WO2013118752A1 - Coverlay film, printed wiring board to be equipped with light-emitting element, and light source device - Google Patents
Coverlay film, printed wiring board to be equipped with light-emitting element, and light source device Download PDFInfo
- Publication number
- WO2013118752A1 WO2013118752A1 PCT/JP2013/052685 JP2013052685W WO2013118752A1 WO 2013118752 A1 WO2013118752 A1 WO 2013118752A1 JP 2013052685 W JP2013052685 W JP 2013052685W WO 2013118752 A1 WO2013118752 A1 WO 2013118752A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin layer
- reflectance
- coverlay film
- wavelength
- inorganic filler
- Prior art date
Links
- 239000012787 coverlay film Substances 0.000 title claims abstract description 90
- 229920005989 resin Polymers 0.000 claims abstract description 132
- 239000011347 resin Substances 0.000 claims abstract description 132
- 239000011256 inorganic filler Substances 0.000 claims abstract description 53
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 53
- 239000004020 conductor Substances 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 238000012360 testing method Methods 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 96
- 239000000758 substrate Substances 0.000 claims description 71
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 46
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 36
- 239000010408 film Substances 0.000 claims description 24
- 239000011241 protective layer Substances 0.000 claims description 22
- 230000009467 reduction Effects 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 12
- 229910052724 xenon Inorganic materials 0.000 claims description 6
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 6
- 238000002310 reflectometry Methods 0.000 abstract description 22
- 238000000034 method Methods 0.000 description 51
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 239000002245 particle Substances 0.000 description 15
- 239000011342 resin composition Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- 229910052782 aluminium Inorganic materials 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 229920001187 thermosetting polymer Polymers 0.000 description 12
- 238000004132 cross linking Methods 0.000 description 10
- 238000001723 curing Methods 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- -1 siloxane skeleton Chemical group 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 229920005992 thermoplastic resin Polymers 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- 229910052809 inorganic oxide Inorganic materials 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 description 4
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 230000005251 gamma ray Effects 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004383 yellowing Methods 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 239000005995 Aluminium silicate Substances 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
- 229910052845 zircon Inorganic materials 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920004747 ULTEM® 1000 Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000001699 photocatalysis Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
Definitions
- the present invention protects the surface of a printed wiring board, in particular, a substrate on which a light emitting element such as an LED is mounted.
- the present invention relates to a substrate and a light source device. More specifically, it has a high reflectivity, and even after passing through a high-temperature heat load environment or a light resistance test environment, a decrease in reflectivity is suppressed, that is, a high reflectivity is maintained, and the phosphor is dispersed.
- the present invention relates to a coverlay film that can also be used as a dam material when filling resin.
- Chip type LEDs with LEDs mounted directly on the printed circuit board pattern and resin-sealed are advantageous for miniaturization and thinning. Therefore, electronic devices such as numeric keypad lighting for mobile phones and backlights for small liquid crystal displays are available. Widely used in equipment.
- the technology for increasing the brightness of LEDs has been remarkably improved, and LEDs have become more bright.
- the amount of heat generated by the LED element itself increases, and the ambient temperature of the LED element may exceed 100 ° C., which increases the thermal load on components such as a printed wiring board.
- the heating temperature reaches about 260-300 ° C in the thermosetting process of the sealing resin and the reflow process after joining with lead (Pb) -free solder. The surroundings are exposed to a high temperature heat environment not only during use but also in the manufacturing process.
- thermosetting resin compositions that have been used in the past, such as thermosetting resin compositions that are coated with a thermosetting solder resist, are used in an environment where a thermal load is applied as described above.
- a tendency was observed in which the whiteness decreased and the reflection efficiency decreased due to yellowing of the solder resist and the printed wiring board. Therefore, when developing a substrate for mounting a next-generation high-brightness LED in the future, it is necessary to improve such a decrease in reflection efficiency.
- the degree of whiteness is also the same as in the heat load environment, even in an environment where ultraviolet rays are irradiated. There was a tendency for the reflectivity to decrease due to a decrease.
- a substrate made of ceramic is excellent in heat resistance, it has a hard and brittle property, so there is a limit to increase the area and thickness. Therefore, there is a possibility that a substrate made of the ceramic may be difficult to be used as a substrate used in future general lighting applications or display applications. Therefore, there has been a demand for the development of a printed wiring board in which a cover lay film is laminated as a heat-resistant substrate that does not cause discoloration or a decrease in reflectance even under a high temperature heat load and can cope with a large area. .
- the mounting part is filled with a sealing resin (silicone resin, epoxy resin, or the like) in which a phosphor is dispersed.
- a dam material made of a thermosetting resin for example, a silicone resin or an epoxy resin is formed so that the sealing resin does not leak to the peripheral portion.
- a dam material is generally formed by a dispenser or the like and thermally cured.
- the resin when the resin is heat-cured, the wiring portion may be contaminated and the wire bonding property may be affected, or the white solder resist and the printed wiring board material may be thermally deteriorated, so a dam material is formed. It was a challenge.
- the manufacturing cost is high, development of a coverlay film in which a conductor protective layer such as metal wiring and a dam material are integrated, and a printed wiring board formed by laminating such a coverlay film have been demanded.
- Patent Document 1 had insufficient initial reflectance and light discoloration resistance. Moreover, there was no description or suggestion about a technology that can be widely applied, such as being usable as a dam material.
- the object of the present invention is a cover lay film that has high reflectivity in the visible light region, high heat resistance, and low decrease in reflectivity under high-temperature heat load environments and light-proof environments, and can cope with an increase in area.
- it is to provide a coverlay film that can be used for a printed wiring board for LED mounting, and a light-emitting element mounting substrate and a light source device formed by laminating the coverlay film.
- polyorganosiloxane was used as a thermosetting resin, and a resin composition containing this resin and an inorganic filler was used as a gamma ray or the like.
- a resin composition containing this resin and an inorganic filler was used as a gamma ray or the like.
- the first invention in the present invention includes a resin layer containing a polyorganosiloxane and an inorganic filler, has an average reflectance of 85% or more at a wavelength of 400 to 800 nm, and is at 260 ° C. for 10 minutes. It is a coverlay film for protecting a conductor circuit of a printed wiring board having a reflectance reduction rate at a wavelength of 450 nm after heat treatment of 5% or less.
- the reflectance reduction rate at a wavelength of 450 nm after the light resistance test shown below is 5% or less.
- Light resistance test Using a xenon weather meter, irradiation was performed at a temperature of 63 ° C. (black panel temperature), humidity of 50%, and irradiance (295 to 400 nm) of 60 W / m 2 for 50 hours.
- the resin layer is preferably cured by radiation.
- the inorganic filler is preferably titanium oxide.
- the coverlay film preferably has a thickness of 30 to 500 ⁇ m.
- the average reflectance at a wavelength of 350 to 400 nm is preferably 40% or more.
- the resin layer (A), a polyorganosiloxane, and a resin layer (B) containing an inorganic filler different from the inorganic filler contained in the resin layer (A) are provided. It is preferable that At this time, the inorganic filler contained in the resin layer (B) is preferably alumina.
- a protective layer having a resin layer (A) containing a polyorganosiloxane and an inorganic filler is formed on a substrate used for mounting at least one light emitting element.
- the protective layer has an average reflectance of 85% or more at a wavelength of 400 to 800 nm, and a reduction rate of the reflectance at a wavelength of 450 nm after heat treatment at 260 ° C. for 10 minutes is 5% or less. It is the board
- a conductor circuit is formed on a substrate, a protective layer is laminated on the conductor circuit, and the light emitting element on the substrate is mounted so that the conductor circuit and the light emitting element are electrically connected.
- a light source device having a configuration in which the light emitting element is sealed with a resin.
- the protective layer includes a resin layer (A) containing a polyorganosiloxane and an inorganic filler, has an average reflectance of 85% or more at a wavelength of 400 to 800 nm, and is heat-treated at 260 ° C. for 10 minutes. After that, the light source device is characterized in that the reflectance reduction rate at a wavelength of 450 nm is 5% or less.
- the cover lay film of the present invention has a high reflectivity not only in the visible light region but also in the ultraviolet region, high heat resistance, and little reduction in reflectivity under high temperature heat load environment and light resistance test environment. Can be obtained. Therefore, the coverlay film of the present invention is useful as a coverlay film for protecting a conductor circuit of a printed wiring board. And the light emitting element mounting substrate and light source device in which the conductor circuit protective layer was formed can be manufactured by using the coverlay film of this invention.
- the cover lay film according to the first embodiment of the present invention includes a resin layer (A) containing a polyorganosiloxane and an inorganic filler, and has a wavelength of 400 to 800 nm.
- a coverlay film for protecting a conductor circuit of a printed wiring board having an average reflectance of 85% or more and a reduction rate of reflectance at a wavelength of 450 nm after heat treatment at 260 ° C. for 10 minutes is 5% or less.
- the coverlay film needs to have an average reflectance of 85% or more at a wavelength of 400 to 800 nm. This is because the higher the reflectance in the visible light region, the higher the luminance of the LED mounted on the substrate, and if it is in the above range, it can be suitably used as a coverlay film for the LED mounting substrate. is there. From this viewpoint, the average reflectance is preferably 90% or more, particularly 95% or more.
- the reflectance at 450 nm is more preferably 85% or more, particularly 90% or more. In particular, it is preferably 95% or more.
- the coverlay film may reflect both light having a wavelength of 350 to 400 nm and light having a wavelength in the visible light region (400 to 800 nm), corresponding to the emission wavelength of the ultraviolet (near ultraviolet) LED. It becomes necessary. Therefore, this cover lay film preferably has an average reflectance of 350 to 400 nm of 40% or more, more preferably 60% or more, and particularly preferably 80% or more.
- polyorganosiloxane As a method for increasing the average reflectance at a wavelength of 400 to 800 nm, the reflectance at 450 nm, and the reflectance at a wavelength in the ultraviolet (near ultraviolet) region (350 to 400 nm) to a predetermined range, polyorganosiloxane An inorganic filler is contained in the resin layer (A) to form a resin layer (A), thereby obtaining extremely excellent reflection characteristics, and a method of appropriately adjusting the type and content of the inorganic filler to be used.
- This cover lay film requires that the reflectance reduction rate at a wavelength of 450 nm after heat treatment at 260 ° C. for 10 minutes is 5% or less of the reflectance before the heat treatment.
- thermosetting process 100 to 200 ° C, several hours
- a sealing agent such as a conductive adhesive, epoxy or silicone resin, soldering process (Pb-free solder reflow, peak temperature 260 ° C)
- soldering process Pb-free solder reflow, peak temperature 260 ° C
- a high thermal load such as a wire bonding process.
- the thermal load on the substrate tends to increase, and the LED element ambient temperature may exceed 100 ° C. Therefore, in the future, it will be important to maintain a high reflectance without discoloration even under such a high heat load environment.
- wavelength 450nm is an average wavelength of blue LED.
- the reflectance decrease rate at a wavelength of 450 nm after heat treatment at 260 ° C. for 10 minutes is 5% or less of the reflectance before the heat treatment, it is possible to suppress the decrease in reflectance in the manufacturing process.
- the rate of decrease is preferably 4% or less, more preferably 3% or less, and particularly preferably 2% or less.
- this cover-lay film has the reflectance decreasing rate after the next light resistance test of 5% or less of the reflectance before the light resistance test.
- Light resistance test Irradiated with a xenon weather meter at a temperature of 63 ° C. (black panel temperature), a humidity of 50%, and an irradiance (295 to 400 nm) of 60 W / m 2 for 50 hours.
- the reflectance decrease rate after the light resistance test is 5% or less of the reflectance before the light resistance test, it is possible to suppress the decrease in reflectance during actual use. It can be suitably used for a mounting substrate. From this viewpoint, the rate of decrease is preferably 4% or less, more preferably 3% or less, and particularly preferably 2% or less.
- polyorganosiloxane in order to make the reduction rate of the reflectance after heat treatment and the reduction rate of the reflectance after the light resistance test within a desired range, when forming the resin layer (A), polyorganosiloxane
- the resin composition containing the inorganic filler is preferably cured by radiation, particularly by gamma rays, as will be described later. However, it is not limited to this method.
- This coverlay film is provided with a resin layer (A) containing a polyorganosiloxane and an inorganic filler.
- polyorganosiloxane used in the cover lay film are substances having a siloxane skeleton described in formula (1) and capable of causing a crosslinking reaction.
- polyorganosiloxane There is no restriction
- R in formula (1) represents an alkyl group such as a methyl group or an ethyl group, a hydrocarbon group such as a vinyl group or a phenyl group, or a halogen-substituted hydrocarbon group such as a fluoroalkyl group.
- polydimethylsiloxane in which “R” in formula (1) is all methyl groups, or a part of the methyl groups of polydimethylsiloxane is one or more of the above hydrocarbon groups or halogen-substituted hydrocarbon groups.
- various polyorganosiloxanes substituted by As polyorganosiloxane used for this coverlay film, said polydimethylsiloxane and various polyalkylsiloxane can be used individually or in mixture of 2 or more types.
- the polyorganosiloxane resin When forming the resin layer (A), the polyorganosiloxane resin may be cured.
- the curing means for the polyorganosiloxane may be determined by appropriately selecting from any conventionally known methods such as addition type, condensation type, peroxide curing type and the like.
- condensation type examples include dealcoholization, deacetic acid, deoxime, and dehydrogenation types. Among these, it is preferable to use an addition type polyorganosiloxane that does not generate a by-product during curing.
- Examples of the method for curing the polyorganosiloxane include a method of adding a curing catalyst, a method of heating at a high temperature, a method of adding a crosslinking agent, and a crosslinking method by irradiation with radiation.
- Examples of the curing catalyst include aminosilane-based, nickel salt-based, and ammonium salt-based catalysts.
- metal soaps, such as octylate and naphthenate, such as Al, Fe, Co, Mn, and Zn, platinum catalyst, etc. are mentioned.
- the condition is generally 150 ° C. to 250 ° C. and can be cured by heating for about 30 minutes to 2 hours.
- the heating temperature can be lowered.
- the heating temperature can be set to 100 ° C. to 180 ° C., for example.
- the heating time can also be shortened to about 10 to 30 minutes, for example, which is preferable.
- Curing by radiation is a method in which heat is not applied to the polyorganosiloxane, and there is no fear of impairing the heat resistance and light resistance reliability due to the residue of the crosslinking material, and the effect of the present invention becomes remarkable. preferable.
- examples of the radiation used for curing the polyorganosiloxane include electron beam, X-ray, and ⁇ -ray. These radiations are widely used industrially, can be easily used, and are energy efficient. Among these, it is preferable to use ⁇ rays having little absorption loss and high permeability.
- the polyorganosiloxane is cured by irradiating the uncrosslinked polyorganosiloxane with, for example, ⁇ rays. Since the crosslinking reaction can be advanced by irradiation with ⁇ rays, the crosslinking reaction can be caused without using a crosslinking agent.
- the irradiation dose of ⁇ rays may be appropriately selected and determined depending on the resin type, the amount of crosslinking groups, and the type of radiation source, but is generally 10 to 150 kGy. Of these, 20 to 100 kGy is preferable, and 30 to 60 kGy is particularly preferable.
- the crystalline polyester resin is generally a substrate excellent in resistance to radiation and suitable for the process film of the present invention.
- Inorganic filler used for resin layer (A) There is no restriction
- the inorganic filler used in the resin layer (A) is further coated with a silicone compound or a polyhydric alcohol based on the surface of the inorganic filler in order to improve dispersibility in the resin layer (A) made of polyorganosiloxane.
- a silicone compound or a polyhydric alcohol based on the surface of the inorganic filler in order to improve dispersibility in the resin layer (A) made of polyorganosiloxane.
- a silicone compound, an amine compound, a fatty acid, a fatty acid ester or the like can be used. Of these, those treated with silicone compounds (such as siloxane and silane coupling agents) are preferred.
- the inorganic filler used for the resin layer (A) it is preferable to use a material having a large refractive index difference from the polyorganosiloxane in consideration of the light reflectivity of the present coverlay film.
- those having a refractive index of 1.6 or more are preferable, and specifically, for example, among those described above, calcium carbonate, barium sulfate, zinc oxide, titanium oxide, titanate and the like can be mentioned, and titanium oxide is particularly preferable.
- Alumina is preferred from the viewpoint of increasing the reflectance in the low wavelength region.
- Titanium oxide has a significantly higher refractive index than other inorganic fillers, and can increase the difference in refractive index from polyorganosiloxane as the base resin, so it is less than when other fillers are used. It is preferable because excellent reflectivity can be obtained by the blending amount.
- a crystalline titanium oxide such as anatase type or rutile type is preferable, and in particular, from the viewpoint of increasing the difference in refractive index from the polyorganosiloxane, Rutile type titanium oxide is preferred.
- the coverlay film is also ultraviolet (nearly near). It is necessary to reflect light with a wavelength of 350 to 400 nm corresponding to the emission wavelength of the ultraviolet LED and to reflect light with a wavelength in the visible light region (400 to 800 nm).
- the anatase type with less light absorption is preferred.
- the production method of titanium oxide generally includes a chlorine method and a sulfuric acid method, but as the production method of titanium oxide used in the present invention, it is preferable to use titanium oxide produced by the chlorine method from the viewpoint of whiteness. .
- the titanium oxide is preferably one whose surface is coated with an inert inorganic oxide.
- an inert inorganic oxide By coating the surface of titanium oxide with an inert inorganic oxide, the photocatalytic activity of titanium oxide can be suppressed, and deterioration of the coverlay film of the present invention can be suppressed, which is preferable.
- the inert inorganic oxide specifically, for example, at least one selected from the group consisting of silica, alumina, and zirconia is preferably used. Use of these inert inorganic oxides is preferable because it can suppress a decrease in molecular weight and yellowing of the resin during high-temperature melting without impairing high reflectivity.
- the titanium oxide has at least one inorganic compound selected from the group consisting of a siloxane compound, a silane coupling agent, etc., a group consisting of a polyol, polyethylene glycol, etc., in order to enhance the dispersibility in the resin composition.
- a siloxane compound e.g., a silane coupling agent, etc.
- the particle size of the inorganic filler used for the resin layer (A) is arbitrary, and may be appropriately selected and determined according to the use and thickness of the coverlay film of the present invention. In general, a film having a particle size equal to or less than the thickness of the cover lay film is used. Specifically, for example, the average particle size is preferably 0.05 to 50 ⁇ m, more preferably 0.1 to 30 ⁇ m, and particularly preferably about 0. It is preferably 15 to 15 ⁇ m.
- the particle size of the inorganic filler is 0.05 ⁇ m to 50 ⁇ m because the dispersibility in the resin is good, the interface with the resin is densely formed, and high reflectivity can be imparted.
- the particle size is preferably 0.1 ⁇ m to 1.0 ⁇ m, and more preferably 0.2 ⁇ m to 0.5 ⁇ m. Is preferred. If the particle size of titanium oxide is in the above range, the dispersibility in the resin is good, the interface with the resin is densely formed, and high reflectivity can be imparted, which is preferable.
- the content of the inorganic filler used in the resin layer (A) is preferably 10 to 1000 parts by weight, more preferably 20 to 500 parts by weight, and more preferably 25 to 200 parts by weight with respect to 100 parts by weight of the polyorganosiloxane.
- the amount is preferably 30 to 100 parts by mass. Within this range, it is preferable because good reflection characteristics can be obtained and good reflection characteristics can be obtained even when the film thickness is reduced.
- the cover lay film includes a resin layer (B) containing a polyorganosiloxane and an inorganic filler different from the inorganic filler contained in the resin layer (A) separately from the resin layer (A). You can also.
- the resin layer (A) has a high reflectance in the visible light region (400 to 800 nm), and the resin layer (B) has a high reflectance in the ultraviolet (near ultraviolet) region (350 to 400 nm). It is possible to combine resin layers (A) and (B) having different actions such as forming layers.
- the polyorganosiloxane of the resin layer (B) is not particularly limited as in the case of the resin layer (A) described above, and any conventionally known one may be appropriately selected and determined. Moreover, the means similar to the resin layer (A) mentioned above can also be used for the polyorganosiloxane curing means.
- the inorganic filler used for the resin layer (B) is not particularly limited as long as it is an inorganic filler different from the inorganic filler contained in the resin layer (A).
- the inorganic filler used for the resin layer (B) is not particularly limited as long as it is an inorganic filler different from the inorganic filler contained in the resin layer (A).
- talc mica, mica, glass flake, boron nitride (BN), aluminum nitride, calcium carbonate, aluminum hydroxide, silica, titanate (potassium titanate, etc.), barium sulfate, alumina, kaolin, clay, titanium oxide,
- Examples thereof include zinc oxide, zinc sulfide, lead titanate, zircon oxide, antimony oxide, and magnesium oxide. These may be added singly or in combination of two or more.
- the inorganic filler used for the resin layer (A) is titanium oxide, particularly when it is rutile type titanium oxide, light absorption occurs in the ultraviolet (near ultraviolet) region (350 to 400 nm).
- the inorganic filler used in (B) it is preferable to select anatase-type titanium oxide or alumina that has low light absorption in the 400 nm region.
- the coverlay film comprising the resin layers (A) and (B) is used for the “substrate for mounting a light-emitting element” described later, anatase-type titanium oxide that absorbs less light in the 400 nm region as an inorganic filler.
- stack with a metal layer so that the resin layer (B) using an alumina may become a use surface (it may become the exposed side).
- light in the ultraviolet (near ultraviolet) region 350 to 400 nm
- light in the visible light region (400 to 800 nm) contains the resin layer (B) and rutile titanium oxide. Therefore, the reflectance can be increased in a wide wavelength region.
- the particle size of the inorganic filler used for the resin layer (B) is arbitrary, and may be appropriately selected and determined according to the use and thickness of the coverlay film of the present invention. In general, a film having a particle size equal to or less than the thickness of the cover lay film is used.
- the average particle size is preferably 0.05 to 50 ⁇ m, more preferably 0.1 ⁇ m or more and 30 ⁇ m or less. More preferably, it is 15 ⁇ m or more or 15 ⁇ m or less.
- the particle size of the inorganic filler is 0.05 ⁇ m to 50 ⁇ m because the dispersibility in the resin is good, the interface with the resin is densely formed, and high reflectivity can be imparted.
- the content of the inorganic filler used in the resin layer (B) is preferably 10 to 1000 parts by mass with respect to 100 parts by mass of the polyorganosiloxane, more preferably 20 parts by mass or more and 500 parts by mass or less, of which 30 parts by mass. Part or more or 300 parts by mass or less, more preferably 50 parts by mass or more or 200 parts by mass or less. Within this range, it is preferable because good reflection characteristics can be obtained and good reflection characteristics can be obtained even when the film thickness is reduced.
- the resin layer (A) and the resin layer (B) may contain various additives other than other resins and inorganic fillers as long as the properties are not impaired.
- a heat stabilizer, an ultraviolet absorber, a light stabilizer, a nucleating agent, a colorant, a lubricant, a flame retardant, and the like may be appropriately blended.
- the thickness of the cover lay film is not particularly limited and may be appropriately selected and determined. Generally, the thickness is 1 ⁇ m to 1000 ⁇ m, and in the present coverlay film, it is preferably 10 ⁇ m to 1000 ⁇ m. Among them, 10 ⁇ m to 800 ⁇ m, more preferably 20 ⁇ m to 500 ⁇ m, particularly 20 ⁇ m to 300 ⁇ m, and particularly preferably 30 ⁇ m to 200 ⁇ m are preferable. Further, when the effect of the present invention that the rate of decrease in reflectance is small is obtained in a high reflectance region, the thickness of the cover lay film is preferably 50 ⁇ m or more, particularly 100 ⁇ m, The upper limit is usually 1000 ⁇ m, preferably 500 ⁇ m.
- the thickness is sufficient to seal LED chips and gold wires.
- the method for preparing the resin composition for forming the resin layer (A) and the resin layer (B), that is, the resin composition for forming the resin layer containing polyorganosiloxane is not particularly limited.
- a known method can be used.
- a method of adjusting the concentration of the resin to be mixed and mechanically blending using a kneader or an extruder can be given.
- (b) a method in which various additives are mechanically blended directly with a resin to be used using a kneader, an extruder, or the like.
- a method of preparing and mixing the master batch (a) is preferable.
- a known film forming method for example, an extrusion cast using a T-die using a resin composition obtained by mixing polyorganosiloxane and an inorganic filler.
- examples thereof include a method of forming a film by a method, a calendering method, or a method of coating on a base film (PET film or the like). What is necessary is just to harden the polyorganosiloxane of an uncrosslinked state by heat curing, radiation curing, etc. for the film formed in this way.
- This cover lay film can be used as a cover lay film for protecting a conductor circuit of a printed wiring board.
- a conductor circuit is formed on a substrate, and this cover lay film is laminated on the conductor circuit, while a light emitting element is mounted on the substrate so that the conductor circuit and the light emitting element are electrically connected. can do.
- the coverlay film it is possible to prevent the conductor circuit from being damaged and disconnected, and to prevent a short circuit due to solder adhesion when the light emitting element is mounted.
- a light-emitting element mounting substrate (referred to as a “light-emitting element mounting substrate”) according to the second embodiment of the present invention includes a polyorganosiloxane and a substrate used for mounting at least one light-emitting element.
- a protective layer having a resin layer (A) containing an inorganic filler, the protective layer having an average reflectance of 85% or more at a wavelength of 400 to 800 nm, and a wavelength after heat treatment at 260 ° C. for 10 minutes;
- the light emitting element mounting substrate is characterized in that a reflectance reduction rate at 450 nm is 5% or less.
- the light emitting element mounting substrate is not particularly limited in the shape or material of the substrate or the like, and any conventionally known one can be used as long as the above-described conditions are satisfied.
- a substrate used for mounting a light emitting element is a resin / metal laminate in which a metal layer is laminated on at least one surface of a resin substrate material made of a thermosetting resin or a thermoplastic resin.
- a configuration in which a wiring pattern (conductor circuit) is formed on at least one surface of the resin substrate material can be exemplified.
- a protective layer having a resin layer containing a polyorganosiloxane and an inorganic filler having the above-mentioned specific properties is formed on such a “substrate used for mounting a light-emitting element”, that is, the above-mentioned book If a cover lay film is laminated
- Metal layer examples of the metal layer in the resin / metal laminate used for the light emitting element mounting substrate include copper, gold, silver, aluminum, nickel, tin, and the like.
- the thickness of the metal layer is arbitrary and may be selected and determined as appropriate, but is usually 1 ⁇ m to 100 ⁇ m, preferably 5 ⁇ m to 70 ⁇ m.
- copper and copper alloys are preferred as the metal species, and those having the surface subjected to chemical conversion treatment such as black oxidation treatment are preferred.
- a conductive foil that is a metal layer that has been chemically or mechanically roughened on the contact surface (surface to be overlapped) side with the coverlay film.
- Specific examples of the conductor foil that has been subjected to the surface roughening treatment include, for example, a roughened copper foil that has been electrochemically treated when an electrolytic copper foil is produced.
- the resin / metal laminate that is the substrate used for the light emitting element mounting substrate may be a laminate of a plurality.
- this lamination method a known method can be adopted as a heat fusion method without using an adhesive layer as long as it is a method by heating and pressurization.
- a heat press method, a heat laminating roll method, and extrusion are used.
- An extrusion laminating method in which the resin is laminated with a cast roll, or a method combining these can be suitably employed.
- a metal material such as a copper plate or an aluminum plate, aluminum nitride, or the like is used when more heat dissipation is required. It is also possible to improve heat dissipation by combining with a material having high thermal conductivity such as a ceramic or a graphite plate.
- the above-mentioned metal laminate is laminated on the entire surface of the aluminum plate, or a window frame for a cavity (recess) structure is removed from the metal laminate and laminated. If you want to.
- the aluminum to be used is preferably roughened in consideration of the adhesion to the resin, but when considering the cavity structure, in order to efficiently reflect the light from the LED, highly reflective aluminum is used. It is preferable to use it.
- Examples of the highly reflective aluminum include those whose surfaces have been polished, alumite-treated, and those treated with a reflection-reflecting film in which a metal such as silver is deposited in addition to inorganic oxides such as titanium and silica.
- the reflectance of aluminum is preferably 80% or more, and more preferably 90% or more, particularly 95% or more, with an average reflectance at a wavelength of 400 to 800 nm.
- the manufacturing method of this light emitting element mounting substrate is arbitrary, and is not particularly limited.
- a method for manufacturing a double-sided substrate in which metal layers are laminated on both sides of the substrate will be described with reference to FIG.
- a substrate (100) made of a thermoplastic resin or a thermosetting resin and two copper foils (10) to be a metal layer are prepared, and (b): A copper foil (10) is laminated on both sides of a substrate (100) made of a thermoplastic resin or a thermosetting resin by a vacuum press to produce a resin / metal laminate.
- the window cutting method is arbitrary and is not particularly limited. Specifically, for example, a method using a big die, a router processing method, a laser processing method, or the like can be used.
- the protective layer may be formed by applying a resin layer (30) containing polyorganosiloxane and an inorganic filler.
- a manufacturing method of the light emitting element mounting substrate as the aluminum composite substrate will be described with reference to FIG.
- FIG. 2 (a): a copper foil (10) is laminated on one side of a substrate (100) made of a thermoplastic resin or a thermosetting resin to produce a metal laminate. And (b): The copper foil (10) is etched to form a wiring pattern (20), gold plating is performed, and the substrate (100) is punched into a cavity frame using a big die (50).
- the method of punching into the cavity frame is not limited to the above method using the Bic die, and can be formed by, for example, router processing or laser.
- stacking of the film with a single-sided copper foil ((b) in FIG. 2), a protective layer, and an aluminum plate is performed collectively, these are laminated
- a conductor pattern may be formed.
- a conductive circuit is formed on the substrate for mounting the light emitting element, and the substrate and the light emission mounted on the substrate.
- the element is electrically connected and the light emitting element is sealed with resin.
- a conductor circuit is formed on a substrate, a protective layer is laminated on the conductor circuit, and the light emitting element on the substrate is mounted to make the conductor circuit and the light emitting element conductive, and the light emitting element.
- the protective layer in the light source device has the characteristics of the resin layer (A), for example, the average reflectance at a wavelength of 400 to 800 nm is 85% or more, and the wavelength is 450 nm after heat treatment at 260 ° C. for 10 minutes. In other words, the reflectance is decreased by 5% or less. Therefore, by forming the protective layer in this way, it becomes possible to effectively protect the conductor circuit, which causes a decrease in reflectivity even under high temperature heat load environment and light resistance test environment. Therefore, the light source device of the present invention can be used for various applications such as lighting, projector light sources, backlight devices such as liquid crystal display devices, in-vehicle applications, and mobile phone applications.
- Sheet generally refers to a product that is thin by definition in JIS and generally has a thickness that is small and flat for the length and width.
- film is compared to the length and width.
- a film having a thickness of 100 ⁇ m or more is sometimes referred to as a sheet, and a film having a thickness of less than 100 ⁇ m is sometimes referred to as a film.
- X is preferably greater than X” or “preferably Y”, with the meaning of “X to Y” unless otherwise specified. It also includes the meaning of “smaller”.
- X or more is an arbitrary number
- Y or less is an arbitrary number
- An integrating sphere is attached to a spectrophotometer ("U-4000", manufactured by Hitachi, Ltd.), and the reflectance when the reflectance of the alumina white plate is assumed to be 100% is measured at intervals of 0.5 nm over a wavelength range of 400 nm to 800 nm. It was measured. The average value of the measured values obtained was calculated, and this value was taken as the average reflectance. The average reflectance at a wavelength of 350 to 400 nm was measured in the same manner.
- the obtained white film was fixed with a fixing jig, heated in a hot air circulation oven at 260 ° C. for 10 minutes, the reflectance after the heat treatment was measured in the same manner as described above, and the reflectance at 450 nm was read. It was.
- the obtained coverlay film was temperature 63 ° C. (black panel temperature), humidity 50%, irradiance (295 to 400 nm) 60 W / m. 2 was irradiated for 50 hours, followed by measuring the above method as well as the reflectance was read reflectance at 450nm.
- Example 1 Resin obtained by mixing 100 parts by mass of polyorganosiloxane (TSE2571-5U, manufactured by Momentive) and 67 parts by mass of rutile type titanium oxide (R105, manufactured by DuPont, average particle size 0.31 ⁇ m) with a planetary mixer.
- a coverlay film precursor having a thickness of 100 ⁇ m was obtained on the release PET film at a set temperature of 100 ° C. using an extruder.
- cure by the irradiation dose of 50 kGy with a gamma ray was evaluated by the method mentioned above. The results are shown in Table 1.
- Example 2 1.5 parts by mass of a vulcanizing agent (TC-12, manufactured by Momentive) as a thermal crosslinking material and 100 parts by mass of polyorganosiloxane (TSE2571-5U, manufactured by Momentive), titanium oxide (R105, manufactured by DuPont) , Average particle size 0.31 ⁇ m)
- TC-12 vulcanizing agent
- TSE2571-5U polyorganosiloxane
- R105 titanium oxide
- Example 3 A coverlay film made of the resin layer (A) was prepared and evaluated in the same manner as in Example 1 except that the thickness was 300 ⁇ m. The results are shown in Table 1.
- Example 4 A coverlay film made of the resin layer (A) was produced and evaluated in the same manner as in Example 1 except that the titanium oxide was changed to 400 parts by mass. The results are shown in Table 1.
- Example 5 A coverlay film made of the resin layer (A) was prepared and evaluated in the same manner as in Example 1 except that the titanium oxide was changed to 25 parts by mass. The results are shown in Table 1.
- Example 6 A coverlay film made of the resin layer (A) was produced and evaluated in the same manner as in Example 1 except that the thickness was 50 ⁇ m. The results are shown in Table 1.
- Example 7 The resin layer (A) was prepared in the same manner as in Example 1 except that 25 parts by mass of anatase-type titanium oxide (SA-1, Sakai Chemical Industry Co., Ltd., average particle size: 0.3 ⁇ m) was used as titanium oxide. A coverlay film consisting of was prepared and evaluated. The results are shown in Table 1.
- SA-1 Sakai Chemical Industry Co., Ltd., average particle size: 0.3 ⁇ m
- Example 8 A coverlay film composed of the resin layer (A) was prepared and evaluated in the same manner as in Example 1 except that polyorganosiloxane (TSE2913-U, manufactured by Momentive) was used as the polyorganosiloxane. The results are shown in Table 1.
- Example 9 A cover lay film comprising a resin layer (A) in the same manner as in Example 1 except that 150 parts by mass of alumina (AA04, manufactured by Sumitomo Chemical Co., Ltd., average particle size 0.4 ⁇ m) was used instead of titanium oxide. Were made and evaluated. The results are shown in Table 1.
- Example 10 A coverlay film made of the resin layer (A) was prepared and evaluated in the same manner as in Example 8 except that the thickness was 150 ⁇ m. The results are shown in Table 1.
- Example 11 A coverlay film made of the resin layer (A) was prepared and evaluated in the same manner as in Example 9 except that the thickness was 150 ⁇ m. The results are shown in Table 1.
- Example 12 After obtaining a coverlay film precursor composed of a resin layer (A) having a thickness of 100 ⁇ m by the same method as in Example 8, the resin layer (B) having a thickness of 50 ⁇ m was obtained in the same manner as in Example 9. A coverlay film precursor was prepared, and the coverlay film surfaces of both precursors were bonded together, and then a coverlay film having a laminated structure cured with ⁇ rays was prepared and evaluated. The results are shown in Table 1. In addition, the measurement of the reflectance measured the surface which consists of a resin layer (B).
- Example 13 A coverlay film having a laminated structure was prepared and evaluated in the same manner as in Example 12 except that the thickness of the resin layer (B) was 100 ⁇ m. The results are shown in Table 1. In addition, the measurement of the reflectance measured the surface which consists of a resin layer (B).
- Example 1 to 8 and 10 since polyorganosiloxane was filled with titanium oxide, the reflectance was particularly high even in the visible light region (400 to 800 nm). Since Example 7 was filled with anatase-type titanium oxide, the reflectivity in the ultraviolet region was higher than that of Examples 1 to 6, 8, and 10 filled with rutile type.
- Example 12 and 13 by setting it as the laminated structure of the resin layer (A) which filled the polyorganosiloxane with the rutile type titanium oxide, and the resin layer (B) which filled the polyorganosiloxane with the alumina, High reflectivity was exhibited in both the ultraviolet light region (350 to 400 nm) and the visible light region (400 to 800 nm).
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Abstract
Description
この特許文献1には、熱可塑性樹脂組成物の結晶性を利用して、260℃以下の低温に加熱した際に、プリント配線板の表面との接着に適した特性を示し、比較的短時間で接着可能であり、且つ熱融着後には耐熱温度260℃を示すカバーレイフィルムが開示されている。 With respect to the above-mentioned problems, conventionally, for example, 5 to 100 inorganic fillers are added to 100 parts by mass of a resin composition comprising a polyaryl ketone resin having a crystal melting peak temperature of 260 ° C. or higher and an amorphous polyetherimide resin. By using a resin composition containing parts by mass, a coverlay film in which a decrease in reflectance is suppressed even under a high-temperature heat load environment or a light resistance test environment has been proposed (see, for example, Patent Document 1).
This Patent Document 1 shows characteristics suitable for adhesion to the surface of a printed wiring board when heated to a low temperature of 260 ° C. or lower by utilizing the crystallinity of a thermoplastic resin composition, and has a relatively short time. A cover lay film is disclosed that can be bonded together with a heat resistant temperature of 260 ° C. after heat sealing.
(耐光性試験);キセノンウェザーメータを用いて、温度63℃(ブラックパネル温度)、湿度50%、放射照度(295~400nm)60W/m2で50時間照射 In the first invention, it is preferable that the reflectance reduction rate at a wavelength of 450 nm after the light resistance test shown below is 5% or less.
(Light resistance test): Using a xenon weather meter, irradiation was performed at a temperature of 63 ° C. (black panel temperature), humidity of 50%, and irradiance (295 to 400 nm) of 60 W / m 2 for 50 hours.
また第1の発明においては、無機充填剤が酸化チタンであることが好ましい。 In the first invention, the resin layer is preferably cured by radiation.
In the first invention, the inorganic filler is preferably titanium oxide.
この際、前記樹脂層(B)に含まれる無機充填剤がアルミナであることが好ましい。 In the first invention, the resin layer (A), a polyorganosiloxane, and a resin layer (B) containing an inorganic filler different from the inorganic filler contained in the resin layer (A) are provided. It is preferable that
At this time, the inorganic filler contained in the resin layer (B) is preferably alumina.
前記保護層は、ポリオルガノシロキサン及び無機充填剤を含有する樹脂層(A)を備えた層であって、波長400~800nmにおける平均反射率が85%以上であり、かつ260℃で10分間熱処理した後の波長450nmにおける反射率の低下率が5%以下であることを特徴とする光源装置である。 According to a third aspect of the present invention, a conductor circuit is formed on a substrate, a protective layer is laminated on the conductor circuit, and the light emitting element on the substrate is mounted so that the conductor circuit and the light emitting element are electrically connected. And a light source device having a configuration in which the light emitting element is sealed with a resin.
The protective layer includes a resin layer (A) containing a polyorganosiloxane and an inorganic filler, has an average reflectance of 85% or more at a wavelength of 400 to 800 nm, and is heat-treated at 260 ° C. for 10 minutes. After that, the light source device is characterized in that the reflectance reduction rate at a wavelength of 450 nm is 5% or less.
本発明の第1の実施形態にかかるカバーレイフィルム(「本カバーレイフィルム」と称する)は、ポリオルガノシロキサン及び無機充填剤を含有する樹脂層(A)を備えており、波長400~800nmにおける平均反射率が85%以上であって、かつ260℃で10分間熱処理した後の波長450nmにおける反射率の低下率が5%以下であるプリント配線板の導体回路保護用のカバーレイフィルムである。 <This coverlay film>
The cover lay film according to the first embodiment of the present invention (referred to as “the present cover lay film”) includes a resin layer (A) containing a polyorganosiloxane and an inorganic filler, and has a wavelength of 400 to 800 nm. A coverlay film for protecting a conductor circuit of a printed wiring board having an average reflectance of 85% or more and a reduction rate of reflectance at a wavelength of 450 nm after heat treatment at 260 ° C. for 10 minutes is 5% or less.
上記のとおり、本カバーレイフィルムは、波長400~800nmにおける平均反射率が85%以上であることを必要とする。これは、可視光領域の反射率が高いほど、基板に搭載するLEDの輝度が高くなる傾向があり、上記範囲であれば、LED搭載向け基板のカバーレイフィルムとして好適に利用可能であるからである。かかる観点から、当該平均反射率は90%以上、特に95%以上であることが好ましい。 (Reflectance)
As described above, the coverlay film needs to have an average reflectance of 85% or more at a wavelength of 400 to 800 nm. This is because the higher the reflectance in the visible light region, the higher the luminance of the LED mounted on the substrate, and if it is in the above range, it can be suitably used as a coverlay film for the LED mounting substrate. is there. From this viewpoint, the average reflectance is preferably 90% or more, particularly 95% or more.
したがって、本カバーレイフィルムは、350~400nmの平均反射率が40%以上であることが好ましく、中でも60%以上、特に80%以上であることが好ましい。 In addition, when obtaining white light using a currently mainstream blue LED, a reflectance around 450 nm is important. Therefore, in order to obtain white light with higher color rendering properties, a type in which an ultraviolet (near ultraviolet) LED is combined with red, green, and blue phosphors has been developed. In that case, the coverlay film may reflect both light having a wavelength of 350 to 400 nm and light having a wavelength in the visible light region (400 to 800 nm), corresponding to the emission wavelength of the ultraviolet (near ultraviolet) LED. It becomes necessary.
Therefore, this cover lay film preferably has an average reflectance of 350 to 400 nm of 40% or more, more preferably 60% or more, and particularly preferably 80% or more.
また、紫外(近紫外)領域(350~400nm)と可視光領域(400~800nm)の双方の波長の反射率を高めるためには、それぞれの波長における反射率を付与するために好ましい添加剤をポリオルガノシロキサンに対して別々に配合し、それぞれの樹脂組成物からなる樹脂層を積層化させることも可能である。
但し、これらの方法に限定するものではない。 As a method for increasing the average reflectance at a wavelength of 400 to 800 nm, the reflectance at 450 nm, and the reflectance at a wavelength in the ultraviolet (near ultraviolet) region (350 to 400 nm) to a predetermined range, polyorganosiloxane An inorganic filler is contained in the resin layer (A) to form a resin layer (A), thereby obtaining extremely excellent reflection characteristics, and a method of appropriately adjusting the type and content of the inorganic filler to be used. Among these, when increasing the average reflectance at a wavelength of 400 to 800 nm and the reflectance at 450 nm, it is preferable to select titanium oxide as an inorganic filler from the viewpoint of a large difference in refractive index from polyorganosiloxane. On the other hand, when increasing the reflectance in the ultraviolet (near ultraviolet) region (350 to 400 nm), it is preferable to select alumina as the inorganic filler.
In order to increase the reflectance at both wavelengths in the ultraviolet (near ultraviolet) region (350 to 400 nm) and the visible light region (400 to 800 nm), preferred additives for imparting the reflectance at each wavelength are used. It is also possible to mix the polyorganosiloxane separately and to laminate the resin layers made of the respective resin compositions.
However, it is not limited to these methods.
本カバーレイフィルムは、260℃で10分間熱処理した後の波長450nmにおける反射率の低下率が、該熱処理前の反射率の5%以下であることを必要とする。 (Reduction rate of reflectivity after heat treatment)
This cover lay film requires that the reflectance reduction rate at a wavelength of 450 nm after heat treatment at 260 ° C. for 10 minutes is 5% or less of the reflectance before the heat treatment.
LED搭載基板を製造する際には、導電接着剤やエポキシ、シリコーン樹脂等の封止剤の熱硬化工程(100~200℃、数時間)、半田付け工程(Pbフリー半田リフロー、ピーク温度260℃、数分間)、ワイヤボンディング工程等、高熱負荷がかかる工程を経る必要がある。また、LEDを搭載した発光装置の使用環境下においても、高輝度LEDの開発が進み、基板への熱負荷は高まる傾向にあり、LED素子周辺温度は100℃超になる場合もある。そのため、今後このような高熱負荷環境下においても、変色することなく、高い反射率を維持することが重要になってきている。
また、波長450nmは青色LEDの平均波長である。 The grounds for the above conditions are described below.
When manufacturing an LED mounting substrate, a thermosetting process (100 to 200 ° C, several hours) of a sealing agent such as a conductive adhesive, epoxy or silicone resin, soldering process (Pb-free solder reflow, peak temperature 260 ° C) For several minutes), it is necessary to go through a process that requires a high thermal load, such as a wire bonding process. In addition, even in an environment where a light emitting device equipped with an LED is used, development of a high-brightness LED has progressed, the thermal load on the substrate tends to increase, and the LED element ambient temperature may exceed 100 ° C. Therefore, in the future, it will be important to maintain a high reflectance without discoloration even under such a high heat load environment.
Moreover, wavelength 450nm is an average wavelength of blue LED.
かかる観点から、当該低下率は、中でも4%以下であるのが好ましく、特に3%以下であるのがさらに好ましく、中でも特に2%以下であるのがさらに好ましい。 Therefore, if the reflectance decrease rate at a wavelength of 450 nm after heat treatment at 260 ° C. for 10 minutes is 5% or less of the reflectance before the heat treatment, it is possible to suppress the decrease in reflectance in the manufacturing process. In addition, since it is possible to suppress a decrease in reflectance during actual use, it can be suitably used for an LED mounting substrate.
From this viewpoint, the rate of decrease is preferably 4% or less, more preferably 3% or less, and particularly preferably 2% or less.
また、本カバーレイフィルムは、次の耐光性試験後の反射率の低下率が、耐光性試験前の反射率の5%以下であるのが好ましい。
(耐光性試験);キセノンウェザーメータを用いて、温度63℃(ブラックパネル温度)、湿度50%、放射照度(295~400nm)60W/m2で50時間照射。 (Reduction rate of reflectance after light resistance test)
Moreover, it is preferable that this cover-lay film has the reflectance decreasing rate after the next light resistance test of 5% or less of the reflectance before the light resistance test.
(Light resistance test): Irradiated with a xenon weather meter at a temperature of 63 ° C. (black panel temperature), a humidity of 50%, and an irradiance (295 to 400 nm) of 60 W / m 2 for 50 hours.
前述のように、LEDを搭載した発光装置の使用環境下においても、高輝度LEDの開発が進み、基板への耐光性の要求は高まる傾向にある。そこで、今後このような高出力の光が照射される環境下においても、変色することなく、高い反射率を維持することができる耐光性が必要になってくる。 The grounds for the above conditions are described below.
As described above, even under the usage environment of a light emitting device equipped with an LED, development of a high-brightness LED advances and the demand for light resistance on the substrate tends to increase. Therefore, in the future, it will be necessary to have light resistance capable of maintaining a high reflectance without being discolored even in an environment in which such high output light is irradiated.
かかる観点から、当該低下率は、中でも4%以下であるのが好ましく、特に3%以下であるのがさらに好ましく、中でも特に2%以下であるのがさらに好ましい。 Therefore, if the reflectance decrease rate after the light resistance test is 5% or less of the reflectance before the light resistance test, it is possible to suppress the decrease in reflectance during actual use. It can be suitably used for a mounting substrate.
From this viewpoint, the rate of decrease is preferably 4% or less, more preferably 3% or less, and particularly preferably 2% or less.
本カバーレイフィルムは、ポリオルガノシロキサン及び無機充填剤を含有する樹脂層(A)を備えるものである。 [Resin layer (A)]
This coverlay film is provided with a resin layer (A) containing a polyorganosiloxane and an inorganic filler.
具体的には、式(1)中「R」が全てメチル基であるポリジメチルシロキサンや、ポリジメチルシロキサンのメチル基の一部が上記炭化水素基又は上記ハロゲン置換炭化水素基の一種又は複数種によって置換された各種のポリオルガノシロキサンが挙げられる。
本カバーレイフィルムに用いるポリオルガノシロキサンとしては、上記のポリジメチルシロキサンや各種のポリアルキルシロキサンを単独、又は二種類以上混合して用いることができる。 Here, “R” in formula (1) represents an alkyl group such as a methyl group or an ethyl group, a hydrocarbon group such as a vinyl group or a phenyl group, or a halogen-substituted hydrocarbon group such as a fluoroalkyl group.
Specifically, polydimethylsiloxane in which “R” in formula (1) is all methyl groups, or a part of the methyl groups of polydimethylsiloxane is one or more of the above hydrocarbon groups or halogen-substituted hydrocarbon groups. And various polyorganosiloxanes substituted by.
As polyorganosiloxane used for this coverlay film, said polydimethylsiloxane and various polyalkylsiloxane can be used individually or in mixture of 2 or more types.
ポリオルガノシロキサンの硬化手段としては、付加型、縮合型、過酸化物硬化型等、従来公知の任意の方法から適宜選択して決定すればよい。 When forming the resin layer (A), the polyorganosiloxane resin may be cured.
The curing means for the polyorganosiloxane may be determined by appropriately selecting from any conventionally known methods such as addition type, condensation type, peroxide curing type and the like.
硬化触媒としては、例えば、アミノシラン系、ニッケル塩系、アンモニウム塩系の触媒が挙げられる。またAl、Fe、Co、Mn、Znなどのオクチル酸塩、ナフテン酸塩などの金属石鹸類、白金触媒なども挙げられる。 Examples of the method for curing the polyorganosiloxane include a method of adding a curing catalyst, a method of heating at a high temperature, a method of adding a crosslinking agent, and a crosslinking method by irradiation with radiation.
Examples of the curing catalyst include aminosilane-based, nickel salt-based, and ammonium salt-based catalysts. Moreover, metal soaps, such as octylate and naphthenate, such as Al, Fe, Co, Mn, and Zn, platinum catalyst, etc. are mentioned.
放射線による硬化(ポリオルガノシロキサンの架橋)は、ポリオルガノシロキサンに熱が加わらない方法であり、架橋材の残渣等による耐熱、耐光信頼性を損なう懸念がなく、本発明の効果が顕著となるので好ましい。 Especially, it is preferable to perform hardening of the resin layer (A) containing the polyorganosiloxane used for this coverlay film with a radiation.
Curing by radiation (crosslinking of the polyorganosiloxane) is a method in which heat is not applied to the polyorganosiloxane, and there is no fear of impairing the heat resistance and light resistance reliability due to the residue of the crosslinking material, and the effect of the present invention becomes remarkable. preferable.
前記樹脂層(A)に用いる無機充填剤としては、特に制限は無く、従来公知の任意のものを使用できる。例えばタルク、マイカ、雲母、ガラスフレーク、窒化ホウ素(BN)、窒化アルミ、炭酸カルシウム、水酸化アルミニウム、シリカ、チタン酸塩(チタン酸カリウム等)、硫酸バリウム、アルミナ、カオリン、クレー、酸化チタン、酸化亜鉛、硫化亜鉛、チタン酸鉛、酸化ジルコン、酸化アンチモン、酸化マグネシウム等が挙げられる。これらは1種類を単独で添加してもよく、2種類以上を組み合わせて添加してもよい。 [Inorganic filler used for resin layer (A)]
There is no restriction | limiting in particular as an inorganic filler used for the said resin layer (A), A conventionally well-known arbitrary thing can be used. For example, talc, mica, mica, glass flake, boron nitride (BN), aluminum nitride, calcium carbonate, aluminum hydroxide, silica, titanate (potassium titanate, etc.), barium sulfate, alumina, kaolin, clay, titanium oxide, Examples thereof include zinc oxide, zinc sulfide, lead titanate, zircon oxide, antimony oxide, and magnesium oxide. These may be added singly or in combination of two or more.
また、低波長域の反射率を高めることができる観点からは、アルミナが好ましい。 As the inorganic filler used for the resin layer (A), it is preferable to use a material having a large refractive index difference from the polyorganosiloxane in consideration of the light reflectivity of the present coverlay film. Among them, those having a refractive index of 1.6 or more are preferable, and specifically, for example, among those described above, calcium carbonate, barium sulfate, zinc oxide, titanium oxide, titanate and the like can be mentioned, and titanium oxide is particularly preferable. .
Alumina is preferred from the viewpoint of increasing the reflectance in the low wavelength region.
本カバーレイフィルムは、前記樹脂層(A)とは別に、ポリオルガノシロキサンと、樹脂層(A)に含まれる無機充填剤とは異なる無機充填剤とを含有する樹脂層(B)を備えることもできる。
例えば、樹脂層(A)を、可視光領域(400~800nm)において高反射率を有する層とし、樹脂層(B)を、紫外(近紫外)領域(350~400nm)において高反射率を有する層とするなど、異なる作用を有する樹脂層(A)(B)を組み合わせることができる。 [Resin layer (B)]
The cover lay film includes a resin layer (B) containing a polyorganosiloxane and an inorganic filler different from the inorganic filler contained in the resin layer (A) separately from the resin layer (A). You can also.
For example, the resin layer (A) has a high reflectance in the visible light region (400 to 800 nm), and the resin layer (B) has a high reflectance in the ultraviolet (near ultraviolet) region (350 to 400 nm). It is possible to combine resin layers (A) and (B) having different actions such as forming layers.
前記樹脂層(B)に用いる無機充填剤としては、前記樹脂層(A)に含まれる無機充填剤とは異なる無機充填剤であれば特に制限はない。例えばタルク、マイカ、雲母、ガラスフレーク、窒化ホウ素(BN)、窒化アルミ、炭酸カルシウム、水酸化アルミニウム、シリカ、チタン酸塩(チタン酸カリウム等)、硫酸バリウム、アルミナ、カオリン、クレー、酸化チタン、酸化亜鉛、硫化亜鉛、チタン酸鉛、酸化ジルコン、酸化アンチモン、酸化マグネシウム等が挙げられる。これらは1種類を単独で添加してもよく、2種類以上を組み合わせて添加してもよい。 [Inorganic filler used for resin layer (B)]
The inorganic filler used for the resin layer (B) is not particularly limited as long as it is an inorganic filler different from the inorganic filler contained in the resin layer (A). For example, talc, mica, mica, glass flake, boron nitride (BN), aluminum nitride, calcium carbonate, aluminum hydroxide, silica, titanate (potassium titanate, etc.), barium sulfate, alumina, kaolin, clay, titanium oxide, Examples thereof include zinc oxide, zinc sulfide, lead titanate, zircon oxide, antimony oxide, and magnesium oxide. These may be added singly or in combination of two or more.
前記樹脂層(A)および樹脂層(B)は、その性質を損なわない程度に、他の樹脂や無機充填剤以外の各種添加剤を含有してもよい。例えば、熱安定剤、紫外線吸収剤、光安定剤、核剤、着色剤、滑剤、難燃剤等を適宜配合してもよい。 (Additives, etc.)
The resin layer (A) and the resin layer (B) may contain various additives other than other resins and inorganic fillers as long as the properties are not impaired. For example, a heat stabilizer, an ultraviolet absorber, a light stabilizer, a nucleating agent, a colorant, a lubricant, a flame retardant, and the like may be appropriately blended.
本カバーレイフィルムの厚みは特に制限はなく、適宜選択して決定すればよい。一般的には1μm~1000μmであり、本カバーレイフィルムに於いては10μm~1000μmであることが好ましい。中でも10μm~800μm、さらには20μm~500μm、とりわけ20μm~300μm、特に30μm~200μmであることが好ましい。
また、本発明の効果である反射率の低下率が少ないという効果を高い反射率の領域に於いて求める場合には、本カバーレイフィルムの厚みを50μm以上、特に100μmとすることが好ましく、その上限は通常、1000μm、中でも500μmであることが好ましい。 (Thickness of coverlay film)
The thickness of the cover lay film is not particularly limited and may be appropriately selected and determined. Generally, the thickness is 1 μm to 1000 μm, and in the present coverlay film, it is preferably 10 μm to 1000 μm. Among them, 10 μm to 800 μm, more preferably 20 μm to 500 μm, particularly 20 μm to 300 μm, and particularly preferably 30 μm to 200 μm are preferable.
Further, when the effect of the present invention that the rate of decrease in reflectance is small is obtained in a high reflectance region, the thickness of the cover lay film is preferably 50 μm or more, particularly 100 μm, The upper limit is usually 1000 μm, preferably 500 μm.
前記樹脂層(A)および樹脂層(B)を形成するための樹脂組成物、すなわち、ポリオルガノシロキサンを含有する樹脂層を形成する樹脂組成物の調製方法としては、特に制限されるものではなく、公知の方法を用いることができる。例えば、(a)各種添加剤をポリオルガノシロキサンなどの適当なベース樹脂に高濃度(代表的な含有量としては10~90重量%)に混合したマスターバッチを別途作製しておき、これを使用する樹脂に濃度を調整して混合し、ニーダーや押出機等を用いて機械的にブレンドする方法を挙げることができる。また、(b)使用する樹脂に直接各種添加剤をニーダーや押出機等を用いて機械的にブレンドする方法などを挙げることができる。
これらの方法の中では、分散性や作業性の点から、(a)のマスターバッチを作製して混合する方法が好ましい。 (Coverlay film manufacturing method)
The method for preparing the resin composition for forming the resin layer (A) and the resin layer (B), that is, the resin composition for forming the resin layer containing polyorganosiloxane is not particularly limited. A known method can be used. For example, (a) A master batch in which various additives are mixed with a suitable base resin such as polyorganosiloxane at a high concentration (typically 10 to 90% by weight) is prepared separately and used. A method of adjusting the concentration of the resin to be mixed and mechanically blending using a kneader or an extruder can be given. In addition, (b) a method in which various additives are mechanically blended directly with a resin to be used using a kneader, an extruder, or the like.
Among these methods, from the viewpoint of dispersibility and workability, a method of preparing and mixing the master batch (a) is preferable.
このように成膜したフィルムを、熱硬化や放射線硬化等により未架橋状態のポリオルガノシロキサンを硬化させればよい。 Next, as a method of forming the resin composition, a known film forming method, for example, an extrusion cast using a T-die using a resin composition obtained by mixing polyorganosiloxane and an inorganic filler. Examples thereof include a method of forming a film by a method, a calendering method, or a method of coating on a base film (PET film or the like).
What is necessary is just to harden the polyorganosiloxane of an uncrosslinked state by heat curing, radiation curing, etc. for the film formed in this way.
本カバーレイフィルムは、プリント配線基板の導体回路保護用のカバーレイフィルムとして使用することができる。例えば、基板上に導体回路を形成し、前記導体回路上に本カバーレイフィルムを積層する一方、前記基板上に発光素子を搭載して前記導体回路と当該発光素子とを導通させるようにして使用することができる。この際、当該カバーレイフィルムを積層することで、導体回路に傷が入って断線するのを防止することができると共に、発光素子を実装する際のはんだ付着による短絡を防止することができ、さらには、電源端子部に指などが触れて感電するのを防止するなどの機能を発揮することができる。 (Application of coverlay film)
This cover lay film can be used as a cover lay film for protecting a conductor circuit of a printed wiring board. For example, a conductor circuit is formed on a substrate, and this cover lay film is laminated on the conductor circuit, while a light emitting element is mounted on the substrate so that the conductor circuit and the light emitting element are electrically connected. can do. At this time, by laminating the coverlay film, it is possible to prevent the conductor circuit from being damaged and disconnected, and to prevent a short circuit due to solder adhesion when the light emitting element is mounted. Can exhibit functions such as preventing a finger from touching the power terminal portion and receiving an electric shock.
本発明の第2の実施形態に係る発光素子搭載用基板(「本発光素子搭載用基板」と称する)は、少なくとも1つ以上の発光素子を搭載するために用いる基板上に、ポリオルガノシロキサン及び無機充填剤を含有する樹脂層(A)を有する保護層を備え、該保護層は、波長400~800nmにおける平均反射率が85%以上であって、かつ260℃で10分間熱処理した後の波長450nmにおける反射率の低下率が5%以下であることを特徴とする発光素子搭載用基板である。 <Substrate for mounting this light emitting element>
A light-emitting element mounting substrate (referred to as a “light-emitting element mounting substrate”) according to the second embodiment of the present invention includes a polyorganosiloxane and a substrate used for mounting at least one light-emitting element. A protective layer having a resin layer (A) containing an inorganic filler, the protective layer having an average reflectance of 85% or more at a wavelength of 400 to 800 nm, and a wavelength after heat treatment at 260 ° C. for 10 minutes; The light emitting element mounting substrate is characterized in that a reflectance reduction rate at 450 nm is 5% or less.
本発光素子搭載用基板に用いる樹脂/金属積層体における金属層としては、例えば金属種としては銅、金、銀、アルミニウム、ニッケル、錫等が挙げられる。また金属層の厚さは任意で有り、適宜選択して決定すればよいが、通常1μm~100μm、中でも好ましくは5μm~70μmである。 (Metal layer)
Examples of the metal layer in the resin / metal laminate used for the light emitting element mounting substrate include copper, gold, silver, aluminum, nickel, tin, and the like. The thickness of the metal layer is arbitrary and may be selected and determined as appropriate, but is usually 1 μm to 100 μm, preferably 5 μm to 70 μm.
本発光素子搭載用基板の製造方法は任意であり、特に制限されるものではない。ここでは先ず、本発光素子搭載用基板の具体的な製造方法として、基板の両面に金属層を積層してなる両面基板の製造方法を、図1に基づいて説明する。 (Manufacturing method of light emitting element mounting substrate)
The manufacturing method of this light emitting element mounting substrate is arbitrary, and is not particularly limited. Here, first, as a specific method for manufacturing the light emitting element mounting substrate, a method for manufacturing a double-sided substrate in which metal layers are laminated on both sides of the substrate will be described with reference to FIG.
例えば、図2に示すように、(a):熱可塑性樹脂又は熱硬化性樹脂からなる基板(100)の片面に銅箔(10)を積層して金属積層体を製造する。そして(b):銅箔(10)をエッチングして配線パターン(20)を形成し金メッキ加工を施し、さらに基板(100)をビク型を用いてキャビティー枠に打ち抜く(50)。 Next, a manufacturing method of the light emitting element mounting substrate as the aluminum composite substrate will be described with reference to FIG.
For example, as shown in FIG. 2, (a): a copper foil (10) is laminated on one side of a substrate (100) made of a thermoplastic resin or a thermosetting resin to produce a metal laminate. And (b): The copper foil (10) is etched to form a wiring pattern (20), gold plating is performed, and the substrate (100) is punched into a cavity frame using a big die (50).
本発明の第3の実施形態に係る光源装置(「本光源装置」と称する)としては、上記の本発光素子搭載用基板に導体回路を形成して、該基板と該基板に搭載された発光素子とを導通させ、該発光素子を樹脂封止してなるものであれば特に制限されるものではない。具体的には、基板上に導体回路を形成し、該導体回路上に保護層を積層すると共に、前記基板上発光素子を搭載して前記導体回路と前記発光素子とを導通させ、該発光素子を樹脂封止してなる構成のものを挙げることができる。 <Light source device>
As a light source device according to the third embodiment of the present invention (referred to as “the present light source device”), a conductive circuit is formed on the substrate for mounting the light emitting element, and the substrate and the light emission mounted on the substrate. There is no particular limitation as long as the element is electrically connected and the light emitting element is sealed with resin. Specifically, a conductor circuit is formed on a substrate, a protective layer is laminated on the conductor circuit, and the light emitting element on the substrate is mounted to make the conductor circuit and the light emitting element conductive, and the light emitting element The thing of the structure formed by resin-sealing can be mentioned.
一般的に「シート」とは、JISにおける定義上、薄く、一般にその厚さが長さと幅のわりには小さく平らな製品をいい、一般的に「フィルム」とは、長さ及び幅に比べて厚さが極めて小さく、最大厚さが任意に限定されている薄い平らな製品で、通常、ロールの形で供給されるものをいう(日本工業規格JISK6900)。例えば厚さに関して言えば、狭義では100μm以上のものをシートと称し、100μm未満のものをフィルムと称すことがある。しかし、シートとフィルムの境界は定かでなく、本発明において文言上両者を区別する必要がないので、本発明においては、「フィルム」と称する場合でも「シート」を含むものとし、「シート」と称する場合でも「フィルム」を含むものとする。 <Explanation of words>
“Sheet” generally refers to a product that is thin by definition in JIS and generally has a thickness that is small and flat for the length and width. In general, “film” is compared to the length and width. A thin flat product having an extremely small thickness and an arbitrarily limited maximum thickness, usually supplied in the form of a roll (Japanese Industrial Standard JISK6900). For example, in terms of thickness, in the narrow sense, a film having a thickness of 100 μm or more is sometimes referred to as a sheet, and a film having a thickness of less than 100 μm is sometimes referred to as a film. However, since the boundary between the sheet and the film is not clear and it is not necessary to distinguish the two in terms of the present invention, in the present invention, even when the term “film” is used, the term “sheet” is included and the term “sheet” is used. In some cases, “film” is included.
また、「X以上」(Xは任意の数字)或いは「Y以下」(Yは任意の数字)と表現した場合、「Xより大きいことが好ましい」或いは「Y未満であることが好ましい」旨の意図も包含する。 In the present specification, when expressed as “X to Y” (X and Y are arbitrary numbers), “X is preferably greater than X” or “preferably Y”, with the meaning of “X to Y” unless otherwise specified. It also includes the meaning of “smaller”.
In addition, when expressed as “X or more” (X is an arbitrary number) or “Y or less” (Y is an arbitrary number), it is “preferably greater than X” or “preferably less than Y”. Includes intentions.
なお、本明細書中に示されるフィルム等についての種々の測定値及び評価は以下のようにして求めた。 Hereinafter, it demonstrates further more concretely by an Example and a comparative example. However, the present invention is not limited to the following examples unless it exceeds the gist.
In addition, the various measured values and evaluation about the film etc. which are shown in this specification were calculated | required as follows.
分光光度計(「U-4000」、株式会社日立製作所社製)に積分球を取りつけ、アルミナ白板の反射率が100%としたときの反射率を、波長400nm~800nmにわたって、0.5nm間隔で測定した。得られた測定値の平均値を計算し、この値を平均反射率とした。そして波長350~400nmの平均反射率も同様に測定した。 (Average reflectance)
An integrating sphere is attached to a spectrophotometer ("U-4000", manufactured by Hitachi, Ltd.), and the reflectance when the reflectance of the alumina white plate is assumed to be 100% is measured at intervals of 0.5 nm over a wavelength range of 400 nm to 800 nm. It was measured. The average value of the measured values obtained was calculated, and this value was taken as the average reflectance. The average reflectance at a wavelength of 350 to 400 nm was measured in the same manner.
得られた白色フィルムを固定冶具で固定し、熱風循環式オーブンに、260℃で10分間加熱処理し、加熱処理後の反射率を上記の方法と同様に測定して、450nmにおける反射率を読みとった。 (Reflectance after heat treatment)
The obtained white film was fixed with a fixing jig, heated in a hot air circulation oven at 260 ° C. for 10 minutes, the reflectance after the heat treatment was measured in the same manner as described above, and the reflectance at 450 nm was read. It was.
得られたカバーレイフィルムをスガ試験機社製のキセノンウェザーメータ(型式:SX-75)を用いて、温度63℃(ブラックパネル温度)、湿度50%、放射照度(295~400nm)60W/m2で50時間照射し、その後上記の方法と同様に反射率を測定し、450nmにおける反射率を読みとった。 (Test with xenon weather meter)
Using the xenon weather meter (model: SX-75) manufactured by Suga Test Instruments Co., Ltd., the obtained coverlay film was temperature 63 ° C. (black panel temperature),
ポリオルガノシロキサン(TSE2571-5U、モメンティブ社製)100質量部と、ルチル型の酸化チタン(R105、デュポン社製、平均粒径0.31μm)67質量部をプラネタリミキサーで混合して得られた樹脂組成物を、押出機を用いて設定温度100℃で、離型PETフィルム上に厚さ100μmのカバーレイフィルム前駆体を得た。その後、γ線により50kGyの照射線量にて硬化させて得られた樹脂層(A)からなるカバーレイフィルムを、上述した方法により評価した。結果を表1に記した。 <Example 1>
Resin obtained by mixing 100 parts by mass of polyorganosiloxane (TSE2571-5U, manufactured by Momentive) and 67 parts by mass of rutile type titanium oxide (R105, manufactured by DuPont, average particle size 0.31 μm) with a planetary mixer. A coverlay film precursor having a thickness of 100 μm was obtained on the release PET film at a set temperature of 100 ° C. using an extruder. Then, the coverlay film which consists of a resin layer (A) obtained by making it harden | cure by the irradiation dose of 50 kGy with a gamma ray was evaluated by the method mentioned above. The results are shown in Table 1.
ポリオルガノシロキサン(TSE2571-5U、モメンティブ社製)100質量部に対して熱架橋材としての加硫剤(TC-12、モメンティブ社製)を1.5質量部、酸化チタン(R105、デュポン社製、平均粒径0.31μm)67質量部をプラネタリミキサーで混合して得られた樹脂組成物を、押出機を用いて設定温度100℃で、離型PETフィルム上に厚さ100μmのカバーレイフィルム前駆体を得た。その後、125℃にて15分間、次いで200℃にて4時間熱処理することにより硬化させて得られた樹脂層(A)からなるカバーレイフィルムを、評価した。結果を表1に記した。 <Example 2>
1.5 parts by mass of a vulcanizing agent (TC-12, manufactured by Momentive) as a thermal crosslinking material and 100 parts by mass of polyorganosiloxane (TSE2571-5U, manufactured by Momentive), titanium oxide (R105, manufactured by DuPont) , Average particle size 0.31 μm) A cover lay film having a thickness of 100 μm on a release PET film with a resin composition obtained by mixing 67 parts by mass with a planetary mixer at a set temperature of 100 ° C. using an extruder. A precursor was obtained. Then, the coverlay film which consists of the resin layer (A) obtained by making it heat-process at 125 degreeC for 15 minutes and then heat-treating at 200 degreeC for 4 hours was evaluated. The results are shown in Table 1.
厚さを300μmとした以外は、実施例1と同様の方法にて樹脂層(A)からなるカバーレイフィルムを作製し、評価した。結果を表1に記した。 <Example 3>
A coverlay film made of the resin layer (A) was prepared and evaluated in the same manner as in Example 1 except that the thickness was 300 μm. The results are shown in Table 1.
酸化チタンを400質量部とした以外は、実施例1と同様の方法にて樹脂層(A)からなるカバーレイフィルムを作製し、評価した。結果を表1に記した。 <Example 4>
A coverlay film made of the resin layer (A) was produced and evaluated in the same manner as in Example 1 except that the titanium oxide was changed to 400 parts by mass. The results are shown in Table 1.
酸化チタンを25質量部とした以外は、実施例1と同様の方法にて樹脂層(A)からなるカバーレイフィルムを作製し、評価した。結果を表1に記した。 <Example 5>
A coverlay film made of the resin layer (A) was prepared and evaluated in the same manner as in Example 1 except that the titanium oxide was changed to 25 parts by mass. The results are shown in Table 1.
厚さ50μmとした以外は、実施例1と同様の方法にて樹脂層(A)からなるカバーレイフィルムを作製し、評価した。結果を表1に記した。 <Example 6>
A coverlay film made of the resin layer (A) was produced and evaluated in the same manner as in Example 1 except that the thickness was 50 μm. The results are shown in Table 1.
酸化チタンとして、アナターゼ型の酸化チタン(SA-1、堺化学工業社製、平均粒径0.3μm)25質量部を用いた以外は、実施例1と同様の方法にて樹脂層(A)からなるカバーレイフィルムを作製し、評価した。結果を表1に記した。 <Example 7>
The resin layer (A) was prepared in the same manner as in Example 1 except that 25 parts by mass of anatase-type titanium oxide (SA-1, Sakai Chemical Industry Co., Ltd., average particle size: 0.3 μm) was used as titanium oxide. A coverlay film consisting of was prepared and evaluated. The results are shown in Table 1.
ポリオルガノシロキサンとして、ポリオルガノシロキサン(TSE2913-U、モメンティブ社製)を用いた以外は、実施例1と同様の方法にて樹脂層(A)からなるカバーレイフィルムを作製し、評価した。結果を表1に記した。 <Example 8>
A coverlay film composed of the resin layer (A) was prepared and evaluated in the same manner as in Example 1 except that polyorganosiloxane (TSE2913-U, manufactured by Momentive) was used as the polyorganosiloxane. The results are shown in Table 1.
酸化チタンに代えて、アルミナ(AA04、住友化学社製、平均粒径0.4μm)150質量部を用いた以外は、実施例1と同様の方法にて樹脂層(A)からなるカバーレイフィルムを作製し、評価した。結果を表1に記した。 <Example 9>
A cover lay film comprising a resin layer (A) in the same manner as in Example 1 except that 150 parts by mass of alumina (AA04, manufactured by Sumitomo Chemical Co., Ltd., average particle size 0.4 μm) was used instead of titanium oxide. Were made and evaluated. The results are shown in Table 1.
厚みを150μmとした以外は、実施例8と同様の方法にて樹脂層(A)からなるカバーレイフィルムを作製し、評価した。結果を表1に記した。 <Example 10>
A coverlay film made of the resin layer (A) was prepared and evaluated in the same manner as in Example 8 except that the thickness was 150 μm. The results are shown in Table 1.
厚みを150μmとした以外は、実施例9と同様の方法にて樹脂層(A)からなるカバーレイフィルムを作製し、評価した。結果を表1に記した。 <Example 11>
A coverlay film made of the resin layer (A) was prepared and evaluated in the same manner as in Example 9 except that the thickness was 150 μm. The results are shown in Table 1.
実施例8と同様の方法にて、厚さ100μmの樹脂層(A)からなるカバーレイフィルム前駆体を得た後、実施例9と同様の方法にて厚さ50μmの樹脂層(B)からなるカバーレイフィルム前駆体を作成し、両前駆体のカバーレイフィルム面を貼りあわせた後、γ線で硬化させた積層構成によるカバーレイフィルムを作製し、評価した。結果を表1に記した。なお、反射率の測定は樹脂層(B)からなる面を測定した。 <Example 12>
After obtaining a coverlay film precursor composed of a resin layer (A) having a thickness of 100 μm by the same method as in Example 8, the resin layer (B) having a thickness of 50 μm was obtained in the same manner as in Example 9. A coverlay film precursor was prepared, and the coverlay film surfaces of both precursors were bonded together, and then a coverlay film having a laminated structure cured with γ rays was prepared and evaluated. The results are shown in Table 1. In addition, the measurement of the reflectance measured the surface which consists of a resin layer (B).
樹脂層(B)の厚さを100μmとした以外は、実施例12と同様の方法にて積層構成によるカバーレイフィルムを作製し、評価した。結果を表1に記した。なお、反射率の測定は樹脂層(B)からなる面を測定した。 <Example 13>
A coverlay film having a laminated structure was prepared and evaluated in the same manner as in Example 12 except that the thickness of the resin layer (B) was 100 μm. The results are shown in Table 1. In addition, the measurement of the reflectance measured the surface which consists of a resin layer (B).
ポリエーテルエーテルケトン樹脂(PEEK450G、Tm=335℃)40質量%、及び非晶性ポリエーテルイミド樹脂(Ultem 1000)60質量%からなる樹脂組成物100質量部に対して、ルチル型の酸化チタン(R108、デュポン社製、平均粒径0.23μm)67質量部を混合して得られた組成物を溶融混練し、Tダイを備えた押出機を用いて設定温度380℃で、厚さ100μmのカバーレイフィルムを作製し、実施例1と同様に評価した。結果を表1に記した。 <Comparative Example 1>
For 100 parts by mass of a resin composition comprising 40% by mass of a polyether ether ketone resin (PEEK450G, Tm = 335 ° C.) and 60% by mass of an amorphous polyetherimide resin (Ultem 1000), a rutile type titanium oxide ( R108, manufactured by DuPont, average particle size of 0.23 μm) 67 parts by mass was melt-kneaded, and using an extruder equipped with a T-die at a set temperature of 380 ° C. and a thickness of 100 μm A coverlay film was prepared and evaluated in the same manner as in Example 1. The results are shown in Table 1.
20 配線パターン
30 ポリオルガノシロキサン及び無機充填剤を含有する樹脂層
40 ボンディングワイヤ
100 熱可塑性樹脂又は熱硬化性樹脂からなる基板
200 保護層
300 LED
400 アルミ板 10
400 aluminum plate
Claims (10)
- ポリオルガノシロキサン及び無機充填剤を含有する樹脂層(A)を備えており、波長400~800nmにおける平均反射率が85%以上であって、かつ260℃で10分間熱処理した後の波長450nmにおける反射率の低下率が5%以下であるプリント配線板の導体回路保護用のカバーレイフィルム。 A resin layer (A) containing polyorganosiloxane and an inorganic filler is provided, the average reflectance at a wavelength of 400 to 800 nm is 85% or more, and the reflection at a wavelength of 450 nm after heat treatment at 260 ° C. for 10 minutes. A coverlay film for protecting a conductor circuit of a printed wiring board having a rate of decrease of 5% or less.
- 以下に示す耐光性試験後の反射率の低下率が5%以下であることを特徴とする請求項1記載のカバーレイフィルム。
(耐光性試験);キセノンウェザーメータを用いて、温度63℃(ブラックパネル温度)、湿度50%、放射照度(295~400nm)60W/m2で50時間照射。 The coverlay film according to claim 1, wherein the reflectance reduction rate after the light resistance test shown below is 5% or less.
(Light resistance test): Irradiated with a xenon weather meter at a temperature of 63 ° C. (black panel temperature), a humidity of 50%, and an irradiance (295 to 400 nm) of 60 W / m 2 for 50 hours. - 前記樹脂層(A)が放射線により硬化してなる層であることを特徴とする請求項1又は2記載のカバーレイフィルム。 The cover lay film according to claim 1 or 2, wherein the resin layer (A) is a layer formed by curing with radiation.
- 前記樹脂層(A)に含まれる無機充填剤が酸化チタンであることを特徴とする請求項1~3のいずれかに記載のカバーレイフィルム。 The coverlay film according to any one of claims 1 to 3, wherein the inorganic filler contained in the resin layer (A) is titanium oxide.
- フィルムの厚みが30μm~500μmであることを特徴とする請求項1~4のいずれかに記載のカバーレイフィルム。 5. The cover lay film according to claim 1, wherein the film has a thickness of 30 μm to 500 μm.
- 波長350~400nmにおける平均反射率が40%以上であることを特徴とする請求項1~5のいずれかに記載のカバーレイフィルム。 6. The coverlay film according to claim 1, wherein an average reflectance at a wavelength of 350 to 400 nm is 40% or more.
- 前記樹脂層(A)と、ポリオルガノシロキサン、及び、樹脂層(A)に含まれる無機充填剤とは異なる無機充填剤を含有する樹脂層(B)とを備えてなることを特徴とする請求項1~6のいずれかに記載のカバーレイフィルム。 The resin layer (A), a polyorganosiloxane, and a resin layer (B) containing an inorganic filler different from the inorganic filler contained in the resin layer (A) are provided. Item 7. The coverlay film according to any one of Items 1 to 6.
- 前記樹脂層(B)に含まれる無機充填剤がアルミナであることを特徴とする請求項7に記載のカバーレイフィルム。 The coverlay film according to claim 7, wherein the inorganic filler contained in the resin layer (B) is alumina.
- 少なくとも1つ以上の発光素子を搭載するために用いる基板上に、ポリオルガノシロキサン及び無機充填剤を含有する樹脂層(A)を有する保護層を形成してなる構成を備え、
該保護層は、波長400~800nmにおける平均反射率が85%以上であり、かつ260℃で10分間熱処理した後の波長450nmにおける反射率の低下率が5%以下であることを特徴とする発光素子搭載用基板。 Comprising a structure in which a protective layer having a resin layer (A) containing polyorganosiloxane and an inorganic filler is formed on a substrate used for mounting at least one light-emitting element;
The protective layer has an average reflectance of 85% or more at a wavelength of 400 to 800 nm, and a reduction rate of the reflectance at a wavelength of 450 nm after heat treatment at 260 ° C. for 10 minutes is 5% or less. Device mounting board. - 基板上に導体回路を形成し、該導体回路上に保護層を積層すると共に、前記基板上に発光素子を搭載して前記導体回路と前記発光素子とを導通させ、該発光素子を樹脂封止してなる構成を備えた光源装置において、
前記保護層は、ポリオルガノシロキサン及び無機充填剤を含有する樹脂層(A)を備えた層であって、波長400~800nmにおける平均反射率が85%以上であり、かつ260℃で10分間熱処理した後の波長450nmにおける反射率の低下率が5%以下であることを特徴とする光源装置。
A conductor circuit is formed on the substrate, a protective layer is laminated on the conductor circuit, and a light emitting element is mounted on the substrate to make the conductor circuit and the light emitting element conductive, and the light emitting element is sealed with resin. In the light source device having a configuration formed by
The protective layer includes a resin layer (A) containing a polyorganosiloxane and an inorganic filler, has an average reflectance of 85% or more at a wavelength of 400 to 800 nm, and is heat-treated at 260 ° C. for 10 minutes. After that, the light source device is characterized in that the reflectance decrease rate at a wavelength of 450 nm is 5% or less.
Priority Applications (3)
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KR1020147024910A KR20140130161A (en) | 2012-02-10 | 2013-02-06 | Coverlay film, printed wiring board to be equipped with light-emitting element, and light source device |
JP2013557536A JP5676785B2 (en) | 2012-02-10 | 2013-02-06 | Cover-lay film, light-emitting element mounting substrate, and light source device |
CN201380004632.9A CN104025726A (en) | 2012-02-10 | 2013-02-06 | Coverlay film, printed wiring board to be equipped with light-emitting element, and light source device |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016103576A (en) * | 2014-11-28 | 2016-06-02 | 三菱樹脂株式会社 | Silicone sheet containing fluorescent body and light-emitting device |
JP2018060989A (en) * | 2016-10-04 | 2018-04-12 | 日本特殊陶業株式会社 | Frame member, light-emitting device, and manufacturing method thereof |
JP2018085368A (en) * | 2016-11-21 | 2018-05-31 | 日本特殊陶業株式会社 | Lid member, light emitting device using the same, and manufacturing method of the same |
WO2019084423A1 (en) * | 2017-10-26 | 2019-05-02 | Ahmad Syed Taymur | Composition comprising non-newtonian fluids for hydrophobic, oleophobic, and oleophilic coatings, and methods of using the same |
CN110800118A (en) * | 2017-06-29 | 2020-02-14 | 京瓷株式会社 | Circuit board and light-emitting device provided with same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111919519B (en) * | 2018-04-12 | 2024-01-12 | 三菱电机株式会社 | Printed circuit board covered with protective film and method for manufacturing the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11327150A (en) * | 1998-03-17 | 1999-11-26 | Mitsubishi Chemical Corp | Positive photoresist composition |
JP2005120155A (en) * | 2003-10-14 | 2005-05-12 | Shin Etsu Chem Co Ltd | Silicone rubber composition for protecting electrode circuit, electrode circuit-protecting material and electric/electronic part |
JP2009302110A (en) * | 2008-06-10 | 2009-12-24 | Mitsubishi Plastics Inc | Cover ray film |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4460524B2 (en) * | 2005-11-14 | 2010-05-12 | 信越化学工業株式会社 | Radiation curable silicone rubber composition |
KR101174063B1 (en) * | 2007-11-29 | 2012-08-13 | 미쓰비시 쥬시 가부시끼가이샤 | Metal laminated body, led-mounted substrate, and white film |
JP5108825B2 (en) * | 2009-04-24 | 2012-12-26 | 信越化学工業株式会社 | Silicone resin composition for optical semiconductor device and optical semiconductor device |
-
2013
- 2013-02-06 WO PCT/JP2013/052685 patent/WO2013118752A1/en active Application Filing
- 2013-02-06 JP JP2013557536A patent/JP5676785B2/en active Active
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11327150A (en) * | 1998-03-17 | 1999-11-26 | Mitsubishi Chemical Corp | Positive photoresist composition |
JP2005120155A (en) * | 2003-10-14 | 2005-05-12 | Shin Etsu Chem Co Ltd | Silicone rubber composition for protecting electrode circuit, electrode circuit-protecting material and electric/electronic part |
JP2009302110A (en) * | 2008-06-10 | 2009-12-24 | Mitsubishi Plastics Inc | Cover ray film |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016103576A (en) * | 2014-11-28 | 2016-06-02 | 三菱樹脂株式会社 | Silicone sheet containing fluorescent body and light-emitting device |
JP2018060989A (en) * | 2016-10-04 | 2018-04-12 | 日本特殊陶業株式会社 | Frame member, light-emitting device, and manufacturing method thereof |
JP2018085368A (en) * | 2016-11-21 | 2018-05-31 | 日本特殊陶業株式会社 | Lid member, light emitting device using the same, and manufacturing method of the same |
CN110800118A (en) * | 2017-06-29 | 2020-02-14 | 京瓷株式会社 | Circuit board and light-emitting device provided with same |
CN110800118B (en) * | 2017-06-29 | 2022-10-28 | 京瓷株式会社 | Circuit board and light-emitting device provided with same |
WO2019084423A1 (en) * | 2017-10-26 | 2019-05-02 | Ahmad Syed Taymur | Composition comprising non-newtonian fluids for hydrophobic, oleophobic, and oleophilic coatings, and methods of using the same |
JP2021501250A (en) * | 2017-10-26 | 2021-01-14 | サイド・タイムール・アフマド | Compositions containing non-Newtonian fluids for hydrophobic, oleophilic and lipophilic coatings, and how to use them |
US11149150B2 (en) | 2017-10-26 | 2021-10-19 | Actnano, Inc. | Composition comprising non-newtonian fluids for hydrophobic, oleophobic, and oleophilic coatings, and methods of using the same |
JP7104161B2 (en) | 2017-10-26 | 2022-07-20 | サイド・タイムール・アフマド | Compositions containing non-Newtonian fluids for hydrophobic, oleophilic and lipophilic coatings, and how to use them |
JP2022106729A (en) * | 2017-10-26 | 2022-07-20 | サイド・タイムール・アフマド | Composition containing non-newtonian fluid for hydrophobic, oleophobic and lipophilic coating, and method for using the same |
US11603472B2 (en) | 2017-10-26 | 2023-03-14 | Actnano, Inc. | Method of coating a printed circuit board with a viscoelastic or non-Newtonian coating |
US11603473B2 (en) | 2017-10-26 | 2023-03-14 | Actnano, Inc. | Electronic device comprising a conformal viscoelastic or non-Newtonian coating |
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KR20140130161A (en) | 2014-11-07 |
JP5676785B2 (en) | 2015-02-25 |
CN104025726A (en) | 2014-09-03 |
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