CN108811367B - Surface mounting method - Google Patents
Surface mounting method Download PDFInfo
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- CN108811367B CN108811367B CN201810865439.9A CN201810865439A CN108811367B CN 108811367 B CN108811367 B CN 108811367B CN 201810865439 A CN201810865439 A CN 201810865439A CN 108811367 B CN108811367 B CN 108811367B
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- Prior art keywords
- solder resist
- solder
- resist layer
- layer
- oil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
Abstract
The invention provides a surface mounting method, which comprises the following steps: providing a printed circuit board, wherein the printed circuit board comprises a welding pad area and a non-welding pad area; forming a first solder resist oil layer on the surface of the non-solder-pad area, so that the upper surface of the solder pad area is lower than the upper surface of the first solder resist oil layer, and the solder pad area and the first solder resist oil layer form a groove; filling the groove with solder paste; mounting components; and welding and fixing the components. The surface mounting method does not use a steel mesh, and has the characteristic of simple operation process.
Description
Technical Field
The invention relates to a surface mounting method, and belongs to the technical field of printed circuit board assembly processes.
Background
In the process of manufacturing electronic products, the technology of bonding components and circuit boards can be divided into Through Hole Technology (THT) and Surface Mount Technology (SMT). Among them, the surface mount technology directly welds surface mount components to the specified positions on the surface of a Printed Circuit Board (PCB) without drilling insertion holes on the PCB, which is the most popular technology and process in the electronic assembly industry at present. The surface mounting process flow which is commonly used is as follows: firstly, printing solder paste on the surface of a bonding pad of a printed circuit board; then, mounting the components to be welded on the corresponding positions of the printed circuit board to complete the mounting of the components; then, reflow soldering is carried out to fix the components on the surface of the printed circuit board; finally, the surface mounting of the components on the surface of the printed circuit board is finished after the inspection is qualified.
In the surface mounting process, in order to apply solder paste to a designated position of a pad, a steel screen printing technique is industrially used on a large scale. The printing in-process makes the steel mesh earlier, and the printing machine makes the tin cream constantly roll on the steel mesh through removing the scraper blade and falls into in the opening of steel mesh to realize printing. The manufacturing cost and the time cost of the steel mesh are high; the problem of inaccurate alignment of the steel mesh and the printed circuit board pad is easy to occur, thereby causing rework of solder paste coating.
Disclosure of Invention
The invention aims to solve the technical problem of how to provide a surface mounting method which does not need a steel mesh and has simple process.
In order to solve the above problems, the present invention provides a surface mounting method, which includes the steps of:
step S1: providing a printed circuit board, wherein the printed circuit board comprises a welding pad area and a non-welding pad area;
step S2: forming a first solder resist oil layer on the surface of the non-solder-pad area, so that the upper surface of the solder pad area is lower than the upper surface of the first solder resist oil layer, and the solder pad area and the first solder resist oil layer form a groove;
step S3: filling the groove with solder paste;
step S4: mounting components;
step S5: and welding and fixing the components.
The surface mounting method directly coats the solder paste on the surface of the solder resist oil layer when the solder paste is coated. A steel mesh is not used, so that the manufacturing cost and expense of the steel mesh are saved, and the process difficulty is reduced; meanwhile, the problem of solder paste coating rework caused by misalignment of the steel mesh and the bonding pad area is avoided.
Further, after step S2, the method further includes the following steps:
and covering the whole surface of the first solder resist layer to form a second solder resist layer, so that the depth of all the grooves is deepened.
Further, after step S2, the method further includes the following steps:
forming the second solder resist layer to cover a part of the surface of the first solder resist layer so that a part of the depth of the groove is deepened.
Further, after the second solder resist oil layer is formed, the method further comprises the following steps:
forming one or more additional solder resist layers covering the entire surface of the second solder resist layer such that the depth of all the deepened grooves is further deepened.
Further, the additional solder resist layer is a plurality of layers, and the additional solder resist layer formed later covers the entire surface of the additional solder resist layer formed earlier, so that the depth of the groove which has been deepened is further deepened.
Further, after the second solder resist oil layer is formed, the method further comprises the following steps:
forming one or more additional solder resist layers covering a portion of the surface of the second solder resist layer such that a portion of the recess that has been deepened is further deepened.
Further, the additional solder resist layer is a plurality of layers, and a later-formed additional solder resist layer covers a part of the surface of the previously-formed additional solder resist layer, so that the depth of a part of the groove which has been deepened is further deepened.
Further, in step S2, the method for forming the first solder resist layer is: firstly, coating solder mask oil on the surface of the printed circuit board; secondly, carrying out contraposition exposure to initially crosslink and solidify the solder resist oil; thirdly, developing to remove the solder mask oil in the pad area; finally, post-curing is performed to further crosslink and cure the solder resist.
Further, the thickness of the first solder resist layer in the direction perpendicular to the printed circuit board is greater than or equal to 0.1mm, so that the reliability of soldering is ensured.
Further, after step S3, a scraper is used to scrape off the excess solder paste to improve the quality of the solder flux.
Drawings
The invention is further described with reference to the following figures and embodiments.
Fig. 1 to 5 are schematic views illustrating a detailed process of a surface mounting method according to an embodiment of the present invention;
fig. 6 is a schematic flow chart of a surface mounting method according to a first embodiment of the present invention;
fig. 7 is a detailed process diagram of a surface mounting method according to a second embodiment of the present invention;
fig. 8 is a schematic flow chart of a surface mounting method according to a second embodiment of the present invention;
fig. 9 is a detailed process diagram of a surface mounting method according to a third embodiment of the present invention;
fig. 10 is a schematic flow chart of a surface mounting method according to a third embodiment of the present invention;
fig. 11 is a detailed process diagram of a surface mounting method according to a fourth embodiment of the present invention;
fig. 12 is a schematic flow chart of a surface mounting method according to a fourth embodiment of the present invention;
in the figure:
110. 210, 310, 410: a printed circuit board;
111. 211, 311, 411: a pad region;
112. 212, 312, 412: a non-pad area;
120. 220, 320, 420: a first solder resist oil layer;
130. 230, 330, 430: a groove;
221. 321, 421: a second solder resist oil layer;
422: adding a solder resist oil layer;
140. 240, 340, 440: tin paste;
150. 250, 350, 450: and (6) a component.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly and clearly apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
The technical solution of the present invention will be further specifically described below with reference to the accompanying drawings and embodiments.
Implementation mode one
Referring to fig. 1 to 6, a surface mounting method includes the following steps:
step S10: providing a printed circuit board 110, wherein the printed circuit board comprises a pad area 111 and a non-pad area 112;
step S20: forming a first solder resist layer 120 on the surface of the non-pad area 112, so that the upper surface of the pad area 111 is lower than the upper surface of the first solder resist layer 120, and the pad area 111 and the first solder resist layer 120 form a groove 130;
step S30: filling the recess 130 with solder paste 140;
step S40: mounting the component 150;
step S50: and welding and fixing the component 150.
In the surface mounting method, when the solder paste 140 is coated, the solder paste is directly coated on the surface of the first solder resist layer 120. A steel mesh is not used, so that the manufacturing cost and expense of the steel mesh are saved, and the process difficulty is reduced; meanwhile, the problem of solder paste coating rework caused by misalignment of the steel mesh and the pad area 111 is avoided.
Referring to fig. 1, in particular, the printed circuit board 110 is composed of an insulating substrate and a conductive layer. The material of the insulating substrate can be polymer resin or glass fiber reinforced material; the conductive layer is most commonly copper. In the present embodiment, the printed circuit board 1 is an epoxy resin copper clad circuit board (PCB), a Polyimide (PI) copper clad circuit board, or a polyethylene terephthalate (PET) copper clad circuit board, thereby reducing costs and obtaining excellent performance.
Referring to fig. 2, in step S2, the material of the first solder resist layer 120 is a water-soluble developing ink or an organic solvent developing ink. In this embodiment, the material of the first solder resist layer 120 is water-soluble developing ink, so that the process flow is more environment-friendly. In the present embodiment, the method for forming the first solder resist layer 2 includes: firstly, coating first solder resist oil on the surface of the printed circuit board 110; secondly, carrying out contraposition exposure to enable the first solder mask oil to be primarily crosslinked and cured; thirdly, developing to remove the first solder mask oil in the pad region 111; finally, post-curing is performed to further crosslink and cure the first solder resist layer, and finally a first solder resist layer 120 is formed. The thickness of the first solder resist layer 120 depends on the amount of solder paste 140 required, and the more solder paste 140 required, the thicker the thickness of the first solder resist layer 120. In the present embodiment, the thickness of the first solder resist layer 120 in the direction perpendicular to the printed circuit board 110 is greater than or equal to 0.1mm, so that the groove 130 is deep enough to retain enough solder paste 140 to ensure the quality of soldering.
Referring to fig. 3, specifically, when the solder paste 140 is directly coated on the surface of the first solder resist layer 120, the solder paste 140 may be redundant. In the present embodiment, the excessive solder paste 140 is scraped off by a squeegee to improve the reliability of soldering.
Referring to fig. 4, in particular, the component 150 may be mounted automatically by using a mounter or manually by using an auxiliary tool. In this embodiment, the components 150 in the tray or the woven bag are picked up by a robot using vacuum suction and then mounted on the designated positions of the pcb 110.
Referring to fig. 5, in detail, the method of soldering and fixing is reflow soldering or wave soldering, and the reflow soldering technology is mainly classified into gas-phase reflow soldering, infrared reflow soldering, hot-air furnace reflow soldering, hot-plate heating reflow soldering, laser reflow soldering, and the like according to the heating method. In the present embodiment, the component 150 is soldered and fixed by gas phase reflow soldering to improve soldering efficiency and soldering quality.
Second embodiment
Referring to fig. 7 and 8, the difference between the first embodiment and the second embodiment is that after step S20, the method further includes the following steps:
step S21: a second solder resist layer 221 is formed to cover the entire surface of the first solder resist layer 220 such that the depth of the entire groove 230 is deepened. In an actual process, when the depth of the groove 230 needs to be deeper due to the requirement of the size or height of the component, the groove may be deepened in the manner of step S21, and the solder paste is directly coated on the surface of the second solder resist layer 221. A steel mesh is not needed, so that the manufacturing cost and expense of the steel mesh are saved, and the process difficulty is reduced; meanwhile, the problem of solder paste coating rework caused by misalignment of the steel mesh and the pad region 211 is avoided.
Specifically, referring to fig. 7, in this embodiment, a method for forming the second solder resist layer 221 includes: firstly, coating a second solder resist oil on the surface of the first solder resist oil layer 220; secondly, carrying out contraposition exposure to enable the second solder mask oil to be primarily crosslinked and cured; thirdly, developing to remove the second solder resist oil in the pad region 211; and finally, carrying out post-curing to further crosslink and cure the second solder mask oil. The thickness of the second solder resist layer 221 depends on the amount of solder paste 240 required, and the greater the amount of solder paste 240 required, the greater the thickness of the second solder resist layer 221. In other embodiments of the invention, after step S21, the following steps may be further included: one or more additional solder resist layers are formed to cover the entire surface or a part of the surface of the second solder resist layer 221, and the additional solder resist layer formed later covers the entire surface or a part of the previously formed additional solder resist layer.
EXAMPLE III
Referring to fig. 9 and 10, the difference between the first embodiment and the second embodiment is that after step S20, the method further includes the following steps:
step S22: the second solder resist layer 321 is formed to cover a portion of the surface of the first solder resist layer 320 such that a depth of a portion of the groove 330 is further deepened. In practice, when a step recess is required, it can be completed by step S22, i.e. directly coating solder paste 340 on the surface of the second solder resist layer 321 and the surface of the first solder resist layer 320. In the process, a steel mesh is not used, so that the manufacturing cost and expense of the steel mesh are saved, and the process difficulty is reduced; meanwhile, the problem of reworking of the solder paste 340 caused by inaccurate alignment of the steel mesh and the pad region 311 is avoided
Specifically, referring to fig. 9, in this embodiment, a method for forming the second solder resist layer 321 includes: firstly, coating a second solder resist oil on the surface of the first solder resist oil layer 320; secondly, carrying out contraposition exposure to enable the second solder mask oil to be primarily crosslinked and cured; thirdly, developing to remove the second solder resist oil in the pad region 311; and finally, carrying out post-curing to further crosslink and cure the second solder mask oil. The thickness of the second solder resist layer 321 depends on the amount of solder paste 340 required, and the greater the amount of solder paste 340 required, the greater the thickness of the second solder resist layer 321. In other embodiments of the present invention, the following steps may be further included after step S22: one or more additional solder resist layers are formed to cover a part of the surface of the second solder resist layer 321, and the additional solder resist layer formed later covers the whole surface or a part of the surface of the previously formed additional solder resist layer.
Example four
Referring to fig. 10 and 11, the difference between the third embodiment and the fourth embodiment is that after step S22, the method further includes the following steps:
step S23: an additional solder resist layer 422 is formed to cover the entire surface of the second solder resist layer 421 so that the depth of the entire deepened recess 430 is further deepened. I.e., directly applying solder paste on the surface of the additional solder resist layer 422 and the surface of the first solder resist layer 420. In practice, the depth of the groove can be increased according to the requirement, and a steel mesh is not needed at all, so that the manufacturing cost and expense of the steel mesh are saved, and the process difficulty is reduced; meanwhile, the problem of reworking of the solder paste 440 caused by misalignment between the steel mesh and the pad area 411 is avoided.
Specifically, referring to fig. 10, in this embodiment, a method for forming the additional solder resist layer 422 includes: firstly, coating a third solder resist oil on the surface of the second solder resist oil layer 421; secondly, carrying out contraposition exposure to enable the third solder mask oil to be primarily crosslinked and cured; thirdly, developing to remove the third solder resist oil of the pad area 411; finally, post-curing is performed to further crosslink and cure the third solder resist oil. The thickness of the additional solder resist layer 422 depends on the amount of solder paste required, and the more solder paste required, the thicker the thickness of the additional solder resist layer 422. In other embodiments of the present invention, the following steps may be further included after step S23: one or more additional solder resist layers are continuously formed to cover the entire surface or a part of the surface of the additional solder resist layer 422, and the additional solder resist layer formed later covers the entire surface or a part of the surface of the previously formed additional solder resist layer.
The foregoing is merely illustrative and explanatory of the inventive concept and various modifications, additions or substitutions as are known to those skilled in the art may be made to the described embodiments without departing from the inventive concept or exceeding the scope as defined in the claims.
Claims (5)
1. A surface mounting method is characterized by comprising the following steps:
step S1: providing a printed circuit board, wherein the printed circuit board comprises a welding pad area and a non-welding pad area;
step S2: forming a first solder resist oil layer on the surface of the non-solder-pad area, so that the upper surface of the solder pad area is lower than the upper surface of the first solder resist oil layer, and the solder pad area and the first solder resist oil layer form a groove; the forming method of the first solder resist layer comprises the following steps: firstly, coating solder mask oil on the surface of the printed circuit board; secondly, carrying out contraposition exposure to initially crosslink and solidify the solder resist oil; thirdly, developing to remove the solder mask oil in the pad area; finally, post-curing is carried out to further crosslink and cure the solder resist oil; covering the whole surface of the first solder resist oil layer to form a second solder resist oil layer; the thickness of the first solder resist layer in a direction perpendicular to the printed circuit board is greater than or equal to 0.1 mm;
step S3: filling the groove with solder paste; scraping out the redundant solder paste by a scraper;
step S4: mounting components;
step S5: welding and fixing the components;
after step S2, the method further includes the following steps:
forming the second solder resist layer covering a part of the surface of the first solder resist layer;
the solder resist oil layer is made of water-soluble developing ink or organic solvent developing ink.
2. A surface mounting method according to claim 1, further comprising the following steps after forming the second solder resist layer:
and forming one or more additional solder resist layers covering the whole surface of the second solder resist layer.
3. A surface mounting method according to claim 2, wherein the additional solder resist layer is a plurality of layers, and the later-formed additional solder resist layer covers the entire surface of the earlier-formed additional solder resist layer.
4. A surface mounting method according to claim 1, further comprising the following steps after forming the second solder resist layer:
one or more additional solder resist layers are formed overlying a portion of the surface of the second solder resist layer.
5. A surface mounting method according to claim 4, wherein the additional solder resist layer is a plurality of layers, and the later-formed additional solder resist layer covers a part of the surface of the earlier-formed additional solder resist layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810865439.9A CN108811367B (en) | 2018-08-01 | 2018-08-01 | Surface mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810865439.9A CN108811367B (en) | 2018-08-01 | 2018-08-01 | Surface mounting method |
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| CN108811367A CN108811367A (en) | 2018-11-13 |
| CN108811367B true CN108811367B (en) | 2020-12-22 |
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Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5478700A (en) * | 1993-12-21 | 1995-12-26 | International Business Machines Corporation | Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head |
| TW536767B (en) * | 2002-03-01 | 2003-06-11 | Advanced Semiconductor Eng | Solder ball attaching process |
| TWI316381B (en) * | 2007-01-24 | 2009-10-21 | Phoenix Prec Technology Corp | Circuit board and fabrication method thereof |
| CN103813654B (en) * | 2012-11-12 | 2017-02-22 | 北大方正集团有限公司 | Plugging method for printed circuit board |
| CN104144563A (en) * | 2014-06-30 | 2014-11-12 | 广东美的集团芜湖制冷设备有限公司 | Bonding pad structure of SMT component, installation method and circuit board |
| CN206389606U (en) * | 2016-11-29 | 2017-08-08 | 惠州市蓝微新源技术有限公司 | A kind of pad copper foil structure of surface mount device |
| CN206977832U (en) * | 2017-07-25 | 2018-02-06 | 信利光电股份有限公司 | A kind of welding PCB of surface mount elements |
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Effective date of registration: 20201201 Address after: 518000 second floor, building 2, No. 117, Jingsheng Industrial Zone, Huafan Road, Dalang street, Longhua New District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Ketai Technology Co., Ltd Address before: 518000 Guangdong, Shenzhen, Luohu District, Dongmen street, 123 Shennan Road, Shenzhen, department store building, east side, 1-B02 Applicant before: SHENZHEN FULAIGUO TECHNOLOGY Co.,Ltd. |
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