CN104144567A - PCB with socket and method of improving installation reliability of the socket - Google Patents
PCB with socket and method of improving installation reliability of the socket Download PDFInfo
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- CN104144567A CN104144567A CN201410266849.3A CN201410266849A CN104144567A CN 104144567 A CN104144567 A CN 104144567A CN 201410266849 A CN201410266849 A CN 201410266849A CN 104144567 A CN104144567 A CN 104144567A
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- socket
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- pcb board
- pin
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Abstract
The invention relates to the technical field of PCBs, and particularly relates to a PCB with a socket and a method of improving installation reliability of the socket. The PCB comprises a substrate and the socket. The socket is disposed above the substrate. The substrate is provided with jacks penetrating the substrate. The socket is provided with an L-shaped pin. The L-shaped pin comprises a longitudinal pin body and a horizontal pin body. The longitudinal pin body is longitudinally inserted in the jacks. The tail end of the longitudinal pin body passes through the jacks and extends horizontally to form the horizontal pin body. The horizontal pin body is disposed on the lower surface of the substrate provided with a bonding pad. The surface of the bonding pad is provided with a connecting part. The tail end of the horizontal pin body is connected to the connecting part. The PCB is simple in structure. Connection of the L-shaped pin and the jacks of the substrate is high in reliability and long in service lifetime. The method is simple, feasible, low in production cost and good in effects.
Description
Technical field
The present invention relates to pcb board technical field, relate in particular to a kind of method that is provided with the pcb board of socket and improves the installation reliability of socket.
Background technology
The develop rapidly of communications industry at present, the competition in mobile terminal market is more and more fierce, along with mobile terminal is gradually to intelligent, miniaturization development, the components and parts usage quantity of PCB plate design small-medium size encapsulation is numerous, also make that its circuit design scheme is increasingly sophisticated, PCB plate area is more and more less, therefore the size of corresponding standard soldering board also can be more and more less, therefore the anti-impact force of pad also can decline thereupon, in the process of producing, test, transporting, the phenomenon that easily causes components and parts to come off together with pad monoblock in the time being subject to external impacts occurs.Components and parts come off can affect overall performance, when serious, also can cause complete machine to be scrapped, thereby causes the increase of maintenance and design cost.
Taking the data card deck of mobile phone as example, at present, the pin of data card deck all adopts Welder conventionally
Skill is welded mutually with the circuit on main circuit board, due to the structure being welded, shock resistance is poor in actual use, when mobile terminal is subject to unexpected collision or falls carelessly, weld easily ruptures, misplaces, make between data card deck and main circuit board be electrically connected unreliable, and then make to be connected between data card and the circuit of main circuit board unreliable, cause the poor reliability of mobile terminal, useful life shorter.For this reason, above problem is urgently to be resolved hurrily.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, and provide, a kind of structural stability is strong, the pcb board of the installation reliability of the raising socket of long service life.
The present invention is achieved through the following technical solutions.
A kind of pcb board of the installation reliability that improves socket, comprise substrate and socket, socket is arranged at the top of substrate, substrate offers the jack through substrate, on socket, be provided with " L " shape pin, " L " shape pin comprises longitudinal pin body and horizontal pin body, longitudinally pin body is longitudinally inserted in jack, laterally pin body extends and forms towards horizontal direction after passing jack by the tail end of longitudinal pin body, laterally pin body is positioned at the lower surface of substrate, the lower surface of substrate is provided with pad, the surface of pad is provided with connector, laterally the end of pin body is connected in connector.
Wherein, pad comprises interconnective pad body and extension, and extension stretches out from the edge of pad body, and pad body is circular pad body, and the central part of circular pad body offers through hole.
Wherein, extension comprises four extension bars that are evenly arranged at the outer ring of circular pad body, and four are extended all types linearly of bar, and every two angles that extend between bars are right angle.
Wherein, extension also comprises clamping ring, and clamping ring is arranged at four outsides of extending bar, and four one end away from circular pad body of extending bar are all connected in clamping ring.
Wherein, extension comprises five extension bars that are evenly arranged at the outer ring of circular pad body, and five extension bars are all curved.
Wherein, the central angle of arc extension bar is 30 °-45 °.
Wherein, connector is scolder connector.
Wherein, socket is one or more the combination wherein of SD card socket, UIM card socket or usim card socket.
Wherein, substrate adopts polyimide resin to make.
The method that improves the installation reliability of the socket of the above-mentioned pcb board that is provided with socket, it comprises the following steps:
A, throw in scolder in " L " of base lower surface shape pin region corresponding with pad;
B, first by the preheating of Reflow Soldering equipment, be preheated to temperature and reach 150 ~ 190 DEG C, the time of preheating is 60 ~ 120s, again the substrate that has added scolder in step a is put into Reflow Soldering equipment, then make Reflow Soldering equipment continue to heat up, be warming up to temperature and reach 220 ~ 250 DEG C, melt solder is by " L " shape pin and substrate adhesion, last cooling formation scolder connector, makes pcb board finished product.Scolder is solder(ing) paste, after solder(ing) paste melting, sorptive force strengthens, " L " shape pin closely can be connected with the lower surface of substrate, then when the solder(ing) paste of melting is cooling, just form scolder connector at contact area base lower surface and " L " shape pin, scolder connector has strengthened " L " shape pin and reliable epistasis of being connected of substrate, has strengthened the integrally-built stability of pcb board.
Beneficial effect of the present invention is: the present invention is simple in structure, because the pin of socket is " L " shape pin, " L " shape pin wore after jack can back-off in the lower surface of substrate, strengthen the connective stability of pin and substrate, replace traditional single welding manner, the connection reliability of the jack of " L " shape pin and substrate is strong, long service life.
The method of the installation reliability of raising socket of the present invention is simple, and production cost is low, and the installation reliability of raising socket is effective.
Brief description of the drawings
Fig. 1 is structural representation of the present invention.
Fig. 2 is the generalized section of dissecing along II-II line in Fig. 1 of the present invention.
Fig. 3 is the structure enlarged diagram at the A place of Fig. 2 of the present invention.
Fig. 4 is the structural representation of the pad of embodiments of the invention 1.
Fig. 5 is the structural representation of the pad of embodiments of the invention 2.
Fig. 6 is the structural representation of the pad of embodiments of the invention 3.
Reference numeral comprises:
1-substrate, 11-jack, 2-socket, 21-" L " shape pins, 211-laterally pin body, 212-longitudinally pin body, 3-pad, 31-pad body, 32-extension, 321-through hole, 322-clamping ring, 4-connector.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further illustrated.
embodiment mono-.
As shown in Figures 1 to 4, the pcb board of a kind of installation reliability that improves socket of the present embodiment, comprise substrate 1 and socket 2, socket 2 is arranged at the top of substrate 1, substrate 1 offers the jack 11 through substrate 1, on socket 2, be provided with " L " shape pin 21, " L " shape pin 21 comprises longitudinal pin body 212 and horizontal pin body 211, longitudinally pin body 212 is longitudinally inserted in jack 11, laterally pin body 211 is passed by the tail end of longitudinal pin body 212 that jack 11 is rear to be extended and form towards horizontal direction, and laterally pin body 211 is positioned at the lower surface of substrate 1.The present invention is simple in structure, because the pin of socket 2 is " L " shape pin 21, " L " shape pin 21 wore after jack 11 can back-off in the lower surface of substrate 1, strengthen the connective stability of pin and substrate 1, replace traditional single welding manner, " L " shape pin 21 is strong with the connection reliability of the jack 11 of substrate 1, long service life.
In the present embodiment, the lower surface of substrate 1 is provided with pad 3, and the surface of pad 3 is provided with connector 4, and laterally the end of pin body 211 is connected in connector 4, and connector 4 is scolder connector.The end of pin of the present invention is connected with substrate 1 by scolder connector, has further strengthened the connective stability of pin and substrate 1, greatly improves the installation reliability of socket 2 and substrate 1, further extends useful life of the present invention.
In the present embodiment, pad 3 comprises interconnective pad body 31 and extension 32, and extension 32 stretches out from the edge of pad body 31.Pad body 31 is convenient to scolder connector and is attached on substrate 1, and extension 32 has increased the area of pad 3, and then has strengthened the adhesive force of pad 3 with substrate 1, thereby ensures the connective stability of scolder connector and pin end.
In the present embodiment, pad body 31 is circular pad body, the central part of circular pad body offers through hole 321, pad body 31 is annular, the through hole 321 at middle part can avoid stress to concentrate on center, effectively prevent stress from concentrating and cause pad 3 to break, greatly improve the cohesiveness of pad body 31, structural stability is high.
In the present embodiment, extension 32 comprises four extension bars that are evenly arranged at the outer ring of circular pad body 31, and four are extended all types linearly of bar, and every two angles that extend between bars are right angle.Extend by four the pad 3 that bars and circular pad body 31 connect and compose and be cross, the stress of pad 3 is dispersed to four direction equably, has greatly strengthened and between pad 3 and substrate 1, has had preferably adhesiveness and bonding force.
In the present embodiment, socket 2 is one or more combination of SD card socket, UIM card socket and usim card socket.SD card socket, UIM card socket or usim card socket are applied to respectively plug-in mounting SIM card, UIM card and usim card, can realize respectively being electrically connected between SIM card, UIM card and usim card and pcb board.Certainly, the socket 2 in the present embodiment can be also other data card sockets outside above socket 2.
In the present embodiment, substrate 1 adopts polyimide resin to make.High temperature resistant the reaching more than 400 DEG C of polyimide substrate of being made by polyimide resin, high-frequency dielectric performance is (below 50MHz, dielectric constant is 4.1, dielectric loss angle tangent is 8 × 10-3), electric property, chemical resistance and good dimension stability, belong to F to H class F insulating material F, and its satisfactory mechanical property, bending strength (20 DEG C)>=170MPa, impact strength (non-notch)>=28kJ/m
2, hot strength>=100 MPa, percentage elongation >120%, product quality is good.
In the present embodiment, improve the method for the installation reliability of the socket of the above-mentioned pcb board that is provided with socket, it comprises the following steps:
A, throw in scolder in " L " of substrate 1 lower surface shape pin 21 region corresponding with pad 3;
B, first by the preheating of Reflow Soldering equipment, be preheated to temperature and reach 150 DEG C, the time of preheating is 120s, again the substrate 1 that has added scolder in step a is put into Reflow Soldering equipment, then make Reflow Soldering equipment continue to heat up, be warming up to temperature and reach 220 DEG C, melt solder is by " L " shape pin 21 and substrate 1 adhesion, last cooling formation scolder connector, makes pcb board finished product.Scolder is solder(ing) paste, after solder(ing) paste melting, sorptive force strengthens, " L " shape pin 21 closely can be connected with the lower surface of substrate 1, then when the solder(ing) paste of melting is cooling, just form scolder connector at contact area substrate 1 lower surface and " L " shape pin 21, scolder connector has strengthened " L " shape pin 21 and reliable epistasis of being connected of substrate 1, has strengthened the integrally-built stability of pcb board.
embodiment bis-.
As shown in Figure 5, the difference of the present embodiment and embodiment mono-is: in the present embodiment, extension 32 also comprises clamping ring 322, and clamping ring 322 is arranged at four outsides of extending bar, and four one end away from circular pad body 31 of extending bar are all connected in clamping ring 322.Clamping ring 322 extends the ends of bars by four and is connected as a single entity, and prevents that the end away from circular pad body 31 of extending bar from peeling off, and has further strengthened adhesiveness and bonding force between pad body 31 and substrate 1.
In the present embodiment, improve the method for the installation reliability of the socket of the above-mentioned pcb board that is provided with socket, it comprises the following steps:
A, throw in scolder in " L " of substrate 1 lower surface shape pin 21 region corresponding with pad 3;
B, first by the preheating of Reflow Soldering equipment, be preheated to temperature and reach 190 DEG C, the time of preheating is 60s, again the substrate 1 that has added scolder in step a is put into Reflow Soldering equipment, then make Reflow Soldering equipment continue to heat up, be warming up to temperature and reach 250 DEG C, melt solder is by " L " shape pin 21 and substrate 1 adhesion, last cooling formation scolder connector, makes pcb board finished product.
Other structure of the present embodiment is identical with embodiment mono-, does not repeat them here.
embodiment tri-.
As shown in Figure 6, the difference of the present embodiment and embodiment mono-is: in the present embodiment, extension 32 comprises five extension bars that are evenly arranged at the outer ring of circular pad body 31, and five extension bars are all curved, and the central angle that arc extends bar is 30 °-45 °.The quantity of extending bar increases, the effect of pad 3 stress dispersions strengthens, simultaneously, because the extension bar of the present embodiment is curved, therefore the scope that the direction of stress dispersion covers is larger, further strengthens the effect of pad 3 stress dispersions, more effectively prevents that stress is concentrated and cause pad 3 to break, the cohesiveness that greatly improves pad body 31, structural stability is high.
In the present embodiment, improve the method for the installation reliability of the socket of the above-mentioned pcb board that is provided with socket, it comprises the following steps:
A, throw in scolder in " L " of substrate 1 lower surface shape pin 21 region corresponding with pad 3;
B, first by the preheating of Reflow Soldering equipment, be preheated to temperature and reach 170 DEG C, the time of preheating is 80s, again the substrate 1 that has added scolder in step a is put into Reflow Soldering equipment, then make Reflow Soldering equipment continue to heat up, be warming up to temperature and reach 235 DEG C, melt solder is by " L " shape pin 21 and substrate 1 adhesion, last cooling formation scolder connector, makes pcb board finished product.
Other structure of the present embodiment is identical with embodiment mono-, does not repeat them here.
The above execution mode, it is preferred embodiments of the present invention, be not to limit the scope of the present invention, the equivalence of doing according to structure, feature and principle described in the present patent application the scope of the claims therefore all changes or modifies, and all should comprise in patent claim of the present invention.
Claims (10)
1. one kind is improved the pcb board of the installation reliability of socket, comprise substrate and socket, socket is arranged at the top of substrate, it is characterized in that: substrate offers the jack through substrate, on socket, be provided with " L " shape pin, " L " shape pin comprises longitudinal pin body and horizontal pin body, longitudinally pin body is longitudinally inserted in jack, laterally pin body extends and forms towards horizontal direction after passing jack by the tail end of longitudinal pin body, laterally pin body is positioned at the lower surface of substrate, the lower surface of substrate is provided with pad, the surface of pad is provided with connector, laterally the end of pin body is connected in connector.
2. the pcb board of a kind of installation reliability that improves socket according to claim 1, it is characterized in that: pad comprises interconnective pad body and extension, extension stretches out from the edge of pad body, pad body is circular pad body, and the central part of circular pad body offers through hole.
3. the pcb board of a kind of installation reliability that improves socket according to claim 2, it is characterized in that: extension comprises four extension bars that are evenly arranged at the outer ring of circular pad body, four are extended all types linearly of bar, and every two angles that extend between bars are right angle.
4. the pcb board of a kind of installation reliability that improves socket according to claim 3, it is characterized in that: extension also comprises clamping ring, clamping ring is arranged at four outsides of extending bar, and four one end away from circular pad body of extending bar are all connected in clamping ring.
5. the pcb board of a kind of installation reliability that improves socket according to claim 2, is characterized in that: extension comprises five extension bars that are evenly arranged at the outer ring of circular pad body, and five extension bars are all curved.
6. the pcb board of a kind of installation reliability that improves socket according to claim 7, is characterized in that: the central angle that arc extends bar is 30 °-45 °.
7. the pcb board of a kind of installation reliability that improves socket according to claim 2, is characterized in that: connector is scolder connector.
8. the pcb board of a kind of installation reliability that improves socket according to claim 1, is characterized in that: socket is one or more the combination wherein of SD card socket, UIM card socket and usim card socket.
9. a kind of pcb board that is provided with socket according to claim 1, is characterized in that: substrate adopts polyimide resin to make.
10. a method that improves the installation reliability of the socket of the pcb board that is provided with socket described in claim 1-9 any one, is characterized in that: it comprises the following steps:
A, throw in scolder in " L " of base lower surface shape pin region corresponding with pad;
B, first by the preheating of Reflow Soldering equipment, be preheated to temperature and reach 150 ~ 190 DEG C, the time of preheating is 60 ~ 120s, again the substrate that has added scolder in step a is put into Reflow Soldering equipment, then make Reflow Soldering equipment continue to heat up, be warming up to temperature and reach 220 ~ 250 DEG C, melt solder is by " L " shape pin and substrate adhesion, last cooling formation scolder connector, makes pcb board finished product.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130119618 | 2013-10-08 | ||
| KR10-2013-0119618 | 2013-10-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104144567A true CN104144567A (en) | 2014-11-12 |
Family
ID=51853606
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420319542.0U Expired - Fee Related CN203983541U (en) | 2013-10-08 | 2014-06-16 | A kind of pcb board that improves the installation reliability of socket |
| CN201410266849.3A Pending CN104144567A (en) | 2013-10-08 | 2014-06-16 | PCB with socket and method of improving installation reliability of the socket |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420319542.0U Expired - Fee Related CN203983541U (en) | 2013-10-08 | 2014-06-16 | A kind of pcb board that improves the installation reliability of socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN203983541U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104633618B (en) * | 2015-01-30 | 2018-09-18 | 木林森股份有限公司 | A kind of electric connection structure, assembly method and the lamps and lanterns of LED lamp panel and power panel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5443391A (en) * | 1992-12-29 | 1995-08-22 | Funai Electric Co., Ltd. | Electric wire-connecting terminal |
| CN1822746A (en) * | 2005-02-18 | 2006-08-23 | 富士通株式会社 | Printed board |
| CN101321441A (en) * | 2007-06-08 | 2008-12-10 | Smk株式会社 | Method of reflow soldering a printed circuit board wherein an electroconductive coating material is used |
| CN201194445Y (en) * | 2008-03-18 | 2009-02-11 | 深圳和而泰智能控制股份有限公司 | Welding tray on printed circuit board |
| CN203457417U (en) * | 2013-08-23 | 2014-02-26 | 广东美的生活电器制造有限公司 | Circuit board assembly and bonding pad thereof |
-
2014
- 2014-06-16 CN CN201420319542.0U patent/CN203983541U/en not_active Expired - Fee Related
- 2014-06-16 CN CN201410266849.3A patent/CN104144567A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5443391A (en) * | 1992-12-29 | 1995-08-22 | Funai Electric Co., Ltd. | Electric wire-connecting terminal |
| CN1822746A (en) * | 2005-02-18 | 2006-08-23 | 富士通株式会社 | Printed board |
| CN101321441A (en) * | 2007-06-08 | 2008-12-10 | Smk株式会社 | Method of reflow soldering a printed circuit board wherein an electroconductive coating material is used |
| CN201194445Y (en) * | 2008-03-18 | 2009-02-11 | 深圳和而泰智能控制股份有限公司 | Welding tray on printed circuit board |
| CN203457417U (en) * | 2013-08-23 | 2014-02-26 | 广东美的生活电器制造有限公司 | Circuit board assembly and bonding pad thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN203983541U (en) | 2014-12-03 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141112 |
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| RJ01 | Rejection of invention patent application after publication |