TWI375493B - Heat spreaders with vias - Google Patents

Heat spreaders with vias Download PDF

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Publication number
TWI375493B
TWI375493B TW96102478A TW96102478A TWI375493B TW I375493 B TWI375493 B TW I375493B TW 96102478 A TW96102478 A TW 96102478A TW 96102478 A TW96102478 A TW 96102478A TW I375493 B TWI375493 B TW I375493B
Authority
TW
Taiwan
Prior art keywords
graphite
channel
planar
heat
flange
Prior art date
Application number
TW96102478A
Other languages
Chinese (zh)
Other versions
TW200810621A (en
Inventor
Bradley E Reis
Martin David Smalc
Brian J Laser
Gary Stephen Kostyak
Prathib Skandakumaran
Matthew G Getz
Michael Frastaci
Original Assignee
Advanced Energy Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/339,338 external-priority patent/US7303005B2/en
Application filed by Advanced Energy Tech filed Critical Advanced Energy Tech
Publication of TW200810621A publication Critical patent/TW200810621A/en
Application granted granted Critical
Publication of TWI375493B publication Critical patent/TWI375493B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3677Wire-like or pin-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/642Heat extraction or cooling elements characterized by the shape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0323Carbon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10416Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)

Description

1375493 九、發明說明: 本發明係由Reis等人於2005年11月4日提出申請之 美國第1 1/267,93 3號專利申請案「散熱電路總成」之部分 連續案,兩案同處審理中;該連續案之詳細內容以參考方 式倂於本案中。 【發明所屬之技術領域】 本發明槪括地關於由異向性石墨平面材料所製成之 熱分散器,且尤指包括熱通道以利將熱傳遞穿過熱分散器 之厚度的該類熱分散器。 【先前技術】 石墨熱分散器先前已被提出來用以從若干的分散熱 源處而將熱移走。分散器之表面被安置成與離散熱源相 抵,且熱從其處移至分散器中。然後,熱被傳導通過分散 器,並從分散器之兩表面處藉由傳導或輻射而被消散至較 冷之諸相鄰表面處,或藉由對流而被消散至空氣中。具有 高平面內熱傳導率之厚石墨分散器具有大截面面積,以便 可傳導熱並可比一由相同材料製成之薄分散器移去更多 熱。然而,具有高平面內熱傳導率之石墨材料具有相對較 低之厚度貫穿熱傳導率。此低厚度貫穿熱傳導率妨礙貫穿 石墨厚度之流動,且使經由分散器之熱傳遞無法達到最 大。 此問題可藉由將熱通道埋置在位於熱源位置處之石 墨分散器中而被克服。熱通道係由一等向性材料所製成, 而此等向性材料之熱傳導率則係較高於石墨之厚度貫穿 1375493 熱傳導率。候選之通道材料包括:金、銀、銅、鋁等及其 各種合金。熱通道典型地係爲圓形,且大小被設定成使其 直徑大到足以大致覆蓋住熱源之整個表面。通道之端部接 觸熱源,且熱流入通道內並穿過其中。熱經由通道之外徑 llljflst傳遞至石墨內。通道有效坡經由石墨之厚度傳遞熱·-並可利用石墨分散器之全厚度以使熱傳遞達到最大。一個 有關在石墨熱分散器中使用通道之先前技藝範例被揭示 於經頒予Krassowski等人且被讓與給本發明之受讓人的 美國第6,758,263號專利中,而該美國專利之詳細內容被 以參考方式倂於本案中。 由高平面內熱傳導率石墨所製成且倂入一熱通道之 厚石墨熱分散器爲一比相對等之全石墨、全銅或全鋁製熱 分散器更有效率之熱分散器,且其通常係比全銅或全鋁製 熱分散器更輕。 在一特別應用中,使用熱分散器與印刷電路板相結 合。印刷電路板傳統上係由諸如玻璃纖維層板(熟知爲 FR4板)、聚四氟乙烯、及類似材料等之介電質材料所製 成。在此類板之諸表面中之一者上,或在諸介電質材料層 之間的係爲通常由銅所構成之電路。此等電路一般係藉由 光微影法、濺鍍、網版印刷、或其他類似之方法而被形成 (就被配置在諸層間之電路而論’在層板形成之前需先將 電路鋪設於介電質材料上)。此外’諸如led、處理器或 其他類似物等之組件可被配置在該板之表面上,並與此表 面上之電路相接觸。此諸組件可能產生大量之熱,其必須 1375493 被消散以使諸組件能可靠地運作,並達到其預期之性能水 平 〇 由於這些熱產生組件,印刷電路板必須協助消散之熱 的量可能很大。所謂之”熱板”被形成於諸如銅或鋁及其 合金等之熱分散材料層與介電質#料相層疊之處,益在與 電路及熱產生組件之表面相對向之表面上或諸層板中,以 便作爲一用於分散由諸電子組件所產生之熱的熱分散 器。重要的是熱分散器必須被定位成使得至少一介電質材 料層可將熱分散器與(諸)電路分開,因爲諸熱分散器材 料通常係可導電的,而如果其相接觸,則將妨礙諸電路之 運作》 市面上存在許多可購得之”熱板",其有時被稱作爲 金屬芯印刷電路板(MCPCB ),諸如來自Bergquist公司 之 Insulated Metal SubstrateTM熱板、來自 Thermagon 公司 之T-CladTM熱板、來自Denka公司之HITT Plate板、以及 來自TT Electronics之Anotherm ^板。這些熱板可利用具 導熱性之介電質層,例如前三種熱板者可透過將介電質層 塡充以複數個導熱顆粒,或者例如Ano therm板者可透過 位在鋁熱分散器層頂部上的薄陽極處理層。然而,導熱顆 粒之使用可能很昂貴,且後續之層板必須夠厚,以便可確 保其無針孔,此卻增加了設計上之熱阻。此方法之額外限 制因素在於其缺乏製造彎曲或非平面電路結構之彈性,及 介電質材料覆蓋熱分散器層之整個表面的事實。將陽極處 理層作爲介電質層可克服上述之某些問題,但因爲銅無法 1375493 被陽極處理,故只能強制使用鋁以作爲其熱分散器層。由 於鋁的熱傳導率顯著小於銅的熱傳導率,故此可能成爲一 項熱缺失。然而,所有前述之方法均可能遭受焊接之困難 性,因爲在印刷電路板及諸組件運作期間係有益之相同散 熱性質會卸制需要點熱源以误择接(倒,熱棒黏結)之 組裝程序。 爲克服上述之某些而非全部問題,傳統之印刷電路板 可在一分離之程序中與一分離之金屬熱分散器層相互結 合。在此一配置中,此印刷電路板可被設計成具有若干熱 通道(典型地係爲被鍍以銅之鑽製孔),以便可更佳地將 熱傳導通過印刷電路板之未經塡充的介電質層,但這些只 可被用於組件與組件間並不需電絕緣之場合中。 此外,傳統之熱分散材料(例如,銅或鋁)將會大幅 地增加板之重量,此係爲不樂見者,且這些材料之熱膨脹 係數(CTE )無法與玻璃纖維層板之熱膨脹係數緊密地相 匹配,而此在熱的作用下將導致在印刷電路板上產生物理 應力,且潛在地可能導致脫層或龜裂。 此外,因爲位於這些板上之熱分散器層係由一等向性 之薄(相對其長度及寬度)金屬材料所構成,故熱將可立 即流動穿過熱分散器之厚度,且所形成之熱點可出現在與 熱源直接相對置之位置上。 另一類在本業中被稱爲「軟性電路」之電路總成面臨 相似之熱管理問題。軟性電路係藉由在作爲介電質層之聚 合物材料(例如聚亞醯胺或聚酯)表面上提供一電路(例 1375493 如前述之銅電路)而被構成。如名稱所暗示的,這些電路 材料係軟性的且甚至能以電路材料捲之型式提供,其可在 後來與一如銅或鋁之熱分散器層相結合。雖然非常薄,但 軟性電路中之介電質層仍顯著地增加了一給定設計之熱 阻’並面臨某些在印刷電路板中所観察到的相同問題。通 道之使用仍被限制在如前述之電絕緣用途。而且顯然地, 硬性金屬層(例如銅或鋁)之使用將使得無法利用軟性電 路之柔軟性,而此一特性在終端應用上卻是很重要的。 使用經壓縮之已剝離石墨顆粒的(諸)薄片所構成之 熱分散器將可補救許多在使用銅或鋁熱分散器時所遭遇 之缺失,此乃因爲此類石墨材料提供相較於銅可減少80% 重量之優點,同時可相符或甚至超過銅在平面內方向上使 熱分散遍及印刷電路板之表面所需之熱傳導率。此外,石 墨具有實質爲零之平面內熱膨脹係數(CTE),及較低於 銅成鋁之剛度,因此可減小在石墨-介電質黏結處之熱應 力。 雖然經壓縮之已剝離石墨顆粒的薄片甚至可具有能 與軟性電路配合使用之柔軟性,但是增加含石墨之熱分散 器層並無法克服所有之缺失,而此諸缺失係產生自熱分散 器之位置將使熱分散器與諸熱產生組件之間被一或多層 之介電質材料所隔開,而導致從諸組件至熱分散器層處之 熱傳遞降低。 疊層板諸層中之一或多層係由軟性石墨薄片所構成 爲在本藝中係習知的。這些結構例如可在襯墊製造中見到 1375493 其效用。參見頒予Howard之美國第4,961,991號專利。 Howard案揭示各種疊層結構,其包括若干被黏結在諸軟 性石墨薄片間之金屬或塑膠薄片。Howard案揭示該類結 構可藉由在金屬網之兩側上冷加工軟性石墨薄片並接著 將黏至該金屬網而被製備成。Howard案亦揭示 將一被塗層以聚合物樹脂之布放置在兩軟性石墨薄片之 間’同時加熱至一足以軟化該聚合物樹脂之溫度,藉此將 該被塗層以聚合物樹脂之布黏結於該兩軟性石墨薄片 間’以製成一軟性石墨疊層板。同樣地,Hirschvogel之美 國第5,509,99 3號專利揭示軟性石墨/金屬疊層板,其係藉 由一種方法而被製備成,而該方法之主要步驟係將表面活 性劑塗敷至諸欲被黏結之表面上。Mercuri之美國第 5,1 92,605號專利亦以被黏結至可爲金屬、玻璃纖維或碳 之芯材上之軟性石墨薄片構成疊層板。 Mercuri案在將芯 材及軟性石墨進給通過輪壓機壓輥以形成疊層板之前,將 先沈積並接著固化位於芯材上之環氧樹脂的塗層及熱塑 劑之顆粒。 除了在襯墊材料上之效用外,石墨疊層板亦具有作爲 熱傳遞或冷卻裝置之效用。將各種實心結構作爲熱傳送體 在本藝中係爲習知的。例如Banks之美國第5,316,080及 5,224,030號專利揭示鑽石及氣體衍生石墨纖維之效用, 其等係由一適當之黏結劑所連結以作爲熱傳遞裝置。此類 裝置被用以被動地將熱從一熱源(例如一半導體)處傳導 至一散熱器。 -10- 1375493 在Krassowski及Chen之美國第6,758,263號專利中揭 示將一高導熱插件倂合入一散熱組件(例如石墨散熱基 底)內’以便可從該處以一平面方向將熱從一熱源處傳導 通過該組件之厚度。然而,Krassowski及Chen案之揭示 內容中並無敘述可將熱從一熱源處傳導通過複數層相對 而言係非傳導性之材料(諸如電路總成之介電質層)。 如前所指明的,較好用作爲本發明之熱分散器材料之 石墨材料係由經壓縮之已剝離石墨顆粒的薄片,其通常被 稱爲軟性石墨薄片材料。 以下係石墨及成形方式之簡要說明,其中該成形方式 通常被進行以構成軟性石墨薄片材料。在顯微規格上,石 墨係由碳原子六角陣列或網絡之層板平面所構成。這些呈 六角形配置之碳原子的層板平面係大致成平坦,並被定向 或排列成大致彼此平行且等距。此諸大致成平坦、平行且 等距之碳原子薄片或層(通常被稱爲石墨薄片層或基底平 面)被連結或鍵結在一起,且其諸群被排列成微晶。高度 有序之石墨材料係由具有相當大尺寸之微晶所組成,而此 等微晶相對於彼此被高度地對準或定向,且具有若干相當 有序之碳層。換言之’高度有序之石墨具有—高度之優選 微晶定向。應注意的是’從定義上來說’石墨具有異向性 結構,且因此展現或具有許多高度方向性之特性,例如熱 與電傳導性及流體擴散性。 簡要地說,石墨之特徵在於碳之疊層結構’亦即,由 若干藉弱凡得瓦爾(vanderWaals)力而被連接在一起之 -11- 1375493 碳原子的#置層或薄層所組成之結構。就該石墨結構而 論,通常會提及兩軸線或方向,即” C”軸線或方向 及"a”軸線或方向。爲簡化起見’” C"軸線或方向可被 認定爲垂直於諸碳層之方向。” a”軸線或方向可被認定 爲平行於諸碳層之方I句,或垂直於” c ”方同之方岗=適 用於製造軟性石墨板片之石墨具有一極高度之方向性。 如上所提及的,將諸平行碳原子層固定在一起之鍵結 力係只是弱凡得瓦爾力。天然石墨可經化學處理成使得諸 碳原子疊置層或薄層之間的間隔可被顯著敞開,以便可提 供一沿著垂直於諸層之方向(即沿著” C”方向)的顯著 膨脹,並因而形成一膨脹或腫大之石墨結構,其中諸碳層 之薄層特性大體上被保留。 已被化學或熱膨脹之石墨薄片,更具體而言已被膨脹 成可具有一最終厚度或” C"方向尺寸,其係大約爲原 始” c”方向尺寸之80倍或更多倍大,則可在不使用黏結 劑下將石墨薄片成形爲黏合或整體之膨脹石墨板片,例如 網、紙、條、帶或其他類似者(通常被稱爲「軟性石墨」)。 由於在諸已大量膨脹之石墨顆粒間所達到之機械連結或 黏合,使得可在不使用任何黏結材料下,藉由壓縮而將石 墨顆粒成形爲整體之軟性板片,其中該等石墨顆粒已被膨 脹成可具有一最終厚度或” C”方向尺寸,其大約爲原 始” c”方向尺寸之80倍或更多倍大。 除了柔軟性之外,如上所提出之板片材料亦被發現在 熱及電傳導性及流體擴散性上具有高度之異向性’雖較不1375493 IX. INSTRUCTIONS: The present invention is a contiguous case of the "heat dissipation circuit assembly" of the US Patent Application No. 1/267,93 3 filed by Reis et al. on November 4, 2005. The trial is in the process; the details of the consecutive case are referred to in this case by reference. TECHNICAL FIELD OF THE INVENTION The present invention is generally directed to a heat spreader made of an anisotropic graphite planar material, and more particularly to such a heat dispersion comprising a heat tunnel to facilitate heat transfer through the thickness of the heat spreader. Device. [Prior Art] Graphite heat spreaders have previously been proposed to remove heat from a number of dispersed heat sources. The surface of the disperser is placed against a discrete heat source and heat is moved therefrom into the disperser. Heat is then conducted through the disperser and dissipated from the two surfaces of the disperser by conduction or radiation to the cooler adjacent surfaces or dissipated into the air by convection. Thick graphite dispersers with high in-plane thermal conductivity have large cross-sectional areas to allow heat to be transferred and remove more heat than a thin disperser made of the same material. However, graphite materials having a high in-plane thermal conductivity have a relatively low thickness throughout thermal conductivity. This low thickness throughout the thermal conductivity impedes the flow through the graphite thickness and does not maximize heat transfer through the disperser. This problem can be overcome by embedding the hot aisle in a graphite disperser located at the location of the heat source. The hot aisle is made of an isotropic material, and the thermal conductivity of the isotropic material is higher than the thickness of the graphite through the 1375493 thermal conductivity. The candidate channel materials include: gold, silver, copper, aluminum, etc. and various alloys thereof. The hot aisle is typically circular and sized to have a diameter large enough to substantially cover the entire surface of the heat source. The end of the channel contacts the heat source and heat flows into and through the channel. Heat is transferred to the graphite via the outer diameter llljflst of the channel. The effective slope of the channel transfers heat via the thickness of the graphite - and the full thickness of the graphite disperser can be utilized to maximize heat transfer. A prior art example of the use of a channel in a graphite heat dissipator is disclosed in U.S. Patent No. 6,758,263, issued to the assignee of Reference to the case in this case. A thick graphite heat disperser made of high-in-plane thermal conductivity graphite and breaking into a hot aisle is a more efficient heat disperser than a relative graphite, all-copper or all-aluminum heat disperser, and It is usually lighter than a full copper or all-aluminum heat spreader. In a particular application, a heat spreader is used in conjunction with a printed circuit board. Printed circuit boards have traditionally been fabricated from dielectric materials such as fiberglass laminates (known as FR4 panels), polytetrafluoroethylene, and the like. On one of the surfaces of such a board, or between layers of dielectric material, is a circuit typically composed of copper. These circuits are typically formed by photolithography, sputtering, screen printing, or the like (in the case of circuits disposed between layers), the circuit must be laid before the layer is formed. On the dielectric material). Further, components such as led, processor or the like can be disposed on the surface of the board and in contact with the circuitry on the surface. These components may generate a significant amount of heat, which must be dissipated in order to allow the components to operate reliably and to the desired level of performance. Due to these heat generating components, the amount of heat that the printed circuit board must assist in dissipating may be large. . The so-called "hot plate" is formed at a layer where a layer of a heat dispersing material such as copper or aluminum and an alloy thereof is laminated with a dielectric material, and is preferably on the surface opposite to the surface of the circuit and the heat generating component or In the laminate, as a heat disperser for dispersing the heat generated by the electronic components. It is important that the heat spreader must be positioned such that at least one layer of dielectric material separates the heat spreader from the circuit(s) because the heat spreader materials are typically electrically conductive, and if they are in contact, Blocking the Operation of Circuits There are many commercially available "hot plates" on the market, sometimes referred to as metal core printed circuit boards (MCPCBs), such as the Insulated Metal SubstrateTM hot plate from Bergquist, from Thermagon. T-CladTM hot plate, HITT Plate from Denka, and Anotherm® from TT Electronics. These plates can be made of a dielectric layer with thermal conductivity. For example, the first three hot plates can pass through the dielectric layer. Filling with a plurality of thermally conductive particles, or such as an Ano therm plate, can pass through a thin anodized layer on top of the aluminothermic disperser layer. However, the use of thermally conductive particles can be expensive and the subsequent laminate must be thick enough. In order to ensure that it has no pinholes, this increases the thermal resistance of the design. An additional limiting factor of this method is its lack of manufacturing curved or non-planar circuit structures. And the fact that the dielectric material covers the entire surface of the heat disperser layer. The use of the anodized layer as a dielectric layer overcomes some of the above problems, but since copper cannot be anodized with 1374493, only aluminum can be used. As a layer of its heat disperser, since aluminum has a thermal conductivity significantly lower than that of copper, it may become a heat loss. However, all of the aforementioned methods may suffer from soldering difficulties because of printed circuit boards and components. The same heat dissipation properties during operation will unload the assembly process that requires a point of heat source to mis-connect (pour, hot rod bonding). To overcome some, but not all, of the above problems, conventional printed circuit boards can be separated. The process is combined with a separate metal heat spreader layer. In this configuration, the printed circuit board can be designed to have a number of hot runners (typically drilled with copper) so that The heat is conducted through the unfilled dielectric layer of the printed circuit board, but these can only be used in applications where components and components do not need to be electrically insulated. In addition, traditional heat-dispersible materials (for example, copper or aluminum) will greatly increase the weight of the board, which is unpleasant, and the coefficient of thermal expansion (CTE) of these materials cannot be closely related to the thermal expansion coefficient of the glass fiber laminate. Ground matching, which under thermal action will cause physical stress on the printed circuit board, and potentially can cause delamination or cracking. Furthermore, because the thermal diffuser layer on these plates is an isotropic The thinness of the material (relative to its length and width) is made of metal material, so the heat will flow immediately through the thickness of the heat disperser, and the hot spot formed may appear directly opposite the heat source. The other type is in the industry. Circuit assemblies known as "soft circuits" face similar thermal management problems. The flexible circuit is constructed by providing a circuit (e.g., 1375493 copper circuit as described above) on the surface of a polymer material (e.g., polyimide or polyester) as a dielectric layer. As the name implies, these circuit materials are soft and can even be provided in the form of a coil of circuit material that can later be combined with a layer of heat spreader such as copper or aluminum. Although very thin, the dielectric layer in a flexible circuit still significantly increases the thermal resistance of a given design and faces some of the same problems observed in printed circuit boards. The use of the channel is still limited to electrical insulation as described above. Moreover, it is clear that the use of a hard metal layer (e.g., copper or aluminum) would make it impossible to utilize the softness of the soft circuit, which is important in end applications. The use of a heat spreader consisting of compressed sheets of exfoliated graphite particles will remedy many of the losses encountered with copper or aluminum heat spreaders because such graphite materials are comparable to copper. The advantage of reducing the weight by 80%, while at the same time matching or even exceeding the thermal conductivity required for the copper to disperse heat throughout the surface of the printed circuit board in the in-plane direction. In addition, graphite has a coefficient of thermal expansion (CTE) in the plane of substantially zero, and is lower than the stiffness of copper to aluminum, thereby reducing the thermal stress at the graphite-dielectric bond. Although the compressed sheet of exfoliated graphite particles may even have the flexibility to be used in conjunction with a flexible circuit, the addition of a graphite-containing thermal disperser layer does not overcome all of the defects that result from the self-heating disperser. The location will separate the heat spreader from the heat generating components by one or more layers of dielectric material, resulting in reduced heat transfer from the components to the heat spreader layer. One or more of the layers of the laminate are composed of soft graphite flakes as is well known in the art. These structures can be seen, for example, in the manufacture of pads for the benefit of 1375493. See U.S. Patent No. 4,961,991 issued to Howard. The Howard case discloses various laminate structures comprising a plurality of metal or plastic sheets bonded between soft graphite sheets. The Howard case reveals that such a structure can be prepared by cold working a soft graphite flake on both sides of a metal mesh and then adhering to the metal mesh. The Howard case also discloses that a coating of a polymer resin is placed between two soft graphite sheets while heating to a temperature sufficient to soften the polymer resin, thereby coating the polymer resin with a cloth. Bonded between the two soft graphite sheets to form a soft graphite laminate. No. 5,509,99 3 to Hirschvogel discloses a soft graphite/metal laminate which is prepared by a method in which the main step of the method is to apply a surfactant to the desired Bonded to the surface. U.S. Patent No. 5,1,92,605 to Mercuri also incorporates a laminate of flexible graphite sheets bonded to a core material of metal, fiberglass or carbon. The Mercuri case deposits and then cures the coating of the epoxy resin on the core material and the particles of the thermoplastic prior to feeding the core material and soft graphite through the roller press roll to form the laminate. In addition to its utility on gasket materials, graphite laminates also have utility as heat transfer or cooling devices. The use of various solid structures as heat transfer bodies is well known in the art. For example, U.S. Patent Nos. 5,316,080 and 5,224,030, the disclosures of each of each of each each each each each each each each each Such devices are used to passively conduct heat from a heat source (e.g., a semiconductor) to a heat sink. U.S. Patent No. 6,758,263 to the disclosure of U.S. Pat. Through the thickness of the assembly. However, the disclosures of Krassowski and Chen do not describe materials that conduct heat from a source of heat through a plurality of layers that are relatively non-conductive (such as a dielectric layer of a circuit assembly). As indicated previously, the graphite material which is preferably used as the heat disperser material of the present invention is a sheet of compressed exfoliated graphite particles, which is commonly referred to as a soft graphite flake material. The following is a brief description of graphite and the manner of forming, wherein the forming method is usually carried out to constitute a soft graphite sheet material. In microscopic form, the graphite consists of a hexagonal array of carbon atoms or a laminate plane of the network. The planes of the layers of carbon atoms in a hexagonal configuration are generally flat and are oriented or arranged to be substantially parallel and equidistant from one another. The substantially flat, parallel and equidistant carbon atom flakes or layers (commonly referred to as graphite flake layers or substrate planes) are joined or bonded together and their populations are arranged in crystallites. The highly ordered graphite material is composed of crystallites of considerable size which are highly aligned or oriented relative to one another and which have a number of relatively ordered carbon layers. In other words, 'highly ordered graphite has a preferred microcrystalline orientation of height. It should be noted that 'by definition' graphite has an anisotropic structure and thus exhibits or has many highly directional properties such as thermal and electrical conductivity and fluid diffusivity. Briefly, graphite is characterized by a stack of carbon's, that is, consisting of a number of layers or thin layers of -11-1375493 carbon atoms that are joined together by a weak vanderWaals force. structure. As far as the graphite structure is concerned, two axes or directions are usually mentioned, namely the "C" axis or direction and the "a" axis or direction. For the sake of simplicity '"C" the axis or direction can be considered perpendicular to the The direction of the carbon layer. The "a" axis or direction can be considered to be parallel to the carbon layer of the I sentence, or perpendicular to the "c" square square = graphite suitable for the manufacture of soft graphite sheets has a very high degree of directivity. As mentioned above, the bonding force that holds the parallel layers of carbon atoms together is only a weak van der Waals force. The natural graphite can be chemically treated such that the intervals between the carbon atom stacks or layers can be significantly opened so as to provide a significant expansion along the direction perpendicular to the layers (i.e., along the "C" direction). And thus forming an expanded or swollen graphite structure in which the thin layer properties of the carbon layers are substantially retained. Graphite sheets that have been chemically or thermally expanded, and more specifically, have been expanded to have a final thickness or "C" directional dimension that is about 80 times or more larger than the original "c" direction dimension. The graphite flakes are formed into a bonded or integral expanded graphite sheet, such as a mesh, paper, strip, tape or the like (commonly referred to as "soft graphite"), without the use of a binder. Due to the mechanical joining or bonding achieved between the extensively expanded graphite particles, the graphite particles can be formed into a unitary flexible sheet by compression without the use of any bonding material, wherein the graphite particles have been The expansion may have a final thickness or "C" direction dimension which is about 80 times or more greater than the original "c" direction dimension. In addition to softness, the sheet material as proposed above has also been found to have a high degree of anisotropy in heat and electrical conductivity and fluid diffusibility, although less

J -12- 1375493 如,但卻可比得上天然石墨起始材料,此乃因爲諸膨脹石 墨顆粒之方向大致平行於由非常高壓縮(例如輥壓加工處 理)所形成之板片的諸相對向面。因而所製成之板片材料 具有絕佳之柔軟性、良好之強度及非常高度之方向性。存 在一種對能更完全地利闬這些性質之邡工處理的需求。 簡要而言,用於製進軟性無黏結劑異向性石墨板片材 料(例如網、紙、條、帶、箔、墊、或其他類似物)包括 在一預定負載下且無黏結劑之情形下壓縮或緊實諸膨脹 石墨顆粒,其具有一大約爲諸原始顆粒之”C”方向尺寸之 80倍或更多倍大之”C”方向尺寸,以便可形成一大體上平 坦’軟性,且成一體之石墨板片。通常在外觀上呈蟲狀或 蠕蟲狀之諸膨脹石墨顆粒一旦被壓縮將維持壓縮變形,並 與板片之相對主要表面相對齊。板片之性質可藉由在壓縮 步驟前先予塗層及/或加入黏結劑及添加物而被改變。見 頒予Shane等人之美國第3,404,061號專利。板片材料之 密度及厚度可藉由控制壓縮程度而被改變。 較低密度在表面細節必需進行壓印或模製之處是有 利的’且較低密度有助於獲得良好之細節。然而,較密集 之板片通常具有較高之平面內強度及熱傳導率。典型地, 板片材料之密度將在從大紛0.04g/cm3至大約l.9g/cm3之 範圍內。 如上述般被製成之軟性石墨板片材料,由於與板片之 諸主要相對向平行表面相平行之諸石墨顆粒的對齊,而通 常展現一可觀程度之異向性,同時使得異方性之程度在輥 -13- 1375493 壓該板片材料以增加密度之後隨即增加。在經輥壓之異方 性板片材料中,厚度(亦即,垂直於諸相對向平行板片表 面)包括” C”方向及諸沿著長度延伸之方向,而寬度(亦 即,沿著或平行於諸相對向主要表面)包括” a”方向,且 通常就大小而言,板片在” c ”及” a 方向上之熱性質係非常 不同的。 【發明內容】 因此,本發明之目的在於提供石墨熱分散器中之通道 的改良結構。 本發明之另一目的在於提供用於製造具有熱通道之 石墨熱分散器之改良方法。 本發明之另一目的在於提供一種凸緣通道,其具有一 與石墨熱分散器之諸主要表面中之一者相啣合的凸緣,以 便可改善通道與石墨熱分散器之間的熱傳遞。 本發明之另一目的在於提供一種利用價廉之推置螺 帽來製造具有通道之熱分散器的低成本方法。 本發明之另一目的在於提供用於建構具有齊平式熱 通道之石墨熱分散器的結構及方法。 本發明之另一目的在於提供石墨熱分散器,其具有若 干熱通道及一層可提供有利於固定該熱分散器之結構完 整性的包覆層。 本發明之再另一目的在於提供可將熱通道與石墨熱 分散器一起鍛造之方法。 對熟習本藝之人士而言,在閱讀本揭示內容並配合參 i -14- 1375493 照附圖之後,隨即可輕易且顯然了解本發明之其 之目的、特徵與優點。 【實施方式】 本發明提供用於製造具有熱通道之石墨熱 較佳結構及方法。在一實施例中,凸緣通道被提 至少一凸緣,其與石墨熱分散器之石墨平面元件 平面表面中之一者相啣合。此一凸緣通道可被透 推置螺帽,或是透過使用一被剛性地連接至通道 第二凸緣,而被繫固於石墨分散器上。因此,此 包含至少一凸緣及一第二凸緣或一推置螺帽,其 至石墨熱元散器元件之表面上方。在另一實施例 一種齊平式熱通道,其在最終位置上係與石墨熱 件之諸主要平面表面相齊平。各種不同可用於製 施例之較佳技術將被提供。 兩實施例較佳地涉及一種製造方法,其中通 被壓入配合至一具相同形狀但略爲較小且貫穿 元件之孔內,以便可提供一在心柱與貫穿石墨平 孔間的緊密配合。 此類石墨熱分散器之一特別用途係其可與 路板之電路總成配合使用。當在熱產生組件(尤3 與熱分散器層之間的熱路徑(亦即熱通路)被提 路總成上之熱分散器層的熱分散功能被實質地改 正地,藉由此一熱路徑之使用,石墨基熱分散器 可提供改良之熱分散,甚至是可比得上使用鋁或 他及另外 分散器的 洪成具有 的諸主要 過使用一 心柱上之 凸緣通道 全均伸出 中則提供 元散器元 造此兩實 道之心柱 石墨平面 面元件之 一印刷電 ^ 是 LED ) 供時,電 :善了。真 層之使用 銅製熱分 -15- 1375493 散器者,同時還具有減輕重量之優點。 「電路總成」用辭係指一包括一或多個被定位在介電 質材料上之電子電路的總成,且可包括疊層板,其中諸電 路中之一或多個被夾置於諸介電質層之間。電路總成之具 體範例係爲印刷電路板及軟性電路,如同熟習本項技術之 人士所熟知者。 在說明本發明改良現有材料之方法前,將先依序簡要 地說明石墨及其如何成形爲軟性板片,而此諸軟性板片將 會變爲用於構成本發明產品之主要熱分散器。 石墨係碳之微晶型式,其包括被共價地鍵結在諸平坦 疊層平面中之諸原子,且使諸平面之間成較弱之鍵結。藉 著用一例如硫酸及硝酸溶液之插層劑來處理石墨顆粒(諸 如天然石墨薄片),石墨之結晶體結構將會起作用而形成 —石墨與該插層劑之化合物。經處理之石墨顆粒在下文中 被稱之爲「已插層石墨顆粒」。在暴露至高溫之後,石墨 內之插層劑隨即分解並揮發,此導致諸已插層石墨顆粒之 尺寸可沿著” C ”方向(亦即沿著垂直於石墨之諸結晶表 面的方向)以一類似手風琴之型式膨脹至其原始體積的 80倍或更多倍大。已剝離石墨顆粒在外觀上係呈蠕蟲狀, 而因此普遍地被稱爲嬬蟲。此諸蠕蟲可被一起壓縮成軟性 板片,其不像原始之石墨薄片,而是可被成形且切割成各 種不同形狀。 適用於本發明中之石墨起始材料包括高度石墨化含 碳材料,其可將有機與無機酸以及鹵素插入,然後當被暴 -16- 1375493 露在熱之下時會膨脹。這些高度石墨化含碳材料最佳地具 有約1.0之石墨化度。如同在本文中所使用的,「石墨化 度j 一詞係指根據下列公式所得之g値: =3.45 X d(002) g = 0.095 其中d(002)係在以埃(Angstrom)單位所量測之晶體 結構中之碳的諸石墨層間的間隔。介於諸石墨層間之間隔 係由標準X光繞射技術所測量。對應於(002)、(〇〇4)及(〇〇6) 米勒指標(Miller Indices)之諸繞射峰的位置被測得,且 標準之最小平方技術被用以導出間隔,其最小化所有這些 峰之總誤差。高度石墨化含碳材料之範例包含自各種來源 處所取之天然石墨,以及其他含碳材料,諸如以化學汽相 沉積、聚合物之高溫熱解、或結晶化及類似方法所製備之 石墨。天然石墨則係最佳的。 本發明中所使用之石墨起始材料可包含非石墨組 件,只要諸起始材料之晶體結構保持所要之石墨化度且其 可剝離便可。一般而言,任何含碳材料均適於配合本發明 使用,而此諸含碳材料之晶體結構均具有所要之石墨化度 且可剝離。此類石墨較佳地具有一至少約爲80%重量百分 比之純度。更佳地,被用於本發明之石墨具有一至少約爲 94 %之純度。在最佳之實施例中,所使用之石墨將具有至 少約爲98%之純度。 —種用於製造石墨板片之普遍方法被敘述於Shane等 人之美國第3,404,061號專利中,其揭示內容以引用之方 式被倂於本文中。在Shane等人之方法的典型實施中,天 -17- 1375493 然石墨薄片藉由將諸薄片消散在一包括例如硝酸及 混合物之溶液中而被插層,而最有利地係在重量上 100份石墨薄片(pph)大約20至大約3 00份插層溶 標準。插層溶液包括氧化劑及本藝中所習知之其他 劑範倒包活那些包含:氧化劑及氧化混合物,諸如 酸、氯酸鉀、鉻酸、高錳酸鉀、鉻酸鉀、重鉻酸鉀、 酸及類似物之溶液;或混合物,諸如濃縮硝酸及氯酸 鉻酸及磷酸、硫酸及硝酸;或例如三氟醋酸之強有機 混合物;及溶解在該有機酸中之強氧化劑。或者,電 被用以引起石墨之氧化。可利用電解氧化而被導入石 體中之化學物質包括硫酸及其他酸。 在一較佳實施例中,插層劑爲硫酸、或硫酸與碳 及氧化劑之混合物的溶液,其中氧化劑亦即硝酸、 酸、鉻酸、高錳酸鉀 '過氧化氫、碘酸、過碘酸、或 類似物。雖非較佳的,但插層溶液可包含:金屬鹵化 諸如氯化鐵、及與硫酸相混合之氯化鐵;或鹵化物, 作爲溴與硫酸之溶液的溴、或在一有機溶劑中之溴》 插層溶液之量可在從大約20至大約35Opph之範 且更典型地係在大約40至大約1 60pph之範圍。在諸 被插層後,任何過剩之溶液從諸薄片處被排出,且諸 被水洗。或者,插層溶液之量可被限制在大約10至 40pph之間,其將使水洗步驟可如美國第4,895,713號 中所教示且建議地被消去,此美國專利所揭示內容亦 用之方式被倂於本文中》 硫酸 以每 液之 插層 含硝 過氯 鹽' 酸的 位可 墨晶 酸、 過氛 其他 物, 諸如 圍, 薄片 薄片 大約 專利 以引 -18- 1375493 以插層溶液處理之石墨薄片的顆粒可例如藉由混合 而與一還原有機劑接觸,該還原有機劑係選擇自醇類、糖 類、醛類及酯類,其在25°C至125°C之溫度範圍中可與 氧化插層溶液之表面薄膜反應。適宜之特定有機劑包括: ί-六烷醇,十八碳醇,1-辛醇,2-辛醇,癸醇· 1,10癸二 醇、癸醛、1-丙醇、1,3丙二醇、乙二醇、聚丙二醇、葡 萄糖、果糖、乳糖、蔗糖、馬鈴薯澱粉、乙二醇單硬脂酸 酯、二苯甲酸二乙二醇酯、丙二醇單硬脂酸酯、單硬脂酸 甘油酯、羧酸二甲酯、羧酸二乙酯、甲酸甲酯、甲酸乙酯、 抗壞血酸、以及由木質素衍生之化合物,諸如木質素磺酸 鈉。有機還原劑之量係適當地佔石墨薄片顆粒重量之大約 0.5 至 4%。 在插層之前、插層期間、或就在插層之後使用膨脹輔 助劑亦可提供改良。在這些改良中可爲降低之剝離溫度及 增大之膨脹體積(亦被稱爲「蠕蟲體積」)。在本文中之 膨脹輔助劑將最好係爲一種可充分溶解於插層溶液中以 便可達成膨脹改良之有機材料。更嚴密地說,可使用該類 包含碳、氫及氧(較佳係獨佔的)之有機材料。羧酸被發 現是特別有效的。一可用爲膨脹輔助劑之適當羧酸可被選 自芳香族、脂肪族或脂環族、直鏈或支鏈、飽和及不飽和 單羧酸、二羧酸及聚羧酸,其具有至少1個碳原子(較佳 係多達15個碳原子),其能以一可有效針對一或多個剝 離態樣提供可預見改良之量而溶解於插層溶液中。適當之 有機溶劑可被用以改善插層溶液中之有機膨脹輔助劑的 -19- 1375493 溶解性。 飽和脂肪族羧酸之代表性範例係諸如具 H(CH小COOH的那些酸類,其中n係一從〇至 字,而此諸酸類包括:甲酸、乙酸、丙酸、丁 Γ~Ι SPfft Ό- itU Λ、I -JU- =rr m r«rr —ϋ r^- .t>r irju LJ敗 ' 汉升TIB網Ί以书 °刃、WJ Md 0T现汉應Ί王?交肢 如烷基酯)來代替羧酸。烷基酯的代表係甲酸 乙酯。硫酸、硝酸及其他習知之水性插層劑均 最終分解成水及二氧化碳之能力。因此,甲酸 之膨脹輔助劑最好在石墨薄片浸沒入水性插 與石墨薄片相接觸。二羧酸之代表係具有2至 子之脂肪族二羧酸,尤其是草酸、反丁烯二酸 順丁烯二酸、琥珀酸、戊二酸、己二酸、1,5-戊 1,6-己烷二羧酸、1,10-癸烷二羧酸、環已烷-1 及芳香族二羧酸,諸如鄰苯二甲酸或對苯二甲 之代表係羧酸二甲酯及羧酸二乙酯。環脂族酸 環已烷二羧酸,而芳香族羧酸之代表係安息香 鄰胺基苯甲酸、Ρ -對氨基苯甲酸、水楊酸、〇-,】 基酸、甲氧基及乙氧基安息香酸、乙醯基乙醯 乙醯胺安息香酸、苯乙酸及萘甲酸。羥基芳香 表係對羥基苯甲酸、3 -羥基-1-萘酸、3 -羥基-羥基-2·萘酸、5 -羥基-1-萘酸、5 -羥基-2-萘酸 萘酸、及7-羥基-2-萘酸。聚羧酸類中之重要者 插層溶液係水性的,且較佳地含有從1至 輔助劑的量。此量將有效地增加剝離。在其中 有化學式爲 大約5之數 酸、戊酸、 /%— £±_ *» / - ✓ 七 AT王籾L薙 甲酯及甲酸 具有將甲酸 及其他敏感 層劑之前先 i 12個碳原 、丙二酸、 烷二羧酸、 ,4-二羧酸、 酸。烷基酯 類之代表係 酸、萘酸、 m-及p-甲苯 胺安息香及 族酸類之代 2-萘酸、4-、6-羥基-2-係檸檬酸。 10%之膨脹 膨脹輔助劑 -20- 1375493J -12-1375493, for example, but comparable to natural graphite starting materials, since the direction of the expanded graphite particles is substantially parallel to the relative orientation of the sheets formed by very high compression (eg, roll processing) surface. The sheet material thus produced has excellent flexibility, good strength and very high directionality. There is a need for a complete processing that can more fully benefit these properties. Briefly, the use of a non-adhesive anisotropic graphite sheet material (such as a mesh, paper, strip, tape, foil, mat, or the like) for forming a non-adhesive agent is included under a predetermined load and without a binder. Lowering or compacting the expanded graphite particles having a size of about 80 times or more the "C" direction of the "C" direction of the original particles so as to form a substantially flat 'softness, and Integral graphite sheet. Expanded graphite particles, which are generally in the form of insects or worms in appearance, will remain compressively deformed once compressed and aligned with the opposite major surfaces of the sheet. The nature of the sheet can be altered by precoating and/or adding binders and additives prior to the compression step. See U.S. Patent No. 3,404,061 issued to Shane et al. The density and thickness of the sheet material can be varied by controlling the degree of compression. Lower densities are advantageous where surface details must be embossed or molded' and lower densities help to achieve good detail. However, denser sheets typically have higher in-plane strength and thermal conductivity. Typically, the density of the sheet material will range from 0.04 g/cm3 to about 1.9 g/cm3. The soft graphite sheet material produced as described above generally exhibits an appreciable degree of anisotropy due to the alignment of the graphite particles parallel to the main opposite parallel surfaces of the sheet, while making the anisotropy The degree is increased immediately after the sheet material is pressed at the roller-13-1375493 to increase the density. In the rolled anisotropic sheet material, the thickness (i.e., perpendicular to the surfaces of the opposing parallel sheets) includes a "C" direction and directions extending along the length, and the width (i.e., along Or parallel to the major surfaces, including the "a" direction, and generally in terms of size, the thermal properties of the sheets in the "c" and "a" directions are very different. [Invention] Accordingly, the present invention It is an object to provide an improved structure for a channel in a graphite heat spreader. Another object of the present invention is to provide an improved method for fabricating a graphite heat spreader having a hot aisle. Another object of the present invention is to provide a flanged passage, It has a flange that engages one of the major surfaces of the graphite heat spreader to improve heat transfer between the channel and the graphite heat spreader. Another object of the present invention is to provide an inexpensive one. A low cost method of pushing a nut to make a heat spreader with a channel. Another object of the present invention is to provide a structure for constructing a graphite heat spreader having a flush heat path Another object of the present invention is to provide a graphite heat spreader having a plurality of heat passages and a coating layer that provides structural integrity to facilitate the fixation of the heat spreader. Still another object of the present invention is to provide A method of forging a hot aisle together with a graphite heat disperser. For those skilled in the art, the present invention can be easily and clearly understood after reading the disclosure and referring to the accompanying drawings in the accompanying drawings. Objects, Features, and Advantages [Embodiment] The present invention provides a preferred structure and method for producing graphite heat having a hot runner. In one embodiment, the flange passage is provided with at least one flange that is thermally dispersed with graphite. One of the planar surfaces of the graphite planar element is engaged. The flange channel can be pushed through the nut or can be fastened to the graphite by being rigidly connected to the second flange of the passage. On the disperser, therefore, this includes at least one flange and a second flange or a push nut that is above the surface of the graphite thermal element element. In another embodiment a flush heat The track, which is in the final position, is flush with the major planar surfaces of the graphite heat piece. Various preferred techniques for making the embodiment will be provided. Two embodiments preferably relate to a method of manufacture in which Press fit into a hole of the same shape but slightly smaller and penetrating through the element so as to provide a close fit between the stem and the through hole of the graphite. One of the special uses of such a graphite heat spreader is The circuit board assembly is used in combination with the heat dispersing function of the heat disperser layer on the heat path (ie, the heat path) between the heat generating component (the heat path) and the heat dissipator layer. Correctly, with the use of this thermal path, the graphite-based heat spreader can provide improved heat dispersion, even comparable to the use of aluminum or other and other dispersers. The flange channel is fully extended, and the element is provided by the elemental element. The printed circuit of the two elements of the graphite column surface element is printed by the LED. The use of the true layer of copper heat points -15- 1375493, also has the advantage of weight reduction. By "circuit assembly" is meant an assembly comprising one or more electronic circuits positioned on a dielectric material, and may include a laminate in which one or more of the circuits are sandwiched Between the dielectric layers. Specific examples of circuit assemblies are printed circuit boards and flexible circuits, as is well known to those skilled in the art. Before explaining the method of the present invention for improving existing materials, the graphite and how it is formed into a flexible sheet will be briefly described in the first place, and the soft sheets will become the main heat dispersers for constituting the product of the present invention. A microcrystalline version of graphite-based carbon that includes atoms that are covalently bonded in the plane of the flat stack and that bond the planes to a weaker bond. By treating the graphite particles (such as natural graphite flakes) with an intercalant such as a solution of sulfuric acid and nitric acid, the crystalline structure of the graphite will act to form a compound of graphite and the intercalant. The treated graphite particles are hereinafter referred to as "intercalated graphite particles". After exposure to high temperatures, the intercalating agent in the graphite then decomposes and volatilizes, which causes the intercalated graphite particles to be sized along the "C" direction (ie, along the direction perpendicular to the crystalline surfaces of the graphite). A type like the accordion expands to 80 times or more of its original volume. The exfoliated graphite particles are worm-like in appearance and are therefore commonly referred to as aphids. The worms can be compressed together into a flexible sheet which, unlike the original graphite sheet, can be formed and cut into various shapes. Graphite starting materials suitable for use in the present invention include highly graphitized carbonaceous materials which can be inserted into organic and inorganic acids and halogens and which then swell when exposed to heat under the exposure of 16-16775493. These highly graphitized carbonaceous materials optimally have a degree of graphitization of about 1.0. As used herein, the term "degree of graphitization j" refers to g値 obtained according to the following formula: = 3.45 X d(002) g = 0.095 where d(002) is in units of Angstrom The spacing between the graphite layers of the carbon in the crystal structure is measured. The spacing between the graphite layers is measured by standard X-ray diffraction techniques, corresponding to (002), (〇〇4), and (〇〇6) meters. The position of the diffraction peaks of the Miller Indices is measured, and the standard least squares technique is used to derive the spacing, which minimizes the total error of all of these peaks. Examples of highly graphitized carbonaceous materials are included from various sources. Natural graphite taken from the site, as well as other carbonaceous materials, such as graphite prepared by chemical vapor deposition, high temperature pyrolysis of polymers, or crystallization and the like. Natural graphite is the best. The graphite starting material used may comprise a non-graphite component as long as the crystal structure of the starting materials maintains the desired degree of graphitization and is exfoliable. In general, any carbonaceous material is suitable for use with the present invention, and Carbonaceous The crystal structure of the material has a desired degree of graphitization and is exfoliable. Such graphite preferably has a purity of at least about 80% by weight. More preferably, the graphite used in the present invention has an at least about 94. The purity of %. In the preferred embodiment, the graphite used will have a purity of at least about 98%. A common method for making graphite sheets is described in US Patent No. 3,404,061 to Shane et al. The disclosure is incorporated herein by reference. In a typical implementation of the method of Shane et al., Day-17-1375493 graphite flakes are dispersed by a solution comprising, for example, nitric acid and a mixture. Intercalated, and most advantageously tied to 100 parts by weight of graphite flakes (pph) from about 20 to about 300 parts of the intercalation standard. The intercalation solution includes oxidizing agents and other agents known in the art. Including: an oxidizing agent and an oxidizing mixture, such as a solution of an acid, potassium chlorate, chromic acid, potassium permanganate, potassium chromate, potassium dichromate, an acid, and the like; or a mixture such as concentrated nitric acid and chromic acid chromic acid and phosphorus , sulfuric acid and nitric acid; or a strong organic mixture such as trifluoroacetic acid; and a strong oxidizing agent dissolved in the organic acid. Alternatively, electricity is used to cause oxidation of graphite. Chemicals that can be introduced into the stone by electrolytic oxidation. Including sulfuric acid and other acids. In a preferred embodiment, the intercalating agent is a solution of sulfuric acid or a mixture of sulfuric acid and carbon and an oxidizing agent, wherein the oxidizing agent is nitric acid, acid, chromic acid, potassium permanganate 'hydrogen peroxide , iodic acid, periodic acid, or the like. Although not preferred, the intercalation solution may comprise: a metal halide such as ferric chloride, and ferric chloride mixed with sulfuric acid; or a halide as bromine and sulfuric acid The amount of bromine of the solution, or the bromine intercalation solution in an organic solvent, may range from about 20 to about 35 Opph and more typically from about 40 to about 1 60 pph. After being intercalated, any excess solution is discharged from the sheets and washed with water. Alternatively, the amount of intercalation solution can be limited to between about 10 and 40 pph, which will allow the water wash step to be eliminated as taught and suggested in U.S. Patent No. 4,895,713, the disclosure of which is incorporated herein by reference. In this article, sulphuric acid is intercalated with a perchloric acid salt in the liquid permeate, and other substances, such as a slab, such as a lamella sheet, are patented to introduce -18-1375493 graphite treated with an intercalation solution. The granules of the flakes can be contacted, for example by mixing, with a reducing organic agent selected from the group consisting of alcohols, saccharides, aldehydes and esters which are oxidizable in the temperature range from 25 ° C to 125 ° C. The surface film of the intercalation solution reacts. Suitable specific organic agents include: ί-hexanol, octadecyl alcohol, 1-octanol, 2-octanol, decyl alcohol, 1,10-decanediol, furfural, 1-propanol, 1,3 propanediol , ethylene glycol, polypropylene glycol, glucose, fructose, lactose, sucrose, potato starch, ethylene glycol monostearate, diethylene glycol dibenzoate, propylene glycol monostearate, glyceryl monostearate , dimethyl carboxylic acid, diethyl carboxylic acid, methyl formate, ethyl formate, ascorbic acid, and compounds derived from lignin, such as sodium lignosulfonate. The amount of organic reducing agent is suitably from about 0.5 to 4% by weight of the graphite flake particles. The use of expansion aids prior to intercalation, during intercalation, or just after intercalation may also provide improvements. Among these improvements may be a reduced peel temperature and an increased expansion volume (also referred to as "worm volume"). The swelling aid herein will preferably be an organic material which is sufficiently soluble in the intercalation solution to achieve expansion improvement. More strictly speaking, such organic materials containing carbon, hydrogen and oxygen (preferably exclusively) can be used. Carboxylic acids have been found to be particularly effective. A suitable carboxylic acid which may be used as an expansion aid may be selected from aromatic, aliphatic or alicyclic, linear or branched, saturated and unsaturated monocarboxylic acids, dicarboxylic acids and polycarboxylic acids having at least one One carbon atom (preferably up to 15 carbon atoms) can be dissolved in the intercalation solution in an amount effective to provide a predictable improvement for one or more exfoliation patterns. A suitable organic solvent can be used to improve the solubility of the organic expansion aid -19-1375493 in the intercalation solution. Representative examples of saturated aliphatic carboxylic acids are those such as those having H (CH small COOH), wherein n is from hydrazine to the word, and the acids include: formic acid, acetic acid, propionic acid, butyl hydrazine ~ hydrazine SP ff Ό - itU Λ, I -JU- = rr mr«rr —ϋ r^- .t>r irju LJ defeat' Han Sheng TIB net Ί 书 ° blade, WJ Md 0T is now Han Ying Ί king? Cross limbs such as alkyl ester ) instead of carboxylic acid. The representative of the alkyl ester is ethyl formate. Sulfuric acid, nitric acid and other conventional aqueous intercalants are all capable of decomposing into water and carbon dioxide. Therefore, the expansion aid of formic acid is preferably contacted with the graphite flakes while the graphite flakes are immersed in the aqueous plug. The dicarboxylic acid is represented by a 2- to aliphatic fatty dicarboxylic acid, especially oxalic acid, fumaric acid maleic acid, succinic acid, glutaric acid, adipic acid, 1,5-penta-1, 6-hexane dicarboxylic acid, 1,10-decane dicarboxylic acid, cyclohexane-1 and aromatic dicarboxylic acids, such as phthalic acid or terephthalic acid represented by dimethyl carboxylic acid and carboxylic acid Diethyl acid. a cycloaliphatic acid cyclohexanedicarboxylic acid, and the representative of the aromatic carboxylic acid is benzoin o-aminobenzoic acid, hydrazine-p-aminobenzoic acid, salicylic acid, hydrazine-, carboxylic acid, methoxyl and ethoxylate Kean acid, acetamethylene acetamide benzoic acid, phenylacetic acid and naphthoic acid. The hydroxyaromatics are p-hydroxybenzoic acid, 3-hydroxy-1-naphthoic acid, 3-hydroxy-hydroxy-2.naphthoic acid, 5-hydroxy-1-naphthoic acid, 5-hydroxy-2-naphthoic acid naphthalic acid, and 7-Hydroxy-2-naphthoic acid. An important one of the polycarboxylic acids is that the intercalation solution is aqueous and preferably contains from 1 to an adjuvant. This amount will effectively increase the peeling. Among them, there are chemical formulas of about 5 acid, valeric acid, /%-£±_*» / - ✓ seven AT king 籾L薙 methyl ester and formic acid with formic acid and other sensitive layering agents before i 12 carbon atoms , malonic acid, alkyl dicarboxylic acid, 4-dicarboxylic acid, acid. Representative of alkyl esters are acids, naphthoic acid, m- and p-toluidine benzoin and acid acids 2-naphthoic acid, 4-, 6-hydroxy-2-systemic citric acid. 10% expansion expansion aid -20- 1375493

於浸沒入水性插層溶液中之前或之後與石墨薄 之實施例中,膨脹輔助劑可藉由適當裝置(例贫 合機)而與石墨相混合,其通常係佔石墨薄片之 約0.2%至大約10%之量。 在插入石墨薄片後,且在將被塗以插層劑之 墨薄片與有機還原劑混合後,該混合物被暴露宅 125°C之溫度範圍中,以便可促進還原劑與插層 反應。加熱期間將可長達大約20小時,而在上 之較高溫度處則只需例如至少大約10分鐘之較 間。在諸較高之溫度處可使用半小時或更少之時 依次爲10至25分鐘。 被如此處理之石墨顆粒有時被稱爲「已插層 粒」。當暴露在高溫下(例如至少大約160°C, 約700°C至10 00°C,及更高之溫度),已插層石 沿著” c ”方向(亦即沿著垂直於諸構成石墨顆 平面的方向)以一類似手風琴之型式膨脹至其原 80至1 000倍或更多倍大。諸經膨脹(亦即經剝 墨顆粒在外觀上係呈蠕蟲狀,而因此普遍被稱爲 諸蠕蟲可被一起壓縮成軟性板片,其不像原始 片,而是可被成形且切割成各種不同形狀。 具有良好處理強度之軟性石墨板片及箔片 合的,且適於例如藉由輥壓而被壓縮至—大約在 至3.75 mm間之厚度,及一在每立方公分上具有 公克(g/cm3)之典型密度。如美國第5,902,762 片相接觸 丨,V型混 重量的大 已插層石 E 25。(:至 劑塗層之 述範圍內 短加熱時 間,例如 之石墨顆 特別是大 墨顆粒可 粒之微晶 始體積的 離)之石 橋蟲。此 之石墨薄 係相互黏 0.07 5mm 0.1 至 1.9 號專利中 -21- 1375493 所述(該案以引用之方式被倂合於本文中),佔重量之 1.5至30%的陶瓷添加劑可與已插層石墨薄片相混合,以 便可在最終軟性石墨產品中提供增大之樹脂植入。此諸添 加劑包括陶瓷纖維顆粒,其具有一約爲0.15至1.5 mm間 之長度。諸顆粒的寬度係適當地從0.04至0.004mm。諸陶 瓷纖維顆粒對石墨係不起反應且不黏著的,並在溫度達到 約1100°C,較佳約14 00°C或更高係穩定的。適當之陶瓷 纖維顆粒係由浸軟石英玻璃纖維、碳及石墨纖維、氧化 鉻、氮化硼、碳化矽及氧化鎂纖維、天然生成礦物纖維, 諸如偏矽酸鈣纖維、矽酸鈣鋁纖維、氧化鋁纖維,及其他 類似物所構成。 上述用於插層及剝離石墨薄片之方法可藉由石墨薄 片在石墨化溫度處(亦即,在大約3000°C及以上之範圍 內之溫度)之預處理,以及藉由在插層劑中包含潤滑添加 劑而被有利地加強,此如第PCT/US02/39749號國際專利 申請案中所述,其揭示內容以引用之方式被倂於本文中。 當石墨薄片隨後經歷插層及剝離時,石墨薄片之預處 理或退火將導致顯著增加之膨脹(亦即,膨脹體積增加至 3 00 %或更大)。確實地,與無退火步驟之相似處理方式相 比較,令人滿意地,在膨脹上之增加係至少大約50%。用 於退火步驟之溫度應不可顯著低於3000°C,此乃因爲連較 低100°C之溫度都會導致實質上減小之膨脹。 本發明之退火被進行一段足以導致薄片之時間,而此 薄片在進行插層及隨後之剝離之後隨即具有一增大之膨 -22- 1375493 脹度。通常所需時間係1小時或更多,較佳係1至3小時, 且最有利地係在惰性環境中進行。爲求最大利益結果,經 退火之石墨等片將亦可經歷在本藝中係爲習知之其他可 增大膨脹度的方法,亦即插層法,其包含一有機還原劑、 一諸如舍機酸之插層輔助劑、及在插層完成後之表面活性 劑沖洗。此外,爲求最大利益結果,插層步驟可被重複。 本發明之退火步驟可在一感應爐或其他此類設備中 被進行,如同在石墨化技藝中所熟知且明瞭的;至於此處 所用之溫度係在3000 °C之範圍內,而此溫度應位於在石 墨化程序中所遭遇之溫度範圍中的上端溫度處。 因爲已觀察到諸利用已進行預插層退火處理之石墨 所製造之蠕蟲有時可能「成塊」在一起,其可能負面地影 響衝擊面釋重量均一性,故可協助成形「自由流動」之蠕 蟲的添加劑係高度必要的。將潤滑添加劑加入插層溶液中 有助於蠕蟲可更均勻地分布橫跨壓縮設備之機床(例如一 輪壓機工作站之機床),其傳統上被用於將石墨蠕蟲壓縮 (輥壓)成軟性石墨板片。因此,最終所得之板片具有較 高之面積重均一性及較大之抗拉強度。潤滑添加劑較佳係 爲一長鍵碳氧化合物,更佳係具有至少大約10個碳之碳 氧化合物。即使存在其他之功能群,亦可使用其他具有長 鍵碳氧化合物群之有機化合物》 更佳地,潤滑添加劑係油,最佳係爲礦油,尤其是考 量到礦油較不易腐敗及發臭,對於需長期儲放者,此係爲 一項重要之考量。將可注意到的,已於上文中詳述之某些 -23- 1375493 膨脹輔助劑亦符合潤滑添加劑之定義。當這些材料被用作 膨脹輔助劑時,則並不需要在插層劑中包含—個別之潤滑 添加劑。 潤滑添加劑在插層劑中係以至少約1.4pph之量存 在’較佳係至少約i.Spph»雖然包潤滑添加劑含量之上限 並不如下限般重要,但潤滑添加劑含量在較大於約4pph 之水平下似乎並沒有任何顯著之附加利益。 本發明之軟性石墨板片,如果必要,可利用再經硏磨 軟性石墨板片之顆粒而非剛膨脹完成之蠕蟲,此如美國第 6,673,289號專利案中所述,其揭示內容以引用之方式被 倂於本文中。諸板片可爲剛新完成之板片材料、回收之板 片材料、廢棄之板片材料、或任何其地適當之來源。 本發明之方法亦可使用未用過之材料與回收之材料 的混合品。 回收材料之來源材料可爲板片或板片之經修剪掉的 部分’其已如上述般地被壓縮模製,或者可爲已經被例如 預先輪壓輥所壓縮但尙未被植入樹脂之板片。此外,來源 材料可爲已被植入樹脂但尙未固化之板片或板片之經修 剪掉的部分’或已被植入樹脂且已固化之板片或板片之經 修剪掉的部分。來源材料亦可爲回收之軟性石墨質子交換 膜(PEM )燃料電池組件,諸如流程板或電極。各種石墨 來源中之每一者均可被使用作爲天然石墨薄片,或可用與 天然石墨薄片相混合。 一旦軟性石墨板片之來源材料可取得,其接著便可用 -24- 1375493 習知之方法或裝置(諸如一噴射硏磨機、氣磨機、攪拌機 等)予以硏成粉末,以便可製成顆粒。較佳地,大多數顆 ' 粒均具有一可使其通過美國國家標準20篩目之直徑;更 . 佳地,大部分(較大於約20%,最佳係較大於約50% )將 • ·、*Ό^ ·、Γ3 -ΧΛ. I 凡I I 民I IL?C Λ**» Λ Λ f—» ^=» >.», ».· nrrri ♦»· , »—» 恶te迪迴关幽幽豕惊罕 iSU師日。寂住吧,睹賴祖Μ有一 ' 較大於約美國國家標準20篩目之顆粒大小。最好可在軟 性石墨板片正在被硏成粉末且同時被植入樹脂之時將其 冷卻,以便可避免樹脂系統在硏成粉末期間受到熱損壞。 • 經硏成粉末之顆粒的大小可被選定,以便可平衡具有 所要熱特性之石墨物品的可加工性及可成形性。因此,較 小顆粒將導致一種較易於加工及/或成形之石墨物品,而 較大顆粒將導致一種具有較高之異向性且因此具有較大 之平面內電及熱傳導性之石墨物品。 一旦來源材料被硏成粉末,其接著被再膨脹。該再膨 脹可藉由利用上述之插層及剝離法,以及如頒予Shane等 人之美國第3,404,06 1號專利與頒予Greinke等人之美國第 ^ 4,895,7 1 3號專利中所敘述的那些方法而發生。 —般而言,在插層之後,諸顆粒藉由在爐中加熱諸已 . 插層顆粒而被剝離。在此剝離步驟期間,已插層天然石墨 薄片可被加入回收之已插層顆粒中。較佳地,在再膨脹步 驟期間,諸顆粒被膨脹成具有一在至少約lOOcc/g及達約 3 5 0cc/g或更大之範圍中的比體積。最後,在再膨脹之後, 諸已再膨脹之顆粒可被壓縮成軟性板片,如下文中所述。 根據本發明,如上述般被製備之石墨板片(其通常具 -25- 1375493 有約0.075mm至約1 0mm之厚度,但其可例如按所用之壓 縮度而改變)可用樹脂予以處理,而經吸收的樹脂在固化 之後可加強板片之抗濕及操作強度(亦即剛性),並且「固 定j板片之形態。在環氧植入石墨板片內之樹脂的量必須 爲一足以確保最終組合及固化層狀結構係密集且具有黏 著力之量,而與密集化石墨結構相關聯之異向性熱傳導率 則尙未被不利地影響。適當之樹脂含量較佳係至少佔重量 之約5%,更佳地係佔重量之約10至35%,且適當地可達 佔重量之約6 0 %。 被發現尤有利於實施本發明之樹脂包括:丙烯酸基、 環氧基及酚醛基樹脂系統、氟基聚合物、或其混合物。適 當之環氧樹脂系統包括那些以雙酚A (DGEBA)之環氧樹 脂爲基者,以及其他多功能之樹脂系統;可被使用之酚醛 樹脂包含Resole及Novolac型酚醛樹脂。可選擇地,除了樹 脂外,軟性石墨可被植入纖維及/或鹽類;或軟性石墨可 被植入纖維及/或鹽類以取代樹脂。除此之外,反應或不 反應之添加劑可與樹脂系統一起使用,以便可修正性質 (諸如黏著性、材料流動性、厭水性等)。 一種用於連續成形樹脂且經壓縮之軟性石墨材料的 設備被揭示在頒予Mercuri, Capp,Warddrip及Weber之美 國第6,706,400號專利案中,其揭示內容以引用之方式被 倂於本文中。 有利地,當由經壓縮之已剝離石墨顆粒所構成之板片 被浸漬樹脂時,在壓縮步驟(例如藉由輪壓)之後,經浸 -26- 1375493In embodiments where the graphite is thin before or after immersion in the aqueous intercalation solution, the expansion aid may be mixed with the graphite by a suitable apparatus (eg, a lean machine), which typically comprises about 0.2% of the graphite flakes. About 10% of the amount. After the graphite flakes are inserted, and after the ink flakes to be coated with the intercalant are mixed with the organic reducing agent, the mixture is exposed to a temperature range of 125 ° C to promote the reaction of the reducing agent with the intercalation. The heating period can be as long as about 20 hours, while at the upper temperature it is only necessary, for example, at least about 10 minutes. It can be used at higher temperatures for half an hour or less, followed by 10 to 25 minutes. The graphite particles thus treated are sometimes referred to as "intercalated particles". When exposed to high temperatures (eg, at least about 160 ° C, about 700 ° C to 100 ° C, and higher temperatures), the intercalated stone is along the "c" direction (ie, perpendicular to the constituent graphite) The direction of the plane is expanded to an original 80 to 1,000 times or more in an original accordion type. The swells (i.e., the smear-off particles are worm-like in appearance, and thus are generally referred to as worms that can be compressed together into a soft sheet which, unlike the original sheet, can be shaped and cut In various shapes. Soft graphite sheets and foils with good processing strength, and are suitable for being compressed, for example, by rolling, to a thickness of between about 3.75 mm, and one per cubic centimeter Typical density of grams (g/cm3). For example, the 5th, 902,762 pieces of the United States contact 丨, the V-type mixed weight of the large intercalated stone E 25. (: to the coating surface within the range of short heating time, such as graphite In particular, the large ink particles can be granulated by the microcrystalline starting volume of the stone bridge worm. The graphite thin system is mutually viscous 0.07 5mm 0.1 to 1.9 patents as described in 21- 1375493 (the case is incorporated by reference) As used herein, 1.5 to 30% by weight of the ceramic additive can be mixed with the intercalated graphite flakes to provide increased resin implantation in the final soft graphite product. The additives include ceramic fiber particles. Has a value of about 0. The length between 15 and 1.5 mm. The width of the particles is suitably from 0.04 to 0.004 mm. The ceramic fiber particles are non-reactive and non-sticky to the graphite and are at a temperature of about 1100 ° C, preferably about 14 00. °C or higher is stable. Suitable ceramic fiber particles are made of macerated quartz glass fiber, carbon and graphite fiber, chromium oxide, boron nitride, tantalum carbide and magnesia fiber, naturally occurring mineral fiber, such as abietic acid. Calcium fiber, calcium aluminum silicate fiber, alumina fiber, and the like. The above method for intercalating and stripping graphite flakes can be performed by graphite flakes at a graphitization temperature (ie, at about 3000 ° C) And the pretreatment of the temperature in the range of the above, and the reinforcing agent is advantageously enhanced by the inclusion of a lubricating additive in the intercalating agent, as disclosed in the International Patent Application No. PCT/US02/39749, the disclosure of which is incorporated herein by reference. The manner of reference is incorporated herein. When the graphite flakes subsequently undergo intercalation and exfoliation, pretreatment or annealing of the graphite flakes will result in a significantly increased expansion (i.e., the expanded volume is increased to 300% or greater). Indeed, the increase in expansion is satisfactorily at least about 50% compared to a similar treatment without an annealing step. The temperature used in the annealing step should not be significantly lower than 3000 ° C, because A temperature as low as 100 ° C will result in a substantially reduced expansion. The annealing of the present invention is carried out for a period of time sufficient to cause the sheet, and the sheet then has an increased swelling after the intercalation and subsequent stripping - 1375493. The required time is usually 1 hour or more, preferably 1 to 3 hours, and most advantageously carried out in an inert environment. For the best benefit, the annealed graphite sheet will also be experienced. In the art, it is a conventional method for increasing the degree of expansion, that is, an intercalation method comprising an organic reducing agent, an intercalation aid such as an acid, and surface activity after the intercalation is completed. Flush. In addition, the intercalation step can be repeated for maximum benefit results. The annealing step of the present invention can be carried out in an induction furnace or other such apparatus as is well known and clarified in the art of graphitization; as far as the temperature used herein is in the range of 3000 ° C, the temperature should be Located at the upper end temperature in the temperature range encountered in the graphitization procedure. It has been observed that worms made from graphite that has been subjected to pre-intercalation annealing may sometimes "cluster" together, which may negatively affect the uniformity of impact surface release weight, thus assisting in the formation of "free flow" The worm additive is highly necessary. The addition of a lubricating additive to the intercalation solution helps the worm to more evenly distribute the machine tool across the compression device (eg, a machine tool of a press workstation), which has traditionally been used to compress (roll) the graphite worm into Soft graphite sheet. Therefore, the resulting sheet has a higher area uniformity and a larger tensile strength. The lubricating additive is preferably a long bond carbon oxide, more preferably a carbon oxide having at least about 10 carbons. Even if other functional groups exist, other organic compounds having long-chain carbon oxide groups can be used. More preferably, the lubricating additive is oil, and the best is mineral oil, especially considering that the mineral oil is less prone to spoilage and stinky. For those who need long-term storage, this is an important consideration. It will be noted that certain -23-1375493 expansion aids, which have been detailed above, also meet the definition of a lubricating additive. When these materials are used as expansion aids, it is not necessary to include an individual lubricating additive in the intercalant. The lubricating additive is present in the intercalating agent in an amount of at least about 1.4 pph. Preferably, at least about i.Spph is acceptable. Although the upper limit of the encapsulating lubricating additive content is not as important as the following, the lubricating additive content is greater than about 4 pph. It does not seem to have any significant additional benefits. The soft graphite sheet of the present invention, if necessary, can be used to temper the granules of the soft graphite sheet instead of the newly expanded worm, as described in U.S. Patent No. 6,673,289, the disclosure of which is incorporated herein by reference. The way is to be included in this article. The sheets may be freshly finished sheet material, recycled sheet material, discarded sheet material, or any suitable source thereof. The method of the present invention may also use a mixture of unused materials and recycled materials. The source material of the recycled material may be the trimmed portion of the sheet or sheet 'which has been compression molded as described above, or may have been compressed by, for example, a pre-roller roll but not implanted with resin. Plate. In addition, the source material may be the trimmed portion of the sheet or sheet that has been implanted with the resin but not cured, or the trimmed portion of the cured sheet or sheet that has been implanted with the resin. The source material can also be a recycled soft graphite proton exchange membrane (PEM) fuel cell assembly, such as a flow plate or electrode. Each of the various graphite sources can be used as a natural graphite flake or can be mixed with natural graphite flakes. Once the source material of the soft graphite sheet is available, it can then be powdered by a conventional method or apparatus (e.g., a jet honing machine, a gas mill, a blender, etc.) so that it can be made into granules. Preferably, most of the particles have a diameter that allows them to pass the US National Standard 20 mesh; more preferably, most (greater than about 20%, the best system is greater than about 50%) will ·,*Ό^ ·,Γ3 -ΧΛ. I 凡II民I IL?C Λ**» Λ Λ f—» ^=» >.», ».· nrrri ♦»· , »—» Back to the secluded stunned iSU teacher day. Silence, 睹 Μ Μ has a 'larger than about the United States national standard 20 mesh size. It is preferable to cool the soft graphite sheet while it is being powdered and simultaneously implanted with the resin so that the resin system can be prevented from being thermally damaged during the powder formation. • The size of the granulated particles can be selected to balance the processability and formability of the graphite article having the desired thermal properties. Thus, smaller particles will result in a graphite article that is easier to process and/or shape, while larger particles will result in a graphite article that has a higher anisotropy and therefore greater in-plane electrical and thermal conductivity. Once the source material is broken into powder, it is then re-expanded. The re-expansion can be utilized by the use of the above-described intercalation and exfoliation methods, as well as in U.S. Patent No. 3,404,06, issued to Shane et al. The methods described are occurring. In general, after intercalation, the particles are peeled off by heating the intercalated particles in a furnace. During this stripping step, the intercalated natural graphite flakes can be added to the recovered intercalated particles. Preferably, during the re-expansion step, the particles are expanded to have a specific volume in the range of at least about 100 cc/g and up to about 350 cc/g or greater. Finally, after re-expansion, the re-expanded particles can be compressed into flexible sheets, as described below. According to the present invention, a graphite sheet prepared as described above (which usually has a thickness of from -25 to 1375493 of from about 0.075 mm to about 10 mm, but which may be changed, for example, according to the degree of compression used) may be treated with a resin, and The absorbed resin enhances the moisture resistance and handling strength (ie, rigidity) of the sheet after curing, and "fixes the shape of the sheet. The amount of resin in the epoxy-implanted graphite sheet must be sufficient to ensure The final combined and cured layered structure is dense and has an amount of adhesion, while the anisotropic thermal conductivity associated with the dense graphite structure is not adversely affected. Suitable resin content is preferably at least about the weight. 5%, more preferably from about 10 to 35% by weight, and suitably up to about 60% by weight. Resins which have been found to be particularly advantageous for the practice of the invention include: acrylic, epoxy and phenolic groups Resin systems, fluorine-based polymers, or mixtures thereof. Suitable epoxy resin systems include those based on bisphenol A (DGEBA) epoxy resins, as well as other multifunctional resin systems; phenolic resins that can be used include Res Ole and Novolac type phenolic resin. Alternatively, in addition to the resin, soft graphite may be implanted into fibers and/or salts; or soft graphite may be implanted with fibers and/or salts to replace the resin. Reactive or non-reactive additives can be used with resin systems to modify properties such as adhesion, material flow, water repellency, etc. A device for continuously forming resin and compressing soft graphite material is revealed In U.S. Patent No. 6,706,400 to Mercuri, Capp, Wardrip, and Weber, the disclosure of which is incorporated herein by reference. At the time of the compression step (for example, by means of wheel pressure), after immersion-26-1375493

漬之材料被切割成適當大小之切片,並被 中,在此處該樹脂將在一提高之溫度下被@ 性石墨薄片可以一疊層板之型式被運用,其 別之石墨板片一起堆疊在壓機中而被製備β 被用於壓機中之温度必須足以確保石 壓力下被密集化,同時該結構之熱性質並不 響。一般而言,此將需要一至少大約爲90 通常可達到大約200°C。最佳地,固化係右 至200° C之溫度範圍下。用於固化之壓力將 溫度之函數,但將足以確保石墨結構在不會 性質形成不利影響下被密集化。一般而言, 利性,將要利用到可將該結構密集化至所要 需壓力。此一壓力將通常爲至少約7Mpa ( 英吋1000磅),且不需超過約35Mpa(相當 而更普遍地係從約7至約21Mpa( 1000至 化時間可依據樹脂系統及所用之溫度與壓j 常係在約0.5小時至2小時之範圍內。在固 材料被發現具有一至少約爲1.8g/cm3之密g 從約 1.8g/cm3 至 2.0g/cm3。The stained material is cut into appropriately sized slices and placed therein, where the resin is applied at a raised temperature by a @ graphite sheet that can be stacked in a laminate form, with other graphite sheets stacked together The temperature at which the beta is produced in the press is used in the press must be sufficient to ensure that the stone pressure is densified while the thermal properties of the structure are not loud. In general, this would require a minimum of about 90 and typically up to about 200 °C. Most preferably, the cure is from the right to a temperature range of 200 ° C. The pressure used for curing will be a function of temperature, but will be sufficient to ensure that the graphite structure is densified without adversely affecting the properties. In general, the benefits will be exploited to intensify the structure to the required pressure. This pressure will typically be at least about 7 MPa (1000 lbs) and no more than about 35 MPa (comparably and more generally from about 7 to about 21 MPa (1000 liters depending on the resin system and the temperature and pressure used). j is usually in the range of about 0.5 hours to 2 hours. The solid material is found to have a density of at least about 1.8 g/cm3 from about 1.8 g/cm3 to 2.0 g/cm3.

有利地,當軟性石墨板片本身呈現爲一 在於經植入之板片中的樹脂將可作爲疊層枝 而,根據本發明之另一實施例,在軟性板片 之前,經輪壓及植入之軟性石墨板片將先被 劑。適當之黏著劑包括環氧基 '丙烯酸基S 放置在一壓機 3化。此外,軟 可藉由將諸個 ζ。 墨結構在固化 會被不利地影 °C之溫度,且 :從大約150°C 多少係爲所用 對該結構之熱 爲了製造之便 程度之最小必 相當於每平方 於 5000psi), 3000psi)。固 ]而改變,但通 化完成之後, f,且通常係在 -疊層板時,存 ί之黏著劑。然 被堆疊且固化 塗層以一黏著 L酚醛基樹脂。 -27- 1375493 被發現尤有利於實施本發明之酚醛樹脂包括:Resole型及 Novolak型酚醛樹脂。 雖然經由輪壓或模製而形成板片係爲最常用於成形 可用以實施本發明之石墨材料的方法,但亦可使用其他之 成形法。 本發明之經溫度及壓力固化的石墨/樹脂複合物提供 了一種石墨基複合材料,其在只有銅重量之一小部分下具 有可比得上或超越銅之熱傳導率的平面內熱傳導率。更具 體而言,諸複合物具有至少約SOOW/n^K之平面內熱傳導 率,同時具有小於約15W/m°K之穿透平面熱傳導率,更 佳地係小於約10W/m°K。 現參照圖式,尤其參照第1圖,一根據本發明而將一 石墨熱分散器與若干熱通道相併合之電路總成被標示以 元件符號10。電路總成10包括至少一介電質層20及一熱 分散器30,其中熱分散器30鄰接介電質層20。較佳地, 熱分散器30包括至少一由經壓縮之已剝離石墨顆粒所構 成之板片,其係如前述般地被製備成。電路總成10通常 係爲一印刷電路板或軟性電路,但亦可包括例如一位於介 電質層20上之導電墨水式印刷或絲網圖案。 電路總成10通常亦包括一傳統上由銅所製成之電路 40於其上,其藉由光罩蝕刻法、濺鍍法、網版印刷法或 其他類似方法而被鋪設於介電質層20上。如前所提及, 電路40亦可由導電墨水所構成,其係藉由例如印刷或絲 網方法而被鋪設於介電質層20上。 -28- 1375493 介電質層20可爲在印刷電路板工業中所習知者,諸 如:具有樹脂之玻璃纖維(FR-4 ),較佳係成形爲一疊層 板;聚四氟乙烯(PTFE ),市面上可購得之鐵氟龍品牌材 料:及擴張性PTFE,有時被標示爲ePTFE;以及上述項 目之浸漬或吸入樹脂型式者。此外,介亀貧層20可爲一 聚合物’諸如聚亞醯胺或聚酯,如同使用於軟性電路之成 形者。介電質層20亦可包括陶瓷材料,諸如氮化鋁、氧 化鋁、礬土,其以一分離層之型式呈現,或經由例如陽極 處理、汽相沉積、或火焰熔射法而被鋪設於一基底層(例 如熱分散器層30)上;陽極處理之使用係特別與熱分散 器層30係爲鋁之場合有關的。 此外,在某些情況下,最好是至少部分地包封住熱分 散器層30,或提供一包覆層於熱分散器層30之表面上, 以便可防止微粒物質自熱分散器層30上剝落。例如,某 些人的看法係石墨材料易於成片剝落。無論是否事實,提 供一由例如Mylar之聚合材料(通常在厚度小於20微米 之等級)所構成之包覆層以防止成片剝落將可與上述之看 法相關聯。在此情形下,該聚合材料可當作電路總成10 之介電質層20’因爲所使用之材料可爲不導電,且薄到 足以不實質地干擾熱傳導至熱分散器層30。或者,一經 陽極處理之銘層亦可被用以抑制剝落,而同時該陽極處理 層亦可作爲介電質層20。 較佳地’熱分散器層30在厚度上係從大約0.25 mm至 大的25mm’更佳係從大約〇.5mm至大的14mm,且包括至 -29- 1375493Advantageously, when the soft graphite sheet itself is presented as a resin in the implanted sheet, it can be used as a laminate, according to another embodiment of the invention, before the soft sheet, by wheel pressing and planting The soft graphite sheet will be the first agent. Suitable adhesives include epoxy-acrylic-based S placed in a press. In addition, soft can be made by smashing. The temperature of the ink structure will be adversely affected by the temperature, and: from about 150 ° C to the heat used for the structure, the minimum degree of manufacturing must be equivalent to 5000 psi per square meter, 3000 psi). Solid, but changed, but after the completion of the pass, f, and usually attached to the laminated board, the adhesive is stored. The layers are then stacked and cured to adhere the L phenolic based resin. -27- 1375493 Phenolic resins which have been found to be particularly advantageous for the practice of the invention include: Resole type and Novolak type phenolic resin. Although the formation of the sheet by means of wheel pressing or molding is the most commonly used method of forming the graphite material useful in the practice of the present invention, other forming methods can be used. The temperature and pressure cured graphite/resin composite of the present invention provides a graphite based composite having an in-plane thermal conductivity comparable to or exceeding the thermal conductivity of copper at only a fraction of the copper weight. More specifically, the composites have an in-plane thermal conductivity of at least about SOOW/n^K while having a through-plane thermal conductivity of less than about 15 W/m°K, more preferably less than about 10 W/m°K. Referring now to the drawings, and in particular to FIG. 1, a circuit assembly in which a graphite heat spreader is combined with a plurality of hot channels in accordance with the present invention is designated by the symbol 10. The circuit assembly 10 includes at least one dielectric layer 20 and a heat spreader 30, wherein the heat spreader 30 abuts the dielectric layer 20. Preferably, the heat spreader 30 comprises at least one sheet of compressed exfoliated graphite particles which are prepared as previously described. The circuit assembly 10 is typically a printed circuit board or flexible circuit, but may also include, for example, a conductive ink-based or screen pattern on the dielectric layer 20. The circuit assembly 10 also typically includes a circuit 40, which is conventionally made of copper, which is applied to the dielectric layer by photomask etching, sputtering, screen printing, or the like. 20 on. As mentioned previously, the circuit 40 can also be constructed of conductive ink that is applied to the dielectric layer 20 by, for example, printing or wire mesh methods. -28- 1375493 Dielectric layer 20 can be well known in the printed circuit board industry, such as: glass fiber with resin (FR-4), preferably formed into a laminate; polytetrafluoroethylene ( PTFE), commercially available Teflon brand materials: and expanded PTFE, sometimes labeled as ePTFE; and impregnated or inhaled resin versions of the above items. Additionally, the poor lean layer 20 can be a polymer such as polyamidene or polyester, as is used in the formation of flexible circuits. The dielectric layer 20 may also comprise a ceramic material, such as aluminum nitride, aluminum oxide, alumina, which is presented as a separate layer or is applied via, for example, anodization, vapor deposition, or flame spray. A substrate layer (e.g., heat spreader layer 30) is used; the use of the anode treatment is particularly relevant to the case where the heat spreader layer 30 is aluminum. Moreover, in some cases, it is preferred to at least partially enclose the heat spreader layer 30 or provide a coating on the surface of the heat spreader layer 30 so as to prevent particulate matter from the heat spreader layer 30. Peel off. For example, some people's opinion is that graphite materials are prone to flakes. Whether or not it is true, providing a coating composed of a polymeric material such as Mylar (typically on a grade less than 20 microns thick) to prevent sheet flaking will be associated with the above-described teachings. In this case, the polymeric material can serve as the dielectric layer 20' of the circuit assembly 10 because the material used can be non-conductive and thin enough to not substantially interfere with heat transfer to the heat spreader layer 30. Alternatively, an anodized layer may be used to inhibit spalling, while the anodized layer may also serve as dielectric layer 20. Preferably, the 'heat disperser layer 30 is from about 0.25 mm in thickness to 25 mm' in thickness, more preferably from about 〇5 mm to about 14 mm, and includes to -29-1375493.

少一板片。有利地,熱分散器層30可爲一由多達 多石墨板片所構成之疊層板,以便可提供所要之熱 力。該石墨複合物可被用以至少部分地取代用作爲 成熱分散器之銅或其他金屬,而在諸較佳之實施例 /-«-» ML. »-· Mi 兀王吧收T\ ° 出人意外地,當熱分散器層30例如藉由油漆 黑色時,尤其是當其係由一或多個經壓縮之已剝離 粒的板片所構成時,將可獲得改良之熱阻。換言之 與介電質層20相鄰接之石墨熱分散器層30之諸表 色處,自熱產生組件處起之熱路徑的有效熱阻被減 然此情況之精確原因未明,但一般相信使石墨熱分 30成爲黑色將可改善分散器層30之發射率,藉此 熱分散器層30散發熱之能力。 熱分散器層30並不需必然爲平面狀,亦可包 多個「彎曲」,以便可形成三維之形狀。此在電 10必須位在一與熱分散器層30不同之平面上的場 特別有利的。此配置例如被用於側光型液晶顯示器 顯示器),其中若干LED被安裝在電路總成10上 一具有受限空間(亦即,LCD顯示器之厚度)之平 而熱分散器層30則垂直於該LED安裝平面伸展。 確實地,在本發明之一實施例中,熱分散器層 有一較大於介電質層20及任何位於其上之電路40 積。在此情形下,介電質層20與(諸)熱產生組f 及(諸)電路40可位於一平面中(例如用於側光One less piece. Advantageously, the heat spreader layer 30 can be a laminate of up to a plurality of graphite sheets to provide the desired heat. The graphite composite can be used to at least partially replace copper or other metals used as heat generating dispersers, and in the preferred embodiment /-«-» ML. »-· Mi 兀王吧T\° Surprisingly, an improved thermal resistance will be obtained when the heat spreader layer 30 is constructed, for example, by painting black, especially when it is composed of one or more sheets of compressed, stripped particles. In other words, at the color of the graphite heat disperser layer 30 adjacent to the dielectric layer 20, the effective thermal resistance of the thermal path from the heat generating component is reduced. The exact cause of this situation is unknown, but it is generally believed that the graphite is made. The fact that the heat score 30 becomes black will improve the emissivity of the disperser layer 30, whereby the heat spreader layer 30 dissipates heat. The heat spreader layer 30 does not necessarily have to be planar, but may also be "bent" so as to form a three-dimensional shape. This is particularly advantageous in the field where the electricity 10 must be located on a different plane than the heat spreader layer 30. This configuration is for example used in edge-lit liquid crystal display displays, in which several LEDs are mounted on the circuit assembly 10 with a confined space (i.e., the thickness of the LCD display) and the thermal diffuser layer 30 is perpendicular to The LED mounting plane is extended. Indeed, in one embodiment of the invention, the heat spreader layer has a larger capacity than the dielectric layer 20 and any circuitry 40 located thereon. In this case, the dielectric layer 20 and the heat generating group(s) and circuit 40(s) can be located in a plane (eg, for sidelighting)

10或更 分散能 電路總 中則可 而成爲 石墨顆 ,在未 面係黑 小。雖 散器層 可改良 含一或 路總成 合處係 F ( LCD 且位於 •面中, F 30具 的表面 夺50以 型LCD -30- 1375493 顯示器之LED平面),而熱分散器層30則如前述 伸展至另一平面內(例如一具有大約90。之彎曲的 面,如位於LCD顯示器之後平面中者),並因此 分散至其他平面內而達額外之消散。 石墨/介電貿材料疊層板可藉由將若干介電質, 熱分散器層30例如以一在成形電路總成疊層板中 之方式並利用習知之黏著劑予以層疊在一起而被相 者’石墨/介電質材料疊層板可被形成爲預壓成之 並同時加壓固化諸石墨材料》在諸經植入之石墨板 環氧聚合物在固化時係足以將該結構之非石墨及 之石墨層黏結於適當位置中。不管如何,在較佳之 中,石墨複合物被用作爲電路總成10之熱分散器 以便可取代在一所謂「金屬背襯型」印刷電路板或 性電路中之銅或鋁熱分散器。 如前所提及,形成電路總成10之中央部分的 材料20具有兩個主要表面2 0a及20b。熱分散器f 接介電質材料20之諸表面20a中之一者;另一表 已在其上設置至少一熱產生組件50,且經常有複 產生組件50a、50b、50c等,諸如LED、晶片組、 本技藝之人士所熟悉之其他組件。熱產生組件50 成可與電路40之一部分相接觸,而電路40則係平 上設有組件50之電路總成10的表面20b上。 某些製造商之LED包含熱嵌條以協助將熱自 身處消散;這些熱嵌條一般而言被認爲係帶電的。 般地可 垂直平 可將熱 層20及 所習知 I成。或 堆疊, 片中之 經植入 實施例 層30, 在一軟 介電質 置30鄰 t 面 20b 數個熱 或熟習 被定位 置於其 LED本 因此, -31- 1375493 當此諸LED中之一個以上被設於電路總成ι〇上時,必須 小心避免在該總成之兩或更多個LED上之諸嵌條間造成 短路;因此,諸個別之LED經常必須被電絕緣。 爲了促使熱從熱產生組件50傳遞至熱分散器層30, 一熱通路60 (亦稱爲熱通道或只稱爲通道60)延伸穿過 熱分散器層30並鄰接熱產生組件50。有利地,通道60 亦延伸穿過介於各熱產生組件50與熱分散器層30之間的 電路總成10。雖然其他像鋁或經壓縮之已剝離石墨顆粒 之其他高導熱性.材料可被使用,但通道60仍包括一由諸 如銅或其合金之高導熱性材料所製成之嵌條或「鉚釘」。 「高導熱性」意指通道60在熱產生組件50與熱分散器層 30間之方向上的熱傳導率係較大於介電質層30之厚度貫 穿熱傳導率;較佳地,通道 60之熱傳導率係至少約 100W/m°K,更佳係至少約200W/m°K,甚至更佳係至少約 》50W/m°K。雖照通道60最普遍地係呈圓柱形狀,但各通 道60仍可採用任何特定之截面形狀。 通道60可爲一單一整體元件,但亦可包括一個以上 之部分,諸如一對分開之部件,其被壓入配合或以其他方 式連接在一起,如下文中將配合第7至27圖而說明者。 此外,基於位置之考量,通道60可有利地具有一位在側 邊鄰接之介電質層上之肩部或階狀部61。如果需要電絕 緣,則一介電質層(諸如經陽極處理之鋁、氮化鋁、氧化 鋁或礬土等)可被安置於其上或通道60之所有表面上,像 經火焰熔射或汽相沉積之礬土被安置於銅上,或例如使用經 -32- 1375493 陽極處理之鋁作爲通道60。此外,通道60的表面能保持 爲可焊接的,或可被覆層以成爲可焊接的,藉而有利於將 熱產生組件50連接至通道60。 各通道60延伸至熱分散器層30內且與其成熱接觸。 例如,通道ό 0可被裝配入一位於熱分散器層3 G中之狭縫 或孔內,此係利用熱黏著劑或壓力配合,諸如所謂之「快 速螺帽j或推置螺帽,以便可確保通道60與熱分散器層 30間之良好熱接觸,並確保自通道60處之熱傳遞可穿過 分散器層30之厚度。一使通道60被裝配入分散器層30 內以便可建立充分熱接觸之適當方式係強迫通道60通過 一位於分散器層30中之孔,其具有一較小於通道60直徑 之直徑,如以下配合例如第14、20、30及36圖所說明者; 在此方式中,強迫通道60通過該孔之動作將提供兩者間 之壓力配合。或者,位於分散器層30中之孔可藉由利用 通道60本身作爲一衝頭而被形成。經壓縮之已剝離石墨 顆粒之性質可允許該配合被完成,而不致對熱通道60或 熱分散器層30造成不當之損壞。 同樣地,通道60必需處於與熱產生組件50成良好熱 接觸之狀態。因此,通道60必需被熱連接或黏結至熱產 生組件50,此係藉由利用焊料、導熱膏、熱黏著劑,如 環氧樹脂、經壓縮之已剝離石墨顆粒的板片、或其他類似 物。因此,通道60較佳地延伸穿過電路總成10,並被暴 露在電路總成10之表面處,其上則設置熱產生組件50» 因此,在此實施例中,通道60具有一長度,其大致等於 -33- 1375493 介電質層20與熱分散器層30之組合厚度,加上通道60 自介電質層20或熱分散器層30處伸出之任一距離,如第 2A圖中所示。或者,熱通道或導熱介電質材料可被用以 從熱產生組件處熱傳遞至通道60,並使得通道60只延伸 通過熱分散器層30,以便將熱分散通過熱分散器層30之 厚度;因此,在此情況下,通道60將具有一長度,其大 致等於熱分散器層30之厚度,加上通道60自熱分散器層 30處伸出之任何距離。 爲了提供通道60與熱產生組件50間之良好熱接觸, 通道60可如第2Α圖中所示般地伸出至介電質層20之表 面20 b上方。或者,通道60可如第2Β圖中所示般地放置 成與介電質層20之表面2 Ob齊平,或可如第2C圖中所示 般地相對於介電質層20之表面20成凹入,而此將決定於 熱產生組件50之性質,及用於提供通道60與熱產生組件 50間之熱連接的較佳方法。 一用於提供通道60與熱分散器層30間良好熱接觸之 有利方法係藉由使用一「鉚釘」型式通道60,如下文中 配合第7至27圖所述者。在此一方式中,以相同於鉚釘 被壓縮以封抵基底之方法,一鉚釘型通道60可被壓縮或 壓擠以封抵熱分散器層30之外表面(亦即未與介電質層 鄰接之表面),此將形成兩者間之良好熱連接。 如前所提及,熱分散器層30被有利地層疊或黏結至 介電質層20»然而,可預期到通道60之使用將使熱分散 器層30與介電質層20之間存在一間隙,以便可最佳化熱 -34- 1375493 消散。換言之,因爲熱產生組件50與熱分散器層30間之 熱傳遞主要係經由通道60而非經由介電質層20,故熱分 散器層30並不需要與介電質層20接觸》因此,大至約lmm 或甚至更大之間隙可例如藉由使用分隔件等(未示於圖) 而被提俟於熱分散器層30與介電質層2G之間u在此一方 式中,假如熱分散器層30保持與通道60成熱接觸,則熱 分散器層30之更多表面積會被暴露出,且更多之熱可從 此處被消散掉。簡要言之,在此一實施例中,熱分散器層 30可同時作爲一熱分散器及一熱消散鰭片。 在第4圖所示之可替代實施例中,通道60可與熱產 生組件50成爲一體。例如,如果一 LED被用作爲熱產生 組件5 0,則該LED可具有一延伸自其處之高導熱性嵌條 或鉚釘,其可接著延伸穿過電路總成10並與熱分散器層 30成熱接觸(例如,如前述般地經由壓力配合或鉚釘型 式之連接),以便有助於熱從該LED處分散至熱分散器 層30。 在第6A及6B圖所示之另一實施例中,(諸)通道 60可出現在一延伸穿過熱分散器層30之收集條62,其中 之收集條62包括一長形件,其具有若千延伸自其處並向 上穿過介電質層20之個別通道單元64a、64b、64c等, 如第6B圖所示。或者,收集條可延伸穿過介電質層20, 同時諸個別通道單元延伸穿過熱分散器層30(未示於圖)。 在第5圖所示之另一實施例中,通道60可延伸穿過 並超越熱分散器層30,以便可作爲另外之熱消散層3 0a、 -35- 1375493 30b、3 0c等(例如,熱分散器層或熱消散鰭片)的支撐。 換言之,如果空間允許,通道60可延伸穿過熱分散器層 ' 30,且其他熱分散器層或熱消散鰭片3 0a、30b、30c等(較 . 佳地亦係由經壓縮之已剝離石墨顆粒的板片所構成)可接 ' 著被安置成與通道60呈熱接觸,且藉著位在諸額外層 ‘ 或鰭片30a、30b、30c等之間的氣隙,可提供額外之熱消 散。若干間隔件(未示於圖)可被用以維持諸層30a、30b、 30c等之分隔。 ® 如第3圖所示,本發明在當電路總成係一軟性電路 100時係特別有用。因爲軟性電路100之性質,相較於經 壓縮之已剝離石墨板片呈相對地堅硬之傳統熱分散材料 係不實用的。然而,使用一或多片經壓縮之已剝離石墨板 片作爲熱分散器層30將可有效地將熱從熱產生組件50處 經由通道60而消散,不致嚴重地損及柔軟性。此外,因 爲各通道60通常係爲一不連續物件,故即使包含了複數 個通道60a、60b、60c亦將不會損及柔軟性。 ® 因此,藉由運用本發明,在一電路總成中之有效分散 將可達到一前所未見之程度,甚至在軟性電路情況中,及 甚至在熱源係LED的場合。 凸緣通道 .第7至27圖說明凸緣通道之構造,且說明組裝具有 石墨平面元件之凸緣通道的方法。 1 . f氏·葎q少熱鉚釘 在某些應用中’熱通道被允許或有必要突出至分散器 -36- 1375493 之表面上方。同樣地,在某些應用中則有必要降低分 之費用,同時卻仍嘗試使通過分散器之熱流量達到最 這些衝突之目標可藉由在分散器中使用一凸緣化之 型通道而達到,如第7圖所示。 在第7圖中,一熱管理系統被槪括地標示以元件 100。系統100包含一異向性石墨平面元件102,其具 -及第二相對向之平面表面104及106,並具有一形 此諸平面表面間之厚度108。平面元件102具有一相 之平行於諸平面表面104及106的熱傳導率,及一相 之穿過厚度108的熱傳導率。平面元件102·具有一貫 中且位於諸平面表面104及106間之圓形凹穴或孔1 此凹穴100係由一圓筒形內穴壁112所界定。鉚釘型 道114具有一圓柱形心柱116,其延伸穿過凹穴110 密地啣合內凹穴壁112»通道114另包含一凸緣,其 柱116處側向地延伸並緊密地啣合石墨平面元件102 —平面表面1 04。 如前所提及,通道114較佳係由等向性材料所構 以便使來自熱源(例如120)之熱可被傳導通過通道 並進入石墨平面元件102之厚度108中。通道114較 由一選自由金、銀、銅、鋁及其合金所組成之群中的 所構成。異方性石墨平面元件102較佳係由經壓縮之 離石墨顆粒所製成。 如第7圖中明顯展示的,鉚釘型通道114之凸緣萌 從石墨平面元件1 02之一側突出,而心柱1 1 6則自石 散器 大。 鉚釘 符號 有第 成於 虽尚 當低 穿其 10, 熱通 並緊 從心 之第 :成, 114, 佳係 材料 已剝 g 118 墨平 -37- 1375493 面元件102之另一側突出。鉚釘型通道114之大小 成可使心柱116之直徑大到足以大致覆蓋熱源120 表面。 凸緣通道114藉由壓置一市面上可購得之推 i 22於通道1 1 4之心柱1 1 6上,而可相對於石墨平 102被保持於適當位置。推置螺帽丨22並不需由與通 相同之材料所製成,因其不會促成熱傳遞;其唯一 係可相對於石墨平面元件102將鉚釘型通道114保 當位置。推置螺帽1 22之內徑略小於心柱1 1 6之外 便使推置螺帽可與通道114之心柱116密切地接觸 114之上端或自由端124接觸熱源120,且熱從熱 流入通道1 14之心柱1 1 6及凸緣1 1 8內。熱經由心 之外徑與凸緣118之內側表面126兩者而被傳遞至 面元件102內。因爲凸緣118接觸與熱源120相對 墨平面元件102的第一側104,故傳遞至石墨平面元 之熱達到最大。 將可察覺的是,在熱源120與心柱116的自由 之間具有一接觸面積,其可被稱爲一被界定在熱源 之熱傳導接觸面積。雖然熱源可適度地大於心柱11 由端124的面積,且本發明之優點一樣可實質地達 該接觸面積仍較佳係小於心柱116之自由端124的 推置螺帽122被容納於心柱116上方並與其成 合。推置螺帽122緊貼地啣合石墨平面元件102之 面表面106,以致使石墨平面元件102被夾層於凸 被設定 之整個 置螺帽 面元件 道114 之目的 持於適 徑,以 。通道 源120 柱116 石墨平 向之石 件102 端124 120上 6之自 到,但 面積。 摩擦啣 第二平 緣118 -38- 1375493 與推置螺帽122之間》在第7圖所示之實施例中, 之自由端124整個延伸穿過推置螺帽122。 凸緣118之直徑與厚度應被選定成確保熱可 遞至石墨平面元件102內。凸緣118之直徑亦應 使凸緣ii8不會在推置螺帽122被下壓時產生過 或切入石墨平面元件102內。如果推置螺帽122 法充分地增大以防止石墨平面元件102受過度, 壞,那麼一較大直徑之墊圈128可被用於推置螺 方,如第7A圖所示。因爲墊圈128之使用主要 之目的(亦即非用以傳導熱),故其可鬆弛地裝 116上,且不需以與熱通道114相同之材料製成 第8及9圖分別地顯示熱通道114之詳細平 圖。第1 0及1 1圖則分別地顯示推置螺帽1 22之 及正視圖。 最佳如第12圖所顯示,爲可使用鉚釘型熱遺 孔110較佳地被模切入石墨平面元件102內。模 孔徑,其具有一與其有關之大公差。爲可確保熱 與石墨平面元件102間之良好熱傳遞,該模切孔 徑130較佳地被選定成使得藉模切所得之最大孔 熱通道114之心柱116的外徑。 最佳如第14圖所示,在孔110被模切入石 件1 02內之後,通道1 1 4之心柱1 1 6被如第1 4 般地向上推並穿過孔110。因爲通道114之心柱 一略大於孔110之直徑,故石墨將會在心柱116 心柱1 1 6 良好地傳 大到足以 度之壓力 之外徑無 壓力之損 帽122下 係爲機械 配在心柱 〇 面及正視 詳細平面 ί 道 114, 切產生一 通道114 1 10之直 仍略小於 墨平面兀 圖中所示 1 16具有 周圍呈蕈 -39- 1375493In the total of 10 or more dispersive circuits, it can be graphite, which is black in the absence of surface. Although the diffuser layer can be modified to include the one or the road assembly F (LCD and located in the face, the surface of the F 30 has a 50-inch LCD -30-1375493 display LED plane), while the heat spreader layer 30 Extending to another plane as previously described (e.g., a curved surface having a curvature of about 90, such as in the plane behind the LCD display), and thus dispersed into other planes for additional dissipation. The graphite/dielectric trade material laminate can be phased by laminating a plurality of dielectrics, heat spreader layers 30, for example, in a laminate of the formed circuit assembly and using conventional adhesives. 'Graphite/dielectric material laminates can be formed to be pre-compressed and simultaneously pressurize and cure the graphite materials." The implanted graphite sheet epoxy polymer is sufficient to cure the structure when cured. The graphite and graphite layers are bonded in place. In any event, preferably, the graphite composite is used as a heat spreader for the circuit assembly 10 to replace a copper or aluminum heat spreader in a so-called "metal backed" printed circuit board or circuit. As mentioned previously, the material 20 forming the central portion of the circuit assembly 10 has two major surfaces 20a and 20b. The heat spreader f is coupled to one of the surfaces 20a of the dielectric material 20; the other meter has disposed thereon at least one heat generating assembly 50, and often has a replica generating assembly 50a, 50b, 50c, etc., such as an LED, Chipsets, other components familiar to those skilled in the art. The heat generating assembly 50 is in contact with a portion of the circuit 40, and the circuit 40 is mounted on the surface 20b of the circuit assembly 10 on which the assembly 50 is disposed. Some manufacturers' LEDs contain hot fillets to help dissipate the heat itself; these hot fillets are generally considered to be charged. The hot layer 20 and the conventional I can be formed in a vertical manner. Or stacked, in the slice implanted embodiment layer 30, in a soft dielectric material 30 adjacent to the t-plane 20b, a number of heat or familiarity is placed in its LED, therefore -31- 1375493 when these LEDs When more than one is placed on the circuit assembly, care must be taken to avoid shorting between the strips on the two or more LEDs of the assembly; therefore, the individual LEDs must often be electrically insulated. To facilitate the transfer of heat from the heat generating assembly 50 to the heat spreader layer 30, a heat path 60 (also referred to as a hot channel or simply channel 60) extends through the heat spreader layer 30 and abuts the heat generating assembly 50. Advantageously, the passage 60 also extends through the circuit assembly 10 between the respective heat generating assemblies 50 and the heat spreader layer 30. While other high thermal conductivity materials such as aluminum or compressed exfoliated graphite particles may be used, the channel 60 still includes a fillet or "rivet" made of a highly thermally conductive material such as copper or its alloy. . By "high thermal conductivity" is meant that the thermal conductivity of the channel 60 in the direction between the heat generating component 50 and the heat spreader layer 30 is greater than the thickness of the dielectric layer 30 throughout the thermal conductivity; preferably, the thermal conductivity of the channel 60 It is at least about 100 W/m °K, more preferably at least about 200 W/m °K, and even more preferably at least about 50 W/m °K. Although channel 60 is most generally cylindrical in shape, each channel 60 can take any particular cross-sectional shape. Channel 60 can be a single unitary component, but can also include more than one portion, such as a pair of separate components that are press fit or otherwise joined together, as will be described below in conjunction with Figures 7-27. . Moreover, based on location considerations, the channel 60 can advantageously have a shoulder or step 61 on a side adjacent dielectric layer. If electrical insulation is required, a dielectric layer (such as anodized aluminum, aluminum nitride, alumina or alumina, etc.) can be placed thereon or on all surfaces of the channel 60, such as by flame spraying or The vapor deposited alumina is placed on the copper or, for example, the aluminum treated with -32-1375493 anodized as the channel 60. In addition, the surface of the channel 60 can remain solderable or can be coated to be solderable, thereby facilitating the attachment of the heat generating assembly 50 to the channel 60. Each channel 60 extends into and is in thermal contact with the heat spreader layer 30. For example, the channel ό 0 can be assembled into a slit or hole in the heat spreader layer 3 G using a thermal adhesive or a press fit such as the so-called "fast nut j or push nut" so that Good thermal contact between the channel 60 and the heat spreader layer 30 is ensured and heat transfer from the channel 60 is ensured to pass through the thickness of the diffuser layer 30. Once the channel 60 is assembled into the diffuser layer 30 for establishment A suitable means of adequate thermal contact is to force passage 60 through a bore in diffuser layer 30 having a diameter that is smaller than the diameter of passage 60, as described below, for example, as illustrated in Figures 14, 20, 30 and 36; In this manner, forcing passage 60 through the action of the aperture will provide a press fit between the two. Alternatively, the aperture in the diffuser layer 30 can be formed by utilizing the passage 60 itself as a punch. The nature of the stripped graphite particles may allow the mating to be completed without undue damage to the hot runner 60 or the heat spreader layer 30. Likewise, the passage 60 must be in good thermal contact with the heat generating assembly 50. ,through 60 must be thermally bonded or bonded to the heat generating component 50 by utilizing solder, a thermal paste, a thermal adhesive such as an epoxy resin, a sheet of compressed exfoliated graphite particles, or the like. Channel 60 preferably extends through circuit assembly 10 and is exposed at the surface of circuit assembly 10, on which heat generating assembly 50 is disposed. Thus, in this embodiment, channel 60 has a length that is substantially Equivalent to -33 - 1375493 The combined thickness of the dielectric layer 20 and the heat spreader layer 30, plus any distance that the channel 60 extends from the dielectric layer 20 or the heat spreader layer 30, as shown in Figure 2A. Alternatively, a hot aisle or thermally conductive dielectric material can be used to transfer heat from the heat generating component to the channel 60 and such that the channel 60 extends only through the heat spreader layer 30 to dissipate heat through the heat spreader layer 30. The thickness; therefore, in this case, the channel 60 will have a length that is substantially equal to the thickness of the heat spreader layer 30, plus any distance that the channel 60 projects from the heat spreader layer 30. To provide the channel 60 with Good thermal contact between the heat generating components 50 The channel 60 may protrude above the surface 20b of the dielectric layer 20 as shown in FIG. 2. Alternatively, the channel 60 may be placed with the dielectric layer 20 as shown in FIG. The surface 2 Ob is flush, or may be recessed relative to the surface 20 of the dielectric layer 20 as shown in Figure 2C, and this will depend on the nature of the heat generating assembly 50 and be used to provide the channel 60 with A preferred method of thermally connecting the heat generating components 50. An advantageous method for providing good thermal contact between the channels 60 and the heat spreader layer 30 is by using a "rivet" type channel 60, as described below in conjunction with the seventh Figure 27 is the one described. In this manner, a rivet-type passage 60 can be compressed or squeezed to seal against the outer surface of the heat spreader layer 30 (i.e., not with the dielectric layer) in the same manner as the rivet is compressed to seal against the substrate. Adjacent surface), which will form a good thermal connection between the two. As mentioned previously, the heat spreader layer 30 is advantageously laminated or bonded to the dielectric layer 20» However, it is contemplated that the use of the via 60 will result in a presence between the heat spreader layer 30 and the dielectric layer 20. Clearance so that heat-34-1375493 can be optimized for dissipation. In other words, since the heat transfer between the heat generating component 50 and the heat spreader layer 30 is mainly via the channel 60 rather than via the dielectric layer 20, the heat spreader layer 30 does not need to be in contact with the dielectric layer 20. A gap of up to about 1 mm or even larger may be lifted between the heat spreader layer 30 and the dielectric layer 2G, for example, by using a separator or the like (not shown), in this manner, if The heat spreader layer 30 remains in thermal contact with the channel 60, and more surface area of the heat spreader layer 30 is exposed and more heat can be dissipated therefrom. In short, in this embodiment, the heat spreader layer 30 can serve as both a heat spreader and a heat dissipation fin. In an alternative embodiment shown in Fig. 4, the passage 60 can be integral with the heat generating assembly 50. For example, if an LED is used as the heat generating component 50, the LED can have a highly thermally conductive fillet or rivet extending therefrom that can then extend through the circuit assembly 10 and with the heat spreader layer 30. Thermal contact (e.g., via a press fit or rivet pattern as previously described) to facilitate heat dissipation from the LED to the heat spreader layer 30. In another embodiment illustrated in Figures 6A and 6B, the channel(s) 60 can be present in a collection strip 62 extending through the heat spreader layer 30, wherein the collection strip 62 includes an elongate member having Thousands of individual channel elements 64a, 64b, 64c, etc. extending therefrom and up through the dielectric layer 20 are shown in Figure 6B. Alternatively, the collector strips may extend through the dielectric layer 20 while the individual channel units extend through the heat spreader layer 30 (not shown). In another embodiment, illustrated in Figure 5, the passage 60 can extend through and beyond the heat spreader layer 30 to serve as additional heat dissipation layers 30a, -35-1375493 30b, 30c, etc. (e.g., Support for the heat spreader layer or heat dissipating fins). In other words, if space permits, the channel 60 can extend through the heat spreader layer '30, and other heat spreader layers or heat dissipation fins 30a, 30b, 30c, etc. (better than also from the compressed stripped graphite) The slab of particles can be placed in thermal contact with the channel 60 and provide additional heat by means of an air gap between the additional layers' or fins 30a, 30b, 30c, etc. dissipate. A plurality of spacers (not shown) may be used to maintain separation of the layers 30a, 30b, 30c, and the like. ® As shown in Figure 3, the present invention is particularly useful when the circuit assembly is a flexible circuit 100. Because of the nature of the flexible circuit 100, conventional heat dissipating materials that are relatively rigid compared to the compressed exfoliated graphite sheets are not practical. However, the use of one or more compressed exfoliated graphite sheets as the heat spreader layer 30 will effectively dissipate heat from the heat generating assembly 50 via passage 60 without severely compromising softness. In addition, since each of the channels 60 is generally a discontinuous article, even if a plurality of channels 60a, 60b, 60c are included, the flexibility will not be compromised. ® Thus, by using the present invention, effective dispersion in a circuit assembly can be achieved to an unprecedented level, even in the case of flexible circuits, and even in the case of heat source LEDs. Flange passages. Figures 7 through 27 illustrate the construction of the flange passage and illustrate a method of assembling a flange passage having a graphite planar member. 1 . f··qq less heat rivet In some applications the 'hot aisle is allowed or necessary to protrude above the surface of the diffuser -36-1375493. Similarly, in some applications it is necessary to reduce the cost of the split, while still trying to achieve the goal of achieving the most conflicts of heat flow through the disperser by using a flanged type of channel in the disperser. As shown in Figure 7. In Figure 7, a thermal management system is shown in the figure as component 100. System 100 includes an anisotropic graphite planar element 102 having - and second opposing planar surfaces 104 and 106 and having a thickness 108 between the planar surfaces. The planar element 102 has a phase of thermal conductivity parallel to the planar surfaces 104 and 106 and a phase of thermal conductivity through the thickness 108. The planar element 102 has a circular pocket or aperture 1 that is consistently located between the planar surfaces 104 and 106. The recess 100 is defined by a cylindrical inner pocket wall 112. The rivet track 114 has a cylindrical stem 116 extending through the pocket 110 to closely engage the inner pocket wall 112. The passage 114 further includes a flange with the post 116 extending laterally and closely engaging. Graphite planar element 102 - planar surface 104. As mentioned previously, the passage 114 is preferably constructed of an isotropic material such that heat from a heat source (e.g., 120) can be conducted through the passage and into the thickness 108 of the graphite planar member 102. The passage 114 is formed of a group selected from the group consisting of gold, silver, copper, aluminum, and alloys thereof. The anisotropic graphite planar element 102 is preferably made from compressed graphite particles. As is apparent from Fig. 7, the flange of the rivet-type passage 114 protrudes from one side of the graphite planar member 102, and the stem 1 16 is larger from the diffuser. The rivet symbol has the advantage that although it is still low, it wears 10, and the heat is tight and closes from the heart: Cheng, 114, the best material has been stripped g 118 Ink-37- 1375493 The other side of the surface element 102 protrudes. The rivet-type passage 114 is sized such that the diameter of the stem 116 is large enough to substantially cover the surface of the heat source 120. The flange channel 114 is held in position relative to the graphite flat 102 by pressing a commercially available pusher 12 on the stem 1 1 of the channel 1 14 . The push nut 22 does not need to be made of the same material as the pass because it does not contribute to heat transfer; it is unique in that the rivet-type channel 114 can be held in position relative to the graphite planar member 102. The inner diameter of the push nut 1 22 is slightly smaller than the stem 1 1 6 so that the push nut can closely contact the upper end 114 of the channel 114 or the free end 124 contacts the heat source 120, and the heat is from heat. It flows into the stem 1 1 6 of the passage 1 14 and the flange 1 1 8 . Heat is transferred into the face member 102 via both the outer diameter of the core and the inner side surface 126 of the flange 118. Because the flange 118 contacts the first side 104 of the ink planar element 102 opposite the heat source 120, the heat transferred to the graphite planar element is maximized. It will be appreciated that there is a contact area between the heat source 120 and the freedom of the stem 116, which may be referred to as a thermally conductive contact area defined by the heat source. Although the heat source may be moderately larger than the area of the stem 11 from the end 124, and the advantage of the present invention is substantially as high as the contact area is still less than the free end 124 of the stem 116, the push nut 122 is received in the heart. Above and at the column 116. The push nut 122 snugly engages the face surface 106 of the graphite planar member 102 such that the graphite planar member 102 is sandwiched between the convexly disposed full face nut member channels 114 for a suitable diameter. Channel source 120 column 116 graphite level stone member 102 end 124 120 on 6 from, but the area. Friction between the second flat edge 118-38-1375493 and the push nut 122. In the embodiment illustrated in Figure 7, the free end 124 extends entirely through the push nut 122. The diameter and thickness of the flange 118 should be selected to ensure heat transfer into the graphite planar member 102. The diameter of the flange 118 should also be such that the flange ii8 does not become or cut into the graphite planar member 102 when the push nut 122 is depressed. If the push nut 122 method is sufficiently enlarged to prevent the graphite planar member 102 from being excessively or badly, a larger diameter washer 128 can be used to push the screw, as shown in Fig. 7A. Because the gasket 128 is used for the primary purpose (i.e., it is not used to conduct heat), it can be loosely mounted on the 116, and does not need to be made of the same material as the hot aisle 114. Figures 8 and 9 respectively show the hot aisle. Detailed flat map of 114. The first and second figures show the push nut 1 22 and the front view, respectively. Preferably, as shown in Fig. 12, a rivet-type thermal aperture 110 is preferably die cut into the graphite planar member 102. The die aperture has a large tolerance associated with it. To ensure good heat transfer between the heat and graphite planar member 102, the die cut aperture 130 is preferably selected such that the outer diameter of the stem 116 of the largest bore thermal passage 114 is obtained by die cutting. Preferably, as shown in Fig. 14, after the hole 110 is die cut into the stone 102, the stem 1 16 of the channel 1 14 is pushed up through the hole 110 and through the hole 110. Since the stem of the channel 114 is slightly larger than the diameter of the hole 110, the graphite will be mechanically matched in the outer diameter of the stem 116, which is well transmitted to a sufficient pressure. The cylindrical surface and the frontal detailed plane ί channel 114, cut to produce a channel 114 1 10 is still slightly smaller than the ink plane 兀 shown in the figure 1 16 with a surrounding 蕈-39-1375493

狀向上,藉以形成一環形蕈狀突出部132。 爲確保良好之熱傳遞,此覃狀突出部132接 一如第14圖中所示之衝頭134下壓在蕈狀突出 而被強迫向下成與石墨平面元件102之頂表面或 表面ίϋό相齊平。衝頭i 34在其中具有一圓简狀 其尺寸係略大於心柱116之外徑。 在蕈狀突出部132已被壓平之後,推置螺帽 置在心柱116之自由端124上,並被強迫下壓抵 面兀件之心柱1 1 6至如第7圖之最終總成中所元 類似於第14圖中所示之衝頭134且具有一較大 納推置螺帽122之突起部分的另一衝頭(未示於 用以達成推置螺帽122在心柱116之放置。應有 被用以將石墨平面元件102穩固地夾定於推置螺 鉚釘凸緣118之間,以便可確保熱可良好地傳遞 凸緣1 1 8。 雖然在第7至14圖中所示之範例中,孔1 且心柱亦爲圓形或圓柱形,但應了解的是亦可用 面形狀。更槪括地說,孔110可被描述成具有一 | 其具有一與石墨平面元件102之平面相平行之最 寸,而在此情形下之最大截面尺寸即爲第12圖 直徑130»同樣地,通道114之心柱116可被描 一截面形狀,其與孔110之截面形狀互補,且具 範例中係心柱1 1 6之外徑直徑的最小截面尺寸, 孔110之最大截面尺寸130。或者,如果孔110 著藉由以 部132上 第二平面 ΠΠ iW 1 〇 ,. α 〇Ρ I JO · 122被放 住石墨平 ^之位置。 凹部以容 •圖)可被 足夠之力 丨帽122與 穿過鉚釘 1 0係圓形 其他之截 說面形狀, 大截面尺 中所見之 述成具有 有一在本 其較大於 較大於心 -40- 1375493 柱1 1 6,則在其之間的間係應被塡充以導熱膏或類似物, 以便可使石墨平面元件102與通道114間之熱傳遞達到最 大。 2. 县雙凸緣之凸緣涌楢 如貼所提及’在某些應用中,通道有必要突出至石墨 熱分散器元件之表面上方’以便使其可接觸熱源。此外, 在非常高性能之應用中,儘可能地將通道與周圍石墨材料 間之熱阻減到最小係很重要的。此可藉由倂合一亦可被稱 爲雙凸緣通道(諸如第15圖中所不者)之圓形凸緣通道 及墊圈總成而達到。 在第15圖中,本發明之一可替代實施例包含一熱管 理系統’其槪括地被標以元件符號200。熱管理系統200 包括一石墨平面元件2 02,其類似於第7圖中所示之石墨 平面元件102。石墨平面元件202具有相對向之第一及第 二主要平面表面204及206。厚度208被界定於諸表面204 及206之間。由內壁212所界定之孔210係穿過石墨平面 元件202而成形。系統2 00包含一熱通道214,其在此例 中係由第一及第二部分215及217所構成。第一部分215 包括心柱216及第一凸緣218。 在此情形中,熱通道214藉由第二部分217 (亦可被 稱爲一墊圈或第二凸緣217)而可被裝固於石墨平面元件 202上之適當位置。第二凸緣217係由與通道214之第一 部分2 1 5的心柱2 1 6及第一凸緣2 1 8相同之材料所製成。 第1 8及1 9圖分別顯示第二凸緣217之詳細平面圖及 -41- 1375493 憑藉著第15至19圖之雙凸緣通道214’ 一諸如220 之熱源可接的第一凸緣218或第二凸緣。較佳地’心柱216 將具有一至少與熱源220之外徑或最大尺寸一樣大之直 徑,以便可有效地協助熱傳遞遍及熱源220與通道214之 間的整個接觸面積β 憑藉著第15至19圖之雙凸緣通道214,熱經由心柱 216之外徑與諸凸緣218及217之內徑而被傳遞至石墨平 面元件202內。相對照於第7圖中所示僅將熱傳遞通過心 柱及一個凸緣之單凸緣通道,因本雙凸緣通道設計而自然 形成之大量位於通道214與石墨平面元件202間之接觸表 面將使得傳遞至石墨平面元件202之熱可達到最大。 當第二凸緣217與通道214之第一部分215被組裝 時,諸肩部225及223將對接在一起。心柱216之較大直 徑部分的長度227被選定成較小於石墨平面元件202之厚 度208,以便可確保當第二凸緣217被壓至第一部分215 上且諸肩部225及223對接在一起時,在諸凸緣218及217 間之環狀石墨面積將被處於壓縮狀態下。此確保熱從諸凸 緣218及217良好地傳遞至石墨平面元件202內。 第20圖顯示通道214之第一部分215被安裝在石墨 平面元件202內之適當位置處。石墨平面元件202具有以 —類似於先前配合第12圖所述之石墨平面元件102者之 方式而被模切成形於其內之孔210。再者,此模切孔210 之直徑被選定成使因而可得之最大孔仍略小於心柱216之 較大部分的第小可能直徑。熱通道214之第一部分215如 -43- 1375493 第20圖中所示般地被向上推至石墨平面元件202之? 內,再次地肜成一環形蕈狀突出部232。爲確保良好 傳遞,此蕈狀突出部2 32藉由如第20圖所示之衝頭 而被強制向下成與石墨平面元件202之頂表面206濟 此外,衝頭2 34具有一圓筒形凹部236於其中,而此 之大小被設定成略大於心柱216之最大外徑。 在蕈狀突出部232已被壓平之後,第二凸緣217 置在心柱216之端部上,且足夠的力被施以將第二 217向下推至心柱216上,直到諸肩部223及225彼 抵爲止。 諸凸緣218及217之直徑及厚度應被予選定,以 保熱可良好地傳遞至石墨平面元件202內。這些直徑 大到足以使諸凸緣218及217,在當第二凸緣217被 在心柱216上時,不會產生過度之壓力或切入石墨平 件中。 第21至24圖顯示雙凸緣通道214A之第二種設 其再次包含第一部分215A及第二部分217A。與第 17圖相較,唯一之差異在於本實施例中並無肩部被 成心柱2 1 6 A。用以取代地,心柱2 1 6 A係爲一在其上 處具有一個小去角之直圓筒形心柱。同樣地,第二 217A具有一貫穿其中之直圓柱孔219A。心柱216A之 略大於第二凸緣217A之內徑219A,因而提供了心柱 與第二墊圈2 1 7 A間之干涉配合。在組裝處,一實心 (未示於圖)被用以強迫第二凸緣217A向下至心柱In the upward direction, an annular beak-like projection 132 is formed. To ensure good heat transfer, the beak-like projection 132 is pressed against the top surface or surface of the graphite planar member 102 by pressing the punch 134 as shown in FIG. Qi Ping. The punch i 34 has a circular shape therein which is slightly larger in size than the outer diameter of the stem 116. After the beak-like projection 132 has been flattened, the push nut is placed on the free end 124 of the stem 116 and forced to press against the stem of the facepiece 1 16 to the final assembly as shown in FIG. The middle element is similar to the punch 134 shown in FIG. 14 and has a further punch having a larger protruding portion of the push nut 122 (not shown to achieve the push nut 122 in the stem 116 Placed. It should be used to securely sandwich the graphite planar member 102 between the push-on rivet flanges 118 to ensure that heat is well transferred to the flange 1 18. Although in Figures 7 through 14, In the illustrated example, the hole 1 and the stem are also circular or cylindrical, but it should be understood that the shape of the face can also be used. More specifically, the hole 110 can be described as having a | The plane of 102 is parallel, and the maximum cross-sectional dimension in this case is the diameter 130 of Figure 12. Similarly, the stem 116 of the channel 114 can be depicted in a cross-sectional shape that is complementary to the cross-sectional shape of the aperture 110. And having the smallest cross-sectional dimension of the outer diameter of the stem of the sample column 1 16 , and the maximum cross-sectional dimension 130 of the hole 110. If the hole 110 is held by the second plane ΠΠ iW 1 部 on the portion 132, α 〇Ρ I JO · 122 is placed at the position of the graphite flat. The recess can be sufficiently loaded with the cap 122 With the other shape of the circular shape passing through the rivet 10, the large-section ruler has a larger than the larger than the heart -40 - 1375493, the column 1 1 6 is between The system should be filled with a thermal paste or the like to maximize heat transfer between the graphite planar member 102 and the channel 114. 2. Flange surge in the double flange of the county As mentioned in the article 'In some applications, it is necessary for the passage to protrude above the surface of the graphite heat spreader element' so that it can contact the heat source. In addition, in very high performance applications, it is important to minimize the thermal resistance between the channel and the surrounding graphite material. This can be achieved by a circular flange channel and washer assembly that can also be referred to as a dual flange channel (such as the one shown in Figure 15). In Fig. 15, an alternative embodiment of the present invention includes a thermal management system, which is collectively labeled with the component symbol 200. The thermal management system 200 includes a graphite planar element 202 that is similar to the graphite planar element 102 shown in FIG. The graphite planar element 202 has opposing first and second major planar surfaces 204 and 206. Thickness 208 is defined between surfaces 204 and 206. A hole 210 defined by the inner wall 212 is formed through the graphite planar member 202. System 200 includes a hot aisle 214, which in this example is comprised of first and second portions 215 and 217. The first portion 215 includes a stem 216 and a first flange 218. In this case, the hot aisle 214 can be secured to the graphite planar member 202 by a second portion 217 (also referred to as a gasket or second flange 217). The second flange 217 is made of the same material as the stem 2 16 and the first flange 2 18 of the first portion 2 15 of the passage 214. Figures 18 and 19 respectively show a detailed plan view of the second flange 217 and -41 - 1375493 by means of the double flange channel 214' of Figures 15 to 19, a first flange 218 accessible by a heat source such as 220 or Second flange. Preferably, the stem 216 will have a diameter at least as large as the outer diameter or maximum dimension of the heat source 220 to effectively assist heat transfer throughout the entire contact area β between the heat source 220 and the passage 214 by virtue of the fifteenth to In the dual flange channel 214 of FIG. 19, heat is transferred into the graphite planar member 202 via the outer diameter of the stem 216 and the inner diameter of the flanges 218 and 217. In contrast to the single flange channel, which transfers heat only through the stem and a flange, as shown in Figure 7, a large number of contact surfaces naturally formed between the channel 214 and the graphite planar member 202 are formed by the dual flange channel design. The heat transferred to the graphite planar element 202 will be maximized. When the second flange 217 is assembled with the first portion 215 of the passage 214, the shoulders 225 and 223 will be butted together. The length 227 of the larger diameter portion of the stem 216 is selected to be smaller than the thickness 208 of the graphite planar member 202 to ensure that when the second flange 217 is pressed onto the first portion 215 and the shoulders 225 and 223 are docked at Together, the annular graphite area between the flanges 218 and 217 will be in a compressed state. This ensures that heat is well transferred from the flanges 218 and 217 into the graphite planar element 202. Figure 20 shows that the first portion 215 of the channel 214 is mounted at a suitable location within the graphite planar element 202. The graphite planar element 202 has a hole 210 that is die cut into the same manner as the graphite planar element 102 previously described in connection with Fig. 12. Moreover, the diameter of the die cut hole 210 is selected such that the largest hole thus available is still slightly smaller than the third possible diameter of the larger portion of the stem 216. The first portion 215 of the hot aisle 214 is pushed up to the graphite planar element 202 as shown in Figure 4 - 43 - 1375493. Inside, it is again folded into an annular beak-like projection 232. To ensure good transmission, the beak-like projection 2 32 is forced downwardly to the top surface 206 of the graphite planar member 202 by a punch as shown in Fig. 20, and the punch 2 34 has a cylindrical recess 236 is therein, and the size is set to be slightly larger than the maximum outer diameter of the stem 216. After the beak-like projection 232 has been flattened, the second flange 217 is placed on the end of the stem 216 and sufficient force is applied to push the second 217 down onto the stem 216 until the shoulders 223 and 225 arrived. The diameters and thicknesses of the flanges 218 and 217 should be selected to provide good heat transfer into the graphite planar member 202. These diameters are large enough that the flanges 218 and 217 do not create excessive pressure or cut into the graphite flat when the second flange 217 is placed on the stem 216. Figures 21 through 24 show a second arrangement of dual flange channels 214A which again includes a first portion 215A and a second portion 217A. Compared with Fig. 17, the only difference is that no shoulder is formed into the stem 2 1 6 A in this embodiment. Instead, the stem 2 1 6 A is a straight cylindrical stem with a small chamfer on it. Similarly, the second 217A has a straight cylindrical bore 219A therethrough. The stem 216A is slightly larger than the inner diameter 219A of the second flange 217A, thus providing an interference fit between the stem and the second washer 2 17 A. At the assembly, a solid (not shown) is used to force the second flange 217A down to the stem

I 210 之熱 ! 234 F平。 n r*i iVTT 被安 凸緣 此承 便確 亦應 下壓 面元 計, 16及 機製 端部 凸緣 直徑 216A 衝頭 216A -44- 1375493 上。動作在當第二凸緣217A之上表面229與心柱216A之 上端部231齊平時便停止。爲可控制位於第一及第二凸緣 218A及217A間之石墨平面元件的壓縮量,心柱216A之 長度233及第二凸緣217A之厚度235將被管制。 3. 齊平式熱诵道 前述之熱通道全都具有一或兩個突出於石墨平面元 件之表面上方的凸緣。然而,在某些應用中,熱分散器卻 有必要具有一完全齊平之面,亦即並無熱通道之部分可突 出於石墨平面元件之表面上方》這些目標可利用一如第 25圖所示之已被埋置在石墨分散器中之熱通道而達成。 第25圖顯示一包括石墨平面元件302之熱管理系統 3 00,而此石墨平面元件則具有第一及第二主要平面表面 304及306。石墨平面元件302具有一被界定於諸表面3 04 及306間之厚度308。一由內壁312所界定之孔310係穿 過石墨平面元件302之厚度而形成。 熱通道314被容納於孔310中。在此一實施例中,通 道314係一在其上及下端部320及322上具有去角316及 318之圓盤,最佳如第26及27圖所示。如下文中將進一 步敘述的,在第25圖所示之此一具有被埋置在石墨平面 元件302內之盤形熱通道314的構造中,石墨材料緊密地 配合盤形熱通道314,並疊置在熱通道314之去角316及 318上。通道314具有其上及下端3 20及322,其分別與 石墨平面元件302之第二主要平面表面306及第一主要平 面表面3 04齊平。此構造在通道314與石墨平面元件3 02 -45- 1375493 之間增加了熱傳遞並提供了機械連結。 盤形熱通道314具有一厚度,其大體上相等於石墨平 面元件302之厚度308。 第28、29、30圖係一系列方法之說明性圖式,其中 顯示盤形熱通道314被埋置在石墨平面元件302內。再一 次地,石墨平面元件302具有在其中模切成形之孔310。 此模切孔310之尺寸被選定爲可使得在給定之相關公差 下,可由模切成形之最大孔仍將略小於盤形熱通道314之 外徑。在埋置作業期間,通道314將伸張並擴大孔310。 第28圖顯示一埋置設備3 24之分解圖,其包含上及 下鋼模半體3 26及328與一衝頭330。 上鋼模半體326中具有一貫穿孔3 32,且下鋼模半體 3 28中具有一部分孔3 34。 孔332及334之直徑係相同且略大於熱通道314之外 徑。對齊導件(未示於圖)被用以將位於上及下鋼模半體 326及328中之孔332及334與位於石墨平面元件302中 之模切孔3 10排列成直線。止動件3 36被設於下鋼模半體 3 2 8中。止動件3 3 6之上端部3 3 8係與模切孔3 1 0排列成 直線。止動件3 3 6被設於之頂表面340齊平,且止動件之 直徑係較小於盤形熱通道3 1 4之直徑,如此使得一環形凹 穴342可環繞止動件33 6。衝頭330具有與盤形熱通道314 相同之外徑,且被用以將通道314壓在適當位置處。 設備324之操作可最佳如第29圖所示。石墨平面元 件3 02被對準並夾持於上及下鋼模半體326及328之間。 -46- 1375493 一旦被夾持於定位,石墨材料之薄緣(未示於圖)便伸入 位於上及下鋼模半體326及328中之孔332及334。熱通 道314被安置在位於上鋼模半體3 26中之孔3 32內,其後 隨著衝頭3 30。壓力被施加至衝頭,其向上面對通道314 並通過突出之石墨枋料些突出之石墨衬料被切掉:而 —些則被壓縮在通道314周圍。通道314抵住止動件336 之端部338而停止,並與石墨平面元件3 02之下表面3 04 齊平。石墨材料之經切除的廢料則收集在止動件336周圍 之環形空間3 4 2內。 當上及下鋼模半體326及328被移離且與盤形熱通道 314組裝在一起之石墨平面元件3 02被從設備處移去時, 由通道314所壓縮之石墨材料形成周邊凸塊346及348, 其鄰接盤形熱通道314之去角邊緣316及318。 爲使這些凸塊346及348予以平坦,總成302及314 於是被置於一如第30圖所示壓機之上及下壓板之間,且 壓力被施加至總成302及314上。此一壓力應大於1 500psi 並小於lOOOOpsi,此係石墨材料之最小壓縮強度》此壓力 將凸塊346及348壓縮成與盤形熱通道314之諸端面3 20 及322齊平,並將石墨材料壓抵住通道314之諸去角邊緣 316及318,因而緊固地將通道314鎖制在石墨平面元件 302內之適當位置處。此結果便導致如第25圖中所示之熱 分散器元件3 02及314。 盤形熱通道314之諸去角邊緣316及318槪括地可被 描述爲形成於通道314上之凹部。如第25圖中所示,石 -47- 1375493 墨平面元件302之石墨材料疊置在此諸凹部或去角邊緣 316 及 318 上。 現參照第31及32圖,此相同之方法可被用以製造其 上具有若干薄表面層354之熱分散器。此諸表面層354典 型地係由My i ar、鋁、鋁或類似钧所構成。在此情形中 表面層354將在石墨平面元件3 02中模切孔310之前先被 鋪在石墨平面元件302上。然後,孔310被模切入石墨平 面元件302及表面層354兩者之內。孔310之直徑與通道 314之外徑必須被選定成使穿過表面層之孔可完全地包圍 —諸如320之熱源,其被安置成與通道3 14相接觸。導致 如第32圖中所示具有表面層354之組裝產品之其餘組裝 步驟係如先前參照第28至30圖所示者。此獲致一具有埋 置型熱通道之熱分散器,且通道之兩側如第32圖中所示 般地藉由位於表面層35 4中之諸孔而可被露出。此使得熱 通道314與熱源320間得以直接地接觸,同時可在石墨平 面元件302之所有暴露區域上方提供表面層354 » —般而言,此表面層354可被描述成一較薄於石墨平 面元件302之厚度308的表面層,其並覆蓋住石墨平面元 件302之諸相對向之主要平面表面304及306。 包覆型分散器及齊平式熱涌措 第33圖係相似於第25圖。箭頭3 5 6代表將盤形熱通 道314壓抵熱源3 20之一安裝負載,如此使得無負載被施 加至石墨平面元件302本身。石墨平面元件302保持平坦 狀,且在石墨平面元件302與熱通道314之間有良好之接 -48- 1375493 觸,而在熱通道314與石墨平面元件302之間的熱傳遞則 是絕佳。 如第34圖所示,然而必需常將諸如35 8及360之安 裝孔設置穿過石墨平面元件302並安置螺絲,施加安裝螺 絲負載至石墨平面兀件302上之鄰接諸孔35 S及360處> 如箭頭362及364所代表。此安裝負載此刻被直接施於石 墨平面元件302上。因爲石墨平面元件302之相當低彈性 係數,如箭頭362及364所代表之典型安裝負載可造成石 墨平面元件3 02如第34圖所示般地彎曲,而石墨平面元 件302之若干部分在被標以366之區域中被拉離熱通道 314,因此而造成若千可敞開於石墨平面元件302與熱通 道3 1 4間之間隙。此導致熱通道3 1 4與石墨平面元件302 間之熱傳遞減小,及在熱分散器之熱性能上之顯著降低。 甚至如第34圖所示之不太大的安裝負載都足以永久地彎 曲石墨平面元件302。 爲克服此一問題,一連續且相當堅硬之材料薄層368 可被包覆在石墨平面元件302之下側304,如第35圖中所 示。包覆層材料可包括銅、鋁等及其合金。例如,具有 0.003 in最小厚度之鋁片係用作爲包覆層之典型選擇。包 覆層368可利用諸如Ashland Aroset 3250之黏著劑而被黏 附於石墨平面元件302之表面3 04上,以及通道314之下 端部322上。一旦經黏附,諸安裝螺絲孔358及360被衝 壓或鑽孔穿過包覆層368及石墨平面元件302。應注意的 是,包覆層368在熱通道314之下端面322上係連續的, -49- 1375493 經由閱讀本說明便顯而可知者。然而,可預期 更及修改型式均將包含於由後附諸申請專利 界定之本發明範圍內。這些申請專利範圍權項 以任何配置或順序所表示之元件及步驟,其可 本發明之預期目的,除非本文中有特別地相反 【圖式簡單說明】 第1圖係根據本發明所實施之電路總成 立體圖,其中電路總成在其一表面上具有一熱 及一位於熱分散器層與熱產生組件之間的熱路 生組件則係位在電路總成之第二表面上。 第2 A-2C圖係第1圖中所示電路總成之熱 不同可替代配置之部分剖面圖,其係沿第1圖 所取,且分別顯示伸出至電路總成之第二表面 路總成之第二表面相齊平、及凹陷入電路總成 內的熱路徑。 第3圖係根據本發明之軟性電路的部: 圖,其中軟性電路在其一表面上具有一熱分散 數條位於熱分散器層與多個熱產生組件之間的 諸熱產生組件則係位在軟性電路之第二表面上 第4圖係根據本發明之電路總成的部分剖 電路總成在其一表面上具有一熱分散器層以 分散器層與熱產生組件之間的熱路徑,而熱產 位在電路總成之第二表面上,其中熱路徑與熱 整合成一體。 所有此類變 範圍權項所 係意欲涵蓋 有效地達成 :表示。 的部分斷裂 分散器層以 r徑,而熱產 路徑的多個 中之2-2線 上方、與電 之第二表面 汗斷裂立體 器層以及複 熱路徑,而 〇 面圖,其中 及一位於熱 生組件則係 產生組件係 -52- 1375493 第5圖係根據本發明之電路總成的部分剖面圖,其中 電路總成在其一表面上具有一熱分散器層以及一位於熱 分散器層與熱產生組件之間的熱路徑,而熱產生組件則係 位在電路總成之第二表面上,其中熱路徑延伸超過熱分散 器層並支承額外之熱消散層。 第6A圖係根據本發明之電路總成的仰視平面圖,其 中電路總成具有一長形基底式熱路徑組合。 第6B圖係第6A圖中所示電路總成之俯視平面圖。 第7圖係具有熱鉚釘型式通道之石墨熱分散器的正 視部份剖面圖,其中通道上安裝有一推置螺帽。 第7A圖係類似於第7圖之視圖,其顯示位於推置螺 帽下方之墊圏的可選擇性使用。 第8圖係第7圖中所示凸緣熱通道之平面圖。 第9圖係第8圖中所示凸緣熱通道之正視圖》 第10圖係第7圖中所示推置螺帽之平面圖。 第1 1圖係第1 0圖中所示推置螺帽之正視剖面圖。 第12圖係第7圖中所示石墨平面元件之一部分的平 面圖,其顯示設有模切孔以接納通過其內之凸緣通道。 第1 3圖係第7及1 2圖中所示石墨平面元件之正視剖 面圖。 第14圖係凸緣通道已被強制裝配穿過位於石墨平面 元件上之模切孔後而形成蕈狀石墨凸邊之正視剖面圖。位 於石墨平面元件及通道正上方者係一衝頭,其被用以壓縮 石墨凸邊》 -53- 1375493 第15圖係本發明之另一實施例的正視部分剖面圖, 其利用一具有兩各位於一端部上之凸緣的熱通道。本範例 中之熱源雖被顯示位於與下凸緣相抵處,但亦可被置於與 此通道之任一個凸緣相抵處。由第15圖中之剖面部分可 見,通道係由兩個部分所構成,其第一部分包括心柱及下 凸緣,而第二部分則包括上凸緣。 第15A係類似第第15圖之視圖,其顯示雙凸緣通道 之可替代形式。 第16圖係第15圖中所示心柱及下凸緣之平面圖。 第17圖係第16圖中所示具有與下凸緣成一體之心柱 的正視圖。 第18圖係上凸緣在被裝配以第15圖熱通道前之平面 圖。 第1 9圖係第1 8圖中所示上凸緣之正視剖面圖。 第20圖係一稍類似第14圖且顯示第17圖中所示凸 緣通道之心柱的視圖,其中凸緣通道之心柱已被壓入穿過 石墨平面元件而形成一蕈狀石墨凸邊。一衝頭被顯示位於 通道之上方並預備向下移動以壓縮石墨凸邊。 第21圖係凸緣通道之可替代結構的平面圖。 第22圖係第21圖中所示凸緣通道之正視圖。 第23圖係一具有直孔之第二凸緣的平面圖,其中直 孔將與第21及22圖中所示凸緣通道配合使用。 第24圖係第23圖中所示第二凸緣之正視剖面圖。 第25圖係本發明具有齊平通道之另一實施例的正視 •54- 1375493 部分剖面圖,其中齊平通道係與石墨平面元件之主要平面 表面相齊平。 第26圖係第25圖中所示熱通道之平面圖,而此熱通 道係呈一在各端部上具有若干去角邊緣之圓盤形狀。 第2 7圖係第2 6圖中所示熱通道之正視圖。 第28圖係一設備之正視部分剖面分解圖,而此設備 被用以將第26及27圖中所示熱通道埋置於石墨平面元件 中以形成如第25圖所示熱分散器結構。從第28圖頂部至 底部依序顯示衝頭、熱通道,上鋼模半體、石墨分散器、 及下鋼模半體。 第29圖係第28圖中所示設備在衝頭已強制使熱通道 貫穿上鋼模半體並進入石墨分散器內適當位置處後之正 視剖面圖。 第30圖係一壓機之兩壓板的分解正視剖面圖,其中 兩壓板係用於壓縮具有齊平通道之石墨分散器的諸環狀 凸塊。 第31圖係在其上具有一表面層之石墨熱分散器的正 視剖面圖。 第32圖係類似第25圖之視圖,其顯示已被組裝完成 並具有一表面層之石墨熱分散器,且包括齊平熱通道並具 有一被顯示於其上適當位置處之熱源。 第33圖係類似第25圖之視圖,其說明出現在熱分散 器的一種使用模式下之諸安裝模式。 第34圖係類似第33圖之視圖,其顯示另一種安裝模 -55- 1375493 式,其中兩螺絲延伸穿過石墨平面元件,此因而導致石墨 熱分散器之彎曲。 第35圖係爲類似本發明之一經修改實施例之第34圖 之視圖,其中一包覆層已被加至石墨熱分散器,且諸安裝 孔延伸穿過包覆層,其提误石墨熱分散器結構完整性,因 而使其彎曲得以減至最小。I 210 heat! 234 F flat. n r*i iVTT is flanged. This bearing should also be pressed down to the panel, 16 and the end of the mechanism flange diameter 216A punch 216A -44- 1375493. The action is stopped when the upper surface 229 of the second flange 217A is flush with the upper end portion 231 of the stem 216A. To control the amount of compression of the graphite planar elements between the first and second flanges 218A and 217A, the length 233 of the stem 216A and the thickness 235 of the second flange 217A will be regulated. 3. Flush hot chutes The aforementioned hot aisles all have one or two flanges that protrude above the surface of the graphite planar element. However, in some applications, it is necessary for the heat spreader to have a perfectly flush surface, i.e., portions of the hot channel that do not protrude above the surface of the graphite planar element. These targets can be utilized as shown in Figure 25. This is achieved by a hot aisle that has been embedded in the graphite disperser. Figure 25 shows a thermal management system 300 comprising a graphite planar element 302 having first and second major planar surfaces 304 and 306. The graphite planar element 302 has a thickness 308 defined between the surfaces 03 and 306. A hole 310 defined by the inner wall 312 is formed through the thickness of the graphite planar member 302. The hot aisle 314 is received in the bore 310. In this embodiment, the passage 314 is a disc having chamfers 316 and 318 on its upper and lower ends 320 and 322, as best shown in Figures 26 and 27. As will be further described below, in the configuration of the disk-shaped hot aisle 314 having the embedded in the graphite planar member 302 shown in Fig. 25, the graphite material closely fits the disk-shaped hot aisle 314 and is superposed. On the corners 316 and 318 of the hot aisle 314. Channel 314 has its upper and lower ends 3 20 and 322 which are flush with second major planar surface 306 of graphite planar element 302 and first major planar surface 304, respectively. This configuration adds heat transfer between the channel 314 and the graphite planar element 302 - 45 - 1375493 and provides a mechanical bond. The disk shaped hot aisle 314 has a thickness that is substantially equal to the thickness 308 of the graphite planar element 302. Figures 28, 29, and 30 are illustrative diagrams of a series of methods in which the disk shaped hot aisle 314 is shown embedded within the graphite planar element 302. Again, the graphite planar element 302 has a hole 310 in which the die cut is formed. The die cut hole 310 is sized such that, given the relevant tolerances, the largest hole that can be formed by die cutting will still be slightly smaller than the outer diameter of the disk shaped hot aisle 314. During the embedding operation, the channel 314 will stretch and enlarge the aperture 310. Figure 28 shows an exploded view of a buried device 3 24 including upper and lower steel mold halves 3 26 and 328 and a punch 330. The upper steel mold half 326 has a consistent perforation 3 32 and the lower steel mold half 3 28 has a portion of the aperture 3 34 therein. The diameters of the holes 332 and 334 are the same and slightly larger than the outer diameter of the hot aisle 314. Alignment guides (not shown) are used to align the holes 332 and 334 in the upper and lower steel mold halves 326 and 328 with the die cut holes 3 10 in the graphite planar member 302. A stopper 3 36 is provided in the lower steel mold half 3 2 8 . The upper end portion 3 3 8 of the stopper member 3 3 6 is aligned with the die-cut hole 3 10 0. The stopper 336 is disposed flush with the top surface 340, and the diameter of the stopper is smaller than the diameter of the disk-shaped heat passage 31, such that an annular pocket 342 can surround the stopper 33 6 . The punch 330 has the same outer diameter as the disk shaped hot aisle 314 and is used to press the channel 314 in place. The operation of device 324 is best as shown in Figure 29. The graphite planar member 322 is aligned and clamped between the upper and lower steel mold halves 326 and 328. -46- 1375493 Once clamped in position, the thin edge of the graphite material (not shown) extends into holes 332 and 334 in the upper and lower steel mold halves 326 and 328. The hot aisle 314 is placed in a hole 3 32 in the upper steel mold half 3 26, followed by a punch 3 30. Pressure is applied to the punch which faces upwardly into the channel 314 and is cut away by the protruding graphite material to some of the protruding graphite linings: and some are compressed around the channel 314. Channel 314 stops against end 338 of stop 336 and is flush with lower surface 304 of graphite planar element 302. The cut scrap of graphite material is collected in an annular space 342 around the stop 336. When the upper and lower steel mold halves 326 and 328 are removed and the graphite planar element 302 assembled with the disc shaped hot aisle 314 is removed from the apparatus, the graphite material compressed by the passage 314 forms a peripheral bump. 346 and 348, which adjoin the chamfered edges 316 and 318 of the disk shaped hot aisle 314. To flatten the bumps 346 and 348, the assemblies 302 and 314 are then placed between the press and the lower platen as shown in Fig. 30, and pressure is applied to the assemblies 302 and 314. This pressure should be greater than 1 500 psi and less than 1000 psi, the minimum compressive strength of the graphite material. This pressure compresses the bumps 346 and 348 into flush with the end faces 3 20 and 322 of the disk shaped hot aisle 314, and the graphite material The declination edges 316 and 318 of the channel 314 are pressed against, thereby securely locking the channel 314 in place within the graphite planar element 302. This result in the heat spreader elements 302 and 314 as shown in Fig. 25. The chamfered edges 316 and 318 of the disk shaped hot aisle 314 can be described as being formed in the recesses on the channel 314. As shown in Fig. 25, the graphite material of the stone -47-1375493 ink planar member 302 is superposed on the recesses or chamfered edges 316 and 318. Referring now to Figures 31 and 32, the same method can be used to fabricate a heat spreader having a plurality of thin surface layers 354 thereon. The surface layers 354 are typically constructed of My i ar, aluminum, aluminum or the like. In this case the surface layer 354 will be laid on the graphite planar element 302 prior to die cutting the holes 310 in the graphite planar element 302. Hole 310 is then die cut into both graphite planar element 302 and surface layer 354. The diameter of the bore 310 and the outer diameter of the passage 314 must be selected such that the aperture through the surface layer can be completely surrounded by a heat source such as 320 that is placed in contact with the passage 314. The remaining assembly steps leading to the assembled product having the surface layer 354 as shown in Figure 32 are as previously described with reference to Figures 28 through 30. This results in a heat spreader having a buried hot channel, and both sides of the channel can be exposed by the holes in the surface layer 354 as shown in Fig. 32. This allows direct contact between the hot aisle 314 and the heat source 320 while providing a surface layer 354 over all exposed areas of the graphite planar element 302. In general, this surface layer 354 can be described as being thinner than a graphite planar element. A surface layer of thickness 308 of 302 that covers the opposing major planar surfaces 304 and 306 of the graphite planar member 302. The coated disperser and the flush heat rushing method are similar to those in Fig. 25. Arrow 3 5 6 represents pressing the disk shaped heat tunnel 314 against one of the heat source 3 20 mounting loads such that no load is applied to the graphite planar element 302 itself. The graphite planar element 302 remains flat and has a good contact between the graphite planar element 302 and the hot aisle 314 - and the heat transfer between the hot aisle 314 and the graphite planar element 302 is excellent. As shown in Fig. 34, however, mounting holes such as 35 8 and 360 must be placed through the graphite planar member 302 and screws are placed, and mounting screws are applied to the adjacent holes 35 S and 360 on the graphite planar element 302. > as represented by arrows 362 and 364. This mounting load is now applied directly to the graphite planar element 302. Because of the relatively low modulus of elasticity of the graphite planar element 302, typical mounting loads as represented by arrows 362 and 364 can cause the graphite planar element 302 to bend as shown in Figure 34, while portions of the graphite planar element 302 are labeled The zone 366 is pulled away from the hot aisle 314, thus causing a gap between the graphite planar element 302 and the hot aisle 3 1 4 . This results in a reduced heat transfer between the hot aisle 3 1 4 and the graphite planar element 302 and a significant decrease in the thermal performance of the heat spreader. Even a less large mounting load as shown in Figure 34 is sufficient to permanently bend the graphite planar member 302. To overcome this problem, a continuous and relatively rigid thin layer of material 368 can be coated on the underside 304 of the graphite planar member 302, as shown in Figure 35. The cladding material may include copper, aluminum, etc., and alloys thereof. For example, aluminum sheets having a minimum thickness of 0.003 in are typically used as a coating. The cladding 368 can be adhered to the surface 304 of the graphite planar element 302 and to the lower end 322 of the channel 314 using an adhesive such as Ashland Aroset 3250. Once adhered, the mounting screw holes 358 and 360 are stamped or drilled through the cladding layer 368 and the graphite planar member 302. It should be noted that the cladding layer 368 is continuous over the lower end surface 322 of the hot aisle 314, and is described in the description of the present specification. However, it is contemplated that modifications and variations are intended to be included within the scope of the invention as defined by the appended claims. These claims are intended to be in any configuration or order of elements and steps, which are intended for the purpose of the present invention, unless specifically described herein. A total body image is shown in which the circuit assembly has a heat on one surface thereof and a thermal path component between the heat spreader layer and the heat generating component is tied to the second surface of the circuit assembly. 2A-2C is a partial cross-sectional view of a different alternative configuration of the heat of the circuit assembly shown in FIG. 1, taken along the first figure, and showing a second surface path extending to the circuit assembly, respectively. The second surface of the assembly is flush and recessed into the thermal path within the circuit assembly. Figure 3 is a portion of a flexible circuit in accordance with the present invention: Figure wherein the flexible circuit has a thermally dispersed plurality of heat generating components on one surface thereof between the heat spreader layer and the plurality of heat generating components. 4 is a partial cross-sectional circuit assembly of a circuit assembly according to the present invention having a heat spreader layer on one surface thereof to provide a thermal path between the diffuser layer and the heat generating component, The heat is placed on the second surface of the circuit assembly, wherein the heat path is integrated with the heat. All such variable scope rights are intended to cover effectively: representation. The partial rupture disperser layer has an r-path, and the second of the plurality of heat-producing paths is above the 2-2 line, and the second surface of the electric sweat breaks the three-dimensional layer and the reheating path, and the top view, wherein The thermal assembly is a component assembly - 52-1375493. Figure 5 is a partial cross-sectional view of a circuit assembly in accordance with the present invention, wherein the circuit assembly has a heat spreader layer on one surface thereof and a heat spreader layer on one surface A thermal path is formed with the heat generating component, and the heat generating component is positioned on the second surface of the circuit assembly, wherein the thermal path extends beyond the heat spreader layer and supports an additional heat dissipation layer. Figure 6A is a bottom plan view of a circuit assembly in accordance with the present invention, wherein the circuit assembly has an elongated base-type thermal path combination. Figure 6B is a top plan view of the circuit assembly shown in Figure 6A. Figure 7 is a front elevation, partial cross-sectional view of a graphite heat spreader having a hot rivet type channel with a push nut mounted on the channel. Figure 7A is a view similar to Figure 7 showing the optional use of the mattress located underneath the push nut. Figure 8 is a plan view of the flange hot aisle shown in Figure 7. Fig. 9 is a front elevational view of the flange hot aisle shown in Fig. 8. Fig. 10 is a plan view of the push nut shown in Fig. 7. Fig. 1 is a front cross-sectional view showing the push nut shown in Fig. 10. Figure 12 is a plan view of a portion of the graphite planar member shown in Figure 7 showing the die cut hole to receive the flange passage therethrough. Figure 13 is a front cross-sectional view of the graphite planar member shown in Figures 7 and 12. Figure 14 is a front cross-sectional view of the flanged channel having been forcedly assembled through the die cut holes in the graphite planar member to form a serpentine graphite flange. A punch located directly above the graphite planar member and the channel, which is used to compress the graphite bumps - 53- 1375493. Figure 15 is a front elevational cross-sectional view of another embodiment of the present invention, which utilizes one with two a hot aisle at the flange on one end. Although the heat source in this example is shown to be in contact with the lower flange, it can also be placed against any of the flanges of the channel. As can be seen from the section of the section in Fig. 15, the channel is composed of two parts, the first part comprising the stem and the lower flange, and the second part comprising the upper flange. Section 15A is a view similar to Figure 15, which shows an alternative form of a double flange channel. Figure 16 is a plan view of the stem and the lower flange shown in Figure 15. Fig. 17 is a front elevational view of the stem having an integral with the lower flange as shown in Fig. 16. Figure 18 is a plan view of the upper flange before it is assembled with the heat path of Figure 15. Figure 19 is a front cross-sectional view of the upper flange shown in Figure 18. Figure 20 is a view similar to Figure 14 and showing the stem of the flange channel shown in Figure 17, wherein the stem of the flange channel has been pressed through the graphite planar element to form a serpentine graphite side. A punch is shown above the channel and is ready to move down to compress the graphite rim. Figure 21 is a plan view of an alternative construction of the flange channel. Figure 22 is a front elevational view of the flange channel shown in Figure 21. Figure 23 is a plan view of a second flange having a straight bore which will be used in conjunction with the flange passages shown in Figures 21 and 22. Figure 24 is a front cross-sectional view of the second flange shown in Figure 23. Figure 25 is a partial cross-sectional view of another embodiment of the present invention having a flush channel, 54-1375493, wherein the flush channel is flush with the major planar surface of the graphite planar element. Figure 26 is a plan view of the hot aisle shown in Figure 25, and the thermal path is in the shape of a disk having a plurality of chamfered edges at each end. Figure 27 is a front view of the hot aisle shown in Figure 26. Figure 28 is a cross-sectional exploded view of a front view of a device which is used to embed the thermal channels shown in Figures 26 and 27 in a graphite planar member to form a heat spreader structure as shown in Figure 25. The punch, the hot aisle, the upper steel mold half, the graphite disperser, and the lower steel mold half are sequentially displayed from the top to the bottom of Fig. 28. Figure 29 is a front elevational view of the apparatus shown in Figure 28 after the punch has forced the hot aisle through the upper steel mold half and into position within the graphite disperser. Figure 30 is an exploded front elevational cross-sectional view of two press plates of a press for compressing the annular bumps of the graphite disperser having flush channels. Figure 31 is a front cross-sectional view of a graphite heat spreader having a surface layer thereon. Figure 32 is a view similar to Figure 25 showing a graphite heat spreader that has been assembled and has a surface layer and includes a flush heat channel and has a heat source that is shown at a suitable location thereon. Figure 33 is a view similar to Figure 25 illustrating the installation modes that occur in one mode of use of the heat spreader. Figure 34 is a view similar to Figure 33, showing another type of mounting die - 55-1375493 in which two screws extend through the graphite planar element, which in turn causes bending of the graphite heat spreader. Figure 35 is a view similar to Figure 34 of a modified embodiment of the present invention in which a coating has been applied to the graphite heat spreader and the mounting holes extend through the cladding to compensate for the graphite heat The structural integrity of the diffuser thus minimizes its bending.

第36圖係具有齊平式通道之石墨平面元件的正視剖 面圖’其中通道可藉由第28及29圖中所說明之程序而被 埋置於石墨平面元件中。 第37圖係一用於將熱通道連同石墨平面元件一起锻 造之鋼模的分解圖。兩鋼模半體被分開,且石墨熱分散器 被顯示位於兩鋼模半體間之適當位置處。 第3 8圖係第3 7圖中所示鋼模總成之另一視圖,其顯 示兩鋼模半體已被組合在一起,以便可將熱通道連同石墨 平面元件一起鍛造’從而導致熱通道與石墨平面元件之側 向伸展。 第39圖係由第37及38圖中所示程序經共同锻造而 得之石墨平面元件。如第36圖所示的,熱通道與石墨平 面元件兩者因锻造而已側向地伸展。 【主要元件符號說明】 10 電路總成 20 介電質層 20a/20b 主要表面 30 熱分散器 , -56- 1375493Figure 36 is a front elevational cross-sectional view of a graphite planar element having flush channels wherein the channels are embedded in the graphite planar elements by the procedures illustrated in Figures 28 and 29. Figure 37 is an exploded view of a steel mold for forging a hot aisle along with a graphite planar element. The two steel mold halves are separated and the graphite heat spreader is shown in place between the two steel mold halves. Figure 38 is another view of the steel mold assembly shown in Figure 37, showing that the two steel mold halves have been combined so that the hot aisle can be forged together with the graphite planar element to cause a hot aisle Side extension with graphite planar elements. Figure 39 is a graphite planar element obtained by co-forging from the procedures shown in Figures 37 and 38. As shown in Fig. 36, both the hot aisle and the graphite planar element have been laterally stretched for forging. [Main component symbol description] 10 Circuit assembly 20 Dielectric layer 20a/20b Main surface 30 Heat disperser , -56- 1375493

30a/30b/30c 熱消散層 40 電路 50 熱產生組件 50a/50b/50c 熱產生組件 60 熱通道 60a/60b/60c 通道 61 肩部 62 收集條 64a/64b/64c 通道單元 100 軟性電路/熱管理系統 102 石墨平面元件 104/106 平面表面 108 厚度 110 模切孔 112 內穴壁 114 熱通道 116 心柱 118 凸緣 120 熱源 122 推置螺帽 124 自由端 126 內側表面 128 墊圈 130 直徑 132 蕈狀突出部 -57- 1375493 134 衝頭 136 凹部 200 熱管理系統 200A 雙凸緣熱管理系統 202 , · · 伫垂千囬兀忏 204/206 主要平面表面 208 厚度 210 孔 2 12 內壁 214 熱通道 215 第一部分 215A 第一部分 216 心柱 216A 心柱 2 17 第二部分/第二凸緣 2 1 7 A 第二部分/第二凸緣 218 第一凸緣 218A 第一凸緣 219 內徑 2 1 9A 孔 223 心柱肩部 225 凸緣肩部 227 長度 232 覃狀突出部 -58- 137549330a/30b/30c Heat Dissipation Layer 40 Circuit 50 Heat Generation Assembly 50a/50b/50c Heat Generation Assembly 60 Heat Channel 60a/60b/60c Channel 61 Shoulder 62 Collection Bar 64a/64b/64c Channel Unit 100 Flexible Circuit / Thermal Management System 102 graphite planar element 104/106 planar surface 108 thickness 110 die cut hole 112 inner wall 114 hot channel 116 stem 118 flange 120 heat source 122 push nut 124 free end 126 inner surface 128 washer 130 diameter 132 蕈 protruding Department -57- 1375493 134 Punch 136 Recession 200 Thermal Management System 200A Double Flange Thermal Management System 202, · · 伫 千 兀忏 兀忏 204/206 Main Plane Surface 208 Thickness 210 Hole 2 12 Inner Wall 214 Hot Passage 215 Part 215A First part 216 Heart column 216A Heart column 2 17 Second part / Second flange 2 1 7 A Second part / Second flange 218 First flange 218A First flange 219 Inner diameter 2 1 9A Hole 223 Column shoulder 225 flange shoulder 227 length 232 braided projection -58- 1375493

233 長 度 234 衝 頭 234A 雙 凸 緣 通 道 235 厚 度 2 3 6 η η UU tvrr 邵 300 熱 管 理 系 統 302 石 墨 平 面 元 件 304/306 主 要 平 面 表 面 308 厚 度 3 10 孔 3 12 內 壁 3 14 熱 通 道 316/318 去 角 320/322 上 及 下 端 部 324 埋 置 設 備 326/328 上 及 下 鋼 模 半體 330 衝 頭 332 貫 穿 孔 334 部 分 孔 336 止 動 件 340 頂 表 面 342 凹 穴 346/348 凸 塊 354 表 面 層 -59-233 Length 234 Punch 234A Double flange channel 235 Thickness 2 3 6 η η UU tvrr Shao 300 Thermal Management System 302 Graphite Plane Element 304/306 Main Plane Surface 308 Thickness 3 10 Hole 3 12 Inner Wall 3 14 Hot Aisle 316/318 Dehorning 320/322 Upper and lower end 324 Embedding equipment 326/328 Upper and lower steel mold half 330 Punch 332 Through hole 334 Partial hole 336 Stopper 340 Top surface 342 Pocket 346/348 Bump 354 Surface layer -59-

Claims (1)

1375493 p-^ 修正本 ^ 月外給 第96H)2478號「具有通道之熱分散器」專利案 十、申請專利範圍: (2012年4月30曰修正) -種熱管理系統之組裝方法,其包括下列步驟: ⑷形成-貫穿一異向性石墨平面元件之厚度的 孔,該平面元件具有第-及第二相對向主要平面表面, 該孔具有_截面形狀’其具有平行於該平面元件之平面 的最大截面尺寸; (b)提供一由等向性材料所構成之熱通道該熱通道 具有與該孔之截面形狀成互補之截面形狀,且具有比該 孔之最大截面尺寸大之最小截面尺寸;其中該熱通道包 括一心柱及第一凸緣,而該心柱包含該最小截面尺寸; 及 (c)將该熱通道壓入配合於該石墨平面元件之孔 内,直到I亥第一凸緣與該石墨平面元件之其中一主要平 面表面相啣合,藉以在該熱通道與該石墨平面元件之間 形成緊密配合,以便使來自熱源之熱可經由該通道而被 傳導入該平面元件之厚度内。 2.如申請專利範圍第1項之方法,其中該石墨平面元件係 藉由壓縮複數個已剝離石墨顆粒而構成。 3 ·如申請專利範圍第1項之方法,其中該通道係由一種包 括金、銀、銅、鋁及其合金之群組中所選取之材料所構 成。 4_如申請專利範圍第1項之方法,其中: 該孔及該通道之截面形狀係圓形。 1375493 修本 5. 如申請專利範圍第1項之方法,其中: 在步驟(a )中’該孔之成形包括模切該孔。 6. 如申請專利範圍第1項之方法,其中另包括: • 在步驟(c )中,該石墨向上成蕈狀擴張於該心柱 . 之周圍,藉此形成一簟狀突出部;及 向下強制使該蕈狀突出部齊平於該石墨平面元件 之諸主要平面表面中之另一者,其係與該通道之凸緣相 對向者。 鲁 7_如申請專利範圍第1項之方法,另包括: 將第二凸緣緊配合在與該第一凸緣相對向之該心 柱的自由端上,且將該石墨平面元件壓縮在該等第一及 第二凸緣之間。 8.如申請專利範圍第1項之方法,另包括: 將一推置螺帽壓迫至與該第一凸緣相對向之該心 柱的自由端上,以便使該推置螺帽可與該石墨平面元件 相啣合,以便將該通道牢固地固定在該石墨平面元件之 • 孔内定位。 9·如申請專利範圍第!項之方法,其中被啣合的主要平面 表面是該石墨平面元件的頂表面。 1〇'種熱管理系統之組裝方法,其包括下列步驟: (a)形成一貫穿一異向性石墨平面元件之厚度的 孔,該平面7L件具有第一及第二相對向主要平面表面, 該孔具有一截面形狀,其具有平行於該平面元件之平面 的最大截面尺寸; (b)提供一由等向性材料所構成之熱通道,該熱通道 -2- 1375493 修正本 jg身^ 大致與5亥 係以圓柱盤體構形,具有去角邊緣,炅”名入 2:里正品-Μ 必真有與該孔之截面 石墨十面7L件之厚度相同的厚度,及/ 形狀成互補之截面形狀,且具有比该扎之袁大截面尺 大之最小截面尺寸; • (C)將該熱通道壓入配合於該石墨平面元件之孔 内,使得該石墨平面it件在鄰接該通羞之去角邊緣處凸 起而形成圓周凸塊,藉以在該熱通道與該石墨平面兀件 之間形成緊密配合,以便使來自熱源之熱可經由該通道 • 而被傳導入該平面元件之厚度内;及 (d)壓縮該等圓周凸塊,使得該通道係與该石墨平面 元件之兩主要平面表面齊平。 11. 如申請專利範圍第10項之方法,另包括: 在該壓縮步驟期間,共同锻造該通道與該石墨平面 元件,藉以同時產生該通道與該石墨平面元件兩者之塑 性變形》 12. 如申請專利範圍第10項之方法,其中另包括: _ 在該壓縮步驟後’包覆該等主要平面表面中之一 者,並以形成的包覆層遮蓋該通道。 1 3. —種熱管理系統,其包括: . 一異向性石墨平面兀件,其具有第一及第二相對向 • 主要平面表面;及 -熱通道,其係由等向性材料所構成,該通道被埋 置在該石墨平面元件中’且具有第一及坌_母h 人罘一露出端,其 分別齊平於該石墨平面元件之第一及第_相m /、 币一相對向主要 平面表面,該通道具有一被界定於其上之明却 人 < 凹。卩,而該石 1375493 修正本 墨平面元件則與該凹部相搭疊, 該凹部在該通道之第/及第二端之每^者上包含 一圓周去角。 μ.如申請專利範圍第13項之系統,其中該異向性石墨平 • 面兀件包括複數個經壓縮之已剝離石墨顆粒。 .15.如申請專利範圍第13項之系統其中該通道係由—種 巴括金冑_、紹及其合金之群组中所選取之材料所 構成。 鲁16.如申請專利範圍第13項之系統,其中該石墨平面元件 與。亥通道之凹部間的搭疊增強了該石墨平面元件與該 通道之間的熱傳遞。 Π.如申請專利範圍第13項之系統,其中該石墨平面元件 與該通道之凹部間的搭疊提供該通道與該石墨之間的 機械聯結。 18•如申請專利範圍第13項之系統,其巾㈣道係成圓柱 狀。 •丨9·如申請專利範圍第13項之系统,其中另包括: 表面層,其比該石墨平面元件之厚度薄,且覆蓋 。玄石墨平面元件之諸相對向主要平面表面,而該通道之 第一及第一露出端則齊平於該表面層。 20.如申請專利範圍第13項之系統,其中另包括: 包覆層,其被黏附至該第一主要平面表面,並覆 蓋該熱通道之第—端。 21如申請專利範圍第2G項之系統,其中另包括—安裝螺 絲孔,其延伸貫穿該包覆層及該石墨平面元件。 1375493 修正本 22. —種熱管理系統,其包括·· 一異向性石墨平面元件,其具有第一及第二相對向 主要平面表面,且具有一形成於該等平面表面間之厚 • 度;·該平面元件在平行該等平面表面之方向具有—相對 . 地較高之熱傳導率,而在穿過該厚度之方向上則具有_ 相對低之熱傳導率;該平面元件具有一貫穿形成在該等 平面表面間之穴部,而該穴部係由一内穴壁所界定;及 一熱通道具有: • 一心柱,其延伸穿過該穴部,並緊密地啣合該内穴 壁; V 一凸緣,其自該心柱側向地延伸,並緊密地啣合該 平面元件之諸平面表面中之一者;及 忒通道係由一等向性材料所構成,以便使來自熱源 之熱可經由該通道而被傳導入該平面元件的厚度内;及 推置螺帽,其被接納於該心柱上,並與其成摩擦 啣合,該螺帽緊貼地啣接與該凸緣相啣合之該等平面表 • 面中之„亥另平面表面,使得該平面表面被夾在該凸緣 及該螺帽之間。 23. 如申請專利範圍第22項之系統,其中該異向性石墨平 面元件包括複數個經壓縮之已剝離石墨顆粒。 24. 如申咕專利範圍第22項之系統其中該通道係由一種 包括金銀、銅、铭及其合金之群組中所選取之材料所 構成。 25. 如申:月專利範圍帛22項之系統,其中該螺帽係由一與 該通道不同之材料所構成。 1375493 修正本 26.如申請專利範圍第22項之系統,另包括: 一熱源,其具有一被界定於其上之傳熱接觸面積, 以供接觸與該凸緣相對向之該心柱的端部,而該接觸面 . 積係較小於該心柱之端部面積。 • 27.如申請專利範圍第22項之系統,其中該心柱具有一與 . 該凸緣相對向之自由端,該自由端延伸完全貫穿且超過 該推置螺帽。 28. 如申請專利範圍第22項之系統,另包括: • 一墊圈,其被鬆弛地接納於該心柱周圍’並被夾緊 於該推置螺帽與該石墨平面元件之間。 29. 如申請專利範圍第22項之系統另包括: 一第二凸緣,其被連接至該心柱上並鄰接與該第一 • 凸緣相對向之該心柱的端部處,而該第二凸緣具有一被 緊密地接納在該心柱周圍之内孔;及 ,5亥石墨平面兀件具有一環狀部,其圍繞被壓縮在該 等第一及第二凸緣之間的該穴部,以便使該等第一及第 • 二凸緣兩者可與該石墨平面元件成緊密之熱傳導啣合。 30. 如申請專利範圍第29項之系統,纟中該第二凸緣被壓 入配合於該心柱上。 • 31.如申請專利範圍第29項之系統,其中: 該心柱具有一被界定於其上且背向該第一凸緣部 的心柱肩部;及 该第二凸緣之内孔具有一被界定於其上之凸緣肩 部,其與該心柱之心柱肩部成互補且相緊靠。 32.如申請專利範圍第29項之系統,豆中: 1375493 修正本 該〜柱包括—具有恆定直徑之筆直圓柱狀外表 面且該第—凸緣之内孔係一筆直圓柱狀内孔;及 S 凸緣齊平於與該第一凸緣相對向之該心柱 的端部。 3 3. —種熱營理系#夕έ …統之.·且裝方法,包括下列步驟: (a) 形成一言兹 g , 貝穿一異向性石墨平面元件之厚度的 孔’該平面元件具有第一及第二相對向主要平面表面, 該孔具有㈣,其具有平行於該平面元件之平面 的最大截面尺寸; (b) 提供—由等向性材料所構成之熱通道該熱通道 的厚度大致與該石墨平面元件之厚度相同,且具有與該 孔之截面形狀成互補之截面形狀,且具有比該孔之最大 截面尺寸為大之最小截面尺寸;及 (C)將該熱通道壓入配合於該石墨平面元件之孔 内藉以在该熱通道與該石墨平面元件之間形成緊密配1375493 p-^ Revised this patent for the "Hot-distributor with channel" patent No. 96H) 2478. Application area: (April 30, 2012) - Assembly method of thermal management system, The method comprises the steps of: (4) forming a hole through a thickness of an anisotropic graphite planar element, the planar element having first and second opposing major planar surfaces, the aperture having a cross-sectional shape 'having parallel to the planar element a maximum cross-sectional dimension of the plane; (b) providing a hot channel composed of an isotropic material having a cross-sectional shape complementary to the cross-sectional shape of the hole and having a minimum cross-section larger than the largest cross-sectional dimension of the hole Dimensions; wherein the hot channel includes a stem and a first flange, and the stem includes the minimum cross-sectional dimension; and (c) press-fit the hot channel into the hole of the graphite planar member until IH first a flange engaging one of the major planar surfaces of the graphite planar member to form a tight fit between the thermal passage and the graphite planar member such that heat from the heat source can be passed The channel is conducted into the thickness of the planar element. 2. The method of claim 1, wherein the graphite planar element is constructed by compressing a plurality of stripped graphite particles. 3. The method of claim 1, wherein the channel is formed from a material selected from the group consisting of gold, silver, copper, aluminum, and alloys thereof. 4) The method of claim 1, wherein: the hole and the cross-sectional shape of the channel are circular. 1375493. The method of claim 1, wherein: in step (a), forming the hole comprises die cutting the hole. 6. The method of claim 1, wherein the method further comprises: • in the step (c), the graphite is expanded in a weft shape around the stem, thereby forming a dome-shaped protrusion; The lower projection is forced to be flush with the other of the major planar surfaces of the graphite planar member that is opposite the flange of the passage. The method of claim 1, further comprising: fitting a second flange tightly on a free end of the stem opposite the first flange, and compressing the graphite planar member Waiting between the first and second flanges. 8. The method of claim 1, further comprising: pressing a push nut onto a free end of the stem opposite the first flange such that the push nut is engageable The graphite planar elements are engaged to securely secure the channel within the bore of the graphite planar element. 9. If you apply for a patent scope! The method of the item wherein the primary planar surface to be engaged is the top surface of the graphite planar member. A method of assembling a thermal management system comprising the steps of: (a) forming a hole through a thickness of an anisotropic graphite planar member, the planar 7L having first and second opposing major planar surfaces, The hole has a cross-sectional shape having a maximum cross-sectional dimension parallel to a plane of the planar element; (b) providing a hot aisle composed of an isotropic material, the hot aisle -2- 1537493 With the 5 Hai system with a cylindrical disk configuration, with a chamfered edge, 炅" Name 2: Authentic - Μ must have the same thickness as the thickness of the cross-section graphite of the hole 7L 7L, and / shape complementary a cross-sectional shape having a minimum cross-sectional dimension larger than a large cross-section of the tie; (C) press-fitting the hot channel into the hole of the graphite planar member such that the graphite planar piece is adjacent to the shyness Forming a circumferential projection at the corner of the chamfer to form a tight fit between the hot channel and the graphite planar element so that heat from the heat source can be conducted into the thickness of the planar element via the channel And (d) compressing the circumferential projections such that the passageway is flush with the two major planar surfaces of the graphite planar member. 11. The method of claim 10, further comprising: during the compressing step Cooperating the channel with the graphite planar element to simultaneously produce plastic deformation of both the channel and the graphite planar element. 12. The method of claim 10, wherein the method further comprises: _ after the compressing step Coating one of the major planar surfaces and covering the channel with the formed cladding layer. 1 3. A thermal management system comprising: an anisotropic graphite planar element having a first a second opposing surface; a primary planar surface; and a thermal channel formed by an isotropic material embedded in the graphite planar element and having a first and a 坌, which are respectively flush with the first and the first phase of the graphite planar element, and a relative planar surface of the coin, the channel having a distinctly defined person < concave, 卩, and the stone 1375493 The modified ink planar member is overlapped with the recess, the recess comprising a circumferential chamfer on each of the first and second ends of the channel. μ. The system of claim 13 wherein An anisotropic graphite flat • a face piece comprising a plurality of compressed stripped graphite particles. 15. The system of claim 13 wherein the channel is made of a type of bar, gold, and alloy. The system of claim 13, wherein the overlap between the graphite planar element and the recess of the channel enhances the plane between the graphite planar element and the channel. The system of claim 13, wherein the overlap between the graphite planar element and the recess of the channel provides a mechanical bond between the channel and the graphite. 18• If the system of claim 13 is applied, the towel (4) is cylindrical. • The system of claim 13, wherein the system further comprises: a surface layer that is thinner than the thickness of the graphite planar element and covers. The meta-graphite planar elements are opposed to the major planar surface, and the first and first exposed ends of the channel are flush with the surface layer. 20. The system of claim 13 further comprising: a cladding adhered to the first major planar surface and covering the first end of the thermal pathway. 21 The system of claim 2G, further comprising - mounting a screw hole extending through the cladding layer and the graphite planar member. 1375493 MODIFICATION 22. A thermal management system comprising: an anisotropic graphite planar element having first and second opposing major planar surfaces and having a thickness between the planar surfaces The planar element has a relatively high thermal conductivity in a direction parallel to the planar surfaces and a relatively low thermal conductivity in a direction through the thickness; the planar element has a through formation a pocket between the planar surfaces, the pocket being defined by an inner wall; and a hot aisle having: • a post extending through the pocket and closely engaging the inner wall; a flange extending laterally from the stem and closely engaging one of the planar surfaces of the planar member; and the channel is formed of an isotropic material to provide heat from the source Heat can be conducted through the channel into the thickness of the planar element; and a push nut is received on the core post and frictionally engaged therewith, the nut being snugly engaged with the flange The plane table • a flat surface in the face such that the planar surface is sandwiched between the flange and the nut. 23. The system of claim 22, wherein the anisotropic graphite planar element comprises a plurality of Compressed exfoliated graphite particles. 24. The system of claim 22, wherein the channel is composed of a material selected from the group consisting of gold, silver, copper, and alloys thereof. The system of claim 22, wherein the nut is composed of a material different from the channel. 1375493 Amendment 26. The system of claim 22, further comprising: a heat source having a a heat transfer contact area defined thereon for contacting an end of the stem opposite the flange, the contact surface being smaller than the end area of the stem. The system of claim 22, wherein the stem has a free end opposite the flange, the free end extending completely through and beyond the push nut. 28. As claimed in claim 22 System, including: a gasket that is loosely received around the stem and is clamped between the push nut and the graphite planar element. 29. The system of claim 22 further comprising: a second convex a rim that is attached to the stem and abuts the end of the stem opposite the first flange, the second flange having an inner bore that is tightly received around the stem And a 5 hp graphite planar element having an annular portion surrounding the pocket compressed between the first and second flanges to enable both the first and second flanges The heat transfer can be tightly coupled to the graphite planar member. 30. The system of claim 29, wherein the second flange is press fit into the stem. 31. The system of claim 29, wherein: the stem has a stem shoulder defined thereon and facing away from the first flange; and the inner bore of the second flange has A flange shoulder defined thereon that is complementary to and abuts the shoulder of the stem of the stem. 32. The system of claim 29, wherein: 1375493 is modified to include a straight cylindrical outer surface having a constant diameter and the inner bore of the first flange is a straight cylindrical inner bore; The S flange is flush with the end of the stem opposite the first flange. 3 3. A kind of thermal management system #夕έ... The method of installation, including the following steps: (a) forming a hole, a hole in the thickness of an anisotropic graphite planar element Having a first and a second opposing major planar surface, the aperture having (four) having a largest cross-sectional dimension parallel to a plane of the planar element; (b) providing a hot aisle comprised of an isotropic material The thickness is substantially the same as the thickness of the graphite planar member, and has a cross-sectional shape complementary to the cross-sectional shape of the hole, and has a minimum cross-sectional dimension larger than a maximum cross-sectional dimension of the hole; and (C) pressing the hot runner Incorporating into the hole of the graphite planar element to form a tight fit between the hot channel and the graphite planar element 合,使得來自熱源之熱可經由該通道而被傳導入該平面 元件之厚度内;及 (d)包覆該平面元件的主要平面表面中之一者,並以 形成的包覆層遮蓋該熱通道。 1375493So that heat from the heat source can be conducted into the thickness of the planar element via the channel; and (d) one of the major planar surfaces of the planar element is coated, and the heat is covered by the formed cladding layer aisle. 1375493 π年MM曰修C^i正替換頁π year MM repair C ^ i positive replacement page 314 τ^7/7///314 τ^7/7/// c 第39圖c Figure 39
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