CN103917058B - Method for manufacturing pluggable finger type flexible circuit board - Google Patents
Method for manufacturing pluggable finger type flexible circuit board Download PDFInfo
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- CN103917058B CN103917058B CN201410118836.1A CN201410118836A CN103917058B CN 103917058 B CN103917058 B CN 103917058B CN 201410118836 A CN201410118836 A CN 201410118836A CN 103917058 B CN103917058 B CN 103917058B
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- positioning
- splicing fingers
- flexible pcb
- wad cutter
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Abstract
The invention relates to manufacturing of flexible circuit boards, and discloses a method for manufacturing a pluggable finger type flexible circuit board. The method includes the steps that S1, a designed printing ink pattern layer is formed on a circuit board raw material, wherein the designed printing ink pattern layer is formed in the mode that the area near the tail end of a pluggable finger is provided with multiple positioning target hole patterns, each positioning target hole pattern is connected with an earth copper area pattern, and the pattern of each soldering lug of the pluggable finger is connected with the inside of the corresponding positioning target hole pattern through a transition circuit pattern; S2, a copper foil layer of the circuit board is processed into a circuit; S3, resistance welding is carried out; S4, surface processing is carried out; S5, hole processing is carried out, positioning target holes are drilled, and after the positioning target holes of the area near the tail end of the pluggable finger, the connection relation of transition circuits in the positioning target holes are cut off; S6, electric test is carried out; S7, shape punching is carried out. The method is sued for manufacturing the pluggable finger type flexible circuit board.
Description
Technical field
The present invention relates to the manufacture of flexible PCB, the more particularly, to manufacture of splicing fingers class flexible PCB.
Background technology
Flexible PCB is usually to adopt layout structure on manufacturing, and arranges multiple dice on a space of a whole page.Generally
, the manufacturing process of splicing fingers class flexible PCB includes：A1, the ink pattern layer of design is formed at circuit board raw material
（There is the circuit board raw material of complete copper foil layer and substrate layer）On operation, specifically include design film, development, transfer etc.；
A2, the copper foil layer of circuit board is processed into the operation of circuit, particular by chemical etching or laser ablation etc. according to design
Ink pattern layer make the copper foil layer of circuit board be processed to form circuit；A3, welding resistance treatment process, need on the line to be hindered
Welding zone domain attaches one layer of solder mask（Splicing fingers area does not attach）；A4, hole treatment process, specifically punching location hole, drill-through hole
Deng；A5, surface treatment procedure, splicing fingers or other regions are carried out gold-plated（Or silver）, on the Copper Foil in gold-plated region
Form layer protective layer；A6, testing electrical property operation, the circuit of wiring board is tested, to exclude the circuits such as short circuit, short circuit not
Non-defective unit；A7, is punched profile operation, after the outline die of the unit plate in layout, so that cell board separates.
It is known that in surface treatment procedure to splicing fingers（It is intended to gold-plated region）Carrying out plating is to need Shi Gai area
Circuit in domain is all electrically connected to electroplate lead wire.Therefore it is common practice that making all weld tabs of splicing fingers all by lead
It is connected to ground copper, the ground copper of the week side of boss that during plating, electroplate lead wire folder is clamped directly at plate achieves electrical connection.As
Shown in Fig. 1, it is the design of the ink pattern layer of a splicing fingers class flexible PCB（Copper wire pattern also inevitable phase therewith
With）, as we know from the figure：All weld tabs of splicing fingers all access ground copper by transition circuit.However, after surface treatment procedure
Circuit board, when carrying out testing electrical property, needs to make the weld tabs of splicing fingers and the electric connection of ground copper disconnect again.Common practice
It is, as shown in Fig. 2 a hollow-out slot bore is punched into by the region in the transition circuit of splicing fingers（Clear area because of in figure
It is indication circuit plate substrate layer, black region represents the copper foil layer of metal, therefore be to fill this region of point pattern representation herein
For vacancy section）Shown in Fig. 3 be represent and carried out testing electrical property operation after, through being punched profile operation, each in layout is single
The outline die of first plate out after one of cell board monnolithic case.
But in place of the manufacture method of this splicing fingers class flexible PCB of prior art is Shortcomings, mainly
It is embodied in：1, between surface treatment procedure and testing electrical property operation, need to increase the flow process of the punching of one transition circuit,
Electric performance test can be carried out, reduce production efficiency.2；Because splicing fingers class flexible PCB is past at the back side in splicing fingers area
Toward all posting PI reinforcing chip, lead to must be punched out using punching block operating in the flow process of punching of transition circuit, also increase
Cost of manufacture.3；After the punching carrying out transition circuit, grafting can be caused because of the presence of this hollow-out slot bore of splicing fingers front end
Finger tips portion is hanging, is punched out to be affected by this field strength deficiency during profile operation after mould location hole, from
And finally affect the quality of product.
Content of the invention
Therefore, the present invention is directed to above-mentioned weak point, proposes a kind of manufacture improving splicing fingers class flexible PCB
Method.
The present invention adopts the following technical scheme that realization：
A kind of manufacture method of splicing fingers class flexible PCB, including operation：
S1, the ink pattern layer of design is formed at the operation on circuit board raw material, designed ink in this operation
Graph layer is：It is provided with the figure of multiple positioning wad cutters in the region of the terminal part closing on splicing fingers, and respectively position wad cutter
Figure is connected to the figure in Di Tong area, and the figure of each weld tabs of splicing fingers all by the figure of transition circuit connect to
In the figure of positioning wad cutter；
S2, the copper foil layer of circuit board is processed into the operation of circuit；
S3, welding resistance treatment process；
S4, surface treatment procedure；
S5, hole treatment process, include the process that each positioning wad cutter is punched in this operation, close on splicing fingers
After the positioning wad cutter in the region of terminal part is punched, the annexation of the transition circuit in positioning wad cutter is cut off；
S6, testing electrical property operation；
S7, is punched profile operation.
Wherein preferred, this positioning wad cutter is to be connected to Di Tongqu by being connected line.
Wherein preferred, at least two, the linking line of each positioning wad cutter.
Wherein preferred, the live width of this linking line is more than 0.12mm.
Wherein preferred, the transition circuit in each positioning wad cutter is all in side close to each other.
Wherein preferred, this transition circuit is more than 0.12mm in the live width connecting a section entering in positioning wad cutter.
Wherein preferred, this transition circuit enters the development length at least 0.2mm of a section positioning in wad cutter connecting.
Wherein preferred, the spacing at least 0.1mm of this transition circuit and its both sides.
The manufacture method of the splicing fingers class flexible PCB of the present invention is compared to prior art, improve production efficiency and fall
Low production cost, and improve product yield to a certain extent.
Brief description
Fig. 1 is the design drawing of the ink pattern layer of splicing fingers class flexible PCB in existing manufacture method；
Fig. 2 is the signal being punched into a hollow-out slot bore in existing manufacture method in the region of the transition circuit of splicing fingers
Figure；
Fig. 3 be in existing manufacture method through outline die out after one of cell board monnolithic case illustrate
Figure；
Fig. 4 is the design drawing of the ink pattern layer of splicing fingers class flexible PCB in embodiments of the invention；
Fig. 5 is the schematic diagram after each positioning wad cutter being punched in embodiments of the invention；
Fig. 6 be in embodiments of the invention through outline die out after one of cell board monnolithic case illustrate
Figure.
Specific embodiment
In conjunction with the drawings and specific embodiments, the present invention is further described.
The manufacture method of the splicing fingers class flexible PCB of one most preferred embodiment of the present invention, including operation：
S1, the ink pattern layer of design is formed at the operation on circuit board raw material, including design film, development, clearly
The step such as wash, transfer, this part is similar with prior art, no longer describes in detail in this.Wherein, topmost difference, refers to
Shown in Fig. 4, ink pattern layer designed in this operation（Covering black portions are ink pattern layer, and being left white part is FPC's
Substrate layer）It is：It is provided with the figure of multiple positioning wad cutters 3 in the region of the terminal part closing on splicing fingers 1, and respectively position wad cutter
3 figure is connected to the figure in Di Tong area 2, and the figure of each weld tabs 101 of splicing fingers 1 is all by transition circuit 4
Figure connects to the figure of positioning wad cutter 3.
Preferably, this positioning wad cutter 3 is to be connected to Di Tong area 2 by being connected line 5 to this embodiment；And it is it is furthermore preferred that every
At least two, the linking line 5 of individual positioning wad cutter 3, and the live width of this linking line 5 is more than 0.12mm, with ensure to position wad cutter 3 with
The reliability of the connection in Di Tong area 2.
Preferably, the transition circuit 4 in each positioning wad cutter 3 is all in side close to each other to this embodiment, should use up
Scattering device can be avoided that, in order to avoid having influence on perforating press in subsequent openings treatment process to identify this positioning wad cutter 3（G target）.
Preferably, this transition circuit 4 is more than this embodiment in the live width connecting a section entering in positioning wad cutter 3
0.12mm, to ensure that transition circuit 4 occurs without broken string.
Preferably, this transition circuit 4 is in the development length connecting a section entering in positioning wad cutter 3 at least for this embodiment
0.2mm, to guarantee really to thrust the connection of transition circuit 4 and positioning wad cutter 3 in follow-up punching.
Preferably, the spacing at least 0.1mm of this transition circuit 4 and its both sides, to guarantee in follow-up punching for this embodiment
Afterwards, occur without the phenomenon of transition circuit 4 and Di Tong area 2 short circuit.
S2, the copper foil layer of circuit board is processed into the operation of circuit, be by chemical etching or laser ablation etc. according to
The ink pattern layer of design makes the copper foil layer of circuit board be processed to form circuit（The line pattern of processing and the oil of above-mentioned design
Black graph layer is consistent, then the copper foil layer of Fig. 6 is equally to be represented with black portions, is left white the substrate layer that part is FPC）, this part
Similar with prior art, no longer describe in detail in this.
S3, welding resistance treatment process, mainly need on the line to carry out one layer of solder mask of welding resistance region attaching（Splicing fingers
Area does not typically attach）, this part is similar with prior art, no longer describes in detail in this.
S4, surface treatment procedure, splicing fingers or some other region are carried out gold-plated（Or silver）, in gold-plated region
Copper Foil on formed layer protective layer；When gold-plated, electroplate lead wire folder is clamped directly at the Di Tong area 2 of the week side of boss of plate, because positioning
Wad cutter 3 Shi Yuditong area 2 is connected, and each weld tabs 101 of splicing fingers 1 further through transition circuit 4 connection to positioning target
Hole 3, so necessarily make each weld tabs 101 of splicing fingers 1 and electroplate lead wire folder achieve electric connection, such that it is able to grafting
Each weld tabs 101 of finger 1 carries out gold-plated process.Craft of gilding can be realized using prior art, no longer describes in detail in this.
S5, hole treatment process, include the step to the process that each positioning wad cutter is punched in this operation.Refering to Fig. 5
Shown, the positioning wad cutter 3 closing on the region of the terminal part of splicing fingers 1 is punched（Because the clear area of in figure is indication circuit
Plate substrate layer, black region represents the copper foil layer of metal, therefore is to fill this bore region of point pattern representation as hollow hole herein）
Afterwards, the annexation of the transition circuit 4 in positioning wad cutter 3 is cut off, thus providing for the realization of follow-up testing electrical property operation
Possible condition.The steps such as other drill-through holes, welding hole are also included in this hole treatment process, all can be real using prior art
Existing, no longer describe in detail in this.
S6, testing electrical property operation, due to after the hole treatment process of above-mentioned S5, the connection of branch-cut bridge road 4 and positioning wad cutter 3
After disconnection, each weld tabs 101 and the annexation in Di Tong area 2 of splicing fingers 1 are also necessarily disconnected, thus splicing fingers 1
Each weld tabs 101 is no longer electrically connected to together, such that it is able to carry out testing electrical property, the circuit of wiring board is tested,
To discharge the circuit defective products such as short circuit, short circuit；Testing electrical property can be realized using prior art, no longer describes in detail in this.
S7, is punched profile operation, after being positioned using positioning wad cutter 3, by the profile punching of the unit plate in layout
After cutting, so that cell board separates.As shown in fig. 6, the flexible PCB after punching profile and the flexible electrical after prior art punching
Road plate（As shown in Figure 3）Completely the same.This operation equally can be realized using prior art, no longer describes in detail in this.
By the manufacture method of splicing fingers class flexible PCB and the splicing fingers of prior art of this embodiment above-mentioned
The manufacture method of class flexible PCB is compared and be can be seen that：This embodiment makes the weld tabs 101 of splicing fingers 1 using transition circuit 4
It is connected and positions the connected mode of wad cutter 3 and Di Tong area 2 and realize weld tabs 101 and the Di Tongqu of splicing fingers 1 with positioning wad cutter 3
2 electrical connection, is beneficial to the carrying out of the gold-plated step of the weld tabs 101 of splicing fingers 1.Meanwhile, by this layout
Shape designs, as long as exchanging surface treatment procedure and hole treatment process order in prior art, you can by right in the treatment process of hole
After positioning wad cutter 3 is punched, and the electrical connection of each weld tabs 101 and Di Tong area 2 realizing splicing fingers 1 is cut
Disconnected, thus testing electrical property operation can directly be carried out.Thus avoiding in prior art, need, before testing electrical property operation, to need
Increase the flow process being punched the punching of hollow-out slot bore together in splicing fingers front end, with improve production efficiency and reduction production cost；
Simultaneously because being punched, in splicing fingers front end, the intensity that hollow-out slot bore also in a disguised form improves splicing fingers region, thus beneficial to punching
Cut the carrying out of profile operation, also improve product yield to a certain extent.
Although specifically show and describe the present invention in conjunction with preferred embodiment, those skilled in the art should be bright
In vain, in the spirit and scope of the present invention being limited without departing from appended claims, in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (8)
1. a kind of manufacture method of splicing fingers class flexible PCB, including operation：
S1, the ink pattern layer of design is formed at the operation on circuit board raw material, designed ink pattern in this operation
Layer be：It is provided with the figure of multiple positioning wad cutters in the region of the terminal part closing on splicing fingers, and each figure positioning wad cutter
It is connected to the figure in Di Tong area, and the figure of each weld tabs of splicing fingers is all connected to positioning by the figure of transition circuit
In the figure of wad cutter；
S2, the copper foil layer of circuit board is processed into the operation of circuit；
S3, welding resistance treatment process；
S4, surface treatment procedure；
S5, hole treatment process, include the process that each positioning wad cutter is punched in this operation, close on the end of splicing fingers
After the positioning wad cutter in the region in portion is punched, the annexation of the transition circuit in positioning wad cutter is cut off；
S6, testing electrical property operation；
S7, is punched profile operation.
2. splicing fingers class flexible PCB according to claim 1 manufacture method it is characterised in that：This positioning wad cutter
It is to be connected to Di Tongqu by being connected line.
3. splicing fingers class flexible PCB according to claim 2 manufacture method it is characterised in that：Each positions target
At least two, the linking line in hole.
4. splicing fingers class flexible PCB according to claim 2 manufacture method it is characterised in that：This linking line
Live width is more than 0.12mm.
5. the splicing fingers class flexible PCB according to claim 1 or 2 or 3 or 4 manufacture method it is characterised in that：
Transition circuit in each positioning wad cutter is all in side close to each other.
6. the splicing fingers class flexible PCB according to claim 1 or 2 or 3 or 4 manufacture method it is characterised in that：
This transition circuit is more than 0.12mm in the live width connecting a section entering in positioning wad cutter.
7. the splicing fingers class flexible PCB according to claim 1 or 2 or 3 or 4 manufacture method it is characterised in that：
This transition circuit enters the development length at least 0.2mm of a section positioning in wad cutter connecting.
8. the splicing fingers class flexible PCB according to claim 1 or 2 or 3 or 4 manufacture method it is characterised in that：
The spacing at least 0.1mm in the Di Tong area of this transition circuit and its both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410118836.1A CN103917058B (en) | 2014-03-27 | 2014-03-27 | Method for manufacturing pluggable finger type flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410118836.1A CN103917058B (en) | 2014-03-27 | 2014-03-27 | Method for manufacturing pluggable finger type flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103917058A CN103917058A (en) | 2014-07-09 |
| CN103917058B true CN103917058B (en) | 2017-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410118836.1A Active CN103917058B (en) | 2014-03-27 | 2014-03-27 | Method for manufacturing pluggable finger type flexible circuit board |
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| Country | Link |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495452B (en) * | 2018-03-27 | 2021-04-30 | 厦门市铂联科技股份有限公司 | Manufacturing method of flexible circuit board with suspended plugging fingers and product |
| CN113936545B (en) * | 2021-10-15 | 2024-01-16 | 业成科技（成都）有限公司 | Backlight module and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1984534A (en) * | 2005-12-15 | 2007-06-20 | 比亚迪股份有限公司 | Production of flexible printing circuit board |
| CN102006046A (en) * | 2010-09-30 | 2011-04-06 | 江苏惠通集团有限责任公司 | Key detecting board |
-
2014
- 2014-03-27 CN CN201410118836.1A patent/CN103917058B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1984534A (en) * | 2005-12-15 | 2007-06-20 | 比亚迪股份有限公司 | Production of flexible printing circuit board |
| CN102006046A (en) * | 2010-09-30 | 2011-04-06 | 江苏惠通集团有限责任公司 | Key detecting board |
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| Publication number | Publication date |
|---|---|
| CN103917058A (en) | 2014-07-09 |
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