CN1984534A - Production of flexible printing circuit board - Google Patents
Production of flexible printing circuit board Download PDFInfo
- Publication number
- CN1984534A CN1984534A CN 200510022341 CN200510022341A CN1984534A CN 1984534 A CN1984534 A CN 1984534A CN 200510022341 CN200510022341 CN 200510022341 CN 200510022341 A CN200510022341 A CN 200510022341A CN 1984534 A CN1984534 A CN 1984534A
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- printed circuit
- flexible printed
- circuit board
- manufacture method
- dry film
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Abstract
The method comprises: layout and wiring; cutting off; coating film; exposure; developing; etching; stripping film; covering tectorial membrane by hot press; surface treating; making location holes; cutting up into pieces. The layout and wiring step comprises: two wires to be located at the joint of flexible printed circuit (FPC) are crossed each other on same plane, and then are connected to the ground copper; making layout and wiring. The step of making location hole comprises: location holes are made at place exposed after etching. The step next to the step of cutting up into pieces comprises: testing and packaging the product.
Description
Technical field
The present invention relates to be used for the jockey of flexible print circuit or flat or flat cable, especially relate to a kind of manufacture method of flexible printed circuit board.
Background technology
Existing single-sided flexible printed circuit board (PCB) (Flexible Printed Circuit board, be called for short FPC) manufacture method, following steps are arranged successively: composing wiring, severing, pad pasting, exposure, video picture, etching, striping, the hot pressing of subsides epiphragma, surface treatment, make location hole (comprise get die-cut conductor wire with location hole and die-cut external form location hole), cut slivering, die-cut conductor wire, O/S test (open; Short test, open circuit, short circuit electric performance test), die-cut external form the FPC product and the test package that adhere to specification.The employing surface gold-plating is handled, can satisfy the hardness and wear resistance requirement, but require the drawing conductor wire, described conductor wire is the pilot wire that connects FPC internal circuit and whole copper face, guarantee the bridge of foreign current when being gold-plated operation,, guarantee that electric current can arrive FPC internal electrical terminal by the connection of conductor wire by whole copper face and the conducting of FPC internal circuit, to finish the ionic charge exchange, reach gold-plated purpose.In the wiring step of setting type, generally be that setting conductor wire length is 0.8 mm～1.0mm, and before the O/S test, in order to satisfy the test request that FPC internal circuit and outside copper face open circuit, need whole product cut slivering, with the die-cut conductor wire of punching block it is thrust again, above-mentionedly cut, die-cut step does not mutually combine utilization, causes man-hour and waste of material.
Summary of the invention
The technical problem to be solved in the present invention is the defective that overcomes prior art, proposes a kind of manufacture method that can reduce the flexible printed circuit board of cost of manufacture.
Technical problem of the present invention is solved like this:
The manufacture method of this flexible printed circuit board comprises the step that next coming in order carry out: composing wiring, severing, pad pasting, exposure, video picture, etching, striping, the hot pressing of subsides epiphragma, surface treatment, make location hole, cut slivering.
The characteristics of the manufacture method of this flexible printed circuit board are:
Described composing wiring step is that elder generation locates adapted at the FPC contact (Tab is commonly called as the golden finger end) of the work of drawing up upper and lower two sections conductor wires intert mutually at grade and intersect, and are connected with ground copper, and then set type;
The described location hole step of beating is only the external form that etches to be got with location hole;
The described subsequent step that cuts the slivering step, the FPC product and the test package step that have O/S test, die-cut external form to adhere to specification successively.
Technical problem of the present invention is to solve according to qualifications like this:
The interspersed mutually length that intersects of described upper and lower two sections conductor wires is at least 3mm.Such size ratio is easier to operation, and is undersized, occurs conductor wire during operation easily and is not cut off, and causes follow-up O/S test that mistake takes place and surveys.
Described is horizontal composing with setting type after ground copper is connected again.
The inventive method is only got the external form that etches beating in the location hole step of making single face FPC with location hole, and needn't make die-cut conductor wire location hole, and finish make single face FPC whole FPC cut the slivering step after needn't die-cut conductor wire, directly enter the O/S testing procedure.The inventive method has overcome die-cut step that prior art exists and has not mutually combined and to utilize and cause the defective of man-hour and waste of material, can be effectively in conjunction with utilizing forward and backward job step, the cost of the mould that the die-cut conductor wire of minimizing making is used, shorten work flow and production cycle, have the advantage that flow process is simple, the number of working processes is less, efficient is high, can also improve the FPC contact patch intensity and patch after reliability.
Description of drawings
The present invention will be described in detail below in conjunction with embodiment:
Accompanying drawing is the composing wiring schematic diagram of the specific embodiment of the invention.
1 is cutting line among the figure, the 2nd, and conductor wire.
Embodiment
The manufacture method of flexible printed circuit board as shown in drawings comprises the step that next coming in order carry out:
Set type and connect up: the conductor wire of adapted at the upper and lower FPC contact place of the work of drawing up interted at grade mutually intersect earlier, the length that intersects after upper and lower two sections conductor wires intert is 3mm, guarantee that conductor wire is connected with ground copper, laterally set type again, make egative film after finishing;
Severing: will put in order volume copper foil material LVAS1018RD, epiphragma material C VA1025 and cut into the single sheet material that is of a size of 250mm * 335mm respectively;
Pad pasting: the photosensitive dry film H-S930 of thickness 30 μ m is sticked on individual copper foil surface, and the upper roller temperature is 110 ℃, the bottom roller temperature: 65 ℃, transfer rate is 1.0m/min, and pad pasting pressure is 0.4Mpa, leaves standstill 15min behind the lamination at least;
Exposure: the egative film location that makes is placed on above the photosensitive dry film, vacuumize 10s, vacuum degree is more than 90%, egative film and photosensitive dry film are fitted tightly, with the 40Mj exposure energy egative film is shone 5s by ultraviolet source again, make the photosensitive dry film polymerization reaction take place that receives light source irradiation and crosslinking curing, and the photosensitive dry film that does not receive light source irradiation do not become, indirectly with image transfer to photosensitive dry film;
Video picture: semi-finished product after will exposing and dilute alkaline soln even contact, remove the active group of unexposed portion in the photosensitive dry film, expose copper foil surface, only keep the visuals of photosensitive cross-linking curing, used dilute alkaline soln is that the concentration weight ratio is 1% natrium carbonicum calcinatum Na
2CO
3Solution, video picture temperature are 30 ℃, and video picture production line roller transfer rate is 2.4m/min, and the dilute alkaline soln pressure of roller top spray head ejection is 1.0kgf/cm
2, the dilute alkaline soln pressure of roller below spray head ejection is 1.5kgf/cm
2
Etching: with semi-finished product after the video picture and etching solution even contact, remove exposed copper foil surface, the visuals of preserving photosensitive cross-linking curing is the circuit that needs, and used etching solution is that the concentration weight ratio is 1.25% copper chloride CuCl
2Solution, etch temperature are 48 ℃, and etching production line roller transfer rate is 3.3m/min, and the etching solution pressure of roller top spray head ejection is 1.5kgf/cm
2, the etching solution pressure of roller below spray head ejection is 1.0kgf/cm
2
Striping: with semi-finished product after the etching and strong base solution even contact, remove the photosensitive dry film of crosslinking curing, copper foil surface below it is exposed, used strong base solution is that the concentration weight ratio is 2.5% NaOH NaOH solution, the striping temperature is 48 ℃, striping production line roller transfer rate is 3.4m/min, and the strong base solution pressure of roller top spray head ejection is 1.5kgf/cm
2, the strong base solution pressure of roller below spray head ejection is 1.0kgf/cm
2
Paste epiphragma hot pressing: the processing of earlier welding resistance epiphragma material C VA1025 being holed on request, then in the mode of manual assembly, fit in copper foil surface according to the etching alignment mark, insert the hot press pressing after folding, temperature is 175 ℃, pressure is 290psi, and hot pressing total time is 150min, and wherein the high temperature pressing time is 25min;
Surface treatment: the part copper foil surface is carried out the electronickelling gold handle, Bao Jin Au electroplating current is 0.16A/4pcs, and thick golden Au electroplating current is 0.28A/4pcs, and the nickel electroplating current is 8.4A/4pcs, electroplates cycle 80s;
Make location hole: adopt the target practice board that the external form that etches is got with location hole, use in order to the die-cut external form of subsequent step, target practice board punch diameter is 2.0mm;
The described slivering step that cuts is to adopt cut-off knife that individual FPC semi-finished product are cut into little FPC semi-finished product, in order to die-cut;
The O/S test: adopt O/S2000 type tester table that little FPC semi-finished product are carried out the electrical property analysis, test has or not open circuit, short circuit phenomenon;
The FPC product that die-cut external form adheres to specification: adopt and to beat the hole that the location hole step gets and little FPC semi-finished product are navigated on the alignment pin of mould the product that use punching out mould punching external form adheres to specification;
Test package: adopt the antistatic packaging box that certified FPC product is put into packing box.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the present invention is determined by claims of being submitted to.
Claims (9)
1. the manufacture method of a flexible printed circuit board comprises the step that next coming in order carry out: composing wiring, severing, pad pasting, exposure, video picture, etching, striping, the hot pressing of subsides epiphragma, surface treatment, make location hole, cut slivering, it is characterized in that:
Described composing wiring step is, the upper and lower two section conductor wires of adapted at the FPC contact place that does of drawing up are interted at grade mutually intersect earlier, and with set type again after ground copper is connected;
The described location hole step of beating is only the external form that etches to be got with location hole;
The described subsequent step that cuts the slivering step, the FPC product and the test package step that have O/S test, die-cut external form to adhere to specification successively.
2. the manufacture method of flexible printed circuit board as claimed in claim 1 is characterized in that:
The interspersed mutually length that intersects of described upper and lower two sections conductor wires is at least 3mm.
3. as the manufacture method of claim 1,2 described flexible printed circuit boards, it is characterized in that:
Described step of membrane sticking is, photosensitive dry film is sticked on individual copper foil surface, and the pad pasting temperature is 100 ℃～110 ℃, and pad pasting pressure is 30～60psi, and transfer rate is 1.0m/min～2.0m/min.
4. the manufacture method of flexible printed circuit board as claimed in claim 3 is characterized in that:
Described step of exposure is, the egative film location that makes is placed on above the photosensitive dry film, vacuumize egative film and photosensitive dry film are fitted tightly, egative film is shone with the exposure energy of setting by ultraviolet source again, make the photosensitive dry film polymerization reaction take place that receives light source irradiation and crosslinking curing, and the photosensitive dry film that does not receive light source irradiation does not become, indirectly with image transfer to photosensitive dry film.
5. the manufacture method of flexible printed circuit board as claimed in claim 4 is characterized in that:
Described video picture step is, with semi-finished product and the dilute alkaline soln even contact after the exposure, removes the active group of unexposed portion in the photosensitive dry film, exposes copper foil surface, only keeps the visuals of photosensitive cross-linking curing.
6. the manufacture method of flexible printed circuit board as claimed in claim 5 is characterized in that:
Described etching step is, with semi-finished product after the video picture and etching solution even contact, removes exposed copper foil surface, preserves the visuals that photosensitive cross-linking solidifies and is the circuit that needs.
7. the manufacture method of flexible printed circuit board as claimed in claim 6 is characterized in that:
Described striping step is, with semi-finished product after the etching and strong base solution even contact, removes the photosensitive dry film of crosslinking curing, and the copper foil surface below it is exposed.
8. the manufacture method of flexible printed circuit board as claimed in claim 7 is characterized in that:
Described subsides epiphragma heat-press step is, the processing of earlier welding resistance epiphragma material being holed on request, fit in copper foil surface according to the etching alignment mark then, insert the hot press pressing after folding, temperature is 170 ℃～180 ℃, pressure is 280psi～300psi, and hot pressing total time is 140min～160min, and wherein the high temperature pressing time is 20min～30min.
9. the manufacture method of flexible printed circuit board as claimed in claim 8 is characterized in that:
Described O/S testing procedure is that employing O/S tester table carries out the electrical property analysis to little FPC semi-finished product, tests to have or not out short circuit phenomenon.
10. the manufacture method of flexible printed circuit board as claimed in claim 9 is characterized in that:
The FPC product step that described die-cut external form adheres to specification is, adopts to beat the hole that the location hole step gets and little FPC semi-finished product are navigated on the alignment pin of mould the product that use punching out mould punching external form adheres to specification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510022341XA CN100484370C (en) | 2005-12-15 | 2005-12-15 | Production of flexible printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510022341XA CN100484370C (en) | 2005-12-15 | 2005-12-15 | Production of flexible printing circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1984534A true CN1984534A (en) | 2007-06-20 |
| CN100484370C CN100484370C (en) | 2009-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200510022341XA Active CN100484370C (en) | 2005-12-15 | 2005-12-15 | Production of flexible printing circuit board |
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| CN (1) | CN100484370C (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102505132A (en) * | 2011-10-25 | 2012-06-20 | 深南电路有限公司 | Encapsulation base plate surface electroplating method |
| CN102638945A (en) * | 2012-03-21 | 2012-08-15 | 深圳崇达多层线路板有限公司 | Method for producing goldfinger via twice electroplating |
| CN102821554A (en) * | 2012-08-27 | 2012-12-12 | 中国科学院理化技术研究所 | Flexible circuit suction filtration forming method |
| CN103068159A (en) * | 2012-12-14 | 2013-04-24 | 意力(广州)电子科技有限公司 | Large flexible printed circuit (FPC) and typesetting method of manufacturing FPC |
| CN103128798A (en) * | 2013-02-28 | 2013-06-05 | 莆田市城厢区星华电子模具有限公司 | Punching die used for circuit boards |
| CN103171246A (en) * | 2011-12-23 | 2013-06-26 | 昆山允升吉光电科技有限公司 | Manufacture method of silicon solar cell electrode screen board |
| CN103203981A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | SMT (surface mounting technology) template with locating points and manufacturing method thereof |
| CN101547554B (en) * | 2009-05-08 | 2013-11-27 | 钟火炎 | Multi-functional flexible conductor circuit board and production method thereof |
| CN103731993A (en) * | 2014-01-17 | 2014-04-16 | 杨秀英 | Machining method for single-side flexible printed circuit board |
| CN105188267A (en) * | 2015-09-10 | 2015-12-23 | 昆山龙朋精密电子有限公司 | Method for mirroring production of FPC (Flexible Printed Circuit) single panel |
| CN105911405A (en) * | 2016-03-30 | 2016-08-31 | 业成光电（深圳）有限公司 | Manufacturing method for anti-break electric closed loop |
| CN103917058B (en) * | 2014-03-27 | 2017-02-22 | 厦门爱谱生电子科技有限公司 | Method for manufacturing pluggable finger type flexible circuit board |
| CN106851998A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of fine and closely woven PCB circuits and preparation method |
| CN108541146A (en) * | 2018-04-24 | 2018-09-14 | 珠海元盛电子科技股份有限公司 | A kind of fully-additive process technology of full printing single layer FPC |
| CN108776558A (en) * | 2018-08-08 | 2018-11-09 | 意力(广州)电子科技有限公司 | The production method of touch sensing |
| CN111447743A (en) * | 2020-04-09 | 2020-07-24 | 江门市盈声电子科技有限公司 | Circuit board preparation process and circuit board prepared by using same |
| CN112020225A (en) * | 2020-07-29 | 2020-12-01 | 厦门爱谱生电子科技有限公司 | Method for manufacturing narrow-frame flexible circuit board |
| CN115023053A (en) * | 2022-06-22 | 2022-09-06 | 苏州斯普兰蒂科技股份有限公司 | Novel FPC production process |
Family Cites Families (1)
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| CN1335743A (en) * | 2000-07-26 | 2002-02-13 | 赵远涛 | Technological process of making printed circuit board |
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Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101547554B (en) * | 2009-05-08 | 2013-11-27 | 钟火炎 | Multi-functional flexible conductor circuit board and production method thereof |
| CN102505132A (en) * | 2011-10-25 | 2012-06-20 | 深南电路有限公司 | Encapsulation base plate surface electroplating method |
| CN103171246A (en) * | 2011-12-23 | 2013-06-26 | 昆山允升吉光电科技有限公司 | Manufacture method of silicon solar cell electrode screen board |
| CN103203981A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | SMT (surface mounting technology) template with locating points and manufacturing method thereof |
| CN102638945A (en) * | 2012-03-21 | 2012-08-15 | 深圳崇达多层线路板有限公司 | Method for producing goldfinger via twice electroplating |
| CN102638945B (en) * | 2012-03-21 | 2014-09-03 | 深圳崇达多层线路板有限公司 | Method for producing goldfinger via twice electroplating |
| CN102821554B (en) * | 2012-08-27 | 2015-05-06 | 中国科学院理化技术研究所 | Flexible circuit suction filtration forming method |
| CN102821554A (en) * | 2012-08-27 | 2012-12-12 | 中国科学院理化技术研究所 | Flexible circuit suction filtration forming method |
| CN103068159A (en) * | 2012-12-14 | 2013-04-24 | 意力(广州)电子科技有限公司 | Large flexible printed circuit (FPC) and typesetting method of manufacturing FPC |
| CN103068159B (en) * | 2012-12-14 | 2015-12-09 | 意力(广州)电子科技有限公司 | A large FPC and composition method when making FPC |
| CN103128798A (en) * | 2013-02-28 | 2013-06-05 | 莆田市城厢区星华电子模具有限公司 | Punching die used for circuit boards |
| CN103731993A (en) * | 2014-01-17 | 2014-04-16 | 杨秀英 | Machining method for single-side flexible printed circuit board |
| CN103917058B (en) * | 2014-03-27 | 2017-02-22 | 厦门爱谱生电子科技有限公司 | Method for manufacturing pluggable finger type flexible circuit board |
| CN105188267A (en) * | 2015-09-10 | 2015-12-23 | 昆山龙朋精密电子有限公司 | Method for mirroring production of FPC (Flexible Printed Circuit) single panel |
| CN105911405B (en) * | 2016-03-30 | 2019-03-15 | 业成光电（深圳）有限公司 | The production method of anti-breaking formula electrical property loop |
| CN105911405A (en) * | 2016-03-30 | 2016-08-31 | 业成光电（深圳）有限公司 | Manufacturing method for anti-break electric closed loop |
| CN106851998A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of fine and closely woven PCB circuits and preparation method |
| CN108541146A (en) * | 2018-04-24 | 2018-09-14 | 珠海元盛电子科技股份有限公司 | A kind of fully-additive process technology of full printing single layer FPC |
| CN108776558A (en) * | 2018-08-08 | 2018-11-09 | 意力(广州)电子科技有限公司 | The production method of touch sensing |
| CN111447743A (en) * | 2020-04-09 | 2020-07-24 | 江门市盈声电子科技有限公司 | Circuit board preparation process and circuit board prepared by using same |
| CN112020225A (en) * | 2020-07-29 | 2020-12-01 | 厦门爱谱生电子科技有限公司 | Method for manufacturing narrow-frame flexible circuit board |
| CN115023053A (en) * | 2022-06-22 | 2022-09-06 | 苏州斯普兰蒂科技股份有限公司 | Novel FPC production process |
| CN115023053B (en) * | 2022-06-22 | 2023-04-11 | 苏州斯普兰蒂科技股份有限公司 | FPC production process |
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| CN100484370C (en) | 2009-04-29 |
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Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Production of flexible printing circuit board License type: Exclusive license Record date: 20080504 |
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Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
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Effective date of registration: 20220303 Address after: 214500 No. 96, Xingye Road, Jingjiang City, Taizhou City, Jiangsu Province (in Chengnan Incubation Park) Patentee after: Jingjiang Defang Technology Service Co.,Ltd. Address before: 214500 Room 101, building 6, Biboyuan, Chunjiang Huacheng, Jingjiang City, Taizhou City, Jiangsu Province Patentee before: Jingjiang Shunxiang Trade Co.,Ltd. |