JP2016127136A - Led-mounted module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the optical property of an LED-mounted module having a reflective material and the productivity thereof.SOLUTION: In an LED-mounted module 10, a reflective material 15 is a monolayer resin film arranged by molding a reflective material composition including a polyethylene-based resin of 0.870-0.940 g/cmin density as a base resin, and a white pigment, or a multilayer resin film including, as an outermost layer, a contact-reinforcement layer arranged by molding the reflective material composition. The reflective material has through-holes 151 for LED device mount, the maximum of the width of a gap part formed between an inner peripheral side face of each through-hole 151 for LED device mount, and an outer peripheral side face of an LED device 16 disposed in each through-hole 151 for LED device mount is 1 mm or smaller.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an LED mounting module and a manufacturing method thereof.

  In recent years, as an alternative to conventional cathode ray tube type monitors, it is possible to meet the demands for lower power consumption, larger and thinner devices, and LEDs such as liquid crystal televisions and liquid crystal displays that use LED elements as backlight sources. The spread of display devices is progressing rapidly.

  In order to mount an LED element as a light source in these display devices, various types of LED element substrates each including a support substrate and a wiring portion are usually used. A laminate in which LED elements are mounted on these substrates (in this specification, a laminate having such a configuration is referred to as an “LED mounting module”) is used for various display devices such as the above-described liquid crystal televisions. Widely used as a light source.

  These display devices are required to improve the luminance of the light source in order to improve the image quality. Therefore, in general, when the LED mounting module is used as a backlight of a liquid crystal screen or the like, light emitted from the LED element is reflected from the side or back side of the light emitted from the LED element and is emitted from the LED element. In order to use the LED more efficiently, various reflectors are installed around the LED element mounted on the module.

  As a general aspect of the reflective material in the LED mounting module, the white resist layer formed on the substrate by printing has a certain thickness so that the reflectance is improved and the function as the reflective material is exhibited. Is known (see Patent Document 1).

  Here, in order to use the light emitted from the LED element more efficiently, the gap between the reflective material surrounding the LED element and the element, and particularly the height of the reflective material around the element ( (Thickness) and the like are required to be precisely controlled in units of mm. For example, when the gap width is required to be 0.1 mm, the above-described printing method can precisely control the height of the reflector while controlling the height of the reflector. It was extremely difficult to control the gap width.

JP 2012-124358 A

  The present invention has been made in view of the circumstances as described above, and includes an LED having a reflective material having an excellent light reflecting function for improving the utilization efficiency of light emitted from the LED element, and having excellent productivity. An object is to provide a mounting module.

  As a result of intensive research, the present inventors have adopted a so-called flexible substrate type wiring film in which a metal wiring portion is formed on a flexible substrate film, and further, an adhesive having a composition unique to the present application. It has an excellent light reflection function by attaching a LED material mounting through hole formed on a reflective material made of a white resin film having excellent properties to the substrate by thermocompression bonding. The present inventors have found that an LED mounting module with higher productivity can be provided, and have completed the present invention. Specifically, the present invention provides the following.

(1) An LED mounting module in which an LED element is mounted on an LED element substrate, wherein the LED element substrate includes a substrate film made of a thermoplastic resin and a metal wiring portion formed on the substrate film. And a reflective material laminated on the substrate film and the metal wiring part so as to cover a region excluding the LED element mounting region, and the reflective material has a density of 0.870 g / cm ³ or more and 0.940 g. / Cm ³ or less polyethylene-based resin as a base resin, a single-layer resin film molded from a reflector composition containing a white pigment, or an adhesion reinforcing layer molded from the reflector composition as an outermost layer A multi-layer resin film, wherein the reflector has a plurality of LED element mounting through holes, and the LED element mounting through holes and the LED elements LED mounting module maximum width of the gap portion formed between the outer peripheral side surface of the LED elements arranged worn through bore is 1mm or less.

  (2) The LED mounting module according to (1), wherein a width of the gap portion is in a range of 0.01 mm to 0.1 mm.

  (3) The LED mounting module according to (1) or (2), wherein the reflector is made of a single resin film having a thickness of 100 μm to 250 μm.

  (4) The reflective material composition according to any one of (1) to (3), further including a copolymer obtained by copolymerizing an α-olefin and an ethylenically unsaturated silane compound as a comonomer. LED mounting module.

  (5) The LED mounting module according to any one of (1) to (4), wherein a melting point of the base resin of the reflective material composition is 50 ° C. or higher and 100 ° C. or lower.

  (6) The reflective material is a multi-layered resin film composed of a plurality of resin layers whose base resins are resin compositions having different melting points, and a resin having a higher melting point than the base resin of the adhesion reinforcing layer. The LED mounting module according to any one of (1) to (5), wherein a layer serving as a base resin is disposed as an intermediate layer.

  (7) An LED display device using the LED mounting module according to any one of (1) to (6) as a backlight light source.

  (8) A method for producing an LED mounting module according to any one of (1) to (6), wherein a non-crosslinked single layer or multilayer resin film is subjected to a crosslinking treatment by irradiation with ionizing radiation. A reflective material manufacturing step for manufacturing the reflective material, a reflective material laminating step for closely attaching the reflective material to the substrate film and the metal wiring portion by a thermocompression treatment, and a solder for mounting the LED element on the metal wiring portion by a soldering process. A method of manufacturing an LED mounting module, wherein the thermocompression bonding process in the reflective material laminating process is performed by heating the reflective material with heat applied to heat the solder in the solder processing process. .

  ADVANTAGE OF THE INVENTION According to this invention, the LED mounting module which is provided with the reflecting material which has the outstanding light reflection function which raises the utilization efficiency of the light emitted from an LED element, and is excellent also in productivity can be provided.

It is a top view which shows typically an example of the LED mounting module of this invention. FIG. 2 is a diagram for explaining an LED element mounting mode in the LED element mounting module of the present invention in a state in which the reflecting material in FIG. 1 is removed. FIG. 2 is an enlarged cross-sectional view schematically showing a cross section of the AA portion of FIG. 1, and is a drawing for explaining a mounting mode of LED elements in the LED mounting module of the present invention. It is the top view which looked at FIG. 4 from the upper surface side, and is drawing with which it uses for description of the mounting aspect of the LED element in the LED mounting module of this invention. It is a perspective view which shows typically the outline of the layer structure of the LED display apparatus which uses the LED mounting module of this invention.

  Hereinafter, each embodiment of the LED mounting module and the LED display device of the present invention will be described. The present invention is not limited to the following embodiments, and can be implemented with appropriate modifications within the scope of the object of the present invention.

<LED mounting module>
The LED mounting module 10 of the present invention shown in FIGS. 1 to 4 has a material composition unique to the present invention, and particularly has good adhesion to the metal wiring part 13 and good reflection performance with respect to light in the visible light range. The LED element 16 is mounted on the LED element substrate 1 including the reflective material 15. The LED mounting module 10 can be preferably used as a light source for LED display devices and other various large-sized LED element-mounted electronic devices.

  As shown in FIG. 3, the LED mounting module 10 includes the LED element mounting through holes 151 and the LED element mounting in a state where the LED elements 16 are mounted in the “LED element mounting region” of the LED element substrate 1. The maximum value of the width W of the gap portion 152, which is a gap between the outer peripheral side surfaces of the LED elements 16 disposed in the through-hole 151 for use, is 1 mm or less, preferably 0.01 mm or more and 0.1 mm or less. Further, the variation in the value of W is preferably such that the ratio of the minimum value to the maximum value of W (minimum value Wmin / maximum value Wmax) is 0.9 or more, and more preferably 0.99 or more. The “LED element mounting area” is an area formed by joining the LED element 16 to the metal wiring part 13 and its peripheral part on the LED element substrate 1. The LED element 16 is installed and the LED element 16 emits light. This is the area directly below the space required to secure the optical path necessary for taking out the light to be transmitted to the outside. In FIG. 1 and FIG. 3, the reflective material 15 is arranged so that the position of the LED element mounting through hole 151 of the reflective material 15 becomes the LED element mounting region in the LED mounting module 10.

  When the maximum value of the width W of the gap portion 152 exceeds 1 mm, a region where the reflecting material 15 does not exist in the peripheral portion of the LED element 16 becomes relatively large, thereby reducing the reflection performance of the reflecting material 15 as a whole. By setting the maximum value of the width W of the gap portion 152 to 1 mm or less, the luminance of the LED display device can be improved by effectively using the light emitted from the LED element 16. Further, the width W is more preferably 0.1 mm or less. From the viewpoint of improving the luminance, the width W is preferably as small as possible if it is up to about 0.01 mm. However, when the width W becomes 0, it is difficult to align the reflector 15 when it is laminated, and there is a risk that the heat generated from the LED element 16 after mounting causes damage such as partial melting of the reflector. Even if the width W is reduced, it is preferable to leave a non-zero fine gap.

[Substrate for LED element]
Next, details of the LED element substrate 1 that enables the gap portion 152 of the above aspect to be formed in the LED mounting module 10 will be described. The LED element substrate 1, which is a flexible wiring board on which the LED elements 16 are mounted, has a conductive metal wiring portion made of a metal foil or the like on the surface of a substrate film 11 made of a thermoplastic resin, as shown in FIGS. 13 is formed through the adhesive layer 12. And as shown in FIG. 3, the reflecting material 15 is laminated | stacked so that the area | region except the "LED element mounting area | region" on the board | substrate film 11 and the metal wiring part 13 may be covered. Specifically, the reflecting material 15 may be laminated on the substrate film 11 via the adhesive layer 12 on the surface of the substrate film 11. This adhesive layer 12 is usually left on the substrate film 11 after the metal wiring portion 13 is etched.

  In the LED element substrate 1, the material of the reflective material 15 is limited to a thermoplastic resin material that can be easily punched and can be firmly adhered to the metal wiring portion 13 by thermocompression treatment. Is. As a result, the LED element mounting through-hole 151 can be formed in the reflecting material 15 at a desired position and size with high accuracy with an accuracy of several tens of μm. Then, alignment and adhesion forming operations on the flexible substrate film 11 and the metal wiring portion 13 can be performed by a thermocompression bonding process such as a thermal lamination process that can be continuously performed on a normal production line. In the LED element substrate 1, the reflective material 15 having the LED element mounting through-holes 151 is disposed with high accuracy so as to surround the LED element mounting area, thereby improving the brightness of the LED mounting module 10. It can greatly contribute to.

  In addition, the board | substrate for LED elements of this invention may laminate | stack the insulating protective film which consists of thermosetting ink etc. further on the board | substrate film 11 as needed. For example, when there is a range in which the reflective material 15 does not exist in the peripheral part of the LED element mounting region, etc., by injecting and laminating an insulating protective film made of thermosetting ink or the like around the range and its periphery. Migration resistance characteristics of the LED element substrate 1 can be improved. However, the insulating function required for the LED element substrate can be ensured only by the reflective material 15 without stacking them.

  As shown in FIG. 3, the LED element substrate 1 becomes an LED mounting module 10 when the LED element 16 is mounted on the metal wiring portion 13 through the solder layer 14 in a conductive manner.

(Substrate film)
The substrate film 11 can be formed using a flexible thermoplastic resin formed into a film shape.

  The thermoplastic resin used as the material for the substrate film 11 is required to have high heat resistance and insulation. As such a resin, polyimide resin (PI) or polyethylene naphthalate (PEN) which is excellent in heat resistance, dimensional stability during heating, mechanical strength, and durability can be used. Among these, polyethylene naphthalate (PEN) that has been improved in heat resistance and dimensional stability by performing heat resistance improvement treatment such as annealing treatment can be preferably used. In addition, polyethylene terephthalate (PET) whose flame retardancy is improved by the addition of a flame retardant inorganic filler or the like can also be selected as a material resin for the substrate film.

  As the thermoplastic resin for forming the substrate film 11, a resin having a thermal shrinkage start temperature of 100 ° C. or higher, or a material having improved heat resistance so that the temperature becomes 100 ° C. or higher by the above-described annealing treatment or the like is used. It is preferable. Usually, the peripheral portion of the element reaches a temperature of about 90 ° C. due to heat generated from the LED element. From this viewpoint, it is preferable that the thermoplastic resin forming the substrate film has heat resistance equal to or higher than the above temperature.

  In this specification, “thermal shrinkage start temperature” means that a sample film made of a thermoplastic resin to be measured is set in a TMA apparatus, a load of 1 g is applied, and the temperature is increased to 120 ° C. at a rate of temperature increase of 2 ° C./min. Measure the amount of shrinkage (in%) at that time, output this data and record the temperature and amount of shrinkage, read the temperature that deviates from the 0% baseline due to shrinkage, and heat shrink the temperature This is the starting temperature. In addition, the “thermosetting temperature” in the present specification is the measurement and calculation of the temperature at the rising position of the thermosetting reaction when the thermosetting resin to be measured is heated, and that temperature is the thermosetting temperature. .

In addition, the substrate film 11 is required to be an insulating resin that can provide the insulating properties required for the LED element substrate 1 when the LED display device is integrated as a backlight or the like. In general, the substrate film 11 has a volume resistivity of preferably 10 ¹⁴ Ω · cm or more, and more preferably 10 ¹⁸ Ω · cm or more.

  The thickness of the substrate film 11 is not particularly limited, but is preferably approximately 10 μm or more and 100 μm or less from the viewpoint of heat resistance and insulating properties and a balance between manufacturing costs. Also, the thickness is preferably within the above-mentioned thickness range from the viewpoint of maintaining good productivity when manufacturing by the roll-to-roll method.

(Adhesive layer)
The formation of the metal wiring portion 13 on the surface of the LED element substrate 1 is preferably performed by a dry laminating method with the adhesive layer 12 interposed. As the adhesive forming the adhesive layer 12, a known resin adhesive can be used as appropriate. Of these resin adhesives, urethane-based, polycarbonate-based, or epoxy-based adhesives can be particularly preferably used.

(Metal wiring part)
As shown in FIGS. 2 and 3, the metal wiring portion 13 is a wiring pattern formed on one surface of the LED element substrate 1 by a conductive base material such as a metal foil.

  The arrangement of the metal wiring part 13 is not limited to a specific arrangement as long as the LED element can be mounted. However, in the LED element substrate 1, at least 80% or more, preferably 90%, more preferably 95% or more of one surface of the substrate film 11 is covered with the metal wiring portion 13. preferable. Thereby, it can contribute to the improvement of the heat dissipation calculated | required in the LED display apparatus which uses the board | substrate 1 for LED elements for a metal wiring part.

  The metal thermal conductivity λ constituting the metal wiring part 13 is preferably 200 W / (m · K) or more and 500 W / (m · K) or less, and preferably 300 W / (m · K) or more and 500 W / (m · K) or less. More preferred. The electric resistivity R of the metal constituting the metal wiring part 13 is preferably 3.00 × 10 −8 Ωm or less, and more preferably 2.50 × 10 −8 Ωm or less. Here, the measurement of the thermal conductivity λ can use, for example, a thermal conductivity meter QTM-500 manufactured by Kyoto Electronics Industry Co., Ltd., and the measurement of the electrical resistivity R can be performed, for example, a 6517B type electrometer manufactured by Keithley. Can be used. According to this, for example, in the case of copper, the thermal conductivity λ is 403 W / (m · K), and the electrical resistivity R is 1.55 × 10 −8 Ωm. Thereby, both heat dissipation and electrical conductivity can be achieved. More specifically, since the heat dissipation from the LED element is stabilized and an increase in electrical resistance can be prevented, the variation in light emission between the LEDs is reduced, and the LED can stably emit light, and the LED life is also extended. . Further, since deterioration of peripheral members such as the substrate due to heat can be prevented, the product life of the image display device itself in which the LED element substrate is incorporated as a backlight can be extended.

  The surface resistance value of the metal wiring portion 13 is preferably 500Ω / □ or less, more preferably 300Ω / □ or less, further preferably 100Ω / □ or less, and particularly preferably 50Ω / □ or less. The lower limit is about 0.005Ω / □.

  Examples of the metal include metal foils such as aluminum, gold, silver, and copper. The thickness of the metal wiring part 13 should just be set suitably according to the magnitude | size of the electric current resistance requested | required of the board | substrate 1 for LED elements, etc., Although it does not specifically limit, 10 micrometers-50 micrometers in thickness are mentioned as an example. From the viewpoint of improving heat dissipation, the thickness of the metal wiring portion 13 is preferably 10 μm or more. Further, if the metal layer thickness is less than the lower limit value, the influence of thermal shrinkage of the substrate film 11 is large, and the warp after the treatment is likely to increase during the solder reflow process. Is preferably 10 μm or more. On the other hand, when the thickness is 50 μm or less, sufficient flexibility of the LED element substrate can be maintained, and a decrease in handling property due to an increase in weight can be prevented.

(Solder layer)
In the LED element substrate 1, the metal wiring portion 13 and the LED element 16 are joined through the solder layer 14. Details of the soldering method will be described later, but can be roughly classified into either a reflow method or a laser method.

(Reflective material)
The reflecting material 15 is a single-layer or multilayer resin film using a reflecting material composition having a composition unique to the present application. The reflective material composition is a copolymer (copolymer) obtained by copolymerizing an α-olefin and an ethylenically unsaturated silane compound, which will be described in detail later, as a comonomer, using a polyethylene resin in a predetermined melting point and density range as a base resin. Hereinafter, it is also referred to as “silane-modified polyethylene resin”) and a white pigment such as titanium oxide. The LED element substrate 1 is obtained by thermocompression-bonding a reflective material 15 made of a resin film using the reflective material composition onto the substrate film 11 and the metal wiring portion 13 without using a physical fixing means such as screwing. It is a laminated body constituted by being firmly adhered by a method such as treatment. As a specific example, the tight adhesion means that peeling does not occur between the metal wiring portion 13 and the reflective material 15 even after being stored for a long time in a manner such as being wound in a roll shape in the course of distribution. It refers to the strength of adhesion. In addition, since the resin can be thermocompression-bonded due to the metal adhesion, it is not necessary to cover the reflector with the LED element placement position after mounting the LED element, which contributes to the improvement of productivity. Can do.

  The reflective material 15 is composed of a single layer film formed from the above-described reflective material composition, or the film molded from the above-mentioned reflective material composition is used as an adhesion reinforcing layer, and the outermost layer thereof is used. It consists of an arranged multilayer film. In this specification, a multilayer film is a film having a multilayer structure of two or more layers comprising at least one outermost layer laminated on the outermost surface side and an intermediate layer which is a layer other than the outermost layer. Say that. The intermediate layer refers to a layer other than the outermost layer, and may have a single layer structure, or the intermediate layer itself may have a multilayer structure including a plurality of layers.

  Regardless of the layer structure, the reflective material 15 preferably has a total thickness of 100 μm to 250 μm, and more preferably 125 μm to 225 μm. When the total thickness of the reflecting material 15 is less than 100 μm, the workability at the time of integration as an LED mounting module is lowered due to excessive stretchability and flexibility of the resin film. On the other hand, when the thickness is 250 μm or less, sufficient flexibility of the LED element substrate can be maintained, and a decrease in handling property due to an increase in weight can be prevented. For example, when the reflector 15 has a three-layer structure of outermost layer-intermediate layer-outermost layer, the thickness ratio of each layer is preferably 1: 1: 1 to 1: 30: 1. 1: 3: 1 to 1: 15: 1 are more preferable.

  The reflective member 15 is formed with LED element mounting through-holes 151 that are penetrating terms that serve as LED element mounting regions in the LED mounting module 10 at a required position and size with high accuracy of several tens of μm. .

  Regardless of the layer structure, the reflective material 15 is provided with sufficient flexibility by a highly adhesive film layer formed by the reflective material composition, and molding characteristics during the integration process as the LED element substrate 1 Substrate adhesion, particularly metal adhesion, can be significantly improved.

  In addition, when the reflecting material 15 consists of a multilayer film, it is preferable that melting | fusing point of an intermediate | middle layer is higher than outermost layer. By setting the intermediate layer to a melting point higher than that of the outermost layer, sufficient heat resistance can be imparted to the reflecting material 15 while maintaining preferable adhesion on the outermost layer side of the reflecting material 15.

  In addition, it is preferable that the reflecting material 15 is subjected to a crosslinking treatment so that a gel fraction after the crosslinking treatment is 1% to 85%, preferably 5% to 70%. Although the details of the crosslinking treatment will be described later, when the gel fraction is less than 1%, the effect of suppressing the flow by the crosslinking process is not exhibited at the time of thermocompression bonding to the metal wiring part, and the reflective material composition flows excessively. However, it becomes difficult to keep the film thickness constant. On the other hand, if the gel fraction exceeds 85%, the fluidity of the reflective material composition becomes too low, and the molding characteristics to follow the irregularities such as the metal wiring portion become insufficient. That is, by optimizing the cross-linking treatment conditions in the manufacturing process so that the gel fraction of the reflective material is in the above range, while suppressing excessive flow of the reflective material composition, molding characteristics with respect to irregularities such as metal wiring parts Can be maintained well. Here, the gel fraction (%) means that 0.1 g of the reflective material is put in a resin mesh, extracted with 60 ° C. toluene for 4 hours, taken out together with the resin mesh, weighed after drying treatment, and mass comparison before and after extraction. And the mass% of the residual insoluble matter was measured and used as the gel fraction. In addition, about the gel fraction of the reflecting material which is a multilayer film, the said process was performed in the multilayer state with which all the layers were laminated | stacked, and the obtained measured value was made into the gel fraction of the said multilayer film.

  Moreover, it is preferable that the reflection material 15 has a linear expansion coefficient of less than 1.0 × E−4 / ° C. in a temperature range equal to or higher than the melting point. Since the substrate 1 for LED elements becomes high temperature in the process of bonding the reflecting material 15 and the reflow process, the reflecting material 15 tends to shrink by heat. The curling deformation of the LED element substrate 1 due to the contraction force adversely affects the adhesion of the reflector 15 and the LED element substrate 1 to the metal wiring portion 13 and the like. In the LED element substrate 1, the curl deformation of the LED element substrate 1 at the time of the above process can be suppressed by setting the linear expansion coefficient of the reflector 15 in the above range.

(Reflective material composition)
The details of the reflective material composition, which is a resin composition used to mold the reflective material 15 constituting the LED element substrate 1 of the present invention, will be described. The reflector composition is a resin composition that can be obtained by blending a base resin made of low-density polyethylene or the like and a white pigment made of titanium oxide or the like with a predetermined content. However, the preferable content of the white pigment in the reflective material composition has a correlation with the total thickness of the reflective material 15, and details of the aspect of the white pigment content in the reflective material composition that is approximately inversely proportional to this will be described later. . The reflecting material 15 is formed by using this reflecting material composition, a single layer reflecting material or an adhesion reinforcing layer disposed in the outermost layer of a multilayer reflecting material.

  In addition, the resin composition which forms the intermediate layer in the case where the reflective material 15 is a multilayer has the optimum heat resistance of the reflective material 15 by selecting a resin having a different melting point and density from the above reflective material composition. Can be For example, a composition for a reflector intermediate layer having a high melting point, high-density polyethylene-based resin or other thermoplastic resin as a base resin is used separately from a reflector composition that relatively forms an adhesion reinforcing layer. Thus, the heat resistance of the reflective material can be adjusted to a necessary and sufficient height. In addition, as a method of ensuring the heat resistance of the reflective material in the intermediate layer, in addition to the proper use of the composition for each layer, for example, by a method of inclining after the progress of crosslinking for each layer by setting conditions during the crosslinking treatment You can also.

The polyethylene resin used as the base resin of the reflector material composition, density 0.870 g / cm ³ or more 0.940 g / cm ³ or less, preferably, 0.870 or more 0.930 g / cm ³ or less of the polyethylene resin Use. The density of the base resin of the reflector composition is preferably the same as the base resin of the intermediate layer composition, or is lower than the density of the base resin of the intermediate layer composition.

  Here, the melting point of the polyethylene resin used as the base resin of the reflector composition is 50 ° C. or higher and 100 ° C. or lower, preferably 50 ° C. or higher and 80 ° C. or lower. When the melting point of the polyethylene resin used as the base resin is less than 50 ° C., the heat resistance against heat generated from the LED element 16 is insufficient, and when it exceeds 100 ° C., the adhesion to the metal wiring portion 13 and the like is insufficient. As will be described later, by setting the melting point of the base resin of the reflective material composition within the above range, the reflective material 15 is heated by the heat applied during the soldering process for mounting the LED element 16 on the metal wiring portion 13. It is possible to select a manufacturing method for fusing the metal wiring part 13 and the like. Thereby, the productivity of the LED mounting module 10 can be further improved.

  In addition, as the polyethylene resin used as the base resin of the reflector composition, low density polyethylene (LDPE), linear low density polyethylene (LLDPE), or metallocene linear low density polyethylene (M-LLDPE) is preferably used as appropriate. Can do. Among these, M-LLDPE, which is synthesized using a metallocene catalyst that is a single-site catalyst, has few side chain branches and a uniform comonomer distribution, and therefore has a narrow molecular weight distribution, as detailed below. It is easy to make the density very low, and preferable flexibility can be imparted to the outermost layer of the reflector. As a result, the adhesion between the LED element substrate and the other member laminated with the reflective material can be enhanced.

  In addition, the polyethylene resin used as the base resin of the reflector composition is an MFR value measured at 190 ° C. and a load of 2.16 kg measured according to JIS7210 (“MFR” in this specification) from the viewpoint of maintaining good film forming properties. "Means this value.) Is preferably in the range of 0.5 g / 10 min to 30.0 g / 10 min and more preferably 1.0 g / 10 min to 15.0 g / 10 min. More preferred.

  The content of the base resin contained in the reflector composition is preferably 10 parts by mass or more and 99 parts by mass or less, more preferably 50 parts by mass or more and 99 parts by mass with respect to 100 parts by mass in total of all resin components in the composition. It is not more than part by mass, more preferably not less than 90 parts by mass and not more than 99 parts by mass. Other resins may be contained within the above composition range. In the present specification, the term “all resin components” includes the other resins described above.

  The reflective material composition can appropriately contain a silane-modified polyethylene resin. However, in order to efficiently improve the adhesion between the reflective material and the other member, it is particularly preferable to add the same resin to the outermost layer that is an adhesion surface with the other member. The silane-modified polyethylene resin is obtained by graft-polymerizing an ethylenically unsaturated silane compound as a side chain to linear low-density polyethylene (LLDPE) or the like as a main chain. Such a graft copolymer has a high degree of freedom of silanol groups that contribute to adhesion. As for the content of the silane-modified polyethylene resin, the content of the ethylenically unsaturated silane compound grafted on the resin in the reflector composition is 0. 0 parts by mass relative to 100 parts by mass of the total resin components of the composition. It is preferable to adjust appropriately so as to be 1 part by mass or more and 2.0 parts by mass or less, more preferably 0.2 part by mass or more and 1.5 parts by mass or less. Thereby, the adhesiveness to the other member of a reflecting material can be improved.

  The silane-modified polyethylene resin can be produced, for example, by the method described in JP-A-2003-46105. By using the resin as a component of a reflector composition for a substrate for LED elements, strength and durability can be improved. In addition, it has excellent weatherability, heat resistance, water resistance, light resistance, wind pressure resistance, yield resistance, and other characteristics, and also affects manufacturing conditions such as thermocompression bonding for manufacturing LED element substrates. Thus, it is possible to manufacture a substrate for an LED element which has extremely excellent heat-fusibility without being subjected to heat treatment, is stably and at low cost, and is suitable for various applications.

When the reflector 15 is a multilayer film, the base resin of the intermediate layer composition is preferably a resin having a relatively higher density than the base resin of the reflector composition. Specifically, density 0.920 g / cm ³ or more 0.970 g / cm ³ or less of polyethylene, it preferably using 0.935 g / cm ³ or more 0.965 g / cm ³ or less of high density polyethylene (HDPE) Can do. The melting point of the base resin of the composition for the intermediate layer is preferably 125 ° C. or higher. In addition, as the base resin of the composition for the intermediate layer, other thermoplastic resins in the above density range can also be used. The content of the base resin composition in the reflector composition of the intermediate layer is 10% by mass or more and 50% by mass or less, preferably 15% by mass or more and 35% by mass or less. By setting the type and density range of the base resin of the composition for the intermediate layer and the content in the reflector composition as described above, it is sufficient while maintaining preferable adhesion to other members of the reflector. The reflective material can be provided with heat resistance. Moreover, as above-mentioned, the heat-resistant guarantee by an intermediate | middle layer can also be implement | achieved by the conditions setting of bridge | crosslinking process irrespective of material selection. As a specific example, for example, as a base resin of the composition for the intermediate layer, the base resin and the same degree of density of 0.870 g / cm ³ or more 0.940 g / cm ³ or less polyethylene in the reflector material composition By using it as a resin and optimizing the processing conditions for ionizing radiation for this, the cross-linking progress of each layer is inclined, and the intermediate layer is sufficient for maintaining the adhesion of the adhesion reinforcing layer. It is also possible to form the reflecting material 15 by imparting excellent heat resistance.

  Specific examples of other thermoplastic resins that can be used as the base resin of the composition for the intermediate layer include thermoplastic elastomers in which ethylene-propylene rubber (EPDM, EPM) is finely dispersed in polypropylene resin (PP). A certain olefin type elastomer etc. can be used preferably. The olefin-based elastomer is incompatible with polyethylene, but has high flexibility and heat resistance, and therefore can impart preferable flexibility and heat resistance to the reflector.

  In addition, the polyethylene resin used as the base resin of the composition for the intermediate layer has an MFR value of 0.5 g at 190 ° C. and a load of 2.16 kg measured according to JIS7210 from the viewpoint of maintaining good film forming properties. / 10 min or more and 30.0 g / 10 min or less is preferable, and 1.0 g / 10 min or more and 15.0 g / 10 min or less is more preferable.

  The content of the base resin contained in the intermediate layer composition is preferably 10 parts by mass or more and 99 parts by mass or less, more preferably 50 parts by mass with respect to 100 parts by mass in total of all resin components in the composition. It is 99 mass parts or less, More preferably, it is 90 mass parts or more and 99 mass parts or less. Other resins may be contained within the above composition range. In the present specification, the term “all resin components” includes the other resins described above.

  In order to provide the reflective composition with the necessary reflectivity, a white pigment is added to the base resin. Examples of the white pigment include titanium oxide, calcium carbonate, barium sulfate, and silicon dioxide. Among these, titanium oxide can be particularly preferably used as the white pigment used in the reflective material composition of the present invention. As described above, the amount of white pigment added is optimized according to the thickness of the reflector. Basically, as the thickness is larger, the content of the white pigment in the reflector composition may be smaller, and the necessary reflectivity can be maintained with a smaller content.

  For example, when the total thickness of the reflective material 15 is in the range of 100 μm to 250 μm, the content of the white pigment added to the reflective material composition is preferably 12% by mass or more and 45% by mass or less. The product of the total thickness (μm) of the reflector 15 and the content (mass%) of the white pigment (hereinafter also simply referred to as “product of thickness and content”) is constant. It is preferable that it is a value within the range. A specific preferable range of the product of the thickness and the content is 3000 or more and 4500 or less, preferably 3600 or more and 4200 or less. For example, when the total thickness of the reflector 15 is 100 μm, the content of the white pigment is preferably 30% by mass or more and 45% by mass or less (from 3000/100 = 30,4500 / 100 = 45). If it is 200 μm, the content of the white pigment is preferably 15% by mass or more and 22.5% by mass or less (from 3000/200 = 15, 4500/200 = 22.5). The content of is preferably 12% by mass or more and 18% by mass or less (from 3000/250 = 12, 4500/250 = 18). In addition, even if it is a case where the reflecting material 15 consists of a multilayer film, it is preferable that the average density | concentration in all the layers exists in the said range.

  By limiting the content of the white pigment such as titanium oxide in the reflective material composition to the above range, the reflective material 15 can be provided with good reflectance without impairing the metal adhesion of the reflective material 15. . Incidentally, if the content is less than 12% by mass, or if the product of the thickness and content is less than 3000, the reflectivity is insufficient, while the content exceeds 45% by mass, or When the product of the above-mentioned thickness and content exceeds 4500, there is a problem of deterioration of the smoothness of the film of the reflecting material due to a decrease in film forming property or bleed-out, etc., while the reflectance is improved by adding more than that. The effect is not recognized.

  Specifically, the good reflectance is as follows. That is, the reflective material 15 satisfies the constituent requirements of the present invention, so that the reflectance at a wavelength of 450 to 700 nm is 95.0% or more, preferably 97.0% or more, more preferably 98. 0.0% or more can be done. In addition, since it is difficult to strictly measure the absolute reflectance, the relative reflectance with the reference standard sample is usually used for the reflectance. In the present invention, barium sulfate is used as a comparative standard sample. The reflectance in the present invention is determined by attaching an integrating sphere attachment device (for example, ISR2200, manufactured by Shimadzu Corporation) to a spectrophotometer (for example, Shimadzu Corporation UV2450), using barium sulfate as a standard plate, and using 100 as the standard plate. It is a value obtained by measuring the relative reflectance in%.

  The reflective material 15 is also an optimized material particularly focusing on the elastic modulus of the adhesion reinforcing layer, that is, the Young's modulus. In the reflector 15, the adhesion reinforcing layer is always exposed on at least one of the outermost surfaces. In the production of the reflector 15, the composition of the reflector composition and the crosslinking treatment are performed so that the Young's modulus of the adhesion reinforcing layer is 5.0E + 4 Pa to 5.0E + 6 Pa, preferably 1.0E + 5 Pa to 5.0E + 6 Pa. A process for optimizing manufacturing conditions at each time is performed. Thereby, sufficient softness | flexibility can be provided to the reflecting material 15, and the molding characteristic and base-material adhesiveness in the integration process as the board | substrate 1 for LED elements can be improved especially metal adhesion.

  In addition, by adding an adhesion improver to the reflective material composition as appropriate, it is possible to further improve the adhesion to other substrates, particularly the metal adhesion. As the adhesion improver, a known silane coupling agent can be used. The silane coupling agent is not particularly limited. For example, vinyl-based silane coupling agents such as vinyltrichlorosilane, vinyltrimethoxysilane, and vinyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3-methacryloxypropyldiethoxy. A methacryloxy-based silane coupling agent such as silane or 3-methacryloxypropyltriethoxysilane can be preferably used. In addition, these can also be used individually or in mixture of 2 or more types.

  When a silane coupling agent is added as an adhesion improver, the content is 0.1 parts by mass or more and 10.0 parts by mass or less with respect to 100 parts by mass in total of all resin components of the reflector composition. The upper limit is preferably 5.0 parts by mass or less. When the content of the silane coupling agent is in the above range and the resin constituting the reflector composition contains an appropriate amount of the ethylenically unsaturated silane compound, the adhesion is improved to a more preferable range.

  However, even within the above range, the addition of the adhesion improver may adversely affect the physical properties of the encapsulant sheet. Specifically, this is a case where a so-called bleed out occurs in which the silane coupling agent is agglomerated and solidified with time to be pulverized on the surface of the sealing material sheet. Also, depending on the film forming conditions, the reaction resulting from the addition of the silane coupling agent may proceed excessively during film formation, and the sealing material composition may adhere closely to the unloading screw of the extruder, reducing productivity. There is also a case. Therefore, it is not necessary to add an excessive adhesion improver until the above risk of productivity reduction or the like is taken. By paying attention to the Young's modulus of the reflective material 15 and adjusting it to the optimum range, even if no adhesion improver is added or a smaller amount than usual, sufficient adhesion to other members, particularly excellent metal The adhesiveness can be exhibited.

  In both the reflector composition and the intermediate layer composition, a crosslinking agent can be appropriately contained. A well-known thing can be used for a crosslinking agent, It does not specifically limit, For example, a well-known radical polymerization initiator can be used. Examples of radical polymerization initiators include hydroperoxides such as diisopropylbenzene hydroperoxide and 2,5-dimethyl-2,5-di (hydroperoxy) hexane; di-t-butyl peroxide, t-butyl Cumyl peroxide, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, 2,5-dimethyl-2,5-di (t-peroxy) hexyne-3, etc. Dialkyl peroxides; diacyl peroxides such as bis-3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, benzoyl peroxide, o-methylbenzoyl peroxide, 2,4-dichlorobenzoyl peroxide; t-butyl peroxyacetate, t-butyl pero Ci-2-ethylhexanoate, t-butyl peroxypivalate, t-butyl peroxyoctoate, t-butyl peroxyisopropyl carbonate, t-butyl peroxybenzoate, di-t-butyl peroxyphthalate, 2 , 5-dimethyl-2,5-di (benzoylperoxy) hexane, 2,5-dimethyl-2,5-di (benzoylperoxy) hexyne-3, t-butylperoxy-2-ethylhexyl carbonate Oxyesters; organic peroxides such as ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide, or azo compounds such as azobisisobutyronitrile and azobis (2,4-dimethylvaleronitrile), dibutyltin Diacetate, dibutyltin dilaurate It can be mentioned dibutyltin dioctoate, dioctyltin dilaurate, dicumyl peroxide, such a silanol condensation catalyst.

  When the crosslinking agent is contained in the reflective material composition and the composition for the intermediate layer, the content thereof may be appropriately adjusted according to the production method of the reflective material.

  For example, in the case of producing a reflector by the method described in JP2013-115212A, that is, by adjusting the Young's modulus to a desired range by crosslinking treatment with ionizing radiation after forming the reflector, a crosslinking agent is used. Is not essential, and the content of the reflector composition is such that the content of the reflector composition with respect to all resin components is 0% by mass or more and less than 0.5% by mass, preferably 0.02% by mass. It is the range of 0.5 mass% or less. By adding 0.02% by mass or more of a crosslinking agent, more preferable heat resistance can be imparted to the polyethylene resin used in the reflective material of the present invention.

  On the other hand, for example, as described in Patent Document 2, a reflector is manufactured by a manufacturing method that imparts heat resistance by causing a very weak crosslinking reaction (weak crosslinking) that does not exert an excessive burden on an extrusion apparatus during molding. In the case of producing a polyethylene resin used in the reflector of the present invention by adding 0.02 mass% or more and less than 0.5 mass% of a crosslinking agent to the total resin component of the reflector composition. The preferred heat resistance can be imparted. On the other hand, when the addition amount of the crosslinking agent exceeds 0.5% by mass, a gel is generated during molding and the film forming property is lowered, and the transparency is also lowered.

  In the present invention, a polyfunctional monomer having a carbon-carbon double bond and / or an epoxy group can be used as a crosslinking aid. More preferably, the cross-linking aid is one in which the functional group of the polyfunctional monomer is an allyl group, a (meth) acrylate group, or a vinyl group. By adding such a crosslinking aid, the crystallinity of the low-density polyethylene is lowered, and a crosslinked reflector having excellent low-temperature flexibility can be obtained.

  When the crosslinking aid is used, specifically, polyallyl compounds such as triallyl isocyanurate (TAIC), triallyl cyanurate, diallyl phthalate, diallyl fumarate, diallyl maleate, trimethylolpropane trimethacrylate (TMPT), triaryl Methylolpropane triacrylate (TMPTA), ethylene glycol diacrylate, ethylene glycol dimethacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, tricyclodecane dimethanol Poly (meth) acryloxy compounds such as diacrylate, glycidyl methacrylate containing double bond and epoxy group, 4-hydroxybutyl acrylate glycidyl ether and epoxy group Containing two or more 1,6-hexanediol diglycidyl ether, and 1,4-butanediol diglycidyl ether, cyclohexanedimethanol diglycidyl ether, an epoxy-based compounds such as trimethylolpropane polyglycidyl ether. These may be used alone or in combination of two or more.

  In addition, in the reflector composition and the composition for the intermediate layer, as necessary, as other components, an inorganic flame retardant such as an antimony trioxide flame retardant or a magnesium hydroxide flame retardant, etc. It is preferable to add an appropriate flame retardant as necessary.

[LED element]
The LED element 16 is a light emitting element utilizing light emission at a PN junction where a P-type semiconductor and an N-type semiconductor are joined. There are proposed a structure in which a P-type electrode and an N-type electrode are provided on the upper and lower surfaces of the element and a structure in which both the P-type and N-type electrodes are provided on one side of the element. Any structure of the LED element 16 can be used for the LED mounting module 10 of the present invention, but among the above, the LED element having a structure in which both the P-type and N-type electrodes are provided on the element single side is particularly preferably used. Can do.

<Manufacturing method of reflecting material (first embodiment)>
In the first embodiment of the manufacturing method of the reflecting material 1, the reflecting material composition is selected for each of the intermediate layer and the outermost layer, and further, the ionizing radiation is irradiated after the melt molding, and the degree of progress of the crosslinking degree It is a method of controlling appropriately.

  The second embodiment of the method for producing a reflective material according to the present invention is a method in which weak crosslinking proceeds during film formation and the progress of the crosslinking is controlled. In the second embodiment, unlike the first embodiment, a separate cross-linking treatment after film formation is unnecessary. However, there is no need for a separate cross-linking step after film formation, and the addition amount of the cross-linking agent for progressing weak cross-linking during film formation and the range of film forming temperature conditions are different from the second. The embodiment is a process similar to the first embodiment. Hereinafter, first, the manufacturing method of the 1st embodiment of the manufacturing method of the reflective material of this invention is demonstrated.

[Filming process]
The melt molding of each composition for the intermediate layer and outermost layer is a molding method usually used in ordinary thermoplastic resins, that is, various moldings such as injection molding, extrusion molding, hollow molding, compression molding, and rotational molding. Done by law. As an example of the forming method as the multilayer film, there is a method of forming by co-extrusion using two or more melt-kneading extruders.

  The lower limit of the molding temperature at the time of molding may be a temperature exceeding the melting point of the reflective material composition. The upper limit of the molding temperature is, when a crosslinking agent is used, the temperature at which crosslinking does not start during film formation, that is, the gel fraction of the reflector composition is 0, depending on the 1 minute half-life temperature of the crosslinking agent. Any temperature that can be maintained at% is acceptable.

  Here, in the manufacturing method (1st embodiment) of the reflecting material of this invention, a crosslinking agent is not essential in a reflecting material composition, Moreover, even when it is a case where a crosslinking agent is added, the content is The content is less than 0.5% by mass. For this reason, under a normal low density polyethylene resin molding temperature, for example, a heating condition of about 120 ° C., the gel fraction does not change, and the crosslinking that substantially affects the physical properties of the resin does not proceed. According to the production method of the present invention that maintains the gel fraction of the reflective material composition during film formation at 0%, it is possible to reduce the load on the extruder and the like during film formation and increase the productivity of the reflective material. It is.

[Crosslinking process]
An LED element substrate in which a cross-linking process in which a cross-linking treatment by ionizing radiation is performed on an uncross-linked reflective material after the film forming step is performed after the film forming step is completed and the reflective material is integrated with other members. Before the integration process starts. By this crosslinking treatment, a reflective material having a gel fraction of 2% to 80% is obtained. The cross-linking treatment may be performed continuously in-line following the film forming step, or may be performed off-line.

  Regarding the crosslinking treatment by irradiation with ionizing radiation, the individual crosslinking conditions are not particularly limited. As a rough standard of specific irradiation amount, it may be appropriately set so that the gel fraction of the intermediate layer after the crosslinking treatment is in a range of about 5% or more. Specifically, it can be performed by ionizing radiation such as electron beam (EB), α-ray, β-ray, γ-ray, neutron beam, etc. Among them, it is preferable to use an electron beam. The acceleration voltage in electron beam irradiation is determined by the film thickness that is the object to be irradiated, and the thicker the film, the larger the acceleration voltage is required. For example, a film having a thickness of about 200 μm is irradiated with 100 kV or more, preferably 200 kV or more. If the accelerating voltage is lower than this, crosslinking of the intermediate layer does not proceed sufficiently. The irradiation dose is in the range of 5 kGy to 200 kGy, preferably 5 to 100 kGy. If the irradiation dose is less than 5 kGy, the crosslinking of the intermediate layer does not proceed sufficiently, and if it exceeds 200 kGy, there is a concern about deformation or coloring of the reflecting material due to the generated heat.

  The irradiation with ionizing radiation may be performed from either one side or both sides as long as the crosslinking of the intermediate layer can be sufficiently advanced to the above degree. More preferably, the degree of progress of crosslinking is inclined. As a result, the surface having the smaller degree of progress of cross-linking is used as the contact surface with the metal wiring portion or the like, thereby obtaining better adhesion while maintaining the necessary heat resistance of the entire reflector 15. it can. In particular, when the reflecting material 15 is formed of a single layer film, it is effective to balance the heat resistance and the adhesiveness on both sides by giving an inclination to the degree of progress of crosslinking by such a method. Become. Irradiation with ionizing radiation may be performed in an air atmosphere or a nitrogen atmosphere.

  This crosslinking treatment may be performed continuously in-line following the film forming step, or may be performed off-line. In addition, when the crosslinking treatment is a general heat treatment, the content of the crosslinking agent is generally required to be 0.5 parts by mass or more and 1.5 parts by mass or less with respect to 100 parts by mass of all components of the reflective material. However, in the reflective material of the present invention, the content of the crosslinking agent may be 0, and even when it is contained, it is preferably less than 0.5 parts by mass. Thereby, the risk of the productivity fall by gelatinization of the reflector composition in the film formation process of a reflector composition can be reduced. In addition, since the reflection material of the present invention thus obtained is subjected to a crosslinking treatment, it is not necessary to perform another annealing treatment or the like, and it can be used in the subsequent reflection material lamination or adhesion process. .

<Manufacturing method of reflecting material (second embodiment)>
In the second embodiment of the method for producing a reflector according to the present invention, the amount of the crosslinking agent added to the reflector composition is increased in an appropriate amount range that does not lead to a decrease in film-formability, and weak crosslinking is caused during film formation. It is a method of adjusting the degree of progress of crosslinking of each layer of the reflector 1 to the optimum range by proceeding and appropriately controlling this. Hereinafter, about the 2nd embodiment of the manufacturing method of the reflector of this invention, description is abbreviate | omitted about the part similar to a 1st embodiment, and only a different part from a 1st embodiment is demonstrated.

  When manufacturing the reflecting material 1 by this 2nd embodiment, 0.02 mass% or more and less than 0.5 mass% of crosslinking agents are added with respect to all the resin components of a reflecting material composition.

  The film formation of the reflecting material in the second embodiment can be performed by the same method as in the first embodiment. However, in order to promote a weak crosslinking reaction during molding, the molding temperature is preferably not lower than the melting point of the polyethylene-based resin constituting the reflector composition + 50 ° C. or higher. Specifically, a high temperature of 150 to 250 ° C. is preferable, and a range of 190 to 230 ° C. is more preferable. Since the molding temperature is equal to or higher than the 1 minute half-life temperature of the crosslinking agent, the crosslinking agent hardly remains after molding. For this reason, the weak crosslinking ends at this molding stage.

<Method for producing LED element substrate>
The LED element substrate 1 can be manufactured by an etching process, which is one of the conventionally known methods for manufacturing an electronic substrate, and a reflector lamination process unique to the present invention. Further, it is preferable that the resin is preliminarily subjected to heat resistance improvement treatment by annealing treatment according to the material resin to be selected.

[Annealing treatment]
Although not essential in the present invention, conventionally known heat treatment means can be used for the annealing treatment. As an example of the annealing treatment temperature, when the thermoplastic resin forming the substrate film 11 is PEN, the glass transition temperature to the melting point range, more specifically 160 ° C. to 260 ° C., more preferably 180 ° C. to 230 ° C. Range. An example of the annealing time is about 10 seconds to 5 minutes. According to such heat treatment conditions, the thermal contraction start temperature of PEN, which is generally about 80 ° C., can be improved to about 100 ° C.

[Etching process]
A laminated body made of a material is obtained by laminating a metal wiring portion 13 such as a copper foil as a material of the metal wiring portion 13 on the surface of the substrate film 11 which has been subjected to an annealing treatment as necessary. As a lamination method, a metal foil is adhered to the surface of the substrate film 11 with an adhesive, or a plating method or a vapor deposition method (sputtering, ion plating, electron beam evaporation, Examples thereof include a method of depositing the metal wiring portion 13 by vacuum deposition, chemical vapor deposition, or the like. From the viewpoint of cost and productivity, a method of bonding the metal foil to the surface of the substrate film 11 with a urethane adhesive is advantageous.

  Next, the etching mask patterned in the shape of the metal wiring part 13 is shape | molded on the surface of metal foil of said laminated body. In the future, the etching mask is provided so that the wiring pattern forming portion of the metal foil to be the metal wiring portion 13 is free from corrosion by the etching solution. The method for forming the etching mask is not particularly limited. For example, the etching mask may be formed on the surface of the laminated film by developing after exposing a photoresist or dry film through the photomask, an inkjet printer, or the like. An etching mask may be formed on the surface of the laminated film by the printing technique.

  Next, the metal foil in a portion not covered with the etching mask is removed with an immersion liquid. Thereby, parts other than the location used as the metal wiring part 13 are removed among metal foil.

  Finally, the etching mask is removed using an alkaline stripping solution. As a result, the etching mask is removed from the surface of the metal wiring portion 13.

[Reflecting material lamination process]
After the formation of the metal wiring part 13, the reflective material 15 is further laminated thereon. This lamination can be preferably performed by a thermal lamination method in which a film for a reflecting material obtained by the above manufacturing method is heat-pressed on the surfaces of the metal wiring portion 13 and the substrate film 11. This thermal lamination may be performed as an independent heat treatment for pressing the reflective material to the metal wiring portion 13 or the like as appropriate before and after mounting the LED element 17. However, as described below, the soldering process and the reflective material for mounting the LED element 17 are caused by heat for melting the solder during the soldering process for mounting the LED element 17 in the process of manufacturing the LED mounting module. Thermal lamination processing on the 15 metal wiring portions 13 and the like can be performed simultaneously.

  Formation of the LED element mounting through-holes 151 in the reflector 15 can be performed by various well-known perforating processes such as punching and laser processing. In addition, this drilling process can raise the precision of a drilling process further by performing it after finishing the said bridge | crosslinking process when performing the above bridge | crosslinking processes to a reflecting material.

  In addition, the lamination | stacking of the reflecting material 15 is not restricted to thermocompression bonding processes like said thermal lamination method, It can also be based on other well-known methods, such as a dry lamination method. However, the reflective material 15 of the present invention is also characterized in that it can be applied to the above-described production method with excellent productivity by defining the composition of the reflective material composition within a unique range.

<Method for manufacturing LED mounting module>
A method for manufacturing the LED mounting module 10 will be described.

[Reflecting material manufacturing process]
This is a process of manufacturing the reflective material 15 by the above-described reflective material manufacturing method.

[Soldering process]
The LED element 16 can be joined to the metal wiring part 13 by soldering. This soldering joining can be performed by a reflow method or a laser method. In the reflow method, the LED element 16 is mounted on the metal wiring part 13 through solder, and then the LED element substrate 1 is transported into the reflow furnace, and hot air at a predetermined temperature is applied to the metal wiring part 13 in the reflow furnace. In this method, the solder paste is melted by spraying, and the LED element 16 is soldered to the metal wiring portion 13. The laser method is a method in which solder is locally heated by a laser to solder the LED element 16 to the metal wiring portion 13. The heating in this treatment varies depending on the type of solder used, but is generally about 170 ° C., and particularly about 135 ° C. when a low melting point solder is used.

  When soldering the LED element 16 to the metal wiring part 13, it is preferable to adopt a method of performing solder reflow by laser irradiation from the back surface side of the substrate film 11. Thereby, the ignition of the organic component of the solder by heating and the accompanying damage to the base material can be more reliably suppressed.

[Reflective material adhesion process]
The thermocompression bonding process in which the resin film constituting the reflective material 15 is brought into close contact with the substrate film 11 and the metal wiring part 13 can be performed by various known heating and pressure methods. The heat treatment can be performed by heating the resin film for forming the reflective material 15 by heat applied to heat the solder in the soldering process, simultaneously with the heat applied for the soldering process. Thereby, the process number in manufacture of the LED mounting module 10 can be reduced, and productivity improves.

<LED display device>
FIG. 5 is a perspective view schematically showing an outline of a layer configuration of the LED display device 100 using the LED mounting module 10. The LED display device 100 displays information (images) such as characters and images on the monitor 3 by driving (emitting light) the plurality of LED elements 16 arranged in a matrix at predetermined intervals. In addition, it is more preferable that the heat dissipation structure 4 for radiating the heat radiated from the LED mounting module 10 to the outside more efficiently is installed on the back side of the LED element substrate 1.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited to a following example.

<Manufacture of reflective material>
Reflector compositions and intermediate layer compositions having the compositions shown in Table 1 below (units of numerical values other than the melting point (° C.) and the intensity of EB irradiation (kGy) in Table 1 are all composition ratios (mass%)). A blend for a single layer was mixed. Each film for a reflector was molded from the blend using a φ30 mm extruder and a film molding machine having a 400 mm wide T die at an extrusion temperature of 180 ° C. and a take-off speed of 1.1 m / min. About Examples 1-3 and Comparative Examples 2-3, the 200-micrometer-thick single layer film was shape | molded and each reflector was manufactured from the film for reflectors of these single layers. Further, for Examples 4 to 5, a multilayer film composed of three layers in which a layer composed of the following base resin 3 or 4 is used as an intermediate layer, and a layer comprising the base resin 2 is disposed on both sides as an outermost layer. The reflector was manufactured from this multilayer film. The total thickness of this multilayer film was 200 μm, and the thickness ratio of each layer was 1: 6: 1.

The following raw materials were used as raw materials for the reflective material composition and the intermediate layer composition.
(Base resin)
Base resin 1 (indicated as “ML1” in Table 1, the same applies hereinafter): Metallocene linear chain having a density of 0.880 g / cm ³ , a melting point of 60 ° C., and an MFR at 190 ° C. of 3.5 g / 10 min. Low density polyethylene (M-LLDPE).
Base resin 2 (“ML2”): metallocene linear low density polyethylene (M-LLDPE) having a density of 0.901 g / cm ³ , a melting point of 97 ° C., and an MFR at 190 ° C. of 3.5 g / 10 min. .
Base resin 3 (PS1): 2 parts by mass of vinyltrimethoxysilane with respect to 100 parts by mass of a metallocene linear low density polyethylene having a density of 0.880 g / cm ³ and an MFR of 30 g / 10 min, and a radical generator Silane-modified polyethylene resin obtained by mixing 0.15 parts by mass of dicumyl peroxide as (reaction catalyst), melting and kneading at 200 ° C. Density 0.880 g / cm ³ , MFR 13.0 g / 10 min. Melting point 60 ° C.
Base resin 4 (PS2): 2 parts by mass of vinyltrimethoxysilane with respect to 100 parts by mass of metallocene linear low density polyethylene having a density of 0.902 g / cm ³ and an MFR of 13 g / 10 min, and a radical generator Silane-modified polyethylene resin obtained by mixing 0.15 parts by mass of dicumyl peroxide as (reaction catalyst), melting and kneading at 200 ° C. Density 0.901 g / cm ³ , MFR 2.0 g / 10 min. Melting point 97 ° C.
Base resin 5 (“HD”): high density polyethylene (HDPE) having a density of 0.963 g / cm ³ , an MFR at 190 ° C. of 7.0 g / 10 min, and a melting point of 135 ° C.
Base resin 6 (indicated as “PP” in Table 1): Polypropylene (PP) having a density of 0.910 g / cm ³ , MFR at 230 ° C. of 7.0 g / 10 min, and melting point of 165 ° C.
(White pigment)
Titanium oxide: Titanium oxide having an average particle size of 0.3 μm. Addition to each of the reflector composition and the composition for the intermediate layer so that the contents in the composition for the reflector material of Examples 1 to 5 and Comparative Example 2 and the composition for the intermediate layer are both 19% by mass did. In addition, since the total thickness of the reflectors of Examples 1 to 5 and Comparative Example 2 are both 200 μm, the product of the thickness and the content described above is 3800 in these reflectors. .

  An electron beam irradiation device (manufactured by Iwasaki Electric Co., Ltd., product name EC250 / 15 / 180L) was used for the film for the reflecting material after molding in Examples 1 to 3 and Comparative Examples 2 to 3, both of which were accelerated voltages About 200 kV and irradiation intensity | strength, it irradiated with each intensity | strength (kGy) of Table 1 only from the reflective surface side, and it was set as the crosslinked reflecting material. Example 6 is a film for a reflector having the same resin composition as that of Example 1, but the width of the gap portion is changed as described below.

  About the reflecting material film after the said shaping | molding of Examples 4-5, the crosslinking process by electron beam irradiation was not performed but it was set as the reflecting material of each Example as it was.

The following resin film (white PET film) that is generally used as a white reflective resin was used as the reflective material of Comparative Example 1. This is not subjected to crosslinking treatment by electron beam irradiation.
“Highly reflective / white void film mirror E6SR” thickness 188 μm, melting point 250 ° C.

<Evaluation Example 1: Luminance>
A total of 6 LED elements (NFSW757DT-V1 / Nichia Chemical Co., Ltd.) are mounted in 2 columns × 3 rows on a substrate (15 cm × 15 cm) in which copper wiring is formed on a PEN film. The LED mounting module for evaluation in which the reflective material was laminated was prepared according to the method for manufacturing the LED mounting module described above. In addition, it created so that the gap part of the LED element mounting area | region of each LED mounting module might become the width | variety (maximum width and dispersion | variation within + -0.01%), respectively. However, since the reflective material (white PET) of Comparative Example 1 cannot be fixed by thermocompression bonding, the following tests were performed with the periphery temporarily fixed with a plurality of pins.

[Module brightness test]
The module luminance was measured by 2K color analyzer CA2000 manufactured by Konica Minolta, and the average luminance of 5 mm in diameter centered on the LED light source was measured for each of the 6 mounted LED elements, and the average value was calculated. The brightness value of the comparative example was used. And the brightness | luminance of the comparative example 1 was made into the reference, and the relative value (%) with respect to it was made into the evaluation value of the brightness | luminance of each evaluation module. The results are shown in Table 2.

<Evaluation Example 2: Metal adhesion>
About each reflective material of an Example and a comparative example, metal adhesiveness was measured and evaluated.

[Metal adhesion test]
Each of the reflectors of Examples and Comparative Examples cut to a width of 15 mm was brought into close contact with a copper foil (75 mm × 50 mm × 0.035 mm), and under the same conditions as the following thermal lamination conditions (a) to (d) Then, vacuum heating laminator treatment was performed to obtain metal adhesion evaluation samples for the respective examples and comparative examples. For each of these metal adhesion evaluation samples, the adhesion strength under the following test conditions was measured to evaluate the metal adhesion.
In the above sample for evaluating metal adhesion, the reflective material in close contact with the copper foil was subjected to a vertical peel (50 mm / min) test using a peel tester (Tensilon Universal Tester RTF-1150-H). The measurement results were evaluated according to the following evaluation criteria A to D. The results are shown in Table 3. In addition, this evaluation standard prescribes the following evaluation standard from the viewpoint of the adhesiveness assumed to be necessary at least by the stage of the semi-finished product after the reflow treatment.
(Thermal lamination conditions) (a) Vacuum drawing: 0.5 minutes
(B) Pressurization (0 kPa to 100 kPa): 100 kPa
(C) Pressure holding (100 kPa): 1.0 minute
(D) Temperature 100 ° C
(Evaluation criteria) A: 1.5 N / 15 mm or more
B: 0.5N / 15mm or more and less than 1.5N / 15mm
C: 0.05N / 15 or more and less than 0.5N / 15mm
D: Less than 0.05N / 15mm

  From Table 2, it can be seen that the LED mounting module of the present invention retains better reflection performance than the LED mounting module using white PET, which has been used for general purposes, as a reflective material. Moreover, it can be seen from Table 3 that the reflective material of the present invention can constitute a laminated body constituting the LED element substrate by a lamination treatment by a thermal lamination method. From the above, it can be seen that according to the present invention, an LED mounting module having optical characteristics higher than those of the prior art and remarkably high productivity can be provided.

DESCRIPTION OF SYMBOLS 1 LED element substrate 11 Substrate film 12 Adhesive layer 13 Metal wiring part 14 Solder layer 15 Reflector 151 LED element mounting through-hole 152 Gap part 16 LED element 21 Iron plate frame 22 Rigid substrate 23 Fixing pin 3 Monitor 4 Heat dissipation structure 10 LED mounting module 100 LED display device

Claims (8)

An LED mounting module in which an LED element is mounted on an LED element substrate,
The LED element substrate covers a substrate film made of a thermoplastic resin, a metal wiring portion formed on the substrate film, and a region excluding the LED element mounting region, and on the substrate film and the metal wiring portion. And a reflective material laminated on the
The reflective material, the density of 0.870 g / cm ³ or more 0.940 g / cm ³ or less of the polyethylene resin as a base resin, a resin film of a single layer which is formed by the reflective material composition containing a white pigment, or, A multilayer resin film comprising an adhesion reinforcing layer formed by the reflective material composition as an outermost layer,
The reflective material has a plurality of LED element mounting through holes, and between the inner peripheral side surface of the LED element mounting through hole and the outer peripheral side surface of the LED element disposed in the LED element mounting through hole. The LED mounting module in which the maximum value of the width of the gap portion formed on the LED is 1 mm or less.   The LED mounting module according to claim 1, wherein a width of the gap portion is in a range of 0.01 mm to 0.1 mm.   The LED mounting module according to claim 1, wherein the reflective material is made of a single resin film having a thickness of 100 μm to 250 μm.   The LED mounting module according to any one of claims 1 to 3, wherein the reflective material composition further contains a copolymer obtained by copolymerizing an α-olefin and an ethylenically unsaturated silane compound as a comonomer.   The LED mounting module according to claim 1, wherein a melting point of the base resin of the reflective material composition is 50 ° C. or higher and 100 ° C. or lower.   The reflective material is a multilayer resin film composed of a plurality of resin layers each having a resin composition having a different melting point as a base resin, and a resin having a melting point higher than that of the base resin of the adhesion reinforcing layer is defined as a base resin. The LED mounting module according to claim 1, wherein the layer to be arranged is arranged as an intermediate layer.   The LED display apparatus which uses the LED mounting module in any one of Claim 1 to 6 as a backlight light source. It is a manufacturing method of the LED mounting module in any one of Claim 1 to 6,
A reflector manufacturing process for manufacturing a reflector by performing crosslinking treatment by irradiation of ionizing radiation to an uncrosslinked single-layer or multilayer resin film;
A reflective material laminating step for bringing the reflective material into close contact with the substrate film and the metal wiring portion by thermocompression treatment;
A soldering process for mounting the LED element on the metal wiring part by soldering,
The method for manufacturing an LED mounting module, wherein the thermocompression bonding process in the reflective material laminating process is performed by heating the reflective material with heat applied to heat the solder in the soldering process.

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