CN113286455A - Method for improving short circuit of board generated by resin hole plugging unsatisfied in shallow back drilling - Google Patents
Method for improving short circuit of board generated by resin hole plugging unsatisfied in shallow back drilling Download PDFInfo
- Publication number
- CN113286455A CN113286455A CN202110534405.3A CN202110534405A CN113286455A CN 113286455 A CN113286455 A CN 113286455A CN 202110534405 A CN202110534405 A CN 202110534405A CN 113286455 A CN113286455 A CN 113286455A
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- Prior art keywords
- hole
- copper
- resin
- film
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 49
- 229920005989 resin Polymers 0.000 title claims abstract description 49
- 238000005553 drilling Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 68
- 229910052802 copper Inorganic materials 0.000 claims abstract description 65
- 239000010949 copper Substances 0.000 claims abstract description 65
- 238000007747 plating Methods 0.000 claims abstract description 19
- 238000005530 etching Methods 0.000 claims abstract description 14
- 238000007689 inspection Methods 0.000 claims abstract description 14
- 238000000151 deposition Methods 0.000 claims abstract description 13
- 238000005498 polishing Methods 0.000 claims abstract description 9
- 229910052737 gold Inorganic materials 0.000 claims abstract description 8
- 239000010931 gold Substances 0.000 claims abstract description 8
- 238000003384 imaging method Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000009713 electroplating Methods 0.000 claims description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 238000005234 chemical deposition Methods 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 230000002159 abnormal effect Effects 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 4
- 230000008719 thickening Effects 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 238000012795 verification Methods 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
A method for improving short circuit of a board generated by resin plug hole unsaturations of a shallow back drilling hole comprises the following steps: step 1, cutting, internal light imaging and pressing; step 2, drilling holes in resin; step 3, metalizing the wall of the through hole; step 4, plating a hole dry film and plating a hole film; step 5, plating holes; step 6, back drilling; step 7, plugging holes with resin; step 8, curing the resin, baking the plate at 150 ℃ for 2 hours, and normally switching the sequence; step 9, polishing resin; step 10, drilling; step 11, depositing copper and plating; step 12, external light imaging and external line film; step 13, plating the exposed copper circuit, the hole and the bonding pad to the copper thickness requirement required by the customer; step 14, etching the outer layer and removing the film firstly; step 15, AOI inspection; and step 16, chemically preparing nickel palladium gold. After multiple times of verification, the baking plate parameters are controlled at 150 ℃, the baking time is optimal for 10 minutes, the viscosity of resin ink after baking is controlled at about 200-250dpas, and the plumpness effect of secondary hole plugging is obviously improved.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a method for improving a board short circuit caused by resin plug hole unsaturation of a shallow back drilling hole.
Background
With the increase of high-density multilayer boards, the design of back drilling is increased, more back drilling holes appear in production, and the scrapping trend is rising due to poor resin hole plugging.
Disclosure of Invention
The invention provides a method for improving short circuit of a board generated by resin plug hole unsaturation of a shallow back drilling hole, which aims to solve at least one technical problem.
To solve the above problems, as an aspect of the present invention, there is provided a method for improving short circuit of a board generated by resin tap hole unsaturations in a shallow back drilled hole, comprising:
step 1, cutting, internally imaging, pressing and pressing a prepreg, an inner core plate and a copper foil into a multilayer board under the action of high-temperature pressure;
step 2, drilling holes by resin, wherein the holes are mainly drilled with conductive holes, the minimum aperture is 0.2mm, and holes needing resin plugging are formed;
step 3, depositing copper, plating a plate, metalizing the wall of the through hole by using a chemical deposition mode, thickening the hole copper and the surface copper by 5-8um by using a whole plate electroplating mode, and connecting the hole with the outer layer copper;
step 4, plating a hole dry film and a hole film, sticking a layer of photosensitive dry film on the copper plate after the plate is electrified, and selectively exposing and developing the hole film to form a hole-plated pattern;
step 5, plating holes, plating hole copper to 25-30um in an electroplating mode, removing a film, and removing a dry film of a plated hole pattern;
step 6, back drilling;
step 7, plugging holes with resin;
step 8, curing the resin, baking the plate at 150 ℃ for 2 hours, and normally switching the sequence;
step 9, polishing resin, measuring the expansion and shrinkage coefficient, normally polishing the resin on the board surface, and measuring the expansion and shrinkage coefficient after the board is polished;
step 10, drilling;
step 11, copper deposition and plate electroplating, wherein the hole wall of the through hole is metalized by using a chemical deposition mode, the hole copper and the surface copper are thickened by 5-8um by using a whole plate electroplating mode, and the hole is connected with the outer layer copper;
step 12, external light imaging, an external line film, attaching a layer of photosensitive dry film to the electrified copper plate, and selectively exposing and developing by using the external line film to form a circuit pattern;
step 13, electroplating the circuit, the hole and the pad with the exposed copper to meet the copper thickness requirement required by a customer by using an electroplating mode, and then tinning to protect the circuit, the hole and the pad by using tin so as to prevent the copper thickness from being abnormal after etching;
step 14, etching the outer layer, removing the film first, exposing all copper to be etched, etching all the exposed copper after film removal to form a circuit, removing tin, and removing tin with thick protective electroplated copper to form a circuit pattern required by a customer;
step 15, AOI inspection is carried out to check whether the problems of open short circuit, abnormal inspection of copper thickness, incomplete etching and the like exist;
step 16, chemical nickel palladium gold, and depositing a layer of effective nickel, palladium and gold layers on the surface and the side wall of the effective copper in a chemical deposition mode to protect the surface;
step 17, electrical testing, testing whether open circuit and short circuit problems exist;
step 18, milling a plate;
and 19, final inspection, inspection and shipment.
In the technical scheme, after multiple times of verification, the baking plate has the parameters controlled at 150 ℃, the baking time is optimal for 10 minutes, the viscosity of the resin ink after baking is controlled at about 200-250dpas, and the plumpness effect of secondary hole plugging is obviously improved.
Detailed Description
The following detailed description of embodiments of the invention, but the invention can be practiced in many different ways, as defined and covered by the claims.
The inventor researches the viscosity of resin hole plugging ink, the control of primary resin hole plugging baking time, the control of secondary resin hole plugging baking time and a grinding operation method, tests the fullness of back drilling hole plugging by a three-dimensional thickness measuring mode, further analyzes the relation between the back drilling hole depth and the plugging fullness, and sends out data analysis, particularly when the back drilling depth is only 0.1 +/-0.05 mm, the resin hole plugging is often not full, the generated covering copper on the resin hole is connected with hole copper, the short circuit scrap is the most serious, the short circuit scrap is often produced in batch production, and a new method needs to be found for improvement.
Therefore, the method for improving the short circuit caused by the unsaturated resin plug holes of the shallow back drilling hole comprises the following steps:
step 1, after a customer places an order, engineering screening shallow back drilling plate order classification;
step 2, production flow: cutting, internal polishing, pressing, resin-drilling, copper deposition, plate electroplating, hole dry film plating, hole plating, back drilling, resin hole plugging, resin curing, resin polishing, measuring a shrinkage coefficient, drilling, copper deposition, plate electroplating, external optical imaging, external etching, AOI inspection, nickel-palladium-gold, electrical testing, plate milling, final inspection, shipment and the like
Step 3, cutting, internal light imaging and pressing the prepreg, the inner core board and the copper foil into a multilayer board under the action of high-temperature pressure;
and 4, drilling holes by using resin, wherein the holes are mainly drilled with conductive holes, the minimum hole diameter is 0.2mm, and holes needing resin plugging are formed.
Step 5, depositing copper, plating a plate, metalizing the hole wall of the through hole by using a chemical deposition mode, and thickening the hole copper and the surface copper by 5-8um by using a whole plate electroplating mode; the hole is connected to the outer layer of copper.
Step 6, plating a hole dry film and a hole film, sticking a layer of photosensitive dry film on the copper plate after the plate is electrified, and selectively exposing and developing the hole film to form a hole-plated pattern;
and 7, plating holes, plating hole copper to 25-30um in an electroplating mode, removing the film, and removing the dry film of the plated hole pattern.
And 8, back drilling, namely, remarking in an ERP column of the back drilling process according to design requirements, wherein the back drilling information comprises the following steps: (Back drilling depth 0.1 +/-0.05 mm, drilling through L4 layers of copper sheets and not damaging L3 layers of circuits.)
Step 9, filling holes with resin, and filling the holes in an ERP column of a resin hole filling process according to design requirements, wherein back drilling information, such as: (one hole is filled normally, the 150 ℃ baking plate is used for 10 minutes, and one hole is filled in normal resin);
and step 10, curing the resin, baking the plate at 150 ℃ for 2 hours, and normally transferring the sequence.
Step 11, polishing resin, measuring the expansion and shrinkage coefficient, normally polishing the resin on the board surface, and measuring the expansion and shrinkage coefficient after the board is polished;
and step 12, drilling, namely mainly drilling component holes.
Step 13, depositing copper and electroplating a plate, metalizing the hole wall of the through hole in a chemical deposition mode, and thickening the hole copper and the surface copper by 5-8um in a whole plate electroplating mode; the hole is connected to the outer layer of copper.
Step 14, external light imaging, an external line film, attaching a layer of photosensitive dry film to the electrified copper plate, and selectively exposing and developing by using the external line film to form a circuit pattern;
and step 15, electroplating the circuits, the holes and the pads exposed with copper to meet the copper thickness requirement required by a customer by using an electroplating mode, and then tinning to protect the circuits, the holes and the pads by using tin so as to prevent abnormal copper thickness after etching.
And step 16, etching the outer layer, removing the film first, exposing all the copper to be etched, etching all the exposed copper after the film is removed to form a circuit, removing tin, and removing the tin with the thick protective electroplated copper to form a circuit pattern required by a customer.
And step 17, AOI inspection, wherein whether the problems of open short circuit, abnormal copper thickness inspection, incomplete etching and the like exist is checked.
And step 18, chemically depositing nickel-palladium-gold, and depositing an effective nickel layer, a palladium layer and a gold layer on the surface and the side wall of the effective copper layer in a chemical deposition mode to protect the surface for the use of components on customers.
And 19, electrically testing whether the open circuit and the short circuit are problems or not.
And 20, milling the plate into the size required by a customer.
And step 21, final inspection and shipment.
The resin ink is generally stored at 25 ℃, the higher the temperature is, the lower the viscosity of the ink is, the lower the temperature is, the higher the viscosity of the ink is, the viscosity of the resin ink is 450-plus-500 dpas at normal temperature, the time control of baking the plate is important, the time for baking the plate is long during secondary hole plugging, the bonding force between the first hole plugging ink and the second hole plugging ink is poor, the time for baking the plate is short, the resin ink does not form a solidified state, the resin ink is scraped away by the secondary hole plugging, the resin ink cannot be solidified in a back drilling hole, and the problem of insufficient hole plugging is caused.
In the technical scheme, after multiple times of verification, the baking plate has the parameters controlled at 150 ℃, the baking time is optimal for 10 minutes, the viscosity of the resin ink after baking is controlled at about 200-250dpas, and the plumpness effect of secondary hole plugging is obviously improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (1)
1. A method for improving short circuit of a board generated by resin hole plugging of a shallow back drilling hole is characterized by comprising the following steps:
step 1, cutting, internally imaging, pressing and pressing a prepreg, an inner core plate and a copper foil into a multilayer board under the action of high-temperature pressure;
step 2, drilling holes by resin, wherein the holes are mainly drilled with conductive holes, the minimum aperture is 0.2mm, and holes needing resin plugging are formed;
step 3, depositing copper, plating a plate, metalizing the wall of the through hole by using a chemical deposition mode, thickening the hole copper and the surface copper by 5-8um by using a whole plate electroplating mode, and connecting the hole with the outer layer copper;
step 4, plating a hole dry film and a hole film, sticking a layer of photosensitive dry film on the copper plate after the plate is electrified, and selectively exposing and developing the hole film to form a hole-plated pattern;
step 5, plating holes, plating hole copper to 25-30um in an electroplating mode, removing a film, and removing a dry film of a plated hole pattern;
step 6, back drilling;
step 7, plugging holes with resin;
step 8, curing the resin, baking the plate at 150 ℃ for 2 hours, and normally switching the sequence;
step 9, polishing resin, measuring the expansion and shrinkage coefficient, normally polishing the resin on the board surface, and measuring the expansion and shrinkage coefficient after the board is polished;
step 10, drilling;
step 11, copper deposition and plate electroplating, wherein the hole wall of the through hole is metalized by using a chemical deposition mode, the hole copper and the surface copper are thickened by 5-8um by using a whole plate electroplating mode, and the hole is connected with the outer layer copper;
step 12, external light imaging, an external line film, attaching a layer of photosensitive dry film to the electrified copper plate, and selectively exposing and developing by using the external line film to form a circuit pattern;
step 13, electroplating the circuit, the hole and the pad with the exposed copper to meet the copper thickness requirement required by a customer by using an electroplating mode, and then tinning to protect the circuit, the hole and the pad by using tin so as to prevent the copper thickness from being abnormal after etching;
step 14, etching the outer layer, removing the film first, exposing all copper to be etched, etching all the exposed copper after film removal to form a circuit, removing tin, and removing tin with thick protective electroplated copper to form a circuit pattern required by a customer;
step 15, AOI inspection is carried out to check whether the problems of open short circuit, abnormal inspection of copper thickness, incomplete etching and the like exist;
step 16, chemical nickel palladium gold, and depositing a layer of effective nickel, palladium and gold layers on the surface and the side wall of the effective copper in a chemical deposition mode to protect the surface;
step 17, electrical testing, testing whether open circuit and short circuit problems exist;
step 18, milling a plate;
and 19, final inspection, inspection and shipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110534405.3A CN113286455A (en) | 2021-05-17 | 2021-05-17 | Method for improving short circuit of board generated by resin hole plugging unsatisfied in shallow back drilling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110534405.3A CN113286455A (en) | 2021-05-17 | 2021-05-17 | Method for improving short circuit of board generated by resin hole plugging unsatisfied in shallow back drilling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113286455A true CN113286455A (en) | 2021-08-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110534405.3A Pending CN113286455A (en) | 2021-05-17 | 2021-05-17 | Method for improving short circuit of board generated by resin hole plugging unsatisfied in shallow back drilling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113286455A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905521A (en) * | 2021-09-17 | 2022-01-07 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with two different hole copper thicknesses |
| CN114302561B (en) * | 2021-12-08 | 2024-02-02 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board with ultralow copper residue and semi-through holes |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5160579A (en) * | 1991-06-05 | 1992-11-03 | Macdermid, Incorporated | Process for manufacturing printed circuit employing selective provision of solderable coating |
| CN110831336A (en) * | 2019-11-11 | 2020-02-21 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN111405761A (en) * | 2020-03-13 | 2020-07-10 | 大连崇达电路有限公司 | Method for manufacturing resin hole plugging plate |
| CN111970857A (en) * | 2020-07-14 | 2020-11-20 | 江门崇达电路技术有限公司 | Method for improving poor hole plugging of PCB resin |
| CN112423476A (en) * | 2020-10-26 | 2021-02-26 | 深圳崇达多层线路板有限公司 | Method for improving poor hole plugging of PCB resin |
-
2021
- 2021-05-17 CN CN202110534405.3A patent/CN113286455A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5160579A (en) * | 1991-06-05 | 1992-11-03 | Macdermid, Incorporated | Process for manufacturing printed circuit employing selective provision of solderable coating |
| CN110831336A (en) * | 2019-11-11 | 2020-02-21 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN111405761A (en) * | 2020-03-13 | 2020-07-10 | 大连崇达电路有限公司 | Method for manufacturing resin hole plugging plate |
| CN111970857A (en) * | 2020-07-14 | 2020-11-20 | 江门崇达电路技术有限公司 | Method for improving poor hole plugging of PCB resin |
| CN112423476A (en) * | 2020-10-26 | 2021-02-26 | 深圳崇达多层线路板有限公司 | Method for improving poor hole plugging of PCB resin |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905521A (en) * | 2021-09-17 | 2022-01-07 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with two different hole copper thicknesses |
| CN114302561B (en) * | 2021-12-08 | 2024-02-02 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board with ultralow copper residue and semi-through holes |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20210820 |