CN108566725A - A kind of corrosion resistant type multi-layer PCB board - Google Patents
A kind of corrosion resistant type multi-layer PCB board Download PDFInfo
- Publication number
- CN108566725A CN108566725A CN201810774982.8A CN201810774982A CN108566725A CN 108566725 A CN108566725 A CN 108566725A CN 201810774982 A CN201810774982 A CN 201810774982A CN 108566725 A CN108566725 A CN 108566725A
- Authority
- CN
- China
- Prior art keywords
- heat
- layer
- substrate
- emission hole
- heat emission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005260 corrosion Methods 0.000 title claims abstract description 23
- 230000007797 corrosion Effects 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 210000002966 serum Anatomy 0.000 claims abstract description 19
- 230000001681 protective effect Effects 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 39
- 238000000576 coating method Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 239000012792 core layer Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000004922 lacquer Substances 0.000 claims description 7
- 238000010422 painting Methods 0.000 claims description 7
- 239000010754 BS 2869 Class F Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- LCDFWRDNEPDQBV-UHFFFAOYSA-N formaldehyde;phenol;urea Chemical compound O=C.NC(N)=O.OC1=CC=CC=C1 LCDFWRDNEPDQBV-UHFFFAOYSA-N 0.000 claims 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 15
- 239000007788 liquid Substances 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
Abstract
The invention discloses a kind of corrosion resistant type multi-layer PCB boards,Including the first heat emission hole,First cooling fin,Second cooling fin,Second heat emission hole,Protective plate and anticorrosion serum cap,Make outside air that can enter inside heat dissipating layer by the way that the first heat emission hole is arranged,To accelerate the speed that heat sheds,The radiating rate of heat-conducting plate is further improved by the way that the first cooling fin and the second cooling fin is arranged,To further improve the heat dissipation performance of equipment,It is used to further facilitate shedding for heat in heat-conducting layer by the way that the second heat emission hole is arranged,Further improve the heat dissipation performance of equipment,By the way that protective plate is arranged for protecting substrate both sides,It is used to substrate top is blocked corrosive liquids is avoided to fall substrate is caused to corrode in substrate top by the way that anticorrosion serum cap is arranged,Improve the corrosion resistance of equipment,Heat sheds when being used to further facilitate substrate work by the way that third heat emission hole is arranged.
Description
Technical field
The present invention relates to a kind of pcb board, specifically a kind of corrosion resistant type multi-layer PCB board.
Background technology
The title of circuit board has：Ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for permanent circuit are laid out lifting
It acts on.Circuit board can be described as printed wiring board or printed circuit board, and (FPC wiring boards are also known as flexible circuit board flexible PCB
There is height reliability, excellent flexible printed circuit to be a kind of made of base material using polyimides or polyester film.Tool
Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good！) and Rigid Flex FPC and PCB birth and development,
Rigid Flex this new product is expedited the emergence of.Therefore, Rigid Flex is exactly flexible circuit board and rigid wiring board, through overvoltage
The processes such as conjunction, are combined, the wiring board with FPC characteristics and PCB characteristics of formation by related process requirement；
In recent ten years, printed circuit board manufacturing in China's is quickly grown, and circuit board integrated level is higher and higher, and performance is increasingly
It is good, but it is following but have also discovered that many problems are to be solved, the thermal diffusivity and corrosion resistance of existing pcb board are poor, make
It is shorter with the service life.
Invention content
It is mentioned above in the background art to solve the purpose of the present invention is to provide a kind of corrosion resistant type multi-layer PCB board
Problem.
To achieve the above object, the present invention provides the following technical solutions：
A kind of corrosion resistant type multi-layer PCB board, including anticorrosion serum cap, lacquer painting layer, heat-conducting plate, substrate, radiator, first dissipate
Hot hole, corrosion-resisting film, heat-conducting layer, the second heat emission hole, mounting hole, mounting plate, protective plate and third heat emission hole, the substrate include
High frequency coating and insulative core layer, the insulative core layer outer surface are coated with high frequency coating, and the substrate top is coated with lacquer painting layer,
Corrosion-resisting film is fixedly connected on the outside of the substrate, the base plate bottom is installed with heat-conducting plate, and the heat-conducting plate bottom is solid
Surely it is connected with heat-conducting layer, multiple first heat emission holes are offered in the heat-conducting layer, first heat emission hole connects with heat-conducting plate bottom
It is logical, radiator is provided in first heat emission hole, the radiator includes the first cooling fin and the second cooling fin, described
Second cooling fin is fixedly mounted on heat-conducting plate bottom, and multiple first cooling fins are installed on second cooling fin, described
Position in heat-conducting layer below the first heat emission hole offers the second heat emission hole, and the heat-conducting plate both sides are installed with one
A mounting plate offers mounting hole on mounting plate, and protective plate is installed at the top of mounting plate, is set right over the substrate top
It is equipped with anticorrosion serum cap, the anticorrosion serum cap is fixedly mounted at the top of protective plate, and anticorrosion serum cap side is opened
Equipped with multiple third heat emission holes.
As a further solution of the present invention：The insulative core layer is by the class F insulating material Fs such as FR4 or ceramic material or doping
The class F insulating material Fs such as the FR4 of ceramic powders are made.
As further scheme of the invention：The high frequency coating is made of polytetrafluoroethylene material.
As further scheme of the invention：The corrosion-resisting film is made of phenolic resin material.
As further scheme of the invention：The heat-conducting plate is made of easy thermal conductive metallic material.
Compared with prior art, the beneficial effects of the invention are as follows：Pcb board is improved by setting corrosion-resisting film using
Corrosion resistance in journey extends the service life of pcb board, improves the practicability of equipment, and being used for by setting heat-conducting plate will
The heat that substrate generates when working sheds, and improves the heat dissipation performance of equipment, makes extraneous sky by the way that the first heat emission hole is arranged
Gas can enter inside heat dissipating layer, to accelerate the speed that heat sheds, by be arranged the first cooling fin and the second cooling fin into
One step improves the radiating rate of heat-conducting plate, to further improve the heat dissipation performance of equipment, by the way that the second heat emission hole is arranged
For further facilitating shedding for heat in heat-conducting layer, the heat dissipation performance of equipment is further improved, is passed through and protective plate is set is used
It is protected in substrate both sides, by the way that anticorrosion serum cap is arranged for being blocked to avoid corrosivity to substrate top
Liquid is fallen to be caused to corrode in substrate top to substrate, to further improve the corrosion resistance of equipment, is dissipated by the way that third is arranged
Heat sheds when hot hole is used to further facilitate substrate work, further improves the heat dissipation performance of equipment.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of corrosion resistant type multi-layer PCB board.
Fig. 2 is a kind of structural schematic diagram of anticorrosion serum cap in corrosion resistant type multi-layer PCB board.
Fig. 3 is a kind of structural schematic diagram of radiator in corrosion resistant type multi-layer PCB board.
As shown in the figure：Anticorrosion serum cap 1, lacquer painting layer 2, high frequency coating 3, insulative core layer 4, heat-conducting plate 5, substrate 6, heat dissipation
Device 7, the first heat emission hole 8, corrosion-resisting film 9, heat-conducting layer 10, the second heat emission hole 11, mounting hole 12, mounting plate 13, protective plate 14,
Third heat emission hole 15, the first cooling fin 16, the second cooling fin 17.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig.1~3, in the embodiment of the present invention, a kind of corrosion resistant type multi-layer PCB board, including anticorrosion serum cap 1,
Lacquer painting layer 2, heat-conducting plate 5, substrate 6, radiator 7, the first heat emission hole 8, corrosion-resisting film 9, heat-conducting layer 10, the second heat emission hole 11,
Mounting hole 12, mounting plate 13, protective plate 14 and third heat emission hole 15, the substrate 6 include high frequency coating 3 and insulative core layer 4, institute
Insulative core layer 4 is stated to be made of class F insulating material Fs such as the class F insulating material Fs such as FR4 or ceramic material or the FR4 for being doped with ceramic powders,
4 outer surface of the insulative core layer is coated with high frequency coating 3, and the high frequency coating 3 is made of polytetrafluoroethylene material, the substrate
6 top coatings have lacquer painting layer 2,6 outside of the substrate to be fixedly connected with corrosion-resisting film 9, and the corrosion-resisting film 9 is by phenolic resin material
Material is made, and improves the corrosion resistance of pcb board in use by the way that corrosion-resisting film 9 is arranged, extend pcb board uses the longevity
Life improves the practicability of equipment, and 6 bottom of the substrate is installed with heat-conducting plate 5, and the heat-conducting plate 5 is easy heat-conducting metal
Material is made, and is shed by the way that heat of the heat-conducting plate 5 for being generated when substrate 6 works is arranged, improves the heat dissipation of equipment
Performance, 5 bottom of the heat-conducting plate are fixedly connected with heat-conducting layer 10, and multiple first heat emission holes 8, institute are offered in the heat-conducting layer 10
The first heat emission hole 8 is stated to be connected to 5 bottom of heat-conducting plate；
Radiator 7 is provided in first heat emission hole 8, the radiator 7 radiates including the first cooling fin 16 and second
Piece 17, second cooling fin 17 are fixedly mounted on 5 bottom of heat-conducting plate, and multiple are installed on second cooling fin 17
One cooling fin 16 makes outside air that can enter inside heat-conducting layer 10, sheds to accelerate heat by the way that the first heat emission hole 8 is arranged
Speed, the radiating rate of heat-conducting plate 5 is further improved by the way that the first cooling fin 16 and the second cooling fin 17 is arranged, into
One step improves the heat dissipation performance of equipment, and offering second positioned at the position of 8 lower section of the first heat emission hole in the heat-conducting layer 10 dissipates
Hot hole 11 is used to further facilitate shedding for heat in heat-conducting layer 10 by the way that the second heat emission hole 11 is arranged, further improves and set
Standby heat dissipation performance, 5 both sides of the heat-conducting plate are fixedly mounted there are one mounting plate 13, and mounting hole is offered on mounting plate 13
12,13 top of mounting plate is installed with protective plate 14, is used to protect 6 both sides of substrate by the way that protective plate 14 is arranged, institute
It states 6 top of substrate and is arranged above anticorrosion serum cap 1, the anticorrosion serum cap 1 is fixedly mounted on 14 top of protective plate,
By be arranged anticorrosion serum cap 1 be used to that the top of substrate 6 to be blocked corrosive liquids is avoided to fall it is right at 6 top of substrate
Substrate 6 causes to corrode, and to further improve the corrosion resistance of equipment, 1 side of anticorrosion serum cap offers multiple
Third heat emission hole 15 is used to further facilitate heat when substrate 6 works by the way that third heat emission hole 15 is arranged and sheds, further carries
The high heat dissipation performance of equipment.
The present invention operation principle be：Pcb board in use corrosion-resistant is improved by the way that corrosion-resisting film 9 is arranged
Property, the service life of pcb board is extended, the practicability of equipment is improved, by the way that heat-conducting plate 5 is arranged for when substrate 6 works
The heat of generation sheds, and improves the heat dissipation performance of equipment, makes outside air that can enter by the first heat emission hole 8 of setting and leads
Inside thermosphere 10, to accelerate the speed that heat sheds, by the way that the first cooling fin 16 and the second cooling fin 17 is arranged further
The radiating rate for improving heat-conducting plate 5 is used to further improve the heat dissipation performance of equipment by the way that the second heat emission hole 11 is arranged
In further facilitating shedding for heat in heat-conducting layer 10, the heat dissipation performance of equipment is further improved, passes through and protective plate 14 is set
For protecting 6 both sides of substrate, by the way that anticorrosion serum cap 1 is arranged it is used to that 6 top of substrate to be blocked to avoid
Corrosive liquids is fallen to be caused to corrode at 6 top of substrate to substrate 6, to further improve the corrosion resistance of equipment, by setting
It sets third heat emission hole 15 and sheds for further facilitating heat when substrate 6 works, further improve the heat dissipation performance of equipment.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art,
It still can be with technical scheme described in the above embodiments is modified, or is carried out to which part technical characteristic etc.
With replacing, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this
Within the protection domain of invention.
Claims (5)
1. a kind of corrosion resistant type multi-layer PCB board, including anticorrosion serum cap (1), lacquer painting layer (2), heat-conducting plate (5), substrate (6),
Radiator (7), the first heat emission hole (8), corrosion-resisting film (9), heat-conducting layer (10), the second heat emission hole (11), mounting hole (12), peace
Loading board (13), protective plate (14) and third heat emission hole (15), which is characterized in that the substrate (6) include high frequency coating (3) and absolutely
Edge sandwich layer (4), insulative core layer (4) outer surface are coated with high frequency coating (3), and substrate (6) top coating has lacquer painting layer
(2), it being fixedly connected with corrosion-resisting film (9) on the outside of the substrate (6), substrate (6) bottom is installed with heat-conducting plate (5),
Heat-conducting plate (5) bottom is fixedly connected with heat-conducting layer (10), and multiple first heat emission holes are offered in the heat-conducting layer (10)
(8), first heat emission hole (8) is connected to heat-conducting plate (5) bottom, and radiator is provided in first heat emission hole (8)
(7), the radiator (7) includes the first cooling fin (16) and the second cooling fin (17), and second cooling fin (17) is fixed
Mounted on heat-conducting plate (5) bottom, multiple first cooling fins (16), the heat conduction are installed on second cooling fin (17)
Position in layer (10) below the first heat emission hole (8) offers the second heat emission hole (11), and heat-conducting plate (5) both sides are solid
Dingan County's dress offers mounting hole (12), is installed at the top of mounting plate (13) there are one mounting plate (13) on mounting plate (13)
Protective plate (14), substrate (6) top are arranged above anticorrosion serum cap (1), and the anticorrosion serum cap (1) is fixed
At the top of protective plate (14), anticorrosion serum cap (1) side offers multiple third heat emission holes (15).
2. a kind of corrosion resistant type multi-layer PCB board according to claim 1, which is characterized in that the insulative core layer (4) by
The class F insulating material Fs such as the class F insulating material Fs such as FR4 or ceramic material or the FR4 that is doped with ceramic powders are made.
3. a kind of corrosion resistant type multi-layer PCB board according to claim 1, which is characterized in that the high frequency coating (3) is by gathering
Tetrafluoroethene material is made.
4. a kind of corrosion resistant type multi-layer PCB board according to claim 1, which is characterized in that the corrosion-resisting film (9) is by phenol
Urea formaldehyde material is made.
5. a kind of corrosion resistant type multi-layer PCB board according to claim 1, which is characterized in that the heat-conducting plate (5) is easily to lead
Hot metallic material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810774982.8A CN108566725A (en) | 2018-07-16 | 2018-07-16 | A kind of corrosion resistant type multi-layer PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810774982.8A CN108566725A (en) | 2018-07-16 | 2018-07-16 | A kind of corrosion resistant type multi-layer PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108566725A true CN108566725A (en) | 2018-09-21 |
Family
ID=63555386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810774982.8A Pending CN108566725A (en) | 2018-07-16 | 2018-07-16 | A kind of corrosion resistant type multi-layer PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108566725A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09126670A (en) * | 1995-10-30 | 1997-05-16 | Furukawa Electric Co Ltd:The | Heat pipe type heat sink |
| CN206851133U (en) * | 2017-06-14 | 2018-01-05 | 梅州市达富多层线路板有限公司 | A kind of novel corrosion resistant multilayer circuit board |
| CN207305059U (en) * | 2017-10-10 | 2018-05-01 | 东洋通信技术（深圳）有限公司 | A kind of PCB circuit board of high efficiency and heat radiation multilayer |
| CN207531170U (en) * | 2017-12-06 | 2018-06-22 | 东莞联桥电子有限公司 | A kind of cooling circuit board |
| CN208462137U (en) * | 2018-07-16 | 2019-02-01 | 湖北荣宝电子科技有限公司 | A kind of corrosion resistant type multi-layer PCB board |
-
2018
- 2018-07-16 CN CN201810774982.8A patent/CN108566725A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09126670A (en) * | 1995-10-30 | 1997-05-16 | Furukawa Electric Co Ltd:The | Heat pipe type heat sink |
| CN206851133U (en) * | 2017-06-14 | 2018-01-05 | 梅州市达富多层线路板有限公司 | A kind of novel corrosion resistant multilayer circuit board |
| CN207305059U (en) * | 2017-10-10 | 2018-05-01 | 东洋通信技术（深圳）有限公司 | A kind of PCB circuit board of high efficiency and heat radiation multilayer |
| CN207531170U (en) * | 2017-12-06 | 2018-06-22 | 东莞联桥电子有限公司 | A kind of cooling circuit board |
| CN208462137U (en) * | 2018-07-16 | 2019-02-01 | 湖北荣宝电子科技有限公司 | A kind of corrosion resistant type multi-layer PCB board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180921 |