CN204669713U - Soft or hard is in conjunction with multilayer circuit board - Google Patents
Soft or hard is in conjunction with multilayer circuit board Download PDFInfo
- Publication number
- CN204669713U CN204669713U CN201520285918.5U CN201520285918U CN204669713U CN 204669713 U CN204669713 U CN 204669713U CN 201520285918 U CN201520285918 U CN 201520285918U CN 204669713 U CN204669713 U CN 204669713U
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- soft
- circuit board
- hard
- wiring board
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- Expired - Fee Related
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Abstract
The utility model discloses a kind of soft or hard in conjunction with multilayer circuit board, comprises at least two hard wiring boards and at least one soft-circuit board; Described hard wiring board is connected by soft-circuit board; Be electrically connected by soft-circuit board between each hard wiring board; Each hard wiring board and soft-circuit board junction offer at least one location hole; Described location hole comprises macropore and the aperture of coaxial setting, and macropore and aperture are mutually through; Each hard wiring board offers radiating groove, and each radiating groove runs through two sidewalls of corresponding hard wiring board respectively.Heat on hard wiring board, in conjunction with multilayer circuit board, is effectively distributed by radiating groove, good heat dissipation effect by soft or hard described in the utility model, thus effectively can improve the useful life of heating panel.
Description
Technical field
The utility model relates to multilayer circuit board technical field, is specifically related to a kind of soft or hard in conjunction with multilayer circuit board.
Background technology
The birth of FPC and PCB and development, expedited the emergence of this new product of Rigid Flex.Therefore, flexible and hard combined circuit board is exactly flexible circuit board and rigid wiring board in fact, through operations such as pressings, combines by related process requirement.It is thin that flexible and hard combined circuit board has thickness, lightweight, and volume is little, and three dimensions can free bend, the advantage such as flexible, folding.Just because of it, there is above-described premium properties, so it can advance the miniaturization of electronic product further, lightness, slimming and mobilism development.
Flexible and hard combined circuit board is mainly used in the various electronic field such as mobile phone, battery of mobile phone, talk back equipment, notebook computer, computer periphery, PDA, CD-ROM, VCD, DVD, magnetic head, printer, facsimile machine, photocopier, camera.
Along with the future development that electronic product tendency is portable, ultra-thin, also more and more higher to the requirement of wiring board unit are wiring, especially for the wiring board that soft or hard combines.Such as cause the live width of circuit single wire and adjacent wires spacing more and more less, thus make the heat on wiring board more and more difficulty distribute, thus affect the useful life of wiring board.
Utility model content
For the deficiencies in the prior art, the purpose of this utility model is to provide a kind of soft or hard of rational in infrastructure, good heat dissipation effect in conjunction with multilayer circuit board.
For achieving the above object, the utility model adopts following technical scheme:
A kind of soft or hard, in conjunction with multilayer circuit board, comprises at least two hard wiring boards and at least one soft-circuit board; Described hard wiring board is connected by soft-circuit board; Be electrically connected by soft-circuit board between each hard wiring board; Each hard wiring board and soft-circuit board junction offer at least one location hole; Described location hole comprises macropore and the aperture of coaxial setting, and macropore and aperture are mutually through; Each hard wiring board offers radiating groove, and each radiating groove runs through two sidewalls of corresponding hard wiring board respectively.
Preferably, each hard wiring board comprises at least two-layer substrate layer respectively, and each substrate layer is printed with at least one circuit layer respectively; The mutual stacked setting of described substrate layer, and fixed by adhesive between adjacent two-layer substrate layer; Described adhesive is coated on substrate layer on the surface or on circuit layer, described radiating groove is between adjacent two-layer substrate layer.
Preferably, the upper surface of each substrate layer and/or lower surface offer groove.
Preferably, adjacent two substrate layer upper grooves coordinate the described radiating groove of formation.
Preferably, described radiating groove is opened in substrate layer, and radiating groove in each substrate layer is spaced.
Preferably, described soft-circuit board is provided with the golden finger connecting external interface.
Preferably, described soft-circuit board and hard wiring board are by being welded and fixed.
Preferably, described hard wiring board offers through hole, this through hole runs through each substrate layer of corresponding hard wiring board.
Preferably, each through hole communicates with the radiating groove on corresponding hard wiring board.
Preferably, heat sink material is filled with in the described through hole of part.
The beneficial effects of the utility model:
Compared with prior art, described in this real utility model, soft or hard offers radiating groove in conjunction with on the hard wiring board of multilayer circuit board, is effectively distributed by the heat on hard wiring board by radiating groove, improves the useful life of heating panel.Described location hole forms large aperture, and structure like this is the borehole accuracy for improving during boring, reduces the rejection number produced in manufacturing process.
Accompanying drawing explanation
Fig. 1 be in embodiment of the present utility model a kind of soft or hard in conjunction with multilayer circuit board structure schematic diagram;
Fig. 2 be in embodiment of the present utility model a kind of soft or hard in conjunction with multilayer circuit board phantom.
In figure: 1, hard wiring board; 10, location hole; 101, macropore; 102, aperture; 11, radiating groove; 12, substrate layer; 13, circuit layer; 14, through hole; 15, heat sink material; 2, soft-circuit board; 21, golden finger.
Embodiment
Below, by reference to the accompanying drawings and embodiment, the utility model is described further:
With reference to Fig. 1 and Fig. 2, a kind of soft or hard described in the present embodiment, in conjunction with multilayer circuit board, comprises at least two hard wiring boards 1 and at least one soft-circuit board 2.Described hard wiring board 1 is connected by soft-circuit board 2.Be electrically connected by soft-circuit board 2 between each hard wiring board 1.Each hard wiring board 1 offers at least one location hole 10 with soft-circuit board 2 junction.Described location hole 10 comprises macropore 101 and the aperture 102 of coaxial setting, and macropore 101 is mutually through with aperture 102.Preferably, described macropore 101 is in truncated cone-shaped, and aperture 102 is cylindrical.The minimum diameter of described macropore 101 is in the equal diameters of aperture 102, and the maximum gauge of macropore 101 is about 1.2 times of aperture 102.The diameter of described aperture 102 is about about 0.15mm.Locate more accurate when described location hole can be used for improving soft hard circuit board welding between soft hard circuit board.
Each hard wiring board 1 offers radiating groove 11.Each radiating groove 11 runs through two sidewalls of corresponding hard wiring board 1 respectively.Preferably, described soft-circuit board 2 is provided with the golden finger 21 connecting external interface.Preferably, described soft-circuit board 2 and hard wiring board 1 are by being welded and fixed.
Each hard wiring board 1 comprises at least two-layer substrate layer 12 respectively, and each substrate layer 12 is printed with at least one circuit layer 13 respectively.The mutual stacked setting of described substrate layer 12, and fixed by adhesive between adjacent two-layer substrate layer 12.Described adhesive is coated on substrate layer 12 on the surface or on circuit layer 13.Described radiating groove 11 is between 12 layers adjacent, two-layer substrate layer.
As preferred embodiment, the upper surface of each substrate layer 12 and/or lower surface offer groove.Preferably, adjacent two substrate layer 12 upper grooves coordinate the described radiating groove 11 of formation.
Be appreciated that described radiating groove 11 can also be opened in substrate layer 12, and radiating groove 11 in each substrate layer 12 is spaced.In like manner, groove can be offered on substrate layer 12 and described radiating groove 11 is offered in inside simultaneously.
As another preferred embodiment, in order to further improve the radiating effect of wiring board, described hard wiring board 1 offers through hole 14, and this through hole 14 runs through each substrate layer 12 of corresponding hard wiring board 1.Preferably, each through hole 14 communicates with the radiating groove 11 on corresponding hard wiring board 1.Heat in radiating groove 11 is distributed by through hole 14, improves radiating rate.Preferably, in order to further improve radiating rate, heat sink material 15 can be filled with in some or all of described through hole 14.
In sum, described in this real utility model, soft or hard offers radiating groove 11 in conjunction with on the hard wiring board 1 of multilayer circuit board, is effectively distributed by the heat on hard wiring board 1 by radiating groove 11, improves the useful life of heating panel.Described location hole 10 forms large aperture, and structure like this is the borehole accuracy for improving during boring, reduces the rejection number produced in manufacturing process.
To one skilled in the art, according to technical scheme described above and design, other various corresponding change and deformation can be made, and all these change and deformation all should belong within the protection range of the utility model claim.
Claims (10)
1. soft or hard is in conjunction with multilayer circuit board, it is characterized in that: comprise at least two hard wiring boards and at least one soft-circuit board; Described hard wiring board is connected by soft-circuit board; Be electrically connected by soft-circuit board between each hard wiring board; Each hard wiring board and soft-circuit board junction offer at least one location hole; Described location hole comprises macropore and the aperture of coaxial setting, and macropore and aperture are mutually through; Each hard wiring board offers radiating groove, and each radiating groove runs through two sidewalls of corresponding hard wiring board respectively.
2. soft or hard according to claim 1 is in conjunction with multilayer circuit board, it is characterized in that: each hard wiring board comprises at least two-layer substrate layer respectively, and each substrate layer is printed with at least one circuit layer respectively; The mutual stacked setting of described substrate layer, and fixed by adhesive between adjacent two-layer substrate layer; Described adhesive is coated on substrate layer on the surface or on circuit layer, described radiating groove is between adjacent two-layer substrate layer.
3. soft or hard according to claim 2 is in conjunction with multilayer circuit board, it is characterized in that: the upper surface of each substrate layer and/or lower surface offer groove.
4. soft or hard according to claim 3 is in conjunction with multilayer circuit board, it is characterized in that: adjacent two substrate layer upper grooves coordinate the described radiating groove of formation.
5. soft or hard according to claim 2 is in conjunction with multilayer circuit board, it is characterized in that: described radiating groove is opened in substrate layer, and radiating groove in each substrate layer is spaced.
6. the soft or hard according to any one of claim 1-5, in conjunction with multilayer circuit board, is characterized in that: described soft-circuit board is provided with the golden finger connecting external interface.
7. the soft or hard according to any one of claim 1-5, in conjunction with multilayer circuit board, is characterized in that: described soft-circuit board and hard wiring board are by being welded and fixed.
8. the soft or hard according to any one of claim 1-5, in conjunction with multilayer circuit board, is characterized in that: described hard wiring board offers through hole, and this through hole runs through each substrate layer of corresponding hard wiring board.
9. soft or hard according to claim 8 is in conjunction with multilayer circuit board, it is characterized in that: each through hole communicates with the radiating groove on corresponding hard wiring board.
10. soft or hard according to claim 9 is in conjunction with multilayer circuit board, it is characterized in that: be filled with heat sink material in the described through hole of part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520285918.5U CN204669713U (en) | 2015-05-06 | 2015-05-06 | Soft or hard is in conjunction with multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520285918.5U CN204669713U (en) | 2015-05-06 | 2015-05-06 | Soft or hard is in conjunction with multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204669713U true CN204669713U (en) | 2015-09-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520285918.5U Expired - Fee Related CN204669713U (en) | 2015-05-06 | 2015-05-06 | Soft or hard is in conjunction with multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204669713U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112382314A (en) * | 2020-12-11 | 2021-02-19 | 全南群英达电子有限公司 | Integrated coil miniature magnetic head |
| CN112449488A (en) * | 2019-09-05 | 2021-03-05 | 华为技术有限公司 | Circuit board and electronic equipment |
-
2015
- 2015-05-06 CN CN201520285918.5U patent/CN204669713U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112449488A (en) * | 2019-09-05 | 2021-03-05 | 华为技术有限公司 | Circuit board and electronic equipment |
| CN112382314A (en) * | 2020-12-11 | 2021-02-19 | 全南群英达电子有限公司 | Integrated coil miniature magnetic head |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150923 Termination date: 20190506 |