CN209517623U - A kind of pressure resistance PCB circuit board - Google Patents
A kind of pressure resistance PCB circuit board Download PDFInfo
- Publication number
- CN209517623U CN209517623U CN201822102036.7U CN201822102036U CN209517623U CN 209517623 U CN209517623 U CN 209517623U CN 201822102036 U CN201822102036 U CN 201822102036U CN 209517623 U CN209517623 U CN 209517623U
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- resistant
- plate body
- compression
- circuit board
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Abstract
The utility model discloses a kind of pressure-resistant PCB circuit board, including plate body, the plate body is by copper foil layer, epoxy resin layer, copper-based surface layer and compression-resistant structure layer are combined, the structure of the compression-resistant structure layer is by the first supporting module, second supporting module and corrugated structure form, and the specific layer structure of compression-resistant structure layer is corrugated structure between the first supporting module and the second supporting module, the copper foil layer is located at the top layer of plate body, epoxy resin layer is located at the lower section of copper foil layer, compression-resistant structure layer is then located at the lowest level of plate body, copper-based surface layer is between compression-resistant structure layer and epoxy resin layer, via hole is additionally provided on the plate body, the compression-resistant structure layer of plate body uses corrugated structure, and corrugated structure is using the preferable high-temperature silicon disulfide rubber of elasticity, the structure feature and high-temperature silicon disulfide rubber of corrugated structure itself can not only be Plate body improves good stability, and plate body can also be made to be unlikely to deform and damage when being squeezed.
Description
Technical field
The utility model relates to wiring board arts, more particularly, to a kind of pressure-resistant PCB circuit board.
Background technique
PCB circuit board is also known as printed circuit board, and PCB circuit board is the supplier of electronic component electrical connection, current
PCB circuit board is mainly made of bus plane, dielectric layer, via hole and anti-solder ink;With the fast development of electronic technology,
PCB circuit board is widely used in every field, all includes corresponding PCB circuit board in almost all of electronic equipment;Currently, city
PCB circuit board on face is poor in the performance of pressure-resistant performance, and PCB circuit board is easily deformed or directly under by biggish external force
Damage.
Utility model content
The utility model is to overcome above situation insufficient, it is desirable to provide a kind of technical solution that can solve the above problem.
A kind of pressure resistance PCB circuit board, including plate body, the plate body is by copper foil layer, epoxy resin layer, copper-based surface layer and resistance to compression
Structure sheaf is combined, and the structure of the compression-resistant structure layer is made of the first supporting module, the second supporting module and corrugated structure,
And the specific layer structure of compression-resistant structure layer is corrugated structure between the first supporting module and the second supporting module, the copper
Layers of foil is located at the top layer of plate body, and epoxy resin layer is located at the lower section of copper foil layer, and compression-resistant structure layer is then located at the lowest level of plate body,
Copper-based surface layer is additionally provided with via hole on the plate body between compression-resistant structure layer and epoxy resin layer.
Preferably, the corrugated structure is made of high-temperature silicon disulfide rubber.
Preferably, the thickness of the corrugated structure is not less than 0.5mm.
Preferably, the via hole has several.
Preferably, the compression-resistant structure layer is adhered on the bottom surface of copper-based surface layer by glue.
Preferably, the corrugated structure is adhered between the first supporting module and the second supporting module by glue.
Preferably, the concrete shape of the corrugated structure is U-shaped, and U-shaped corrugated structure is characterized in thering is certain elasticity, energy
Better elasticity is provided for plate body.
Preferably, the concrete shape of the corrugated structure is V-arrangement, and V-arrangement corrugated structure is characterized in that plane resistance to compression force value is high,
Better stability can be provided for plate body.
Preferably, the concrete shape of the corrugated structure is UV shape, and UV shape corrugated structure is characterized in thering is high resistance to compression
Power, and there is certain elasticity, preferably elasticity and stability can be provided for plate body.
Compared with prior art, the utility model has the beneficial effects that the compression-resistant structure layer of plate body uses corrugated structure, and
Corrugated structure is using the preferable high-temperature silicon disulfide rubber of elasticity, the structure feature and high-temperature silicon disulfide rubber of corrugated structure itself
Good stability can not only be improved for plate body, and plate body can also be made to be unlikely to deform and damage when being squeezed.
The additional aspect and advantage of the utility model will be set forth in part in the description, partially will be from following description
In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of pressure-resistant PCB circuit board of the utility model;
Fig. 2 is the structural schematic diagram of U-shaped corrugated structure in a kind of pressure-resistant PCB circuit board of the utility model;
Fig. 3 is the structural schematic diagram of V-arrangement corrugated structure in a kind of pressure-resistant PCB circuit board of the utility model;
Fig. 4 is the structural schematic diagram of UV shape corrugated structure in a kind of pressure-resistant PCB circuit board of the utility model;
In figure: plate body 1, copper foil layer 2, epoxy resin layer 3, copper-based surface layer 4, compression-resistant structure layer 5, corrugated structure 6, first
Hold mode block 7, the second supporting module 8, via hole 9.
Specific embodiment
Below by the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described
Embodiment is only the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
Please refer to Fig. 1~4, in the utility model embodiment, a kind of pressure resistance PCB circuit board, including plate body 1, the plate body 1
Be combined by copper foil layer 2, epoxy resin layer 3, copper-based surface layer 4 and compression-resistant structure layer 5, the structure of the compression-resistant structure layer 5 by
First supporting module 7, the second supporting module 8 are formed with corrugated structure 6, and the specific layer structure of compression-resistant structure layer 5 is corrugation
For structure 6 between the first supporting module 7 and the second supporting module 8, the copper foil layer 2 is located at the top layer of plate body 4, asphalt mixtures modified by epoxy resin
Rouge layer 3 is located at the lower section of copper foil layer 2, and compression-resistant structure layer 5 is then located at the lowest level of plate body 1, and copper-based surface layer 4 is located at compression-resistant structure layer
Between 5 and epoxy resin layer 3, via hole 9 is additionally provided on the plate body 1;
The compression-resistant structure layer 5 of plate body 1 uses corrugated structure 6, and corrugated structure 6 is using the preferable high-temperature vulcanized silicon rubber of elasticity
Glue, the structure feature and high-temperature silicon disulfide rubber of corrugated structure 6 itself can not only improve good stability for plate body 1, and
And plate body 1 can also be made to be unlikely to deform and damage when being squeezed.
The corrugated structure 6 is made of high-temperature silicon disulfide rubber.
The thickness of the corrugated structure 6 is not less than 0.5mm.
The via hole 9 has several.
The compression-resistant structure layer 5 is adhered on the bottom surface of copper-based surface layer 4 by glue.
The corrugated structure 6 is adhered between the first supporting module 7 and the second supporting module 8 by glue.
Corrugated structure in above-mentioned technical proposal has numerous embodiments, specific as follows.
[embodiment one]
The concrete shape of the corrugated structure 6 is U-shaped, and U-shaped corrugated structure 6 is characterized in the elasticity for having certain, can be
Plate body provides preferably elasticity.
[embodiment two]
The concrete shape of the corrugated structure 6 is V-arrangement, and V-arrangement corrugated structure 6 is characterized in that plane resistance to compression force value is high, can be
Plate body provides better stability.
[embodiment three]
The concrete shape of the corrugated structure 6 is UV shape, and UV shape corrugated structure 6 is characterized in thering is high compressive resistance, again
With certain elasticity, preferably elasticity and stability can be provided for plate body.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
Claims (9)
1. a kind of pressure resistance PCB circuit board, including plate body, which is characterized in that the plate body is by copper foil layer, epoxy resin layer, copper-based
Surface layer and compression-resistant structure layer are combined, the structure of the compression-resistant structure layer by the first supporting module, the second supporting module with watt
Stupefied structure composition, and the specific layer structure of compression-resistant structure layer is that corrugated structure is located at the first supporting module and the second supporting module
Between, the copper foil layer is located at the top layer of plate body, and epoxy resin layer is located at the lower section of copper foil layer, and compression-resistant structure layer is then located at plate
The lowest level of body, copper-based surface layer are additionally provided with via hole on the plate body between compression-resistant structure layer and epoxy resin layer.
2. a kind of pressure-resistant PCB circuit board according to claim 1, which is characterized in that the corrugated structure is by high temperature vulcanized
Silicon rubber is constituted.
3. a kind of pressure-resistant PCB circuit board according to claim 1, which is characterized in that the thickness of the corrugated structure is not small
In 0.5mm.
4. a kind of pressure-resistant PCB circuit board according to claim 1, which is characterized in that the via hole has several.
5. a kind of pressure-resistant PCB circuit board according to claim 1, which is characterized in that the concrete shape of the corrugated structure
For U-shaped.
6. a kind of pressure-resistant PCB circuit board according to claim 1, which is characterized in that the concrete shape of the corrugated structure
For V-arrangement.
7. a kind of pressure-resistant PCB circuit board according to claim 1, which is characterized in that the concrete shape of the corrugated structure
For UV shape.
8. a kind of pressure-resistant PCB circuit board according to claim 1, which is characterized in that the compression-resistant structure layer passes through glue
It is adhered on the bottom surface of copper-based surface layer.
9. a kind of pressure-resistant PCB circuit board according to claim 1, which is characterized in that the corrugated structure is glutinous by glue
It is connected between the first supporting module and the second supporting module.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201822102036.7U CN209517623U (en) | 2018-12-14 | 2018-12-14 | A kind of pressure resistance PCB circuit board |
Applications Claiming Priority (1)
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CN201822102036.7U CN209517623U (en) | 2018-12-14 | 2018-12-14 | A kind of pressure resistance PCB circuit board |
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CN209517623U true CN209517623U (en) | 2019-10-18 |
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CN201822102036.7U Active CN209517623U (en) | 2018-12-14 | 2018-12-14 | A kind of pressure resistance PCB circuit board |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111465169A (en) * | 2020-03-25 | 2020-07-28 | 万安裕维电子有限公司 | Anti-warping PCB |
-
2018
- 2018-12-14 CN CN201822102036.7U patent/CN209517623U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111465169A (en) * | 2020-03-25 | 2020-07-28 | 万安裕维电子有限公司 | Anti-warping PCB |
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