CN201194445Y - Welding tray on printed circuit board - Google Patents
Welding tray on printed circuit board Download PDFInfo
- Publication number
- CN201194445Y CN201194445Y CNU2008200927506U CN200820092750U CN201194445Y CN 201194445 Y CN201194445 Y CN 201194445Y CN U2008200927506 U CNU2008200927506 U CN U2008200927506U CN 200820092750 U CN200820092750 U CN 200820092750U CN 201194445 Y CN201194445 Y CN 201194445Y
- Authority
- CN
- China
- Prior art keywords
- pad
- bonding pad
- intermediate body
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a bonding pad on a printed circuit board. An external bonding wire is welded on the bonding pad. The utility model is characterized in that: the bonding pad comprises an intermediate body and at least two fixing support feet connected with the periphery of the intermediate body. The intermediate body is circular or elliptic, and the fixing support feet are uniformly distributed on the circumference of the intermediate body. The periphery of the bonding pad is extended out with uniformly distributed fixing support feet, so the stress condition of the bonding pad is improved, and the adhesive force of the copper foil of the bonding pad is favorably enhanced; welding material mass can be reduced under the condition of the same bonding pad size; the structure is simple and the performance is reliable.
Description
Technical field
The utility model relates to a kind of pad, especially relates to the pad on a kind of printed substrate.
Background technology
As shown in Figure 1, the pad on 1 ' 2 ' adopts directly dew copper on the traditional printing wiring board.The pad 2 ' of general straight cutting spare is rounded or oblong, and be reduction electronic product cost often adopt single face paper printing wiring board 1 '.When stressed bigger or heavier components and parts are assembled on the single face wiring board, relatively poor because of the Copper Foil adhesive force of single face wiring board, need add the size or the fastening element body of large bonding pad usually.Even but add large bonding pad or fastening element body, electronic product is in production or transportation or use, produce reasons such as acceleration of gravity owing to the center of gravity ambiguity of heavier components and parts and when being subjected to external force, the pin that is welded on the wiring board is produced a kind of bursting stress and the pulling force that is in reverse to wiring board, make the pad 2 ' dry joint on the wiring board or play copper sheet, influence the q﹠r of electronic product, make the electronic product integrated cost raise.
Summary of the invention
The technical problems to be solved in the utility model is to remedy above defective, proposes the pad on a kind of printed substrate, strengthens pad adhesive force, thereby improves the quality of electronic product.
Technical problem of the present utility model is solved by the following technical programs.
Pad on this printed substrate, extraneous bonding wire are welded on the described pad, and its characteristics are: described pad comprises intermediate and at least two fixed feet that are connected with the intermediate periphery.
Preferably, described intermediate is circular or oval, and described fixed feet evenly distributes at the circumference of intermediate.
Described printed substrate is a single face paper printing wiring board.
The beneficial effect that the utility model is compared with the prior art is: extend equally distributed fixed feet around pad, the stressed position of pad improves, stressed even, make extraneous bonding wire can parallelly distribute, help strengthening the Copper Foil adhesive force of pad the pulling force or the bursting stress of pad; Under the condition of same pad size, can reduce the scolder consumption; Simple in structure, dependable performance.
Description of drawings
Fig. 1 is this existing pad structure schematic diagram;
Fig. 2 is the structural representation of the utility model embodiment.
Embodiment
Pad on a kind of printed substrate, as shown in Figure 2, the pad on the printed substrate 1 comprises two parts, for the intermediate 2 that is positioned at the centre be positioned at several fixed supports 3 around the intermediate 2.Intermediate 2 is circular, adheres to several fixed feet 3 evenly distributedly on the circular circumference.Fixed feet 3 is the equidistant isometric wide welding rods of outwards extending out around intermediate 2, and equidistant isometric widely attached to the circumference of intermediate, makes whole pad be rendered as a star.Adopt the ripple beacon to be welded and join the automatic upward scolder that covers on the fixed support 3 of back, need not manually to weld again.
Fixed feet 3 is generally 6～12, can determine according to the size of pad, increases or reduces the bar number and guarantee evenly to distribute around intermediate 2, can be so that pad is stressed parallel and attractive in appearance, to strengthen pad Copper Foil adhesive force.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (3)
1. the pad on the printed substrate, extraneous bonding wire is welded on the pad, it is characterized in that: described pad comprises intermediate and at least two fixed feet that are connected with the intermediate periphery.
2. want pad on the 1 described printed substrate as right, it is characterized in that: described intermediate is for circular or oval, and described fixed feet evenly distributes at the circumference of intermediate.
3. want pad on the 1 described printed substrate as right, it is characterized in that: described printed substrate is a single face paper printing wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200927506U CN201194445Y (en) | 2008-03-18 | 2008-03-18 | Welding tray on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200927506U CN201194445Y (en) | 2008-03-18 | 2008-03-18 | Welding tray on printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201194445Y true CN201194445Y (en) | 2009-02-11 |
Family
ID=40393977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200927506U Expired - Lifetime CN201194445Y (en) | 2008-03-18 | 2008-03-18 | Welding tray on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201194445Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104144567A (en) * | 2013-10-08 | 2014-11-12 | 东莞尔来德通讯有限公司 | PCB with socket and method of improving installation reliability of the socket |
| CN104302122A (en) * | 2013-07-15 | 2015-01-21 | 深圳市共进电子股份有限公司 | Method for preventing shedding of welding rings in printed circuit board and printed circuit board |
| CN105636348A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN105792511A (en) * | 2016-03-30 | 2016-07-20 | 努比亚技术有限公司 | Pad compatible structure and PCB |
| CN111050467A (en) * | 2019-12-31 | 2020-04-21 | 东莞华贝电子科技有限公司 | Circuit board and terminal equipment |
-
2008
- 2008-03-18 CN CNU2008200927506U patent/CN201194445Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302122A (en) * | 2013-07-15 | 2015-01-21 | 深圳市共进电子股份有限公司 | Method for preventing shedding of welding rings in printed circuit board and printed circuit board |
| CN104302122B (en) * | 2013-07-15 | 2018-09-07 | 深圳市共进电子股份有限公司 | Prevent the method and printed circuit board that weld-ring falls off in printed circuit board |
| CN104144567A (en) * | 2013-10-08 | 2014-11-12 | 东莞尔来德通讯有限公司 | PCB with socket and method of improving installation reliability of the socket |
| CN105636348A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN105792511A (en) * | 2016-03-30 | 2016-07-20 | 努比亚技术有限公司 | Pad compatible structure and PCB |
| CN111050467A (en) * | 2019-12-31 | 2020-04-21 | 东莞华贝电子科技有限公司 | Circuit board and terminal equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Heng Baoshi wiring board Co., Ltd Assignor: ShenZhen H&T Intelligent Control CO., LTD. Contract record no.: 2012440020260 Denomination of utility model: Welding tray on printed circuit board Granted publication date: 20090211 License type: Exclusive License Record date: 20120919 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090211 |