester resin compositions, polyethylene resin compositions, polypropylene resin compositions, imide resin compositions, amide resin compositions, and acrylic resin compositions; and thermosetting resin compositions such as phenol resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, and alkyd resin compositions.
另，附轉印膜之電磁波屏蔽膜110的轉印膜120、保護層131之理想材料等，係與附轉印膜之電磁波屏蔽膜10的轉印膜20、保護層31之理想材料等相同，故而省略此處的說明。 In addition, the ideal materials of the transfer film 120 and the protective layer 131 of the electromagnetic wave shielding film with transfer film 110 are the same as the ideal materials of the transfer film 20 and the protective layer 31 of the electromagnetic wave shielding film with transfer film 10, so the description here is omitted.
其次，說明本發明第2實施形態之附轉印膜之電磁波屏蔽膜之製造方法。 Next, the manufacturing method of the electromagnetic wave shielding film with transfer film of the second embodiment of the present invention is described.
本發明附轉印膜之電磁波屏蔽膜之製造方法包含：(1)轉印膜準備步驟；及(2)電磁波屏蔽膜形成步驟。 The method for manufacturing an electromagnetic wave shielding film with a transfer film of the present invention comprises: (1) a transfer film preparation step; and (2) an electromagnetic wave shielding film formation step.
(1)轉印膜準備步驟 (1) Transfer membrane preparation steps
於本步驟中，準備楊氏模數為2.0GPa以上之轉印膜的轉印膜材料等既已說明，故而省略此處的說明。 In this step, the preparation of the transfer film material of the transfer film having a Young's modulus of 2.0 GPa or more has been described, so the description here is omitted.
(2)電磁波屏蔽膜形成步驟 (2) Electromagnetic wave shielding film formation step
其次，於轉印膜上依序積層保護層及接著劑層而形成電磁波屏蔽膜。 Next, a protective layer and an adhesive layer are sequentially laminated on the transfer film to form an electromagnetic wave shielding film.
將該等積層的方法可使用與以往製造電磁波屏蔽膜之方法相同的方法。 The method of laminating the above-mentioned layers can be the same as the method of manufacturing electromagnetic wave shielding films in the past.
又，該等材料等既已說明，故而省略此處的說明。 Furthermore, since these materials have already been explained, their explanation here will be omitted.
實施例 Implementation example
以下顯示更具體說明本發明的實施例，惟本發明並不限於該等實施例。 The following shows embodiments of the present invention in more detail, but the present invention is not limited to such embodiments.
(實施例1-1~1-3)及(比較例1-1) (Implementation Examples 1-1~1-3) and (Comparative Example 1-1)
(1)轉印膜準備步驟 (1) Transfer membrane preparation steps
準備具有表1所示楊氏模數且厚度50μm之由聚對苯二甲酸乙二酯膜構成的轉印膜(實施例1-1~1-3)，以及厚度 50μm之由聚甲基戊烯構成的轉印膜(比較例1-1)。另，楊氏模數為利用拉伸試驗機(島津製作所(股)製造，商品名AGS-X50S)並根據JIS K 7113-1995於25℃下測得之值。 A transfer film composed of polyethylene terephthalate film having a Young's modulus and a thickness of 50 μm (Examples 1-1 to 1-3) and a transfer film composed of polymethylpentene having a thickness of 50 μm (Comparative Example 1-1) were prepared. In addition, the Young's modulus is a value measured at 25°C using a tensile tester (manufactured by Shimadzu Corporation, trade name AGS-X50S) in accordance with JIS K 7113-1995.
(2)電磁波屏蔽膜形成步驟 (2) Electromagnetic wave shielding film formation step
於轉印膜表面塗佈脫模劑並予以加熱乾燥而形成脫模劑層。準備環氧系樹脂作為保護層用組成物，並使用線棒於脫模劑層表面塗佈該環氧系樹脂，藉由進行加熱乾燥而形成厚度5μm之保護層。 A release agent is applied to the surface of the transfer film and then heated and dried to form a release agent layer. An epoxy resin is prepared as a protective layer composition, and the epoxy resin is applied to the surface of the release agent layer using a wire rod, and then heated and dried to form a protective layer with a thickness of 5μm.
其次，利用真空蒸鍍，於保護層之表面形成厚度0.1μm之由銀構成的屏蔽層。 Secondly, a shielding layer made of silver with a thickness of 0.1μm is formed on the surface of the protective layer by vacuum evaporation.
接著，於環氧系樹脂中，添加平均粒徑5μm之樹枝狀覆銀銅粉作為導電性填料且達到15質量%，製備為接著劑層用組成物。又，利用線棒於屏蔽層上塗佈該接著劑層用組成物後，進行100℃×3分鐘之乾燥，形成厚度15μm之具各向異性導電性的接著劑層。 Next, dendritic silver-coated copper powder with an average particle size of 5μm was added to the epoxy resin as a conductive filler to reach 15% by mass to prepare a composition for the adhesive layer. In addition, the adhesive layer composition was applied to the shielding layer using a wire rod and then dried at 100℃ for 3 minutes to form an anisotropic conductive adhesive layer with a thickness of 15μm.
經由以上步驟，製作出實施例1-1~1-3及比較例1-1之附轉印膜之電磁波屏蔽膜。 Through the above steps, the electromagnetic wave shielding film with transfer film of Examples 1-1 to 1-3 and Comparative Example 1-1 was produced.
(實施例2-1~2-3)及(比較例2-1) (Implementation Examples 2-1~2-3) and (Comparative Example 2-1)
(1)轉印膜準備步驟 (1) Transfer membrane preparation steps
準備具有表2所示楊氏模數且厚度50μm之由聚對苯二甲酸乙二酯膜構成的轉印膜(實施例2-1~2-3)，以及厚度50μm之由聚甲基戊烯構成的轉印膜(比較例2-1)。另，楊氏模數為利用拉伸試驗機(島津製作所(股)製造，商品名AGS-X50S)並根據JIS K 7113-1995於25℃下測得之值。 A transfer film composed of polyethylene terephthalate film having a Young's modulus and a thickness of 50 μm (Examples 2-1 to 2-3) and a transfer film composed of polymethylpentene having a thickness of 50 μm (Comparative Example 2-1) were prepared. In addition, the Young's modulus is a value measured at 25°C using a tensile tester (manufactured by Shimadzu Corporation, trade name AGS-X50S) in accordance with JIS K 7113-1995.
(2)電磁波屏蔽膜形成步驟 (2) Electromagnetic wave shielding film formation step
於轉印膜表面塗佈脫模劑。準備環氧系樹脂作為保護層用組成物，並使用線棒於已塗佈脫模劑之轉印膜表面塗佈該環氧系樹脂，藉由進行加熱乾燥而形成厚度5μm之保護層。 Apply a release agent to the surface of the transfer film. Prepare an epoxy resin as a protective layer composition, and use a wire rod to apply the epoxy resin to the surface of the transfer film on which the release agent has been applied, and heat and dry it to form a protective layer with a thickness of 5μm.
其次，準備接著劑層用組成物，其係於環氧系樹脂中添加平均粒徑5μm之樹枝狀覆銀銅粉作為導電性填料且達到60質量%者。 Next, prepare the composition for the next coating, which is a dendritic silver-coated copper powder with an average particle size of 5μm added to the epoxy resin as a conductive filler and reaches 60% by mass.
然後，利用線棒於保護層上塗佈該接著劑層用組成物後，進行100℃×3分鐘之乾燥，形成厚度15μm之具各向同性導電性的接著劑層。 Then, the adhesive layer composition is applied on the protective layer using a wire rod, and then dried at 100°C for 3 minutes to form an isotropic conductive adhesive layer with a thickness of 15μm.
經由以上步驟，製作出實施例2-1~2-3及比較例2-1之附轉印膜之電磁波屏蔽膜。 Through the above steps, the electromagnetic wave shielding film with transfer film of Examples 2-1 to 2-3 and Comparative Example 2-1 was produced.
另，於實施例2-1~2-3及比較例2-1之附轉印膜之電磁波屏蔽膜中，具導電性之接著劑層具有電磁波屏蔽機能以及與印刷配線板之接著機能兩者。 In addition, in the electromagnetic wave shielding film with transfer film of Examples 2-1 to 2-3 and Comparative Example 2-1, the conductive adhesive layer has both electromagnetic wave shielding function and bonding function with the printed wiring board.
(評價用基板之作成) (Preparation of evaluation substrate)
圖7(a)及圖7(b)為步驟圖，其示意顯示實施例1之評價用基板之製作方法。 Figure 7(a) and Figure 7(b) are step diagrams, which schematically show the method for making the evaluation substrate of Example 1.
首先，如圖7(a)所示，於由聚醯亞胺構成的基底膜251上，形成2個由部分表面設有鍍金層之銅箔構成的印刷電路252，並於其上形成具有露出印刷電路的孔254(直徑0.5mm)且由聚醯亞胺膜構成的覆蓋層253(厚度37.5μm)，藉此，製作出作為評價用基板使用的印刷配線 板250。 First, as shown in FIG. 7(a), two printed circuits 252 made of copper foil with a gold-plated layer on a part of the surface are formed on a base film 251 made of polyimide, and a covering layer 253 (thickness 37.5 μm) made of polyimide film with a hole 254 (diameter 0.5 mm) exposing the printed circuit is formed thereon, thereby producing a printed wiring board 250 used as an evaluation substrate.
另，於印刷配線板250中，印刷電路252係模擬接地電路。 In addition, in the printed wiring board 250, the printed circuit 252 is an analog ground circuit.
其次，如圖7(b)所示，以實施例1-1之附轉印膜之電磁波屏蔽膜210的接著劑層233接觸印刷配線板250的覆蓋層253之方式，將附轉印膜之電磁波屏蔽膜210配置於印刷配線板250。 Next, as shown in FIG. 7( b ), the electromagnetic wave shielding film 210 with a transfer film is arranged on the printed wiring board 250 in such a manner that the adhesive layer 233 of the electromagnetic wave shielding film 210 with a transfer film of Example 1-1 contacts the covering layer 253 of the printed wiring board 250 .
其次，利用壓機，於溫度：170℃、時間3分鐘、壓力：3.0MPa之條件下進行加熱加壓，將附轉印膜之電磁波屏蔽膜壓接於印刷配線板。 Next, a press is used to heat and pressurize the electromagnetic wave shielding film with transfer film to the printed wiring board at a temperature of 170°C, a time of 3 minutes, and a pressure of 3.0MPa.
接著，藉由將轉印膜220剝離，製得實施例1之評價用基板。 Next, the transfer film 220 is peeled off to obtain the evaluation substrate of Example 1.
另，圖7(b)中，符號230表示電磁波屏蔽膜，符號231表示保護層，符號232表示屏蔽層。 In addition, in FIG. 7(b), symbol 230 represents an electromagnetic wave shielding film, symbol 231 represents a protective layer, and symbol 232 represents a shielding layer.
除了使用實施例1-2、1-3、2-1~2-3以及比較例1-1及比較例2-1之附轉印膜之電磁波屏蔽膜外，藉由與製得上述實施例1之評價用基板之方法相同的方法，製得實施例1-2、1-3及2-1~2-3以及比較例1-1及比較例2-1之評價用基板。 In addition to using the electromagnetic wave shielding film with transfer film of Examples 1-2, 1-3, 2-1 to 2-3 and Comparative Examples 1-1 and 2-1, the evaluation substrates of Examples 1-2, 1-3 and 2-1 to 2-3 and Comparative Examples 1-1 and 2-1 were prepared by the same method as the method for preparing the evaluation substrate of the above-mentioned Example 1.
(連接電阻試驗) (Connection resistance test)
圖8為示意圖，其示意顯示連接電阻試驗中實施例1-1之評價用基板之連接電阻測定方法。 FIG8 is a schematic diagram showing a method for measuring the connection resistance of the evaluation substrate of Example 1-1 in the connection resistance test.
於實施例1-1之評價用基板中，如圖8所示，利用電阻計270測定2個印刷電路252間之電阻值，來對評價用基板 的印刷電路與附轉印膜之電磁波屏蔽膜的接著劑層之連接電阻加以評價。 In the evaluation substrate of Example 1-1, as shown in FIG8 , the resistance value between two printed circuits 252 is measured using a resistance meter 270 to evaluate the connection resistance between the printed circuit of the evaluation substrate and the adhesive layer of the electromagnetic wave shielding film with the transfer film.
又，利用相同方法，評價實施例1-2、1-3及2-1~2-3以及比較例1-1及2-1之評價用基板中評價用基板的印刷電路與附轉印膜之電磁波屏蔽膜的接著劑層之連接電阻。表1及表2中顯示結果。 In addition, the same method was used to evaluate the connection resistance between the printed circuit of the evaluation substrate and the adhesive layer of the electromagnetic wave shielding film with transfer film in the evaluation substrates of Examples 1-2, 1-3 and 2-1~2-3 and Comparative Examples 1-1 and 2-1. The results are shown in Tables 1 and 2.
另，將實施例1-1~1-3、比較例1-1中連接電阻小於3000mΩ之情形評價為導電性優異，將實施例2-1~2-3、比較例2-1中連接電阻小於250mΩ之情形評價為導電性優異。 In addition, the connection resistance of Examples 1-1 to 1-3 and Comparative Example 1-1 is less than 3000mΩ, and the connection resistance of Examples 2-1 to 2-3 and Comparative Example 2-1 is less than 250mΩ, and the conductivity is excellent.
如表1及表2所示，可得知使用實施例1-1~1-3及實施例2-1~2-3之附轉印膜之電磁波屏蔽膜時，可形成低連接電阻狀態。即，顯示出實施例1-1~1-3及實施例2-1~2-3中，附轉印膜之電磁波屏蔽膜的接著劑層與評價用基板的印刷電路充分地接觸。 As shown in Table 1 and Table 2, it can be seen that when the electromagnetic wave shielding film with transfer film of Examples 1-1 to 1-3 and Examples 2-1 to 2-3 is used, a low connection resistance state can be formed. That is, it is shown that in Examples 1-1 to 1-3 and Examples 2-1 to 2-3, the adhesive layer of the electromagnetic wave shielding film with transfer film is in sufficient contact with the printed circuit of the evaluation substrate.
10‧‧‧附轉印膜之電磁波屏蔽膜 10‧‧‧Electromagnetic wave shielding film with transfer film
20‧‧‧轉印膜 20‧‧‧Transfer film
30‧‧‧電磁波屏蔽膜 30‧‧‧Electromagnetic wave shielding film
31‧‧‧保護層 31‧‧‧Protective layer
32‧‧‧屏蔽層 32‧‧‧Shielding layer
33‧‧‧接著劑層 33‧‧‧Then the agent layer
Claims (9)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018160342A JP7256618B2 (en) | 2018-08-29 | 2018-08-29 | Electromagnetic wave shielding film with transfer film, method for producing electromagnetic wave shielding film with transfer film, and method for producing shield printed wiring board |
| JP2018-160342 | 2018-08-29 |
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| Publication Number | Publication Date |
|---|---|
| TW202009283A TW202009283A (en) | 2020-03-01 |
| TWI846693B true TWI846693B (en) | 2024-07-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003298285A (en) | 2002-03-29 | 2003-10-17 | Tatsuta Electric Wire & Cable Co Ltd | Reinforcing shield film and shield flexible printed wiring board |
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003298285A (en) | 2002-03-29 | 2003-10-17 | Tatsuta Electric Wire & Cable Co Ltd | Reinforcing shield film and shield flexible printed wiring board |
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