CN105636348A - Flexible printed circuit board and mobile terminal - Google Patents
Flexible printed circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105636348A CN105636348A CN201511027749.6A CN201511027749A CN105636348A CN 105636348 A CN105636348 A CN 105636348A CN 201511027749 A CN201511027749 A CN 201511027749A CN 105636348 A CN105636348 A CN 105636348A
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- CN
- China
- Prior art keywords
- lead
- copper foil
- pad
- wire
- foil layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
Abstract
The invention provides a flexible printed circuit board and a mobile terminal. The flexible printed circuit board comprises a substrate layer, a copper foil layer arranged on the substrate layer and a covering film layer. A pad is arranged on the copper foil layer. At least one lead wire is arranged on the pad and is led out from the pad to the copper foil layer. All or parts of the at least one lead wire are provided with reinforcing blocks which compresses the lead wires on the copper foil layer. The covering film layer covers the copper foil layer and compresses the at least one lead wire and the reinforcing blocks. According to the invention, at least one lead wire is led out from the pad to the copper foil layer; all or parts of the at least one lead wire are provided with the reinforcing blocks; and the lead wires are compressed on the copper foil layer by the reinforcing blocks. Thus, by use of the reinforcing blocks, the contact area between the pad and the copper foil layer is increased, and the covering film layer is used for compressing the at least one lead wire and the reinforcing blocks, so by use of the compression force of the covering film layer, connection tightness between the pad and the copper foil layer is increased, thereby increasing adhesion force of the pad to the copper foil layer.
Description
Technical field
The present invention relates to field of circuit boards, particularly relate to a kind of flexible PCB and mobile terminal.
Background technology
Flexible PCB (FlexiblePrintedCircuit, FPC) it is the printed circuit board prepared with flexible material for base material, have that wiring density height, light weight, thickness is thin and the advantage such as made of soft, it is flexible, winding and folding, therefore, it is widely used in the conducting system of modern various electronic product. At present, single-layer-flex circuit is typically employed on its copper foil layer and arranges pad, then passes through the electronic devices and components such as pad and resistance, capacitor, integrated circuit and is connected, to realize electrically conducting of flexible PCB and described electronic devices and components.
But, due to pad small volume, therefore the contact area between pad and copper foil layer is less, causes that the adhesive strength of pad is relatively low. Flexible PCB in use or usually can be subject to External Force Acting in the process being connected with other electronic devices and components; such as pull or shock etc.; and External Force Acting can cause pad to come off from copper foil layer on pad or part separates with copper foil layer and causes rosin joint; thus causing loose contact or disconnection between pad and other electronic devices and components; may result in flexible PCB time serious and failure phenomenon occurs, greatly reduce the dependability of flexible PCB.
Summary of the invention
In view of the above-mentioned problems in the prior art, the present invention provides a kind of flexible PCB, and it can increase pad adhesive force on copper foil layer effectively, it is prevented that Pad off, to ensure that flexible PCB normally uses.
It addition, the present invention also provides for a kind of mobile terminal applying described flexible PCB.
To achieve these goals, embodiment of the present invention provides following technical scheme:
First aspect, the present invention provides a kind of flexible PCB, including substrate layer, it is located at the copper foil layer on described substrate layer, described flexible PCB also includes the cover layer being arranged on described copper foil layer, described copper foil layer is provided with the pad exposing described cover layer, described pad is provided with at least one lead-in wire, described at least one lead-in wire leads on described copper foil layer from described pad, described at least one lead-in wire in all or part of on be provided with boss, described lead-in wire is pressed on described copper foil layer by described boss, described cover layer is covered on described copper foil layer, and compress described at least one lead-in wire and described boss.
In conjunction with first aspect, in the first possible implementation of first aspect, described lead-in wire is four, article four, described lead-in wire respectively centered by described pad at different directional divergences, article four, described lead-in wire includes one first lead-in wire and three second lead-in wires, described first lead-in wire leads on described copper foil layer from described pad, in order to connect electronic devices and components, article three, described second lead-in wire all leads on described copper foil layer from described pad, and three described second upper positions near described pad of lead-in wire are provided with described boss.
The first possible implementation in conjunction with first aspect, in the implementation that the second of first aspect is possible, each described second lead-in wire is strip structure, including the first link being oppositely arranged and the second link, described first link is drawn from described pad, described second link is vertical with described first link to be connected, and is provided with described boss on each described second link.
The first possible implementation in conjunction with first aspect, in the third possible implementation of first aspect, each described second lead-in wire is triangular structure, including point and the compressed part connecting described point, described point is drawn from described pad, described compressed part extends on described copper foil layer and is connected with this copper foil layer, and described boss is respectively arranged in each described compressed part.
In conjunction with first aspect, in the 4th kind of possible implementation of first aspect, each described boss is square copper billet, square block tin or square conduction blob of viscose.
In conjunction with first aspect, in the 5th kind of possible implementation of first aspect, each described boss is circular copper billet, square block tin or square conduction blob of viscose.
In conjunction with first aspect, in the 6th kind of possible implementation of first aspect, described pad center is provided with via, is filled with scolding tin in described via.
In conjunction with first aspect, in the 7th kind of possible implementation of first aspect, the position of the corresponding described pad of described cover layer offers opening, and the area of described opening is more than the area of described pad.
In conjunction with first aspect, in the 8th kind of possible implementation of first aspect, described cover layer is adhered on described copper foil layer by viscose glue.
Second aspect, present invention also offers a kind of mobile terminal, and described mobile terminal includes body, mainboard and flexible PCB described above, and described mainboard is located at described body interior, and described flexible PCB is located on described mainboard, and is electrically connected to described mainboard.
In sum, in flexible PCB provided by the invention, described pad is drawn at least one lead-in wire, and this at least one leads on copper foil layer, all or part of at least one lead-in wire arranges boss, and utilizes this boss to be pressed on copper foil layer by lead-in wire. Therefore, utilize this boss that the contact area between pad and copper foil layer is increased, and by the cover layer covered on copper foil layer, at least one lead-in wire and this boss are compressed, thus utilizing the thrust of this cover layer to make the degree of being completely embedded between pad and copper foil layer increase, and then increase pad adhesive force on copper foil layer, prevent described pad from the phenomenon come off occurring, improve the dependability of flexible PCB.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of the flexible PCB that first embodiment of the invention provides;
Fig. 2 is the another kind of structural representation of the flexible PCB of first embodiment of the invention;
Fig. 3 is the structural representation of the flexible PCB that third embodiment of the invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments. Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
For ease of describing, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms the relation of an element or feature and another (a bit) element or feature as illustrated in the drawing is described. It is appreciated that, when an element or layer be referred to as another element or layer " on ", " being connected to " or " being couple to " another element or during layer, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or can there is intervening elements or layer.
It is appreciated that terminology used here merely to describe specific embodiment, is not intended to limit the present invention. When here using, clearly stating unless the context otherwise, otherwise singulative " " and " being somebody's turn to do " are also intended to include plural form. Further, when using in this manual, term " includes " and/or shows " comprising " existence of described feature, entirety, step, element and/or assembly, but is not excluded for existence or the increase of other features one or more, entirety, step, element, assembly and/or its combination. Description subsequent descriptions is implement the better embodiment of the present invention, and right described description is for the purpose of the rule so that the present invention to be described, is not limited to the scope of the present invention. Protection scope of the present invention is when being as the criterion depending on the defined person of claims.
A kind of mobile terminal that the embodiment of the present invention provides, including body (not shown), mainboard (not shown) and flexible PCB, described mainboard is located at described body interior, and described flexible PCB is located on described mainboard, and is electrically connected to described mainboard.
In an embodiment of the present invention, described mobile terminal can be but be not limited to the intelligent mobile terminals such as mobile phone, notebook computer, panel computer, handheld device or media player. In the present embodiment, illustrate for described mobile terminal for mobile phone.
Referring to Fig. 1, for the flexible PCB 100 that first embodiment of the invention provides, described flexible PCB 100 includes substrate layer (not shown), the copper foil layer 11 be located on described substrate layer and be arranged at the cover layer 12 on described copper foil layer 11. Being provided with pad 11a on described copper foil layer 11, this pad 11a exposes described cover layer 12; Described pad 11a is provided with at least one lead-in wire 111, one end of described at least one lead-in wire 111 is drawn from described pad 11a and extends on described copper foil layer 11, described at least one lead-in wire 111 in all or part of on be provided with boss 112, described lead-in wire 111 is pressed on described copper foil layer 11 by described boss 112. Described cover layer 12 is covered on described copper foil layer 11, and compresses described at least one lead-in wire 111 and described boss 112. Preferably, described boss 112 is positioned on described copper foil layer 11, and is close to described pad 11a and arranges, and is pressed on described copper foil layer 11 by described lead-in wire 111.
The flexible PCB 100 that first embodiment of the invention provides, by drawing lead-in wire 111 described at least one on described pad 11a to described copper foil layer 11, and arrange on described lead-in wire 111 on described boss 112 to copper foil layer 11, utilize contacting between described boss 112 and copper foil layer 11, to strengthen the described lead-in wire 111 adhesive force on described copper foil layer 11; Then described lead-in wire 111 and described boss 112 are pressed on described copper foil layer 11 by recycling cover layer 12, owing to lead-in wire 111 is drawn from described pad 11a, described lead-in wire 111 is compressed by described cover layer 12, namely realize described pad 11a portion compresses, to prevent described pad 11a from obscission occurring when being subject to external force collision or pullling, it is ensured that the dependability of described flexible PCB 100.
Specifically, described flexible PCB 100 is lamina, namely only includes one layer of described copper foil layer 11. Described pad 11a can be one or more that be located on described Copper Foil 11. It is understood that in other embodiments, described flexible PCB 100 can be also doubling plate or multi-layer sheet etc.
In the present embodiment, described lead-in wire 111 is four, and four described lead-in wires 111 are drawn from described pad 11a, and outwardly directed disperses different centered by described pad 11a respectively, namely four described lead-in wires 111 are drawn from the periphery of pad 11a, and stretch out centered by this pad 11a and disperse. Article four, described lead-in wire 111 includes one first lead-in wire 111a and three second lead-in wire 111b, described first lead-in wire 111a leads on described copper foil layer 11 from described pad 11a, in order to connect electronic devices and components (not shown), the connection to realize described pad 11a and electronic devices and components turns on. Article three, described second lead-in wire 111b all leads on described copper foil layer 11 from described pad 11a, and is provided with described boss 112 near the position of described pad 11a on three described second lead-in wire 111b. It is understood that in other embodiments, on described first lead-in wire 111a, the position of adjacent described pad 11a may also set up described boss. Described lead-in wire 111 can be also two, six or more a plurality of etc.
Further, each described second lead-in wire 111b is strip structure, including the first link 1111 and the second link 1112, described first link 1111 is drawn from described pad 11a, described second link 1112 is vertical with described first link 1111 to be connected, and is provided with described boss 112 on each described second link 1112. By drawing described four lead-in wires 111 on described pad 11a, and it is strip structure by arranging described second lead-in wire 111b, then the 111b that goes between described second leads on described copper foil layer 11, utilize the reinforcement pressuring action of described boss 112 so that described second link 1112 is attached on described copper foil layer 11 firmly. Owing to described second goes between 111b from extraction described pad 11a, so when described second lead-in wire 111b is attached on described copper foil layer 11 firmly, described pad 11a also is able to be attached at firmly on described copper foil layer 11.
Preferably, each described boss 112 is square copper billet such that it is able to is increasing the described lead-in wire 111 adhesive force on described copper foil layer 11, is also adding pad accordingly in copper foil layer 11 upward stability simultaneously. It is understood that in other embodiments, described boss 112 can be also square block tin or square conduction blob of viscose etc.
It addition, in other embodiments, described boss 112 can be also circular copper billet. As in figure 2 it is shown, Fig. 2 gives a kind of six described lead-in wires 111 of extraction on described pad 11a, six described lead-in wires 111 include one first lead-in wire 111a and five the second lead-in wire 111b. Wherein five described second lead-in wire 111b are strip structure, and second link 1112 of described second lead-in wire 111b is provided with described boss 112, and described boss 112 is circular copper billet. Adopt the mode of circular copper billet, it is also possible to increase the described lead-in wire 111 adhesive force on described copper foil layer 11 further, also add pad accordingly in copper foil layer 11 upward stability simultaneously; Secondly, the mode of circular copper billet, the processing of described boss 112 of being also more convenient for are adopted. It is understood that in other embodiments, described boss 112 can be also circular block tin or circular conductive blob of viscose etc.
Further, in order to increase described pad 11a adhesive force on described copper foil layer 11, described pad 11a center is provided with via (not shown), is filled with scolding tin in described via. By filling described scolding tin in described via, while making described pad 11a can be attached on described copper foil layer 11, also due to have part scolding tin in described via and make described pad 11a increase relative to the scolding tin contact area of described copper foil layer 11, thus preventing described pad 11a from coming off from described copper foil layer 11 when being subject to external force further.
In the present embodiment, described cover layer 12 by paste adhesive on described copper foil layer 11, to protect cabling on described copper foil layer 11 and described pad 11a to be not subjected to lose or damage. Meanwhile, the mode of paste adhesive is adopted, it is also possible to make described cover layer 12 tightr with the connection of described copper foil layer 11, it is prevented that described coverlay 30 shifts and cannot described copper foil layer 11 be protected.
Further, on described cover layer 12, the position of corresponding described pad 11a is provided with opening 12a, to expose described pad 11a, and then is easy to the connection of described pad 11a and other electronic devices and components. Preferably, described opening 12a is the square aperture being opened on described cover layer 12, and the area that the area of described opening 12a is more than or equal to described pad 11a, it is thus possible to expose described pad 11a, in order to described pad 11a carries out electrically conducting when crimping is connected with other electronic devices and components. The area of described opening 12a is more than or equal to 0.8mm2. Owing to described pad 11a exposes described opening 12a, then other positions of described cover layer 12 are still covered on described lead-in wire 111 and boss 112, so that described pad 11a realize be connected with electronic devices and components while, it also is able to utilize described cover layer 12 described lead-in wire 111 and described boss 112 to be pressed on described copper foil layer 11, and then strengthens described pad 11a adhesive force on described copper foil layer 11. It is understandable that, in other embodiments, described opening 12a is opened in circular open on described cover layer 12 or U-shaped opening etc., the area of described opening 12a is also smaller than the area of described pad 11a, as long as described pad 11a part can be exposed, so that the conducting that described pad 11a is capable of with other electronic devices and components is connected.
In the flexible PCB 100 that first embodiment of the invention provides, by drawing three second lead-in wire 111b on described pad 11a, and three described second lead-in wire 111b arranges described boss 112, utilize contacting between described boss 112 and copper foil layer 11, so that the second lead-in wire 111b Adhesion enhancement on copper foil layer 11, and then enable to described pad 11a Adhesion enhancement on described copper foil layer 11. In addition, owing to described lead-in wire 111 and described boss 112 are all pressed on described copper foil layer 11 by described cover layer 12, by described pad 11a portion compresses on described copper foil layer 11, thus preventing described pad 11a from obscission occurring, it is further ensured that the dependability of described flexible PCB 100.
Referring to Fig. 3, for the flexible PCB 200 that second embodiment of the invention provides, described flexible PCB 200 includes substrate layer (not shown), the copper foil layer 21 be located on described substrate layer and cover layer 22. Being provided with pad 21a on described copper foil layer 21, this pad 11a exposes described cover layer 12; Being provided with at least one lead-in wire 211 on described pad 21a, described at least one lead-in wire 211 leads on described copper foil layer 21 from described pad 21a. Described at least one lead-in wire 211 be provided with boss 212 in whole or in part, described boss 212 is in order to be pressed in described lead-in wire 211 on described copper foil layer 21. Described cover layer 22 is covered on described copper foil layer 21, and compresses described at least one lead-in wire 211 and described boss 212.
The flexible PCB 100 that the flexible PCB 200 that second embodiment of the invention provides and first embodiment of the invention provide is different in that:
Described lead-in wire 211 is four, and go between 211a and three second lead-in wire 211b including one first, and three described second lead-in wire 211b are triangular structure, including point 2111 and the compressed part 2112 connecting described point 2111. Described point 2111 is drawn from described pad 21a, and described compressed part 2112 extends on described copper foil layer 21 and is connected with copper foil layer 21, and each described boss 212 is respectively arranged in each described compressed part 2112. In the present embodiment, for the ease of being connected with described compressed part 2112, each described boss 212 is also triangular structure. It is understood that in other embodiments, described boss 212 can be also square structure or circular configuration etc.
The flexible PCB 200 that second embodiment of the invention provides, it is set to triangular structure by the 211b that goes between described second, and described boss 212 is also triangular structure, so that the path that described second lead-in wire 211b draws from described pad 21a is shorter, and the contact area on described copper foil layer 21 is also bigger, thus strengthening described second lead-in wire 211b adhesive force on described copper foil layer 11, and then strengthen described pad 21a adhesive force on described copper foil layer 21.
In sum, in flexible PCB provided by the invention, described pad is drawn at least one lead-in wire, and this at least one leads on copper foil layer, all or part of at least one lead-in wire arranges boss, and utilizes this boss to be pressed on copper foil layer by lead-in wire. Therefore, utilize this boss that the contact area between pad and copper foil layer is increased, and by the cover layer covered on copper foil layer, at least one lead-in wire and this boss are compressed, thus utilizing the thrust of this cover layer to make the degree of being completely embedded between pad and copper foil layer increase, and then increase pad adhesive force on copper foil layer, prevent described pad from the phenomenon come off occurring, improve the dependability of flexible PCB.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example ", " some examples " or similar " first embodiment " etc. means in conjunction with this embodiment or example describe are contained at least one embodiment or the example of the present invention. In this manual, the schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example. And, the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.
Embodiments described above, is not intended that the restriction to this technical scheme protection domain. The amendment made within any spirit at above-mentioned embodiment and principle, equivalent replacement and improvement etc., should be included within the protection domain of this technical scheme.
Claims (10)
1. a flexible PCB, including substrate layer, it is located at the copper foil layer on described substrate layer, it is characterized in that, described flexible PCB also includes cover layer, described copper foil layer is provided with the pad exposing described cover layer, described pad is provided with at least one lead-in wire, described at least one lead-in wire leads on described copper foil layer from described pad, described at least one lead-in wire in all or part of on be provided with boss, described lead-in wire is pressed on described copper foil layer by described boss, described cover layer is covered on described copper foil layer, and compress described at least one lead-in wire and described boss.
2. flexible PCB as claimed in claim 1, it is characterized in that, described lead-in wire is four, article four, described lead-in wire respectively centered by described pad at different directional divergences, article four, described lead-in wire includes one first lead-in wire and three second lead-in wires, described first lead-in wire leads on described copper foil layer from described pad, in order to connect electronic devices and components, article three, described second lead-in wire all leads on described copper foil layer from described pad, and three described second upper positions near described pad of lead-in wire are provided with described boss.
3. flexible PCB as claimed in claim 2, it is characterized in that, each described second lead-in wire is strip structure, including the first link being oppositely arranged and the second link, described first link is drawn from described pad, described second link is vertical with described first link to be connected, and is provided with described boss on each described second link.
4. flexible PCB as claimed in claim 2, it is characterized in that, each described second lead-in wire is triangular structure, including point and the compressed part connecting described point, described point is drawn from described pad, described compressed part extends on described copper foil layer and is connected with this copper foil layer, and described boss is respectively arranged in each described compressed part.
5. flexible PCB as claimed in claim 1, it is characterised in that each described boss is square copper billet, square block tin or square conduction blob of viscose.
6. flexible PCB as claimed in claim 1, it is characterised in that each described boss is circular copper billet, square block tin or square conduction blob of viscose.
7. flexible PCB as claimed in claim 1, it is characterised in that described pad center is provided with via, is filled with scolding tin in described via.
8. flexible PCB as claimed in claim 1, it is characterised in that the position of the corresponding described pad of described cover layer offers opening, and the area of described opening is more than or equal to the area of described pad.
9. flexible PCB as claimed in claim 1, it is characterised in that described cover layer is adhered on described copper foil layer by viscose glue.
10. a mobile terminal, it is characterized in that, described mobile terminal includes body, mainboard and flexible PCB as described in claim 1 to 9 any one, and described mainboard is located at described body interior, described flexible PCB is located on described mainboard, and is electrically connected to described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027749.6A CN105636348A (en) | 2015-12-29 | 2015-12-29 | Flexible printed circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027749.6A CN105636348A (en) | 2015-12-29 | 2015-12-29 | Flexible printed circuit board and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105636348A true CN105636348A (en) | 2016-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201511027749.6A Pending CN105636348A (en) | 2015-12-29 | 2015-12-29 | Flexible printed circuit board and mobile terminal |
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| CN (1) | CN105636348A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109166467A (en) * | 2018-08-25 | 2019-01-08 | 深圳市雷凌显示技术有限公司 | A kind of LED display and LED display mould group |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201194445Y (en) * | 2008-03-18 | 2009-02-11 | 深圳和而泰智能控制股份有限公司 | Welding tray on printed circuit board |
| CN201315702Y (en) * | 2008-12-19 | 2009-09-23 | 深圳华为通信技术有限公司 | Pad structure and printing circuit board |
| CN201657502U (en) * | 2010-03-01 | 2010-11-24 | 番禺得意精密电子工业有限公司 | Printed circuit board |
-
2015
- 2015-12-29 CN CN201511027749.6A patent/CN105636348A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201194445Y (en) * | 2008-03-18 | 2009-02-11 | 深圳和而泰智能控制股份有限公司 | Welding tray on printed circuit board |
| CN201315702Y (en) * | 2008-12-19 | 2009-09-23 | 深圳华为通信技术有限公司 | Pad structure and printing circuit board |
| CN201657502U (en) * | 2010-03-01 | 2010-11-24 | 番禺得意精密电子工业有限公司 | Printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109166467A (en) * | 2018-08-25 | 2019-01-08 | 深圳市雷凌显示技术有限公司 | A kind of LED display and LED display mould group |
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Application publication date: 20160601 |