JP2658967B2 - Supporting member for electronic package assembly and electronic package assembly using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support member for an electronic package assembly for supporting a heat radiating member, and an electronic package assembly using the support member and a tape carrier.

[0002]

2. Description of the Related Art In this specification, "tape carrier"
The term “connecting” means a connection structure including a wiring connected to an electronic component and a film-like insulator supporting the wiring. A tape for tape automated bonding (TAB) is included in a tape carrier.

[0003] One example of an electronic package assembly using a tape carrier is described in RAO R. Tumara.
TUMMALA), Eugen J. RYMAZEWSKI, co-authored by Nikkei BP, pp. 337, FIG.

In this technique, a large-scale integrated circuit (LSI) chip is connected to a tape carrier. The tape carrier is mounted on a substrate. A heat sink for cooling the LSI chip is mounted on the LSI chip.

A tape carrier package including such a heat radiation structure has been frequently used in recent years. This is because the heat generated from the LSI chip has increased due to the increase in the density and the speed of the LSI.

An example of a technique for connecting a tape carrier to a substrate is disclosed in US Pat. No. 5,261,155. In this technique, a solder pole is provided below a flexible board, and the flexible board and the printed board are connected by the solder pole.

[0007]

The above-mentioned electronic package assembly has the following problems.

In the above electronic package assembly, the LSI chip is pressed against the substrate by the weight of the heat sink. There is a risk that the LSI chip may be damaged by the pressure applied by the substrate.

[0009] In the above electronic package assembly,
The weight of the heat sink deflects the tape carrier, causing stress inside the tape carrier. If the tape carrier and the substrate are connected in this state, there is a risk of poor connection.

[0010] In the electronic package assembly described above,
A heat sink is bonded on the LSI chip. In order to reduce the thermal resistance of the adhesive, it is necessary to reduce the thickness of the adhesive as much as possible. To reduce the thickness of the adhesive, a pressing step is required. Specifically, in the case of a room temperature curing type adhesive, it must be left for several days while applying pressure.

[0011] In the electronic package assembly described above,
Special equipment or steps were required to accurately align the pads of the tape carrier over the pads of the substrate. This is particularly problematic when the above-described connection structure is applied to the above-described electronic package assembly. This is because the position of the pad cannot be confirmed because the tape carrier covers the pad.

Further, in the above-described connection structure, since the tape carrier covers the pads, there is a problem that a connection failure of the pads cannot be confirmed.

A first object of the present invention is to provide a support member for an electronic package assembly which protects an electronic member from pressure applied by a heat radiating member, and an electronic package assembly using the same.

A second object of the present invention is to provide a support member for an electronic package assembly which eliminates the stress applied to the tape carrier by the heat radiating member, and an electronic package assembly using the same.

A third object of the present invention is to provide a support member for an electronic package assembly which eliminates the need for a pressing step for reducing the thickness of the adhesive between the heat radiating member and the heat radiating plate, and to use the supporting member. An electronic package assembly is provided.

A fourth object of the present invention is to provide a support member for an electronic package assembly capable of accurately positioning a pad of a tape carrier on a pad of a substrate without using a special apparatus or process. And an electronic package assembly using the same.

A fifth object of the present invention is to provide an electronic package assembly support member and an electronic package assembly in which a connection failure between a tape carrier and a substrate can be easily confirmed.

A sixth object of the present invention is to provide a wiring board in which a connection failure between a tape carrier and a board can be easily confirmed, and a connection method using the wiring board.

[0019]

In order to achieve the above-mentioned object, a supporting member for an electronic package assembly according to the present invention comprises: a heat radiating plate having an electronic component mounted on a lower surface and a heat radiating member mounted on an upper surface; And a lower leg having an upper end attached thereto, wherein a gap is formed between an upper surface of the substrate and a lower surface of the heat sink when the lower end of the lower leg is placed on the substrate.

Further, the electronic package assembly of the present invention comprises:
A support member having a radiator plate and a lower leg having an upper end attached to the radiator plate; a radiator member attached to the upper surface of the radiator plate of the support member; and a lower surface of the radiator plate of the support member. An electronic component, a tape carrier connected to the electronic component and having a first hole, and a substrate to which a lower end of the lower leg of the support member inserted into the first hole of the tape carrier is attached; The electronic component is configured to be accommodated in a gap between the lower surface of the heat sink and the upper surface of the substrate of the support member.

In this electronic package assembly, since the heat radiating member is supported by the supporting member, the weight of the heat radiating member does not add to the electronic components.

The lower leg of the electronic package assembly described above is fixed to the substrate by first fixing means. Various structures can be applied as the first fixing means.

In the first embodiment, the first fixing means includes solder for connecting the lower leg of the support member and the substrate.

In a fourth embodiment, a second hole is provided in the substrate, and the lower end of the lower leg of the support member is inserted into the second hole of the substrate. The first fixing means includes solder for connecting the lower end of the lower leg of the support member to the substrate.

In a fifth embodiment, the substrate has a second hole, and the lower leg of the support member has a first portion having a larger diameter than the second hole and a lower portion than the first portion. A second portion located below and threaded and inserted into the second hole of the substrate. The first fixing means includes a first nut screwed into the second portion of the lower leg of the support member.

In a sixth embodiment, the substrate has a second hole and the first securing means includes a press-fit that engages the second hole in the substrate.

The above-mentioned electronic package assembly has a second fixing means for fixing the heat radiating member to the supporting member. Various structures can be applied as the second fixing means.

In the first to eighth embodiments, the heat radiating member has a third hole. The second fixing means includes an upper leg which is threaded and whose upper end is inserted into the third hole of the heat radiating member and whose lower end is attached to the heat radiating plate of the support member, and which is screwed to the upper leg and A second nut for pressing the heat dissipating member against the supporting member.

In the above-described electronic package assembly, the upper leg and the lower leg may be constituted by one pin.
In this case, the first of the pins protruding above the heat sink
Is screwed and becomes the upper leg, and a second portion of the pin protruding below the heat sink becomes the lower leg.

The radiator plate is fixed to the pins by third fixing means. Various structures can be applied as the third fixing means.

[0031] As the third fixing means, a solder for connecting the radiator plate and the pins may be employed.

In a second embodiment, the third securing means includes a third nut screwed onto the second portion of the pin.

In the third embodiment, the diameter of the second portion of the pin is formed larger than the diameter of the fourth hole of the heat sink.

In the above electronic package assembly, the tape carrier and the substrate are connected by connecting means. The connection means includes a first pad at least partially provided on a lower surface of the tape carrier, a second pad provided on an upper surface of the substrate, the first pad and the second pad. And soldering. The first pad includes a through hole penetrating the tape carrier, and a first conductor pattern provided around the through hole on the lower surface of the tape carrier. At least a part of the solder is sucked into the through hole.

In this connection structure, the connection failure of the solder can be identified by confirming that the solder is sucked up.

In a seventh embodiment, the above-mentioned electronic package assembly comprises a first portion in which the heat sink of the support member covers the electronic component and a second portion in which at least a portion of the tape carrier covers the electronic component. And a portion of

In the eighth embodiment, the second heat radiation plate
A fifth hole is provided at a position corresponding to the first pad in a portion of the heat sink vertically penetrating the second portion of the heat sink.

[0038]

Next, a first embodiment of the present invention will be described with reference to the drawings.

Referring to FIG. 1, the support member of the first embodiment includes a heat sink 12. A cylindrical lower leg 11 is provided on the lower surface of the heat sink 12. The lower legs 11 are provided at four corners of the heat sink 12 one by one. A cylindrical upper leg 13 is provided on the upper surface of the heat sink 12. The upper leg 13 is a lower leg 11
Are provided one by one.

The heat radiating plate 12 is a 22 mm × 22 mm square flat plate. The thickness of the heat sink 12 is 1 to 2 mm. The radiator plate 12 is formed of a material having good thermal conductivity. Specifically, a copper / tungsten alloy is suitable. Copper / tungsten alloy has a high thermal conductivity of about 180 W / mk. The coefficient of thermal expansion of the copper / tungsten alloy is about 6.5 × 10 ⁻⁶ / ° C., which is close to the coefficient of thermal expansion of silicon. In addition, copper / kovar alloys, copper / Mo alloys, and copper , Can be used as a material of the heat sink 12. Further, ceramics having high thermal conductivity such as AIN can be used. Kovar is an alloy containing iron, nickel, and cobalt.

On the upper and lower surfaces of the heat radiating plate 12, heat radiating members and electronic components are attached.

The diameter and length of the lower leg 11 are respectively
1.6 mm to 1.8 mm and 0.8 mm. The upper end of the lower leg 11 is connected to the lower surface of the heat sink 12. Lower leg 1
As one material, brass can be used. The length of the lower leg is determined according to the height of the electronic component. Specifically, the length is set such that no harmful pressure is applied to the electronic components when the lower end of the lower leg 11 is fixed on the substrate.
If the length of the lower leg 11 is set longer than the height of the electronic component, no pressure is applied to the electronic component.

The diameter and length of the upper leg 13 are
1.0 mm and 4.0 mm. The lower end of the upper leg 13 is connected to the upper surface of the heat sink 12. Brass can be used as a material for the upper leg 13. The upper part of the upper leg 13
It is screwed.

The above-described support member 10 can be manufactured by the following method.

The first method is to separate the lower leg 11 from one member.
In this method, the heat sink 12 and the upper leg 13 are cut out. Second
Is a method of brazing the lower leg 11 and the upper leg 13 to the heat sink 12. The third method is to insert a pin into a hole provided in the heat sink 12. The pins are fixed to the heat sink 12 by brazing. Portions of the pins protruding above and below the heat radiating plate 12 become upper legs 13 and lower legs 11, respectively.

Referring to FIG. 2, a tape carrier 20 used in an electronic package assembly including the support member 10 is shown.
Includes a film 26.

The thickness of the film 26 is 50 μm.
The material of the film 26 has heat resistance, stable dimensions,
An organic insulating material to which the wiring 22 can easily adhere is preferable.
Specifically, polyimide is suitable. In addition, a fluorine material or an epoxy material can be used.

The lower leg 1 of the support member 10 is
A circular hole 23 into which 1 is inserted is provided. The shape of the hole 23 is substantially the same as the cross-sectional shape of the lower leg 11. In the case of the first embodiment, the hole 23 is a circle having a diameter of 1.8 mm.

In the center of the film 26, a device hole 24 for receiving an electronic component is provided. The device hole 24 is a square of 18.0 mm × 18.0 mm.

An inner lead 21 protrudes into the device hole 24. Number of inner leads 21 is about 8
00. The inner leads 21 are arranged at a pitch of about 80 μm. The inner lead 21 is connected to the pad 31 via the wiring 22. The pad 31
They are arranged in a grid. Wiring 22 and pad 31
Is provided on the lower surface of the tape carrier 20.

The tape carrier 20 of this embodiment is made of TAB
It is a tape. That is, a plurality of tape carriers 20 are provided on the film 26. One tape carrier 20 is a 43 mm × 43 mm square. A sprocket hole 25 is provided on the side of the film 26. The tape carrier 20 can be moved by engaging a gear with the sprocket hole 25 and rotating the gear.

Referring to FIG. 3, an electronic package assembly using the support member 10 includes an LSI chip 40.
The LSI chip 40 is a square of 17.5 mm × 17.5 mm. A circuit is formed on the lower surface of the LSI chip 40. The LSI chip 40 has approximately 80
It has zero input / output terminals. Input / output terminal is about 80μm
They are arranged at a pitch. The input / output terminal is connected to the inner lead 21 of the tape carrier 20. LSI
The chip 40 is provided in the device hole 2 of the tape carrier 20.
4 is housed. The LSI chip 40 and the tape carrier 20 are sealed with a resin 41.

The lower leg 11 of the support member 10 is inserted into the hole 23 of the tape carrier 20. The LSI chip 4 is attached to the lower surface of the heat sink 12 of the support
0 is adhered. The adhesive 44 is an epoxy adhesive containing silver powder. Au / Si-based brazing material can be used as the adhesive 44. When this brazing material is used, Ti / Au and Ni layers are formed on the upper surface of the LSI chip 40 and the lower surface of the heat sink 12, respectively.

The lower end of the lower leg 11 of the support member 10 is fixed on the substrate 42 by solder 111. A pad 421 is provided on the substrate 42 for this soldering.

The material of the substrate 42 is not limited. As the substrate 42, a glass epoxy printed board, a polyimide printed board, a ceramic printed board, or the like can be used.

The pads 33 are provided on the upper surface of the substrate 42. Pad 31 of tape carrier 20 and substrate 42
Are connected to the pads 33 by the solder bumps 32. The pad 31, the solder bump 32, and the pad 33 form a connection structure 30.

A heat sink 43 is mounted on the upper surface of the radiator plate 12 of the support member 10. The upper leg 13 of the support member 10 is inserted into a hole 431 provided in the heat sink 43. A nut 47 is screwed into the upper part of the upper leg 13. By tightening the nut 47, the heat sink 43 is sandwiched between the nut 47 and the heat sink 12. An adhesive 45 is provided between the heat sink 43 and the heat sink 12. The adhesive 45 is a silicon-based adhesive.

In the above-described structure, the height from the lower surface of the heat sink 12 to the lower surface of the resin 41 is about 0.75 mm. More specifically, the thickness of the LSI chip 40 is about 0.4
5 mm, and the thickness of the resin 41 is 0.3 mm. On the other hand, the height of the lower leg 11 of the support member 10 is about 0.8 mm.
It is. Therefore, the resin 41 does not contact the substrate 42,
No pressure is applied to the LSI chip 40. Further, no stress is applied to the tape carrier 20 due to the weight of the heat sink 43. Further, when the substrate 42 is erected, the tape carrier 20 is not peeled off due to the weight of the heat sink 43.

Next, a method of assembling the above structure will be described.

Referring to FIG. 4A, in a first step, the connection terminals of the LSI chip 40 and the inner leads 21 of the tape carrier 20 are connected. The LSI chip 40 and the inner leads 21 are sealed with a resin 41.

Referring to FIG. 4B, in step 2, the upper surface of the LSI chip 40 or the heat sink 12
The adhesive 44 is uniformly applied to the lower surface of the substrate. After the application of the adhesive 44, the lower surface of the heat sink 12 and the upper surface of the LSI chip 40 are bonded. The lower leg 11 of the support member 10 is inserted into the hole 23 of the tape carrier 20.

Referring to FIG. 4C, as a third step, the support member 10 is positioned at a predetermined position on the substrate 42. At the same time that the support member 10 is positioned,
Each pad 31 of the tape carrier 20 is positioned on a corresponding pad 33 of the substrate 42.

The solder bumps 32 are formed on the pads 33 of the substrate 42 in advance. The solder 111 is applied on the pads 421 of the substrate 42. After the positioning of the support member 10, the solder bumps 32 and the solder 111 are heated and melted. As a result of the heating, the pads 31 of the tape carrier 20 and the pads 33 of the substrate 42 are connected by the solder bumps 32. Also, the solder 111
Thereby, the lower leg 11 of the support member 10 is fixed to the pad 421.

Referring to FIG. 4D, in a fourth step, an adhesive 45 is applied to the upper surface of the heat sink 12 or the lower surface of the heat sink 43. After the application of the adhesive 45, the heat sink 43 is placed on the heat sink 12.
The upper leg 13 is inserted into a hole 431 provided in the heat sink 43. A nut 47 is screwed into the upper part of the upper leg 13. By tightening the nut 47, the thickness of the adhesive 45 is reduced. The time required for bonding is about 24 hours at room temperature,
At about 150 ° C. for about 15 minutes.

In the above assembling process, the tape carrier 20
No positioning is required. This is because, when the support member 10 is positioned, the positioning of the tape carrier 20 is completed at the same time.

In the above-described assembling step, a pressing step for thinning the adhesive 45 is unnecessary. This is because the heat sink 43 is pressed against the heat radiating plate 12 by tightening the nut 47.

Next, a second embodiment of the present invention will be described with reference to the drawings. The second embodiment has two features. The first feature is that the lower leg 11 and the upper leg 13 of the support member 10 are formed by one pin. The second feature is that the tape carrier 20 and the substrate 42 are connected by a novel connection structure.

Referring to FIG. 5, the support member 10 of the second embodiment includes a pin 14. Pin 14 is approximately 1.0m in diameter
m column. The material of the pin 14 is preferably brass or Kovar. It is desirable that the surface of the pin 14 be plated with nickel.

The lower end of the pin 14 is
It is fixed to the pad 421 of the substrate 42. Solder 143
Is a eutectic solder of 63 wt% Sn-37 wt% Pb. The pin 14 is threaded. A nut 142 is screwed into the pin 14.

The LSI chip 40 includes the tape carrier 2
0 ′ is connected to the inner lead 21. Pin 14
Is inserted into the hole 23 of the tape carrier 20 '. The tape carrier 20 ′ and the substrate 42 are connected by the connection structure 34. Tape carrier 20 'and connection structure 34
Will be described later.

The size of the radiator plate 12 is set so as not to cover the connection structure 34. In the second embodiment, the heat radiating plate 12 is a square of about 22 mm × 22 mm. The thickness of the heat sink 12 is about 1 to 2 mm. In the heat sink 12,
A hole 124 is provided. The pin 14 is inserted into the hole 124 of the heat sink 12. The heat sink 12 is supported by a nut 142. The LSI chip 40 is adhered to the lower surface of the heat sink 12 by an adhesive 44.

The heat sink 43 is attached by the adhesive 45
It is adhered to the upper surface of the heat sink 12. The upper part of the pin 14 is inserted into the hole 431 of the heat sink 43. Nut 141
Is screwed into the pin 14. The heat sink 12 and the heat sink 43 are held between the nut 141 and the nut 142.

The material of the radiator plate 12 is the same as that of the first embodiment. LSI chip 40 and heat sink 4
The material and structure of No. 3 are the same as those of the first embodiment. The adhesives 44 and 45 are the same as those of the first embodiment.

Next, the structure of the tape carrier 20 'and the connection structure 34 will be described with reference to the drawings.

Referring to FIG. 6, the inner leads 21 and the wirings 22 are provided on the upper surface of the tape carrier 20 '. One end of the wiring 22 is connected to the inner lead 21. The other end of the wiring 22 is connected to a pad 31 '.

The tape carrier 20 ′ includes about 800 inner leads 21. The inner lead 21 is about 80μ
They are arranged at m pitches.

The material of the wiring 22 is copper. The wiring 22 is plated with gold. The width and the thickness of the wiring 22 are about 40 μm and about 10 to 25 μm, respectively.

The pads 31 'are arranged in a lattice pattern with a pitch of about 1.27 mm. The detailed structure of the pad 31 'will be described later.

In the case of the second embodiment, the hole 23 has a diameter of about 1.
It is a 1 mm circle. The material of the film 26 and the shape of the device hole 24 are the same as those of the first embodiment.

Next, the structure of the pad 31 'will be described.

Referring to FIGS. 7A and 7B, pad 31 'includes annular conductor patterns 36 and 39. The outer diameters of the conductor patterns 36 and 39 are about 250 μm and 600 μm, respectively. The conductor patterns 36 and 39 are formed on the upper and lower surfaces of the tape carrier 20, respectively. In the conductor pattern 36,
The wiring 22 is connected.

Referring to FIG. 8B, the pad 31 '
Further includes a through hole 39. The diameter of the through hole 38 is about 150 μm on the upper surface and about 30 μm on the lower surface.
0 μm. Therefore, the through hole 38 has a taper. A conductor pattern 37 is formed on the inner surface of the through hole 38.

The material of the conductor patterns 36, 37 and 39 is gold-plated copper. Conductor patterns 36, 37
And 39 have a thickness of 20 μm. Conductor pattern 3
6 and 39 are connected by a conductor pattern 37.

Next, the pad 31 'of the tape carrier 20
A method of connecting the terminal to the pad 33 of the substrate will be described with reference to the drawings.

Referring to FIG. 8A, in a first step, solder 35 is provided on pads 33 of substrate 42. Solder 35 is Sn63wt% / Pb37w
t% eutectic solder. The height and volume of the solder 35 are about 300 μm and about 0.6 × 10, respectively.
It is ^-10 m ^3.

Referring to FIG. 8B, in the second step, the pads 31 'of the tape carrier 20 are positioned on the solder 35.

Referring to FIG. 8C, in a third step, solder 35 is heated. Heating temperature is 20
0 ° C to 250 ° C. The heated solder 35 is melted and rises upward in the through hole 38. The raised solder 35 can be confirmed from the upper surface of the tape carrier 20.

Next, a method of confirming the connection failure of the pad 31 'will be described. After the above process, when the solder 35 can be confirmed from the upper surface of the tape carrier 20, the pad 3
1 'is connected normally. When the solder 35 cannot be confirmed from the upper surface of the tape carrier 20, there is a possibility that connection to the pad 31 'is unnecessary. Thus, the pad 31 '
Can be easily confirmed.

The second embodiment is characterized in that, in addition to the first embodiment, a poor connection between the tape carrier 20 and the heat sink 43 can be easily visually confirmed. Specifically, by checking whether the solder 35 has appeared on the upper surface of the tape carrier 20, it is possible to identify a poor connection of the pad 31 '.

Next, a third embodiment of the present invention will be described with reference to the drawings. The feature of the third embodiment lies in the modification of the support means of the heat sink 12, and other structures and functions are the same as those of the first embodiment.

Referring to FIG. 9, the pin 1 of the third embodiment is shown.
5 includes a first portion 151 having a diameter of about 1.0 mm and a second portion 152 having a diameter of about 1.6 mm. Second part 1
The length of 52 is about 0.8 mm. Tape carrier 2
In accordance with the diameter of the second portion 152,
It is set to about 1.8 mm. The lower end of the second portion 152 is connected to the substrate 42 by solder 153.
The substrate 42 is a ceramic substrate. The solder 153 is
It is an Au-Sn-based brazing material. When soldering, solder 1
53 is heated to about 350 ° C.

The diameter of the hole 124 of the heat sink 12 is approximately 1.4.
mm. The first portion 151 can pass through the hole 124, but the second portion 152 cannot. For this reason, the heat sink 12 is supported by the second portion 152.

The third embodiment has the following features in addition to those of the second embodiment.

The first feature is that the nut 142 for supporting the heat sink 12 is unnecessary. Second, the distance between the lower surface of the heat sink 12 and the upper surface of the substrate 42 can be kept constant.

Next, a method of assembling the electronic package assembly according to the third embodiment will be described with reference to the drawings.

Referring to FIG. 10A, in a first step, an adhesive 44 is applied to the lower surface of the heat radiating plate 12 so as to form an L.
The SI chip 40 is bonded. In the LSI chip 40,
The tape carrier 20 'is connected.

Referring to FIG. 10B, in the second step, the pins 15 are inserted into the holes 23 of the tape carrier 20 ′ and the holes 124 of the heat sink 12. Pin 15
Are set up on the substrate 42 in advance. By inserting the holes 23 of the tape carrier 20 into the pins 15, each pad 31 'of the tape carrier 20' is naturally positioned on the corresponding pad 33 of the substrate 42.

Referring to FIG. 10C, in a third step, pads 31 'and 33 are connected by the method shown in FIGS. 8A to 8C. Solder 3
By confirming that 5 has appeared on the upper surface of the tape carrier 20, the connection failure of the pad 31 'can be identified.

Referring to FIG. 11, in a fourth step, a heat sink 43 is mounted on the heat sink 12. The heat sink 43 is attached to the heat sink 1 by the adhesive 45.
Adhered to 2. The pin 14 is connected to the hole 4 of the heat sink 43.
Inserted at 31. A nut 141 is screwed into the pin 14. The heat sink 12 and the heat sink 43
1 and 142. By tightening the nut 141, the thickness of the adhesive 45 is reduced.

Next, a fourth embodiment of the present invention will be described with reference to the drawings. The feature of the present invention is that the support member 10
The structure of the lower leg 11 or the fixing means at the lower end of the pin is the same as that of the third embodiment.

Referring to FIG. 12, the pin 16 includes a first portion 161, a second portion 162, and a third portion 1
63. First part 161 and second part 16
2 respectively correspond to the first part 15 of the third embodiment.
Same as the first and second portions 152. The diameter of the third portion 163 of the pin 16 is about 0.8 mm. The third portion 163 is plated with nickel.

The substrate 42 is a glass-polyimide printed circuit board having both low dielectric constant and heat resistance. Substrate 4
2 is provided with a hole 48 having a diameter of about 0.8 mm.
The third portion 163 of the pin 16 is inserted into the hole 48 of the substrate 42. The third portion 163 of the pin 16 is
4 connects to the substrate 42. Although the solder 164 enters the holes 48 of the substrate 42, the substrate 42 does not cause any trouble because the substrate 42 has both low dielectric constant and heat resistance.

The fourth embodiment has the following features in addition to those of the third embodiment.

First, the third portion 1 is inserted into the hole 48 of the substrate 42.
Since the 63 is inserted, the accuracy of the mounting position of the pin 16 is improved. Second, the insertion of the third portion 163 into the hole 48 increases the strength of the pin 16 against lateral external forces.

Next, a fifth embodiment of the present invention will be described with reference to the drawings. The feature of the fifth embodiment lies in the modification of the fixing means of the lower leg 11 of the support member 10, and other structures and functions are the same as those of the third embodiment.

Referring to FIG. 13, the pin 17 of this embodiment is
Is a first part 171 having a diameter of 1.2 mm and a diameter of 1.6 m.
m second portion 172 and a 0.7 mm diameter third portion 172.
Portion 173. The length of the second portion 172 is about 0.8 mm. The material of the pin 17 is stainless steel. Third portion 173 is threaded.

The substrate 42 has a hole 48 having a diameter of about 0.8 mm. The third portion 173 of the pin 17 is inserted into the hole 48 of the substrate 42. A nut 174 is screwed into the tip of the third portion 173. The pin 17 is fixed to the substrate 42 by tightening the nut 174.

The fifth embodiment is characterized in that the position accuracy of the pin 17 is further improved in addition to the features of the third embodiment.
There is a feature that the strength of the mounting portion of the pin 17 is improved.

Next, a sixth embodiment of the present invention will be described. The feature of the sixth embodiment is that the lower leg 11 of the support member 10 is provided.
The other structure and function are the same as those of the third embodiment.

Referring to FIG. 14, the pin 18 includes a first portion 181, a second portion 182, and a third portion 1
83. The structure of the first part 181 is the same as that of the first part 151 of the third embodiment.

Referring to FIG. 15A, the second part 1
82 is a flat plate. The width of the second portion 182 is
Is larger than the diameter of the hole 48. The length of the second portion 182 is about 0.8 mm.

The third part 183 is a fixing member called press fit. The third portion 183 is formed of an elastic material such as copper.

Referring to FIG. 15B, the third portion 1
The width of 83 decreases toward the tip.

Referring to FIG. 15C, the third part 1
The cross section of 83 has an M shape. The third part 183 is
It has elasticity in the direction of the arrow in the figure. When the third portion 183 is inserted into the hole 48, the portions 1831 and 1832 press against the inner surface of the hole 48. This pressing force causes the pin 18
Is fixed to the substrate 42.

The sixth embodiment has a feature that the pin 18 can be easily attached in addition to the third embodiment.

Next, a seventh embodiment of the present invention will be described with reference to the drawings. The feature of the seventh embodiment resides in a heat sink 12 covering the tape carrier 20.

Referring to FIG. 16, heat sink 1 of the present embodiment is shown.
Reference numeral 2 denotes a first portion 121 to which the LSI chip 40 is bonded on the lower surface, and a second portion 1 covering the tape carrier 20.
22. The lower surface of the second portion 122 of the heat sink 12 is adhered to the upper surface of the tape carrier 20 with an adhesive 49. The adhesive 49 is the same as the adhesive 44.

[0118] The heat sink 43 is
First part 121 and second part 122 of heat sink 12
It is adhered to the upper surface of. The adhesive 49 is the same as the adhesive 45.

The tape carrier 20 and the substrate 42 are
Are connected by the same structure as the connection structure 30 of the embodiment. Since the tape carrier 20 is covered with the heat sink 12, the connection structure 34 of the second embodiment cannot be used as it is.

Next, the assembling method of the seventh embodiment will be described.
This will be described with reference to the drawings.

Referring to FIG. 17A, in step 1, the terminals of the LSI chip 40 are connected to the tape carrier 20.
Is connected to the inner lead 21.

Referring to FIG. 17B, in step 2, the lower surface of the LSI chip 40 is sealed with a resin 41.

Referring to FIG. 17C, in step 3, the upper surface of the LSI chip 40 or the heat sink 1
The adhesive 44 is applied to the lower surface of the second portion 121. At the same time, the adhesive 49 is applied to the upper surface of the tape carrier 20 or the lower surface of the second portion 122 of the heat sink 12. After the application of the adhesive 44 and the adhesive 49, the first portion 121 and the second portion 122 of the heat sink 12
It is bonded to the LSI chip 40 and the tape carrier 20, respectively. Adhesives 44 and 49 are heated to about 150 ° C. for about 10 minutes. As a result of the heating, the adhesive 44
And 49 are cured to complete the bonding.

Referring to FIG. 17D, in step 4, the holes 23 of the tape carrier 20 and the heat radiating plate 12 are formed.
The pin 15 is inserted into the hole 124. After the pins 15 are inserted, the pads 31 of the tape carrier 20 and the pads 33 of the substrate 42 are connected by the solder bumps 32.

Referring to FIG. 17 (e), in step 5, the heat sink 43 is bonded on the heat sink 12 by the adhesive 45. This completes the assembly.

In the structure of the seventh embodiment, the heat sink 4
3 is not only the first portion 121 of the heat sink 12 but also the second portion.
Portion 122 is also adhered. For this reason, the thermal resistance between the heat sink 12 and the heat sink 43 is reduced, and the heat radiation efficiency of the package is improved.

Further, the second portion 122 of the heat sink 12 is
The warpage of the tape carrier 20 is also prevented.

Next, an eighth embodiment of the present invention will be described with reference to the drawings. The feature of the eighth embodiment is that the connection structure 34 of the second embodiment can be applied to the structure of the seventh embodiment by providing a hole 123 in the second portion 122 of the heat sink 12. is there.

Referring to FIG. 18, tape carrier 20
The substrate and the substrate are connected by the connection structure of the second embodiment. In the second portion 122 of the heat sink 12 of the eighth embodiment, a hole 123 is provided at a position corresponding to the pad 31 ′ of the connection structure 34. Due to the holes 123, each pad 31 'is not covered by the second portion 122 of the heat sink 12.

The eighth embodiment has a feature that the connection state of the pad 31 'can be confirmed through the hole 123 in addition to the seventh embodiment.

Next, another embodiment of the present invention will be described.

First, the electronic components mounted on the support member 10 are not limited to the LSI chip 40.

Second, the lower leg 11, the second portion 152 of the pin 15, the second portion 152 of the pin 16, and the second
The cross-sectional shape of the portion 181 is not limited to a circle. For example, it may be rectangular. However, the shape of the hole 23 of the tape carrier 20 needs to be formed according to the cross-sectional shape of these members.

Third, the lower leg 11, the upper leg 13, the pin 15,
The number and arrangement of 16, 17, and 18 are not limited to those in the above-described embodiment.

Fourth, in order to prevent a short circuit between the inner leads 21 of the tape carrier 20, the heat sink 12 may be coated with epoxy, silicon, or the like.

[0136]

The support member and the electronic package assembly of the present invention have the following effects.

First, there is an effect that the electronic member can be protected from the pressure applied by the heat radiating member. This is because the supporting member supports the heat dissipation structure.

Second, there is an effect that stress applied to the tape carrier by the heat radiating member can be eliminated. This is because the supporting member supports the heat dissipation structure.

Third, there is an effect that a pressing step for reducing the thickness of the adhesive between the heat radiating member and the heat radiating plate is unnecessary. This is because the nut screwed into the upper leg of the support member presses the heat radiating member toward the heat radiating plate 12.

Fourth, there is an effect that the tape carrier can be accurately positioned without using any special device or process. This is because the lower leg of the support member is inserted into the hole of the tape carrier.

Fifth, there is an effect that a connection failure between the tape carrier and the substrate can be easily confirmed. This is because a new connection structure having a through hole is adopted.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a structure of a support member 10 according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a structure of the tape carrier 20 according to the first embodiment of the present invention.

FIG. 3 is a view showing the structure of the electronic package assembly according to the first embodiment of the present invention.

FIG. 4 is a view showing a method of assembling the electronic component package assembly according to the first embodiment of the present invention.

FIG. 5 is a view showing a structure of an electronic component package assembly according to a second embodiment of the present invention.

FIG. 6 shows a tape carrier 20 ′ according to a second embodiment of the present invention.
FIG. 3 is a diagram showing the structure of FIG.

FIG. 7 shows a tape carrier 20 'according to a second embodiment of the present invention.
FIG. 4 is a view showing a structure of a pad 31 ′ of FIG.

FIG. 8 shows a tape carrier 20 ′ according to a second embodiment of the present invention.
FIG. 4 is a diagram showing a connection method.

FIG. 9 is a view showing a structure of an electronic package assembly according to a third embodiment of the present invention.

FIG. 10 is a diagram illustrating a method of assembling an electronic package assembly according to a third embodiment of the present invention.

FIG. 11 is a diagram illustrating a method of assembling an electronic package assembly according to a third embodiment of the present invention.

FIG. 12 is a view showing the structure of an electronic package assembly according to a fourth embodiment of the present invention.

FIG. 13 is a view showing the structure of an electronic package assembly according to a fifth embodiment of the present invention.

FIG. 14 is a view showing the structure of an electronic package assembly according to a sixth embodiment of the present invention.

FIG. 15 is a view showing a structure of a third portion 183 of the pin 18 according to the sixth embodiment of the present invention.

FIG. 16 is a view showing the structure of an electronic package assembly according to a seventh embodiment of the present invention.

FIG. 17 is a view illustrating a method of assembling an electronic package assembly according to a seventh embodiment of the present invention.

FIG. 18 is a view showing the structure of an electronic package assembly according to an eighth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Support member 11 Lower leg 111 Solder 12 Heat sink 121 First part 122 Second part 123 Hole 124 Hole 13 Upper leg 14 Pin 141 Nut 142 Nut 143 Solder 15 Pin 151 First part 152 Second part 153 Solder 16 Pin 161 First part 162 Second part 163 Third part 164 Solder 17 Pin 171 First part 172 Second part 173 Third part 174 Nut 18 Pin 181 First part 182 Second part 183 Third part 20 Tape carrier 20 'Tape carrier 21 Inner lead 22 Wiring 23 Hole 24 Device hole 25 Sprocket hole 26 Film 30 Connection structure 31 Pad 31' Pad 32 Solder bump 33 Pad 34 Connection structure 35 Solder 36 Conductor pattern 37 the conductor pattern 38 through-hole 39 conductor pattern 40 LSI chip 41 resin 42 substrate 421 pad 43 heat sink 431 holes 44 adhesive 45 adhesive 46 pads 47 Nut 48 Hole 49 adhesive

Claims (36)

(57) [Claims] An electronic component is attached to a lower surface, and a radiator plate to which a heat radiating member is attached to an upper surface; A gap is sometimes formed between the upper surface of the substrate and the lower surface of the heat radiating plate. 2. A gap between an upper surface of the substrate and a lower surface of the heat radiating plate has a height such that a weight of the heat radiating member does not impose a load on the electronic component.
A support member for an electronic package assembly as described in the above. 3. The supporting member for an electronic package assembly according to claim 1, further comprising first fixing means for fixing said heat radiating member to said heat radiating plate. 4. An upper leg, wherein the first fixing means is threaded, a lower end is attached to the heat radiating plate, and an upper portion is inserted into a hole provided in the heat radiating member, and is screwed to the upper leg. 4. The supporting member for an electronic package assembly according to claim 3, further comprising: a nut for pressing said heat radiating member against said heat radiating plate by tightening. 5. A support member having a radiator plate, a lower leg having an upper end attached to the radiator plate, a radiator member attached to an upper surface of the radiator plate of the support member, and the radiator plate of the support member An electronic component attached to the lower surface of the tape carrier, a tape carrier connected to the electronic component and having a first hole, and a lower end of the lower leg of the support member inserted into the first hole of the tape carrier. An electronic package assembly, comprising: a substrate to be mounted; and wherein the electronic component is accommodated in a gap between the lower surface of the heat sink and the upper surface of the substrate of the support member. 6. A method of mounting an electronic component using a support member having a heat sink and a lower leg having an upper end attached to the heat sink, and a tape carrier connected to the electronic component and having a first hole. A first step of inserting the lower leg of the support member into the first hole of the tape carrier and attaching the electronic component to a lower surface of the heat sink of the support member; An electronic component mounting method, comprising: a second step of fixing on a substrate; and a third step of attaching a heat dissipation member to an upper surface of the heat dissipation plate of the support member. 7. The electronic package assembly according to claim 5, further comprising first fixing means for fixing said lower leg of said support member to said substrate. 8. The electronic package assembly according to claim 7, wherein said first fixing means includes solder for connecting said lower leg of said support member and said substrate. 9. A second hole is provided in the substrate, wherein the lower end of the lower leg of the support member is inserted into the second hole of the substrate, and wherein the first fixing means comprises: The electronic package assembly according to claim 7, further comprising solder for connecting the lower end of the lower leg of the member to the substrate. 10. The substrate has a second hole, and the lower leg of the support member is located at a first portion having a larger diameter than the second hole and at a position lower than the first portion. And
A second portion which is screwed and inserted into the second hole of the substrate, wherein the first fixing means is screwed to the second portion of the lower leg of the support member. The electronic package assembly according to claim 7, further comprising a first nut, wherein the substrate is sandwiched between the first portion of the lower leg of the support member and the first nut. 11. The method of claim 7, wherein the substrate has a second hole, and wherein the first securing means includes a press-fit that engages the second hole of the substrate. Electronic package assembly. 12. The electronic package assembly according to claim 5, further comprising second fixing means for fixing said heat radiating member to said support member. 13. The heat dissipating member has a third hole, the second fixing means is threaded and an upper end is inserted into the third hole of the heat dissipating member, and a lower end is dissipated by the heat dissipating of the support member. 13. The electronic package assembly according to claim 12, further comprising: an upper leg attached to the plate; and a second nut screwed to the upper leg to press the heat radiating member against the supporting member. 14. The radiator plate of the support member has a fourth hole vertically penetrating, the support member includes a pin penetrating the fourth hole of the radiator plate, The first part projecting above the heat sink is screwed and serves as the upper leg, and the second part of the pin projecting below the heat sink serves as the lower leg. Electronic package assembly. 15. A method of mounting an electronic component using a tape carrier connected to the electronic component and having a first hole and a heat sink having a second hole, wherein a lower end of a pin is attached to a substrate. A first step of attaching the electronic component to the lower surface of the heat sink, inserting the pin into the first hole of the tape carrier, and inserting the pin into the second hole of the heat sink. 2. A method for mounting an electronic component, comprising: a second step; and a third step of attaching a heat radiation member to the upper surface of the heat radiation plate. 16. A third fixing the heat sink to the pin.
The electronic package assembly according to claim 14, further comprising fixing means. 17. The electronic package assembly according to claim 16, wherein said third fixing means includes solder for connecting said heat sink and said pins. 18. The third fixing means includes a third nut screwed to the second portion of the pin, wherein the heat radiating member and the heat radiating plate are connected to the second nut and the third nut. 2. The method according to claim 1, wherein the nut is sandwiched between nuts.
7. The electronic package assembly according to claim 6. 19. The diameter of the second part of the pin is larger than the diameter of the fourth hole of the heat sink, and the heat sink is formed of the second nut and the second part of the pin. The electronic package assembly according to claim 14, wherein the electronic package assembly is sandwiched therebetween. 20. The electronic package assembly according to claim 5, wherein said tape carrier and said substrate are connected by connecting means. 21. The connection means, wherein: a first pad at least partially provided on a lower surface of the tape carrier; a second pad provided on an upper surface of the substrate; 21. The electronic package assembly according to claim 20, further comprising: solder for connecting to the second pad. 22. The first pad, comprising: a through hole penetrating the tape carrier; and a first conductor pattern provided around the through hole on a lower surface of the tape carrier. An electronic package assembly according to claim 21. 23. The electronic package assembly according to claim 22, wherein at least a part of the solder penetrates into the through hole. 24. A method for mounting an electronic component using a support member having a heat sink and a lower leg having an upper end attached to the heat sink, and a tape carrier connected to the electronic component and having a first hole. A first step of inserting the lower leg of the support member into the first hole of the tape carrier and attaching the electronic component to a lower surface of the heat sink of the support member; A second step of fixing the tape carrier on the substrate and connecting the tape carrier to the substrate; and a third step of attaching a heat radiation member to the upper surface of the heat radiation plate of the support member. . 25. A method according to claim 25, wherein a through hole is provided in the tape carrier, a first pad is provided on an upper surface of the substrate, and the second step is performed on a solder provided on the first pad. 25. The method according to claim 24, further comprising the steps of: positioning the through-hole of the tape carrier; and dissolving the solder so as to enter the through-hole of the tape carrier. 26. A method of mounting an electronic component using a tape carrier connected to the electronic component and having a first hole and a heat sink having a second hole, wherein a lower end of a pin is attached to a substrate. A first step of attaching the electronic component to the lower surface of the heat sink, inserting the pin into the first hole of the tape carrier, inserting the pin into the second hole of the heat sink, An electronic component mounting method, comprising: a second step of connecting a substrate to the tape carrier; and a third step of attaching a heat radiating member to an upper surface of the heat radiating plate. 27. A method according to claim 27, wherein a through hole is provided in the tape carrier, a first pad is provided on an upper surface of the substrate, and the second step is on a solder provided on the first pad. 27. The method according to claim 26, further comprising the steps of: positioning the through hole of the tape carrier; and dissolving the solder so as to enter the through hole of the tape carrier. 28. The electronic package assembly according to claim 22, wherein an inner surface of the through hole is plated. 29. The first pad includes a second conductor pattern provided on an upper surface of the tape carrier, the through hole penetrates the second conductor pattern, and The electronic package assembly according to claim 28, wherein the second conductive pattern is connected to the second conductor pattern by plating in the through hole. 30. The heat radiating plate of the support member has a first portion covering the electronic component and a second portion covering at least a part of the tape carrier. 6. The electronic package assembly according to claim 5. 31. The radiator plate of the support member has a first portion covering the electronic component and a second portion covering at least a part of the tape carrier. 23. The electronic device according to claim 22, wherein a fifth hole penetrating vertically through the second portion of the heat sink is provided at a position of the second portion corresponding to the first pad. Package assembly. 32. A wiring board comprising: a film provided with wiring; and a through hole penetrating the film, having a taper, and connected to the wiring. 33. A first conductor pattern is provided on a first surface of the film, a second conductor pattern is provided on a second surface of the film, and the first and second conductor patterns are 33. The wiring board according to claim 32, wherein the wiring board is connected by the through hole. 34. The wiring board according to claim 32, wherein the inside of the through hole is plated. 35. A method for connecting a first substrate having a film provided with wiring and a through hole penetrating the film and connected to the wiring, and a second substrate having pads, the method comprising: A first step of placing solder on the pad of the second substrate, a first surface of the first substrate facing the second substrate, and a through-hole of the first substrate A method of connecting a wiring board, comprising: a second step positioned above; and a third step of melting at least a part of the solder into the through hole by melting the solder. 36. A method for confirming that the first substrate and the second substrate are normally connected by the appearance of a part of the solder on the second surface of the first substrate. 36. The method for connecting a wiring board according to claim 35, comprising four steps.