CN216413048U - Chip device - Google Patents
Chip device Download PDFInfo
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- CN216413048U CN216413048U CN202123091119.9U CN202123091119U CN216413048U CN 216413048 U CN216413048 U CN 216413048U CN 202123091119 U CN202123091119 U CN 202123091119U CN 216413048 U CN216413048 U CN 216413048U
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- chip
- substrate
- chip device
- heat dissipation
- dissipation cover
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Abstract
The present invention provides a chip device, including: a heat-dissipating cover, a substrate, a bare chip, and a support; the heat dissipation cover, the bare chip and the supporting piece are all fixedly arranged on the upper surface of the substrate, and the heat dissipation cover covers the bare chip and the outer side of the supporting piece. The utility model can reduce the production cost of the chip device.
Description
Technical Field
The utility model relates to the technical field of chip packaging, in particular to a chip device.
Background
With the rapid development of technology, the technology of chip packaging has been greatly improved.
In the existing process of packaging a chip, in order to avoid the problem that the reliability of a chip device is reduced due to deformation of a substrate or uneven stress distribution on the substrate, a support frame is usually arranged in a cavity of a heat dissipation cover so as to reinforce the substrate when the heat dissipation cover is installed. However, the support frame and the heat dissipation cover body are required to have the same flatness by adopting the mode, so that the processing difficulty of the heat dissipation cover can be increased, and the production cost of the chip device can be further improved.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the chip device provided by the utility model not only strengthens the structure of the chip device, but also reduces the processing difficulty of the heat dissipation cover by arranging the supporting piece on the substrate, thereby reducing the production cost of the chip device.
The present invention provides a chip device, comprising: a heat-dissipating cover, a substrate, a bare chip, and a support;
the heat dissipation cover, the bare chip and the supporting piece are all fixedly arranged on the upper surface of the substrate, and the heat dissipation cover covers the bare chip and the outer side of the supporting piece.
Optionally, a cavity is formed in the surface of the heat dissipation cover facing the substrate;
one end of the bare chip, which is far away from the substrate, is positioned in the cavity;
an end of the support facing away from the substrate is located within the cavity.
Optionally, a heat conducting layer is disposed on an outer side of the bare chip, and the bare chip is abutted to the heat dissipation cover through the heat conducting layer.
Optionally, the material of the heat conducting layer comprises: indium, indium-silver alloy, silver, tin-silver alloy or tin-lead alloy.
Optionally, a protrusion is disposed on a surface of the supporting member, and the supporting member abuts against the heat dissipation cover through the protrusion.
Optionally, the coefficient of thermal expansion of the support is less than the coefficient of thermal expansion of the substrate.
Optionally, the chip device further includes: a passive device;
the passive device is fixedly arranged on the upper surface of the substrate, and the heat dissipation cover covers the outer side of the passive device.
Optionally, the support is bonded to the substrate.
Optionally, the bare chip is soldered to the substrate.
Optionally, the bottom of the bare chip is filled with a sizing.
According to the chip device provided by the embodiment of the utility model, the supporting piece is arranged on the substrate, so that the structure of the chip device is reinforced, the mechanical strength of the chip device is improved, the steps of the processing technology of the heat dissipation cover are reduced, the processing difficulty of the heat dissipation cover is reduced, and the production cost of the chip device is reduced; in addition, the deformation amount of the substrate can be reduced by installing the supporting piece on the substrate before the heat dissipation cover is installed, so that the success rate of the subsequent flip-chip process and welding process is improved, and the reliability of the chip device is improved.
Drawings
Fig. 1 and fig. 2 are respectively a structural diagram of a chip device according to an embodiment of the present application, after a heat dissipation cover is removed, and supporting members of different shapes are mounted on the chip device;
fig. 3 to 6 are schematic structural diagrams of a chip device in different manufacturing stages according to an embodiment of the present application.
Reference numerals
1. A heat dissipation cover; 11. a cavity; 2. a passive device; 3. a substrate; 4. a bare chip; 5. a support member; 6. a thermally conductive layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is to be noted that, in the present invention, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Example one
The present embodiment provides a chip device, and with reference to fig. 1, fig. 2, and fig. 5, the chip device includes: heat-dissipating cover 1, passive device 2, substrate 3, bare chip 4, and support 5.
The passive device 2 is also called a passive device, and does not consume electric energy by itself or converts the electric energy into other energy in different forms; meanwhile, the signal is only needed to be input, and the normal work can be realized without an external power supply. In the present embodiment, the passive device 2 includes: one or more of a resistor, a capacitor, an inductor, a converter, a fader, a matching network, a resonator, a filter, a mixer, and a switch.
The heat dissipation cover 1, the passive component 2, the bare chip 4, and the support 5 are disposed on the upper surface of the substrate 3. And solder balls are fixed on the lower surface of the substrate 3 so as to facilitate the installation of the chip device. The upper surface of the substrate 3 includes a protective area. The support 5 and the die 4 are located within the protection zone. The passive devices 2 are located on the peripheral side of the protection area. The number of the bare chip 4 is one or more. The supporting members 5 may be block-shaped structures distributed on the peripheral side of the bare chip 4; the support 5 may be a frame-shaped structure surrounding the bare chip 4. Deformation amount of the substrate 3 when the environmental temperature changes rapidly can be effectively reduced by arranging the supporting piece 5, and the reliability failure risk caused by thermal mismatch among packaging materials of all layers is reduced.
In the present embodiment, the number of bare chips 4 is six; the support member 5 is a frame-shaped structure and is arranged among the six bare chips 4; the protection region is used for distinguishing a region for mounting the support 5 and the bare chip 4 from a region for mounting the passive device 2, and the shape and size of the protection region are not specifically limited in the present embodiment; the bottom of the support 5 is bonded with the substrate 3 through an adhesive; the bare chip 4 is connected with the substrate 3 by reflow soldering, and the bottom of the bare chip 4 is filled with chip packaging glue. In which the fixing of the supporter 5 using an adhesive can reduce damage to the substrate 3.
The lower surface of the heat dissipation cover 1 is provided with a cavity 11. All passive components 2, six die 4 ends and corresponding supports 5 are located within the cavity 11. The lower surface of the heat dissipation cover 1 is fixedly connected with the substrate 3 in a sealing manner through a sealant. The sealant is based on the performance requirement of the chip device, and the material of the sealant can be a conductive material or an insulating material. Specifically, the sealant comprises the following materials: polymer, rubber or metal resin glues, and the like. The sealant is not particularly limited in this embodiment.
The thermal expansion coefficient of the support 5 is smaller than that of the base plate 3. In this embodiment, the coefficient of thermal expansion of the support 5 differs from the coefficient of thermal expansion of the substrate 3 by at least one order of magnitude. The material of the support 5 includes: copper, iron, aluminum, stainless steel, tungsten, molybdenum, or an organic resin with a low coefficient of thermal expansion.
Further, heat conductive layers 6 are disposed on the tops of the six bare chips 4. In the present embodiment, the heat conductive layers 6 are brazed as heat sinks between the bare chips 4 and the heat dissipation cap 1 so that the six bare chips 4 are in contact with the heat dissipation cap 1 through the respective heat conductive layers 6, respectively. Wherein, the material of heat conduction layer 6 includes: indium, indium-silver alloy, silver, tin-silver alloy, tin-lead alloy, or the like; the material of heat dissipation cover 1 heat is metal heat conduction material, specifically includes: copper, iron, aluminum, stainless steel, tungsten, molybdenum, or the like. The material of the heat conductive layer 6 and the heat dissipation cover 1 is not particularly limited in this embodiment.
The supporting piece 5 is in clearance fit with the heat dissipation cover 1. In an alternative embodiment, the upper surface of the support 5 is provided with a projection. The supporting piece 5 is abutted against the heat dissipation cover 1 through the protrusion. The protrusions may be of a resilient material or of the same material as the support 5. In the present embodiment, the material of the projections is the same as the material of the support 5; the protrusion is fixedly connected with the support piece 5 in a one-way molding manner. The structural strength of the chip device structure can be further improved by arranging the bumps.
The chip device not only strengthens the structure of the chip device, but also improves the mechanical strength of the chip device by arranging the supporting piece 5 on the substrate 3; meanwhile, the steps of the processing technology of the heat dissipation cover 1 are reduced, the processing difficulty of the heat dissipation cover 1 is reduced, and therefore the production cost of the chip device is reduced; in addition, by installing the support member 5 on the substrate 3 before installing the heat dissipation cover 1, the chip device can be prevented from deforming in the production and use processes, such as the processes of solder reflow, ball-planting reflow and surface mounting reflow, of the chip device, so that the success rate of the subsequent flip-chip process and welding process is improved, and the reliability of the chip device is further improved.
Example two
This embodiment provides a method for manufacturing a chip device as in the first embodiment, which includes steps S101 to S108, with reference to fig. 3, 4, 5, and 6:
step S101: a substrate 3 is provided.
Step S102: the passive component 2 is attached to the substrate 3.
Step S103: the support 5 is bonded to the base plate 3.
Step S104: the bare chip 4 is reflow-soldered to the substrate 3.
Step S105: a heat conductive layer 6 is bonded to the top of the bare chip 4.
Step S106: the bottom of the bare chip 4 is filled with a glue. The glue is a chip packaging glue.
Step S107: the heat-dissipating cap 1 is installed such that the heat-dissipating cap 1 covers the bare chip 4 and the support 5.
Step S108: the bottom of the substrate 3 is mounted with balls.
The sequence of the above preparation steps can be adjusted without affecting the technical effect to be achieved by the present invention, which is not described in detail in this embodiment.
According to the chip device manufacturing method, the supporting piece 5 is arranged on the substrate 3, so that the structure of the chip device is reinforced, the mechanical strength of the chip device is improved, the steps of the processing technology of the heat dissipation cover 1 are reduced, the processing difficulty of the heat dissipation cover 1 is reduced, and the production cost of the chip device is reduced; in addition, the deformation amount of the substrate 3 can be reduced by mounting the support member 5 on the substrate 3 before mounting the heat dissipation cover 1, thereby improving the success rate of the subsequent flip-chip process and soldering process, and further improving the reliability of the chip device.
Particularly, for the chip device prepared by adopting an MCM (Multi-chip module) packaging process, the functional density of the chip device can be improved, and meanwhile, the power consumption of the chip device is reduced, so that the high performance and the multiple functions of the chip device are realized, and the deformation of the substrate 3 is reduced by additionally arranging the supporting piece 5 before the flip-chip reflow soldering, so that the success rate of the flip-chip reflow soldering is improved; the total area of the packaging structure can exceed 10000mm2The length of the single side exceeds 120 mm.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A chip device, comprising: a heat-dissipating cover, a substrate, a bare chip, and a support;
the heat dissipation cover, the bare chip and the supporting piece are all fixedly arranged on the upper surface of the substrate, and the heat dissipation cover covers the bare chip and the outer side of the supporting piece.
2. The chip device according to claim 1, wherein a surface of the heat dissipation cover facing the substrate is provided with a cavity;
one end of the bare chip, which is far away from the substrate, is positioned in the cavity;
an end of the support facing away from the substrate is located within the cavity.
3. The chip device according to claim 1, wherein a heat conducting layer is disposed on an outer side of the bare chip, and the bare chip abuts against the heat dissipation cover through the heat conducting layer.
4. The chip device of claim 3, wherein the material of the thermally conductive layer comprises: indium, indium-silver alloy, silver, tin-silver alloy or tin-lead alloy.
5. The chip device according to claim 1, wherein a surface of the supporting member is provided with a protrusion, and the supporting member abuts against the heat-dissipating cover through the protrusion.
6. The chip device of claim 1, wherein the coefficient of thermal expansion of the support is less than the coefficient of thermal expansion of the substrate.
7. The chip device of claim 1, further comprising: a passive device;
the passive device is fixedly arranged on the upper surface of the substrate, and the heat dissipation cover covers the outer side of the passive device.
8. The chip device of claim 1, wherein the support is bonded to the substrate.
9. The chip device of claim 1, wherein the die is bonded to the substrate.
10. The chip device of claim 1, wherein the bottom of the bare chip is filled with a glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123091119.9U CN216413048U (en) | 2021-12-09 | 2021-12-09 | Chip device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123091119.9U CN216413048U (en) | 2021-12-09 | 2021-12-09 | Chip device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216413048U true CN216413048U (en) | 2022-04-29 |
Family
ID=81283738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123091119.9U Active CN216413048U (en) | 2021-12-09 | 2021-12-09 | Chip device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216413048U (en) |
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2021
- 2021-12-09 CN CN202123091119.9U patent/CN216413048U/en active Active
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