WO2007087090A3 - Heat spreaders with vias - Google Patents

Heat spreaders with vias Download PDF

Info

Publication number
WO2007087090A3
WO2007087090A3 PCT/US2006/061588 US2006061588W WO2007087090A3 WO 2007087090 A3 WO2007087090 A3 WO 2007087090A3 US 2006061588 W US2006061588 W US 2006061588W WO 2007087090 A3 WO2007087090 A3 WO 2007087090A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat spreaders
vias
graphite heat
thermal vias
graphite
Prior art date
Application number
PCT/US2006/061588
Other languages
French (fr)
Other versions
WO2007087090A2 (en
Inventor
Bradley E Reis
Martin David Smalc
Brian J Laser
Gary Stephen Kostyak
Prathib Skandakumaran
Matthew G Getz
Michael Frastaci
Original Assignee
Advanced Energy Tech
Bradley E Reis
Martin David Smalc
Brian J Laser
Gary Stephen Kostyak
Prathib Skandakumaran
Matthew G Getz
Michael Frastaci
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/339,338 external-priority patent/US7303005B2/en
Application filed by Advanced Energy Tech, Bradley E Reis, Martin David Smalc, Brian J Laser, Gary Stephen Kostyak, Prathib Skandakumaran, Matthew G Getz, Michael Frastaci filed Critical Advanced Energy Tech
Publication of WO2007087090A2 publication Critical patent/WO2007087090A2/en
Publication of WO2007087090A3 publication Critical patent/WO2007087090A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

Graphite heat spreaders (10) are manufactured with thermal vias (60 or 114)) placed therethrough. The thermal vias may have one or two flanges (118). There are also flush thermal vias (314). Graphite heat spreaders have surface layers (354) covering the graphite material. Graphite heat spreaders have a layer of cladding (368) for increased structural integrity. A graphite heat spreader element may be co-forged with a metal thermal via in place therein.
PCT/US2006/061588 2006-01-25 2006-12-05 Heat spreaders with vias WO2007087090A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/339,338 US7303005B2 (en) 2005-11-04 2006-01-25 Heat spreaders with vias
US11/339,338 2006-01-25

Publications (2)

Publication Number Publication Date
WO2007087090A2 WO2007087090A2 (en) 2007-08-02
WO2007087090A3 true WO2007087090A3 (en) 2007-12-21

Family

ID=38309722

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/061588 WO2007087090A2 (en) 2006-01-25 2006-12-05 Heat spreaders with vias

Country Status (2)

Country Link
TW (1) TWI375493B (en)
WO (1) WO2007087090A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO330346B1 (en) * 2009-07-20 2011-03-28 Sinvent As Local thermal management
KR101835385B1 (en) 2017-09-29 2018-03-09 인동전자(주) Preparation method of thermal conductive thin film using artificial graphite powder
WO2023240552A1 (en) * 2022-06-16 2023-12-21 宁德时代新能源科技股份有限公司 Thermal management component, battery and electric device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5660917A (en) * 1993-07-06 1997-08-26 Kabushiki Kaisha Toshiba Thermal conductivity sheet
US20030116312A1 (en) * 2001-12-13 2003-06-26 Krassowski Daniel W. Heat dissipating component using high conducting inserts
US6930885B2 (en) * 2002-12-23 2005-08-16 Eastman Kodak Company Densely packed electronic assemblage with heat removing element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5660917A (en) * 1993-07-06 1997-08-26 Kabushiki Kaisha Toshiba Thermal conductivity sheet
US20030116312A1 (en) * 2001-12-13 2003-06-26 Krassowski Daniel W. Heat dissipating component using high conducting inserts
US6930885B2 (en) * 2002-12-23 2005-08-16 Eastman Kodak Company Densely packed electronic assemblage with heat removing element

Also Published As

Publication number Publication date
TW200810621A (en) 2008-02-16
TWI375493B (en) 2012-10-21
WO2007087090A2 (en) 2007-08-02

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