CN106910635A - A kind of orderly hole array anode tantalum foil for tantalum capacitor and preparation method thereof - Google Patents
A kind of orderly hole array anode tantalum foil for tantalum capacitor and preparation method thereof Download PDFInfo
- Publication number
- CN106910635A CN106910635A CN201710104154.9A CN201710104154A CN106910635A CN 106910635 A CN106910635 A CN 106910635A CN 201710104154 A CN201710104154 A CN 201710104154A CN 106910635 A CN106910635 A CN 106910635A
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- China
- Prior art keywords
- tantalum
- hole array
- orderly hole
- orderly
- tantalum piece
- Prior art date
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- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title claims abstract description 80
- 229910052715 tantalum Inorganic materials 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000003990 capacitor Substances 0.000 title claims abstract description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 2
- 241000446313 Lamella Species 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a kind of orderly hole array anode tantalum foil for tantalum capacitor and preparation method thereof, be the tantalum piece with different-thickness as material of main part, irradiated by high energy laser, and the orderly hole array being evenly distributed simply is obtained very much in tantalum metal surface.Structure of the invention significantly increases surface area, makes the capacity of the tantalum capacitor being finally made and can greatly improve;And anode tantalum foil of the invention can make the flake of arbitrary shape, takeup type etc., it is more suitable for modern component to slimming, the demand of high power capacity.
Description
Technical field
The present invention relates to a kind of orderly hole array anode tantalum foil for tantalum capacitor and preparation method thereof, belong to solid tantalum
Capacitor manufacturing technology field.
Background technology
Tantalum capacitor is because reliability is high, leakage current is small, stable performance many advantages, such as, and be widely used in communicating, count
The fields such as calculation machine, automotive electronics, automaton, electronic measuring instrument.With the miniaturization, slim of various electronic instruments
Change, the requirement of intelligent and low cost, tantalum capacitor need to also develop towards miniaturization, chip type, high performance direction.
The production technologies such as the widely used tantalum particle of traditional tantalum capacitor is compressing, high temperature sintering, the technique productions
Porous anode size is all more than 0.5 millimeter.In order to produce the product of more miniaturization, chip type, inevitable requirement further subtracts
Small porous tantalum core thickness.But when porous tantalum core thickness is reduced to a certain extent, it may appear that intensity difference, easy fracture, shaping are tired
Difficult the problems such as;Tantalum foil is directly used as anode, and cannot meet high energy demand because specific surface is small.One side market is to thin
The demand of type product is growing, and the compressing bottleneck of another aspect thin product turns into an implacable contradiction, this
A little problems greatly limit the progress of thin product technology.Meanwhile, the porous anode of relatively large and general thickness type
The technical barrier that when carrying out negative pole and being polymerized, voidage utilization rate is low to cause Large Copacity to be difficult to, repeatedly polymerization is wasted time and energy etc.,
Also the technology upgrading of large product is largely limited.
The content of the invention
In order to solve the above technical problems, the invention provides a kind of orderly hole array anode tantalum foil for tantalum capacitor and
Its preparation method, it is intended to irradiate tantalum foil surface by with high energy laser, the orderly hole array being evenly distributed is formed on its surface,
So as to effectively increase surface area, solve the problems, such as that the thin product of pressing process production is easily broken, difficult forming.
To solve technical problem, the present invention is adopted the following technical scheme that:
The present invention discloses a kind of orderly hole array anode tantalum foil for tantalum capacitor first, and it includes laminated structure
Tantalum piece layer, in the integrally-formed orderly hole array at least one surface of tantalum piece layer.
Surface area of the area of the orderly hole array less than or equal to tantalum piece layer.
The thickness of the tantalum piece layer is 5 μm~2mm.In the orderly hole array depth in each hole be 1 μm~50 μm, Kong Zhi
Footpath is 10~80 μm.
The preparation method of above-mentioned orderly hole array anode tantalum foil is:Tantalum piece is taken, the oil on tantalum piece surface is removed with alcohol washes
Dirty and dust;Then tantalum piece is placed on optical table, and is positioned with fixture, clamped;Finally adjust laser parameter and hot spot
Diameter, control laser beam carries out spot scan treatment to tantalum piece surface, i.e., in the integrally-formed orderly hole array of tantalum piece layer surface.
When spot scan treatment is carried out to tantalum piece surface, the energy range for adjusting the laser is 20~30w, sweep speed
Scope is 500~1000mm/s, spot diameter is 30~80 μm, 30-100 μm of spacing of point.
The processing region that spot scan treatment is carried out to tantalum piece surface is arbitrary shape.
The beneficial effects of the present invention are:
(1) present invention irradiates tantalum piece surface by high energy laser, divides so as to simply be formed very much in tantalum metal surface
The uniform hole array in order of cloth, effectively increases surface area, and making the capacity of the tantalum capacitor being finally made can greatly improve.
(2) the orderly hole array structure anode tantalum foil that the present invention is used can make the flake of arbitrary shape, takeup type
Deng, stacked or takeup type design requirement is all met to the direct lamination of anode tantalum foil or winding, it is more suitable for modern component to thin
Type, the demand of high power capacity.
(3) negative pole polymerization conveniently, directly, quickly can be aggregated on high-specific surface area anode tantalum paillon foil, improve poly-
Compound and effective contact area of tantalum foil, save the preparation time of capacitor, reduce production cost.
Brief description of the drawings
Fig. 1 is the SEM photograph of the embodiment of the present invention 1;
Fig. 2 is the SEM photograph of the embodiment of the present invention 4;
Fig. 3 is the SEM photograph of the embodiment of the present invention 5.
Specific embodiment
Embodiments of the invention are elaborated below, following embodiments are entered under premised on technical solution of the present invention
Row is implemented, and gives detailed implementation method and specific operating process, but protection scope of the present invention is not limited to following realities
Apply example.
Embodiment 1
The orderly hole array anode tantalum foil of the present embodiment, including laminated structure tantalum piece layer, tantalum piece layer upper surface one
Body is formed with orderly hole array.Its preparation method is as follows:
The tantalum piece that thickness is 150 μm is taken, the greasy dirt and dust on tantalum piece surface are removed with alcohol washes;Then tantalum piece is placed on
On optical table, and positioned with fixture, clamped;Laser parameter and spot diameter are finally adjusted, control laser beam is to tantalum piece table
Face carries out spot scan treatment, i.e., in the integrally-formed orderly hole array structure of tantalum piece layer surface.Spot scan is carried out to tantalum piece surface
During treatment, adjust laser energy range for 25w, sweep speed be 800mm/s, spot diameter be 50 μm, put 80 μm of spacing.
Scanning area is less than tantalum piece layer upper surface area.
Fig. 1 is the SEM photograph of the present embodiment gained sample, and as can be seen from the figure the area of orderly hole array is less than tantalum piece
The upper surface area of layer, each pore size distribution$ is uniform sequential, and hole depth is 30-40 μm, and bore dia is 50-60 μm.
Embodiment 2
The orderly hole array anode tantalum foil of the present embodiment and preparation method thereof is same as Example 1, differs only in order
The area of hole array is equal with the upper surface area of tantalum piece layer.
Embodiment 3
The orderly hole array anode tantalum foil of the present embodiment and preparation method thereof is same as Example 1, differs only in tantalum
Upper and lower two surfaces of lamella are each formed with orderly hole array structure.
Embodiment 4
The orderly hole array anode tantalum foil of the present embodiment and preparation method thereof is same as Example 1, differs only in hot spot
A diameter of 40 μm, 60 μm of spacing of point, its SEM figures are as shown in Figure 2.As can be seen from the figure each pore size distribution$ is uniform sequential, hole
Depth is 35-45 μm, and bore dia is 35-40 μm.
Embodiment 5
The orderly hole array anode tantalum foil of the present embodiment and preparation method thereof is same as Example 1, differs only in hot spot
A diameter of 30 μm, 40 μm of spacing of point, its SEM figures are as shown in Figure 3.As can be seen from the figure each pore size distribution$ is uniform sequential, hole
Depth is 40-50 μm, and bore dia is 25-30 μm.
Claims (7)
1. a kind of orderly hole array anode tantalum foil for tantalum capacitor, it is characterised in that:Tantalum piece layer including laminated structure,
The integrally-formed orderly hole array at least one surface of the tantalum piece layer.
2. orderly hole array anode tantalum foil according to claim 1, it is characterised in that:The area of the orderly hole array is small
In or equal to tantalum piece layer surface area.
3. orderly hole array anode tantalum foil according to claim 1, it is characterised in that:The thickness of the tantalum piece layer is 5 μm
~2mm.
4. orderly hole array anode tantalum foil according to claim 1, it is characterised in that:Each hole in the orderly hole array
Depth is 1 μm~50 μm, and bore dia is 10~80 μm.
5. a kind of preparation method of the orderly hole array anode tantalum foil in Claims 1 to 4 described in any one, its feature exists
In:Tantalum piece is taken, the greasy dirt and dust on tantalum piece surface are removed with alcohol washes;Then tantalum piece is placed on optical table, and with folder
Tool positioning, clamping;Laser parameter and spot diameter are finally adjusted, control laser beam carries out spot scan treatment to tantalum piece surface,
I.e. in the integrally-formed orderly hole array of tantalum piece layer surface.
6. the preparation method of orderly hole array anode tantalum foil according to claim 5, it is characterised in that:Tantalum piece surface is entered
When row spot scan is processed, adjust the energy range of the laser for 20~30w, sweep speed scope be 500~1000mm/s,
Spot diameter is 30~80 μm, 30-100 μm of spacing of point.
7. the preparation method of the orderly hole array anode tantalum foil according to claim 5 or 6, it is characterised in that:To tantalum piece table
The processing region that face carries out spot scan treatment is arbitrary shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710104154.9A CN106910635A (en) | 2017-02-24 | 2017-02-24 | A kind of orderly hole array anode tantalum foil for tantalum capacitor and preparation method thereof |
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CN201710104154.9A CN106910635A (en) | 2017-02-24 | 2017-02-24 | A kind of orderly hole array anode tantalum foil for tantalum capacitor and preparation method thereof |
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Publication Number | Publication Date |
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CN201710104154.9A Pending CN106910635A (en) | 2017-02-24 | 2017-02-24 | A kind of orderly hole array anode tantalum foil for tantalum capacitor and preparation method thereof |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111105929A (en) * | 2019-12-19 | 2020-05-05 | 泉州泉石电子科技有限公司 | Laser punching type flat-stacked capacitor electrode foil |
CN116288636A (en) * | 2023-02-06 | 2023-06-23 | 安徽格兰科新材料技术有限公司 | High-pressure-resistant ordered porous tantalum foil and preparation method and application thereof |
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---|---|---|---|---|
US6287673B1 (en) * | 1998-03-03 | 2001-09-11 | Acktar Ltd. | Method for producing high surface area foil electrodes |
CN1353432A (en) * | 2000-10-12 | 2002-06-12 | 松下电器产业株式会社 | Capacitance element and its manufacturing method and solid electrolytic capacitor carrying capacitance element |
JP2010114297A (en) * | 2008-11-07 | 2010-05-20 | Sumitomo Metal Mining Co Ltd | Multilayer porous electrode foil and method of manufacturing the same, and multilayer solid-state electrolytic capacitor using multilayer porous electrode foil |
CN103862238A (en) * | 2014-03-11 | 2014-06-18 | 苏州大学 | Manufacturing method for porous tantalum workpieces and corresponding device |
CN104465104A (en) * | 2014-11-27 | 2015-03-25 | 中国振华(集团)新云电子元器件有限责任公司 | Anode tantalum core of ultrathin tantalum capacitor and manufacturing method thereof |
CN105696048A (en) * | 2014-11-27 | 2016-06-22 | 中国科学院大连化学物理研究所 | Preparation method of hierarchical porous material |
CN106425110A (en) * | 2016-10-28 | 2017-02-22 | 深圳瑞隆新能源科技有限公司 | Manufacturing method of high-specific-surface-area current collector |
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2017
- 2017-02-24 CN CN201710104154.9A patent/CN106910635A/en active Pending
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US6287673B1 (en) * | 1998-03-03 | 2001-09-11 | Acktar Ltd. | Method for producing high surface area foil electrodes |
CN1353432A (en) * | 2000-10-12 | 2002-06-12 | 松下电器产业株式会社 | Capacitance element and its manufacturing method and solid electrolytic capacitor carrying capacitance element |
JP2010114297A (en) * | 2008-11-07 | 2010-05-20 | Sumitomo Metal Mining Co Ltd | Multilayer porous electrode foil and method of manufacturing the same, and multilayer solid-state electrolytic capacitor using multilayer porous electrode foil |
CN103862238A (en) * | 2014-03-11 | 2014-06-18 | 苏州大学 | Manufacturing method for porous tantalum workpieces and corresponding device |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111105929A (en) * | 2019-12-19 | 2020-05-05 | 泉州泉石电子科技有限公司 | Laser punching type flat-stacked capacitor electrode foil |
CN116288636A (en) * | 2023-02-06 | 2023-06-23 | 安徽格兰科新材料技术有限公司 | High-pressure-resistant ordered porous tantalum foil and preparation method and application thereof |
CN116288636B (en) * | 2023-02-06 | 2024-05-03 | 安徽格兰科新材料技术有限公司 | High-pressure-resistant ordered porous tantalum foil and preparation method and application thereof |
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Application publication date: 20170630 |