CN110139465A - A kind of high current pcb board - Google Patents
A kind of high current pcb board Download PDFInfo
- Publication number
- CN110139465A CN110139465A CN201910244125.1A CN201910244125A CN110139465A CN 110139465 A CN110139465 A CN 110139465A CN 201910244125 A CN201910244125 A CN 201910244125A CN 110139465 A CN110139465 A CN 110139465A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- current
- silk
- voltage great
- top layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides a kind of high current pcb board, pcb board ontology, high-voltage great-current cabling, top layer solder mask, bottom solder mask, top layer silk-screen coating, bottom silk-screen coatings；High-voltage great-current cabling is set on the pcb board ontology；Safety insulation distance is provided between high-voltage great-current cabling；Top layer solder mask coats the one side that pcb board ontology is provided with high-voltage great-current cabling completely, and coats the high-voltage great-current cabling completely；Bottom solder mask coats pcb board ontology backwards to the one side of high-voltage great-current cabling completely；Top layer silk-screen coating coats top layer solder mask backwards to the one side of pcb board ontology completely；Bottom silk-screen coating coats the bottom solder mask backwards to the one side of the pcb board ontology completely；The top layer silk-screen coating and bottom silk-screen coating all have certain thickness.The cost of manufacture for not only having guaranteed pcb board performance but also having controlled pcb board can be realized using the technical program.
Description
Technical field
The present invention relates to technical field of PCB board, in particular to a kind of high current pcb boards.
Background technique
Currently, component number is more with the development of PCB technology, power is high, and board size is limited, and application environment is severe,
Cost and circuit performance requirement are high, so that PCB design is full of challenge everywhere.It needs to design on limited pcb board body more
Component, and have the route design requirement of high-voltage great-current, meet severe application environment again, safety insulation distance is very
It is high.To solve this problem, PCB design person is often forced to increase design layout, or selects special plate, and it is thick to increase dielectric
Degree increases pcb board layer number to meet the PCB design demand of high current high power density.So, design cost is difficult to drop
Low and circuit performance is also impacted.
Summary of the invention
The purpose of the present invention is to provide a kind of high current pcb board, realization had not only guaranteed pcb board performance but also had controlled pcb board
Cost of manufacture.
In order to solve the above-mentioned technical problems, the present invention provides a kind of high current pcb board, pcb board ontologies, high-voltage great-current
Cabling, top layer solder mask, bottom solder mask, top layer silk-screen coating, bottom silk-screen coating；The high-voltage great-current cabling is set to
On the pcb board ontology；Safety insulation distance is provided between the high-voltage great-current cabling；The top layer solder mask wraps completely
The one side that the pcb board ontology is provided with high-voltage great-current cabling is covered, and coats the high-voltage great-current cabling completely；The bottom
Layer solder mask coats the pcb board ontology backwards to the one side of the high-voltage great-current cabling completely；The top layer silk-screen coating is complete
The top layer solder mask is coated entirely backwards to the one side of the pcb board ontology；The bottom silk-screen coating coats the bottom completely
One side of the solder mask backwards to the pcb board ontology；The top layer silk-screen coating and bottom silk-screen coating are with certain thickness
Silk-screen coating.
In a preferred embodiment, the high-voltage great-current cabling includes the first high-voltage great-current cabling, the second high pressure
High current cabling.
In a preferred embodiment, it is arranged between the first high-voltage great-current cabling and the second high-voltage great-current cabling
There is safety insulation distance 7.
In a preferred embodiment, the component character mark of the top layer silk-screen coating and bottom silk-screen coating is handled
At negative film.
In a preferred embodiment, the pcb board solder mask is made of solder resist material.
Compared to the prior art, technical solution of the present invention have it is following the utility model has the advantages that
The present invention provides a kind of high current pcb boards, high using the good pressure-resistant reduced performance high current of silk-screen coating
The safety insulation distance of power density high-voltage great-current cabling, the in a limited space interior utilization rate for improving the pcb board space of a whole page and increasing
Big current-carrying capacity.Without using special plate, increase plate layer insulation dielectric thickness, or increases pcb board layer number, it can maximum journey
Degree reduces cost.
Detailed description of the invention
Fig. 1 is a kind of overall structure diagram of high current pcb board in the preferred embodiment of the present invention；
Fig. 2 is a kind of overall structure side sectional view of high current pcb board in the preferred embodiment of the present invention.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
A kind of high current pcb board, referring to figs. 1 to 2, including pcb board ontology 1, high-voltage great-current cabling, top layer solder mask 3,
Bottom solder mask 4, top layer silk-screen coating 5, bottom silk-screen coating 6；Specifically, the pcb board ontology 1 be high-voltage great-current and
The limited pcb board of the higher board size of device density.The high-voltage great-current cabling is set on the pcb board ontology 1；It is described
Safety insulation distance is provided between high-voltage great-current cabling；The top layer solder mask 3 coats the pcb board ontology 1 completely and sets
It is equipped with the one side of high-voltage great-current cabling, and coats the high-voltage great-current cabling completely；The bottom solder mask 4 cladding completely
One side of the pcb board ontology 1 backwards to the high-voltage great-current cabling；The top layer silk-screen coating 5 coats the top layer completely
One side of the solder mask 3 backwards to the pcb board ontology 1；The bottom silk-screen coating 6 coats the bottom solder mask 4 backwards completely
The one side of the pcb board ontology 1；The top layer silk-screen coating 5 and bottom silk-screen coating 6 are to apply with certain thickness silk-screen
Material, makes it have higher resistance to pressure.The higher pressure resistance of silk-screen coating of the top layer silk-screen coating 5 and bottom silk-screen coating 6
Property can reduce the safety insulation distance of high pressure cabling.The reduction safety insulation distance can make full use of limited space increase to walk
Line area meets the needs of high current high power density plate high current.The results show is by the thickness of pressure-resistant dope layer 0.2mm
Stress levels can be improved a grade.
Specifically, the high-voltage great-current cabling is walked including the first high-voltage great-current cabling 21, the second high-voltage great-current
Line 22, high-voltage great-current cabling are the more demanding high current cabling of safety insulation distance.First high-voltage great-current is walked
Safety insulation distance 7 is provided between line 21 and the second high-voltage great-current cabling 22.The top layer silk-screen coating 5 and bottom silk-screen
The component character mark of coating 6 is processed into negative word, thus no longer needs to the silk-screen layer that setting is used to do character mark.It is described
Pcb board solder mask is made of solder resist material.
The present invention provides a kind of high current pcb boards, high using the good pressure-resistant reduced performance high current of silk-screen coating
The safety insulation distance of power density high-voltage great-current cabling, the in a limited space interior utilization rate for improving the pcb board space of a whole page and increasing
Big current-carrying capacity.Without using special plate, increase plate layer insulation dielectric thickness, or increases pcb board layer number, it can maximum journey
Degree reduces cost.
The foregoing is only a preferred embodiment of the present invention, but the design concept of the present invention is not limited to this,
Anyone skilled in the art in the technical scope disclosed by the present invention, using this design carries out the present invention non-
Substantive change belongs to the behavior for invading the scope of the present invention.
Claims (5)
1. a kind of high current pcb board, which is characterized in that pcb board ontology, high-voltage great-current cabling, top layer solder mask, bottom welding resistance
Layer, top layer silk-screen coating, bottom silk-screen coating；The high-voltage great-current cabling is set on the pcb board ontology；The high pressure
Safety insulation distance is provided between high current cabling；The top layer solder mask coats the pcb board ontology completely and is provided with height
The one side of high current cabling is pressed, and coats the high-voltage great-current cabling completely；The bottom solder mask coats the PCB completely
One side of the plate ontology backwards to the high-voltage great-current cabling；The top layer silk-screen coating coats the top layer solder mask backwards completely
The one side of the pcb board ontology；The bottom silk-screen coating coats the bottom solder mask backwards to the pcb board ontology completely
On one side；The top layer silk-screen coating and bottom silk-screen coating are with certain thickness silk-screen coating.
2. a kind of high current pcb board according to claim 1, which is characterized in that the high-voltage great-current cabling includes the
One high-voltage great-current cabling, the second high-voltage great-current cabling.
3. a kind of high current pcb board according to claim 2, which is characterized in that the first high-voltage great-current cabling with
Safety insulation distance 7 is provided between second high-voltage great-current cabling.
4. a kind of high current pcb board according to claim 1, which is characterized in that the top layer silk-screen coating and bottom silk
The component character mark of print coating is processed into negative film.
5. a kind of high current pcb board according to claim 1, which is characterized in that the pcb board solder mask is by solder resist material
It is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910244125.1A CN110139465A (en) | 2019-03-28 | 2019-03-28 | A kind of high current pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910244125.1A CN110139465A (en) | 2019-03-28 | 2019-03-28 | A kind of high current pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110139465A true CN110139465A (en) | 2019-08-16 |
Family
ID=67568768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910244125.1A Pending CN110139465A (en) | 2019-03-28 | 2019-03-28 | A kind of high current pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110139465A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201577235U (en) * | 2009-12-11 | 2010-09-08 | 深南电路有限公司 | Printed circuit board |
| CN202857135U (en) * | 2012-11-05 | 2013-04-03 | 广东欧珀移动通信有限公司 | Short circuit prevention type printed circuit board |
| CN203040010U (en) * | 2013-01-16 | 2013-07-03 | 遂宁市英创力电子科技有限公司 | High-thickness solder mask circuit board |
| CN105491809A (en) * | 2015-12-22 | 2016-04-13 | 广东生益科技股份有限公司 | Printed circuit board (PCB) production process and PCB |
| CN205883697U (en) * | 2016-05-30 | 2017-01-11 | 深圳市宇盛光电有限公司 | A circuit board for transmitting heavy current |
| CN106535490A (en) * | 2016-07-22 | 2017-03-22 | 无锡深南电路有限公司 | Ultra-thick copper printed board and solder resisting processing method |
| CN206932458U (en) * | 2016-12-27 | 2018-01-26 | 台达电子电源(东莞)有限公司 | Wiring board |
| CN108012443A (en) * | 2017-11-29 | 2018-05-08 | 惠州市特创电子科技有限公司 | A kind of wiring board welding resistance printing method |
-
2019
- 2019-03-28 CN CN201910244125.1A patent/CN110139465A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201577235U (en) * | 2009-12-11 | 2010-09-08 | 深南电路有限公司 | Printed circuit board |
| CN202857135U (en) * | 2012-11-05 | 2013-04-03 | 广东欧珀移动通信有限公司 | Short circuit prevention type printed circuit board |
| CN203040010U (en) * | 2013-01-16 | 2013-07-03 | 遂宁市英创力电子科技有限公司 | High-thickness solder mask circuit board |
| CN105491809A (en) * | 2015-12-22 | 2016-04-13 | 广东生益科技股份有限公司 | Printed circuit board (PCB) production process and PCB |
| CN205883697U (en) * | 2016-05-30 | 2017-01-11 | 深圳市宇盛光电有限公司 | A circuit board for transmitting heavy current |
| CN106535490A (en) * | 2016-07-22 | 2017-03-22 | 无锡深南电路有限公司 | Ultra-thick copper printed board and solder resisting processing method |
| CN206932458U (en) * | 2016-12-27 | 2018-01-26 | 台达电子电源(东莞)有限公司 | Wiring board |
| CN108012443A (en) * | 2017-11-29 | 2018-05-08 | 惠州市特创电子科技有限公司 | A kind of wiring board welding resistance printing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190816 |
|
| RJ01 | Rejection of invention patent application after publication |