CN102762029B - The method of attachment of mobile communication equipment and circuit board composition and circuit board - Google Patents
The method of attachment of mobile communication equipment and circuit board composition and circuit board Download PDFInfo
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- CN102762029B CN102762029B CN201210219986.2A CN201210219986A CN102762029B CN 102762029 B CN102762029 B CN 102762029B CN 201210219986 A CN201210219986 A CN 201210219986A CN 102762029 B CN102762029 B CN 102762029B
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Abstract
The embodiment of the invention discloses the method for attachment of a kind of mobile communication equipment, the circuit board composition of this equipment and circuit board.Circuit board composition includes first circuit board, verticality conducting resinl and second circuit board.Wherein, first circuit board edge is provided with at least one first electrode, and second circuit panel edges is provided with at least one second electrode, and verticality conducting resinl conducts electricity in the vertical direction and insulate in the horizontal direction.The upper surface of verticality conducting resinl is mutually bonding with the lower surface of first circuit board, and the lower surface of verticality conducting resinl is mutually bonding with the upper surface of second circuit board.Verticality conducting resinl is positioned at immediately below the first electrode and region directly over the second electrode is conduction region, to electrically connect the first electrode and the second electrode.The present invention can facilitate and being linked together by circuit board of low cost, more practicality.
Description
Technical field
The present invention relates to circuit field, be specifically related to a kind of mobile communication equipment, further relate to the circuit board composition of this mobile communication equipment and the method for attachment of its relevant circuit board.
Background technology
Flexible PCB (FPC) and printed circuit board (PCB) (PCB) with the use of the mode various products in electron trade have substantial amounts of application, it is frequently necessary in actual applications both be coupled together by adapter or other modes.In the prior art, conventional connected mode is flexible PCB and printed circuit board (PCB) to be linked together by BTB adapter or ZIF connector, or directly by flexible PCB manual welding to printed circuit board (PCB).
But, it is attached the manufacturing process flow being accomplished by increasing connector body and surface installation technique by the form of various adapters, thus adding production cost；It is attached by the mode of manual welding, can produce to pollute, and the problem that inconvenient maintenance can be brought.
Summary of the invention
What present invention mainly solves technical problem is that: provide the method for attachment of a kind of mobile communication equipment and circuit board composition thereof and circuit board, and the link cost to solve flexible PCB and printed circuit board (PCB) is high, maintenance is inconvenient and welding process problem not environmentally.
For solving above-mentioned technical problem, the technical scheme that the present invention adopts is: provide a kind of circuit board composition, including: first circuit board, verticality conducting resinl and second circuit board.First circuit board edge is provided with at least one first electrode, and second circuit panel edges is provided with at least one second electrode.The upper surface of verticality conducting resinl is mutually bonding with the lower surface of first circuit board, and it is conduction region that verticality conducting resinl is positioned at the region immediately below the first electrode.The upper surface of second circuit board is mutually bonding with the lower surface of verticality conducting resinl, and it is conduction region that verticality conducting resinl is positioned at the region directly over the second electrode, to electrically connect described first electrode and the second electrode.Verticality conducting resinl conducts electricity in the vertical direction and insulate in the horizontal direction；Wherein, the quantity of the first electrode and the second electrode need not be equal, and when the quantity of the first electrode and the second electrode is all higher than one, one group of first electrode therein is set and the second electrode is corresponding and by the verticality conducting resinl normal transmission signal of telecommunication, does not have corresponding relation between other the first electrode and the second electrode.
Wherein, the first electrode is the first Lou Tong district, and the second electrode is the second Lou Tong district, and the number in the first Lou Tong district and the second Lou Tong district is all less than ten.
Wherein, first circuit board is provided with the first hole, location, and second circuit board is provided with the second hole, location, and verticality conducting resinl is provided with the 3rd hole, location.First hole, location, the second hole, location and the 3rd hole, location are corresponding up and down, position hole, the second hole, location and the 3rd hole, location by first and position between first circuit board, second circuit board and verticality conducting resinl.
Wherein, the quantity in the first hole, location, the second hole, location and the 3rd hole, location is the two ends that hole, two: two first location lays respectively at the first electrode of first circuit board, hole, two second location lays respectively at the two ends of the second electrode of second circuit board, and hole, two the 3rd location lays respectively at verticality conducting resinl two ends.
For solving above-mentioned technical problem, another technical solution used in the present invention is: providing a kind of mobile communication equipment, this mobile communication equipment is equipped with above-described circuit board composition.
Wherein, mobile communication equipment is mobile phone.
For solving above-mentioned technical problem, another technical solution used in the present invention is: provide the method for attachment between a kind of circuit board.Specifically: first circuit board, second circuit board and verticality conducting resinl are provided；First circuit board edge is provided with at least one first electrode, and second circuit panel edges is provided with at least one second electrode, and verticality conducting resinl conducts electricity in the vertical direction and insulate in the horizontal direction；The upper surface making verticality conducting resinl is mutually bonding with the lower surface of first circuit board, and the upper surface of second circuit board is mutually bonding with the lower surface of verticality conducting resinl；It is conduction region that verticality conducting resinl is positioned at the region immediately below the first electrode, and it is conduction region that verticality conducting resinl is positioned at the region directly over the second electrode, to electrically connect described first electrode and the second electrode；Wherein, the quantity of the first electrode and the second electrode need not be equal, and when the quantity of the first electrode and the second electrode is all higher than one, one group of first electrode therein is set and the second electrode is corresponding and by the verticality conducting resinl normal transmission signal of telecommunication, does not have corresponding relation between other the first electrode and the second electrode.
Wherein, verticality conducting resinl conducts electricity and non-conductive in the horizontal direction in the vertical direction, and the first electrode is the first Lou Tong district, and the second electrode is the second Lou Tong district, and the number in the first Lou Tong district and the second Lou Tong district is all less than ten.
Wherein, first circuit board is provided with the first hole, location, and second circuit board is provided with the second hole, location, and verticality conducting resinl is provided with hole, two the 3rd location.Make the first hole, location, the second hole, location and the 3rd hole, location corresponding up and down, position first and insert locating dowel with fixing first circuit board, second circuit board and verticality conducting resinl between hole, the second hole, location and the 3rd hole, location.
The embodiment of the present invention passes through verticality conducting resinl, can facilitate and low cost circuit board is linked together, to form a circuit board composition, significantly reduce production cost, and avoid the problems such as the contaminated environment adopting the mode such as welding to cause or inconvenient maintenance, more practicality.
Accompanying drawing explanation
Fig. 1 is the fit system schematic diagram of one embodiment of the invention circuit board composition；
Fig. 2 is the top view of circuit board composition shown in Fig. 1；
Fig. 3 is the sectional view of circuit board composition shown in Fig. 1；And.
Fig. 4 is the schematic flow sheet of the method for attachment between one embodiment of the invention circuit board.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further detail.It is emphasized that following example are merely to illustrate the present invention, but the scope of the present invention is not defined.
Referring to Fig. 1 to Fig. 3, first embodiment of the invention includes first circuit board 10, verticality conducting resinl 20, second circuit board 30 and locating dowel 40.Wherein, first circuit board 10 is provided with one to ten the first electrode (not shown), and second circuit board 30 is provided with one to ten the second electrode (not shown), and the first electrode is corresponding up and down one by one with the position of the second electrode.Specifically, first circuit board 10 has first electrode, second circuit board 30 just has corresponding second electrode, both are overlapping in the vertical direction, so that the signal of telecommunication in the first electrode (or second electrode) can pass through verticality conducting resinl 20 and pass to the second electrode (or first electrode).
It should be noted that the first electrode may be located at any position of first circuit board 10, the second electrode may be located at any position of second circuit board 30.Furthermore, the quantity of the first electrode and the second electrode is also without equal, as long as ensureing to have at least one group is corresponding and can normal operation, on first circuit board 10, such as it is provided with 5 the first electrode a, b, c, d and e, second circuit board 30 is provided with 3 the second electrode x, y and z, wherein a and x is corresponding, corresponding relation is not had between other electrode, in this case, first circuit board 10 and second circuit board 30 can realize the mutual transmission of the signal of telecommunication by the first electrode a and the second electrode x.Certainly, when conditions permit, the number of the first electrode or the second electrode it can also be provided that more than ten, as long as not affecting signal of telecommunication transmission or not producing signal disturbing etc., in the scope of those skilled in the art's understanding, is not construed as limiting.
In the present embodiment, first circuit board 10 and second circuit board 30, in other words electrical connection between the first electrode and the second electrode are realized by verticality conducting resinl 20.Verticality conducting resinl 20 is between first circuit board 10 and second circuit board 30, say, that the upper surface of verticality conducting resinl 20 is mutually bonding with the lower surface of first circuit board 10, and the lower surface of verticality conducting resinl 20 is mutually bonding with the upper surface of second circuit board 30.And verticality conducting resinl 20 has the character conducted electricity in the vertical direction and insulate in the horizontal direction, therefore, verticality conducting resinl 20 can turn on first circuit board 10 and second circuit board 30 in vertical direction, without producing the interference between unlike signal, namely the signal transmission between Different electrodes does not have situation about interfering.
Owing to verticality conducting resinl 20 only conducts electricity in the vertical direction, set a straight line and extend vertically through the plane at verticality conducting resinl 20 place, its respectively with the two of verticality conducting resinl 20 away from face intersect at 2 points, these 2 are " conduction region ", certainly, its position and size arbitrarily can change according to the position of this straight line, in this no limit, now, as long as the first electrode and the second electrode lay respectively on these two conduction regions of verticality conducting resinl 20, just can pass through verticality conducting resinl 20 and turn in vertical direction to transmit the signal of telecommunication etc..
In the present embodiment, first circuit board 10 is flexible PCB, and second circuit board 30 is hard circuit board, and the first electrode is the first Lou Tong district being formed on first circuit board 10, and the second electrode is the second Lou Tong district being formed on second circuit board 20.In other embodiments, it is also possible to carry out different settings according to specific needs, be not construed as limiting here.
In order to better be fixed, it be both provided with hole, location (not shown) at the two ends of first circuit board 10, verticality conducting resinl 20 and second circuit board 30, and by locating dowel 40, the position of three is fixed.It will be understood that the hole, location of first circuit board 10, verticality conducting resinl 20 and second circuit board 30 is also corresponding, so that locating dowel 40 can also cross first circuit board 10, verticality conducting resinl 20 and second circuit board 30.In general, the mode of interference fit is taked to be connected between locating dowel 40 with hole, location but it also may to take other connected modes, be not construed as limiting here.
In order to obtain better locating effect and not affect the transmission of the zone line signal of telecommunication, the hole, location of first circuit board 10, verticality conducting resinl 20 and second circuit board 30 is two, and is separately positioned on the two ends of panel.Certainly, when not affecting locating effect and signal of telecommunication transmission, the position in hole, location can be arranged flexibly, is not construed as limiting here.
It should be noted that the quantity of locating dowel 40 is not limited to two, use two locating dowels 40 in the present embodiment, this is because: generally speaking, 2 locating dowels 40 are possible to prevent relatively rotating between each panel, if selecting 3 or more locating dowel, it is clear that can position better.It is to say, 2 locating dowels 40 are the preferred plan solving orientation problem, but it it not unique scheme.Therefore, the quantity of locating dowel 40 is not defined by the present embodiment.
Understandable, the shape of locating dowel 40 does not constitute limitation of the invention yet, as long as positioning function can be implemented, it is possible to adopt cylindrical, cuboid or pyramid etc..It addition, locating dowel 40 as the present embodiment, can be inserted, to realize positioning action after digging out hole, location；Locating dowel 40 can also be fabricated to the self structure of first circuit board 10, verticality conducting resinl 20 or second circuit board 30.Hole 40, location is such as set on first circuit board 10 and second circuit board 30, and locating dowel 40 is set on verticality conducting resinl 20, namely make lobe (in the present embodiment for cylinder) respectively in the upper and lower surface of verticality conducting resinl 20 and match with the hole, location on first circuit board 10 and second circuit board 30.Here the features such as the structure of locating dowel 40, position, material are not limited in any way.
Should be noted that, locating dowel 40 and hole, location are not the essential conditions of circuit board composition of the present invention.Owing to verticality conducting resinl 20 has certain viscosity, therefore can pass through verticality conducting resinl 20 in the way of stickup, first circuit board 10 and second circuit board 30 to be linked together, additionally can also be attached by other modes such as screws and fix, be not construed as limiting here.
The embodiment of the present invention is by verticality conducting resinl 20 and arranges hole, location on circuit boards, can facilitate and low cost circuit board is linked together, to form a circuit board composition, significantly reduce production cost, and avoid the problems such as the contaminated environment adopting welding manner connection to cause or inconvenient maintenance, more practicality.
The second embodiment of the present invention provides a kind of mobile communication equipment, and this mobile communication equipment is equipped with the circuit board composition element in first embodiment, and this mobile communication equipment can be mobile phone etc..Owing to circuit board composition has been described in detail in the first embodiment of the present invention, therefore not to repeat here.
The third embodiment of the present invention provides the method for attachment between a kind of circuit board, specifically comprises the following steps that
Step S400, first circuit board, second circuit board and verticality conducting resinl are provided, first circuit board edge is provided with at least one first electrode, and second circuit panel edges is provided with at least one second electrode, and verticality conducting resinl conducts electricity in the vertical direction and insulate in the horizontal direction.
Step S401, the upper surface making verticality conducting resinl is mutually bonding with the lower surface of first circuit board, the upper surface of second circuit board is mutually bonding with the lower surface of verticality conducting resinl, wherein verticality conducting resinl is positioned at the region immediately below the first electrode is conduction region, it is conduction region that verticality conducting resinl is positioned at the region directly over the second electrode, to electrically connect the first electrode and the second electrode.
Specifically, verticality conducting resinl conducts electricity and non-conductive in the horizontal direction in the vertical direction, and the first Lou Tong district, described second Lou Tong district number all less than ten.
Furthermore, it is provided with the first hole, location at first circuit board, and it is provided with the second hole, location at second circuit board, verticality conducting resinl is provided with hole, two the 3rd location, make the first hole, location, the second hole, location and the 3rd hole, location corresponding up and down, position first and insert locating dowel with fixing first circuit board, second circuit board and verticality conducting resinl between hole, the second hole, location and the 3rd hole, location.By positioning the mode in hole and locating dowel, the embodiment of the present invention ensure that the connection effect between circuit board.
Method of attachment between the present embodiment circuit board also refers to the preceding embodiment associated description about circuit board composition, those skilled in the art easily in conjunction with, in the scope of understanding, not repeating.
The embodiment of the present invention passes through verticality conducting resinl, it is possible to being linked together by circuit board of convenient and low cost, significantly reduces production cost, and avoids and adopt welding manner to connect the problems such as the contaminated environment caused or inconvenient maintenance, more practicality.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the present invention and accompanying drawing content to make or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical fields, all in like manner include in the scope of patent protection of the present invention.
Claims (10)
1. a circuit board composition, it is characterised in that including:
First circuit board, verticality conducting resinl and second circuit board；
Described first circuit board edge is provided with at least one first electrode, and described second circuit panel edges is provided with at least one second electrode；
The upper surface of described verticality conducting resinl is mutually bonding with the lower surface of first circuit board, and it is conduction region that described verticality conducting resinl is positioned at the region immediately below the first electrode；
The upper surface of described second circuit board is mutually bonding with the lower surface of verticality conducting resinl, and it is conduction region that described verticality conducting resinl is positioned at the region directly over the second electrode, to electrically connect described first electrode and the second electrode；
Described verticality conducting resinl conducts electricity in the vertical direction and insulate in the horizontal direction；
Wherein, the quantity of the first electrode and the second electrode need not be equal, and when the quantity of described first electrode and described second electrode is all higher than one, one group of first electrode therein is set and the second electrode is corresponding and by the described verticality conducting resinl normal transmission signal of telecommunication, does not have corresponding relation between other the first electrode and the second electrode.
2. circuit board composition according to claim 1, it is characterised in that described first electrode is the first Lou Tong district, described second electrode is the second Lou Tong district, and the number in described first Lou Tong district and the second Lou Tong district is all less than ten.
3. circuit board composition according to claim 1, it is characterized in that, described first circuit board is provided with the first hole, location, described second circuit board is provided with the second hole, location, described verticality conducting resinl is provided with the 3rd hole, location, described first hole, location, the second hole, location and the 3rd hole, location are corresponding up and down, position hole, the second hole, location and the 3rd hole, location by first and position between described first circuit board, second circuit board and verticality conducting resinl.
4. circuit board composition according to claim 3, it is characterized in that, the quantity in described first hole, location, the second hole, location and the 3rd hole, location is two, two described first position the two ends that hole lays respectively at the first electrode of first circuit board, two described second position the two ends that hole lays respectively at the second electrode of second circuit board, and two described 3rd holes, location lay respectively at verticality conducting resinl two ends.
5. circuit board composition according to claim 1, it is characterised in that described first circuit board is flexible PCB, described second circuit board is hard circuit board.
6. a mobile communication equipment, it is characterised in that described mobile communication equipment includes the circuit board composition according to any one of claim 1-5.
7. mobile communication equipment according to claim 6, it is characterised in that described mobile communication equipment is mobile phone.
8. the method for attachment between a circuit board, it is characterised in that include
First circuit board, second circuit board and verticality conducting resinl are provided, described first circuit board edge is provided with at least one first electrode, described second circuit panel edges is provided with at least one second electrode, and described verticality conducting resinl conducts electricity in the vertical direction and insulate in the horizontal direction；
The upper surface making described verticality conducting resinl is mutually bonding with the lower surface of first circuit board, the upper surface of described second circuit board is mutually bonding with the lower surface of verticality conducting resinl, it is conduction region that wherein said verticality conducting resinl is positioned at the region immediately below the first electrode, it is conduction region that described verticality conducting resinl is positioned at the region directly over the second electrode, to electrically connect described first electrode and the second electrode；
Wherein, the quantity of the first electrode and the second electrode need not be equal, and when the quantity of described first electrode and described second electrode is all higher than one, one group of first electrode therein is set and the second electrode is corresponding and by the described verticality conducting resinl normal transmission signal of telecommunication, does not have corresponding relation between other the first electrode and the second electrode.
9. method of attachment according to claim 8, it is characterized in that, described verticality conducting resinl conducts electricity and non-conductive in the horizontal direction in the vertical direction, described first electrode is the first Lou Tong district, described second electrode is the second Lou Tong district, and the number in described first Lou Tong district and described second Lou Tong district is all less than ten.
10. method of attachment according to claim 8, it is characterized in that, described first circuit board is provided with the first hole, location, described second circuit board is provided with the second hole, location, described verticality conducting resinl is provided with hole, two the 3rd location, make described first hole, location, described second hole, location and described 3rd hole, location corresponding up and down, position described first and insert locating dowel with fixing described first circuit board, described second circuit board and described verticality conducting resinl between hole, described second hole, location and described 3rd hole, location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210219986.2A CN102762029B (en) | 2012-06-28 | 2012-06-28 | The method of attachment of mobile communication equipment and circuit board composition and circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210219986.2A CN102762029B (en) | 2012-06-28 | 2012-06-28 | The method of attachment of mobile communication equipment and circuit board composition and circuit board |
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| CN102762029A CN102762029A (en) | 2012-10-31 |
| CN102762029B true CN102762029B (en) | 2016-07-13 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104717325A (en) * | 2013-12-12 | 2015-06-17 | 中兴通讯股份有限公司 | Electronic instrument |
| CN104822226B (en) * | 2015-04-28 | 2018-09-14 | 武汉华星光电技术有限公司 | Circuit board assemblies |
| CN106061104B (en) * | 2016-07-28 | 2018-12-04 | 广东欧珀移动通信有限公司 | The circuit board of mobile terminal and mobile terminal with it |
| CN112449488A (en) * | 2019-09-05 | 2021-03-05 | 华为技术有限公司 | Circuit board and electronic equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101296579A (en) * | 2007-04-27 | 2008-10-29 | 欣兴电子股份有限公司 | Station transplantation device of multi-gang circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100483399B1 (en) * | 1997-09-09 | 2005-08-10 | 삼성전자주식회사 | Printed wiring board and its connection method |
| JP2008235556A (en) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | Wiring board module and its manufacturing method |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101296579A (en) * | 2007-04-27 | 2008-10-29 | 欣兴电子股份有限公司 | Station transplantation device of multi-gang circuit board |
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