CN206149586U - Pcb board and terminal equipment - Google Patents
Pcb board and terminal equipment Download PDFInfo
- Publication number
- CN206149586U CN206149586U CN201621166941.3U CN201621166941U CN206149586U CN 206149586 U CN206149586 U CN 206149586U CN 201621166941 U CN201621166941 U CN 201621166941U CN 206149586 U CN206149586 U CN 206149586U
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- China
- Prior art keywords
- pcb board
- hole
- layer
- conductive layer
- voltage signal
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Links
- 230000004888 barrier function Effects 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 2
- 239000012092 media component Substances 0.000 claims 1
- 238000002955 isolation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000004247 hand Anatomy 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Abstract
The utility model provides a PCB board and terminal equipment includes: N layer conducting layer and M layer insulating layer, the conducting layer with insulating layer cascade arrangement, just the insulating layer sets up between per two adjacent conducting layers, seted up the through -hole on at least i layer conducting layer and the i layer insulating layer, the high pressure signal line sets up in the conducting layer of through -hole below, and be located position department under the through -hole, the low pressure signal line sets up in the conducting layer of seting up the through -hole, wherein, N and M are for being greater than 2 positive integer, i <= N, i <= M. From this, realize reducing among the PCB high pressure signal and to the interference of low pressure signal, improved the complete machine performance.
Description
Technical field
The application is related to PCB design technical field, more particularly to a kind of PCB printed circuit board (PCB)s（Printed Circuit
Board, abbreviation PCB）And terminal unit.
Background technology
Cabling in PCB (Printed Circuit Board) plate potentially includes high voltage signal line and low voltage signal
Line, for example, dodge the high voltage signal line of existing high pressure on charging circuit plate, while also have low voltage signal line, or even also USB resistances
Antinoise signal, together with its high voltage signal line is walked with low voltage signal line, the earth signal isolation of centre only, thus, climbing
Not enough, high voltage signal is adjacent with the low voltage signal near it to form height pressure reduction to electrical distance, and high voltage signal can pass through
Pcb board material interferes with low voltage signal line, and then has influence on the performance of whole machine.
Utility model content
The application is intended at least to solve to a certain extent one of technical problem in correlation technique.
For this purpose, first purpose of the application is to propose a kind of pcb board, the pcb board can reduce high pressure letter on pcb board
Interference number and low-voltage signal between, it is ensured that signal quality and safety.
Second purpose of the application is to propose a kind of terminal unit.
It is that, up to above-mentioned purpose, the application first aspect embodiment proposes a kind of pcb board, including：N shell conductive layer and M shell
Insulating barrier, the conductive layer and the insulating barrier arranged stacked, and the insulating barrier be arranged at the adjacent conductive layer of each two it
Between；
At least through hole is offered on i layers conductive layer and i layer insulatings, high-voltage signal line is arranged on leading below the through hole
In electric layer and at the location directly below of the through hole, low-voltage signal line is arranged in the conductive layer for offering through hole；Its
In, N and M is the positive integer more than 2, i≤N, i≤M.
The pcb board of the embodiment of the present application, due to opening up through hole on pcb board, by high-voltage signal line through hole lower section is arranged on
Conductive layer in, and positioned at the underface of through hole, low-voltage signal line is located in the conductive layer for offering through hole, as a result,
High-voltage signal can spatially form a signal isolation with low-voltage signal by through hole, reduce high-voltage signal to low-voltage signal
Interference, improve the signal quality and stability transmitted on whole pcb board.
In the application some embodiments, further, the through hole is at least opened in ground floor conductive layer and ground floor
On insulating barrier.
In the application some embodiments, further, the through hole be opened in ground floor conductive layer, the first insulating barrier,
On second layer conductive layer and the second layer insulating.
In the application some embodiments, further, the cross sectional dimensions of the through hole are along the thickness side of the pcb board
To equal everywhere.
In the application some embodiments, optionally, the thickness direction of the cross sectional dimensions of the through hole along the pcb board
It is gradually reduced from outside to inside.
In the application some embodiments, further, the conductive layer is copper sheet conductive layer.
In the application some embodiments, further, the through hole is shaped as strip bending.
In the application some embodiments, further, in the top layer and bottom of the pcb board conductive layer is.
In the application some embodiments, further, the N=4, the M=3.
It is that, up to above-mentioned purpose, the application second aspect embodiment proposes a kind of terminal unit, including housing, and below
One or more assemblies：Processor, memorizer, power circuit, multimedia groupware, audio-frequency assembly, input/output（I/O）Connect
Mouthful, sensor cluster, and communication component, the power circuit, for for each circuit of the terminal unit or device confession
Electricity；The memorizer is used to store executable program code；The processor is by holding for storing in the reading memorizer
Line program code also includes as also included such as the application first aspect running program corresponding with the executable program code
Described pcb board, the pcb board is arranged on the interior volume that the housing is surrounded, and the processor and the memorizer are arranged
On the pcb board.
The terminal unit of the embodiment of the present application, due to including above-mentioned pcb board, opens up through hole, by high pressure on pcb board
Holding wire is arranged in the conductive layer below through hole, and positioned at the underface of through hole, low-voltage signal line is located at and offers through hole
Conductive layer in, as a result, high-voltage signal and low-voltage signal can spatially form a signal isolation by through hole, subtract
Few interference of the high-voltage signal to low-voltage signal, improves the signal quality and stability transmitted on whole pcb board, improves whole machine
Energy.
Additional aspect of the present utility model and advantage will be set forth in part in the description, partly will be from explained below
In become obvious, or by it is of the present utility model practice recognize.
Description of the drawings
The above-mentioned and/or additional aspect of this utility model and advantage from the following description of the accompanying drawings of embodiments will
Become obvious and easy to understand, wherein：
Fig. 1 is the structural representation of the pcb board of the application one embodiment；
Fig. 2 is the structural representation of the pcb board of another embodiment of the application；
Fig. 3 is the structural representation of the pcb board of the further embodiment of the application；
Fig. 4 is the top view of the pcb board of the embodiment of the present application；
Fig. 5 is the structural representation of the terminal unit of the embodiment of the present application.
Specific embodiment
Embodiments herein is described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the application, and it is not intended that the restriction to the application.
Below with reference to the accompanying drawings the pcb board and terminal unit of the embodiment of the present application are described.
Fig. 1 is the structural representation of the pcb board of the application one embodiment；As shown in figure 1, the pcb board 1100 includes：N
Layer conductive layer and M shell insulating barrier, conductive layer and insulating barrier arranged stacked, and insulating barrier be arranged at the adjacent conductive layer of each two it
Between；At least offer through hole on i layers conductive layer and i layer insulatings, high-voltage signal line be arranged in the conductive layer below through hole and
At the location directly below of through hole, low-voltage signal line is arranged in the conductive layer for offering through hole；Wherein, N and M be more than
2 positive integer, i≤N, i≤M.
Specifically, in the present embodiment, N=4, M=3, i.e. the pcb board can include four layers of conductive layer and three-layer insulated layer.
For example as shown in figure 1, four layers of conductive layer can be included（11、12、13、14）, and three-layer insulated layer（21、22、23）, each is exhausted
Edge layer can be arranged on as shown in Figure 1 between each two conductive layer, and the top layer and bottom of whole pcb board can be conductive layer,
Such as top layer in Fig. 1 is conductive layer 11, and bottom is conductive layer 14.
It is understood that the quantity and thickness of conductive layer and insulating barrier integrally determine the thickness of pcb board, and pcb board
Thickness can further affect the intensity of pcb board, therefore, the quantity and thickness of conductive layer and insulating barrier can be according to the realities of product
Border needs and design, for example, on the basis of the intensity of guarantee pcb board meets the requirements, according to the actual volume size of product with
And the conductive layer and the quantity and thickness of insulating barrier of lightening requirement Design PCB plate, spy is not in the application the present embodiment
Do not limit.
Preferably, in the present embodiment, each conductive layer（11、12、13、14）It can be copper sheet conductive layer.
Through hole is offered at least i-th layer conductive layer and the i-th layer insulating.For example, can be in the conductive layer 11 of ground floor
The top layer of pcb board is opened in through hole 30, i.e. through hole 30 is opened up on the insulating barrier 21 of ground floor.Or, it is also possible in the second layer
Conductive layer 12 and the second layer insulating barrier 22 on open up through hole, i.e. through hole 30 and be opened in the inside of pcb board.Whole pcb board
Through hole is opened up on the layer of part, so that can form groove on whole pcb board, high-voltage signal line is arranged in leading below through hole
In electric layer and at the location directly below of through hole, i.e. so that high-voltage signal line is arranged in a groove.
Certainly, those skilled in the art can also according to actual needs select the position that opens up of through hole 30, and be not limited to this
Above-mentioned the provided position of through hole 30 of embodiment.In the present embodiment, because signal is in transmitting procedure, impedance is there is, it is special
It is not that the heat that high-voltage signal transmitting procedure is produced is especially apparent, can so causes whole pcb board heating serious.It is therefore preferable that
, the pcb board of the present embodiment at least can open up through hole 30 on the conductive layer 11 of ground floor and the insulating barrier 21 of ground floor, such as
This one, because through hole is at least opened on the top layer of pcb board, can be conducive to dissipating the heat produced by high-voltage signal
Heat, improves the service life of whole pcb board.
In addition, it is necessary to explanation, the quantity that opens up of the through hole on whole pcb board can be for multiple, and multiple through holes can be with
The dispersed placement on pcb board, the present embodiment is not limited.
The pcb board that the embodiment of the present application is provided, due to opening up through hole on pcb board, by high-voltage signal line through hole is arranged on
In the conductive layer of lower section, and positioned at the underface of through hole, low-voltage signal line is located in the conductive layer for offering through hole, thus,
Allow high-voltage signal spatially to form a signal isolation by through hole with low-voltage signal, reduce high-voltage signal to low pressure
The interference of signal, improves the signal quality and stability transmitted on whole pcb board.Further, since high-voltage signal line is in through hole institute
In the recessed grain for being formed, it is possible thereby to effectively reduce staff causes what is got an electric shock because encountering high-voltage signal line by mistake when operation
Risk, improves Consumer's Experience.
Further, in the above-described embodiments, as shown in figure 1, the cross sectional dimensions of through hole can be along the thickness side of pcb board
To equal everywhere, consequently, it is possible to can as far as possible ensure that the high-voltage signal line positioned at the lower section of through hole 30 offers through hole 30 with being located at
Conductive layer on low-voltage signal line reduce high in place of the projection of the thickness direction of pcb board does not have overlap, to the full extent
Impact of the pressure signal to low-voltage signal, it is ensured that signal transmission quality.
The shape of through hole can arbitrarily set, and such as through hole 30 can be a square opening, an or cylindrical hole, ability
The shape of the through hole that field technique personnel can open up according to required for selecting in degree easy to process and in the consideration of cost, this
Embodiment is not limited.
Fig. 2 is the structural representation of the pcb board of another embodiment of the application.As shown in Fig. 2 the present embodiment with it is above-mentioned
Unlike embodiment, through hole 30 may also extend through the conductive layer 12 of the second layer and the insulating barrier 22 of the second layer, i.e. can be
Through hole is opened up on the conductive layer 12 of the insulating barrier 21, second layer of one layer of conductive layer 11, ground floor and the insulating barrier 22 of the second layer
30, consequently, it is possible to further increase the depth of through hole, be more beneficial for signal isolation ensure signal transmission quality and
The radiating effect of pcb board.
Fig. 3 be the application Fig. 3 be the application further embodiment pcb board structural representation.As shown in figure 3, this
Embodiment is similar to the above embodiments, unlike the embodiments above, and the cross sectional dimensions of through hole 30 can be along the thickness of pcb board
Degree direction is gradually reduced from outside to inside.
As shown in figure 3, such as through hole 30 can be reverse taper hole, thus, it is possible to so that positioned at the height of the lower section of through hole 30
Pressure holding wire be located at offer low-voltage signal line on the conductive layer of through hole 30 the thickness direction of pcb board projection absolutely not
Overlap part is had, interference of the high-voltage signal to low-voltage signal is prevented to a greater extent, improve signal quality with stablizing for transmitting
Property.
Certainly, similar to the above embodiments, the shape of through hole 30 can arbitrarily set, and the present embodiment is not repeated.
In addition, Fig. 4 is the top view of the pcb board of the embodiment of the present application；As shown in figure 4, being opened in the embodiment of the present application
The shape of the through hole 30 on pcb board 1100 can be strip bending, thus, it is possible to obtain in the limited sky of pcb board as far as possible
Between area of dissipation at upper plus large through-hole 30, improve the radiating efficiency of whole pcb board 1100.
Fig. 5 is the structural representation of the terminal unit of the embodiment of the present application.As shown in figure 5, the present embodiment provides a kind of whole
End equipment, the terminal unit 1000 includes housing 1001, and following one or more assemblies：Processor 1002, memorizer
1003, power circuit 1004, multimedia groupware 1005, audio-frequency assembly 1006, input/output（I/O）Interface 1007, sensor
Component 1008, and communication component 1009, power circuit 1004 is used to be powered for each circuit or device of terminal unit 1000；
Memorizer 1003 is used to store executable program code；The executable journey that processor 1002 passes through storage in reading memorizer 1003
Sequence code also includes the pcb board provided such as above-mentioned any embodiment running program corresponding with executable program code
1100, pcb board 1100 is arranged on the interior volume that housing 1001 is surrounded, and processor 1002 and memorizer 1003 are arranged on pcb board
On 1100.
Terminal unit in the present embodiment can be computer or mobile phone.
The structure of the pcb board of terminal unit in the present embodiment is same as described above, will not be described here.
The terminal unit that this utility model embodiment is provided, due to including above-mentioned pcb board, opens up logical on pcb board
Hole, high-voltage signal line is arranged in the conductive layer below through hole, and positioned at the underface of through hole, low-voltage signal line is located at out
In being provided with the conductive layer of through hole, as a result, high-voltage signal can spatially form a letter with low-voltage signal by through hole
Number isolation, reduces interference of the high-voltage signal to low-voltage signal, improves the signal quality and stability transmitted on whole pcb board, tool
It has been improved overall performance.Also, because high-voltage signal line is in the recessed grain that through hole is formed, it is possible thereby to effectively reduce people
Handss cause the risk got an electric shock when operation because encountering high-voltage signal line by mistake, improve Consumer's Experience.
In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " horizontal ", " length ", " width
Degree ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ",
The orientation or position relationship of the instruction such as " clockwise ", " counterclockwise ", " axial direction ", " radial direction ", " circumference " is based on shown in the drawings
Orientation or position relationship, are for only for ease of description this utility model and simplify description, rather than indicate or imply the dress of indication
Put or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this utility model
Restriction.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In description of the present utility model, " multiple " are meant that two or two
More than, unless otherwise expressly limited specifically.
In this utility model, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. term should be interpreted broadly, it is for example, it may be fixedly connected, or be detachably connected or integral；Can be
Be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two element internals connection or two elements it is mutual
Interactively.For the ordinary skill in the art, can as the case may be understand that above-mentioned term is new in this practicality
Concrete meaning in type.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score
Can be the first and second feature directly contacts, or the first and second features are by intermediary mediate contact.
In description of the present utility model, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means to combine specific features, structure, material or spy that the embodiment or example are described
Point is contained at least one embodiment of the application or example.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.And, the specific features of description, structure, material or feature can be with office
Combine in an appropriate manner in one or more embodiments or example.Additionally, in the case of not conflicting, the skill of this area
Art personnel can be tied the feature of the different embodiments or example described in this specification and different embodiments or example
Close and combine.
Finally it should be noted that：Various embodiments above is only illustrating the technical solution of the utility model, rather than it is limited
System；Although being described in detail to this utility model with reference to foregoing embodiments, one of ordinary skill in the art should
Understand：It still can modify to the technical scheme described in foregoing embodiments, either to which part or whole
Technical characteristic carries out equivalent；And these are changed or are replaced, the essence for not making appropriate technical solution departs from this practicality newly
The scope of each embodiment technical scheme of type.
Claims (10)
1. a kind of pcb board, it is characterised in that include：N shell conductive layer and M shell insulating barrier, the conductive layer and the insulation are layer by layer
Laying up is put, and the insulating barrier is arranged between the adjacent conductive layer of each two；
At least through hole is offered on i layers conductive layer and i layer insulatings, high-voltage signal line is arranged on the conductive layer below the through hole
In and at the location directly below of the through hole, low-voltage signal line is arranged in the conductive layer for offering through hole；Wherein, N
It is the positive integer more than 2 with M, i≤N, i≤M.
2. pcb board according to claim 1, it is characterised in that the through hole is at least opened in ground floor conductive layer and
On one layer insulating.
3. pcb board according to claim 2, it is characterised in that the through hole is opened in ground floor conductive layer, the first insulation
On layer, second layer conductive layer and the second layer insulating.
4. pcb board according to claim 3, it is characterised in that thickness of the cross sectional dimensions of the through hole along the pcb board
Degree direction is equal everywhere.
5. pcb board according to claim 3, it is characterised in that thickness of the cross sectional dimensions of the through hole along the pcb board
Degree direction is gradually reduced from outside to inside.
6. pcb board according to claim 1, it is characterised in that the conductive layer is copper sheet conductive layer.
7. pcb board according to claim 1, it is characterised in that the through hole is shaped as strip bending.
8. the pcb board according to any one of claim 1-7, it is characterised in that be in the top layer and bottom of the pcb board
Conductive layer.
9. the pcb board according to any one of claim 1-7, it is characterised in that the N=4, the M=3.
10. a kind of terminal unit, including housing, and following one or more assemblies：Processor, memorizer, power circuit is more
Media component, audio-frequency assembly, the interface of input/output (I/O), sensor cluster, and communication component, the power circuit,
Power for each circuit or device for the terminal unit；The memorizer is used to store executable program code；It is described
Processor is corresponding with the executable program code to run by the executable program code stored in the reading memorizer
Program, it is characterised in that also include the pcb board as described in any one of claim 1-9, the pcb board is arranged on the shell
The interior volume that body is surrounded, the processor and the memorizer are arranged on the pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621166941.3U CN206149586U (en) | 2016-11-01 | 2016-11-01 | Pcb board and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621166941.3U CN206149586U (en) | 2016-11-01 | 2016-11-01 | Pcb board and terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206149586U true CN206149586U (en) | 2017-05-03 |
Family
ID=58622647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621166941.3U Expired - Fee Related CN206149586U (en) | 2016-11-01 | 2016-11-01 | Pcb board and terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206149586U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490522A (en) * | 2019-09-12 | 2021-03-12 | 北京小米移动软件有限公司 | Battery protection module and method, battery and mobile terminal |
| CN113015319A (en) * | 2021-03-04 | 2021-06-22 | 重庆惠科金渝光电科技有限公司 | Anti-static structure and connecting structure |
-
2016
- 2016-11-01 CN CN201621166941.3U patent/CN206149586U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490522A (en) * | 2019-09-12 | 2021-03-12 | 北京小米移动软件有限公司 | Battery protection module and method, battery and mobile terminal |
| CN113015319A (en) * | 2021-03-04 | 2021-06-22 | 重庆惠科金渝光电科技有限公司 | Anti-static structure and connecting structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170503 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |