CN105263261A - Enclosed metal base insulation groove manufacturing method - Google Patents
Enclosed metal base insulation groove manufacturing method Download PDFInfo
- Publication number
- CN105263261A CN105263261A CN201510644086.6A CN201510644086A CN105263261A CN 105263261 A CN105263261 A CN 105263261A CN 201510644086 A CN201510644086 A CN 201510644086A CN 105263261 A CN105263261 A CN 105263261A
- Authority
- CN
- China
- Prior art keywords
- metal base
- metal
- gong
- insulation
- insulation groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
Abstract
The invention relates to the metal base printed circuit board manufacturing field and particularly relates to an enclosed metal base insulation groove manufacturing method. The method mainly comprises steps that, step 1, one face of a metal base layer is stitched with a PCB sub board; step 2, a milling blade of a milling machine enters from one unstitched face of the metal base layer, and an insulation groove is milled on the metal base layer; and step 3, resin glue solution is filled into the insulation groove, and spilled glue is removed after solidification of the resin glue solution. Through the method, a problem that a metal base layer in the prior art is easily influenced by external force to generate cracks is solved, the production manufacturing process is simplified, production efficiency and product quality can be greatly improved, and the method is suitable for large-size insulation grooves or thin meal bases, are further suitable for manufacturing semi-enclosed insulation grooves and has great popularization values.
Description
Technical field
The present invention relates to metal-base printed wiring board and manufacture field, particularly relate to a kind of manufacture method of closed metal based insulation groove.
Background technology
Metal-based layer also possesses excellent conductivity except possessing good thermal diffusivity, for large power supply class substrate need a kind of can bearing great current export electrode, this electrode or plug-in unit pin just can utilize metal-based layer itself to make, this method can be realized by making insulation tank, for enclosed insulation tank, there is certain manufacture difficulty, traditional manufacture method need retain connection bit when gong groove designs, because connection bit area is little, under the impact of external force, easily cause crack or come off, another also also need need after pressing increases boring flow process, connection bit is bored disconnected.Conventional fabrication steps is:
1, go out insulation tank grooved at metal-based layer gong, grooved must add connection bit, as shown in Figure 1;
2, gong is good metal-based layer needs one side wherein stick diaphragm, to seal groove in case encapsulating time spill;
3, on insulation tank, resin adhesive liquid is poured into, cured resin and cut excessive glue;
4, metal-based layer and RCC or FR4 pressing;
5, connection bit is bored disconnected with bore mode.
Above-mentioned insulation tank making step complexity is various, and production efficiency is low, and is difficult to ensure product quality.
Summary of the invention
For the deficiency that prior art exists, the object of the present invention is to provide a kind of manufacture method greatly promoting the closed metal based insulation groove of quality and production efficiency.
For achieving the above object, the present invention can be achieved by the following technical programs:
A manufacture method for closed metal based insulation groove, comprises the following steps:
Step 1: the wherein one side of metal-based layer and the pressing of PCB daughter board;
Step 2: the gong cutter of gong machine enters from the one side of the non-pressing of metal-based layer, and gong goes out insulation tank on metal-based layer;
Step 3: pour into resin adhesive liquid in insulation tank, eliminates excessive glue after resin adhesive liquid solidification.
Further, in step 2, the thickness of gong machine when gong insulation tank according to metal-based layer carries out controlling depth gong, and guarantee can wear metal-based layer by gong, and PCB daughter board line layer do not worn by gong again.
Further, in step 3, use glue pouring machine to pour into resin adhesive liquid to insulation tank, use amary tape grinding machine to eliminate excessive glue.
Further, the thickness 0.5-3.0mm of described metal-based layer, is particularly useful for insulation tank manufacture method of the present invention within the scope of this.
Further, the width 1.0-8.0mm of described insulation tank, is particularly useful for insulation tank manufacture method of the present invention within the scope of this.
Further, the material of described PCB daughter board is RCC or FR4.
The present invention can solve metal-based layer in conventional fabrication method process and easily occur the problem in crack because of the impact by external force, simplify and manufacture flow process, can improving production efficiency and product quality greatly, be applicable to large scale insulation tank (1.0-8.0mm) or thin metal matrix (0.5-3.0mm), be applicable to the making of semi-enclosed insulation tank simultaneously, there is huge promotional value.
Accompanying drawing explanation
Fig. 1 is the insulation tank grooved that prior art gong goes out;
Fig. 2 is method flow diagram of the present invention;
Fig. 3 is the insulation tank grooved adopting the inventive method gong to go out;
In figure: 1-metal-based layer, 11-insulation tank, 12-connection bit.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is further illustrated:
As shown in figures 2-3, the manufacture method of closed metal based insulation groove of the present invention, mainly comprises the following steps:
Step 1: the wherein one side of metal-based layer 1 and the pressing of PCB daughter board (square frame S1), the material of PCB daughter board can be RCC or FR4.The benefit of first pressing is the one side utilizing PCB daughter board to seal metal-based layer 1, is equivalent to the effect of the diaphragm of traditional handicraft, saves processing step.
Step 2: the gong cutter of gong machine enters from the one side of the non-pressing of metal-based layer 1, controlling depth gong is carried out according to the thickness of metal-based layer 1, on metal-based layer 1, gong goes out insulation tank 11 (square frame S2), and can wear metal-based layer 1 by gong, PCB daughter board line layer do not worn by gong again.In this step, preferably, the thickness of metal-based layer 1 is 0.5-3.0mm, and the width of insulation tank is 1.0-8.0mm, is conducive to the insulation tank that gong goes out quality better like this.
Step 3: use glue pouring machine to pour into resin adhesive liquid toward the insulation tank 11 li that gong is good, uses amary tape grinding machine to eliminate excessive glue, smooth for the resin ground be stoppered (square frame S3) after resin adhesive liquid solidification.
This invention greatly simplifies Making programme, compare traditional handicraft, need connection bit and follow-up brill connection breaking position without the need to reserved, save manpower and materials, improve production efficiency, control dark gong filling filling holes with resin mode after adopting this pressing and can solve current quality and efficiency very well.
For a person skilled in the art, according to above technical scheme and design, other various corresponding change and distortion can be made, and all these change and distortion all should belong within the protection range of the claims in the present invention.
Claims (6)
1. a manufacture method for closed metal based insulation groove, is characterized in that, comprises the following steps:
Step 1: the wherein one side of metal-based layer and the pressing of PCB daughter board;
Step 2: the gong cutter of gong machine enters from the one side of the non-pressing of metal-based layer, and gong goes out insulation tank on metal-based layer;
Step 3: pour into resin adhesive liquid in insulation tank, eliminates excessive glue after resin adhesive liquid solidification.
2. the manufacture method of closed metal based insulation groove according to claim 1, is characterized in that: in step 2, the thickness of gong machine when gong insulation tank according to metal-based layer carries out controlling depth gong.
3. the manufacture method of closed metal based insulation groove according to claim 1 and 2, is characterized in that: use glue pouring machine to pour into resin adhesive liquid to insulation tank in step 3, uses amary tape grinding machine to eliminate excessive glue.
4. the manufacture method of closed metal based insulation groove according to claim 1, is characterized in that: the thickness of described metal-based layer is 0.5-3.0mm.
5. the manufacture method of the closed metal based insulation groove according to claim 1 or 4, is characterized in that: the width of described insulation tank is 1.0-8.0mm.
6. the manufacture method of closed metal based insulation groove according to claim 1, is characterized in that: the material of described PCB daughter board is RCC or FR4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510644086.6A CN105263261B (en) | 2015-09-30 | 2015-09-30 | A kind of production method of closed metal based insulation slot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510644086.6A CN105263261B (en) | 2015-09-30 | 2015-09-30 | A kind of production method of closed metal based insulation slot |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105263261A true CN105263261A (en) | 2016-01-20 |
| CN105263261B CN105263261B (en) | 2018-12-25 |
Family
ID=55102716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510644086.6A Active CN105263261B (en) | 2015-09-30 | 2015-09-30 | A kind of production method of closed metal based insulation slot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105263261B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59198790A (en) * | 1983-04-26 | 1984-11-10 | イビデン株式会社 | Printed circuit board |
| EP0792092A3 (en) * | 1996-02-24 | 1998-07-29 | Robert Bosch Gmbh | Process for manufacturing a composite arrangement |
| CN102364684A (en) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | LED (Light-Emitting Diode) module and manufacturing process thereof |
| CN202503813U (en) * | 2012-03-23 | 2012-10-24 | 深圳市博敏兴电子有限公司 | Circuit board |
| CN102862186A (en) * | 2012-09-26 | 2013-01-09 | 景旺电子科技(龙川)有限公司 | PCB (printed circuit board) forming method |
| CN203289746U (en) * | 2012-12-18 | 2013-11-13 | 景旺电子科技(龙川)有限公司 | Copper substrate structure with direct radiating copper-based boss |
| CN103582291A (en) * | 2012-08-02 | 2014-02-12 | 中兴通讯股份有限公司 | Metal matrix printed circuit board and electronic device |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
-
2015
- 2015-09-30 CN CN201510644086.6A patent/CN105263261B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59198790A (en) * | 1983-04-26 | 1984-11-10 | イビデン株式会社 | Printed circuit board |
| EP0792092A3 (en) * | 1996-02-24 | 1998-07-29 | Robert Bosch Gmbh | Process for manufacturing a composite arrangement |
| CN102364684A (en) * | 2011-06-17 | 2012-02-29 | 杭州华普永明光电股份有限公司 | LED (Light-Emitting Diode) module and manufacturing process thereof |
| CN202503813U (en) * | 2012-03-23 | 2012-10-24 | 深圳市博敏兴电子有限公司 | Circuit board |
| CN103582291A (en) * | 2012-08-02 | 2014-02-12 | 中兴通讯股份有限公司 | Metal matrix printed circuit board and electronic device |
| CN102862186A (en) * | 2012-09-26 | 2013-01-09 | 景旺电子科技(龙川)有限公司 | PCB (printed circuit board) forming method |
| CN203289746U (en) * | 2012-12-18 | 2013-11-13 | 景旺电子科技(龙川)有限公司 | Copper substrate structure with direct radiating copper-based boss |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 张洪文: "金属芯PCB及其散热控温作用", 《覆铜板资讯》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105263261B (en) | 2018-12-25 |
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