CN108419359A - A kind of single-sided circuit board of good heat dissipation effect - Google Patents
A kind of single-sided circuit board of good heat dissipation effect Download PDFInfo
- Publication number
- CN108419359A CN108419359A CN201810404056.1A CN201810404056A CN108419359A CN 108419359 A CN108419359 A CN 108419359A CN 201810404056 A CN201810404056 A CN 201810404056A CN 108419359 A CN108419359 A CN 108419359A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- main body
- ceramic layer
- dielectric ceramic
- cooling piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of single-sided circuit boards of good heat dissipation effect,Including circuit board main body and cooling piece ontology,The circuit board main body is located at the setting of cooling piece bodies top,It is covered with solder mask at the top of the circuit board main body,It is covered with protective film at the top of the solder mask,Cooling piece ontology top and bottom are respectively the first dielectric ceramic layer and the second dielectric ceramic layer,Metallic conductor is equipped between first dielectric ceramic layer and the second dielectric ceramic layer,P-type semiconductor and N-type semiconductor are equipped between the metallic conductor,The circuit board main body and cooling piece ontology both ends are equipped with fixture block,The present invention in circuit board main body bottom by being arranged cooling piece ontology,It is powered using cooling piece ontology,First dielectric ceramic layer absorbs heat,Second dielectric ceramic layer radiates,The heat generated when effectively circuit board main body can work distributes,It can play the role of fixed limitation well by the fixture block of both sides,With very high practicability.
Description
Technical field
The present invention relates to circuit board technology field, specially a kind of single-sided circuit board of good heat dissipation effect.
Background technology
The title of circuit board has：Ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for permanent circuit are laid out lifting
It acts on.Circuit board can be described as printed wiring board or printed circuit board, and English name is (Printed Circuit Board)
PCB, (Flexible Printed Circuit board) (FPC wiring boards are also known as flexible circuitry board flexible circuit to FPC wiring boards
Plate is that have height reliability, excellent pliable printed circuit to be a kind of made of base material using polyimides or polyester film
Plate.Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good！) and Rigid Flex (reechas, Soft and
Hard combination plate)-FPC and PCB birth and development, expedited the emergence of Rigid Flex this new product.Therefore,
Rigid Flex is exactly that flexible circuit board and rigid wiring board are combined by related process requirement one by processes such as pressings
It rises, the wiring board with FPC characteristics and PCB characteristics of formation.
Existing single sided circuits harden structure in use, often because radiate the damage of bad issues results in circuit plate or
Service life reduces, and has certain limitation.
Invention content
The purpose of the present invention is to provide a kind of single-sided circuit boards of good heat dissipation effect, to solve to carry in above-mentioned background technology
The problem of going out.
To achieve the above object, the present invention provides the following technical solutions：A kind of single-sided circuit board of good heat dissipation effect, including
Circuit board main body and cooling piece ontology, the circuit board main body are located at the setting of cooling piece bodies top, the circuit board main body top
Portion is covered with solder mask, is covered with protective film at the top of the solder mask, cooling piece ontology top and bottom are respectively the first insulation
Ceramic layer and the second dielectric ceramic layer are equipped with metallic conductor, institute between first dielectric ceramic layer and the second dielectric ceramic layer
It states and is equipped with P-type semiconductor and N-type semiconductor between metallic conductor, the circuit board main body and cooling piece ontology both ends are equipped with card
Block.
Preferably, the fixture block is C-shaped, and the fixture block is insulating ceramics block.
Preferably, first dielectric ceramic layer and the second dielectric ceramic layer consistency of thickness, and first insulating ceramics
Layer and the second insulating ceramics layer thickness are no more than 5mm.
Preferably, the circuit board main body and cooling piece ontology both sides offer location hole.
Preferably, the fixture block is fixedly connected on circuit board main body and cooling piece ontology in both sides by fixing bolt up and down.
Compared with prior art, the beneficial effects of the invention are as follows：A kind of single-sided circuit board of good heat dissipation effect of the present invention, knot
Structure is novel, easy to operate, by the way that cooling piece ontology is arranged in circuit board main body bottom, is powered using cooling piece ontology, first absolutely
Edge ceramic layer absorbs heat, and the second dielectric ceramic layer heat dissipation, the heat generated when effectively circuit board main body can work gives out
It goes, fixed limitation well can be played the role of by the fixture block of both sides, and convenient for disassembly and assembly, there is very high practicability,
It is functional to greatly improve a kind of use of the single-sided circuit board of good heat dissipation effect, ensures its using effect and utilization benefit,
It is suitble to be widely popularized.
Description of the drawings
Fig. 1 is main structure diagram of the present invention；
Fig. 2 is overlooking structure diagram of the present invention.
In figure：1 circuit board main body, 2 cooling piece ontologies, 3 solder masks, 4 protective films, 5 first dielectric ceramic layers, 6 second are absolutely
Edge ceramic layer, 7 metallic conductors, 8P types semiconductor, 9N types semiconductor, 10 fixture blocks, 11 fixing bolts.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the present invention provides a kind of technical solution：A kind of single-sided circuit board of good heat dissipation effect, including electricity
Road plate body 1 and cooling piece ontology 2, the circuit board main body 1 are located at the 2 top setting of cooling piece ontology, the circuit board main body 1
Top is covered with solder mask 3, and 3 top of the solder mask is covered with protective film 4, and 2 top and bottom of cooling piece ontology are respectively the
One dielectric ceramic layer 5 and the second dielectric ceramic layer 6 are equipped with gold between first dielectric ceramic layer, 5 and second dielectric ceramic layer 6
Belong to conductor 7, P-type semiconductor 8 and N-type semiconductor 9, the circuit board main body 1 and cooling piece sheet are equipped between the metallic conductor 7
2 both ends of body are equipped with fixture block 10, and the fixture block 10 is C-shaped, and the fixture block 10 is insulating ceramics block, first dielectric ceramic layer 5
With 6 consistency of thickness of the second dielectric ceramic layer, and 5 and second dielectric ceramic layer of the first dielectric ceramic layer, 6 thickness is no more than
1cm, the circuit board main body 1 and 2 both sides of cooling piece ontology offer location hole, and about 10 both sides of the fixture block pass through fixation
Bolt 11 is fixedly connected on circuit board main body 1 and cooling piece ontology 2.
Operation principle：A kind of single-sided circuit board of good heat dissipation effect of the present invention, in use, by 1 bottom of circuit board main body
Cooling piece ontology 2 is arranged in portion, is powered using cooling piece ontology 2, and the first dielectric ceramic layer 5 heat absorption, the second dielectric ceramic layer 6 dissipates
Heat, the heat generated when effectively circuit board main body 1 can work are distributed, can be played very by the fixture block 10 of both sides
The effect of good fixed limitation, and it is convenient for disassembly and assembly, there is very high practicability.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be machine
Tool connects, and can also be electrical connection；It can be directly connected, can also can be indirectly connected through an intermediary two members
Connection inside part.For the ordinary skill in the art, above-mentioned term can be understood in this hair as the case may be
Concrete meaning in bright.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of single-sided circuit board of good heat dissipation effect, including circuit board main body (1) and cooling piece ontology (2), it is characterised in that：
The circuit board main body (1) is located at setting at the top of cooling piece ontology (2), and solder mask is covered at the top of the circuit board main body (1)
(3), protective film (4) is covered at the top of the solder mask (3), cooling piece ontology (2) top and bottom are respectively the first insulation pottery
Enamel coating (5) and the second dielectric ceramic layer (6) are equipped with gold between first dielectric ceramic layer (5) and the second dielectric ceramic layer (6)
Belong to conductor (7), P-type semiconductor (8) and N-type semiconductor (9), the circuit board main body (1) are equipped between the metallic conductor (7)
It is equipped with fixture block (10) with cooling piece ontology (2) both ends.
2. a kind of single-sided circuit board of good heat dissipation effect according to claim 1, it is characterised in that：The fixture block (10) is in
C-type, the fixture block (10) are insulating ceramics block.
3. a kind of single-sided circuit board of good heat dissipation effect according to claim 1, it is characterised in that：The first insulation pottery
Enamel coating (5) and the second dielectric ceramic layer (6) consistency of thickness, and first dielectric ceramic layer (5) and the second dielectric ceramic layer (6)
Thickness is no more than 5mm.
4. a kind of single-sided circuit board of good heat dissipation effect according to claim 1, it is characterised in that：The circuit board main body
(1) and cooling piece ontology (2) both sides offer location hole.
5. a kind of single-sided circuit board of good heat dissipation effect according to claim 1, it is characterised in that：On the fixture block (10)
Lower both sides are fixedly connected on circuit board main body (1) and cooling piece ontology (2) by fixing bolt (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810404056.1A CN108419359A (en) | 2018-04-28 | 2018-04-28 | A kind of single-sided circuit board of good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810404056.1A CN108419359A (en) | 2018-04-28 | 2018-04-28 | A kind of single-sided circuit board of good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108419359A true CN108419359A (en) | 2018-08-17 |
Family
ID=63137295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810404056.1A Withdrawn CN108419359A (en) | 2018-04-28 | 2018-04-28 | A kind of single-sided circuit board of good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108419359A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111417258A (en) * | 2020-05-15 | 2020-07-14 | 汪向丽 | Anti-aging circuit board |
| TWI700019B (en) * | 2018-10-26 | 2020-07-21 | 大陸商業成科技（成都）有限公司 | Printed circuit board and manufacturing method thereof |
| CN114269062A (en) * | 2022-01-10 | 2022-04-01 | 郝芪 | Composite heat-conducting PCB |
-
2018
- 2018-04-28 CN CN201810404056.1A patent/CN108419359A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI700019B (en) * | 2018-10-26 | 2020-07-21 | 大陸商業成科技（成都）有限公司 | Printed circuit board and manufacturing method thereof |
| CN111417258A (en) * | 2020-05-15 | 2020-07-14 | 汪向丽 | Anti-aging circuit board |
| CN111417258B (en) * | 2020-05-15 | 2022-12-06 | 安徽全照电子有限公司 | Anti-aging circuit board |
| CN114269062A (en) * | 2022-01-10 | 2022-04-01 | 郝芪 | Composite heat-conducting PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180817 |
|
| WW01 | Invention patent application withdrawn after publication |