CN111836474B - Electronic device and method for manufacturing the same, and printed board and method for manufacturing the same - Google Patents
Electronic device and method for manufacturing the same, and printed board and method for manufacturing the same Download PDFInfo
- Publication number
- CN111836474B CN111836474B CN202010046869.5A CN202010046869A CN111836474B CN 111836474 B CN111836474 B CN 111836474B CN 202010046869 A CN202010046869 A CN 202010046869A CN 111836474 B CN111836474 B CN 111836474B
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- substrate
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- mounting
- solder
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims description 38
- 229910000679 solder Inorganic materials 0.000 claims abstract description 126
- 238000007747 plating Methods 0.000 claims abstract description 77
- 239000000758 substrate Substances 0.000 claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 230000007613 environmental effect Effects 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 144
- 230000008569 process Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000011810 insulating material Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides an electronic device and a manufacturing method thereof, and a printed circuit board and a manufacturing method thereof, which can improve environmental resistance. The electronic device (1) is provided with a printed substrate (5), and the printed substrate (5) is provided with a substrate (9); a copper layer (12) formed on the substrate (9); flash layer (29) formed to cover pad portions (13, 15) of the through hole (11) and an inner wall portion (17) of the through hole (11) in the copper layer (12); and a solder plating layer (39) formed so as to cover the flash plating layer (29).
Description
Technical Field
The disclosed embodiments relate to an electronic device, a method of manufacturing the electronic device, a printed substrate, and a method of manufacturing the printed substrate.
Background
Patent document 1 describes a method for manufacturing a printed wiring board by flash plating.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2009-152483.
Disclosure of Invention
Problems to be solved by the invention
The flash-plated substrate may not have good environmental resistance in an environment of a corrosive gas, for example, and improvement of environmental resistance is demanded.
The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an electronic device, a method for manufacturing an electronic device, a printed board, and a method for manufacturing a printed board, which can improve environmental resistance.
Means for solving the problems
In order to solve the above-described problems, according to an aspect of the present invention, there is provided an electronic device including a printed board having: a substrate; a copper layer formed on the substrate; a flash layer formed to cover a predetermined portion of the copper layer; and a solder plating layer formed to cover the flash plating layer.
In addition, according to another aspect of the present invention, there is provided a method for manufacturing an electronic device including a printed circuit board, the method comprising: a substrate mounting member on which a flash layer is formed so as to cover a predetermined portion of a copper layer; and assembling the substrate on which the component is mounted in a housing, wherein the step of mounting the component on the substrate includes a step of forming a solder plating layer so as to cover the flash plating layer.
In addition, according to another aspect of the present invention, there is provided a printed circuit board to be mounted on an electronic device, the printed circuit board including: a substrate; a copper layer formed on the substrate; a flash layer formed to cover a predetermined portion of the copper layer; and a solder plating layer formed to cover the flash plating layer.
In addition, according to another aspect of the present invention, there is provided a method for manufacturing a printed circuit board mounted on an electronic device, the method including a step of mounting a component on a substrate, wherein a flash layer is formed on the substrate so as to cover a predetermined portion of a copper layer, and the step of mounting the component on the substrate includes a step of forming a solder plating so as to cover the flash layer.
Effects of the invention
According to the electronic device and the like of the present invention, environmental resistance can be improved.
Drawings
Fig. 1 is a perspective view showing an example of a schematic configuration of an electronic device according to the present embodiment;
fig. 2 is a flowchart showing an example of a method for manufacturing an electronic device according to the present embodiment;
fig. 3 is a sectional view showing a sectional structure of a through hole portion of the printed wiring board;
fig. 4 is a flowchart showing an example of a detailed process of SMD mounting (first surface) performed in step S2 of fig. 2;
fig. 5 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S21 of fig. 4;
fig. 6 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S22 of fig. 4;
fig. 7 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S23 of fig. 4;
fig. 8 is a flowchart showing an example of a detailed process of SMD mounting (second surface) performed in step S3 of fig. 2;
fig. 9 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S31 of fig. 8;
fig. 10 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S32 of fig. 8;
fig. 11 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S33 of fig. 8;
fig. 12 is a flowchart showing an example of a detailed process of DIP mounting (second surface) performed in step S4 of fig. 2;
fig. 13 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S41 of fig. 12;
fig. 14 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S42 of fig. 12;
fig. 15 is a flowchart showing an example of a detailed process of DIP mounting (first surface) performed in step S5 of fig. 2;
fig. 16 is a cross-sectional view showing a cross-sectional structure of a through hole portion of the printed board extracted from an example of the structural member mounted on the printed board in step S6 of fig. 2;
fig. 17 is a cross-sectional view showing a cross-sectional structure of a through hole portion of the printed wiring board extracted in correspondence with step S41 of fig. 12 in a modification in which printing of solder paste is performed only on a pad portion of one side;
fig. 18 is a cross-sectional view showing a cross-sectional structure of a through hole portion of the printed wiring board extracted in correspondence with step S42 in fig. 12 in a modification in which printing of solder paste is performed only on one-sided pad portions.
Detailed Description
An embodiment will be described below with reference to the drawings.
<1. Schematic Structure of electronic device >
First, an example of a schematic configuration of the electronic device according to the present embodiment will be described with reference to fig. 1.
As shown in fig. 1, the electronic device 1 includes a housing 3 and a plurality of (e.g., 5) printed boards 5. The printed boards 5 are erected in a direction perpendicular to the bottom plate 3a of the housing 3 via connectors not shown, and are arranged parallel to each other. The number of printed boards 5 mounted on the electronic device 1 is not limited to a plurality, and may be a single number. The printed board 5 may be disposed parallel to the bottom plate 3 a.
The electronic device 1 is, for example, a motor control device that controls a motor. However, the application object of the electronic device 1 is not particularly limited as long as it is a device having a printed board. For example, the present invention can be applied to a control device for controlling a driving machine other than a motor, various industrial equipment, a computer, a smart phone, and the like.
The term "printed wiring board" in the present embodiment refers not to a so-called printed wiring board (PWB: printed Wiring Board) before mounting electronic components, but to a so-called printed circuit board (PCB: printed Circuit Board) on which electronic components are mounted and which operates as an electronic circuit.
<2 > Process for manufacturing electronic device
Next, an example of a manufacturing process (manufacturing method) of the electronic device according to the present embodiment will be described with reference to fig. 2.
In step S1, a Printed Wiring Board (PWB), electronic components mounted on the printed wiring board, and the like are prepared. As will be described later, a copper layer such as a pattern wiring is formed on a printed wiring board, and a flash layer is formed so as to cover a predetermined portion of the copper layer. The electronic components include an SMD (Surface Mount Device ) component as a surface mount component, a DIP (Dual In line Package, dual in-line assembly) component fixed by inserting a lead terminal into a through hole, and the like. The step S1 may be performed by an operator or by an automatic working machine such as a robot.
In step S2, the SMD component is mounted on the first surface of the printed wiring board. In step S3, the printed wiring board is turned over, and the SMD component is mounted on the second surface (the surface opposite to the first surface) of the printed wiring board. As will be described in detail later, in the step S2, the solder plating layer is formed so as to cover the flash plating layer on the first surface of the printed wiring board, and in the step S3, the solder plating layer is formed so as to cover the flash plating layer on the second surface of the printed wiring board. The steps S2 and S3 are performed by a surface mounting machine (not shown) including a solder paste printing device, a mounter, a reflow oven, and the like.
In step S4, DIP components are mounted on the second surface of the printed wiring board. In step S5, the printed wiring board is turned upside down, and DIP components are mounted on the first surface of the printed wiring board. The steps S4 and S5 are performed by an insertion mounter (not shown) including an insertion machine (not required for manual mounting) and a runner.
In addition, in the steps S2 and S3, the SMD components are mounted in the order from the first surface to the second surface, and in the steps S4 and S5, the DIP components are mounted in the order from the second surface to the first surface, so that the step of turning over the printed wiring board can be reduced. The steps S2 to S5 correspond to a step of mounting components on a substrate.
In step S6, the structural component is mounted on a printed substrate (PCB) on which the SMD component and the DIP component are mounted. The "structural member" is, for example, a member other than an electronic component mounted on the substrate, such as a screw or a stud. The step S6 may be performed by an operator or by an automatic working machine such as a robot.
In step S7, the printed board on which the structural member is mounted is assembled into the housing 3 of the electronic apparatus 1. Step S7 corresponds to a step of assembling the substrate into the housing. In addition, other internal devices are mounted, wiring work, and the like are also performed. The step S7 may be performed by an operator or by an automatic working machine such as a robot. Thus, the electronic apparatus 1 is completed.
In the above description, the printed circuit board is a double-sided board in which components are mounted on both the front surface and the back surface, but the component may be mounted on only one side (component side). At this time, in the above step S2, the mounting of the SMD is not performed, and the solder plating layer is formed so as to cover the flash plating layer of the first surface (solder surface). In the above step S3, the SMD component is mounted on the second surface (component surface), and the solder plating layer is formed so as to cover the flash plating layer of the second surface (component surface). In step S4, DIP components are mounted on the second surface (component surface). In addition, the above step S5 is not required.
<3: layer Structure of printed Wiring Board
Next, an example of the layer structure of the printed wiring board prepared in step S1 will be described with reference to fig. 3. Fig. 3 is a sectional view showing a cross-sectional structure of a through hole portion of the printed wiring board.
As shown in fig. 3, the printed wiring board 7 has a first surface 7A and a second surface 7B. The printed wiring board 7 has a substrate 9 (also referred to as a base material) made of an insulating material. The substrate 9 may be a substrate having a single-layer structure, or may be a substrate having a multilayer structure in which, for example, wiring layers and planar layers are laminated. In the substrate 9, a through hole 11 is formed by a drill in the hole forming step. The "through hole" in the present embodiment is a through hole having a large diameter, which penetrates all layers of the substrate 9, and into which a structural member such as a screw or a stud or a lead terminal of a DIP member is inserted. Accordingly, a through hole (so-called via hole) having a small diameter, which is formed to penetrate through all or only a part of the layers of the substrate 9 for the purpose of interlayer conduction, is not included in the "through hole".
A copper layer 12 is formed on the surface of the substrate 9 in the copper plating step and the patterning step. The copper layer 12 has: a pad portion 13 on the first surface 7A side and a pad portion 15 on the second surface 7B side formed around the opening portion of the through hole 11; and an inner wall portion 17 formed on the inner wall of the through hole 11. The copper layer 12 includes pads 19 on the first surface 7A side and pads 21 on the second surface 7B side on which electronic components are to be surface-mounted, pads 23 on the first surface 7A side on which electronic components are not to be mounted, such as test pads or preliminary pads, and identification marks 25 formed on the second surface 7B side for detecting the position or orientation of the substrate by the mounter or interposer.
In addition, a solder resist layer 27 for protecting the copper layer 12 is formed on the surface of the substrate 9 in the solder resist step. The solder resist layer 27 is formed as a pattern wiring (not shown) covering the copper layer 12 except for predetermined portions of the copper layer 12 (for example, portions where the pad portions 13 and 15, the inner wall portion 17, the pads 19 and 21, and the like are soldered, and the pad 23, the identification mark 25, and the like).
In the copper layer 12, a flash layer 29 is formed so as to cover the parts exposed from the solder resist layer 27, that is, the pad parts 13 and 15, the inner wall part 17, the pads 19, 21 and 23, and the identification mark 25 in the example shown in fig. 3, in the flash plating step. Flash plating is thin gold plating (e.g., about 0.01 μm to 0.05 μm) performed in a very short time, and has good compatibility with solder and ensures good wettability.
The printed wiring board 7 is manufactured after the flash plating step, for example, through a step such as character printing, outline processing, and cleaning.
< detailed procedure for SMD mounting >
Next, an example of a detailed process of SMD mounting will be described with reference to fig. 4 to 10.
Fig. 4 is a flowchart showing an example of a detailed process of SMD mounting (first surface) performed in step S2. Fig. 5 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S21 in fig. 4, fig. 6 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S22 in fig. 4, and fig. 7 is a sectional view showing a sectional structure of the through hole portion of the printed wiring board extracted corresponding to step S23 in fig. 4.
As shown in fig. 4, in step S21, solder paste is printed on the flash layer 29 on the first surface 7A side of the printed wiring board 7 by a solder paste printing device using a metal mask. A "solder paste" is a substance obtained by adding a flux (solvent) to a powder of solder to have a predetermined viscosity, and is also called a cream solder. For example, as shown in fig. 5, on the metal mask 31, an opening 35 is formed at a position corresponding to the pad portion 13, the pad 19, and the pad 23 on the first surface 7A side, whereby the solder paste 33 is printed on the flash layer 29 of the pad portion 13, the pad 19, and the pad 23.
In step S22, the SMD component is arranged on the solder paste printed on the portion of the mounting component on the first surface 7A side of the printed wiring board 7 by the mounter. For example, as shown in fig. 6, the SMD component 37 is arranged on the solder paste 33 printed on the flash layer 29 of the pad 19.
In step S23, the printed wiring board 7 provided with the SMD component 37 is heated by a reflow oven. Thereby, the printed solder paste 33 is melted by heating, the flash layer 29 is covered, and the SMD component 37 is bonded by soldering. For example, as shown in fig. 7, the solder paste 33 printed on the flash layer 29 of the pad 19 is vaporized by heating, and the powder of the solder is melted to be liquefied and then solidified to form a solder plating layer 39. Thereby, the SMD component 37 and the flash layer 29 of the pad 19 are bonded. Likewise, the solder paste 33 printed on the flash layer 29 of the pad 23 forms a solder plating layer 39 by melting of the solder powder in such a manner as to cover the flash layer 29. In addition, the solder paste 33 printed on the flash layer 29 of the pad portion 13 is liquefied by melting, and flows into the through hole 11. Thereby, the solder plating layer 39 is formed in such a manner as to cover a part (for example, half of the first surface 7A side) of the flash plating layer 29 of the inner wall portion 17 together with the flash plating layer 29 of the pad portion 13.
Fig. 8 is a flowchart showing an example of the detailed process of SMD mounting (second surface) performed in step S3, fig. 9 is a cross-sectional view showing a cross-sectional structure of a through hole portion of the printed wiring board extracted corresponding to step S31 in fig. 8, fig. 10 is a cross-sectional view showing a cross-sectional structure of a through hole portion of the printed wiring board extracted corresponding to step S32 in fig. 8, and fig. 11 is a cross-sectional view showing a cross-sectional structure of a through hole portion of the printed wiring board extracted corresponding to step S33 in fig. 8.
As shown in fig. 8, in step S31, solder paste is printed on the flash layer 29 on the second surface 7B side of the printed wiring board 7 by the solder paste printing device using a metal mask. For example, as shown in fig. 9, on the metal mask 41, openings 43 are formed at positions corresponding to the pad portions 15, the pads 21, and the identification marks 25 on the second surface 7B side, whereby solder paste 33 is printed on the flash layer 29 of the pad portions 15, the pads 21, and the identification marks 25.
In step S32, the SMD component is arranged on the solder paste printed on the portion of the mounting component on the second surface 7B side of the printed wiring board 7 by the mounter. For example, as shown in fig. 10, the SMD component 45 is arranged on the solder paste 33 printed on the flash layer 29 of the pad 21.
In step S33, the printed wiring board 7 on which the SMD component 45 is arranged is heated by a reflow oven. Thereby, the printed solder paste 33 is melted by heating, the flash layer 29 is covered, and the SMD component 45 is bonded by soldering. For example, as shown in fig. 11, the solder paste 33 printed on the flash layer 29 of the pad 21 is vaporized by heating, and the powder of the solder is melted to be liquefied and then solidified to form a solder plating layer 39. Thereby, the SMD component 45 and the flash layer 29 of the pad 21 are bonded. Likewise, the solder paste 33 printed on the flash layer 29 of the identification mark 25 forms a solder plating layer 39 by melting of the solder powder so as to cover the flash layer 29. In addition, the solder paste 33 printed on the flash layer 29 of the pad portion 15 is liquefied by melting, and flows into the through hole 11. Thereby, the solder plating layer 39 is formed in such a manner as to cover a part (for example, half of the second surface 7B side) of the flash plating layer 29 of the inner wall portion 17 together with the flash plating layer 29 of the pad portion 15. In this way, by performing the SMD component mounting process on both the first surface 7A and the second surface 7B of the printed wiring board 7, the solder plating layer 39 is formed so as to cover the entire flash plating layer 29 of the inner wall portion 17 in the through hole 11.
In the above description, the case where the whole of the inner wall 17 is covered with the solder paste 33 of the pad portion 13 and the pad portion 15 at the same ratio is described, but for example, the whole of the inner wall 17 may be covered with only the solder paste 33 of either the pad portion 13 or the pad portion 15, or the whole of the inner wall 17 may be covered with the solder paste 33 of the pad portion 13 and the pad portion 15 at an appropriate ratio. In this case, for example, the thicknesses of the metal masks 31 and 41 and the sizes of the openings 35 and 43 may be adjusted, and the amount of the solder paste 33 printed on the pad portion 13 or the pad portion 15 may be adjusted to an appropriate amount.
The steps S21 and S31 correspond to a step of printing solder paste and a step of printing solder paste on the flash layer of the pad portion. The steps S23 and S33 correspond to a step of covering the flash layer and a step of covering the flash layer of the pad portion and the inner wall portion. The steps S21 and S31, S23 and S33 correspond to the step of forming the solder plating layer.
< detailed procedure for DIP mounting >
Next, an example of detailed steps of DIP mounting will be described with reference to fig. 12 to 15.
Fig. 12 is a flowchart showing an example of a detailed process of DIP mounting (second surface) performed in step S4, fig. 13 is a cross-sectional view showing a cross-sectional structure of a through hole portion of the printed wiring board extracted corresponding to step S41 in fig. 12, and fig. 14 is a cross-sectional view showing a cross-sectional structure of a through hole portion of the printed wiring board extracted corresponding to step S42 in fig. 12.
As shown in fig. 12, in step S41, DIP components are arranged at the positions of the mounting components on the second surface 7B side of the printed wiring board 7 by an insertion machine or by manual work of an operator. For example, as shown in fig. 13, the DIP member 47 is arranged on the second surface 7B side by inserting the lead terminal 49 into the through hole 51. In the through-hole 51, as in the through-hole 11 described above, the solder plating layer 39 is formed so as to cover the entire flash layer 29 of the pad portions 53 and 55 and the inner wall portion 57 by performing the SMD component mounting step (step S2 and step S3) on both the first surface 7A and the second surface 7B of the printed wiring board 7.
In step S42, the solder reflow is performed on the printed wiring board 7 provided with the DIP member 47 by using the flow grooves. Thereby, the lead terminal 49 of the DIP part 47 is bonded to the through hole 51 by soldering. For example, as shown in fig. 14, a jet of solder is sprayed from the flow groove to the first surface 7A side of the printed wiring board 7 having the DIP member 47 arranged on the second surface 7B side, and the solder is filled into the through hole 51 and the land 59 is formed.
In step S43, the operator performs welding by hand at a portion that is not welded by the above-described flow welding, or performs repair of a portion where a failure (for example, a short circuit or the like) occurs by the above-described flow welding. The step S43 may be performed by an automatic working machine such as a robot.
Fig. 15 is a flowchart showing an example of a detailed process of DIP mounting (first surface) performed in step S5. The cross-sectional structure of the printed wiring board in this step is the same as that shown in fig. 13 and 14 (the printed wiring board is inverted, and the positional relationship between the first surface and the second surface in the up-down direction is reversed), and therefore illustration of the cross-sectional structure is omitted.
As shown in fig. 15, in step S51, the lead terminal of the DIP member is inserted into the through hole by an insertion machine or manual operation of an operator, and the DIP member is disposed on the first surface 7A side.
In step S52, a jet of solder is ejected from the flow groove toward the second surface 7B side of the printed wiring board 7 having the DIP member disposed on the first surface 7A side, and the solder is filled into the through hole and the land is formed.
In step S53, the operator manually welds a portion that is not welded by the above-described flow welding, or repairs a portion where a defect (for example, a short circuit or the like) occurs by the above-described flow welding. The step S53 may be performed by an automatic working machine such as a robot. This completes the mounting of the component on the printed wiring board 7, thereby forming the printed board 5.
As described above, the solder plating layer 39 is formed in advance so as to cover the flash plating layer 29 in the previous step (the SMD component mounting step) on the pad portions 53, 55 and the inner wall portion 57 of the through hole 51 on which the DIP component 47 is mounted. Thus, exposure of the flash layer 29 can be prevented even in the portion where the solder does not reach the pad portion 55 (the pad portion 55 on the side where the DIP member 47 is disposed) and the inner wall portion 57 on the side opposite to the side where the solder is reflowed.
<6 > structural Member mounted on printed Board >
Next, an example of the structural member mounted on the printed circuit board in step S6 will be described with reference to fig. 16.
In the example shown in fig. 16, with respect to the through hole 61 of the printed substrate 5 in which the mounting of the component is completed, a screw 62 is inserted from the first surface 7A side to the second surface 7B side, and is screwed into the stud 64. In the through-hole 61, similarly to the through-holes 11 and 51, the solder plating 39 is formed so as to cover the entire flash layer 29 of the pad portions 63 and 65 and the inner wall portion 67 by performing the SMD component mounting process (step S2 and step S3) on both the first surface 7A and the second surface 7B of the printed wiring board 7. The screw 62 and the stud 64, which are made of conductive material, are conducted by being fastened to each other. The screw 62 is in contact with the solder plating layer 39 via the washer 69 to be in communication with the pad 63, and the stud 64 is in contact with the solder plating layer 39 to be in communication with the pad 65.
With this structure, the following effects are obtained. For example, as a method for suppressing corrosion of the flash layer 29, for example, a coating material (acrylic, urethane, silicon, or the like) may be applied to the surface of the flash layer 29. However, in this case, since the coating material is made of an insulating material, the insulating material is interposed between the screw 62 or the stud 64 and the pad portions 63 and 65, and the conduction in the through hole 61 may become unstable. In the present embodiment, since the solder plating layer 39 is formed as the conductive material, good conduction between the screw 62, the stud 64, and the pad portions 63 and 65 can be ensured, and the stability of conduction of the through hole 61 can be improved.
<7 > effects of the embodiment
As described above, the electronic device 1 of the present embodiment includes the printed board 5, and the printed board 5 includes: a substrate 9; a copper layer 12 formed on the substrate 9; flash layer 29 formed to cover a predetermined portion of copper layer 12; and a solder plating layer 39 formed so as to cover the flash plating layer 29.
By using flash plating as the surface treatment of the copper layer 12, it is possible to mount very small chip components, narrow pitch BGA (packages), or the like, as compared with the case where the surface of the copper layer 12 is covered with solder (solder leveler), for example, and it is possible to achieve higher density or miniaturization of the printed substrate 5. On the other hand, since the flash layer 29 is formed extremely thin, it tends to be easily corroded in an environment of a corrosive gas such as a hydrogen sulfide gas, for example, as compared with the solder leveler, and good environmental resistance may not be obtained.
Therefore, in the present embodiment, the solder plating layer 39 is formed so as to cover the flash plating layer 29. As a result, the solder has high corrosion resistance to corrosive gas, and thus the environmental resistance of the flash layer 29 can be improved. Therefore, the printed board 5 having high density and miniaturization and high environmental resistance can be realized.
Further, as a method of suppressing corrosion of the flash layer 29, for example, a coating material (acrylic, urethane, silicon, or the like) may be applied, but since such a coating material is made of an insulating material, conduction at a portion where the flash layer 29 is formed may become unstable. In the present embodiment, since the solder plating layer 39 made of a conductive material is formed, good conduction can be ensured.
In the present embodiment, the copper layer 12 has, in particular: the land portions 13, 15, etc. (including the land portions 53, 55, the land portions 63, 65, etc.) formed around the opening portions of the through holes 11, etc. (including the through holes 51, 61, etc. hereinafter the same) formed on the substrate 9, etc. and the inner wall portion 17, etc. (including the inner wall portions 57, 67, hereinafter the same) formed on the inner wall of the through holes 11, etc. the flash plating layer 29 is formed so as to cover the land portions 13, 15, etc. and the inner wall portion 17, etc., and the solder plating layer 39 is formed so as to cover the flash plating layer 29 formed on the land portions 13, 15, etc. and the inner wall portion 17, etc.
The through hole 11 or the like formed in the substrate is inserted through by, for example, a screw 62, a stud 64 or the like to serve as a terminal of the component or the substrate, or is inserted through by the lead terminal 49 of the DIP component 47 to serve for mounting of the component. It is assumed that the former through-holes (e.g., through-holes 61) are not generally coated without forming the solder plating layer 39, and therefore the flash plating layer 29 is exposed at the pad portions 63, 65, etc., or the inner wall portion 67, etc. In the latter case, though the DIP member 47 is mounted by spraying molten solder from the surface side opposite to the surface on which the DIP member 47 is disposed in the reflow step, the flash layer 29 may be exposed to a portion where the solder of the pad portion 55 and the inner wall portion 57 on the surface side on which the DIP member 47 is disposed does not reach. Therefore, the influence of corrosive gas is easily received.
In the present embodiment, the solder plating layer 39 is formed as a flash plating layer 29 formed to cover the pad portions 13, 15, etc. of the copper layer 12 and the inner wall portion 17, etc. In this way, the exposed portions of the flash layer 29 can be eliminated in the through holes of both, and environmental resistance can be improved.
In contrast to the case where, for example, a coating material is applied to the exposed portion of the flash layer 29 in the through-hole 11 or the like, since the coating material is made of an insulating material, the insulating material is interposed between the screw 62 and the stud 64 inserted into the inside or the lead terminal 49 of the DIP member 47 and the copper layer 12, and there is a possibility that conduction of the through-hole 11 or the like becomes unstable, and in the present embodiment, since the solder plating layer 39 is formed as a conductive material, stability of conduction of the through-hole 11 or the like can be improved.
The method for manufacturing the electronic device 1 including the printed circuit board 5 according to the present embodiment includes: step S2 to step S5 are steps of mounting components on the printed wiring board 7 in which the flash layer 29 is formed so as to cover a predetermined portion of the copper layer 12; and step S7, which is a step of assembling the printed circuit board 5 with the components mounted therein into the housing 3, wherein steps S2 to S5, which are a step of mounting the components onto the printed wiring board 7, include steps S21 and S31, and steps S23 and S33, which are a step of forming the solder plating layer 39 so as to cover the flash plating layer 29.
This allows the step of forming the solder plating layer 39 to be incorporated into the step of mounting the component, which is a conventional manufacturing step. Therefore, the electronic device 1 including the printed board 5 which can be highly dense and compact and has high environmental resistance can be manufactured without adding a new manufacturing process.
In the present embodiment, in particular, steps S21 and S31 and steps S23 and S33, which are steps of forming the solder plating layer 39, include: step S21 and step S31 are steps of printing solder paste 33 on flash layer 29 using metal masks 31, 41; and steps S23 and S33 are steps of melting the solder paste 33 after printing by heating to cover the flash layer 29.
In general, the process of mounting the SMD components 37, 45 includes: a step of printing solder paste on a predetermined portion on the substrate using a metal mask even when the solder plating layer 39 is not formed (corresponding to step S21 and step S31); a step of disposing a component on the printed solder paste (corresponding to step S22 and step S32); and a step (corresponding to step S23 and step S33) of melting the printed solder paste and fixing the member with the solder by heating. Therefore, according to the present embodiment, the solder plating layer 39 can be formed on the flash plating layer 29 in the step of mounting the SMD components 37 and 45 by newly providing the opening of the portion where the solder plating layer 39 is formed on the opening shape of the conventional metal mask.
In the present embodiment, in particular, step S21 and step S31, which are steps of printing the solder paste 33, include a step of printing the solder paste 33 on the flash layer 29 of the pad portions 13, 15, etc., and step S23 and step S33, which are steps of covering the flash layer 29, include a step of melting the solder paste 33 printed on the flash layer 29 of the pad portions 13, 15, etc., by heating, to cover the flash layer 29 of the pad portions 13, 15, etc., the inner wall portion 17, etc.
In this way, the solder paste 33 printed on the pad portions 13, 15, etc. is melted, and the solder in a liquid state flows into the through hole 11, etc., so that not only the pad portions 13, 15, etc., but also the flash layer 29 of the inner wall portion 17, etc. can be covered with the solder plating layer 39.
<8 > modification example
The disclosed embodiments are not limited to the above, and various modifications can be made without departing from the spirit and technical ideas.
In the above embodiment, both the land portions 53 and 55 of the through hole 51 are printed with the solder paste 33 and heated by the reflow oven, and the solder plating layer 39 is formed so as to cover the entire flash plating layer 29 of the land portions 53 and 55 and the inner wall portion 57, but the present invention is not limited thereto. For example, as shown in fig. 17, the solder paste 33 may be printed only on the land portion 55 of the through hole 51 and heated by a reflow oven, so that the solder plating layer 39 is formed so as to cover a part (for example, half on the second surface 7B side) of the flash plating layer 29 of the inner wall portion 57 together with the flash plating layer 29 of the land portion 55. As shown in fig. 18, a jet flow of solder may be sprayed from the flow groove toward the first surface 7A side of the printed wiring board 7 having the DIP member 47 disposed on the second surface 7B side, and the solder may be filled into the through hole 51 to form the fillet 59, thereby forming the flash layer 29 covering the pad portion 53 and the remaining portion (for example, half of the first surface 7A side) of the inner wall portion 57.
In the case of the present modification, in step S21 shown in fig. 4, the solder paste 33 is not printed on the pad portion 53 on the first surface 7A side, and in step S31 shown in fig. 8, the solder paste 33 is printed on the pad portion 55 on the second surface 7B side. According to this modification, exposure of the flash layer 29 can be prevented even in the portion where the solder of the pad portion 55 (the pad portion 55 on the side where the DIP member 47 is disposed) on the side opposite to the side where the flow soldering is performed or the inner wall portion 57 is difficult to reach (for example, the portion on the second surface 7B side).
In the above description, when the descriptions of "vertical", "parallel", "plane", and the like are given, the descriptions are not strictly meant. That is, these "vertical", "parallel", "plane" are designed to allow manufacturing tolerances and errors, and refer to "substantially vertical", "substantially parallel", "substantially plane".
In the above description, the terms "same (same)", "equal", "different", and the like are used in terms of the dimensions, sizes, shapes, positions, and the like, and are not intended to be construed strictly. That is, these "same (same)", "equal", "different" allow for design and manufacturing tolerances and errors, and refer to "substantially same (same)", "substantially equal", "substantially different".
In addition to the above-described methods, the methods of the above-described embodiments and modifications may be appropriately combined and used. Although not illustrated, the above embodiments and modifications may be implemented with various modifications within a range not departing from the gist thereof.
1. Electronic equipment
3. Frame body
5. Printed substrate
7. Printed wiring board (baseboard)
9. Substrate board
11. Through hole
12. Copper layer
13. Pad part
15. Pad part
17. Inner wall portion
29. Flash coating
31. Metal mask
33. Solder paste
39. Solder coating
41. Metal mask
51. Through hole
53. Pad part
55. Pad part
57. Inner wall portion
61. Through hole
63. Pad part
65. Pad part
67. Inner wall portion
Claims (6)
1. A method for manufacturing an electronic device including a printed circuit board, the method comprising:
a substrate mounting member on which a flash layer is formed so as to cover a predetermined portion of a copper layer; and
assembling the substrate with the components mounted therein into a frame,
the step of mounting the component on the substrate includes the steps of:
mounting a surface mount component on a first surface of the substrate;
turning over the substrate and mounting other surface-mounted components on a second surface opposite to the first surface;
mounting a DIP component fixed by inserting a lead terminal into the second surface of the substrate;
flipping the substrate and mounting other of the DIP components on the first surface of the substrate,
in the step of mounting the surface mount component on the first surface of the substrate and the step of mounting the other surface mount component on the second surface of the substrate,
a step of forming a solder plating layer to cover the flash plating layer formed on the pad portion on the first surface side, the pad portion on the second surface side, and the inner wall portion of the through hole into which the lead terminal is inserted.
2. The method for manufacturing an electronic device according to claim 1, wherein,
the step of forming the solder plating layer includes the steps of:
printing solder paste on the flash layer by using a metal mask; and
the printed solder paste is heated and melted to cover the flash layer.
3. The method for manufacturing an electronic device according to claim 2, wherein,
the copper layer has:
the pad part is formed around the opening part of the through hole, and the through hole is formed on the substrate; and
the inner wall part is formed on the inner wall of the through hole,
the flash layer is formed to cover the pad portion and the inner wall portion,
the step of printing the solder paste includes a step of printing the solder paste on the flash layer of the pad part,
the step of covering the flash layer includes: and a step of heating and melting the solder paste printed on the flash layer of the pad portion to cover the flash layer of the pad portion and the inner wall portion.
4. A method for manufacturing a printed circuit board, characterized by comprising,
comprises a step of mounting a component on a substrate, wherein a flash layer is formed on the substrate so as to cover a prescribed portion of a copper layer,
the step of mounting the component on the substrate includes:
mounting a surface mount component on a first surface of the substrate;
turning over the substrate and mounting other surface-mounted components on a second surface opposite to the first surface;
mounting a DIP component fixed by inserting a lead terminal into the second surface of the substrate;
flipping the substrate and mounting other of the DIP components on the first surface of the substrate,
in the step of mounting the surface mount component on the first surface of the substrate and the step of mounting the other surface mount component on the second surface of the substrate,
a step of forming a solder plating layer to cover the flash plating layer formed on the pad portion on the first surface side, the pad portion on the second surface side, and the inner wall portion of the through hole into which the lead terminal is inserted.
5. The method for manufacturing a printed circuit board according to claim 4, wherein,
the step of forming the solder plating layer includes the steps of:
printing solder paste on the flash layer by using a metal mask; and
the printed solder paste is heated and melted to cover the flash layer.
6. The method of manufacturing a printed circuit board according to claim 5, wherein,
the copper layer has:
the pad part is formed around the opening part of the through hole, and the through hole is formed on the substrate; and
the inner wall part is formed on the inner wall of the through hole,
the flash layer is formed to cover the pad portion and the inner wall portion,
the step of printing the solder paste includes a step of printing the solder paste on the flash layer of the pad part,
the step of covering the flash layer includes: and a step of heating and melting the solder paste printed on the flash layer of the pad portion to cover the flash layer of the pad portion and the inner wall portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-081312 | 2019-04-22 | ||
| JP2019081312A JP6909445B2 (en) | 2019-04-22 | 2019-04-22 | Electronic equipment, manufacturing method of electronic equipment, printed circuit board, manufacturing method of printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN111836474A CN111836474A (en) | 2020-10-27 |
| CN111836474B true CN111836474B (en) | 2023-11-24 |
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| CN202010046869.5A Active CN111836474B (en) | 2019-04-22 | 2020-01-16 | Electronic device and method for manufacturing the same, and printed board and method for manufacturing the same |
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| Country | Link |
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| JP (1) | JP6909445B2 (en) |
| CN (1) | CN111836474B (en) |
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| CN114449753A (en) * | 2022-01-27 | 2022-05-06 | 京东方科技集团股份有限公司 | Printed circuit board, packaging method thereof and electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0654818A1 (en) * | 1993-11-19 | 1995-05-24 | Citizen Watch Co., Ltd. | Semiconductor device with solder bump and process for manufacturing the same |
| JPH09275271A (en) * | 1996-04-02 | 1997-10-21 | Toshiba Corp | Printed-wiring board, manufacture thereof and printed circuit board |
| JP2008091957A (en) * | 2002-01-11 | 2008-04-17 | Nec Infrontia Corp | Soldering method |
| KR20080051341A (en) * | 2006-12-05 | 2008-06-11 | (주) 아모센스 | Electron parts package |
| JP2009152483A (en) * | 2007-12-21 | 2009-07-09 | Citizen Electronics Co Ltd | Method for manufacturing printed circuit board |
| JP2015207729A (en) * | 2014-04-23 | 2015-11-19 | 三菱電機株式会社 | Printed wiring board |
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2019
- 2019-04-22 JP JP2019081312A patent/JP6909445B2/en active Active
-
2020
- 2020-01-16 CN CN202010046869.5A patent/CN111836474B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0654818A1 (en) * | 1993-11-19 | 1995-05-24 | Citizen Watch Co., Ltd. | Semiconductor device with solder bump and process for manufacturing the same |
| JPH09275271A (en) * | 1996-04-02 | 1997-10-21 | Toshiba Corp | Printed-wiring board, manufacture thereof and printed circuit board |
| JP2008091957A (en) * | 2002-01-11 | 2008-04-17 | Nec Infrontia Corp | Soldering method |
| KR20080051341A (en) * | 2006-12-05 | 2008-06-11 | (주) 아모센스 | Electron parts package |
| JP2009152483A (en) * | 2007-12-21 | 2009-07-09 | Citizen Electronics Co Ltd | Method for manufacturing printed circuit board |
| JP2015207729A (en) * | 2014-04-23 | 2015-11-19 | 三菱電機株式会社 | Printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111836474A (en) | 2020-10-27 |
| JP6909445B2 (en) | 2021-07-28 |
| JP2020178106A (en) | 2020-10-29 |
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