CN103917058A - Method for manufacturing pluggable finger type flexible circuit board - Google Patents
Method for manufacturing pluggable finger type flexible circuit board Download PDFInfo
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- CN103917058A CN103917058A CN201410118836.1A CN201410118836A CN103917058A CN 103917058 A CN103917058 A CN 103917058A CN 201410118836 A CN201410118836 A CN 201410118836A CN 103917058 A CN103917058 A CN 103917058A
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- wad cutter
- splicing fingers
- flexible pcb
- manufacture method
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Abstract
The invention relates to manufacturing of flexible circuit boards, and discloses a method for manufacturing a pluggable finger type flexible circuit board. The method includes the steps that S1, a designed printing ink pattern layer is formed on a circuit board raw material, wherein the designed printing ink pattern layer is formed in the mode that the area near the tail end of a pluggable finger is provided with multiple positioning target hole patterns, each positioning target hole pattern is connected with an earth copper area pattern, and the pattern of each soldering lug of the pluggable finger is connected with the inside of the corresponding positioning target hole pattern through a transition circuit pattern; S2, a copper foil layer of the circuit board is processed into a circuit; S3, resistance welding is carried out; S4, surface processing is carried out; S5, hole processing is carried out, positioning target holes are drilled, and after the positioning target holes of the area near the tail end of the pluggable finger, the connection relation of transition circuits in the positioning target holes are cut off; S6, electric test is carried out; S7, shape punching is carried out. The method is sued for manufacturing the pluggable finger type flexible circuit board.
Description
Technical field
The present invention relates to the manufacture of flexible PCB, relate in particular to the manufacture of splicing fingers class flexible PCB.
Background technology
Flexible PCB is generally to adopt layout structure on manufacturing, and on a space of a whole page, arranges multiple unit sheet.Common, the manufacturing process of splicing fingers class flexible PCB comprises: A1, the ink graph layer of design is formed to the operation on circuit board raw material (having the circuit board raw material of complete copper foil layer and substrate layer), specifically comprises design film, development, transfer printing etc.; A2, is processed into the copper foil layer of circuit board the operation of circuit, specifically makes the copper foil layer of circuit board be processed to form circuit by chemical etching or laser ablation etc. according to the ink graph layer of design; A3, welding resistance treatment process, needs on the line to carry out welding resistance region and attaches one deck solder mask (splicing fingers district does not attach); A4, hole treatment process, specifically die-cut location hole, brill via hole etc.; A5, surface treatment procedure, carries out gold-plated (or silver) for splicing fingers or other regions, on the Copper Foil in gold-plated region, forms layer protective layer; A6, testing electrical property operation, tests the circuit of wiring board, to discharge the circuit such as short circuit, short circuit defective products; A7, die-cut profile operation, after die-cut the profile of the unit plate in layout, so that cell board separates.
As everyone knows, be to make the circuit in this region all be electrically connected to electroplate lead wire for splicing fingers (the gold-plated region of wish) being electroplated in surface treatment procedure.Therefore, common way is that all weld tabs that make splicing fingers are all connected in ground copper by lead-in wire, and when plating, electroplate lead wire folder is directly clamped on the ground copper of all sides of plate and has realized electrical connection.As shown in Figure 1, be the design (copper wire pattern is also inevitable identical with it) of the ink graph layer of a splicing fingers class flexible PCB, as we know from the figure: all weld tabs of splicing fingers are all by transition circuit access ground copper.But the circuit board after surface treatment procedure, in the time carrying out testing electrical property, needs again to make the weld tabs of splicing fingers and the electric connection of ground copper to disconnect.Common way is, as shown in Figure 2, by punching out a hollow-out slot bore in the region of the transition circuit of splicing fingers (because the clear area in figure is indication circuit plate substrate layer, black region represents the copper foil layer of metal, so locate is to fill point pattern to represent that this region is vacancy section) be to represent to have carried out after testing electrical property operation shown in Fig. 3, through die-cut profile operation, by the monnolithic case of die-cut profile of the unit plate in layout one of them cell board after out.
But the manufacture method of this splicing fingers class flexible PCB of prior art is Shortcomings part, be mainly reflected in: 1, between surface treatment procedure and testing electrical property operation, need to increase the die-cut flow process of one transition circuit, just can carry out electric performance test, reduce production efficiency.2; Because splicing fingers class flexible PCB often all posts PI reinforcing chip at the back side in splicing fingers district, cause must adopting punching block to carry out die-cut operation in the die-cut flow process of transition circuit, also increase cost of manufacture.3; Carrying out after transition circuit die-cut, can cause splicing fingers terminal part unsettled because of the existence of this hollow-out slot bore of splicing fingers front end, carry out die-cut profile operation after mould location hole time, can be subject to the impact of this field strength deficiency, thereby finally affect the quality of product.
Summary of the invention
Therefore, the present invention is directed to above-mentioned weak point, propose a kind of manufacture method of improving splicing fingers class flexible PCB.
The present invention adopts following technical scheme to realize:
A manufacture method for splicing fingers class flexible PCB, comprises operation:
S1, the ink graph layer of design is formed to the operation on circuit board raw material, ink graph layer designed in this operation is: the figure that has multiple location wad cutter at the region division of terminal part that closes on splicing fingers, and the figure of respectively locating wad cutter is connected in the figure in Di Tong district, and the figure of each weld tabs of splicing fingers is all connected in the figure of location wad cutter by the figure of transition circuit;
S2, is processed into the copper foil layer of circuit board the operation of circuit;
S3, welding resistance treatment process;
S4, surface treatment procedure;
S5, hole treatment process, comprises in this operation the processing that each location wad cutter is punched, after the location wad cutter that closes on the region of the terminal part of splicing fingers punches, the annexation of the transition circuit in the wad cutter of location is cut off;
S6, testing electrical property operation;
S7, die-cut profile operation.
Wherein preferred, this location wad cutter is to be connected in Di Tongqu by being connected line.
Wherein preferred, the linking line of each location wad cutter has two at least.
Wherein preferred, the live width of this linking line is greater than 0.12mm.
Wherein preferred, the transition circuit in the wad cutter of each location is to be all positioned at a close side mutually.
Wherein preferred, the live width of a section of this transition circuit in connection enters location wad cutter is greater than 0.12mm.
Wherein preferred, the development length of a section of this transition circuit in connection enters location wad cutter has 0.2mm at least.
Wherein preferred, the spacing of this transition circuit and its both sides has 0.1mm at least.
The manufacture method of splicing fingers class flexible PCB of the present invention, than prior art, is enhanced productivity and is reduced production costs, and improved product yield to a certain extent.
Brief description of the drawings
Fig. 1 is the design drawing of the ink graph layer of splicing fingers class flexible PCB in existing manufacture method;
Fig. 2 is the schematic diagram that punches out a hollow-out slot bore in existing manufacture method in the region of the transition circuit of splicing fingers;
Fig. 3 is the monnolithic case schematic diagram through die-cut one of them cell board after out of profile in existing manufacture method;
Fig. 4 is the design drawing of the ink graph layer of splicing fingers class flexible PCB in embodiments of the invention;
Fig. 5 is the schematic diagram after each location wad cutter being punched in embodiments of the invention;
Fig. 6 is the monnolithic case schematic diagram through die-cut one of them cell board after out of profile in embodiments of the invention.
Embodiment
Now the present invention is further described with embodiment by reference to the accompanying drawings.
The manufacture method of the splicing fingers class flexible PCB of a most preferred embodiment of the present invention, comprises operation:
S1, is formed at the operation on circuit board raw material by the ink graph layer of design, comprises the steps such as design film, development, cleaning, transfer printing, and this part and prior art are similar, no longer describe in detail in this.Wherein, topmost difference, consult shown in Fig. 4, ink graph layer designed in this operation (covers black part and is divided into ink graph layer, staying white part is the substrate layer of FPC) be: the figure that has multiple location wad cutter 3 at the region division of terminal part that closes on splicing fingers 1, and the figure of respectively locating wad cutter 3 is connected in the figure in Di Tong district 2, and the figure of each weld tabs 101 of splicing fingers 1 is all connected in the figure of location wad cutter 3 by the figure of transition circuit 4.
This embodiment is preferred, and this location wad cutter 3 is to be connected in Di Tong district 2 by being connected line 5; And preferred, the linking line 5 of each location wad cutter 3 has two at least, and the live width of this linking line 5 is greater than 0.12mm, to ensure the reliability of the connection of locating wad cutter 3 Yu Ditong districts 2.
This embodiment is preferred, and the transition circuit 4 in each location wad cutter 3 is to be all positioned at a close side mutually, should avoid as far as possible scattering device, identifies this location wad cutter 3(G target in order to avoid have influence on perforating press in subsequent openings treatment process).
This embodiment is preferred, and the live width of a section of this transition circuit 4 in connection enters location wad cutter 3 is greater than 0.12mm, to ensure that broken string does not appear in transition circuit 4.
This embodiment is preferred, and this transition circuit 4 enters the development length of a section of location in wad cutter 3 in connection and has 0.2mm at least, really can thrust transition circuit 4 and locate being connected of wad cutter 3 when the follow-up punching guaranteeing.
This embodiment is preferred, and this transition circuit 4 has 0.1mm at least with the spacing of its both sides, to guarantee after follow-up punching, does not occur the phenomenon of transition circuit 4 Yu Ditong districts, 2 short circuits.
S2, the copper foil layer of circuit board is processed into the operation of circuit, be by chemical etching or laser ablation etc. according to design ink graph layer make the copper foil layer of circuit board be processed to form circuit (line pattern of processing is consistent with the ink graph layer of above-mentioned design, the copper foil layer of Fig. 6 is to divide and represent with black part equally, staying white part is the substrate layer of FPC), this part and prior art are similar, no longer describe in detail in this.
S3, welding resistance treatment process, is mainly to need on the line to carry out welding resistance region to attach one deck solder mask (splicing fingers district does not generally attach), this part and prior art are similar, no longer describe in detail in this.
S4, surface treatment procedure, carries out gold-plated (or silver) for splicing fingers or some other region, on the Copper Foil in gold-plated region, forms layer protective layer; When gold-plated, electroplate lead wire folder is directly clamped in all Ce Ditong district 2 of plate, because wad cutter 3 Shi Yuditong districts 2, location are connected, and each weld tabs 101 of splicing fingers 1 is located wad cutter 3 by being connected to of transition circuit 4 again, so must make each weld tabs 101 of splicing fingers 1 and electroplate lead wire folder realize electric connection, thereby can carry out gold-plated processing to each weld tabs of splicing fingers 1 101.Craft of gilding can adopt existing techniques in realizing, no longer describes in detail in this.
S5, hole treatment process, comprises the step of the processing that each location wad cutter is punched in this operation.Consult shown in Fig. 5, the location wad cutter 3 that closes on the region of the terminal part of splicing fingers 1 punches (because the clear area in figure is indication circuit plate substrate layer, black region represents the copper foil layer of metal, so locate is to fill point pattern to represent that this bore region is hollow hole) after, the annexation of the transition circuit 4 of location in wad cutter 3 is cut off, thereby provides possible condition for the realization of follow-up testing electrical property operation.The step such as brill via hole, welding hole that also comprises other in this hole treatment process, all can adopt existing techniques in realizing, no longer describes in detail in this.
S6, testing electrical property operation, due to after the hole treatment process of above-mentioned S5, branch-cut bridge road 4 is connected after disconnection with location wad cutter 3, the annexation in each weld tabs 101Yu Ditong district 2 of splicing fingers 1 also must be disconnected, thereby each weld tabs 101 of splicing fingers 1 is no longer electrically connected to together, thereby can carry out testing electrical property, circuit to wiring board is tested, to discharge the circuit such as short circuit, short circuit defective products; Testing electrical property can adopt existing techniques in realizing, no longer describes in detail in this.
S7, die-cut profile operation, after utilizing location wad cutter 3 to position, after die-cut the profile of the unit plate in layout, so that cell board separates.As shown in Figure 6, the flexible PCB after die-cut profile and the prior art flexible PCB (as shown in Figure 3) after die-cut is in full accord.This operation can adopt existing techniques in realizing equally, no longer describes in detail in this.
Compare and can find out by the manufacture method of splicing fingers class flexible PCB of above-mentioned this embodiment and the manufacture method of the splicing fingers class flexible PCB of prior art: this embodiment utilizes weld tabs 101 that transition circuit 4 makes splicing fingers 1 to be connected with location wad cutter 3 and the connected mode of locating wad cutter 3 Yu Ditong districts 2 realizes the electrical connection in the weld tabs 101Yu Ditong district 2 of splicing fingers 1, is beneficial to the carrying out of the gold-plated step of the weld tabs 101 of splicing fingers 1.Simultaneously, by this line pattern design, as long as exchange surface treatment procedure and hole treatment process order in prior art, can be by after location wad cutter 3 being punched in the treatment process of hole, and the electrical connection of realizing each weld tabs 101Yu Ditong district 2 of splicing fingers 1 is cut off, thereby can directly carry out testing electrical property operation.Thereby avoid in prior art, need to be before testing electrical property operation, need to increase the die-cut flow process at the die-cut hollow-out slot bore of splicing fingers front end together, to enhance productivity and to reduce production costs; Simultaneously because of without also in a disguised form improved the intensity in splicing fingers region at the die-cut hollow-out slot bore of splicing fingers front end, thereby be beneficial to the carrying out of die-cut profile operation, also improved to a certain extent product yield.
Although specifically show and introduced the present invention in conjunction with preferred embodiment; but those skilled in the art should be understood that; not departing from the spirit and scope of the present invention that appended claims limits; can make a variety of changes the present invention in the form and details, be protection scope of the present invention.
Claims (8)
1. the manufacture method of splicing fingers class flexible PCB, comprises operation:
S1, the ink graph layer of design is formed to the operation on circuit board raw material, ink graph layer designed in this operation is: the figure that has multiple location wad cutter at the region division of terminal part that closes on splicing fingers, and the figure of respectively locating wad cutter is connected in the figure in Di Tong district, and the figure of each weld tabs of splicing fingers is all connected in the figure of location wad cutter by the figure of transition circuit;
S2, is processed into the copper foil layer of circuit board the operation of circuit;
S3, welding resistance treatment process;
S4, surface treatment procedure;
S5, hole treatment process, comprises in this operation the processing that each location wad cutter is punched, after the location wad cutter that closes on the region of the terminal part of splicing fingers punches, the annexation of the transition circuit in the wad cutter of location is cut off;
S6, testing electrical property operation;
S7, die-cut profile operation.
2. the manufacture method of splicing fingers class flexible PCB according to claim 1, is characterized in that: this location wad cutter is to be connected in Di Tongqu by being connected line.
3. the manufacture method of splicing fingers class flexible PCB according to claim 2, is characterized in that: the linking line of each location wad cutter has two at least.
4. the manufacture method of splicing fingers class flexible PCB according to claim 2, is characterized in that: the live width of this linking line is greater than 0.12mm.
5. according to the manufacture method of the splicing fingers class flexible PCB described in claim 1 or 2 or 3 or 4, it is characterized in that: the transition circuit in the wad cutter of each location is to be all positioned at a close side mutually.
6. according to the manufacture method of the splicing fingers class flexible PCB described in claim 1 or 2 or 3 or 4, it is characterized in that: the live width of a section of this transition circuit in connection enters location wad cutter is greater than 0.12mm.
7. according to the manufacture method of the splicing fingers class flexible PCB described in claim 1 or 2 or 3 or 4, it is characterized in that: the development length of a section of this transition circuit in connection enters location wad cutter has 0.2mm at least.
8. according to the manufacture method of the splicing fingers class flexible PCB described in claim 1 or 2 or 3 or 4, it is characterized in that: the spacing of this transition circuit and its both sides has 0.1mm at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410118836.1A CN103917058B (en) | 2014-03-27 | 2014-03-27 | Method for manufacturing pluggable finger type flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410118836.1A CN103917058B (en) | 2014-03-27 | 2014-03-27 | Method for manufacturing pluggable finger type flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN103917058A true CN103917058A (en) | 2014-07-09 |
| CN103917058B CN103917058B (en) | 2017-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410118836.1A Active CN103917058B (en) | 2014-03-27 | 2014-03-27 | Method for manufacturing pluggable finger type flexible circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495452A (en) * | 2018-03-27 | 2018-09-04 | 厦门市铂联科技股份有限公司 | A kind of manufacturing method and product of the flexible PCB with suspension plugging fingers |
| CN113936545A (en) * | 2021-10-15 | 2022-01-14 | 业成科技（成都）有限公司 | Backlight module and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100484370C (en) * | 2005-12-15 | 2009-04-29 | 比亚迪股份有限公司 | Production of flexible printing circuit board |
| CN102006046B (en) * | 2010-09-30 | 2016-03-09 | 江苏惠通集团有限责任公司 | Key detection board |
-
2014
- 2014-03-27 CN CN201410118836.1A patent/CN103917058B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495452A (en) * | 2018-03-27 | 2018-09-04 | 厦门市铂联科技股份有限公司 | A kind of manufacturing method and product of the flexible PCB with suspension plugging fingers |
| CN108495452B (en) * | 2018-03-27 | 2021-04-30 | 厦门市铂联科技股份有限公司 | Manufacturing method of flexible circuit board with suspended plugging fingers and product |
| CN113936545A (en) * | 2021-10-15 | 2022-01-14 | 业成科技（成都）有限公司 | Backlight module and manufacturing method thereof |
| CN113936545B (en) * | 2021-10-15 | 2024-01-16 | 业成科技（成都）有限公司 | Backlight module and manufacturing method thereof |
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| CN103917058B (en) | 2017-02-22 |
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