CN203352947U - Printed circuit board flexible pad structure - Google Patents

Printed circuit board flexible pad structure Download PDF

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Publication number
CN203352947U
CN203352947U CN 201320462418 CN201320462418U CN203352947U CN 203352947 U CN203352947 U CN 203352947U CN 201320462418 CN201320462418 CN 201320462418 CN 201320462418 U CN201320462418 U CN 201320462418U CN 203352947 U CN203352947 U CN 203352947U
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CN
China
Prior art keywords
pad
circuit board
printed circuit
insulating barrier
pad structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320462418
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Chinese (zh)
Inventor
吴伟平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Weifeng Printing Machinery Factory
Original Assignee
Wuxi Weifeng Printing Machinery Factory
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Weifeng Printing Machinery Factory filed Critical Wuxi Weifeng Printing Machinery Factory
Priority to CN 201320462418 priority Critical patent/CN203352947U/en
Application granted granted Critical
Publication of CN203352947U publication Critical patent/CN203352947U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a printed circuit board flexible pad structure. The printed circuit board flexible pad structure comprises an insulating layer and a base; the insulating layer is arranged on the base; a pad is arranged at a top portion at the center of the insulating layer; a through hole located below the pad is formed inside the insulating layer; two sides inside the through hole are provided with one triangular stiffener respectively; the inner side of each triangular stiffener is provided with a conductive layer; a spring assembly is arranged inside a sealed cavity which is formed through the surrounding the conductive layers; and an upper portion of the spring assembly is connected with a pressing plate. With the printed circuit board flexible pad structure adopted, the processing of the pad can be more reliable, and insufficient welding caused by roughness and collapse of the pad can be avoided, and therefore, the reliability of electrical connection of a printed circuit board can be improved; and with the triangular stiffeners additionally adopted, the structure of the pad is strengthened, and a supporting force can be provided for the pad above from below for a long time.

Description

A kind of printed circuit board (PCB) elastomeric pad structure
Technical field
The utility model relates to printing technology, relates in particular to a kind of printed circuit board (PCB) elastomeric pad structure.
Background technology
Printed circuit board develops into double sided board, multi-layer sheet and flex plate from individual layer, and constantly to high accuracy, high density and high reliability future development, continuous reduced volume, Cost reduction, raising performance.Printed circuit board manufacturing technology development trend is to high density, high accuracy, fine pore, thin wire, little spacing, highly reliable, multiple stratification, high-speed transfer, light weight, slim future development on performance.The wire of single sided board wherein only appears at wherein one side, and double sided board is the extension of single sided board, can carry out the circuit of conducting between two-layer by via hole, makes it to form needed network and connects.At present, in common multilayer board, usually be followed successively by from top to bottom pad, line layer and insulating barrier, wherein pad is positioned at the upper surface of line layer, and insulating barrier is formed with through hole, sometimes, the position of pad can partly or entirely be dropped in through hole corresponding to the position of through hole, can make in this case pad processing unreliable, easily occur causing the electric connection reliability of printed circuit board (PCB) bad because of pad out-of-flatness, the rosin joint that subsides and bring; The supporting construction that it is important to point out that the pad below causes glue, China ink, dust etc. to enter in it because sealing is not enough sometimes, and is not easy to cleaning.Therefore, for above aspect, need to make rational improvement.
The utility model content
The purpose of this utility model be to provide a kind of processing comparatively reliable, be conducive to weld smooth, as can to improve printed circuit board (PCB) electric connection reliability, be conducive to improve the printed circuit board (PCB) elastomeric pad structure of wiring board printing efficiency, to solve many deficiencies of prior art.
The purpose of this utility model is carried out specific implementation by the following technical programs:
A kind of printed circuit board (PCB) elastomeric pad structure, comprise insulating barrier, base, described insulating barrier is arranged on the base top, be positioned at insulating barrier center position top pad is set, the insulating barrier that is positioned at the pad below arranges through hole and is positioned at the inner both sides of this through hole a triangle reinforcement is set respectively, each triangle reinforcement inboard arranges conductive layer, and the inside that is positioned at the sealing chamber that conductive layer surrounds arranges spring assembly, and this spring assembly top connects pressing plate.
Described pressing plate upper surface holds out against the bottom surface of pad, sets up a circle sealing ring at the pressing plate outer edge and between pad and conductive layer.
The beneficial effect of printed circuit board (PCB) elastomeric pad structure described in the utility model is:
(1) can make pad processing comparatively reliable, avoid occurring because of pad out-of-flatness, the rosin joint that subsides and bring, thereby improve the electric connection reliability of described printed circuit board (PCB);
(2) by setting up the triangle reinforcement, reinforced pad structure;
(3) by elastic mechanism and sealing ring are set, can give for a long time the support force of top pad from below, thisly set up firm supporting construction below pad, also can prevent that China ink, glue, dust etc. from entering simultaneously.
The accompanying drawing explanation
Below according to drawings and embodiments the utility model is described in further detail.
Fig. 1 is the structure chart of the described printed circuit board (PCB) elastomeric pad of the utility model embodiment structure.
In figure: 1, insulating barrier; 2, base; 3, pad; 4, triangle reinforcement; 5, conductive layer; 6, spring assembly; 7, pressing plate; 8, sealing ring.
Embodiment
As shown in Figure 1, the described printed circuit board (PCB) elastomeric pad of the utility model embodiment structure, comprise insulating barrier 1, base 2, described insulating barrier 1 is arranged on base 2 tops, be positioned at insulating barrier 1 center position top pad 3 is set, the insulating barrier 1 that is positioned at pad 3 belows arranges through hole and is positioned at the inner both sides of this through hole a triangle reinforcement 4 is set respectively, and each triangle reinforcement 4 inboard arranges conductive layer 5;
The inside that is positioned at the sealing chamber that conductive layer 5 surrounds arranges spring assembly 6, these spring assembly 6 tops connection pressing plates 7 and this pressing plate 7 upper surfaces hold out against the bottom surface of pad 3, set up a circle sealing ring 8 at pressing plate 7 outer edges and between pad 3 and conductive layer 5.

Claims (3)

1. a printed circuit board (PCB) elastomeric pad structure, comprise insulating barrier, base, and described insulating barrier is arranged on the base top, it is characterized in that:
Be positioned at insulating barrier center position top pad is set, the insulating barrier that is positioned at the pad below arranges through hole and is positioned at the inner both sides of this through hole a triangle reinforcement is set respectively, each triangle reinforcement inboard arranges conductive layer, the inside that is positioned at the sealing chamber that conductive layer surrounds arranges spring assembly, and this spring assembly top connects pressing plate.
2. a kind of printed circuit board (PCB) elastomeric pad structure as claimed in claim 1, it is characterized in that: described pressing plate upper surface holds out against the bottom surface of pad.
3. a kind of printed circuit board (PCB) elastomeric pad structure as claimed in claim 1, is characterized in that: set up a circle sealing ring at the pressing plate outer edge and between pad and conductive layer.
CN 201320462418 2013-07-31 2013-07-31 Printed circuit board flexible pad structure Expired - Fee Related CN203352947U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320462418 CN203352947U (en) 2013-07-31 2013-07-31 Printed circuit board flexible pad structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320462418 CN203352947U (en) 2013-07-31 2013-07-31 Printed circuit board flexible pad structure

Publications (1)

Publication Number Publication Date
CN203352947U true CN203352947U (en) 2013-12-18

Family

ID=49752789

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320462418 Expired - Fee Related CN203352947U (en) 2013-07-31 2013-07-31 Printed circuit board flexible pad structure

Country Status (1)

Country Link
CN (1) CN203352947U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103402307A (en) * 2013-07-31 2013-11-20 无锡市伟丰印刷机械厂 Resilient printed circuit board pad structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103402307A (en) * 2013-07-31 2013-11-20 无锡市伟丰印刷机械厂 Resilient printed circuit board pad structure
CN103402307B (en) * 2013-07-31 2016-09-07 安徽博泰电路科技有限公司 A kind of printed circuit board (PCB) elastomeric pad structure

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131218

Termination date: 20140731

EXPY Termination of patent right or utility model